WO2014065328A1 - 放射線検出器の製造方法 - Google Patents
放射線検出器の製造方法 Download PDFInfo
- Publication number
- WO2014065328A1 WO2014065328A1 PCT/JP2013/078714 JP2013078714W WO2014065328A1 WO 2014065328 A1 WO2014065328 A1 WO 2014065328A1 JP 2013078714 W JP2013078714 W JP 2013078714W WO 2014065328 A1 WO2014065328 A1 WO 2014065328A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- array
- cells
- light receiving
- receiving element
- reflective layer
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/2008—Measuring radiation intensity with scintillation detectors using a combination of different types of scintillation detectors, e.g. phoswich
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/1074—Separate cutting of separate sheets or webs
Definitions
- the present invention relates to a method for efficiently producing a dual array type radiation detector using two types of scintillators having different compositions.
- CT computed Tomography
- the CT device has an X-ray tube that irradiates an X-ray fan beam and a radiation detector with a large number of radiation detection elements. Has been placed.
- the X-ray fan beam emitted from the X-ray tube passes through the measurement object and is detected by the radiation detector.
- Collect X-ray absorption data of the measurement target at different irradiation angles for each irradiation calculate the X-ray absorption rate of each part on the tomographic plane of the measurement target by computer analysis, and according to the X-ray absorption rate A tomographic image is constructed.
- the radiation detecting element is composed of a scintillator cell and a light receiving element.
- the scintillator cell emits light upon receiving the irradiated X-ray
- the light receiving element receives the light emitted from the cell and converts it into an electrical signal.
- a detector using a silicon photodiode as a light receiving element and combined with a scintillator cell, or a detector combined with a scintillator cell using a photomultiplier tube as a light receiving element is used.
- U.S. Pat. Discloses a dual array radiation detector that receives light emitted from a second scintillator by a second diode.
- WO 2006/114715 also discloses a first photodetector that converts radiation on the low energy side into light and converts the light into an electrical signal, converts radiation on the high energy side into light, and converts the light into an electrical signal.
- a dual array radiation detector having a second photodetector for converting to a light source is disclosed.
- the radiation energy detection sensitivity distribution is a distribution in which the scintillator plate absorbs the radiation energy, and this depends on the composition of the scintillator.
- US Pat. No. 4,511,799 and WO7992006 / 114715 do not disclose a specific method for manufacturing a dual array type radiation detector.
- JP 2002-236182 discloses a method of manufacturing a one-dimensional or multi-dimensional detector array in which scintillator cells having different widths are combined.
- a composite layer composed of a sensor layer and a base layer sensitive to radiation is formed, and
- the sensor layer is separated from the base layer in order to divide the sensor layer into individual elements insulated from each other.
- a partition is formed in the sensor layer by cutting the layer.
- Japanese Patent Laid-Open No. 2001-174564 a plurality of scintillator elements that react to X-rays of different energy levels are arranged in the X-ray transmission direction, and the light detection elements corresponding to the scintillator elements are perpendicular to the scintillator elements.
- a dual array X-ray detector is disclosed which is arranged in a direction and in which a plurality of scintillator elements and a plurality of light detection elements form a column.
- the plurality of scintillator elements are integrally molded with a light reflective material.
- Japanese Patent Laid-Open No. 2001-174564 does not specifically disclose a method of manufacturing a dual array type X-ray detector.
- JP-T 2009-524015 describes the production of a scintillation ceramic wafer, forming a plurality of slits in two directions perpendicular to the upper surface of the ceramic wafer, oxidizing a part of the surface of the ceramic wafer, and forming a reflective layer Discloses a method of manufacturing a scintillation array.
- the method of JP-T-2009-524015 is to form a scintillation array with one kind of scintillation ceramic and not to arrange two kinds of scintillation cells.
- an object of the present invention is to provide a method for efficiently producing a dual array type radiation detector using two types of scintillators having different compositions.
- a plurality of first and second cells composed of scintillators having different compositions so that the detection sensitivity distribution of radiation energy is different, and the light emitted from each of the first and second cells emitted by the radiation is received as an electrical signal.
- the first and second cells and the light receiving element are positioned by abutting the side surfaces of the first and second single arrays and the side surface of the light receiving element array against a reference surface.
- a jig having a flat surface in a vertical relationship is arranged in the alignment step, and the flat surface is used as a reference surface for positioning the first and second cells and the light receiving element.
- the steps of forming the first and second cell arrays include a step of fixing each scintillator plate to a support plate by a sticking sheet, a step of cutting each fixed scintillator plate into at least m ⁇ n cells, and each cell It is preferable to have a step of forming a cured resin assembly by coating the resin for the reflective layer and curing the resin for the reflective layer, and a step of peeling the adhesive sheet from the cured resin assembly.
- the adhesive sheet has a heat-peelable pressure-sensitive adhesive layer, and it is preferable that the adhesive sheet is peeled off from the cured resin assembly by heating to 80 ° C. or higher.
- the step of forming the cured resin assembly includes the step of forming a frame surrounding the first and second cells, the step of fixing the frame to the support plate, and the reflection in the space surrounded by the frame. And a step of pouring the layer resin.
- the frame is preferably formed by sticking a sticking sheet on a side surface of the support plate so as to surround the first and second cells.
- the X-ray transmittances of the first and second cells are preferably different.
- the X-ray transmittance is a ratio of the intensity of X-rays transmitted through the cell to the intensity of X-rays applied to the cell.
- a dual array type radiation detector using two types of scintillators having different compositions so that the detection sensitivity distribution of radiation energy is different can be efficiently manufactured.
- FIG. 10 is a perspective view showing step 1-3 in the first cell array forming step A1. It is an enlarged plan view showing a part of the first cell array. It is a perspective view which shows the 1st cell array obtained at process A1.
- FIG. 10 is a perspective view showing step 1-4 in the first cell array formation step A1.
- FIG. 10 is a perspective view showing the first cell array obtained in step 1-8 in the first cell array forming step A1.
- FIG. 6 is an enlarged plan view showing a state after performing step A2 in the same place as in FIG.
- FIG. 6 is a plan view showing a first single array that is positioned in step A3.
- FIG. 11 is a sectional view taken along line AA in FIG. It is a top view which shows the 2nd single array positioned by process A3.
- FIG. 13 is a sectional view taken along line BB in FIG.
- FIG. 6 is a plan view showing a light receiving element array that is positioned in step A3.
- FIG. 10 is a perspective view showing a first method for positioning the first and second cell arrays and the light receiving element array in step A3. It is a perspective view which shows the radiation detector manufactured by the method of this invention.
- FIG. 10 is a perspective view showing a second method for positioning the first and second cell arrays and the light receiving element array in step A3.
- FIG. 19 (b) is a side view of the bag viewed from the A direction.
- FIG. 19 (b) is a side view of the bag viewed from the B direction.
- FIG. 10 is a perspective view showing a third method for positioning the first and second cell arrays and the light receiving element array in step A3. It is a top view which shows the 1st and 2nd cell array and the light receiving element array which were positioned by the 3rd method.
- FIG. 20 (b) is a side view of the bag viewed from the A direction.
- 10 is an exploded perspective view showing a fourth method of positioning the first and second cell arrays and the light receiving element array in step A3. It is a perspective view which shows the 1st and 2nd cell array and the light receiving element array which were positioned by the 4th method.
- FIG. 1 is a flowchart showing a method of the present invention for manufacturing a dual array type radiation detector.
- This method includes a step A1 of obtaining a first cell array having at least m ⁇ n first cells from a first scintillator plate through a reflective layer, and cutting the first cell array through the reflective layer.
- a process A4 for wearing for wearing.
- the first cell array forming step A1 includes a step of fixing the first scintillator plate to the support plate with wax, a double-sided adhesive sheet, etc., and the first scintillator plate orthogonal to the rotating grindstone, multi-wire saw, etc. And cutting a plurality of times in two directions.
- a double-sided adhesive sheet is used in step A1
- not only the first cell array can be efficiently formed, but also the jig can be shared, so that the manufacturing cost can be reduced. Since the method using an adhesive sheet can be applied to both steps A1 and B1, only step A1 will be described with reference to the flowchart of FIG. 2, but the description can of course be applied to step B1 as it is.
- Step 1 After fixing fixing sheet 25 having adhesive layers on both sides and each adhesive layer being coated with a separator is cut to a size that covers the upper surface of support plate 24, one of the separators is peeled off and the support plate is removed. Affix to the upper surface of 24 (step 1-1). Next, the other separator of the fixing adhesive sheet 25 is peeled off to expose the adhesive layer 26 of the fixing adhesive sheet 25 and pasted with the front side 27 of the first scintillator plate 23 as shown in FIG. (Step 1-2).
- the fixing adhesive sheet 25 having the heat-peelable pressure-sensitive adhesive layer 26 can be easily peeled off by heating, and thus contributes to an improvement in work efficiency. Similarly, if the adhesive layer on the support plate 24 side is also of a heat-peelable type, the fixing adhesive sheet 25 can be easily peeled off from the support plate 24 by heating.
- a rotary grindstone 9b such as a diamond grindstone is used to cut the first scintillator plate 23 in parallel with the width of d3 m + 1 times and the width of d4 in the orthogonal direction. Are cut in parallel n + 1 times to form m + 1 parallel Z-direction cutting grooves 29 and n + 1 parallel Y-direction cutting grooves 30 (step 1-3).
- a plurality of cutting grooves can be simultaneously formed in the first scintillator plate 23 by a multi-wire saw including a plurality of wire saws instead of the rotating grindstone 9b.
- first, shallow cutting grooves 29 and 30 are formed in the first scintillator plate 23 with the rotating grindstone 9b, and after fixing the first scintillator plate 23 to the support plate 24 with the fixing adhesive sheet 25, the cutting grooves 29, 30 may be further cut.
- the first scintillator plate 23 is divided into (m + 2) ⁇ (n + 2) first cells 2a, but the edges are When removed, at least m ⁇ n first cells 2a are obtained.
- the peripheral portion 31 may be removed to leave the wide peripheral cell 31 as shown in FIG. 4 or the first cell array 1 including at least m ⁇ n first cells 2a. When leaving the peripheral cell 31, if it is removed in a later step, exactly m ⁇ n first cells 2a are obtained.
- the outer two of the m + 1 Z-direction cutting grooves 29 form the side surfaces 5L and 5R of the first cell array 1, and the outer two of the n + 1 Y-direction cutting grooves 30 are the second ones. Side surfaces 5F and 5B of one cell array 1 are formed.
- each first cell 2a is fixed to the support plate 24 by the fixing adhesive sheet 25, the interval between the first cells 2a is accurately maintained. After dividing into the first cells 2a, before proceeding to the covering step, it is preferable to perform washing and drying in order to remove processing wastes and the like.
- a frame for storing the liquid reflective layer resin is formed (step 1-4).
- the frame is preferably formed by an adhesive sheet having the same heat-peeling pressure-sensitive adhesive layer used in Step 1-1.
- the frame pasting sheets 32F and 32B have the same length as the dimension La in the Y direction of the support plate 24, the thickness h1 of the first scintillator plate, the thickness h2 of the resin layer for the reflective layer to be formed, and the support plate It has a width equal to or greater than the total dimension (h1 + h2 + h3) with 24 side sticking margins h3.
- the frame pasting sheets 32L and 32R have the same length as the dimension Lb in the Z direction of the support plate 24 and the same width (h1 + h2 + h3 or more) as the frame pasting sheets 32F and 32B.
- These frame application sheets 32F, 32B, 32L, and 32R are attached to the side surface of the support plate 24 so as to surround the first cell 2a. If all the heat-peelable adhesive layers of the frame pasting sheets 32F, 32B, 32L, and 32R are on the inside, adhesion to the support plate 24 and heat-separation become easy. Of course, you may use the sticking sheet which has a heat-peeling type adhesive layer on both surfaces for a frame.
- a square frame is formed by adhering each end of the frame pasting sheets 32F, 32B, 32L, 32R pasted on the side surface of the support plate 24.
- the space surrounded by the fixing adhesive sheet 25 can be regarded as a container having an opening 33.
- a frame formed by bonding each end of the frame bonding sheets 32F, 32B, 32L, and 32R may be adhered to the side surface of the support plate 24.
- the container may be formed by adhering a frame of a resin such as a fluororesin that is easily peeled off from the reflective layer resin to the side surface of the support plate 24.
- the liquid reflective layer resin is injected into the container surrounded by the frame pasting sheets 32F, 32B, 32L, and 32R (step 1-5).
- the reflection layer resin enters all the gaps 29 and 30 of the first cell 2a and covers the upper surface and side surfaces of the first cell array 1. In this way, the first cell 2a coated with the reflective layer resin is obtained.
- the liquid reflective layer resin is poured gently over time so that the thickness of the resin layer is uniform.
- the first cell array 1 in which m ⁇ n first cells 2a are integrated is obtained by curing the resin for the reflective layer filled in the gaps between the first cells 2a.
- the same reflective layer resin is applied to the side surfaces 5F, 5L, 5R and 5B and the back surface 6a of the first cell array 1, and then cured. Therefore, only the front surface 7a of the first cell array 1 is not covered with the reflective layer resin, and the first cell 2a is exposed.
- the reflective layer resin a thermosetting resin mixed with titanium oxide fine particles is preferable.
- Reflective layer resin filled in the gap between the first cells 2a arranged in the m direction in the Y direction constitutes the reflective layer 3, and for reflection filled in the gap between the first cells 2a arranged in the Z direction in the n rows.
- the resin constitutes the cutting margin layer 4. Therefore, m ⁇ n first cells 2 a are integrated via the reflective layer 3 and the cutting allowance layer 4.
- the reflective layer 3 and the cutting margin layer 4 are shown by straight lines.
- FIG. 5 shows an enlarged part of the front surface 7a of the first cell array 1.
- the first cells 2a arranged in the Y direction are arranged via a reflective layer 3 having a thickness d3, and the first cells 2a arranged in the Z direction are arranged via a cutting margin layer 4 having a thickness d4.
- the reflective layer resin that covers the side surface 5L of the first cell array 1 (corresponding to the outer end surface of the first cell 2a at the end in the Y direction) has a thickness d5Y, and the side surface of the first cell array 1
- the reflection layer resin covering 5B (corresponding to the outer end surface of the first cell 2a at the end in the Z direction) has a thickness d5Z.
- the first layer heating device is used to heat the resin to the heat curing temperature to cure the reflective layer resin (step 1-6).
- the reflective layer resin is preferably a liquid thermosetting resin mixed with fine titanium oxide particles.
- the heat curing time is preferably 1 to 6 hours.
- the frame adhesive sheets 32F, 32B, 32L, 32R and the fixing adhesive sheet 25 are peeled off to obtain a resin cured assembly (step) 1-7).
- the cured resin becomes a reflective layer.
- the fixing adhesive sheet 25 having the heat-peelable adhesive layer and the frame adhesive sheets 32F, 32B, 32L, and 32R are equal to or higher than the curing temperature of the reflective layer resin (for example, 80 ° C.) using a second heating device such as a hot plate. When heated to the above), the adhesive strength is reduced and can be easily peeled off.
- each first cell 2a Since the fixing adhesive sheet 25 and the first cell 2a are in close contact with each other with sufficient adhesive force before the heat-curing of the reflective layer resin, the reflective layer resin does not enter between the gaps. For this reason, one surface of each first cell 2a is exposed on the front surface of the cured resin assembly obtained after the heat curing step and the heat peeling step, but all surfaces other than the front surface are covered with a reflective layer. It has been broken.
- the first cell array having at least m ⁇ n first cells 2a by grinding the front surface 7a of the cured resin assembly flatly until the first cells 2a have a thickness h4. Get 1 (steps 1-8). After the front surface 7a is ground, the reflective layer on the back surface of the cured resin assembly is preferably ground to a thickness h2. As shown in FIG. 8, since the first cell array 1 has the outer peripheral cells 31, the outer peripheral cells 31 are excised in step A2 after single-side grinding.
- Process A2 4 and 9 show a process of cutting the first cell array 1 along the cutting layer 4 using the rotating grindstone 9a or the like.
- the cutting margin layer 4 remaining on the side surface of the first cell 2a after cutting becomes a reflective layer having a thickness d5Z.
- at least m ⁇ 1 cells 2a are arranged in the Y direction through the reflective layer 3 having the thickness d3, and the first single array has the reflective layers having the thickness d5Z on both side surfaces 10B and 10Z in the Z direction. 8 is obtained.
- the second and subsequent columns are cut in the same manner to obtain a first single array 8 of at least n columns in total.
- the method of obtaining at least n first single arrays 8 by cutting the first cell array 1 is more efficient than the method of obtaining the first single arrays 8 individually.
- the reflective layer on the side surface 10L of the first single array 8 has the same thickness d5Y as the reflective layer on the side surface 5L of the first cell array 1.
- the reflective layer resin layer thicker than d5Y and d5Z is formed on the side surfaces 5F, 5L, 5B and 5R of the first cell array 1, or the first cell array 1 has more than m ⁇ n first cells.
- the cutting necessary for obtaining the first single array 8 having the above-described configuration may be performed in step A2.
- the thickness d9 is sufficiently larger than the thickness d9, and after cutting, the reflective layer on the side surface 10F can be ground again to obtain an accurate thickness d10.
- Process B1 and B2 are the same as steps A1 and A2 except that a second scintillator plate having a different composition is used instead of the first scintillator plate.
- the thickness in the Z direction of the cells in the first single array obtained in step A2 and the second single array obtained in step B2 is preferably set as appropriate in order to adjust different X-ray absorption rates depending on the composition.
- the second scintillator plate is thicker than the first scintillator plate, and compared with the same thickness and area, the second scintillator has a higher X-ray absorption rate than the first scintillator.
- Process A3 and A4 The first single array, the second single array, and the light receiving element array are aligned so that each cell and the light receiving element are accurately aligned.
- 10 and 11 show the first single array 8
- FIGS. 12 and 13 show the second single array 11
- FIG. 14 shows the light receiving element array 12.
- first cells 2a are integrated via the reflective layer 3, and surfaces other than the front surface 7b (side surfaces 10B and 10L). , 10R, 10F and the back surface 6b) are covered with a resin for the reflective layer.
- the thickness of the resin for the reflective layer is d5Y on the side surfaces 10L and 10R, d5Z on the side surface 10B, d10 on the side surface 10F, and h2 on the back surface 6b.
- the thickness of the first cell 2a in the X direction is h4.
- At least m second cells 13 are integrated via the reflective layer 3, and surfaces other than the front surface 14b (side surfaces 15B and 15L). 15R, 15F and the back surface 16b) are covered with a resin for the reflective layer.
- the thickness of the resin for the reflective layer is d5Y on the side surfaces 15L and 15R, d5Z on the side surface 15B, and h2 on the back surface 16b.
- the thickness of the second cell 13 in the X direction is h4.
- the Z-direction dimension of the first cell 2a is smaller than the Z-direction dimension of the second cell 13, but this is not restrictive.
- m 16, but of course not limited, and m may be any natural number of 2 or more.
- the light receiving element array 12 has at least m ⁇ 2 light receiving elements 17 arranged at a pitch corresponding to the first and second cells 2a and 13.
- the distance from the side surface 18L of the light receiving element array 12 to the nearest light receiving element 17 is d5Y, and the distance from the side face 18B to the nearest light receiving element 17 is d5Z.
- the light receiving element array 12 for example, a silicon photodiode obtained by a photolithography method can be used. Since the silicon photodiode has the light receiving elements 17 arranged with high precision, positioning with the first and second cells 2a and 13 is easy in the alignment step A3.
- FIG. 15 and FIG. 16 only at least m ⁇ 2 light receiving elements 17 are shown, and wirings, terminals and the like of the light receiving element array 12 are omitted.
- the first method for accurate positioning uses the X reference plane that determines the position in the X direction, the Y reference plane that determines the position in the Y direction, and the Z reference plane that determines the position in the Z direction. Is the method.
- the light receiving element 17 of the element array 12 is positioned in the Y direction and the Z direction (step A3), and then (b) the first cell 2a, the second cell 13 and the light receiving element 17 are moved in the X direction when they are bonded. (Step A4).
- FIG. 15 shows that the first single array 8 and the second single array 11 are positioned in the X direction, the Y direction, and the Z direction using the X reference plane 19, the Y reference plane 20, and the Z reference plane 21 that are perpendicular to each other.
- a method of positioning the light receiving element array 12 in the Y direction and the Z direction is shown.
- the X reference surface 19 is preferably constituted by the upper surface of the flat support plate 40
- the Y reference surface 20 and the Z reference surface 21 are preferably constituted by right-angle inner surfaces of the L-shaped metal plate.
- the first and second single arrays 8, 11 and the light receiving element array as shown in FIG. It is preferable to use an L-shaped metal plate 50 in which metal plates having a size sufficiently covering 12 are integrally connected at right angles.
- FIG. 17 (b) when the L-shaped metal plate 50 is placed on the upper surface 40 (a) ⁇ of the support plate 40 constituting the X reference surface 19, the X reference surface 19 and the Y reference surface intersect at right angles, respectively. 20 and the Z reference plane 21 can be obtained accurately and easily.
- the L-shaped metal plate 50 is preferably formed by bending a relatively thick metal plate or by cutting out from a metal block. In particular, it is preferable to start cutting because the right-angle accuracy and the strength of the jig can be obtained at low cost.
- the first single array 8 and the second single array 11 are arranged on the X reference plane 19.
- the side surface 10F of the first single array 8 and the side surface 15B of the second single array 11 into contact with each other on the X reference surface 19, the distance between the first cell 2a and the second cell 13 in the Z direction can be increased.
- the boundaries between the side surfaces 10F and 15B that are abutted are indicated by “10F, 15B”.
- the first and second side surfaces 10L of the first single array 8 and the side surface 15L of the second single array 11 are brought into contact with the Y reference surface 20, respectively.
- Cells 2a and 13 are accurately positioned in the Y direction.
- the first and second cells 2a and 13 and the light receiving element 17 can be accurately aligned by abutting the side surface 10B of the first single array 8 against the Z reference surface 21.
- the side surface 18L of the light receiving element array 12 is abutted against the Y reference surface 20, and the side surface 18B is directed to the Z reference surface 21.
- the light receiving element array 12 can be positioned in the Y direction and the Z direction so that the light receiving element 17 accurately faces the first cell 2a and the second cell 13.
- step A4 Applying an optical resin adhesive on the front surface 7b of the first single array 8, the front surface 14b of the second single array 11, and the light receiving element 17 side surface of the light receiving element array 12, the X reference surface 19,
- the light receiving element array 12 is bonded to the first and second single arrays 8 and 11 while maintaining the butting against the Y reference surface 20 and the Z reference surface 21 (step A4).
- their positions may be finely adjusted.
- the optical resin adhesive it is preferable to apply to a uniform thickness so that bubbles do not enter. Further, if a slightly excessive adhesive is applied so that bubbles do not enter, excess adhesive protrudes from the adhesive interface when the first and second single arrays 8, 11 and the light receiving element array 12 are brought into close contact with each other. Therefore, it is preferable to apply a release agent to these surfaces in advance so that the X reference surface 19, the Y reference surface 20, and the Z reference surface 21 can be easily removed after bonding.
- FIGS. 17 (a) and 17 (c) it is preferable to provide a plurality of vertical grooves 52 on the inner surface 51 of the L-shaped metal plate 50 at equal intervals.
- FIG. 18 when the first and second single arrays 8, 11 and the light receiving element array 12 are brought into close contact with the L-shaped metal plate 50 having the groove 52, the protruding adhesive 53 enters the groove 52. Positioning of the first and second single arrays 8, 11 and the light receiving element array 12 without increasing the distance between the inner surface 51 of the metal plate 50 and the side surfaces of the first and second single arrays 8, 11 Can be done accurately.
- each of the first and second cells 2a, 13 and each light receiving element 17 are opposed to each other.
- the affixed surfaces of the first and second cells 2a, 13 and the light receiving element 17 are indicated by dotted lines, the affixed locations of the first cell 2a and the light receiving element 17 are indicated by "2a, 17", and the second cell 13 And the light receiving element 17 are indicated by “13, 17”.
- the light of the first and second cells 2a and 13 emitted by radiation incident from the Z direction is input to the light receiving element 17, where it is converted into a radiation detection signal.
- This moving plane is perpendicular to the Y reference plane 20 and the Z reference plane 21 and is parallel to the X reference plane 19. If air suction holes are provided in the X reference surface 19 and the moving surface, the positioned first and second single arrays 8, 11 and the light receiving element array 12 can be fixed, so that the working efficiency is improved.
- the second positioning method positions the side surfaces of the first and second single arrays 8, 11 and the light receiving element array 12.
- vertical cylindrical poles 61 and 62 are used in place of the Y reference plane 20 and the Z reference plane 21.
- the X reference plane 19 is the upper surface 40a of the flat support plate 40.
- the positioned first and second single arrays 8, 11 and the light receiving element array 12 can be fixed. Further, if the light receiving element array 12 is transported using the air suction type suction nozzle 63, positioning and adhesion can be easily automated.
- FIGS. 20 (a) to 20 (c) show an upper surface 40a (X reference surface 19) of a flat support plate 40 and a push rod 70 whose tip surface forms the Y reference surface 20. , 71 and push blocks 72, 73 whose tip surfaces form the Z reference surface 21, a third method of positioning the first and second single arrays 8, 11 and the light receiving element array 12 is shown.
- the first and second single arrays 8 and 11 are first temporarily fixed to the support plate 40 by suction or the like.
- suction is performed after removing the foreign matter and the like with compressed air by the air nozzle.
- the second single arrays 8, 11 are preferably adsorbed.
- the first and second single arrays 8 and 11 can be positioned with high accuracy by suction.
- the push rods 70 and 71 and the push blocks 72 and 73 may be one or a pair on each side.
- One push bar 71 on the side in the Y direction may be used as a reference plane, and the push bar 70 on the other side in the Y direction may be movable.
- the push block 72 on one side surface in the Z direction may be used as a reference surface, and the push block 73 on the other side surface in the Z direction may be movable.
- the light receiving element array 12 coated with the optical resin adhesive is conveyed by the suction nozzle 74, and is transferred to the first and second single arrays 8 and 11. Adhere to form a radiation detector. After removing the push rods 70 and 71 and the push blocks 72 and 73 and stopping the suction, the obtained radiation detector is transported to a tray or the like by the suction nozzle 74, and the next processing is started. Conveyance using the suction nozzle 74 enables continuous processing suitable for mass production.
- FIGS. 21 (a) and 21 (b) show the upper surface 40a (X reference surface 19) of the flat support plate 40, the Y reference surface 20 and the Z reference surface 21 on the suction nozzle 81.
- the first jig 80 to which the plate members 82 and 83 that form the plate are fixed, and the second jig that has the plate members 92 and 93 that form the Y reference surface 20 and the Z reference surface 21 to the suction nozzle 91 are fixed.
- 90 shows a fourth method of positioning the first and second single arrays 8, 11 and the light receiving element array 12.
- the light receiving element array 12 is arranged on the upper surface 40a (X reference surface 19) of the flat support plate 40, and one single array (for example, the first single array 8) is held by the first jig 80.
- the second jig 90 holds the other single array (for example, the second single array 11).
- the first and second single arrays 8 and 11 are bonded to the light receiving element array.
- the positions of the first and second single arrays 8 and 11 are finely adjusted so that they abut against the Y reference plane 20 and the Z reference plane 21, respectively.
- the Y reference plane plate member 82 of the first jig 80 to which the first single array 8 is fixed is lengthened, so that the second jig 90 is fixed to the second jig 90 on the Y reference plane plate member 82.
- the Z direction side surface of the single array 11 is brought into contact. As a result, the first and second single arrays 8, 11 can be accurately positioned in the Y direction and the Z direction.
- the radiation detector Obtained after forming the radiation detector by bonding the first and second single arrays 8, 11 and the light receiving element array 12, and then removing the first and second jigs 80, 90 and stopping the adsorption.
- the radiation detector is transported to a tray or the like by another suction nozzle, and the next process is started. Even in this method, continuous processing suitable for mass production is possible by conveyance using the suction nozzle.
- At least m ⁇ 2 light-receiving elements include a first single array having at least m ⁇ 1 first cells and a second single array having at least m ⁇ 1 second cells. Therefore, it is possible to manufacture a radiation detector ideally in a time of 1 / m compared to the conventional method of aligning individual single arrays to the light receiving elements. it can.
- the dimension system of the side surfaces of the first and second single arrays is very important, so the reflective layer on each side must have exactly the same thickness. After the first and second single arrays and the light-receiving element array are bonded, excess adhesive protrudes from the bonding interface. Therefore, the adhesive is removed by grinding the reflective layer on the side surface to a certain depth. At the same time, the reflective layer may be adjusted to the final thickness.
- the method of the present invention having the above characteristics is suitable for manufacturing a dual array type radiation detector used for a detector of a medical CT apparatus or a CT apparatus for baggage inspection.
Abstract
Description
第一のシンチレータ板から反射層を介して少なくともm×n個(m及びnはそれぞれ2以上の自然数であって、同じでも異なっても良い。)の第一のセルを有する第一のセルアレイを得る工程と、
第二のシンチレータ板から反射層を介して少なくともm×n個の第二のセルを有する第二のセルアレイを得る工程と、
前記第一のセルアレイを切断し、反射層を介して少なくともm×1個の第一のセルを有する第一のシングルアレイを少なくともn個得る工程と、
前記第二のセルアレイを切断し、反射層を介して少なくともm×1個の第二のセルを有する第二のシングルアレイを少なくともn個得る工程と、
各第一のシングルアレイ及び各第二のシングルアレイと、少なくともm×2個の受光素子を有する受光素子アレイとを、前記第一のセル及び前記第二のセルと前記受光素子とが対向するように整列する工程と、
前記第一のシングルアレイ及び第二のシングルアレイと前記受光素子アレイとを接着する工程とを有することを特徴とする。
第一のセルアレイの形成工程A1は、第一のシンチレータ板をワックス、両面粘着性の貼付けシート等で支持プレートに固定する工程と、第一のシンチレータ板を、回転砥石、マルチワイヤーソー等により直交する二方向に複数回切断する工程とを有する。工程A1に両面粘着性の貼付けシートを使うと、第一のセルアレイを効率良く形成することができるだけでなく、治具の共有ができるので製造コストを低減できる。貼付けシートを使う方法は工程A1,B1のいずれにも適用可能であるので、工程A1のみ図2のフローチャートにより説明するが、勿論その説明はそのまま工程B1にも適用できる。
両面に粘着層を備え、かつ各粘着層がセパレータで被覆された固定用貼付けシート25を支持プレート24の上面を覆う大きさにカットした後、一方のセパレータを剥がし、支持プレート24の上面に貼り付ける(ステップ1-1)。次いで、固定用貼付けシート25のもう一方のセパレータを剥がして固定用貼付けシート25の粘着層26を露出させ、図3に示すように第一のシンチレータ板23のオモテ面27を下にして貼り付ける(ステップ1-2)。熱剥離型粘着層26を有する固定用貼付けシート25は、加熱により容易に剥離できるので作業効率の向上に寄与する。支持プレート24側の粘着層も同様に熱剥離型とすれば、固定用貼付けシート25も支持プレート24から加熱により容易に剥離できる。
図4及び図5に示すように、ダイヤモンド砥石等の回転砥石9bにより、第一のシンチレータ板23にd3の幅でm+1回平行に切断するとともに、直交する方向にd4の幅でn+1回平行に切断し、m+1本の平行なZ方向切断溝29及びn+1本の平行なY方向切断溝30を形成する(ステップ1-3)。回転砥石9bの代わりに複数本のワイヤーソーからなるマルチワイヤーソーで、第一のシンチレータ板23に複数の切断溝を同時に形成することもできる。さらに、まず回転砥石9bで第一のシンチレータ板23に浅い切断溝29,30を形成し、固定用貼付けシート25により第一のシンチレータ板23を支持プレート24に固定した後で、切断溝29,30をさらに切断しても良い。
まず、図7に示すように液状反射層用樹脂を溜める枠を形成する(ステップ1-4)。枠は、ステップ1-1で用いたのと同じ熱剥離型粘着層を有する貼付けシートにより形成するのが好ましい。枠用貼付けシート32F及び32Bは、支持プレート24のY方向の寸法Laと同じ長さ、及び第一のシンチレータ板の厚さh1と、形成する反射層用樹脂層の厚さh2と、支持プレート24の側面貼付けしろh3との合計寸法(h1+h2+h3)以上の幅を有する。枠用貼付けシート32L及び32Rは、支持プレート24のZ方向の寸法Lbと同じ長さ、及び枠用貼付けシート32F及び32Bと同じ幅(h1+h2+h3以上)を有する。これらの枠用貼付けシート32F,32B,32L,32Rを、第一のセル2aを囲むように支持プレート24の側面に貼り付ける。枠用貼付けシート32F,32B,32L,32Rの熱剥離型粘着層を全て内側にすると、支持プレート24への粘着及び加熱剥離が容易になる。勿論、両面に熱剥離型粘着層を有する貼付けシートを枠に用いても良い。
第一の加熱装置を用いて反射層用樹脂を硬化した後、枠用貼付けシート32F,32B,32L,32R及び固定用貼付けシート25を剥がし、樹脂硬化集合体を得る(ステップ1-7)。硬化した樹脂は反射層となる。熱剥離型粘着層を有する固定用貼付けシート25及び枠用貼付けシート32F,32B,32L,32Rは、ホットプレート等の第二の加熱装置を用いて反射層用樹脂の硬化温度以上(例えば80℃以上)に加熱すると粘着力が低下し、容易に剥離できる。
図4及び図9は、回転砥石9a等を用いて第一のセルアレイ1を切削しろ層4に沿って切断する工程を示す。切断後に第一のセル2aの側面に残留する切削しろ層4は厚さd5Zの反射層となる。このようにして、厚さd3の反射層3を介してY方向に少なくともm×1個のセル2aが並び、Z方向両側面10B,10Zに厚さd5Zの反射層を有する第一のシングルアレイ8が得られる。2列目以降の切断も同様に行い、合計で少なくともn列の第一のシングルアレイ8を得る。第一のセルアレイ1の切断により少なくともn個の第一のシングルアレイ8を得る方法は、第一のシングルアレイ8を個々に得る方法より効率的である。
工程B1及びB2は、第一のシンチレータ板の代わりに組成の異なる第二のシンチレータ板を使用した以外工程A1及びA2と同じである。工程A2で得られる第一のシングルアレイ及び工程B2で得られる第二のシングルアレイにおけるセルのZ方向厚さは、組成により異なるX線吸収率を調整するために適宜設定するのが好ましい。図示の例では、第二のシンチレータ板の方が第一のシンチレータ板より厚く、かつ同じ厚さ及び面積で比較すると、第二のシンチレータの方が第一のシンチレータよりX線吸収率が高いが、勿論限定的ではない。
第一のシングルアレイ及び第二のシングルアレイと受光素子アレイとを、それぞれのセルと受光素子とが正確に整合するように整列する。図10及び図11は第一のシングルアレイ8を示し、図12及び図13は第二のシングルアレイ11を示し、図14は受光素子アレイ12を示す。
正確な位置決めの第一の方法は、X方向の位置を決めるX基準面、Y方向の位置を決めるY基準面、及びZ方向の位置を決めるZ基準面を用いる方法である。この方法では、(a) 図10及び図11に示す第一のシングルアレイ8の第一のセル2aと、図12及び図13に示す第二のシングルアレイ11の第二のセル13と、受光素子アレイ12の受光素子17とをY方向及びZ方向に位置決めし(工程A3)、次いで(b) それらを接着する際に第一のセル2a、第二のセル13及び受光素子17をX方向に位置決めする(工程A4)。
図19(a)~図19(d) に示すように、第二の位置決め方法では第一及び第二のシングルアレイ8,11及び受光素子アレイ12の側面を位置決めするために、Y基準面20及びZ基準面21の代わりに垂直な円柱状ポール61,62を用いる。X基準面19は平板状の支持プレート40の上面40aとする。支持プレート40の平坦な上面40aに少なくとも3本の垂直なポール61,62を立てることにより、第一の位置決め方法と同様に第一及び第二のシングルアレイ8,11及び受光素子アレイ12の正確な位置決めができる。この場合も、X基準面19にエア吸引穴(図示せず)を設けることにより、位置決めした第一及び第二のシングルアレイ8,11及び受光素子アレイ12を固定できる。また、受光素子アレイ12をエア吸引式の吸着ノズル63を用いて搬送すると、位置決め及び接着を自動化し易い。
図20(a)~図20(c) は、平坦な支持プレート40の上面40a(X基準面19)と、先端面がY基準面20を形成する押し棒70,71と、先端面がZ基準面21を形成する押しブロック72,73とを用いて、第一及び第二のシングルアレイ8,11及び受光素子アレイ12を位置決めする第三の方法を示す。この方法では、まず第一及び第二のシングルアレイ8,11を吸着等により支持プレート40に仮固定する。このとき第一及び第二のシングルアレイ8,11と支持プレート40の間に異物等が挟まり位置決め精度が悪化するのを防ぐために、エアノズルにより圧縮エアで異物等を除去した後に吸引し、第一及び第二のシングルアレイ8,11を吸着するのが好ましい。吸着により第一及び第二のシングルアレイ8,11を高い精度で位置決めできる。
図21(a) 及び図21(b) は、平坦な支持プレート40の上面40a(X基準面19)と、吸着ノズル81にY基準面20及びZ基準面21を形成する板部材82,83が固定された第一の治具80と、吸着ノズル91にY基準面20及びZ基準面21を形成する板部材92,93が固定された第二の治具90とを用いて、第一及び第二のシングルアレイ8,11及び受光素子アレイ12を位置決めする第四の方法を示す。この方法では、平坦な支持プレート40の上面40a(X基準面19)に受光素子アレイ12を配置し、第一の治具80により一方のシングルアレイ(例えば、第一のシングルアレイ8)を保持し、第二の治具90により他方のシングルアレイ(例えば、第二のシングルアレイ11)を保持する。
Claims (7)
- 放射線エネルギーの検出感度分布が異なるように組成が異なるシンチレータからなる複数の第一及び第二のセルと、放射線により発光した各第一及び第二のセルから出た光を受けてそれを電気信号に変換する複数の受光素子と、前記第一及び第二のセルの光を前記受光素子に導く反射層とを有する放射線検出器を製造する方法であって、
第一のシンチレータ板から反射層を介して少なくともm×n個(m及びnはそれぞれ2以上の自然数であって、同じでも異なっても良い。)の第一のセルを有する第一のセルアレイを得る工程と、
第二のシンチレータ板から反射層を介して少なくともm×n個の第二のセルを有する第二のセルアレイを得る工程と、
前記第一のセルアレイを切断し、反射層を介して少なくともm×1個の第一のセルを有する第一のシングルアレイを少なくともn個得る工程と、
前記第二のセルアレイを切断し、反射層を介して少なくともm×1個の第二のセルを有する第二のシングルアレイを少なくともn個得る工程と、
各第一のシングルアレイ及び各第二のシングルアレイと、少なくともm×2個の受光素子を有する受光素子アレイとを、前記第一のセル及び前記第二のセルと前記受光素子とが対向するように整列する工程と、
前記第一のシングルアレイ及び第二のシングルアレイと前記受光素子アレイとを接着する工程とを有することを特徴とする方法。 - 請求項1に記載の放射線検出器の製造方法において、前記整列工程で、前記第一及び第二のシングルアレイの側面及び前記受光素子アレイの側面を基準面に突き当てて、前記第一及び第二のセル及び前記受光素子を位置決めすることを特徴とする方法。
- 請求項2に記載の放射線検出器の製造方法において、前記整列工程で垂直の関係にある基準面を有する治具を使用し、前記基準面により前記第一及び第二のセル及び前記受光素子を位置決めすることを特徴とする方法。
- 請求項1~3のいずれかに記載の放射線検出器の製造方法において、前記第一及び第二のセルアレイの形成工程が、
各シンチレータ板を貼付けシートにより支持プレートに固定する工程と、
固定された各シンチレータ板を少なくともm×n個のセルに切断する工程と、
各セルを反射層用樹脂で被覆し、前記反射層用樹脂を硬化することにより、樹脂硬化集合体を形成する工程と、
前記樹脂硬化集合体から前記貼付けシートを剥離する工程とを有することを特徴とする方法。 - 請求項4に記載の放射線検出器の製造方法において、前記貼付けシートが熱剥離型粘着層を有し、80℃以上に加熱することにより前記貼付けシートを前記樹脂硬化集合体から剥離することを特徴とする方法。
- 請求項4又は5に記載の放射線検出器の製造方法において、前記被覆工程が、前記第一及び第二のセルを囲む枠を形成する工程と、前記枠を前記支持プレートに固定する工程と、前記枠で囲まれた空間に前記反射層用樹脂を注ぐ工程とを有することを特徴とする方法。
- 請求項6に記載の放射線検出器の製造方法において、前記第一及び第二のセルを囲むように前記支持プレートの側面に貼付けシートを貼り付けることにより前記枠を形成することを特徴とする方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/437,883 US9702985B2 (en) | 2012-10-24 | 2013-10-23 | Method for producing radiation detector |
CN201380056009.8A CN104769455B (zh) | 2012-10-24 | 2013-10-23 | 放射线检测器的制造方法 |
EP13848263.3A EP2913693B1 (en) | 2012-10-24 | 2013-10-23 | Method for producing radiation detector |
JP2014543326A JP6115570B2 (ja) | 2012-10-24 | 2013-10-23 | 放射線検出器の製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012234256 | 2012-10-24 | ||
JP2012-234256 | 2012-10-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014065328A1 true WO2014065328A1 (ja) | 2014-05-01 |
Family
ID=50544703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2013/078714 WO2014065328A1 (ja) | 2012-10-24 | 2013-10-23 | 放射線検出器の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9702985B2 (ja) |
EP (1) | EP2913693B1 (ja) |
JP (1) | JP6115570B2 (ja) |
CN (1) | CN104769455B (ja) |
WO (1) | WO2014065328A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI671141B (zh) | 2013-08-30 | 2019-09-11 | 半導體能源研究所股份有限公司 | 支撐體供應裝置及供應支撐體的方法 |
JP6669168B2 (ja) * | 2015-05-12 | 2020-03-18 | 株式会社島津製作所 | 放射線検出器またはそれを備えた放射線断層撮影装置 |
US10804407B2 (en) | 2016-05-12 | 2020-10-13 | Semiconductor Energy Laboratory Co., Ltd. | Laser processing apparatus and stack processing apparatus |
CN109501330A (zh) * | 2018-12-19 | 2019-03-22 | 同方威视技术股份有限公司 | 闪烁体反射层制备模具 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4511799A (en) | 1982-12-10 | 1985-04-16 | American Science And Engineering, Inc. | Dual energy imaging |
JP2001174564A (ja) | 1999-12-15 | 2001-06-29 | Ge Yokogawa Medical Systems Ltd | X線検出器およびx線ct装置 |
JP2002236182A (ja) | 2000-11-03 | 2002-08-23 | Siemens Ag | 一次元又は多次元検出器アレイの製造方法 |
JP2004061492A (ja) * | 2002-06-04 | 2004-02-26 | Hitachi Medical Corp | X線検出器用シンチレータ、その製造方法並びにそれを用いたx線検出器及びx線ct装置 |
WO2006114715A2 (en) | 2005-04-26 | 2006-11-02 | Koninklijke Philips Electronics, N.V. | Detector array for spectral ct |
JP2009524015A (ja) | 2006-01-16 | 2009-06-25 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | シンチレーション要素、シンチレーションアレイ並びにシンチレーション要素及びシンチレーションアレイを生産する方法 |
JP2012199543A (ja) * | 2011-03-09 | 2012-10-18 | Makoto Shizukuishi | 撮像装置及び製造方法 |
JP2013228355A (ja) * | 2012-03-30 | 2013-11-07 | Hitachi Metals Ltd | シンチレータアレイの製造方法及び放射線検出器の製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US793857A (en) * | 1904-06-25 | 1905-07-04 | Edward C Terry | Steam-turbine. |
US6245184B1 (en) * | 1997-11-26 | 2001-06-12 | General Electric Company | Method of fabricating scintillators for computed tomograph system |
US6749761B1 (en) * | 2000-10-10 | 2004-06-15 | Cti Pet Systems, Inc. | Method for producing a high resolution detector array |
JP4703833B2 (ja) * | 2000-10-18 | 2011-06-15 | 日東電工株式会社 | エネルギー線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法 |
US20030236388A1 (en) * | 2002-06-12 | 2003-12-25 | General Electric Company | Epoxy polymer precursors and epoxy polymers resistant to damage by high-energy radiation |
JP4525123B2 (ja) * | 2003-06-30 | 2010-08-18 | 株式会社島津製作所 | 放射線検出器およびその製造方法 |
US20060067472A1 (en) * | 2004-09-30 | 2006-03-30 | Possin George E | Method and apparatus for measuring X-ray energy |
US8448327B2 (en) * | 2008-05-12 | 2013-05-28 | Shimadzu Corporation | Method of manufacturing radiation tomography apparatus |
CN102667525B (zh) * | 2009-12-18 | 2015-05-20 | 株式会社东芝 | 放射线检测器及其制造方法 |
WO2012030737A2 (en) * | 2010-08-30 | 2012-03-08 | Saint-Gobain Ceramics & Plastics, Inc. | Radiation detection system including an array of scintillator elements and processes of forming the same |
JP2012172971A (ja) * | 2011-02-17 | 2012-09-10 | Konica Minolta Medical & Graphic Inc | シンチレータパネル、その製造方法、フラットパネルディテクタ及びその製造方法 |
-
2013
- 2013-10-23 US US14/437,883 patent/US9702985B2/en active Active
- 2013-10-23 JP JP2014543326A patent/JP6115570B2/ja active Active
- 2013-10-23 WO PCT/JP2013/078714 patent/WO2014065328A1/ja active Application Filing
- 2013-10-23 EP EP13848263.3A patent/EP2913693B1/en active Active
- 2013-10-23 CN CN201380056009.8A patent/CN104769455B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4511799A (en) | 1982-12-10 | 1985-04-16 | American Science And Engineering, Inc. | Dual energy imaging |
JP2001174564A (ja) | 1999-12-15 | 2001-06-29 | Ge Yokogawa Medical Systems Ltd | X線検出器およびx線ct装置 |
JP2002236182A (ja) | 2000-11-03 | 2002-08-23 | Siemens Ag | 一次元又は多次元検出器アレイの製造方法 |
US6793857B2 (en) | 2000-11-03 | 2004-09-21 | Siemens Aktiengesellschaft | Method for producing a one- or multidimensional detector array |
JP2004061492A (ja) * | 2002-06-04 | 2004-02-26 | Hitachi Medical Corp | X線検出器用シンチレータ、その製造方法並びにそれを用いたx線検出器及びx線ct装置 |
WO2006114715A2 (en) | 2005-04-26 | 2006-11-02 | Koninklijke Philips Electronics, N.V. | Detector array for spectral ct |
JP2009524015A (ja) | 2006-01-16 | 2009-06-25 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | シンチレーション要素、シンチレーションアレイ並びにシンチレーション要素及びシンチレーションアレイを生産する方法 |
JP2012199543A (ja) * | 2011-03-09 | 2012-10-18 | Makoto Shizukuishi | 撮像装置及び製造方法 |
JP2013228355A (ja) * | 2012-03-30 | 2013-11-07 | Hitachi Metals Ltd | シンチレータアレイの製造方法及び放射線検出器の製造方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2913693A4 * |
Also Published As
Publication number | Publication date |
---|---|
US20150268357A1 (en) | 2015-09-24 |
US9702985B2 (en) | 2017-07-11 |
CN104769455A (zh) | 2015-07-08 |
EP2913693A1 (en) | 2015-09-02 |
JP6115570B2 (ja) | 2017-04-19 |
CN104769455B (zh) | 2017-05-17 |
JPWO2014065328A1 (ja) | 2016-09-08 |
EP2913693B1 (en) | 2017-04-19 |
EP2913693A4 (en) | 2016-07-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6115570B2 (ja) | 放射線検出器の製造方法 | |
JP4215320B2 (ja) | コンピュータ断層撮影装置用シンチレータの製造方法 | |
CN104204855B (zh) | 闪烁器阵列的制造方法 | |
JP2008510131A (ja) | シンチレータおよび抗散乱グリッドの配置 | |
JP5854128B2 (ja) | シンチレータデュアルアレイの製造方法 | |
JP5541413B2 (ja) | シンチレータアレイの製造方法 | |
JP6052595B2 (ja) | シンチレータアレイの製造方法 | |
JPS5988676A (ja) | 多チヤンネル放射線検出器ブロツクの製造方法 | |
TW202008059A (zh) | 晶圓的分割方法 | |
JP6052594B2 (ja) | シンチレータアレイの製造方法 | |
JP6233730B2 (ja) | シンチレータアレイの製造方法 | |
JP2000098040A (ja) | Ct用固体検出器の製造方法 | |
JPH08233942A (ja) | 放射線検出器アレイの製造方法 | |
EP3221720B1 (en) | Mammography detector with small chest distance | |
EP3172453B1 (en) | Bonding method with curing by reflected actinic rays | |
JP2001249180A (ja) | 2次元アレイ型放射線検出器の製造方法 | |
JP5997892B2 (ja) | X線検出器、x線ct装置、及びx線検出器の製造方法 | |
JP2002090463A (ja) | 放射線検出器 | |
JP2002202376A (ja) | 放射線検出器 | |
JPH04232889A (ja) | 多素子放射線検出器およびその製作方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13848263 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2014543326 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14437883 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
REEP | Request for entry into the european phase |
Ref document number: 2013848263 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2013848263 Country of ref document: EP |