WO2013026710A1 - Dispositif de traitement de surface de substrats - Google Patents

Dispositif de traitement de surface de substrats Download PDF

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Publication number
WO2013026710A1
WO2013026710A1 PCT/EP2012/065602 EP2012065602W WO2013026710A1 WO 2013026710 A1 WO2013026710 A1 WO 2013026710A1 EP 2012065602 W EP2012065602 W EP 2012065602W WO 2013026710 A1 WO2013026710 A1 WO 2013026710A1
Authority
WO
WIPO (PCT)
Prior art keywords
areas
grooves
transport
regions
process medium
Prior art date
Application number
PCT/EP2012/065602
Other languages
German (de)
English (en)
Inventor
Woo-Hong JUNG
Helge Haverkamp
Kai WEISSER
Michael Niethammer
Original Assignee
Gebr.Schmid Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gebr.Schmid Gmbh filed Critical Gebr.Schmid Gmbh
Priority to CN201280040905.0A priority Critical patent/CN103889588B/zh
Publication of WO2013026710A1 publication Critical patent/WO2013026710A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/02—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
    • B05C1/025—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles to flat rectangular articles, e.g. flat sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
    • B05C1/08—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line
    • B05C1/0808—Details thereof, e.g. surface characteristics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
    • B05C1/08—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line
    • B05C1/0813—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line characterised by means for supplying liquid or other fluent material to the roller

Definitions

  • the invention relates to a device for surface treatment of substrates, in particular for wetting a substrate underside with a liquid process medium by transport rollers.
  • the transport rollers are provided with raised end portions or end portions with a first larger diameter.
  • the substrates to be treated are provided with a substrate underside. Because the transport rollers rotate with their lower regions in the process medium and thus their surface is wetted with process medium, due to the elevated end regions on which the substrates rest alone, only in these regions the substrate underside is wetted with process medium and thus treated. A full-surface treatment of the substrate base or its wetting should and is therefore not achieved with this device.
  • the invention is based on the object to provide an aforementioned device, can be solved with the problems of the prior art and in particular a good and, if necessary, full surface treatment of substrates or their substrate bases is possible.
  • This object is achieved by a device having the features of claim 1.
  • Advantageous and preferred embodiments of the invention are the subject of the other claims and are explained in more detail below. The wording of the claims is incorporated herein by express reference.
  • the device has transport means for transporting a substrate in a transport plane determined by them, wherein these transport means are designed as transport rollers and at the same time as conveying means in order to wet or coat the substrate on a substrate underside with a liquid process medium and thus treat it.
  • the transport rollers are at least partially immersed in the process medium or have process medium on their upper side. This allows them to wet the underside of the substrate during transport in direct contact.
  • the transport rollers have a rotationally symmetrical outer surface with a plurality of regions of a first, larger diameter and a plurality of regions of a second, smaller diameter, these regions of the second, smaller diameter each lying between two regions of the first, larger diameter.
  • At least in the areas with the second, smaller diameter grooves or recesses are introduced, which are circumferentially and thus in turn rotationally symmetrical.
  • a capillary action can be created or improved in order to build up a certain thickness of the film with process medium on the transport rollers.
  • the underside of the substrate can be wetted in all cases over the entire surface or completely.
  • the areas of the first, larger diameter may have a regular distance from each other. This can also be detached from the areas of the second, smaller diameter.
  • a distance of the regions of the first, larger diameter may be about 10mm to 20mm, preferably 13mm to 17mm.
  • the first, larger diameter can be less than 1 mm above the second, smaller diameter.
  • the diameter difference is even less than 0.5 mm, particularly advantageously it is between 0.1 mm and 0.2 mm.
  • the areas of the first, larger diameter are therefore only slightly above the areas of the second, smaller diameter lying in between.
  • the substrates lie with their substrate undersides only on these areas of the first, larger diameter, on the other hand, the process medium just taken from the surface of the areas of the second, smaller diameter from the bath to the substrate bottom for the purpose of wetting the same or promoted and so desired full-surface wetting of the substrate underside can be effected.
  • the aforementioned squeezing of the film of process medium at the underside of the substrate can be avoided by the slightly greater distance between the underside of the substrate and the areas of the second, smaller diameter. In the areas of the first, larger diameter, it can easily be avoided that they are relatively narrow.
  • the regions of the first, larger diameter can have a transition to the regions with the second, smaller diameter, which is bevelled.
  • a bevel angle can be between 45 ° and 60 °.
  • this improves the above-mentioned prevention of squeezing or sloshing back of the film from process medium.
  • the adhesion of the process medium or the wetting of the underside of the substrate can also be improved here.
  • the regions with the first, larger diameter are formed without grooves or depressions.
  • these areas of the first, larger diameter are relatively narrow, so that anyway there is hardly any space or necessity for such grooves or depressions. They may, for example, have a width of less than 1 mm, advantageously between 0.1 mm and 0.4 mm.
  • the grooves or recesses in the regions with the second, smaller diameter can be approximately V-shaped.
  • a V-angle can be between 40 ° and 70 °, particularly advantageously between 50 ° to 60 °. This results in a relatively large opening angle of the grooves or depressions in the regions with the second, smaller diameter, which in turn is advantageous for the adhesion of process medium to the surface of the transport rollers in this area and thus enables better wetting of the substrate underside.
  • the grooves or depressions are not particularly deep. Their depth can be between 0.1 mm and 1 mm, preferably about 0.5 mm. If this is added to the abovementioned height of the regions of the first, larger diameter of less than 1 mm, then it is quite obvious that overall good wetting of the substrate undersides with process medium can take place from the immersed surface of the transport rollers.
  • a width between the individual grooves or depressions may be less than 1 mm. It can be particularly advantageous about 0.1 mm to 0.4 mm.
  • the grooves can be wider than their spacing.
  • all grooves or depressions in the areas with the second, smaller diameter in a single transport roller may be the same in terms of depth and / or shape or profile. This can also apply to the shape or profile shape of the regions of the first, larger diameter.
  • a rear region of the device along the transport path of the substrates in the transport plane similarly shaped transport rollers as the front, but which have a slightly greater depth of the grooves or depressions in the areas with second, smaller diameter than in the front of the Contraption.
  • This depth may be about 30% to 60% larger, which allows the substrate bottoms to be wetted with less process media at the rear of the device.
  • the amount of process medium introduced at the rear of the device can be reduced somewhat for a more homogeneous wetting or etching result.
  • the transport rollers may have a first, larger diameter of a few cm, advantageously 1 cm to 5cm, more preferably 1, 5cm to 2cm.
  • the transport rollers are made of plastic, with PP or PVDF offer.
  • the transport rollers are integrally or in one piece and formed out of a single piece of material or formed as a one-piece piece of material, preferably made of relatively hard material with a closed surface.
  • multicrystalline wafers can be etched or textured particularly advantageously. For monocrystalline wafers, a so-called pyramid texturing can be performed.
  • FIG. 1 shows a side view of a device according to the invention
  • FIG. 2 is an enlarged view of a single transport roller for
  • Fig. 3 is a high magnification of a section of Fig. 2 for the purpose of illustrating possible dimensions.
  • Fig. 1 from the side in a very schematic representation of an inventive system or device 1 1 is shown, are transported and treated with the substrates 12.
  • the substrates 12 with an upper side 13 upwards and a lower side 14 downwards, wherein these are not necessarily the corresponding sides in the finished functional state, but relate only to this transport plane.
  • the device 1 1 has transport rollers 16a and 16b, which are arranged in a known manner one behind the other, advantageously according to the aforementioned EP 1 960 1 19 B1. They rotate in the same direction and form with their tops the transport plane, wherein the substrates 12 rest with their lower sides 14 on the transport rollers 16a and 16b.
  • the lower portion of the transport rollers 16a and 16b is immersed in a bath of the process medium 18 in a trough not shown here or rotates therein. As a result, a film 19 of process medium 18 is taken along by the transport rollers 16a and 16b and brought upwards by the transport rollers 16a and 16b.
  • This process is also known from the cited EP 1 960 1 19 B1, to which reference is made in this regard.
  • first regions 21 are respectively arranged at the ends of the transport roller 16a and have between them the second regions 25.
  • a first region 21 is formed with a central elevation 22 as a kind of running surface or bearing surface for the substrates 12, wherein bevels 23a and 23b are located on the left and right of it.
  • elevations 26 are likewise provided in the second regions 25, they do not extend to the elevations 22 of the first regions 21.
  • the ridges 26 in the second regions 25 become formed by second bevels 27a and 27b, which are provided as a kind of cuts and grooves 29 form.
  • second bevels 27a and 27b which are provided as a kind of cuts and grooves 29 form.
  • the entire transport roller 16a is formed regularly. This means that the first regions 21 and their elevations 22 each have a constant distance from each other, which may be about 10mm to 20mm as described above.
  • the entire width of a transport roller 16a may be a few cm, for example 5cm to 15cm. Their diameter according to Fig. 1 can be in the range of 1 cm to 3cm.
  • the second regions 25 each have eight elevations 26. There may also be more or fewer increases per se. Furthermore, not all second regions 25 must each have the same number of elevations 26.
  • the dimension bi for the width of the elevation 22 of the first region 21 may be between 0.2 mm and 0.6 mm.
  • it also corresponds to the dimension b 2 of the width of the elevations 26 of the second region 25.
  • the dimension h as half the diameter difference or height difference between the elevations 22 and 26 may be in a range between slightly less than 0.1 mm and 0.5 mm, advantageously between 0.1 mm and 0.2 mm.
  • the depth of the grooves 29 formed by the bevels 27a and 27b is then slightly above and can be 0.2mm to 0.4mm.
  • a width v of the grooves 29 is in the range of their depth and thus also at 0.2mm to 0.4mm.
  • An angle ⁇ of the grooves 29 may be in an aforementioned range, advantageously 50 ° to 60 °.
  • the grooves 29 need not be formed at an acute angle in the lower region, but may also be slightly rounded, for example, for ease of manufacture.
  • the bevel angle of the Ridges 22 of the first regions 21 to the lateral first slopes 23a and 23b may be the same as from the ridges 26 of the second regions 25 to the lateral second slopes 27a and 27b.
  • the substrate 12, with its lower side 14, rests on the elevations 22 of the first regions 21 and has a film 19 of process medium 18 toward the second regions 25, which then precisely measures the film thickness with the dimension h corresponding to FIG. 3 or additionally a film thickness in the grooves 29 inside.
  • the second regions 25 of smaller diameter function as conveyor regions, i. as areas in which process medium 18 is taken from the bath as said process medium film 19 to the substrate base 14 or promoted.
  • this measure of the height difference h is slightly lower, for example 20% to 40%.
  • a smaller amount of process medium 18 fed to the underside 14 is considered sufficient.
  • the grooves 29 can be deeper. By means of deeper grooves 29 having a greater width, a smaller amount of process medium 18 is brought to the underside 14 of the substrates 12.
  • the concave formation prevents the process medium 18 from spilling over onto the upper side 13 of the substrate 12. It can also be seen from the representation in FIG. 2 that spilling over of back-squeezed process medium onto the upper side 13 of the substrates 12 is avoided if these should not be treated. So there are no problems with envelope odgl ..
  • the device 1 shown with the novel transport rollers 16a and 16b is particularly suitable for edge insulation of wafers for solar cell production, wherein the process medium HN 3 0 and HF has.
  • Further process parameters are transport speed or rotational speed of the transport rollers 16a and 16b, temperature, immersion depth of the transport rollers 16a and 16b into the process medium 18, possible suction between the transport rollers and composition of the process medium per se.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Rollers For Roller Conveyors For Transfer (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

L'invention concerne un dispositif de traitement de faces inférieures de tranches, comportant des cylindres de transport (16a, 16b) destinés à transporter les tranches et réalisés à la fois comme des éléments de transport et destinés à imprégner les faces inférieures de tranches avec un milieu de traitement liquide (18). Les cylindres de transport sont plongés au moins en partie dans le milieu de traitement pour humidifier les faces inférieures de tranches lors du transport en contact avec les cylindres de transport. Les cylindres de transport comportent une face extérieure à symétrie de rotation dotée de plusieurs zones présentant un premier grand diamètre (21) et de plusieurs zones présentant un deuxième diamètre inférieur (25), entre lesdites zones, des rainures étant ménagées dans les zones présentant le deuxième diamètre plus petit.
PCT/EP2012/065602 2011-08-22 2012-08-09 Dispositif de traitement de surface de substrats WO2013026710A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201280040905.0A CN103889588B (zh) 2011-08-22 2012-08-09 用于基片的表面处理的装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011081327.6 2011-08-22
DE102011081327A DE102011081327A1 (de) 2011-08-22 2011-08-22 Vorrichtung zur Oberflächenbehandlung von Substraten

Publications (1)

Publication Number Publication Date
WO2013026710A1 true WO2013026710A1 (fr) 2013-02-28

Family

ID=46642543

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/065602 WO2013026710A1 (fr) 2011-08-22 2012-08-09 Dispositif de traitement de surface de substrats

Country Status (4)

Country Link
CN (1) CN103889588B (fr)
DE (1) DE102011081327A1 (fr)
TW (1) TW201323094A (fr)
WO (1) WO2013026710A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103346109A (zh) * 2013-07-16 2013-10-09 英利能源（中国）有限公司 一种湿法刻蚀设备及工艺

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014200582A1 (de) * 2014-01-15 2015-07-16 Helmut Diebold Gmbh & Co. Goldring-Werkzeugfabrik Werkzeugaufnahme mit einem Düsenring
WO2020068487A1 (fr) * 2018-09-27 2020-04-02 Corning Incorporated Appareil et procédés de traitement de substrat

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5592958A (en) * 1995-02-01 1997-01-14 Coates, Asi, Inc. Flood conveyer
US6037020A (en) * 1996-01-29 2000-03-14 Electrochemicals Inc. Ultrasonic mixing of through hole treating compositions
EP1960119B1 (fr) 2005-12-16 2010-05-12 Gebr. Schmid GmbH + Co. Dispositif, installation et procede de traitement de surface de substrats

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JPH03188965A (ja) * 1989-12-18 1991-08-16 Ig Tech Res Inc 印刷用ロール
JPH10216588A (ja) * 1997-02-05 1998-08-18 Fuji Photo Film Co Ltd 塗工装置用ロッド
JP2001121053A (ja) * 1999-10-26 2001-05-08 Ibiden Co Ltd 塗布用ロールコータおよびそれを用いたプリント配線板の製造方法
JP2001054753A (ja) * 2000-01-01 2001-02-27 Ibiden Co Ltd プリント配線板製造用ロールコータ
JP4478780B2 (ja) * 2002-11-22 2010-06-09 壽工業株式会社 透明保護層を有する窯業系基材の塗装方法とその化粧基材
JP2004267854A (ja) * 2003-03-06 2004-09-30 Fuji Photo Film Co Ltd 塗工装置用ロッド、及びその製造方法
JP4314976B2 (ja) * 2003-11-17 2009-08-19 株式会社村田製作所 グラビアロール、グラビアロールの摩耗量確認方法及び電子部品の製造方法
JP4531425B2 (ja) * 2004-03-30 2010-08-25 アイジー工業株式会社 外装基板の均一塗装装置
DE102005062527A1 (de) * 2005-12-16 2007-06-21 Gebr. Schmid Gmbh & Co. Vorrichtung und Verfahren zur Oberflächenbehandlung von Substraten
JP2009125675A (ja) * 2007-11-26 2009-06-11 Tokyo Kakoki Kk 基板材の表面処理用のスプレーユニット
WO2010041328A1 (fr) * 2008-10-10 2010-04-15 有限会社マイスター Rouleau applicateur

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5592958A (en) * 1995-02-01 1997-01-14 Coates, Asi, Inc. Flood conveyer
US6037020A (en) * 1996-01-29 2000-03-14 Electrochemicals Inc. Ultrasonic mixing of through hole treating compositions
EP1960119B1 (fr) 2005-12-16 2010-05-12 Gebr. Schmid GmbH + Co. Dispositif, installation et procede de traitement de surface de substrats

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103346109A (zh) * 2013-07-16 2013-10-09 英利能源（中国）有限公司 一种湿法刻蚀设备及工艺

Also Published As

Publication number Publication date
CN103889588B (zh) 2017-09-08
DE102011081327A1 (de) 2013-02-28
CN103889588A (zh) 2014-06-25
TW201323094A (zh) 2013-06-16

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