WO2014049154A3 - Optoelektronisches bauelement mit schutzschaltung - Google Patents

Optoelektronisches bauelement mit schutzschaltung Download PDF

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Publication number
WO2014049154A3
WO2014049154A3 PCT/EP2013/070280 EP2013070280W WO2014049154A3 WO 2014049154 A3 WO2014049154 A3 WO 2014049154A3 EP 2013070280 W EP2013070280 W EP 2013070280W WO 2014049154 A3 WO2014049154 A3 WO 2014049154A3
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
optoelectronic component
diode
diodes
contact areas
Prior art date
Application number
PCT/EP2013/070280
Other languages
English (en)
French (fr)
Other versions
WO2014049154A2 (de
Inventor
Stefan Illek
Peter Nagel
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102012217932.1A external-priority patent/DE102012217932B4/de
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Priority to KR1020157010586A priority Critical patent/KR101815486B1/ko
Priority to US14/429,390 priority patent/US9418972B2/en
Publication of WO2014049154A2 publication Critical patent/WO2014049154A2/de
Publication of WO2014049154A3 publication Critical patent/WO2014049154A3/de
Priority to US15/210,174 priority patent/US10426006B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/50—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits
    • H05B45/54—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits in a series array of LEDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861—Diodes
    • H01L29/866—Zener diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/44—Details of LED load circuits with an active control inside an LED matrix
    • H05B45/48—Details of LED load circuits with an active control inside an LED matrix having LEDs organised in strings and incorporating parallel shunting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/50—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits
    • H05B45/52—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits in a parallel array of LEDs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Abstract

Die Erfindung betrifft ein Verfahren zur Herstellung eines optoelektronischen Bauelementes und ein optoelektronisches Bauelement mit wenigstens einem ersten Träger (1) mit wenigstens zwei Licht emittierenden Dioden (2) und/oder mit zwei ersten Trägern mit jeweils einer Licht emittierenden Diode (2), wobei jede Diode (2) zwei elektrische Anschlüsse (4, 5) aufweist, wobei jeder elektrische Anschluss (4, 5) zu einer Kontaktfläche (7, 8) geführt ist, wobei die Kontaktflächen (7, 8) auf einer Unterseite (6) eines ersten Träger (1) angeordnet sind, mit einem zweiten Träger (9), wobei im zweiten Träger (9) wenigstens zwei Z-Dioden (10) angeordnet sind, wobei die Z-Dioden (10) weitere elektrische Anschlüsse (11, 12) aufweisen, wobei jeder weitere elektrische Anschluss (11, 12) zu einer weiteren Kontaktfläche (13, 14) geführt ist, wobei die weiteren Kontaktflächen (13,14) auf einer Oberseite (16) des zweiten Trägers (9) angeordnet sind, wobei der erste Träger (1) und/oder die ersten Träger (1) mit der Unterseite (6) auf der Oberseite (16) des zweiten Träger (9) aufliegen und mit dem zweiten Träger (9) fest verbunden sind, wobei die Z-Dioden (10) antiparallel zu den Dioden (2) angeordnet sind, wobei eine elektrische Leitung (15) vorgesehen ist, die die Z- Dioden (10) in einer Serienschaltung verbindet, und wobei die Kontaktflächen (7, 8) einer Diode (2) mit den weiteren Kontaktflächen (13, 14) einer Z-Diode (10) elektrisch in Kontakt stehen.
PCT/EP2013/070280 2012-09-27 2013-09-27 Optoelektronisches bauelement mit schutzschaltung WO2014049154A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020157010586A KR101815486B1 (ko) 2012-09-27 2013-09-27 보호 회로를 갖는 광전자 컴포넌트
US14/429,390 US9418972B2 (en) 2012-09-27 2013-09-27 Optoelectronic component with protective circuit
US15/210,174 US10426006B2 (en) 2012-09-27 2016-07-14 Optoelectronic component with protective circuit

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102012217523 2012-09-27
DE102012217523.7 2012-09-27
DE102012217932.1A DE102012217932B4 (de) 2012-10-01 2012-10-01 Optoelektronisches Bauelement mit Schutzschaltung
DE102012217932.1 2012-10-01

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US14/429,390 A-371-Of-International US9418972B2 (en) 2012-09-27 2013-09-27 Optoelectronic component with protective circuit
US15/210,174 Division US10426006B2 (en) 2012-09-27 2016-07-14 Optoelectronic component with protective circuit

Publications (2)

Publication Number Publication Date
WO2014049154A2 WO2014049154A2 (de) 2014-04-03
WO2014049154A3 true WO2014049154A3 (de) 2014-05-30

Family

ID=49354633

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2013/070280 WO2014049154A2 (de) 2012-09-27 2013-09-27 Optoelektronisches bauelement mit schutzschaltung

Country Status (3)

Country Link
US (2) US9418972B2 (de)
KR (1) KR101815486B1 (de)
WO (1) WO2014049154A2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107248510A (zh) * 2017-06-14 2017-10-13 厦门煜明光电有限公司 一种带有齐纳二极管保护的cob封装结构

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US20120049214A1 (en) * 2009-04-06 2012-03-01 Lowes Theodore D Monolithic Multi-Junction Light Emitting Devices Including Multiple Groups of Light Emitting Diodes

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Also Published As

Publication number Publication date
US10426006B2 (en) 2019-09-24
US20150214203A1 (en) 2015-07-30
US9418972B2 (en) 2016-08-16
US20160323942A1 (en) 2016-11-03
WO2014049154A2 (de) 2014-04-03
KR101815486B1 (ko) 2018-01-05
KR20150058494A (ko) 2015-05-28

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