WO2014044813A3 - Optoelektronisches bauelement umfassend ein transparentes auskoppelelement - Google Patents
Optoelektronisches bauelement umfassend ein transparentes auskoppelelement Download PDFInfo
- Publication number
- WO2014044813A3 WO2014044813A3 PCT/EP2013/069608 EP2013069608W WO2014044813A3 WO 2014044813 A3 WO2014044813 A3 WO 2014044813A3 EP 2013069608 W EP2013069608 W EP 2013069608W WO 2014044813 A3 WO2014044813 A3 WO 2014044813A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- out element
- optoelectronic component
- transparent coupling
- electromagnetic radiation
- hybrid material
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015532428A JP6127145B2 (ja) | 2012-09-21 | 2013-09-20 | 透明光取り出し素子を含むオプトエレクトロニクス部品 |
DE112013004622.9T DE112013004622A5 (de) | 2012-09-21 | 2013-09-20 | Optoelektronisches Bauelement umfassend ein transparentes Auskoppelelement |
CN201380049400.5A CN104662681B (zh) | 2012-09-21 | 2013-09-20 | 包括透明的耦合输出元件的光电子器件 |
US14/430,191 US9515236B2 (en) | 2012-09-21 | 2013-09-20 | Optoelectronic component comprising a transparent coupling-out element |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012108939.6A DE102012108939A1 (de) | 2012-09-21 | 2012-09-21 | Optoelektronisches Bauelement umfassend ein transparentes Auskoppelelement |
DE102012108939.6 | 2012-09-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2014044813A2 WO2014044813A2 (de) | 2014-03-27 |
WO2014044813A3 true WO2014044813A3 (de) | 2014-05-15 |
Family
ID=49230753
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2013/069608 WO2014044813A2 (de) | 2012-09-21 | 2013-09-20 | Optoelektronisches bauelement umfassend ein transparentes auskoppelelement |
Country Status (5)
Country | Link |
---|---|
US (1) | US9515236B2 (de) |
JP (1) | JP6127145B2 (de) |
CN (1) | CN104662681B (de) |
DE (2) | DE102012108939A1 (de) |
WO (1) | WO2014044813A2 (de) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1873211A1 (de) * | 2006-06-14 | 2008-01-02 | Shin-Etsu Chemical Co., Ltd. | Phosphorgefüllte, härtbare Silikonharz-Zusammensetzung und gehärtetes Produkt daraus |
WO2012067766A2 (en) * | 2010-11-18 | 2012-05-24 | 3M Innovative Properties Company | Light emitting diode component comprising polysilazane bonding layer |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5911630B2 (ja) | 1981-06-09 | 1984-03-16 | 横浜ゴム株式会社 | エポキシ系接着剤組成物 |
DE3837418A1 (de) * | 1988-11-04 | 1990-05-10 | Degussa | Organosiloxanamin-copolykondensate, verfahren zu ihrer herstellung und verwendung (i) |
DE3837415A1 (de) * | 1988-11-04 | 1990-05-10 | Degussa | Organopolysiloxan-harnstoff- und organopolysiloxan-thioharnstoff-derivate, verfahren zu ihrer herstellung und verwendung |
DE3925358A1 (de) * | 1989-07-31 | 1991-02-07 | Degussa | Aminoalkylsubstituierte organopolysiloxan-thioharnstoff-derivate, verfahren zu ihrer herstellung und verwendung |
DE3925359C1 (de) | 1989-07-31 | 1991-02-07 | Degussa Ag, 6000 Frankfurt, De | |
DE59713024D1 (de) * | 1996-06-26 | 2010-01-28 | Osram Opto Semiconductors Gmbh | Lichtabstrahlender Halbleiterchip und Lichtabstrahlendes Halbleiterbauelement und Verfahren zu dessen Herstellung |
JPH10316871A (ja) | 1997-05-20 | 1998-12-02 | Hitachi Ltd | 組成物および該組成物を使用した光学および電子デバイス |
US6297332B1 (en) | 1998-04-28 | 2001-10-02 | Mitsui Chemicals, Inc. | Epoxy-resin composition and use thereof |
JP2000063637A (ja) | 1998-08-20 | 2000-02-29 | Toshiba Chem Corp | エポキシ樹脂組成物 |
JP2001348555A (ja) * | 2000-06-07 | 2001-12-18 | Nitto Denko Corp | 接着剤組成物 |
DE102005009790A1 (de) * | 2005-03-03 | 2006-09-07 | Consortium für elektrochemische Industrie GmbH | Verfahren zur Herstellung von Alkoxysilylmethylisocyanuraten |
US9061450B2 (en) * | 2007-02-12 | 2015-06-23 | Cree, Inc. | Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding |
WO2009148099A1 (ja) * | 2008-06-04 | 2009-12-10 | 日産化学工業株式会社 | ケイ素系液晶配向剤、液晶配向膜及び液晶表示素子 |
DE102010024758A1 (de) * | 2009-09-30 | 2011-03-31 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Optikkörpers, Optikkörper und optoelektronisches Bauteil mit dem Optikkörper |
US9093623B2 (en) * | 2009-12-30 | 2015-07-28 | Merck Patent Gmbh | Casting composition as diffusion barrier for water molecules |
TWI435914B (zh) * | 2010-12-31 | 2014-05-01 | Eternal Chemical Co Ltd | 可固化之有機聚矽氧烷組合物及其製法 |
JP2012156334A (ja) | 2011-01-26 | 2012-08-16 | Sony Corp | 固体撮像装置、固体撮像装置の製造方法及び電子機器 |
JP4951147B1 (ja) | 2011-09-08 | 2012-06-13 | 積水化学工業株式会社 | 光半導体装置用硬化性組成物 |
-
2012
- 2012-09-21 DE DE102012108939.6A patent/DE102012108939A1/de not_active Withdrawn
-
2013
- 2013-09-20 WO PCT/EP2013/069608 patent/WO2014044813A2/de active Application Filing
- 2013-09-20 JP JP2015532428A patent/JP6127145B2/ja active Active
- 2013-09-20 CN CN201380049400.5A patent/CN104662681B/zh not_active Expired - Fee Related
- 2013-09-20 DE DE112013004622.9T patent/DE112013004622A5/de not_active Withdrawn
- 2013-09-20 US US14/430,191 patent/US9515236B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1873211A1 (de) * | 2006-06-14 | 2008-01-02 | Shin-Etsu Chemical Co., Ltd. | Phosphorgefüllte, härtbare Silikonharz-Zusammensetzung und gehärtetes Produkt daraus |
WO2012067766A2 (en) * | 2010-11-18 | 2012-05-24 | 3M Innovative Properties Company | Light emitting diode component comprising polysilazane bonding layer |
Also Published As
Publication number | Publication date |
---|---|
JP2015530751A (ja) | 2015-10-15 |
WO2014044813A2 (de) | 2014-03-27 |
US9515236B2 (en) | 2016-12-06 |
JP6127145B2 (ja) | 2017-05-10 |
CN104662681A (zh) | 2015-05-27 |
DE102012108939A1 (de) | 2014-03-27 |
CN104662681B (zh) | 2017-07-21 |
US20150214447A1 (en) | 2015-07-30 |
DE112013004622A5 (de) | 2015-06-03 |
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