WO2014050370A1 - 複合樹脂組成物及び該複合樹脂組成物から成形される平面状コネクター - Google Patents

複合樹脂組成物及び該複合樹脂組成物から成形される平面状コネクター Download PDF

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WO2014050370A1
WO2014050370A1 PCT/JP2013/072224 JP2013072224W WO2014050370A1 WO 2014050370 A1 WO2014050370 A1 WO 2014050370A1 JP 2013072224 W JP2013072224 W JP 2013072224W WO 2014050370 A1 WO2014050370 A1 WO 2014050370A1
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resin composition
composite resin
mol
respect
structural units
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PCT/JP2013/072224
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English (en)
French (fr)
Japanese (ja)
Inventor
峰生 大竹
和博 龍
吉昭 田口
博樹 深津
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ポリプラスチックス株式会社
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Priority to CN201380050126.3A priority Critical patent/CN104662087B/zh
Priority to KR1020157009524A priority patent/KR101627243B1/ko
Priority to JP2014538281A priority patent/JP5826404B2/ja
Publication of WO2014050370A1 publication Critical patent/WO2014050370A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08L67/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/004—Additives being defined by their length
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/18—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members

Definitions

  • the present invention relates to a composite resin composition and a planar connector molded from the composite resin composition.
  • the liquid crystalline polymer is a thermoplastic resin excellent in dimensional accuracy, fluidity and the like. Due to these characteristics, liquid crystalline polymers have been conventionally employed as materials for various electronic components.
  • Patent Document 1 discloses a planar connector molded from a liquid crystalline polymer composition reinforced with glass fibers.
  • Patent Document 2 discloses a planar connector molded from a liquid crystalline polymer composition reinforced with glass fiber and talc.
  • Such a connector is employed as a planar connector (such as a CPU socket) having a lattice structure inside the outer frame, which requires high heat resistance and the like.
  • planar connectors In recent years, the shape required for planar connectors has changed as the integration rate of planar connectors has increased. For example, as the shape of the planar connector, an increase in the number of connector pins, a shape in which the width of the lattice portion is thinner, and the like are required.
  • the present invention has been made in view of such circumstances, a composite resin composition capable of obtaining a planar connector having excellent flatness and fluidity, suppressing warpage deformation, and excellent crack resistance, And it aims at providing the planar connector shape
  • the present inventors have found that the above problem can be solved by combining a liquid crystalline polymer containing a predetermined amount of a specific structural unit, glass fiber, and a predetermined inorganic filler. Specifically, the present invention provides the following.
  • a composite resin composition comprising (A) a liquid crystalline polymer, (B) glass fiber, and (C) one or more inorganic fillers selected from the group consisting of talc and milled fiber,
  • the (A) liquid crystalline polymer has the following constituent units as essential constituents: (I) 4-hydroxybenzoic acid, (II) 2-hydroxy-6-naphthoic acid, (III) terephthalic acid, (IV) Including isophthalic acid and (V) 4,4′-dihydroxybiphenyl,
  • the structural unit of (I) is 35 to 75 mol% with respect to all the structural units,
  • the structural unit of (II) is 2 to 8 mol% with respect to all the structural units,
  • the structural unit of (III) is 4.5 to 30.5 mol% with respect to all the structural units,
  • the structural unit of (IV) is 2 to 8 mol% with respect to all the structural units,
  • the structural unit of (V) is 12.5 to 32.5 mol% with
  • the flatness and fluidity are good, warpage deformation is suppressed, and a planar connector having excellent crack resistance is obtained, and the composite resin composition is molded from the composite resin composition.
  • a flat connector is provided.
  • the composite resin composition of the present invention contains a predetermined amount of a specific liquid crystalline polymer, glass fiber, and inorganic filler.
  • a specific liquid crystalline polymer glass fiber, and inorganic filler.
  • the liquid crystalline polymer according to the present invention has the following constituent units as essential constituents: (I) 4-hydroxybenzoic acid (also referred to as “HBA”), (II) 2-hydroxy-6-naphthoic acid (“HNA”) (III) terephthalic acid (also referred to as “TA”), (IV) isophthalic acid (also referred to as “IA”) and (V) 4,4′-dihydroxybiphenyl (also referred to as “BP”).
  • HBA 4-hydroxybenzoic acid
  • HNA 2-hydroxy-6-naphthoic acid
  • TA terephthalic acid
  • IA isophthalic acid
  • BP 4,4′-dihydroxybiphenyl
  • the liquid crystalline polymer in the present invention contains the above structural units at a specific ratio. That is, the structural unit of (I) is 35 to 75 mol% (preferably 40 to 65 mol%) with respect to all the structural units.
  • the structural unit (II) is 2 to 8 mol% (preferably 3 to 7 mol%) with respect to the total structural units.
  • the structural unit of (III) is 4.5 to 30.5 mol% (preferably 13 to 26 mol%) with respect to the total structural units.
  • the structural unit (IV) is 2 to 8 mol% (preferably 3 to 7 mol%) with respect to the total structural units.
  • the structural unit (V) is 12.5 to 32.5 mol% (preferably 15.5 to 29 mol%) with respect to the total structural units.
  • the total amount of the structural units (II) and (IV) is 4 to 10 mol% (preferably 5 to 10 mol%) with respect to the total structural units.
  • the melting point of the liquid crystalline polymer becomes remarkably high, and liquid crystallinity is produced in the production of molded products such as planar connectors. This is not preferable because the polymer may solidify in the reactor and a liquid crystalline polymer having a desired molecular weight may not be produced.
  • the constituent unit of (III) is less than 4.5 mol% or more than 30.5 mol% with respect to all the constituent units, the melting point of the liquid crystalline polymer becomes remarkably high, and a molded product such as a planar connector is produced. At this time, the liquid crystalline polymer is solidified in the reactor, and it may not be possible to produce a liquid crystalline polymer having a desired molecular weight.
  • the crystallization heat amount of the liquid crystalline polymer can be 2.5 J / g or more.
  • a preferable value for the heat of crystallization of the liquid crystalline polymer is 2.3 J / g or less, and more preferably 2.0 J / g or less.
  • the crystallization heat quantity indicates the crystallization state of the liquid crystalline polymer, and is a value obtained by differential calorimetry.
  • Tm1 endothermic peak temperature
  • Tm1 + 40 ° C. for 2 minutes the calorific value of the exothermic peak obtained from the peak of the exothermic peak temperature observed when measured under the temperature lowering condition per minute.
  • the heat resistance of the liquid crystalline polymer is lowered, which is not preferable.
  • the well-known other structural unit can also be introduce
  • the liquid crystalline polymer in the present invention can be obtained by polymerizing the above structural units by a direct polymerization method, a transesterification method, a melt polymerization method, a solution polymerization method, a slurry polymerization method, a solid phase polymerization method or the like.
  • an acylating agent for the above structural unit or a monomer having an activated terminal as an acid chloride derivative can be used in combination.
  • the acylating agent include acid anhydrides such as acetic anhydride.
  • various catalysts can be used, for example, dialkyl tin oxide, diaryl tin oxide, titanium dioxide, alkoxy titanium silicates, titanium alcoholates, alkali metal salts of carboxylic acids, alkaline earths. Metal salts, Lewis acid salts (BF 3 and the like) and the like.
  • the amount of the catalyst used may be about 0.001 to 1% by mass, preferably about 0.003 to 0.2% by mass, based on the total amount of the above structural units.
  • the conditions for the polymerization reaction are not particularly limited as long as the polymerization of the above structural units proceeds.
  • the reaction temperature is 200 to 380 ° C.
  • the final ultimate pressure is 0.1 to 760 Torr (that is, 13 to 101,080 Pa). ).
  • the polymerization reaction may be a method (one-step system) in which all the raw material monomers, the acylating agent and the catalyst are charged in the same reaction vessel and the reaction is started, and the hydroxyl groups of the raw material monomers (I), (II) and (V) are acylated.
  • a method of reacting with the carboxyl groups of (III) and (IV) (two-stage system) after acylation with an agent may be used.
  • liquid crystalline polymers obtained from the structural units (I) to (V) do not form an anisotropic molten phase depending on the constituent components and the sequence distribution in the liquid crystalline polymer.
  • the liquid crystalline polymer in the present invention is preferably one that forms an anisotropic molten phase, that is, a liquid crystalline polymer that exhibits optical anisotropy when melted.
  • melt anisotropy can be confirmed by a conventional polarization inspection method using an orthogonal polarizer. Specifically, for melting anisotropy, a polarizing microscope (manufactured by Olympus Co., Ltd.) is used, a sample placed on a hot stage (manufactured by Linkham Co., Ltd.) is melted, and the magnification is 150 times under a nitrogen atmosphere. This can be confirmed by observation. Liquid crystalline polymers that exhibit optical anisotropy when melted are optically anisotropic and transmit light when inserted between crossed polarizers. When the sample is optically anisotropic, for example, polarized light is transmitted even in a molten stationary liquid state.
  • the melt viscosity of the liquid crystalline polymer is 1 ⁇ 10 5 Pa ⁇ s or less (more preferably 5 Pa ⁇ s or more and 1 ⁇ 10 2 Pa ⁇ s) at a temperature 10 to 40 ° C. higher than the melting point and a shear rate of 1000 / sec. s or less) is preferable in that the fluidity of the composite resin composition is ensured and the filling pressure does not become excessive at the time of forming the lattice portion of the planar connector.
  • the composite resin composition of the present invention contains 45 to 60% by mass of the liquid crystalline polymer in the composite resin composition with respect to the total composite resin composition. If the content of the liquid crystalline polymer is less than 45% by mass relative to the entire composite resin composition, the fluidity deteriorates, which is not preferable. If the content of the liquid crystalline polymer is more than 60% by mass with respect to the entire composite resin composition, the bending elastic modulus and crack resistance of a molded product such as a planar connector obtained from the composite resin composition are reduced. It is not preferable.
  • the composite resin composition of the present invention preferably contains the liquid crystalline polymer in the composite resin composition in an amount of 50 to 60% by mass based on the total composite resin composition.
  • the composite resin composition of the present invention contains the above liquid crystalline polymer and glass fiber, a molded product obtained by molding the composite resin composition has high crack resistance.
  • the composite resin composition of the present invention contains 35 to 50% by mass of glass fiber in the composite resin composition with respect to the total composite resin composition.
  • the glass fiber content is less than 35% by mass with respect to the entire composite resin composition, the flexural modulus of the molded product obtained from the composite resin composition is low, and the molded product is a planar connector or the like. Is not preferable because cracks may occur in the lattice portion. If the glass fiber content is more than 50% by mass relative to the entire composite resin composition, the fluidity of the composition deteriorates, which is not preferable.
  • the glass fiber in the present invention is preferably contained in the composite resin composition in an amount of 40 to 50% by mass with respect to the entire composite resin composition.
  • the composite resin composition of the present invention further includes one or more inorganic fillers selected from the group consisting of talc and milled fiber.
  • inorganic fillers selected from the group consisting of talc and milled fiber.
  • the average glass fiber length calculated from the fiber length of the glass fiber and the fiber length of the milled fiber among the inorganic fillers is preferably 200 to 500 ⁇ m.
  • An average fiber length of less than 200 ⁇ m is not preferable because cracks may occur in a lattice portion of a molded product such as a planar connector obtained from the composite resin composition. If the average fiber length is more than 500 ⁇ m, the fluidity is deteriorated and it may be difficult to mold the composite resin composition.
  • the fiber diameter of the glass fiber and milled fiber in the present invention is not particularly limited, but generally about 5 to 15 ⁇ m is used.
  • pigments such as nucleating agent, carbon black, inorganic calcined pigment, antioxidant, stabilizer, plasticizer, lubricant, mold release agent, flame retardant, and You may mix
  • the method for producing the composite resin composition of the present invention is not particularly limited as long as the above liquid crystalline polymer and glass fiber can be mixed uniformly, and can be appropriately selected from conventionally known methods for producing resin compositions.
  • each component is melt-kneaded and extruded using a melt-kneader such as a single-screw or twin-screw extruder, and then the resulting composite resin composition is processed into a desired form such as powder, flakes, pellets, etc.
  • a melt-kneader such as a single-screw or twin-screw extruder
  • the minimum filling pressure at the time of molding is hardly excessive, and a portion having a complicated shape such as a lattice portion of a planar connector can be preferably molded.
  • the minimum filling pressure is specified as the minimum injection filling pressure at which a good molded product can be obtained at 365 ° C. when molding the composite resin composition.
  • the planar connector of the present invention By molding the composite resin composition of the present invention, the planar connector of the present invention can be obtained.
  • the shape of the planar connector is not particularly limited, but has a lattice structure inside the outer frame portion, an opening inside the lattice structure, and a pitch interval of the lattice portion in the lattice structure is 1.5 mm. It may be the following, and the planar connector whose thickness ratio of the said outer frame part and the said grating
  • Examples of the shape of the planar connector of the present invention include those shown in FIG.
  • This flat connector has an overall size of 43.88 mm ⁇ 43.88 mm ⁇ 3 mmt, an outer frame portion having a thickness of 3 mm or less, a lattice portion having a thickness of 1.5 mm or less, and 13.88 mm in the center portion.
  • X 13.88 mm opening Further, the pin insertion hole of the planar connector may be partially narrowed in order to prevent the pin inserted into the planar connector from coming off.
  • the shape of the pin insertion hole in the lattice portion of the planar connector of the present invention is not particularly limited, and may be a square shape, a round shape, or the like.
  • Examples of the shape of the pin insertion hole that is preferable in the present invention include shapes other than square and round (referred to as “variant” in the present invention), such as the shape shown in FIG. 5 and the shape of a star. It is done.
  • a pin insertion hole having such a shape (referred to as “an irregularly shaped hole” in the present invention) is not only very difficult to mold, but also easily cracks, and the crack resistance of the molded product tends to decrease.
  • the planar connector of the present invention has excellent crack resistance even if the pin insertion hole is an irregular hole.
  • the planar connector of the present invention includes not only one having an opening in the lattice part but also one having no opening in the lattice part.
  • the molding method for obtaining the planar connector of the present invention is not particularly limited, but there is no residual internal stress in order to prevent deformation of the obtained planar connector and to obtain a planar connector having good flatness (described later). It is preferable to select the molding conditions.
  • the cylinder temperature of the molding machine is preferably a temperature equal to or higher than the melting point of the liquid crystalline polymer.
  • the mold temperature is preferably 70 to 100 ° C. If the mold temperature is low, the composite resin composition filled in the mold may cause flow failure, which is not preferable. If the mold temperature is high, problems such as the occurrence of burrs may occur, which is not preferable.
  • the injection speed is preferably 150 mm / second or more. If the injection speed is low, there is a possibility that only an unfilled molded product can be obtained. Even if a completely filled molded product is obtained, it becomes a molded product with a high filling pressure and a large residual internal stress, resulting in a poor flatness. May only be obtained.
  • the planar connector of the present invention has a good flexural modulus and excellent crack resistance.
  • the bending elastic modulus of the planar connector of the present invention may be 17 GPa or more.
  • a planar connector having an elastic modulus of 17 GPa or more is hardly cracked even if it has a thin lattice portion, and has excellent crack resistance.
  • a bending elastic modulus is measured based on ISO178.
  • planar connector of the present invention is suppressed from being deformed.
  • the degree of deformation of the planar connector is determined using the flatness of the planar connector as an index. Specifically, the flat connector is placed on a horizontal desk, the height of the flat connector is measured with an image measuring device, and the position of 0.5 mm is measured at 10 mm intervals from the connector end surface. The difference between the height and the minimum height is defined as flatness.
  • the change in flatness is suppressed before and after performing IR reflow.
  • Method for producing liquid crystalline polymer 1 A polymerization vessel equipped with a stirrer, a reflux column, a monomer inlet, a nitrogen inlet, and a pressure reduction / outflow line was charged with the following raw material monomers, a metal catalyst, and an acylating agent, and nitrogen substitution was started.
  • the temperature of the reaction system was raised to 140 ° C. and reacted at 140 ° C. for 1 hour. Thereafter, the temperature is further increased to 360 ° C. over 5.5 hours, and then reduced to 5 Torr (ie, 667 Pa) over 30 minutes to melt while distilling acetic acid, excess acetic anhydride, and other low-boiling components. Polymerization was performed. After the stirring torque reached a predetermined value, nitrogen was introduced to change from a reduced pressure state to a normal pressure through a normal pressure, the polymer was discharged from the lower part of the polymerization vessel, and the strand was pelletized to pelletize. The obtained pellets were heat-treated at 300 ° C. for 8 hours under a nitrogen stream. The melting point of the pellet was 349 ° C., the heat of crystallization was 5.6 J / g, and the melt viscosity was 23 Pa ⁇ s.
  • Method for producing liquid crystalline polymer 2 A polymerization vessel equipped with a stirrer, a reflux column, a monomer inlet, a nitrogen inlet, and a pressure reduction / outflow line was charged with the following raw material monomers, a metal catalyst, and an acylating agent, and nitrogen substitution was started.
  • the temperature of the reaction system was raised to 140 ° C. and reacted at 140 ° C. for 1 hour. Thereafter, the temperature is further raised to 340 ° C. over 4.5 hours, and then the pressure is reduced to 10 Torr (ie, 667 Pa) over 15 minutes to melt while distilling acetic acid, excess acetic anhydride, and other low-boiling components. Polymerization was performed. After the stirring torque reached a predetermined value, nitrogen was introduced to change from a reduced pressure state to a normal pressure through a normal pressure, the polymer was discharged from the lower part of the polymerization vessel, and the strand was pelletized to pelletize. The obtained pellet had a melting point of 334 ° C., a heat of crystallization of 2.7 J / g, and a melt viscosity of 18 Pa ⁇ s.
  • the temperature of the reaction system was raised to 140 ° C. and reacted at 140 ° C. for 1 hour. Thereafter, the temperature is further increased to 360 ° C. over 5.5 hours, and then reduced to 10 Torr (ie, 1330 Pa) over 20 minutes to melt while distilling acetic acid, excess acetic anhydride, and other low-boiling components. Polymerization was performed. After the stirring torque reached a predetermined value, nitrogen was introduced to change from a reduced pressure state to a normal pressure through a normal pressure, the polymer was discharged from the lower part of the polymerization vessel, and the strand was pelletized to pelletize. The obtained pellet had a melting point of 358 ° C., a heat of crystallization of 1.6 J / g, and a melt viscosity of 9 Pa ⁇ s.
  • the composite resin composition was injection molded under the following molding conditions, and the flexural modulus was measured according to ISO178.
  • Molding machine Sumitomo Heavy Industries SE100DU Cylinder temperature (indicates temperature from nozzle side); 360 ° C.-370 ° C.-370 ° C.-360 ° C.-340 ° C.-330 ° C. (Examples 1 to 6, Comparative Examples 3 to 7) 370 ° C.-370 ° C.-370 ° C.-370 ° C.-370 ° C.-380 ° C.
  • the composite resin composition has an overall size of 43.88 mm ⁇ 43.88 mm ⁇ 3 mmt, an opening of 13.88 mm ⁇ 13.88 mm in the center, and a lattice pitch of 1.0 mm.
  • the flat connector (number of pin holes: 1248) was injection molded.
  • As the gate a special gate (overflow) shown in FIG. 2 was used.
  • the obtained connector was placed on a horizontal desk, and the height of the connector was measured with Mitutoyo Quick Vision 404 PROCNC image measuring device. At that time, as shown in FIG. 3, 0.5 mm positions were measured at 10 mm intervals from the connector end face, and the difference between the maximum height and the minimum height from the least square plane was defined as flatness.
  • IR reflow was performed under the following conditions, the flatness was measured by the method described above, and the difference in flatness of the flat connector before and after reflow was determined as the amount of connector deformation.
  • Measureasuring instrument RF-300 (using far infrared heater) Sample feed rate: 140 mm / sec Reflow furnace passage time: 5 minutes Preheating zone temperature condition: 150 ° C. Reflow zone temperature condition; 225 ° C Peak temperature: 287 ° C [Molding condition] Molding machine; Sumitomo Heavy Industries SE30DUZ Cylinder temperature (indicates temperature from nozzle side); 360 ° C.-365 ° C.-340 ° C.-330 ° C.
  • the evaluation injection-molded product shown in FIG. 4 has an outer diameter of 23.6 mm, 31 holes of ⁇ 3.2 mm inside, and a minimum wall thickness of 0.16 mm.
  • a three-point gate indicated by an arrow in FIG. Use a stereomicroscope to observe the cracking of the molded product at a magnification of 5 times, and observe the occurrence of cracks around the hole. If there was a crack in the molded product, “X”; if not, “ ⁇ ” It was judged.
  • Molding machine Sumitomo Heavy Industries SE30DUZ Cylinder temperature (indicates temperature from nozzle side); 370 ° C.-375 ° C.-360 ° C.-350 ° C.
  • the planar connector of the present invention was excellent in flatness, warp deformation, fluidity and crack resistance, and had a flexural modulus of 17 GPa or more. Further, when a similar test was performed on a planar connector obtained from the composite resin composition of the present invention, in which the pin insertion hole is a deformed hole (a deformed hole having the shape of FIG. 5), the same preferable results were obtained. Obtained.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
PCT/JP2013/072224 2012-09-27 2013-08-20 複合樹脂組成物及び該複合樹脂組成物から成形される平面状コネクター WO2014050370A1 (ja)

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Application Number Priority Date Filing Date Title
CN201380050126.3A CN104662087B (zh) 2012-09-27 2013-08-20 复合树脂组合物以及由该复合树脂组合物成型而成的平面状连接器
KR1020157009524A KR101627243B1 (ko) 2012-09-27 2013-08-20 복합 수지 조성물 및 당해 복합 수지 조성물로 성형되는 평면상 커넥터
JP2014538281A JP5826404B2 (ja) 2012-09-27 2013-08-20 複合樹脂組成物及び該複合樹脂組成物から成形される平面状コネクター

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JP2012-213668 2012-09-27

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Cited By (4)

* Cited by examiner, † Cited by third party
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JP6022127B1 (ja) * 2014-12-05 2016-11-09 ポリプラスチックス株式会社 複合樹脂組成物及び平面状コネクター
JP6473796B1 (ja) * 2017-11-27 2019-02-20 住友化学株式会社 液晶ポリエステル樹脂組成物および成形体
WO2021085224A1 (ja) * 2019-10-31 2021-05-06 ポリプラスチックス株式会社 樹脂組成物及び平面状コネクター
US11584850B2 (en) 2017-11-27 2023-02-21 Sumitomo Chemical Company, Limited Liquid crystal polyester resin composition and molded body

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CN105837803B (zh) * 2016-02-01 2017-05-31 金发科技股份有限公司 一种液晶聚酯以及由其组成的模塑组合物和其应用
CN114630865B (zh) * 2019-10-31 2023-12-01 宝理塑料株式会社 树脂组合物和连接器
CN111303410A (zh) * 2020-03-18 2020-06-19 南京清研高分子新材料有限公司 一种液晶聚合物及其制备方法

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