WO2014054511A1 - 基板焼成装置 - Google Patents
基板焼成装置 Download PDFInfo
- Publication number
- WO2014054511A1 WO2014054511A1 PCT/JP2013/076189 JP2013076189W WO2014054511A1 WO 2014054511 A1 WO2014054511 A1 WO 2014054511A1 JP 2013076189 W JP2013076189 W JP 2013076189W WO 2014054511 A1 WO2014054511 A1 WO 2014054511A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- hot air
- heating chamber
- substrate
- suction
- nozzle
- Prior art date
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D7/00—Forming, maintaining, or circulating atmospheres in heating chambers
- F27D7/06—Forming or maintaining special atmospheres or vacuum within heating chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Especially adapted for treating semiconductor wafers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D99/00—Subject matter not provided for in other groups of this subclass
- F27D99/0073—Seals
- F27D99/0075—Gas curtain seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
Definitions
- the present invention relates to a substrate baking apparatus used in a baking process of a glass substrate for a liquid crystal display device.
- a substrate baking process in which a circuit pattern or a dielectric layer is formed and then baking, and a multistage having a plurality of heating chambers for baking a single glass substrate.
- a single-wafer type substrate baking apparatus is generally employed.
- the substrate baking apparatus is provided with an opening / closing lid for loading / unloading the substrate.
- the opening / closing lid is opened to load / unload the substrate, and the substrate is closed during baking to prevent dust from entering from the outside. Yes.
- the heating chamber can be sealed by providing an opening / closing lid, the inflow of cold air from the outside is prevented, the temperature inside the heating chamber is kept uniform, and the entry of foreign matter from the outside is effectively suppressed. be able to.
- the substrate entrance / exit opening increases, and the exhaust efficiency of sucking and exhausting external cold air from the suction holes decreases. Sublimation is likely to occur due to cooling.
- an object of the present invention is to provide a substrate baking apparatus in which external cold air does not flow into the apparatus and sublimates are not generated when the opening / closing lid is opened.
- the present invention is a substrate baking apparatus comprising a heating chamber that accommodates a substrate and heats the substrate at a baking temperature, and an open / close lid provided at a substrate outlet of the heating chamber, A hot air blowing part for blowing hot air downward from the vicinity of the inlet / outlet along the upper side of the heating chamber is provided, and a suction part for sucking an atmosphere including the hot air blown out is provided below the vicinity of the inlet / outlet It is characterized by providing.
- the hot air blowing part has a nozzle part that blows hot air outward and obliquely downward from the inside of the heating chamber, and the suction part has a suction hole at a site for sucking hot air blown obliquely downward.
- the nozzle portion may be a nozzle hole that is cut outward and obliquely downward on the lower side of the hot air piping member extending along the upper side of the heating chamber, and is mounted on the lower side of the hot air piping member.
- the structure which consists of a blowing nozzle provided with the nozzle hole of the outward diagonally downward may be sufficient.
- the suction part may have a suction hole drilled on the upper side of the exhaust pipe member extending along the lower side part of the heating chamber.
- the suction part has a suction hole cut in an inclined surface toward the inside of the heating chamber of the mountain-shaped rectification part provided on the upper side of the exhaust pipe member extending along the lower side of the heating chamber. Also good.
- hot air is supplied to the hot air blowing part via the air supply pipe and the branch part, and an air supply valve is provided in the branch part, and the supply valve is controlled to open and close, thereby opening and closing the opening / closing lid. Accordingly, it is preferable to blow out hot air.
- the present invention even when the opening / closing lid is opened, hot air is blown from the upper side to the lower side of the inlet / outlet, and the atmosphere including hot air blown from the suction portion provided below is sucked. This makes it possible to shut off the external cold air and the internal atmosphere. Therefore, it is possible to obtain a substrate baking apparatus in which external cold air does not flow into the apparatus when the open / close lid is opened, and sublimates generated by mixing external cold air and the internal atmosphere are not generated.
- FIG. 1 It is a schematic sectional side view explaining the structure of the board
- a substrate baking apparatus 1 includes a heating chamber 3 that accommodates a substrate K and heats the substrate at a baking temperature, and an opening / closing lid 5 that is provided at an inlet / outlet 4 of the substrate K in the heating chamber 3. It is.
- a single-wafer type substrate baking apparatus in which a plurality of heating chambers 3 are integrally provided in the apparatus body 2 and a plurality of substrates K can be simultaneously fired, for example, a TFT array substrate constituting a liquid crystal display device is manufactured. It is preferably used when
- the open / close lid 5 is configured to be openable and closable in the direction of arrow D1 in the figure.
- the substrate K is carried into the heating chamber 3 from the loading / unloading port 4 with the opening / closing lid 5 opened.
- the substrate K is supported in a substantially horizontal state in the heating chamber 3 via a support portion 9, and heaters 10 are provided on the upper and lower surfaces of the heating chamber 3 so that the upper and lower surfaces can be heated simultaneously. ing.
- the opening / closing lid 5 is opened, the substrate K is taken out, a new substrate K is loaded, and the next baking is started.
- the open / close lid 5 is configured to be openable / closable via a support shaft 6.
- a support shaft 6 extending in a direction passing through FIG. 1 below the entrance / exit 4 is provided, and the opening / closing lid 5 is rotatably attached to the support shaft 6 so that the opening / closing lid 5 is It rotates along the direction of the arrow D1, and can be opened and closed between a closed position that is substantially vertical and an open position that is substantially horizontal.
- the support shaft 6 does not have to be a single length extending over both side portions of the apparatus main body 2.
- a short support shaft is provided on each side portion, A configuration may be adopted in which the opening / closing lid 5 is detachably mounted via a support shaft.
- a hot air blowing section 8 is provided to blow hot air downward along the upper side of the heating chamber 3 from above the vicinity of the inlet / outlet 4, and hot air blown out below the vicinity of the inlet / outlet 4.
- Suction portions 7 and 7A for sucking an atmosphere including
- heaters 10 are arranged above and below the heating chamber 3, and a suction unit 7 is installed on the side of the heater 10 below the inlet / outlet 4.
- the suction portion 7 is formed by providing a suction hole 71 having a predetermined shape on the upper side of an exhaust pipe member having a rectangular cross section, for example, extending in a direction penetrating the drawing.
- the shape of the exhaust pipe member does not have to be rectangular as shown in the figure, and may be circular or elliptical in cross section.
- a hot air blowing section 8 is provided above the entrance / exit 4.
- the hot air blowing section 8 provided in the uppermost heating chamber 3 is installed on the wall portion of the apparatus main body 2. In the other heating chambers 3, the hot air blowing section 8 is installed at the lower portion of the lower suction section 7. Good.
- the hot air blowing portion 8 is formed, for example, by providing a hot air piping member having a rectangular cross section with a nozzle portion (consisting of a nozzle hole 81 or a blowing nozzle 82) having a predetermined shape. Similar to the exhaust pipe member shape described above, the hot air piping member shape may not be rectangular in cross section, and the cross section may be circular or elliptical.
- the nozzle portion may have a nozzle shape that can inject hot air to be blown downward, preferably obliquely downward.
- it may have a configuration comprising a nozzle hole 81 which is cut outward and obliquely downward on the lower side of the hot air piping member extending along the upper side of the heating chamber 3, and is mounted on the lower side of the hot air piping member.
- it may be configured by a blowout nozzle 82 provided with a nozzle hole of a predetermined length that is inclined outward and downward.
- the nozzle hole 81 can be formed by drilling a part of the hot air piping member, the nozzle hole 81 is easy to manufacture and does not protrude below the hot air piping member, so that the apparatus configuration can be simplified. Moreover, since the blowing nozzle 82 has the nozzle hole of predetermined length, the direction of the hot air which blows off can be stabilized, and the stable blowing flow can be formed also with respect to a wide opening part.
- the suction hole 71 is preferably capable of sucking an atmosphere including blown hot air. That is, the hot air blowing part 8 has a nozzle part (nozzle hole 81, blowing nozzle 82) that blows hot air outward from the inside of the heating chamber 3, and the suction part 7 is hot air blown obliquely downward. It is set as the structure which has the suction hole 71 in the site
- the heating chamber 3 may be sealed or may not be completely sealed.
- the sealing material 51 can be sealed by providing a packing material 51 inside the opening / closing lid 5 and pressing against the frame body of the apparatus main body 2 or the frame portion of the suction portion 7 to close.
- the heating chamber 3 when the heating chamber 3 is not sealed when the opening / closing lid 5 is closed, it is possible to control so that external cold air does not flow into the heating chamber 3 by blowing a little hot air from the hot air blowing portion 8. . Further, the external cold air mixed with hot air or the internal atmosphere mixed with hot air may be sucked through the suction unit 7.
- the hot air that is blown out is preferably clean hot air that does not contain dust, and when the opening area of the inlet / outlet 4 with the opening / closing lid 5 opened is large, it is preferably blown out more strongly. Moreover, it is preferable that the blown hot air does not flow into the heating chamber 3. That is, a part of the hot air blown out from the hot air blowing unit 8 is blown out to suppress the inflow of the external cold air into the heating chamber, and a part is sucked into the suction unit 7 while being mixed with the internal atmosphere in the heating chamber. Good.
- the opening / closing lid 5 when the opening / closing lid 5 is closed, the foreign matter that may adhere to the substrate K is sucked through the suction portion 7 regardless of whether the heating chamber 3 is sealed or not. However, when the open / close lid 5 is opened, it is preferable to shut off using hot air so that the external cold air and the internal atmosphere are not mixed.
- a combination of performing a suction operation through the suction unit 7 and blowing hot air from the hot air blowing unit 8 sucks and removes foreign matter in the heating chamber, and external cold air is generated in the heating chamber 3.
- either one of hot air blowing and suctioning by the suction unit 7 may be used, or both may be used by suction by the suction unit 7 while blowing hot air, and can be appropriately adjusted according to the inflow degree of external cold air.
- the external cold air and the internal atmosphere can be prevented from being mixed, and the external cold air can be prevented from flowing into the apparatus.
- the substrate baking apparatus of the conventional configuration includes the suction unit 7 but does not include the hot air blowing unit 8
- both the external cold air and the internal atmosphere are sucked into the suction unit 7 when the opening / closing lid 5 is opened.
- the Therefore, the external cold air and the internal atmosphere are mixed in the vicinity of the suction hole 71 to generate the sublimate W.
- the outside air flow A1 and the inside air flow B1 sucked into the suction hole 71 are mixed in the vicinity of the suction hole 71 to generate a sublimate W and accumulate in the vicinity of the outlet / outlet 4.
- the substrate K Since the substrate K is loaded and unloaded from the loading / unloading port 4, when the substrate K enters and leaves the region where the sublimated material W is accumulated, the sublimated material W adheres to the substrate K and foreign matter defects occur. .
- the exhaust efficiency of sucking and exhausting the external cold air from the suction holes 71 decreases, so that the external cold air easily flows into the heating chamber. In the heating chamber, it may mix with the internal atmosphere and cause further sublimation.
- the temperature inside the heating chamber is lowered, so that the heating efficiency as the baking apparatus may be deteriorated.
- the external cold air and the internal atmosphere can be shut off via the hot air. . That is, no sublimate is generated in the vicinity of the substrate inlet / outlet 4 and the external cold air does not flow into the heating chamber, so that no sublimate is generated in the heating chamber and heating efficiency is not deteriorated.
- FIG. 3 is a schematic explanatory view showing a first embodiment of a suction part and a hot air blowing part, showing a first example of hot air blowing
- FIG. 4 shows a second embodiment of the suction part and hot air blowing part. It is a schematic explanatory drawing shown, Comprising: The 2nd example of hot air blowing is shown.
- the hot air blowing portion 8 is configured by providing a nozzle portion composed of a nozzle hole 81 (for example, a slit nozzle having a predetermined width) that blows hot air obliquely downward on a long hot air piping member having a rectangular cross section.
- a nozzle hole 81 for example, a slit nozzle having a predetermined width
- the suction part 7 provided with the suction hole 71 is installed below the blowing direction.
- the suction part 7 is, for example, a long exhaust pipe member having a rectangular cross section, and the suction hole 71 is a long groove-shaped suction hole provided on the upper surface of the exhaust pipe member.
- the suction part 7 having the suction hole 71 drilled on the upper side of the exhaust pipe member extending along the lower side part of the heating chamber 3 sucks the atmosphere in the vicinity of the suction hole 71, thereby blowing out the flow P1.
- the outside air flow A1 and the inside air flow B1 can be sucked at the same time.
- the outside air flow A1 sucked into the suction hole 71 is not generated.
- the outside air flow A1 sucked into the suction hole 71 is formed so as not to flow into the heating chamber 3.
- the nozzle portion for discharging hot air obliquely downward may be a nozzle blowing shape inclined in the blowing direction, and the form is not particularly limited.
- a nozzle hole 81 formed of a line-shaped groove-type nozzle or a large number of round-hole-type inclined nozzles may be used.
- it may be a nozzle portion in which a blowout nozzle 82 having a predetermined nozzle length is mounted instead of the nozzle hole 81 provided by direct drilling.
- the form of the suction hole 71 for sucking out the blown hot air is not particularly limited as long as it can suck the atmosphere including the hot air blown in the vicinity, and instead of a long groove-like suction hole, A plurality of long hole-shaped suction holes or a large number of round hole-shaped suction holes may be used.
- the hot air is blown out from the hot air blowing section 8 when the opening / closing lid 5 is opened, in order to prevent sublimation from being generated by mixing the external cold air and the internal atmosphere when the opening / closing lid 5 is opened. Is preferable from the viewpoint of drive efficiency. However, even if hot air is blown out in a state where the open / close lid 5 is closed, a configuration in which the hot air is always blown may be used if the baking conditions in the heating chamber are not adversely affected.
- the hot air blowing portion 8 and the nozzle portion (nozzle hole 81) of the first embodiment are the same. However, it is different from the suction part 7 provided with the suction hole 71 in that the suction part 7A provided with the mountain-shaped rectification part 72 is used.
- the hot air blowing flow P1 is blown toward the vicinity of the top of the mountain-shaped rectifying unit 72, and a part of the hot air is blown outward as the outward hot air flow P2, so that external cold air flows in. Is to be surely prevented.
- a suction hole 73 is provided on the inclined surface toward the inside of the heating chamber. Therefore, a part of the hot air directed toward the inside that does not become the outward hot air flow P2 is sucked out of the hot air blowing flow P1. That is, the suction hole 73 sucks the inward hot air flow P3 that is a part branched from the hot air blowing flow P1 and the internal air flow B1. Therefore, this configuration is also the same as the configuration in which a suction part for sucking the atmosphere including the blown hot air is provided below the vicinity of the inlet / outlet.
- the suction hole 73 is provided on the inclined surface toward the inside of the heating chamber, the internal atmosphere is efficiently sucked, but the force for sucking the external cold air is weakened. Moreover, since it has the outward hot air flow P2 which blows outward along the inclined surface on the opposite side of the mountain shape, the possibility of sucking the external cold air is very small.
- the mountain-shaped rectifying unit 72 by adjusting the inclination angle and the installation position of the mountain-shaped rectifying unit 72, it is possible to obtain the outward hot air flow P2 in which most of the hot air that is blown out is blown outward.
- the hot air directed toward the inside of the heating chamber is reduced, the hot air flows into the inside of the heating chamber, so that it is possible to reliably prevent the occurrence of problems such as the balance of the airflow inside the heating chamber being lost and the rising of foreign matter.
- the shape of the suction hole 73 is not particularly limited as in the case of the suction hole 71 described above, and may be a long groove-like suction hole, a plurality of elongated hole-like suction holes, or a number of round hole-like suction holes. .
- the present embodiment since hot air is blown outward as the outward hot air flow P2, it is possible to prevent the inflow of external cold air into the heating chamber and to suppress the inflow of hot air into the heating chamber as much as possible.
- the inclined suction hole 73 is provided on the heating chamber side, in addition to increasing the efficiency of taking in the internal atmosphere, the internal atmosphere mixed into the hot air by sucking hot air flowing into the heating chamber together with the internal atmosphere Can be prevented from leaking outside.
- the existing hot air can be used as the hot air blown out from the hot air blowing unit 8. Moreover, you may provide a hot air production
- the substrate baking apparatus 1 shown in FIG. 5 has a plurality of heating chambers 3 for accommodating the substrate K, and each of the heating chambers includes suction units 7 and 7A and a hot air blowing unit 8.
- One end of each of the suction portions 7 and 7 ⁇ / b> A extends to the outside of the apparatus and communicates with the large-diameter exhaust pipe 11.
- the exhaust pipe 11 is connected to the exhaust blower 12. That is, the exhaust pipe 11 and the exhaust blower 12 form suction means.
- One end of the hot air blowing section 8 extending outside the apparatus communicates with a large-diameter air supply pipe 21, and the air supply pipe 21 is connected to hot air generation means HA having a hot air generation device 22 and an air supply blower 23.
- the hot air generator 22 has a function of heating and storing the air supplied from the air supply blower 23 to a predetermined temperature, and sends hot air having a predetermined pressure heated to the predetermined temperature to the air supply pipe 21. Further, hot air is branched and supplied from the air supply pipes 21 to the respective hot air blowing sections 8, and the supply air valve 14 is provided at each of the branch sections so that hot air can be supplied at independent timings. preferable.
- an exhaust valve 13 is provided also on the suction portions 7 and 7A, and the respective exhaust chambers 13 are controlled to open the corresponding exhaust valve 13 when necessary, and exhausted.
- the flow rate of hot air to be blown out is preferably such that external cold air does not flow from the inlet / outlet 4, and is preferably such that the internal atmosphere is not stirred by blowing into the heating chamber. Moreover, it is preferable that the flow rate to be sucked and exhausted is so small that external cold air is not actively sucked in and out of the inlet / outlet 4 and so large that hot air does not flow into the heating chamber.
- the external cold air and the internal atmosphere are shut off via the hot air so that the external cold air does not flow into the heating chamber 3. It is possible to prevent generation of sublimation by mixing the external cold air and the internal atmosphere.
- the means for solving the problem corresponding to the first aspect of the present invention includes the heating chamber 3 that accommodates the substrate K and heats the substrate K at the baking temperature, and the inlet / outlet of the substrate K in the heating chamber 3.
- the substrate baking apparatus 1 provided with the opening / closing lid 5 provided in 4, a hot air blowing part 8 for blowing hot air downward from the upper vicinity of the heating chamber 3 along the upper side of the heating chamber 3 is provided, and the lower vicinity of the inlet / outlet
- the suction portions 7 and 7A for sucking the atmosphere including the hot air blown out are provided.
- the effect corresponding to the first aspect is that the external cold air and the internal atmosphere are prevented from flowing into the heating chamber 3 by blocking the external cold air and the internal atmosphere through the hot air blown out to the inlet / outlet 4. It is possible to prevent the sublimation product from being mixed with each other.
- the means for solving the problem corresponding to claim 2 is that the hot air blowing portion 8 has a nozzle portion for blowing hot air outwardly and obliquely downward from the inside of the heating chamber, and the suction portions 7 and 7A blown obliquely downward.
- the suction holes 71 and 73 are provided at the site for sucking the hot air.
- the effect corresponding to the second aspect is that the inflow of the external cold air into the heating chamber 3 can be effectively suppressed, and the external cold air does not flow into the heating chamber 3. Further, since the external cold air does not flow into the heating chamber 3, the temperature in the heating chamber 3 does not decrease and can be maintained uniformly, and the heating efficiency of the heater 10 is improved. Therefore, mixing of external cold air and internal atmosphere can be more effectively prevented, and generation of sublimates can be suppressed.
- the nozzle part is a nozzle hole that is drilled outward and obliquely downward on the lower side of the hot air piping member 8 extending along the upper side part of the heating chamber 3. 81.
- the effect corresponding to the third aspect is that the nozzle hole 81 can be formed by drilling a part of the hot air piping member, so that it is easy to manufacture and does not protrude below the hot air piping member. Can be achieved.
- a means for solving the problem wherein the nozzle portion has an outwardly inclined nozzle hole that is mounted on the lower side of the hot air piping member 8 extending along the upper side portion of the heating chamber 3. It consists of the blowing nozzle 82 provided.
- the effect corresponding to the third aspect is that since the blowing nozzle 82 has a nozzle hole of a predetermined length, the direction of hot air to be blown out can be stabilized, and a stable blowing flow can be formed even for a wide opening. it can.
- a means for solving the problem corresponding to claim 5 is that the suction part 7 has a suction hole 71 drilled on the upper side of the exhaust pipe member extending along the lower side part of the heating chamber 3.
- the effect corresponding to the fifth aspect is that by sucking the atmosphere in the vicinity of the suction hole 71, most of the blown flow P1 is sucked, and the outside air flow A1 and the inside air flow B1 can be sucked simultaneously.
- the means for solving the problem corresponding to claim 6 is that the suction portion 7A is inclined toward the inside of the heating chamber of the ridge-shaped rectifying portion 72 provided on the upper side of the exhaust pipe member extending along the lower side portion of the heating chamber 3.
- the suction hole 73 is drilled on the surface.
- the inflow of hot air into the heating chamber can be suppressed as much as possible, and the inclined suction hole 73 is provided on the heating chamber side, so that the hot air flowing into the heating chamber is added to the inside of the heating chamber in addition to increasing the efficiency of taking in the internal atmosphere.
- sucking together with the atmosphere it is possible to prevent the internal atmosphere mixed in the hot air from leaking to the outside.
- the means for solving the problem corresponding to claim 7 is that hot air is supplied to the hot air blowing part 8 via the air supply pipe 21 and the branch part, and an air supply valve 14 is provided at the branch part. Is to blow hot air in accordance with the timing to open and close the open / close lid 5.
- the effect corresponding to the seventh aspect is that hot air can be supplied to each heating chamber 3 by performing control to open the corresponding air supply valve 14 when necessary.
- the suction valves 7 and 7A are also provided with exhaust valves 13, and the exhaust valves 13 and the air supply valves 14 are controlled to be opened and closed in accordance with the timing of opening and closing the opening and closing lids 5 of the respective heating chambers 3.
- the open / close lid 5 is opened, the external cold air and the internal atmosphere are shut off via hot air, thereby effectively preventing the mixture of the external cold air and the internal atmosphere and preventing the generation of sublimates. It becomes possible.
- the present invention when the open / close lid is opened, there is obtained a substrate baking apparatus in which external cold air does not flow into the apparatus and sublimates generated by mixing the external cold air and the internal atmosphere are not generated. Can do.
- the substrate baking apparatus according to the present invention can be suitably used as a substrate heating apparatus that generates an internal atmosphere that may generate sublimates when exposed to external cold air.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Furnace Details (AREA)
- Meat, Egg Or Seafood Products (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201380051084.5A CN104685312B (zh) | 2012-10-03 | 2013-09-27 | 基板烧成装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012221025 | 2012-10-03 | ||
JP2012-221025 | 2012-10-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014054511A1 true WO2014054511A1 (ja) | 2014-04-10 |
Family
ID=50434839
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2013/076189 WO2014054511A1 (ja) | 2012-10-03 | 2013-09-27 | 基板焼成装置 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN104685312B (zh) |
WO (1) | WO2014054511A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017227419A (ja) * | 2016-06-24 | 2017-12-28 | 株式会社デンソー | 加熱装置および当該加熱装置を用いた半導体装置の製造方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106597701B (zh) * | 2016-12-07 | 2019-07-26 | 武汉华星光电技术有限公司 | 一种预烘烤设备热板机构 |
CN106990568A (zh) * | 2017-05-23 | 2017-07-28 | 苏州木山云智能科技有限公司 | 一种液晶显示屏智能烤箱 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6457089A (en) * | 1987-08-27 | 1989-03-03 | Fujitsu Ltd | Heating treater |
JPH0228095U (zh) * | 1988-08-10 | 1990-02-23 | ||
JP2006010268A (ja) * | 2004-06-29 | 2006-01-12 | Espec Corp | 熱処理装置 |
JP2006307244A (ja) * | 2005-04-26 | 2006-11-09 | Nippon Steel Corp | 鋼帯の連続熱処理設備における冷却工程のシール装置およびシール方法 |
JP2007024378A (ja) * | 2005-07-14 | 2007-02-01 | Espec Corp | 熱処理装置 |
JP2011114339A (ja) * | 2009-11-27 | 2011-06-09 | Samsung Electronics Co Ltd | ガス排気方法及びガス排気を行う基板加熱装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3554847B2 (ja) * | 2001-07-30 | 2004-08-18 | 東京エレクトロン株式会社 | 熱処理装置 |
JP4048242B2 (ja) * | 2002-05-29 | 2008-02-20 | エスペック株式会社 | 熱処理装置 |
US8030212B2 (en) * | 2007-09-26 | 2011-10-04 | Eastman Kodak Company | Process for selective area deposition of inorganic materials |
JP2010144939A (ja) * | 2008-12-16 | 2010-07-01 | Tohoku Univ | 循環式の基板焼成炉 |
CN201497344U (zh) * | 2009-07-13 | 2010-06-02 | 苏州汇科机电设备有限公司 | 电子产品退火或烧成炉与载料小车的密封结构 |
-
2013
- 2013-09-27 CN CN201380051084.5A patent/CN104685312B/zh not_active Expired - Fee Related
- 2013-09-27 WO PCT/JP2013/076189 patent/WO2014054511A1/ja active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6457089A (en) * | 1987-08-27 | 1989-03-03 | Fujitsu Ltd | Heating treater |
JPH0228095U (zh) * | 1988-08-10 | 1990-02-23 | ||
JP2006010268A (ja) * | 2004-06-29 | 2006-01-12 | Espec Corp | 熱処理装置 |
JP2006307244A (ja) * | 2005-04-26 | 2006-11-09 | Nippon Steel Corp | 鋼帯の連続熱処理設備における冷却工程のシール装置およびシール方法 |
JP2007024378A (ja) * | 2005-07-14 | 2007-02-01 | Espec Corp | 熱処理装置 |
JP2011114339A (ja) * | 2009-11-27 | 2011-06-09 | Samsung Electronics Co Ltd | ガス排気方法及びガス排気を行う基板加熱装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017227419A (ja) * | 2016-06-24 | 2017-12-28 | 株式会社デンソー | 加熱装置および当該加熱装置を用いた半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN104685312A (zh) | 2015-06-03 |
CN104685312B (zh) | 2016-12-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102053029B1 (ko) | 기판 처리 장치, 반도체 장치의 제조 방법 및 프로그램 | |
TWI412407B (zh) | 減壓乾燥裝置 | |
KR101283377B1 (ko) | 열처리 장치 | |
WO2014054511A1 (ja) | 基板焼成装置 | |
US20150159865A1 (en) | Heat storage type waste gas purification apparatus | |
JP7224806B2 (ja) | 基板処理装置及び基板処理方法 | |
CN107210245B (zh) | 基板处理装置 | |
TW202125678A (zh) | 基板處理裝置及基板處理方法 | |
JP2023012524A (ja) | 基板処理装置及び基板処理方法 | |
JP5788241B2 (ja) | 熱処理装置 | |
JP5015541B2 (ja) | 熱処理装置 | |
JP2009213958A (ja) | 基板処理装置 | |
JP2008133975A (ja) | 排風還流式穀物乾燥機 | |
JP5755845B2 (ja) | 処理装置 | |
CN106066119A (zh) | 加热干燥装置 | |
JP2009147110A (ja) | 基板の熱処理装置 | |
JP2002110619A (ja) | 基板処理装置 | |
KR101572012B1 (ko) | 열 처리 장치 | |
KR102159270B1 (ko) | 오염 방지 기능이 향상된 efem | |
KR102205384B1 (ko) | 기판 처리 장치 및 기판의 냉각 방법 | |
JP2018169077A (ja) | 熱処理装置 | |
JPH08200970A (ja) | 昇華物除去機能付熱処理装置 | |
JP6274448B2 (ja) | 焼成炉及びコーティング方法 | |
KR100558606B1 (ko) | 엘씨디 글라스 오븐 쳄버의 유해 증기 제거 장치 | |
JP6249618B2 (ja) | 基板処理装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13843800 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 13843800 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: JP |