WO2014042242A1

WO2014042242A1 - Circuit substrate module

Info

Publication number: WO2014042242A1
Application number: PCT/JP2013/074837
Authority: WO
Inventors: 林　泰伸
Original assignee: 株式会社村田製作所
Priority date: 2012-09-17
Filing date: 2013-09-13
Publication date: 2014-03-20
Also published as: JPWO2014042242A1; JP5765488B2

Abstract

The present invention provides a circuit substrate module capable of being stably mounted on a substrate (motherboard) of an electric device, electronic device, etc., it being possible for the circuit substrate module to be strongly joined to the substrate. The present invention provides a first insulating substrate on which are formed a mounting part to which a chip component is mounted and a wiring pattern to which the chip component is electrically connected, a frame-shaped substrate formed on the periphery of the mounting part of the first insulating substrate, and a second insulating substrate having a terminal electrode formed on the rear surface. A circuit substrate module in which the wiring pattern and the terminal electrode are electrically connected via a through-hole provided through the first insulating substrate, the frame-shaped substrate, and the second insulating substrate.

Description

Circuit board module

The present invention relates to a circuit board module in which a plurality of chip components are mounted on an insulating substrate.

As a circuit board module that can be stably mounted on a substrate (motherboard) of an electric device or an electronic device, for example, a hybrid IC as disclosed in Patent Document 1 can be cited. The hybrid IC includes an insulating substrate in which a plurality of chip components are mounted on wiring patterns provided on the front and back surfaces of the insulating substrate, and a frame-like substrate in which terminal electrodes (lead electrodes) are provided on the lower surface. The frame-like substrate is attached to a portion where no component is mounted so as to surround the chip component mounted on the back surface of the insulating substrate. Further, the wiring patterns provided on the front and back surfaces of the insulating substrate and the terminal electrodes formed on the lower surface of the frame-like substrate are electrically connected by through holes.

JP-A-5-259372

However, in electrical equipment that is required to be small and light, it is necessary to reduce the size and weight of the circuit board module mounted on the equipment. Therefore, it is necessary to reduce the outer shape of the insulating substrate and the frame-shaped substrate. However, even if the insulating substrate is reduced, the number and size of components built into the circuit board module cannot be changed. I have to. However, since the area of the terminal electrode formed on the lower surface of the frame-shaped substrate depends on the width of the frame-shaped substrate, the area of the terminal electrode bonded to the mother board is inevitably small, and the bonding strength between the circuit board module and the mother board is small. There is a problem of becoming.

The present invention has been made in view of the above-described problems, and the object of the present invention is that when mounted on a motherboard, the bonding strength between the circuit board module and the motherboard is high and can be stably mounted. The object is to provide a circuit board module.

In order to achieve the above object, the present invention has the following configuration. In the circuit board module of the present invention, a first insulating substrate having a mounting portion, at least one electronic component electrically connected to the wiring pattern and mounted on the mounting portion, and the first insulating substrate Around the mounting portion, a frame-shaped substrate formed higher than the mounting height of the chip component, a cavity composed of the first insulating substrate and the frame-shaped substrate, and the first through the cavity A second insulating substrate on which the terminal electrode is formed, and the electronic component and the terminal electrode provided on the second insulating substrate are formed in the frame shape. It is electrically connected through a substrate.

Note that a vent hole penetrating at least one of the first insulating substrate, the second insulating substrate, and the frame-shaped substrate may be provided. In the case where a vent opening communicating with the inside of the cavity and the outside air is installed, there is no deformation or breakage of the circuit board module due to the generation of gas, and therefore the circuit board module can be stably bonded.

Further, a wiring pattern extending along both main surfaces of the second insulating substrate may be formed inside the second insulating substrate. In this case, since the terminal electrode can be formed at an arbitrary position on the bottom surface of the second insulating substrate, it corresponds to various arrangements of mounting electrodes on the motherboard on which the circuit board module is mounted. Can do. In addition, since the number of terminal electrodes formed on the second insulating substrate can be increased, it is possible to increase the functionality of the circuit board module by increasing the number of electronic components mounted on the circuit board module. it can. Furthermore, if the number of terminal electrodes formed on the second insulating substrate can be increased, the bonding strength between the circuit board module and the mother board can be further increased.

Also, a plurality of via conductors may be formed inside the frame-shaped substrate so as to be aligned in a direction parallel to the main surface of the second insulating substrate. In this case, since more complicated wiring is possible inside the circuit board module, the function of the circuit board module can be enhanced.

Further, a resin may be filled in a cavity surrounded by the first insulating substrate, the second insulating substrate, and the frame substrate. In this case, the strength of the circuit board module itself can be improved, and the insulation of the electronic components mounted in the cavity can be improved.

As described above, in the circuit board module to which the present invention is applied, since the terminal electrode can be formed large, the bonding strength with the mother board can be increased.

FIG. 1A is a cross-sectional view of the circuit board module 100 according to the first embodiment, and FIG. 1B is a bottom view. 2A to 2C are cross-sectional views for explaining the manufacturing process of the circuit board module according to the first embodiment in the order of steps, where FIG. 2A is a first step, FIG. 2B is a second step, c) is the third step. FIG. 3A is a cross-sectional view of the circuit board module 200 according to the second embodiment, and FIG. 3B is a bottom view. FIG. 4A is a cross-sectional view of a circuit board module 300 according to the third embodiment, and FIG. 4B is a bottom view. FIG. 5 is a cross-sectional view of a circuit board module 400 according to the fourth embodiment. FIG. 6 is a cross-sectional view of a circuit board module 500 according to the fifth embodiment. FIG. 7 is a cross-sectional view of a circuit board module 600 according to the sixth embodiment.

DESCRIPTION OF EMBODIMENTS Hereinafter, a preferred embodiment of a circuit board module according to the present invention will be described in detail with reference to the accompanying drawings.
(First embodiment)
FIG. 1A is a cross-sectional view of a circuit board module 100 according to the first embodiment. The circuit board module 100 includes a first insulating substrate 111, a frame-shaped substrate 112, and a second insulating substrate 113. The first insulating substrate 111, the frame-shaped substrate 112, and the second insulating substrate 113 are made of an organic substrate, ceramics, or the like, and each substrate is formed through a predetermined electrode and an insulating substrate described later. Through-

holes

121 and 122 are provided. Details will be described below.

In the first insulating substrate 111, a hole penetrating in the thickness direction of the substrate is formed, and a conductive metal such as copper is filled in the hole to form via

conductors

121a and 122a. On the first insulating substrate 111,

wiring patterns

120a and 120b are formed on the front and back surfaces, and

electronic components

130a, 130b, 131a, and 131b are mounted.

The height of the frame of the frame-like substrate 112 is formed higher than the height of the

chip components

131a and 131b mounted on the back surface of the first insulating substrate 111. Via

conductors

121b and 122b are formed in the frame of the frame-shaped substrate 112 so as to be electrically connected to the

via conductors

121a and 122a formed in the first insulating substrate 111 through the frame. . A cavity 114 is formed by these two substrates.

In the second insulating substrate 113, via

conductors

121c and 122c are formed in the same manner as the first insulating substrate so as to be electrically connected to the

via conductors

121b and 122b formed on the frame substrate 112. A via conductor 123 is formed near the center of the second insulating substrate 113, and a wiring pattern 124 is formed on the surface.

Terminal electrodes

125 a and 125 b are formed on the back surface of the second insulating substrate 113.

The bottom surface of the via conductor 121a and the top surface of the via conductor 121b, and the bottom surface of the via conductor 121b and the top surface of the via conductor 121c formed on each substrate are joined with a metal such as solder or a conductive paste to form a through hole 121. The bottom surface of the via conductor 122a and the top surface of the via conductor 122b, and the bottom surface of the via conductor 122b and the top surface of the via conductor 122c are joined with a metal such as solder or a conductive paste to form a through hole 122. The

wiring patterns

120a and 120b formed on the front and back surfaces of the first insulating substrate 111 and the

terminal electrodes

125a and 125b formed on the second insulating substrate 113 are through

holes

121 and 122, and the terminal electrode 126 is a via. The conductor 123 is electrically connected through the wiring pattern 124 and the through

holes

121 and 122.

Next, an example of a method for manufacturing the circuit board module 100 according to the present embodiment having the above structure will be described. 2A to 2C are cross-sectional views illustrating the manufacturing process in order of process.

In the first step shown in FIG. 2A, first, holes for forming via

conductors

121a and 122a are formed at predetermined positions by a drill or a laser, and a conductive metal is filled in the holes. A first insulating substrate 111 is prepared,

wiring patterns

120a and 120b are formed on the front and back surfaces of the first insulating substrate 111, and

chip components

131a and 131b are mounted on the back surface. Via

conductors

121b and 122b are formed on the frame substrate 112 so as to be connected to the via

conductors

121a and 122b. Similarly, via

conductors

121c, 122c, and 123 are formed at predetermined positions on the second insulating substrate 113, and wiring patterns 124 and

terminal electrodes

125a, 125b, and 126 are formed.

2B, the first insulating substrate 111, the frame substrate 112, and the second insulating substrate 113 are joined. For joining, the lower surface of the via conductor 121a formed on the insulating substrate 111 and the upper surface of the via conductor 121b formed on the frame-shaped substrate, the lower surface of the via conductor 121b, and the upper surface of 121c are bonded by using solder. Form. Similarly, the lower surface of the via conductor 122a and the upper surface of 122b, and the lower surface of the via conductor 121b and the upper surface of 121c are joined to form the through hole 122. Note that the underfill can be filled in the gap between the frame-shaped substrate 112 and the first insulating substrate 111 or the gap between the frame-shaped substrate 112 and the second insulating substrate 113 to increase the strength.

Finally, in the third step shown in FIG. 2C, the

chip components

130a and 130b are mounted on the surface of the first insulating substrate 111 to complete the circuit board module 100 of the present embodiment.

The through-

hole conductors

121 and 122 may be formed at predetermined positions after the first insulating substrate 111, the frame-shaped substrate 112, and the second insulating substrate 113 are joined. 130b may be mounted on the insulating substrate 111 before bonding.

As described above, the

terminal electrodes

125a and 125b are formed on the back surface of the second insulating substrate 113 with a large area regardless of the width of the frame-shaped substrate. Therefore, when the circuit board module 100 is mounted on the motherboard, the

terminal electrodes

125a and 125b are stable. It is possible to connect with the obtained bonding strength. Furthermore, since the wiring pattern 124 is connected to the terminal electrode 126 through the through

holes

121 and 122 and the via conductor 123, it functions as a ground electrode and can increase the bonding strength with the mother board.
(Second Embodiment)
A circuit board module 200 according to the second embodiment will be described with reference to FIGS.

3A is a cross-sectional view of the circuit board module 200 according to the second embodiment, and FIG. 3B is a bottom view of the circuit board module 200. Since the basic configuration is substantially the same as that of the first embodiment, the same reference numerals are used for details, and the description is omitted.

The circuit board module 200 is different from the circuit board module 100 according to the first embodiment in that a vent hole 240 having a diameter of 100 μm that penetrates the second insulating substrate 213 constituting the circuit board module 200 is formed. It is.

Since the method for manufacturing the circuit board module according to the present embodiment is substantially the same as that of the first embodiment, the sectional view of the manufacturing process is omitted. The vent holes 240 different from those of the first embodiment are provided inside the frame-shaped substrate 112 and as terminal electrodes so that the cavities 114 are not sealed when the via conductor holes are formed in the second insulating substrate 213. Form on the non-overlapping parts with a drill or laser.

Thereafter, the circuit board module 200 of the present embodiment is completed through the same processes as those of the first embodiment.

As described above, according to the present embodiment, the

terminal electrodes

125a and 125b formed on the second insulating substrate 213 are formed on the back surface of the second insulating substrate 213 with a large area, as in the first embodiment. Therefore, when the circuit board module 200 is mounted on the mother board, it can be connected with a stable bonding strength. Further, as shown in the first embodiment, a terminal electrode may be provided in the center of the back surface of the second insulating substrate.

When the vent hole 240 penetrating the second insulating substrate 213 is provided as in this embodiment, the gas generated in the cavity 114 can be released to the outside, so that the circuit board module 200 is deformed by the internal pressure. Or there is no risk of breakage. In this embodiment, the ventilation hole is provided in one place in the second insulating substrate, but it is formed in a portion that does not overlap with the first insulating substrate wiring pattern or the through hole of the frame substrate so that the cavity and the outside air can be communicated. It is also possible to form a plurality on each substrate.
(Third embodiment)
A circuit board module 300 according to the third embodiment is shown in FIGS.

4A is a cross-sectional view of the circuit board module 300 according to the third embodiment, and FIG. 4B is a schematic bottom view of the circuit board module 300. Since the basic configuration is the same as that of the first embodiment, the same reference numerals are used for the details and the description is omitted, and different parts will be described.

The circuit board module according to this embodiment is different from the circuit board module 100 according to the first embodiment in that a chip component 330 is added to the surface of the first insulating board 311 and the second insulation A wiring pattern 320 c is formed on the surface of the substrate 313, the chip component 332 is mounted, and vent holes 340 a having a diameter of 150 μm are formed at predetermined positions on the first insulating substrate 311 and the second insulating substrate 313, respectively. 340b is formed.

Since the manufacturing method of the circuit board module 300 according to the present embodiment is almost the same as that of the first embodiment, the cross-sectional view of the manufacturing process is omitted, and only the parts different from the first embodiment will be described.

Ventilation holes

340a and 340b different from those in the first embodiment are formed in the first insulating substrate 311 and the second insulating substrate 313 so that the cavity 314 is not sealed. The vent holes 340a and 340b are formed by a drill or a laser on the inside of the frame-shaped substrate 112 and not overlapping the wiring pattern or terminal electrode when forming the holes of the

via conductors

121a, 121b, 121c, and 122c. To do. Then, the

wiring patterns

120a and 120b are formed on the front and back surfaces of the first insulating substrate 311 and the

chip components

131a and 131b are mounted on the back surface. Similarly, the second insulating substrate 313 is formed so that the wiring pattern 320 is formed on the front surface and the

terminal electrodes

125a and 125b are formed on the back surface, and are electrically connected to the wiring pattern 320c formed on the surface of the second insulating substrate 313. Then, the chip component 332 is mounted and the process proceeds to the second step. In the second step, as in the first embodiment, the via conductors 121a to 122c are joined by solder.

In the third step, the

chip components

130a, 130b, and 330 are mounted on the surface of the first insulating substrate 311 to complete the circuit board module 300 of the present embodiment.

If many vents are provided as in this embodiment, the gas generated in the cavity can be released to the outside more quickly, and the board is less likely to be broken or deformed. can do.

In each of the embodiments described above, the wiring pattern formed on the surface of the first insulating substrate of the circuit board module and the mounted chip component may be covered with a case cover or resin.

As shown in the first embodiment, a terminal electrode may be provided in the center of the back surface of the second insulating substrate.
(Fourth embodiment)
FIG. 5 shows a circuit board module 400 according to the fourth embodiment. FIG. 5 is a cross-sectional view.

Since the basic configuration of the circuit board module 400 is the same as that of the first embodiment, the same reference numerals are given to the details and the description thereof is omitted, and only different portions will be described.

The circuit board module 400 includes a second insulating substrate 413.

Terminal electrodes

425a, 425b, 426a, and 426b are formed on the bottom surface of the second insulating substrate 413.

The second insulating substrate 413 has via

conductors

421c, 422c, 423a, and 423b formed therein. Note that in FIG. 5 which is a cross-sectional view, the via

conductors

423a and 423b are not formed in the cross-section, but are formed on the back side of the cross-section in the drawing, and thus are indicated by broken lines.

Further, the second insulating substrate 413 has

wiring patterns

424a and 424b extending along both main surfaces of the second insulating substrate 413 formed therein. Note that in FIG. 5 which is a cross-sectional view, the

wiring patterns

424a and 424b are not formed in the cross section, but are formed on the back side of the cross section in the drawing, and thus are indicated by broken lines.

The via conductor 421c connects the via conductor 121b formed on the frame substrate 112 and the terminal electrode 425a. The via conductor 422c connects the via conductor 122b formed on the frame substrate 112 and the terminal electrode 425b.

The via conductor 423a connects the wiring pattern 424a and the terminal electrode 426a. The via conductor 423b connects the wiring pattern 424b and the terminal electrode 426b.

Note that the wiring pattern 424a is not connected to the via conductor 421c, and is not shown in FIG. 5 hidden behind the via conductor 421c, but connected to another via conductor formed inside the second insulating substrate 413. Has been. Further, the wiring pattern 424b is not connected to the via conductor 422c, and is not shown in FIG. 5 hidden behind the via conductor 422c, but connected to another via conductor formed inside the second insulating substrate 413. Has been.

Since the circuit board module 400 according to the fourth embodiment includes the

wiring patterns

424a and 424b extending along both main surfaces of the second insulating substrate 413 inside the second insulating substrate 413, the terminal electrode 425a. 425b, 426a, and 426b can be formed at any position on the bottom surface of the second insulating substrate 413, and correspond to various arrangements of mounting electrodes on a motherboard (not shown) on which a circuit board module is mounted. can do. In addition, since the number of

terminal electrodes

425a, 425b, 426a, and 426b formed on the second insulating substrate 413 can be increased, the number of

electronic components

130a, 130b, 131a, and 131b mounted on the circuit board module 400 can be reduced. It is possible to increase the functionality of the circuit board module by increasing the number. Furthermore, if the number of

terminal electrodes

425a, 425b, 426a, and 426b formed on the second insulating substrate 413 can be increased, the bonding strength between the circuit board module and the motherboard can be further increased.
(Fifth embodiment)
A circuit board module 500 according to a fifth embodiment is shown in FIG. FIG. 6 is a cross-sectional view.

Since the basic configuration of the circuit board module 500 is the same as that of the first embodiment, the same reference numerals are given to the details and the description thereof is omitted, and only different portions will be described.

The circuit board module 500 includes a frame-shaped substrate 512.

Via

conductors

521b, 521d, 522b, and 522d are formed inside the frame of the frame-like substrate 512. In FIG. 5, the vertical cross section of the frame-like substrate 512 including the cavity 114 is seen, but via

conductors

521b and 521d are formed in the vertical cross section of the left frame of the pair of frames, and the pair of frames Via

conductors

522b and 522d are formed in the longitudinal section of the right frame.

Via

conductors

521b, 521d, 522b, and 522d are formed inside the frame-shaped substrate 512 so as to be aligned in a direction parallel to a main surface of a second insulating substrate 613 to be described later.

Further, the circuit board module 500 includes a second insulating substrate 613.

Terminal electrodes

625a, 625b, 626a, 626b are formed on the bottom surface of the second insulating substrate 613.

The second insulating substrate 613 has via

conductors

621c, 621e, 622c, 622e, 623a, and 623b formed therein.

The second insulating substrate 613 has

wiring patterns

624a and 624b extending in a direction parallel to both main surfaces of the second insulating substrate 613.

The via conductor 121a, the via conductor 521b, the via conductor 621c, and the terminal electrode 625a formed on the first insulating substrate 111 are sequentially connected. In addition, the via conductor 122a, the via conductor 522b, the via conductor 622c, and the terminal electrode 625b formed in the first insulating substrate 111 are sequentially connected.

Further, the wiring pattern 120b formed on the first insulating substrate 111, the via conductor 521d, the via conductor 621e, the wiring pattern 624a, the via conductor 623a, and the terminal electrode 626a are sequentially connected. Further, the wiring pattern 120c formed on the first insulating substrate 111, the via conductor 522d, the via conductor 62e, the wiring pattern 624b, the via conductor 623b, and the terminal electrode 626b are sequentially connected.

In the circuit board module 500 according to the fifth embodiment, since a large number of via

conductors

521b, 521d, 522b, and 522d are formed in the longitudinal section of the frame-like substrate 512, more complicated wiring is possible. Therefore, it is possible to increase the functionality of the circuit board module.
(Sixth embodiment)
FIG. 7 shows a circuit board module 600 according to the sixth embodiment. FIG. 7 is a cross-sectional view.

The basic configuration of the circuit board module 600 is the same as that of the circuit board module 400 according to the fourth embodiment shown in FIG. Only explained.

In the circuit board module 600, the resin 601 is filled in the cavity 114 surrounded by the first insulating substrate 111, the frame substrate 112, and the second insulating substrate 413.

In the circuit board module 600 according to the sixth embodiment, since the resin 601 is filled in the cavity 114, the strength of the circuit board module itself is improved. In addition, since the circuit board module 600 according to the sixth embodiment is filled with the resin 601 inside the cavity 114, the insulation of the

electronic components

131a and 131b mounted in the cavity 114 from the outside is improved. Yes.

100, 200, 300, 400, 500, 600: circuit board modules 111, 311: first insulating substrate 112, 512: frame-shaped

substrate

113, 213, 313, 413, 613: second insulating substrate 114, 314: Cavities 120a, 120b, 124, 220a, 220b, 320, 424a, 424b, 624a, 624b:

wiring patterns

121a, 121b, 121c, 122a, 122b, 122c, 123, 421c, 422c, 423a, 423b, 521b, 521d,

522b

522d, 621c, 621e, 622c, 622e, 623a, 623b: Via conductor 121, 122: Through-

hole conductor

125a, 125b, 126, 425a, 425b, 426a, 426b, 625a, 625b, 626a, 626b:

end Electrodes

130a, 130b, 131a, 131b, 332: chip components 240,340a, 340b: vent

Claims

A first insulating substrate having a mounting portion;
At least one electronic component mounted on the mounting unit;
Around the periphery of the mounting portion of the first insulating substrate, a frame-shaped substrate formed higher than the mounting height of the chip component;
A cavity constituted by the first insulating substrate and the frame substrate;
A second insulating substrate having a terminal electrode formed opposite to the first insulating substrate through the cavity; and
The circuit board module, wherein the electronic component and the terminal electrode provided on the second insulating substrate are electrically connected via the frame-shaped substrate.
The circuit board module according to claim 1, further comprising a vent hole penetrating at least one of the first insulating substrate, the second insulating substrate, and the frame substrate.
3. The circuit board module according to claim 1, wherein the diameter of the vent is 100 μm or more.
4. The wiring pattern according to claim 1, wherein a wiring pattern extending along both main surfaces of the second insulating substrate is formed inside the second insulating substrate. 5. The circuit board module as described.
The plurality of via conductors are formed inside the frame-shaped substrate so as to be aligned in a direction parallel to the main surface of the second insulating substrate. The circuit board module according to claim 1.
The resin is filled in the cavity surrounded by the first insulating substrate, the second insulating substrate, and the frame-shaped substrate. The circuit board module according to item 1.
The circuit board module according to claim 1, wherein the electronic component is a passive component.