WO2014076090A1 - Procédé et dispositif de transport de substrats plats - Google Patents

Procédé et dispositif de transport de substrats plats Download PDF

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Publication number
WO2014076090A1
WO2014076090A1 PCT/EP2013/073635 EP2013073635W WO2014076090A1 WO 2014076090 A1 WO2014076090 A1 WO 2014076090A1 EP 2013073635 W EP2013073635 W EP 2013073635W WO 2014076090 A1 WO2014076090 A1 WO 2014076090A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
transport
transport channel
liquid medium
openings
Prior art date
Application number
PCT/EP2013/073635
Other languages
German (de)
English (en)
Inventor
Daniel Kray
Hannah BANZHAF
Teresa FRENSSEN
Patrick NOWACK
Sofia REIM
Christian SAUTERMEISTER
Alexander Schwarz
Original Assignee
Hochschule Offenburg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hochschule Offenburg filed Critical Hochschule Offenburg
Publication of WO2014076090A1 publication Critical patent/WO2014076090A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks

Definitions

  • the invention relates to the field of transport of flat substrates such as silicon substrates.
  • the invention relates to the particularly gentle and continuous transport of such substrates.
  • the basis of electrical and electronic components such as integrated circuits or solar cells usually forms a flat substrate. This is typically obtained from silicon, which is often initially present as a single crystal (ingot), and from which subsequently flat plates, so-called wafers, are produced via a sawing process.
  • silicon which is often initially present as a single crystal (ingot)
  • wafers so-called wafers
  • a number of wafers are space-savingly inserted into a carrying device (carrier), the surfaces of the wafers being spaced apart and parallel to one another.
  • the wafers are continuously transported through the treatment liquid using rotating rollers on which the wafers rest. Possibly. are still hold-down to prevent floating of the substrates, as proposed for example in the publication WO 03/086914 AI. - -
  • the object of the invention is to avoid the disadvantages known from the prior art. Accordingly, the invention should reduce mechanical stress and thus failure rate of flat, fragile substrates during their transport and at the same time have the lowest possible area consumption. Furthermore, it should be suitable both for the mere transport and for wet-chemical treatment of the substrates in a continuous manner.
  • the invention is based on the recognition that a space-saving transport of flat substrates by a vertical alignment of the same is possible. Accordingly, the invention relates to a method for transporting a vertically oriented flat substrate with two flat sides in a transport direction.
  • the transport takes place within a transport channel, at least partially filled with a liquid medium, two walls and possibly a bottom transport channel, wherein the liquid medium flows against at least one of the flat sides of the substrate and at least one of the sum of weight and buoyancy of the substrate Partially repealing support component and directed in Transporttrich ⁇ tion feed component, so that the substrate is carried and transported without mechanical aids.
  • the transport takes place substantially horizontally, with a slight downward and / or upward movement of the substrate is covered by the horizontal transport.
  • the extension and retraction of the substrate into the liquid or from the liquid medium can be partially or completely vertically.
  • the liquid medium flows against both flat sides of the substrate, since a simple centering of the substrate in the transport channel is thus achieved.
  • the liquid medium flows only against one of the two flat sides of the substrate, while against the not to be contacted with the liquid medium flat side of the substrate flows another (other) fluid medium such as a gas or gas mixture, so that the transport channel only one side of the substrate and thus only partially filled with the liquid medium.
  • the weight force results from the mass of the substrate.
  • the opposing (total) buoyancy force results from the static buoyancy caused by the displacement of the surrounding medium and the dynamic buoyancy caused by the flow around it. It includes definitions ⁇ according to a caused for example by adhering gas bubbles change the buoyancy conditions.
  • the support component is directed against gravity because the plurality of conceivable substrate materials tends to sink in a liquid. Exceptions arise, however, in that gas bubbles form and / or adhere to the surface of the substrate, which in total can lead to a buoyancy of the substrate. In these cases, it is appropriate to align the support component in the direction of gravity. In addition, it is not absolutely necessary to provide a constantly oriented carrying component along the transport path. In the case of an increase in blistering along the transport path, a progressive loss of material due to surface erosion, or generally a change in the sum of buoyancy and weight, it may be necessary to vary the orientation in the transport direction to achieve the desired effect of (horizontal) support to ensure.
  • the substrate (controlled) sink or rise which in turn is possible by adjusting the alignment accordingly.
  • the carrying component only partially lifts the sum of the weight and buoyancy of the substrate.
  • the feed component directed in (or, for a reverse transport,) of the transport direction must at least temporarily be present in order to impart a feed force to the substrate.
  • the substrate is in the - -
  • the invention reduces a mechanical stress and thus breakage rate of flat, fracture-prone substrates during their transport and at the same time has the lowest possible surface area, since a substrate transported substantially horizontally in a vertical orientation requires significantly less space than one transported in a horizontal orientation. Furthermore, the invention is suitable both for the mere transport and for the wet-chemical treatment of the substrates in a continuous manner.
  • the liquid medium is a treatment liquid for wet-chemical treatment of the substrate.
  • this includes, for example, DI water
  • the corresponding treatment is then a cleaning.
  • a modification of the substrate for example a cleaning, etching, surface modification (doping) or coating (deposition) takes place simultaneously with the transport and, depending on the type of treatment liquid.
  • the support component and / or the feed component is provided by inflow openings arranged laterally and / or underneath the substrate in the walls or in the bottom or a lower region of the transport channel and / or through discharge openings in the bottom or lower region of the transport channel.
  • the inflow openings are aligned such that the liquid medium flowing out of them effects the effect provided by the invention.
  • correspondingly positioned outflow openings are included for this purpose;
  • a downward support component can be provided by that below the - -
  • Substrate (in the bottom or bottom of the transport channel) discharge openings are arranged, the suction of which seeks to pull the substrate down.
  • the resultant of the carrying and advancing components has a component oriented in the direction of gravity. This means that in this area the substrate experiences a downward total force, which leads to a sinking of the substrate into the transport channel. In this way, the controlled retraction of the substrate is made possible in the transport route.
  • the resultant of carrying and advancing component has a component directed counter to the force of gravity, which leads to a lifting of the substrate at the end of the transport path and a removal thereof from the liquid Medium relieved.
  • the end face of the transport channel also has at least one inflow opening in its substrate inlet region, through which liquid or another fluid can be introduced into the channel. Since the fluid introduced in this way flows in the transport direction, the feed component desired according to the invention can be supported or even provided alone. Further or additional means for introducing or removing the substrate into and out of the transport channel are e.g. mechanical grippers, vacuum grippers or mechanical guides into consideration.
  • the same volume flow is applied to all inflow openings, with the exception of the inflow openings arranged in an optionally existing inlet area and / or outlet area. If desired, along the transport
  • the varying support component is preferably achieved in that the flow cross sections and / or the number or distribution of the inflow openings are adapted accordingly.
  • Such a liquid supply has the advantage of a correspondingly simple construction.
  • the liquid medium which is then a "first" liquid medium, flows against a flat side of the substrate, and another fluid medium is provided which flows against the other flat side.
  • the other medium may or may not be liquid.
  • the further fluid medium is a gas or gas mixture, so that treatment takes place on both sides.
  • the treatment can be predominantly one-sided. It is open whether the treatment is carried out by the liquid (wet-chemical) or by the gas. It is clear that in this case the transport channel is only one-sided of the substrate, i. only partially filled with a liquid medium.
  • the (at least one) liquid medium examples include a texturing solution, a cleaning solution or an etching solution. As already mentioned, however, it can also be a neutral liquid, such as, for example, di-water, which serves primarily to transport the substrate without modifying it, but if necessary to clean or keep it clean. - -
  • gas for example ozone
  • ozone is additionally injected into the (at least one) liquid medium.
  • Enrichment with a gas can influence the wet-chemical reaction or even initiate it.
  • the gas, in particular the ozone, can also be used to clean the substrate surface.
  • Heating or cooling of the media can also be advantageous. Likewise, reuse or at least recycling of the media is preferred. Particularly preferably, a metered addition of fresh media to the already in circulation media to ensure a consistent quality of the treatment liquid.
  • the invention also discloses an apparatus for carrying out the method according to the invention.
  • Such a device for the vertical transport of a flat substrate in a transport direction has a laterally delimited by two walls transport channel for receiving a liquid medium and for receiving within this medium in a vertical orientation leading substrate with two flat sides, wherein the transport channel in his by the Walls formed wall portion has inflow openings, from which liquid medium against at least one of the two flat sides of the substrate can be dispensed in such a way that a the sum of weight and buoyancy of the substrate at least partially repealing and supporting the substrate support component and directed in the transport direction and the Substrate transporting feed component results, so that the substrate can be carried and transported without mechanical aids.
  • inflow openings need not necessarily be provided by openings in the wall of the transport channel. Also nozzles, which are on the inside of the wall of the - -
  • Transport channels are attached to this and, for example, through lines, which also extend along the inside of the wall, provide inlet openings of the type according to the invention.
  • the inflow openings may also be provided by a porous material such as a sintered ceramic or sintered metal. This is particularly advantageous if a one-sided treatment is to take place in which one side of the substrate is to be protected by a carpet of gas bubbles from the liquid medium. It is clear that these inflow openings are then also suitable for dispensing a gaseous medium, and that these inflow openings are particularly preferably arranged only on the side of the transport channel which faces the side of the substrate to be protected from the liquid.
  • the arrangement of the inflow openings be symmetrical or at least functionally symmetrical on both sides of the substrate.
  • the latter means that the arrangement is not symmetrical at a short distance, but for example alternately or offset, but that the force components desired according to the invention can be formed over a longer distance and act on the substrate.
  • the end face of the transport channel also has at least one inflow opening in its substrate inlet region, through which liquid or another fluid can be introduced into the channel. Since the fluid introduced in this way flows in the transport direction, the feed component desired according to the invention can be supported or even provided alone.
  • outflows are located in the lower region or in the optionally present bottom of the transport channel. - -
  • Openings arranged for the liquid medium can serve to generate a suction, which provides a downwardly facing carrying component.
  • an excess of liquid medium overflows the top edge (s) of the transport channel. Only an (exclusive) overflow at the upper edge located at the end of the transport path ("end edge") may be desirable in order to provide for the provision of the feed component according to the invention in this manner without any further design complexity.
  • the device according to the invention comprises a substrate inlet region arranged at the beginning of the transport channel, whose inflow and possibly existing drainage openings are arranged and aligned in such a way that the resultant of carrying and feed component has a component directed in the direction of gravity. It is likewise preferred that the device comprises a substrate outlet region arranged at the end of the transport channel, whose inflow and possibly existing drainage openings are arranged and aligned in such a way that the resultant of carrying and feed component has a component directed counter to the force of gravity. These two areas therefore serve the simple introduction or removal of the substrate in or out of the transport channel.
  • the device according to the invention for example by successively changing the flow, force a lateral rotation, a sinking or a floating of the substrate, so that the substrate from the vertical orientation in a horizontal orientation or can be converted back again.
  • the transport channel has a rectangular or V-shaped cross section.
  • the depth at least slightly exceeds the corresponding dimension of the substrate, for example by 10% to 30%. In areas where greater vertical movement of the substrate is to be expected, for example in the entrance area, the depth should be correspondingly greater, for example by 30% to 100%.
  • the width of the cross section should preferably be as small as possible in order to minimize the footprint of the device according to the invention. At the same time, however, attention must be paid at all times to the feasibility of the flow conditions according to the invention (carrying and feed components). Of course, the width can also be made variable, with a constant width is structurally preferred.
  • the transport channel should preferably be smooth and without projections. For this reason, as openings are preferred openings in the walls instead of patch nozzles.
  • the invention provides that the device comprises a plurality of parallel transport channels. These are arranged as close to each other as possible to keep the footprint as low as possible.
  • the transport channels may all be the same or different. You can also serve to perform the same or different treatment steps.
  • an example meandering sequence of several, then modular ausgestalteter transport routes is possible. Mechanical, liquid or gas-based "locks" allow a substrate to undergo multiple sequential treatments without the need for mechanical touching. A course of the transport path in curves is possible, provided that care is taken that forms the support and feed component according to the invention, and that the substrate does not abut by a too narrow transport ⁇ channel / curve radius on the side walls or even jammed.
  • the adjacent inflow and possibly existing outflow openings of two adjacent transport channels can be fed or emptied via a common supply or discharge line connected to them.
  • the advantage of a simple construction in conjunction with the smallest possible footprint can be maintained by suitably combining the openings or discharges supplying or discharging the openings.
  • the invention solves the known from the prior art problems in an effective and simple way. Accordingly, the invention reduces mechanical stress and thus breakage rate flat, fragile substrates during their transport and at the same time has the lowest possible surface consumption, as a vertically aligned substrate transported significantly less space needed than a horizontally oriented transported.
  • the invention is suitable both for the mere transport and for the wet-chemical treatment of the substrates in a continuous manner.
  • Figure 1 shows a schematic representation of the cross section of an embodiment of the transport channel according to the invention.
  • Figure 2 shows a longitudinal section of a schematically illustrated
  • Embodiment of the transport channel according to the invention Embodiment of the transport channel according to the invention.
  • Figure 3 shows a plan view of a device with several
  • FIG. 1 shows a schematic illustration of the cross section of an embodiment of the transport channel according to the invention.
  • the transport channel 2 has two walls 3 and 4 and in its lower region a bottom 9.
  • a liquid medium F is accommodated in it.
  • a substrate 1 is shown, which is vertically aligned.
  • liquid medium F small arrows
  • Openings 5 flows into the interior of the transport channel 2. These inlet openings 5 are formed in the embodiment shown by tubes which project through the walls 3, 4 and are fed from the outside (not shown). As indicated, the viewer looks diagonally forward in the tubes, as they are inclined towards the viewer. In this way they not only serve to center the substrate 1, but also provide the feed component according to the invention. In the lower region 9, more precisely in the bottom 9 of the transport channel 2 is also an inflow opening 5 is present. The liquid medium F flowing from it (upward, thick arrow) serves to provide the carrying component according to the invention.
  • discharge openings 6, are arranged in the bottom 9 through which the liquid medium F can leave the interior of the transport channel 2 again, without it overflowing (inclined, downwardly directed thick arrows).
  • FIG. 2 a longitudinal section of a schematically illustrated embodiment of the transport channel according to the invention is shown, wherein the transport direction extends from left to right.
  • the transport channel 2 is filled with liquid medium F.
  • a substrate 1 is introduced into the transport channel 2 in an entry region 7. In order to prevent abutment on the bottom, the depth in the inlet region 7 is increased.
  • a transport of the substrate takes place (without reference numeral) in the direction of the end of the transport channel (on the right in the picture).
  • an exit region 8 is present, which is designed here as a ramp, so that the substrate - - slowly comes out of the liquid medium.
  • grippers or guides are provided, which are not shown in the figure.
  • FIG. 3 shows a plan view of a device with a plurality of transport channels 2. These are arranged parallel to one another and are preferably fed and emptied by respective common lines (not shown).
  • the substrates 1 (only one with reference numeral) pass through these transport channels 2 continuously and in parallel. In this way, a large number of substrates can be transported in a gentle manner and, in the case of the presence of a modifying treatment liquid, also be treated.
  • the dividing line 10 indicates that the transport channels are divided into two successively arranged areas. In each of the areas, a different liquid medium (without reference numerals) may be present if, for example, a bubble carpet is used to separate the areas or their media.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne le domaine du transport de substrats plats comme par exemple des substrats de silicium. L'invention concerne en particulier le transport particulièrement précautionneux et continu de tels substrats. Le procédé selon l'invention sert au transport d'un substrat (1) plat orienté verticalement, ayant deux côtés plats, dans un sens de transport à l'intérieur d'un canal de transport (2) rempli au moins en partie d'un milieu liquide (F), ce dernier (F) s'écoulant contre au moins un des côtés plats du substrat (1) et présentant une composante porteuse neutralisant la somme de la force pondérale et de la force ascensionnelle du substrat (1) ainsi qu'une composante d'avancement orientée dans le sens de transport de sorte que le substrat (1) est porté et transporté sans moyen auxiliaire mécanique. Le dispositif selon l'invention comprend un canal de transport (2) destiné à recevoir un milieu liquide (F) ainsi qu'un substrat (1) à guider dans une orientation verticale à l'intérieur de ce milieu (F), le canal de transport (2) présentant dans les parois (3, 4) des ouvertures d'afflux (5).
PCT/EP2013/073635 2012-11-13 2013-11-12 Procédé et dispositif de transport de substrats plats WO2014076090A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012110916.8 2012-11-13
DE201210110916 DE102012110916B4 (de) 2012-11-13 2012-11-13 Verfahren und Vorrichtung zum Transport flacher Substrate

Publications (1)

Publication Number Publication Date
WO2014076090A1 true WO2014076090A1 (fr) 2014-05-22

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PCT/EP2013/073635 WO2014076090A1 (fr) 2012-11-13 2013-11-12 Procédé et dispositif de transport de substrats plats

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DE (1) DE102012110916B4 (fr)
WO (1) WO2014076090A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019102492A1 (de) * 2019-01-31 2020-08-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zur Bearbeitung von Wafern

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1985005757A1 (fr) * 1984-06-04 1985-12-19 Edward Bok Appareil pour le transport et le traitement de tranches de silicium par flottaison double
US6241427B1 (en) * 1998-11-20 2001-06-05 Seagate Technology, Inc. System and method for substantially touchless hydrodynamic transport of objects
KR20070084294A (ko) * 2004-11-19 2007-08-24 시바우라 메카트로닉스 가부시키가이샤 기판의 처리 장치, 반송 장치 및 처리 방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE50200399D1 (de) * 2002-04-15 2004-06-03 Rena Sondermaschinen Gmbh Transportrollen, Niederhalter und Transportsystem für flaches Transportgut
US9355880B2 (en) * 2008-06-19 2016-05-31 Rena Gmbh Method and apparatus for the transporting of objects

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1985005757A1 (fr) * 1984-06-04 1985-12-19 Edward Bok Appareil pour le transport et le traitement de tranches de silicium par flottaison double
US6241427B1 (en) * 1998-11-20 2001-06-05 Seagate Technology, Inc. System and method for substantially touchless hydrodynamic transport of objects
KR20070084294A (ko) * 2004-11-19 2007-08-24 시바우라 메카트로닉스 가부시키가이샤 기판의 처리 장치, 반송 장치 및 처리 방법

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DE102012110916A1 (de) 2014-05-28
DE102012110916B4 (de) 2014-07-17

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