WO2014027720A1

WO2014027720A1 - Parallel capacitor installed in case

Info

Publication number: WO2014027720A1
Application number: PCT/KR2012/008554
Authority: WO
Inventors: 박대진; 전용원; 박창근; 김윤락
Original assignee: 주식회사 뉴인텍
Priority date: 2012-08-14
Filing date: 2012-10-18
Publication date: 2014-02-20
Also published as: CN204596630U; KR101256347B1

Abstract

The present invention relates to a parallel capacitor installed in a case, comprising: capacitor elements (10) which are formed by winding dielectric films, which have conductive thermally sprayed surfaces formed on the tops and bottoms thereof, and which are arranged into a plurality of parallel rows; a first busbar-forming unit (30) electrically connected to the bottom thermally sprayed surfaces of some of the capacitor elements (10); a second busbar-forming unit (40) electrically connected to the top thermally sprayed surfaces of the other capacitor elements (10) that are not connected to the first busbar-forming unit (30); an insulation sheet (50) interposed between exposed portions of the first busbar-forming unit (30) and the second busbar-forming unit (40) so as to achieve the insulation of the overlapped portions between the first and second busbar-forming units (30, 40) and the insulation of the portions exposed through an outer case; and said outer case (60) for accommodating the capacitor elements (10), the first busbar-forming unit (30), the second busbar-forming unit (40), and the insulation sheet (50).

Description

Case Mount Parallel Capacitors

The present invention relates to a case-embedded parallel capacitor.

In general, capacitors for electric devices, fastening devices, electronic devices, and the like are widely used in various industrial fields. These capacitors use plastic films such as polyethylene terephthalate (PET) resin, polypropylene (PP) resin, polyethylene naphthalate (PEN) resin, polycarbonate (PC) resin, and polyphenylene sulfide (PPS) resin as dielectrics. Then, the deposition film in which the metal is deposited on one side or both sides of the plastic film is wound, and zinc, zinc alloy, tin, or primary zinc secondary tin is sprayed on both sides of the wound deposition film, and the sprayed surface 7 is formed. The capacitor element 4 is manufactured.

Capacitor capacitance varies according to the purpose of the capacitor, so the capacitors are manufactured by adding or subtracting the number of capacitor elements (hereinafter, referred to as the following) to other N-pole bus bars and P-pole bus bars. Wire and the large capacity capacitor is connected to a plurality of devices to manufacture the capacitor. A capacitor composed of a large number of devices connects the N-pole bus bar and the P-pole bus bar with different polarities to both spraying surfaces of the device, and forms a terminal part by exposing a part of the bus bar to the outside of the outer case.

In this way, the N-pole and P-pole busbars are inserted into a case such as a plastic case or a metal case, and then filled with a molding agent such as epoxy or urethane, or a heterogeneous molding agent such as epoxy and urethane. Filled in multiple layers to protect the insulation and inside the capacitor. However, when a capacitor has a high inductance, a high voltage, a large current, or a high frequency, the capacitor affects the peripheral parts of the capacitor and heat is generated by the surge voltage inside the capacitor. Lowers, shortens the life of the capacitor, and lowers the reliability of the performance of the capacitor.

One of the causes of the above-described problem is due to the inductance of the capacitor. Looking at the configuration and assembly process of a conventional capacitor briefly as follows. As a conventional example, as shown in the drawing, N pole bus bars having different polarities and P pole bus bars having different polarities are arranged in parallel without overlapping, and the devices are connected and only the external bus bars are overlapped with each other. There was a limit to the reduction. Insulation was inserted between the N-pole busbar and P-pole busbar on the outside of the case, and it was difficult to work by using a separate insulation and to maintain a constant position of the insulating material. Insulation paper or plastic film is used as insulation material. Insulation paper absorbs moisture in harsh environments (e.g., temperature of 95 ℃, humidity of 85%) and weakens the insulation power. The characteristics change to affect the capacitor.

Conventionally, when a large number of devices and conductive busbars in a capacitor are connected, the conductive busbars are thick, so that a large amount of heat is transferred to the devices during soldering, resulting in deterioration of durability due to shrinkage of the film. Problems such as reduced surface adhesion and uneven adhesion occurred.

In addition, due to the lack of current density in the terminal drawn out of the capacitor outer case, excessive heat is generated in the terminal, causing the terminal to be pressed and the life of the semiconductor power device IGBT due to temperature rise.

In addition, by inserting an insulator only between the P pole and the N pole drawn out of the conventional capacitor outer case has been released a product of the type that only insulates between the P, N pole of the capacitor. When the capacitors are used for a long time, these products are contaminated with dust on the terminals drawn out of the capacitor outer case, and moisture between the P and N poles, PN pole, and the body drawn out of the capacitor outer case due to moisture absorption in dust during the rainy season. The inverter failed because of an over or short that caused a fatal effect on the renewable inverter.

The present invention intends to propose a method of assembling a capacitor that can have a remarkable effect on the performance improvement and life extension effect of the capacitor in the assembly method of busbars having different polarities while repeating many trials and errors.

First, the present invention relates to a thin conductive bus bar (element connection part 31 and 41) connected to a large number of devices in a capacitor or a part or all of the conductive bus bars (leader part 35 and 45) drawn out of the outer case. In addition, the N pole conductive busbars are arranged so that they overlap or overlap each other, so that the noise generated when switching the IGBT in the renewable inverter is canceled with each other, thereby reducing the inductance and minimizing the heat rise generated in the capacitor and the IGBT. To provide a case-mounted parallel capacitor.

Second, by reducing the thickness of the element connection part of the busbar, which is a part that is combined with a large number of devices in the capacitor, the soldering performance is improved by about 30% between the capacitor element and the conductive busbar, and the high heat transfer to the capacitor element is minimized when soldering. As a result of improving the durability of the capacitor and by designing the current density of the terminal by designing the connection terminal part (or part of the lead part) exposed out of the outer case with thick (0.5 ~ 10mm) conductive material to match the current density, To provide a case-mounted parallel capacitor to improve the phenomenon that the terminal is pressed in the part connected to the input terminal in the power device IGBT.

Third, the first and second lead-out

portions

35 and 45 of the busbars exposed to the outside of the capacitor outer case are coated with an insulating material such as epoxy, urethane, silicon, and the first and second lead-out

portions

35 and 45 to each other. Case-mounted parallel capacitors that do not inherently cause problems such as a flashover or short between the P-pole and N-pole conductive busbars, and between the P / N-pole conductive busbars and the body after inserting the insulating sheet 50 between them. To provide.

Fourth, there is a problem that a step occurs in the connection terminal part caused by using a material thicker than the device connection part to improve the current density (occurs when combined with the to-be-connected body: for example, the IGBT connection part of the semiconductor power device). To provide a case-mounted parallel capacitor that can solve the problem.

The case-mounted parallel capacitor of the present invention includes: capacitor elements 10 formed by winding a dielectric film, conductive spray surfaces formed on upper and lower portions thereof, and arranged in parallel in a plurality of rows;

A first busbar forming portion 30 electrically connected to the lower sprayed surface of some of the capacitor elements 10;

A second busbar forming portion 40 electrically connected to the upper sprayed surface of the remaining capacitor elements 10 which are not connected to the first busbar forming portion 30 of the capacitor elements 10;

An insulating sheet 50 in which the first busbar forming portion 30 and the second busbar forming portion 40 overlap each other and are interposed for insulation between portions exposed from the outer case;

And an outer case 60 in which the capacitor element 10, the first busbar forming unit 30, the second busbar forming unit 40, and the insulating sheet 50 are placed. .

In accordance with the present invention, firstly, some or all of the thin conductive busbars (elements: 31, 41) connected to a large number of devices in a capacitor or conductive busbars (leads: 35, 45) drawn out of the outer case. P and N-pole conductive busbars are arranged so that they overlap or overlap each other, so that the noise generated when switching the IGBT in the renewable inverter is canceled with each other, thereby reducing the inductance and minimizing the heat rise generated in the capacitor and the IGBT. It is effective to let.

Second, by reducing the thickness of the element connection part of the busbar, which is a part that is combined with a large number of devices in the capacitor, the soldering performance is improved by about 30% between the capacitor element and the conductive busbar, and the high heat transfer to the capacitor element is minimized when soldering. Improved capacitor durability. In addition, the connection terminal part (or part of the lead part) exposed outside the outer case is made of thick (0.5 ~ 10mm) conductive material and designed to meet the current density to improve the current density of the terminal. It is effective to improve the phenomenon that the terminal is pressed in the part connected to.

Third, the first and second lead-out

portions

35 and 45 to each other. After inserting the insulating sheet 50 between the side-by-side overlap between the P-pole and N-pole conductive busbar, the P / N-pole conductive busbar and the body is solved so as not to cause the problem of the flashover or short.

Fourth, there is a problem that a step occurs in the connection terminal part caused by using a material thicker than the device connection part to improve the current density (occurs when combined with the to-be-connected body: for example, the IGBT connection part of the semiconductor power device). In order to solve this problem, the step height is processed by the shape of the conductive material (copper, iron, stainless) in the form of bush to be bonded (indentation, press-in welding, press-in soldering, press-in brazing). It was. In addition, the guide bar has an effect of facilitating horizontal coupling with the object to be joined.

In practical applications, the above-described improvements have been made to improve the reliability and lifespan of capacitors for new and renewable inverters (large power inverters for solar generators, wind turbines, tidal generators, wave generators, etc.). It has been developed to guarantee more than 80,000 hours in 10 years. As a result, the lifespan of new and renewable inverters has been laid for a long life of more than 80,000 hours in 10 years.

1 is an exploded perspective view of a case-mounted parallel capacitor according to an embodiment of the present invention.

Figure 2 is a perspective view of the case-mounted parallel capacitor coupled state according to an embodiment of the present invention (the final product state embedded in the outer case).

3 is a casing-mounted parallel capacitor parallel circuit diagram and overall conceptual diagram according to an embodiment of the present invention.

4 is a perspective view of a case-mounted parallel capacitor further configured with a bush and a guide bar in an exposed portion to increase bonding.

Hereinafter, a case-mounted parallel capacitor according to an embodiment of the present invention will be described. 1 is an exploded perspective view of a case-mounted parallel capacitor according to an embodiment of the present invention, Figure 2 is a perspective view of a case-mounted parallel capacitor coupled state according to an embodiment of the present invention (the final product state embedded in the outer case) 3 is a case-mounted parallel capacitor parallel circuit diagram and overall conceptual diagram according to an embodiment of the present invention.

As shown in Figures 1 to 3, the case-mounted parallel capacitor according to an embodiment of the present invention is the capacitor element 10, the first busbar forming portion 30 and the second busbar forming portion ( 40) and the insulating sheet 50 and the outer case 60 is configured.

As shown in Figures 1 to 3, in the case-mounted parallel capacitor according to an embodiment of the present invention, the capacitor elements 10 are formed by winding a dielectric film and a conductive sprayed surface on the top and bottom It is formed and arranged side by side in a plurality of rows. The first busbar forming portion 30 is electrically connected to the lower sprayed surface of some of the capacitor elements 10.

1 to 3, in the case-mounted parallel capacitor according to the exemplary embodiment of the present invention, the second busbar forming part 40 may include the first busbar among the capacitor elements 10. It is electrically connected to the upper thermal sprayed surface of the remaining capacitor elements 10 that are not connected to the formation unit 30.

As shown in FIG. 1, the insulating sheet 50 is a portion where the first busbar forming portion 30 and the second busbar forming portion 40 overlap each other and are exposed from an exterior case (that is, an area overlapping each other as shown in FIG. 1). The insulating sheet is positioned in the first and second lead-out regions, and does not mean that the first busbar forming portion 30 and the second busbar forming portion 40 overlap each other in the whole region). Interposed for insulation. The outer case 60 includes the capacitor element 10, the first busbar forming unit 30, the second busbar forming unit 40, and the insulating sheet 50.

1 to 3, in the case-mounted parallel capacitor according to the exemplary embodiment of the present invention, the first busbar forming unit 30 is electrically connected to the lower spray surface of the capacitor element 10. Connected to each other, and the first device connection part 31 having a conductive plate shape horizontally embedded in the outer case 60 and the lower side are coupled to the other side of the first device connection part 31 and extended upward. The upper upper side is a first vertical extension 39 coupled to one side of the first lead-out part 35, and the one side is an upper side of the first vertical extension 39. Coupled to the upper body, wherein the first body portion extends horizontally to the other side and protrudes from the conductive plate-shaped first lead portion 35 exposed from the outer case 60 and the other side of the first lead portion 35. It comprises a first connection terminal 37.

1 to 3, in the case-mounted parallel capacitor according to the embodiment of the present invention, the second busbar forming portion 40 is electrically connected to the upper sprayed surface of the capacitor element 10. The second element connecting portion 41 and one side of the conductive plate-like portion which is connected to the outer case 60 and is horizontally embedded in the outer case 60, and is coupled to the other side of the second element connecting portion 41. The second body portion extends horizontally to the other side and has a conductive plate-shaped second lead portion 45 exposed from the outer case 60, and a second connection terminal 47 protruding from the other side of the second lead portion 45. It is configured to include).

As shown in FIG. 1, in the case-mounted parallel capacitor according to the embodiment of the present invention, the thickness of the first device connection part 31 and the second device connection part 41 is 0.2 to 3 mm. The thickness of the first connection terminal 37 and the second connection terminal 47 is 0.5 to 10 mm, and the thickness of the first device connection part 31 is smaller than that of the first connection terminal 37. The thickness of the second device connection part 41 is preferably smaller than the thickness of the second connection terminal 47.

As shown in FIG. 1, in the case-mounted parallel capacitor according to the exemplary embodiment of the present invention, the insulating sheet 50 is disposed between the first lead part 35 and the second lead part 45. It is preferable to interpose.

1 and 2, in the case-mounted parallel capacitor according to the embodiment of the present invention, the first and second lead portions 33 and 43 having a flat plate shape are made of an insulating material. It is preferred to be coated. The first and second lead portions 33 and 43 may be formed of fine scratches on the surface by sand blasting, and then coated with at least one insulating material selected from epoxy, urethane, and silicon.

[Table 1] is a table showing the effect of improving the adhesion of the sandblasted and not.

Table 1

Thermal Shock Test Conditions	division		50	100	250	500 cycles
-40 ° C, + 100 ° C for 1 hour each, 500 cycles	Insulation coating busbar without sanding	Withstand or fall	Falling	-	-
-40 ° C, + 100 ° C for 1 hour each, 500 cycles	Insulation coating product after sanding	Withstand	Withstand	Withstand	Withstand

4 is a perspective view of a case-mounted parallel capacitor further configured with a bush and a guide bar in an exposed portion to increase bonding. As shown in FIG. 4, in the case-mounted parallel capacitor according to the exemplary embodiment of the present invention, coupling is performed on the upper surface of the first connection terminal 37 (press, press, weld, press, solder, press, press and break). It is preferable that it is configured to further comprise at least one of the step adjustment step 2 bushes (73) coupled to the lower surface of the step adjustment first bush (71) or the second connection terminal (47).

As shown in FIG. 4, in the case-mounted parallel capacitor according to the exemplary embodiment of the present invention, first and second sides of the first and

second extraction units

35 and 45 are respectively located on the other side. It is preferable that the guide bars 75 and 76 protrude to the other side. The guide bar is instead supported by mechanical force to prevent electrical connection damage due to the pulling force transmitted from the object to the terminal.

The first and second

busbar forming portions

30 and 40 are made of copper plate, copper plate + aluminum plate + copper plate, aluminum plate + copper plate or nickel plate, aluminum plate + copper plate + electromagnet plate or nickel plate. Exterior case 60 is composed of a plastic injection case, iron case, aluminum case, stainless case).

Table 2 below is a table in which the capacitor according to the embodiment of the present invention has a smaller inductance than the capacitor manufactured in the form of the prior art shown in FIG. The reduction of inductance reduces heat generation and shows excellent electrical properties.

TABLE 2

division	inductance	Decrease
Comparative example	55nH
1 embodiment	25nH		30 nH

Although the present invention has been described in connection with the above-mentioned preferred embodiments, the scope of the present invention is not limited to these embodiments, and the scope of the present invention is defined by the following claims, and equivalent scope of the present invention. It will include various modifications and variations belonging to.

The reference numerals set forth in the claims below are merely to aid the understanding of the present invention, not to affect the interpretation of the scope of the claims, and the scope of the claims should not be construed narrowly.

Claims

Capacitor elements 10 formed by winding a dielectric film and having conductive sprayed surfaces formed on upper and lower portions thereof, and arranged side by side in a plurality of rows;

A first busbar forming portion 30 electrically connected to the lower sprayed surface of some of the capacitor elements 10;

A second busbar forming portion 40 electrically connected to the upper sprayed surface of the remaining capacitor elements 10 which are not connected to the first busbar forming portion 30 of the capacitor elements 10;

An insulating sheet 50 interposed between the first busbar forming portion 30 and the second busbar forming portion 40 to insulate the portions exposed from the outer case while overlapping each other;

And an outer case 60 in which the capacitor element 10, the first busbar forming unit 30, the second busbar forming unit 40, and the insulating sheet 50 are placed. Case-mounted parallel capacitors.
The method of claim 1,

The first busbar forming unit 30,

A first plate connection part 31 having a conductive plate shape electrically connected to a lower spraying surface of the capacitor element 10 and horizontally embedded in the outer case 60;

The lower side is coupled to the other side of the first device connection part 31 and the upper side is extended upward, and the upper side is coupled to the one side of the first lead-out part 35. 39),

One side is coupled to an upper side of the first vertical extension part 39, and the first body part extends horizontally to the other side and has a conductive plate-shaped first lead part exposed from the exterior case 60 ( 35) and,

It comprises a first connecting terminal (37) protruding on the other side of the first lead-out portion (35);

The second busbar forming unit 40,

A second plate connection part 41 having a conductive plate shape electrically connected to an upper sprayed surface of the capacitor element 10 and horizontally embedded in the outer case 60;

One side is coupled to the other side of the second device connection part 41, and the second body part extends horizontally to the other side and has a conductive plate-shaped second lead part 45 exposed from the exterior case 60. Wow,

And a second connection terminal (47) protruding from the other side of the second lead-out portion (45).
The method of claim 2,

The thickness of the first device connection portion 31 and the second device connection portion 41 is 0.2 ~ 3 mm,

The thickness of the first connection terminal 37, the second connection terminal 47 is 0.5 ~ 10 mm,

The first device connection portion 31 has a thickness smaller than that of the first connection terminal 37,

The thickness of the second element connection portion 41 is case-mounted parallel capacitor, characterized in that less than the thickness of the second connection terminal (47).
The method of claim 2,

The insulating sheet 50 is a case-mounted parallel capacitor, characterized in that interposed between the first lead portion (35) and the second lead portion (45).
The method of claim 2,

The case-mounted parallel capacitor of claim 1, wherein the first and second lead portions (35, 45) having a flat plate shape are coated with an insulating material.
The method of claim 5,

The first and second lead portions 35 and 45 may be formed of fine scratches on the surface by sand blasting, and then coated with at least one insulating material selected from epoxy, urethane, and silicon. Case-mounted parallel capacitors.
The method of claim 3,

Further comprising at least one of the step adjusting the first bush (71) coupled to the upper surface of the first connection terminal 37 or the second bush (73) for adjusting the step coupled to the lower surface of the second connecting terminal (47). Case mounted parallel type capacitor, characterized in that the configuration.
The method of claim 3,

Case-mounted parallel capacitors, characterized in that the first and second guide bars 75 and 76 protrude to the other side, respectively, on the other side of the first lead portion 35 and the second lead portion 45. .
The method of claim 4, wherein

The portion of the insulating sheet 50 which is located outside the outer case 60 is wider than the exposed portion 51 of the first lead portion 35 and the second lead portion 45 to the outside of the outer case 60. The exposed area 51a is formed between the first lead part 35 and the second lead part 45.

The thickness of the first lead part 35 and the second lead part 45 is the same as that of the first device connection part 31 and the second device connection part 41 so that a thin plate is used, and the first connection terminal ( 37) The second connection terminal (47) is a case-mounted series capacitor, characterized in that to use thicker than the first lead portion (35) and the second lead portion (45).