WO2014038404A1

WO2014038404A1 - Offset correction sample and film thickness measuring apparatus

Info

Publication number: WO2014038404A1
Application number: PCT/JP2013/072579
Authority: WO
Inventors: 坂上　英和; 徳実原田; 山脇　千明
Original assignee: シャープ株式会社
Priority date: 2012-09-04
Filing date: 2013-08-23
Publication date: 2014-03-13
Also published as: JP2014048275A

Abstract

An offset correction sample (70) is provided with a first offset detecting section (71) and a second offset detecting section (72). The first offset detecting section (71) is a section for obtaining the positional relationship between a camera (21) and a measuring head (23). The second offset detecting section (72) is a section for obtaining the positional relationship between the camera (21) and a displacement sensor (22).

Description

Offset amount calibration sample and film thickness measuring device

The present invention relates to an offset amount calibration sample and a film thickness measuring device.

Conventionally, as an offset amount calibration sample used in a film thickness measuring apparatus, there is one described in Japanese Patent Application Laid-Open No. 2010-210389 (Patent Document 1). Images are taken at a plurality of positions of the calibration sample, and the film thickness of the calibration sample is measured based on the spot light at each position. Then, the captured image is processed to calculate the difference in the center position between the center of the image and the center of the calibration sample, and based on the change in film thickness with respect to the difference in the center position, the deviation of the spot light with respect to the center of the image Find the amount.

By the way, in the above-mentioned conventional offset amount calibration sample, it is possible to determine the amount of deviation of the spot light in the captured image, but when trying to calibrate the position of another measuring device of the film thickness measuring device, another calibration sample We had to prepare and was troublesome.

JP 2010-210389A

Therefore, an object of the present invention is to provide an offset amount calibration sample and a film thickness measuring apparatus that can calibrate the positions of two types of measuring devices and can save labor of calibration.

In order to solve the above problems, the offset amount calibration sample of the present invention is
A film having a camera for correcting positional information of a formed product substrate, a displacement sensor for adjusting a distance from the product substrate, and a measurement head for measuring the thickness of the film of the product substrate A calibration sample used for calibration of a thickness measuring device,
A first offset amount detection unit for obtaining a positional relationship between the camera and the measurement head;
A second offset amount detection unit for obtaining a positional relationship between the camera and the displacement sensor is provided.

Here, the product substrate includes a substrate and one or more films formed on the substrate.

According to the offset amount calibration sample of the present invention, since the first offset amount detection unit and the second offset amount detection unit are provided, one calibration sample includes three different types of cameras, displacement sensors, and measurement heads. The positional relationship can be obtained. That is, the positions of the displacement sensor and the measurement head can be calibrated with the camera as a reference.

Therefore, the position of the two types of displacement sensors and the measuring head can be calibrated with one calibration sample, and the labor for calibration of the film thickness measuring apparatus can be saved.

Moreover, in the offset amount calibration sample of one embodiment,
The measuring head is configured to irradiate the film of the product substrate with primary X-rays to detect fluorescent X-rays generated from the film;
The first offset amount detection unit includes:
A first portion comprising a first substance;
The second material is different from the first material and is composed of a second portion adjacent to the first portion.

According to the offset amount calibration sample of this embodiment, the first offset amount detection unit is made of a first part made of the first substance and a second substance different from the first substance and is adjacent to the first part. The second part.

Then, the camera detects the boundary between the first part and the second part from the image, and obtains the position coordinates of the camera. The measurement head detects and measures the boundary between the first part and the second part based on fluorescent X-rays generated from the first substance and fluorescent X-rays generated from the second substance. Find the position coordinates of the head.

Thereby, the positional relationship (offset amount) between the camera and the measurement head can be obtained from the position coordinate of the camera and the position coordinate of the measurement head. Therefore, the position of the measuring head can be calibrated with a simple configuration.

Further, in the offset amount calibration sample of one embodiment, a mark that can be recognized by the camera is provided at the boundary between the first part and the second part.

According to the offset amount calibration sample of this embodiment, a mark that can be recognized by the camera is provided at the boundary between the first part and the second part. As a result, the camera can accurately detect the boundary between the first part and the second part and accurately determine the position coordinates of the camera.

Moreover, in the offset amount calibration sample of one embodiment,
The displacement sensor is configured to detect light reflected from the product substrate by irradiating the product substrate with a light beam;
The second offset amount detection unit includes a through hole.

According to the offset amount calibration sample of this embodiment, the second offset amount detection unit is constituted by a through hole.

Then, the camera detects the through hole from the image and obtains the position coordinate of the camera. Since the reflected light of the displacement sensor is not detected in the through hole, the through hole is specified by the displacement sensor and the position coordinates of the displacement sensor are obtained.

Thus, the positional relationship (offset amount) between the camera and the displacement sensor can be obtained from the position coordinate of the camera and the position coordinate of the displacement sensor. Therefore, the position of the displacement sensor can be calibrated with a simple configuration.

Moreover, in the film thickness measuring device of one embodiment,
The base,
A substrate stage that is provided on the base and on which the formed product substrate is placed;
A calibration stage provided on the base and on which the offset amount calibration sample according to any one of claims 1 to 4 is placed;
A gantry that extends in a first direction with respect to the substrate stage and the calibration stage and is attached to the base so as to be movable in a second direction with respect to the substrate stage and the calibration stage;
A slider attached to the gantry movably in the first direction;
A camera that is fixed to the slider and that corrects position information of the product substrate placed on the substrate stage;
A displacement sensor that is fixed to the slider and adjusts the distance from the product substrate placed on the substrate stage;
A measuring head fixed to the slider and measuring the thickness of the film of the product substrate placed on the substrate stage;
The measurement head, the camera, and the displacement sensor are moved to the calibration stage, and the positional relationship between the camera and the measurement head using the offset amount calibration sample placed on the calibration stage, and the camera Measuring device calibration means for obtaining a positional relationship between the sensor and the displacement sensor.

According to the film thickness measuring apparatus of this embodiment, the measurement instrument calibration means uses the offset amount calibration sample, the positional relationship between the camera and the measurement head, and the position between the camera and the displacement sensor. Seeking a relationship.

Thus, it is possible to calibrate the position of the two types of displacement sensors and the measuring head with one offset amount calibration sample, and to save the labor of calibration of the film thickness measuring device.

According to the offset amount calibration sample of the present invention, since the first offset amount detection unit and the second offset amount detection unit are provided, the positions of the two types of measuring instruments can be calibrated, and the calibration work can be performed. Can be saved.

According to the film thickness measuring apparatus of the present invention, the measuring device calibration means uses the offset amount calibration sample, the positional relationship between the camera and the measuring head, and the positional relationship between the camera and the displacement sensor. Ask for. Thereby, the position of the two types of displacement sensors and the measuring head can be calibrated with one offset amount calibration sample, and the labor of calibration of the film thickness measuring apparatus can be saved.

It is a top view which shows the film thickness measuring apparatus of one Embodiment of this invention. It is a side view of the film thickness measuring apparatus seen from the arrow U direction of FIG. It is explanatory drawing explaining operation | movement of a displacement sensor. It is explanatory drawing explaining operation | movement of a measurement head. It is explanatory drawing explaining the state which a fluorescent X ray generate | occur | produces by irradiation of a primary X ray. It is a table | surface which shows the relationship between the X-ray intensity and film thickness in a titanium film and a molybdenum film | membrane. It is the graph which plotted the data of FIG. 6A. It is a top view which shows the offset amount calibration sample of one Embodiment of this invention. It is explanatory drawing explaining the method of calculating | requiring the positional relationship of a camera and a measurement head. It is explanatory drawing explaining the method of calculating | requiring the positional relationship of a camera and a displacement sensor.

Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings.

FIG. 1 is a plan view showing a film thickness measuring apparatus according to an embodiment of the present invention. FIG. 2 is a side view seen from the direction of arrow U in FIG. As shown in FIGS. 1 and 2, the film thickness measuring apparatus includes a base 1, a substrate stage 2, a calibration stage 3, a gantry 4, a slider 5, and a plurality of measuring

devices

21, 22, and 23. And control means 30.

The substrate stage 2 includes a stage provided on the base 1 and divided into a plurality of stages. On the substrate stage 2, the formed product substrate 10 is placed.

The substrate stage 2 is provided with a plurality of air holes 2a. By sucking air from the air holes 2a, the product substrate 10 can be brought into close contact with the substrate stage 2, while air is blown out from the air holes 2a. The product substrate 10 can be lifted from the substrate stage 2.

The product substrate 10 is, for example, a liquid crystal TFT used for a liquid crystal display. The product substrate 10 includes a substrate and one or more films formed on the substrate. The film is formed on the substrate by, for example, a sputtering method, a vapor deposition method, or a plating method. The substrate is, for example, a glass substrate, and the film is a metal film such as aluminum, titanium, tungsten, or molybdenum.

The calibration stage 3 is provided on the base 1 and is provided separately from the substrate stage 2. The calibration stage 3 is provided with a plurality of recesses 3a, and various types of

calibration samples

60 and 70 are fitted into the recesses 3a, and the

calibration samples

60 and 70 are used for the

measurement devices

21, 22, and 23. Calibration is performed.

The gantry 4 extends in the first direction with respect to the substrate stage 2 and the calibration stage 3. The gantry 4 is attached to the base 1 so as to be movable in the second direction with respect to the substrate stage 2 and the calibration stage 3. The first direction refers to the direction of arrow A, and the second direction refers to the direction of arrow B. The first direction and the second direction are orthogonal to each other.

That is, the base 1 is provided with two

rail portions

6 and 6 extending in the second direction (arrow B direction). The two

rail portions

6 and 6 are arranged so as to sandwich the substrate stage 2 and the calibration stage 3. The gandries 4 are stretched over the two

rail portions

6 and 6 and can move along the

rail portions

6 and 6 in the second direction.

The slider 5 is attached to the gantry 4 so as to be movable in the first direction (arrow A direction). A camera 21, a displacement sensor 22, and a measurement head 23 as the measurement device are fixed to the slider 5.

The measuring

devices

21, 22, and 23 can cover the entire range of the substrate stage 2 and the calibration stage 3 in the second direction (arrow B direction) by the movable range Z 1 of the gun dolly 4. Further, the measuring

devices

21, 22, and 23 can cover the entire range of the substrate stage 2 and the calibration stage 3 in the first direction (arrow A direction) by the movable range Z <b> 2 of the slider 5.

The control unit 30 includes a substrate position correcting unit 31, a head position adjusting unit 32, an analyzing unit 33, and a measuring device calibration unit 34.

The camera 21 detects the alignment mark of the product substrate 10 placed on the substrate stage 2. This alignment mark is a mark that can be identified by the camera 21, and is provided at, for example, the four corners of the product substrate 10.

The substrate position correcting means 31 corrects the position information in the plane direction (first and second directions) of the product substrate 10 placed on the substrate stage 2 based on the detection result of the camera 21. Specifically, the base 1 is provided with a plurality of clamps 7 so as to press each side around the product substrate 10. After fixing the product substrate 10 to a predetermined position by the clamp 7, the alignment mark is detected by the camera 21, and the position information of the product substrate 10 is corrected by the substrate position correcting means 31 based on the detection result.

The displacement sensor 22 measures the distance in the height direction from the product substrate 10 placed on the substrate stage 2 as shown in FIG. The displacement sensor 22 irradiates a predetermined measurement point P of the product substrate 10 with light rays such as infrared rays, detects the reflected light from the measurement point P, and measures the distance to the measurement point P.

Based on the measurement value of the displacement sensor 22, the head position adjusting means 32 is configured so that the distance between the product substrate 10 placed on the substrate stage and the measurement head 23 becomes a predetermined constant value. The position of the measuring head 23 in the height direction is adjusted. Specifically, the distance in the height direction between the measurement point P of the product substrate 10 and the light emitting / receiving unit 23a of the measurement head 23 is adjusted to be 2 mm ± 30 μm.

The head position adjusting means 32 moves the measuring head 23 to a position where the measuring head 23 can measure the measurement point P of the product substrate 10 after adjusting the position of the measuring head 23 in the height direction.

The measurement head 23 includes an X-ray irradiation unit 231 and a fluorescent X-ray detection unit 232 as shown in FIG.

The X-ray irradiation unit 231 irradiates the measurement point P of the product substrate 10 with the primary X-ray 51 from the light emitting / receiving unit 23a. The primary X-ray 51 is, for example, rhodium, molybdenum, tungsten, or the like. Then, as shown in FIG. 5, the film 12 on the substrate 11 of the product substrate 10 generates fluorescent X-rays 52 by irradiation with the primary X-rays 51.

The fluorescent X-ray detector 232 detects the fluorescent X-rays 52 generated from the film 12 from the light emitting / receiving unit 23a. The fluorescent X-ray detector 232 is, for example, a silicon drift detector.

The analyzing means 33 obtains the thickness of the film 12 from the intensity of the fluorescent X-ray 52 detected by the measuring head 23. Specifically, the analysis means 33 includes a preamplifier 331 and a multi-channel analyzer (hereinafter referred to as MCA) 332.

The preamplifier 331 amplifies the electric signal output from the fluorescent X-ray detection unit 232. The MCA 332 analyzes the electrical signal amplified by the preamplifier 331. In the MCA 332, the energy output from the fluorescent X-ray detection unit 232 is selected, and the pulse is measured to obtain the X-ray intensity of the elements constituting the film 12. And based on this X-ray intensity, the thickness of the film | membrane 12 is calculated | required from known data. Note that since the MCA 332 is used, foreign matters and impurities mixed in the film 12 can be detected.

For example, when the film 12 is a titanium film or a molybdenum film, the relationship between the X-ray intensity and the film thickness is as shown in FIGS. 6A and 6B.

In the above description, the measurement of the thickness of the single-layer film (FIG. 5) has been described, but the thickness of the multiple-layer film can also be measured. In this case, fluorescent X-rays generated from each film are detected by the measuring head 23, and the X-ray intensity of each element constituting each film is obtained by the analyzing means 33, and the thickness of each film is determined based on this X-ray intensity. Ask for. Furthermore, the composition ratio of each element can also be obtained from the X-ray intensity of each element.

As shown in FIG. 1, the measuring device calibration means 34 moves the measuring

devices

21, 22, and 23 to the calibration stage 3 to calibrate the measuring

devices

21, 22, and 23. Calibration of the measuring

devices

21, 22, and 23 is performed at predetermined intervals. The predetermined interval is, for example, every predetermined time such as performing calibration once a day, or every predetermined number of processes such as performing calibration after measuring the film thickness of a predetermined number of product substrates 10.

In the calibration stage 3, a gain calibration sample 60 and an offset amount calibration sample 70 are installed. The gain calibration sample 60 is a sample for adjusting the gain of the fluorescent X-ray detection unit 232 of the measurement head 23. The offset amount calibration sample 70 is a sample for adjusting the offset amount of each measuring

device

21, 22, 23.

The offset amount calibration sample 70 includes a first offset amount detector 71 and a second offset amount detector 72 as shown in FIG. The first offset amount detection unit 71 is a part for obtaining the positional relationship between the camera 21 and the measurement head 23. The second offset amount detection unit 72 is a part for obtaining the positional relationship between the camera 21 and the displacement sensor 22.

The first offset amount detection unit 71 includes a first portion 711 and a second portion 712 adjacent to the first portion 711. The first and

second portions

711 and 712 are indicated by hatching.

The first part 711 is made of a first substance. The second portion 712 is made of a second material different from the first material. For example, the first material is copper, and the second material is titanium. The area of the first portion 711 is larger than the area of the second portion 712.

The boundary between the first portion 711 and the second portion 712 includes an X-axis boundary line Lx along the X-axis direction and a Y-axis boundary line Ly along the Y-axis direction. Marks 713 that can be recognized by the camera 21 are provided on the X-axis boundary line Lx and the Y-axis boundary line Ly, respectively. Note that the X-axis direction is the left-to-right direction in FIG. 1 (that is, the arrow B direction), and the Y-axis direction is the top-to-down direction (that is, the arrow A direction) in FIG.

The second offset amount detection unit 72 includes a through hole 720. The through hole 720 is provided in the first portion 711. The inner surface of the through-hole 720 is formed in a rectangular shape, and the rectangle includes two sides along the X-axis direction and two sides along the Y-axis direction. The inner surface of the through hole 720 is, for example, a square having a side of 4 mm.

A method for obtaining the positional relationship between the camera 21 and the measuring head 23 using the offset calibration sample 70 will be described.

As shown in FIG. 8, first, a mark 713 on the Y-axis boundary line Ly is detected from the image G1 of the camera 21, and the X coordinate of the camera 21 is calculated.

The primary X-ray beam B1 from the measurement head 23 is scanned in the X-axis direction, the Y-axis boundary line Ly is detected with this beam B1, and the X coordinate of the measurement head 23 is calculated. In this measurement head 23, the Y-axis boundary line Ly is derived from the difference between the fluorescent X-rays generated from the first material of the first portion 711 and the fluorescent X-rays generated from the second material of the second portion 712. Can be detected.

Then, the mark 713 on the X-axis boundary line Lx is detected from the image G2 of the camera 21, and the Y coordinate of the camera 21 is calculated. Then, the primary X-ray beam B2 from the measurement head 23 is scanned in the Y-axis direction, and the X-axis boundary line Lx is detected by this beam B2, and the Y coordinate of the measurement head 23 is calculated.

Thereafter, an offset amount (ΔX, ΔY) between the camera 21 and the measurement head 23 is obtained from the X coordinate of the camera 21 and the measurement head 23 and the Y coordinate of the camera 21 and the measurement head 23.

A method for obtaining the positional relationship between the camera 21 and the displacement sensor 22 using the offset amount calibration sample 70 will be described.

As shown in FIG. 9, first, the center point 720a of the through hole 720 is detected from the image G1 of the camera 21, and the X coordinate and Y coordinate of the camera 21 are calculated.

Then, the beam B1 of the light beam from the displacement sensor 22 is scanned in the X-axis direction, the center point 720a of the through-hole 720 is detected with this beam B1, and the X coordinate of the displacement sensor 22 is calculated. Since the reflected light of the displacement sensor 22 is not detected in the through hole 720, the through hole 720 can be specified by the displacement sensor 22.

Thereafter, the beam B2 of the light beam from the displacement sensor 22 is scanned in the Y-axis direction, the center point 720a of the through-hole 720 is detected with this beam B2, and the Y coordinate of the displacement sensor 22 is calculated.

Thereafter, an offset amount (ΔX, ΔY) between the camera 21 and the displacement sensor 22 is obtained from the X coordinate of the camera 21 and the displacement sensor 22 and the Y coordinate of the camera 21 and the displacement sensor 22.

In this way, by determining the positional relationship between the camera 21 and the measurement head 23 and the positional relationship between the camera 21 and the displacement sensor 22, the position of the camera 21, the displacement sensor 22 and the measurement head 23 can be determined. The change is checked, and the alignment of the camera 21, the displacement sensor 22, and the measuring head 23 is adjusted by a program.

Next, the operation of the film thickness measuring apparatus having the above configuration will be described.

As shown in FIG. 1, first, the product substrate 10 is transferred onto the substrate stage 2 from the right direction (arrow R direction) of the film thickness measuring apparatus. The product substrate 10 transported onto the substrate stage 2 is fixed at a predetermined position by the clamp 7. Thereafter, the alignment mark is detected by the camera 21, and the position information of the product substrate 10 is corrected by the substrate position correcting unit 31 based on the detection result.

Thereafter, the distance in the height direction between the first measurement point and the displacement sensor 22 is measured by the displacement sensor 22 at the first measurement point among the plurality of measurement points of the product substrate 10. Then, the head position adjusting means 32 adjusts the position of the measuring head 23 in the height direction so that the distance between the first measuring point and the measuring head 23 becomes a constant value based on this measured value. To do.

Thereafter, the measurement head 23 is moved directly above the first measurement point by the head position adjusting means 32, and the film of the product substrate 10 is irradiated with primary X-rays to detect fluorescent X-rays generated from this film. To do. Then, the analysis means 33 obtains the thickness of the film from the detected intensity of the fluorescent X-ray.

Thereafter, with respect to the other measurement points of the product substrate 10, similarly, after adjusting the height of the measurement head 23, the film thickness of the other measurement points is measured by the measurement head 23.

Thus, the film thicknesses of all the measurement points of the product substrate 10 are measured, and it is determined whether or not the product substrate 10 is defective based on the measurement result.

Thereafter, the measuring instrument calibration means 34 moves the measuring

instruments

21, 22, 23 to the calibration stage 3 at predetermined intervals, and calibrates the measuring

instruments

21, 22, 23 using the

calibration samples

60, 70. .

According to the offset amount calibration sample 70 having the above configuration, since the first offset amount detection unit 71 and the second offset amount detection unit 72 are provided, three different types of cameras 21 and displacement sensors are used in one calibration sample. The positional relationship between 22 and the measurement head 23 can be obtained. That is, the positions of the displacement sensor 22 and the measurement head 23 can be calibrated with the camera 21 as a reference.

Therefore, the position of the two types of displacement sensors 22 and the measurement head 23 can be calibrated with one calibration sample, and the labor for calibration of the film thickness measuring apparatus can be saved.

The first offset amount detection unit 71 includes a first portion 711 made of a first material and a second portion 712 made of a second material different from the first material and adjacent to the first portion 711. Is done. Thereby, the positional relationship (offset amount) between the camera 21 and the measurement head 23 can be obtained from the position coordinates of the camera 21 and the position coordinates of the measurement head 23. Therefore, the position of the measuring head 23 can be calibrated with a simple configuration.

Also, a mark 713 that can be recognized by the camera 21 is provided at the boundary between the first portion 711 and the second portion 712. As a result, the camera 21 can accurately detect the boundary between the first portion 711 and the second portion 712 and accurately determine the position coordinates of the camera 21.

The second offset amount detection unit 72 includes a through hole 720. Accordingly, the positional relationship (offset amount) between the camera 21 and the displacement sensor 22 can be obtained from the position coordinates of the camera 21 and the position coordinates of the displacement sensor 22. Therefore, the position of the displacement sensor 22 can be calibrated with a simple configuration.

Further, according to the film thickness measuring apparatus having the above-described configuration, the measuring instrument calibration unit 34 uses the offset amount calibration sample 70 to determine the positional relationship between the camera 21 and the measurement head 23, and the camera 21. The positional relationship with the displacement sensor 22 is obtained. Thereby, the position of the two types of displacement sensor 22 and the measurement head 23 can be calibrated with one offset amount calibration sample 70, and the labor of calibration of the film thickness measuring apparatus can be saved.

Further, since the film thickness is obtained by the fluorescent X-ray analysis method, it is possible to measure a minute region of the film 12 of the product substrate 10 and improve the film thickness measurement accuracy. Further, in the fluorescent X-ray analysis method, the film thickness measurement time can be shortened as compared with the X-ray reflectance method.

Further, since the measurement head 23 is movable in the first direction and the second direction with respect to the substrate stage 2, the film thickness at a plurality of locations on the product substrate 10 can be measured with the measurement head 23. Thereby, it becomes suitable for the film thickness measurement of the large-sized product substrate 10.

Note that the present invention is not limited to the above-described embodiment. For example, if the camera 21 can recognize the boundary between the first portion 711 and the second portion 712 of the offset amount calibration sample 70, the mark 713 may not be provided at this boundary.

Further, the second offset amount detection unit 72 of the offset amount calibration sample 70 may be a substance that does not reflect the light beam of the displacement sensor 22 instead of the through hole 720.

Further, the first direction that is the extending direction of the gantry 4 and the second direction that is the moving direction of the gantry 4 may cross each other without being orthogonal to each other.

Further, the number of the camera 21, the displacement sensor 22, and the measuring head 23 is not limited to one, and may be plural.

Further, although two

calibration samples

60 and 70 are installed on the calibration stage 3, the number of calibration samples can be freely increased or decreased. Also, other types of calibration samples may be used, for example, calibration samples for calibrating X-ray intensity drift.

In addition, the film thickness measuring device of the present invention may be used to measure the film thickness of a small product substrate. In addition to the liquid crystal TFT, the film thickness of a semiconductor substrate such as an organic EL may be measured. Also good.

DESCRIPTION OF SYMBOLS 1 Base 2 Substrate stage 3 Calibration stage 4 Gantry 5 Slider 6 Rail part 7 Clamp 10 Product substrate 21 Camera 22 Displacement sensor 23 Measuring head 30 Control means 31 Substrate position correcting means 32 Head position adjusting means 33 Analyzing means 34 Measuring equipment calibration means 60 Gain calibration sample 70 Offset amount calibration sample 71 First offset amount detection unit 711 First portion 712 Second portion 713 Mark 72 Second offset amount detection portion 720 Through hole A First direction B Second direction

Claims

A camera (21) for correcting position information of the product substrate (10) on which the film is formed, a displacement sensor (22) for adjusting the distance between the product substrate (10), and the product substrate (10) A calibration sample used for calibration of a film thickness measuring device having a measurement head (23) for measuring the thickness of the film (12) of
A first offset amount detector (71) for obtaining a positional relationship between the camera (21) and the measuring head (23);
An offset amount calibration sample, comprising: a second offset amount detection unit (72) for obtaining a positional relationship between the camera (21) and the displacement sensor (22).
In the offset amount calibration sample according to claim 1,
The measuring head (23) is configured to irradiate the film (12) of the product substrate (10) with primary X-rays to detect fluorescent X-rays generated from the film (12),
The first offset amount detection unit (71)
A first portion (711) comprising a first substance;
An offset amount calibration sample comprising a second substance different from the first substance and a second part (712) adjacent to the first part (711).
In the offset amount calibration sample according to claim 2,
An offset amount calibration sample, wherein a mark (713) recognizable by the camera (21) is provided at a boundary between the first part (711) and the second part (712).
In the offset amount calibration sample according to any one of claims 1 to 3,
The displacement sensor (22) is configured to detect light reflected from the product substrate (10) by irradiating the product substrate (10) with light.
The second offset amount detection unit (72) is constituted by a through hole (720), the offset amount calibration sample.
The base (1),
A substrate stage (2) on which the product substrate (10) formed on the base (1) is placed;
A calibration stage (3) provided on the base (1) and on which the offset amount calibration sample (70) according to any one of claims 1 to 4 is placed;
The substrate stage (2) and the calibration stage (3) extend in the first direction (A) and the substrate stage (2) and the calibration stage (3) in the second direction (B). A gantry (4) attached to the base (1) so as to be movable
A slider (5) attached to the gantry (4) so as to be movable in the first direction (A);
A camera (21) fixed to the slider (5) and for correcting position information of the product substrate (10) placed on the substrate stage (2);
A displacement sensor (22) fixed to the slider (5) and for adjusting a distance from the product substrate (10) placed on the substrate stage (2);
A measurement head (23) fixed to the slider (5) and for measuring the thickness of the film (12) of the product substrate (10) placed on the substrate stage (2);
The measurement head (23), the camera (21), and the displacement sensor (22) are moved to the calibration stage (3), and the offset amount calibration sample (70) placed on the calibration stage (3) is removed. And measuring instrument calibration means (34) for determining the positional relationship between the camera (21) and the measuring head (23) and the positional relationship between the camera (21) and the displacement sensor (22). A film thickness measuring apparatus.