CN204596630U - Shell carrying type parallel connection type capacitor - Google Patents
Shell carrying type parallel connection type capacitor Download PDFInfo
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- CN204596630U CN204596630U CN201290000996.0U CN201290000996U CN204596630U CN 204596630 U CN204596630 U CN 204596630U CN 201290000996 U CN201290000996 U CN 201290000996U CN 204596630 U CN204596630 U CN 204596630U
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- Prior art keywords
- lead division
- capacitor
- parallel connection
- forming portion
- busbar
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- 239000003990 capacitor Substances 0.000 title claims abstract description 106
- 238000007751 thermal spraying Methods 0.000 claims abstract description 19
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 229920002635 polyurethane Polymers 0.000 claims description 6
- 239000004814 polyurethane Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 238000005488 sandblasting Methods 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 3
- 231100000241 scar Toxicity 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000002985 plastic film Substances 0.000 description 5
- 229920006255 plastic film Polymers 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 229940070527 tourmaline Drugs 0.000 description 1
- 229910052613 tourmaline Inorganic materials 0.000 description 1
- 239000011032 tourmaline Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/14—Protection against electric or thermal overload
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/26—Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The utility model relates to shell carrying type parallel connection type capacitor, and described shell carrying type parallel connection type capacitor comprises: capacitor element, and it is batched by thin dielectric film and is formed, and is formed with the thermal spraying face of conductivity, fitly arranges with multiple row on top and bottom; Busbar forming portion, it is electrically connected in the thermal spraying face, bottom of a part in described capacitor element; 2nd busbar forming portion, it is electrically connected in the thermal spraying face, top of all the other capacitor elements be not connected with described 1st busbar forming portion in described capacitor element; Insulating trip, its between described 1st busbar forming portion and the 2nd busbar forming portion overlapped and between the part being exposed to outer casing, for insulation; Outer casing, it is laid for described capacitor element, the 1st busbar forming portion, the 2nd busbar forming portion and insulating trip.
Description
Technical field
The utility model relates to the built-in parallel connection type capacitor of shell.
Background technology
Generally speaking, electric equipment with, enter and widely use at various industrial circle by, electronic equipment electricity container etc. mutually.This capacitor uses the plastic films such as polyethylene terephthalate (PET) resin, polypropylene (PP) resin, PEN (PEN) resin, Merlon (PC) resin, polyphenylene sulfide (PPS) resin as dielectric, the deposited film that one or both sides at plastic film be deposited to metal batches, on the two sides of the deposited film batched, thermal spraying zinc, kirsite, tin or 1 zinc, 2 tin, form thermal spraying face, manufacture capacitor element.
The static capacity of capacitor there are differences according to the purposes of capacitor, therefore, add and subtract capacitor element (hereinafter referred to as element) number at different N pole busbars and P pole busbar carry out wiring and manufacture capacitor, the capacitor of low capacity connects the element of lesser amt, and large value capacitor connects multiple element and manufactures capacitor.The capacitor be made up of a large amount of elements connects the different N pole busbar of polarity and P pole busbar respectively in element two thermal spraying face, makes a part for busbar be exposed to outer casing (hereinafter referred to as shell) outside, forms portion of terminal.
The element being attached with N pole busbar and P pole busbar as mentioned above in the shell of whole insertion such as plastic casing or metal shell after; fill the molding agent of such as epoxy resin or polyurethane; or different types of molding agent of such as epoxy resin and polyurethane is filled to multilayer, carry out insulation and capacitor for voltage protection inside.But, capacitor is large at inductance, or use voltage high, or flow through big current, or during frequency height, capacitor circumferential component is had an impact, at capacitor internal, generating heat because of surge voltage, can there is the electrical characteristic of reduction capacitor, the life-span of shortening capatcitor, the problem of reduction capacitor performance reliability in the heating of capacitor.
There is one of reason of foregoing problem and result from the inductance of capacitor.Portion in the enclosure, the N pole busbar that polarity is different is not overlapping with P pole busbar, but configures abreast, carries out wiring to element, only have outside busbar overlapped, but the area of overlap is little, in reduction inductance, there is limitation.As the method inserted insulating material carry out insulating between the N pole busbar and P pole busbar of housing exterior, owing to using other insulating material, thus operation trouble, need to keep insulating material position, operation is more difficult setly.And, use insulating paper or plastic film as insulating material, if use insulating paper, (example: temperature 95 DEG C, humidity 85%) absorbs moisture then in the presence of a harsh environment, insulating capacity is weakened, if use plastic film, then due to hydrolyzable, the characteristic of plastic film changes, and has an impact to capacitor.
In the past, when being wired to elements a large amount of in capacitor and conductivity busbar, due to the reason that conductivity busbar is thicker, more heat is transmitted to element during soldering, due to film shrunk, there is the problem that durability declines, when realizing to make heat trnasfer minimizing and carrying out spot welding, if conductivity busbar is thickening, then there is the problems such as bonding force declines and bonding force is uneven.
In addition, being drawn out to the terminal outside the outer casing of capacitor, because current density is not enough, generating heat too much at terminal, problem that terminal burns and semiconductor power element IGBT temperature occurring and to rise the problem causing the life-span to decline.
In addition, only between the P pole be drawn out to outside the outer casing of capacitor and N pole, inserted insulator, only make P, N electrode insulation of capacitor, the goods of this form appear on the market in the past.This goods are when Long-Time Service capacitor, be drawn out to the terminal outside the outer casing of capacitor, pollute because of dust etc., rainy season absorbs moisture because of dust etc., being drawn out to P and the N interpolar outside the outer casing of capacitor, between PN pole and main body, arcing or short circuit occur, and produce detrimental effects to inverter, inverter breaks down.
Utility model content
For solving the problem, the utility model discloses a kind of shell carrying type parallel connection type capacitor, can to improving capacitor performance and life-saving produces extreme influence.
First, the present invention aims to provide a kind of shell carrying type parallel connection type capacitor, 31,41) or the conductivity busbar (lead division: 35,45) be drawn out to outside outer casing being wired to thin conductivity busbar (the element wire connecting portion: of a large amount of element in capacitor, part or all is configured P, N pole conductivity busbar is fitly overlapped or overlap mutually, the noise occurred when the IGBT newly regenerated in inverter is switched is cancelled out each other, thus inductance reduces, and the heat rising realization that capacitor and IGBT can be made to occur minimizes.
Second, aim to provide a kind of shell carrying type parallel connection type capacitor, make the element wire connecting portion lower thickness as the busbar with a large amount of combination of elements position in capacitor, the soldering performance between capacitor element and conductivity busbar is made to improve about 30%, high heat is made to realize minimizing to the transmission of capacitor element during soldering, improve capacitor durability, in addition, the splicing ear position (or comprising a part for lead division) be exposed to outside outer casing is formed with thicker (0.5 ~ 10mm) conductive material, design current density suitably, improve the current density of terminal, result can in the wiring part of semiconductor power element IGBT input terminal, improve terminal and burn phenomenon.
3rd, aim to provide a kind of shell carrying type parallel connection type capacitor, the megohmite insulant coatings such as epoxy resin, polyurethane, silicones are utilized to be exposed to the 1st, the 2nd lead division (35 of the busbar of the exterior housing exterior of capacitor, 45), at the 1st, the 2nd lead division (35,45), after mutually fitly inserting insulating trip (50) between overlap, fundamentally solve between P pole and N pole conductivity busbar, the problem of arcing or short circuit occurs between P/N pole conductivity busbar and main body.
4th, aim to provide a kind of shell carrying type parallel connection type capacitor, can solve due to for improve current density and use the material thicker than element wire connecting portion cause splicing ear part generation staggered floor problem (with combined body in conjunction with time occur: combined style is semiconductor power element IGBT connecting portion in this way).
The technical solution of the utility model is achieved in that
Shell carrying type parallel connection type capacitor of the present utility model, comprising: capacitor element 10, it is batched by thin dielectric film and is formed, and is formed with the thermal spraying face of conductivity, fitly arranges with multiple row on top and bottom;
1st busbar forming portion 30, it is electrically connected in the thermal spraying face, bottom of a part in described capacitor element 10;
2nd busbar forming portion 40, it is electrically connected in the thermal spraying face, top of all the other capacitor elements 10 be not connected with described 1st busbar forming portion 30 in described capacitor element 10;
Insulating trip 50, its between described 1st busbar forming portion 30 and the 2nd busbar forming portion 40 overlapped and between the part being exposed to outer casing, for insulation;
Outer casing 60, it is laid for described capacitor element 10, the 1st busbar forming portion 30, the 2nd busbar forming portion 40 and insulating trip 50.
The beneficial effects of the utility model are:
(1) at the thin conductivity busbar being wired to a large amount of element in capacitor or the conductivity busbar be drawn out to outside outer casing, part or all is configured P, N pole conductivity busbar is fitly overlapped or overlap mutually, the noise occurred when IGBT in new forms of energy inverter is switched is cancelled out each other, thus inductance reduces, and has the heat rising that capacitor and IGBT are occurred and realizes minimized effect;
(2) the element wire connecting portion lower thickness as the busbar with a large amount of combination of elements position in capacitor is made, the soldering performance between capacitor element and conductivity busbar is made to improve about 30%, make high heat realize minimizing to the transmission of capacitor element during soldering, improve capacitor durability.In addition, the splicing ear position (or comprising a part for lead division) be exposed to outside outer casing is formed with thicker 0.5 ~ 10mm conductive material, correctly design current density, improve the current density of terminal, result in the wiring part of semiconductor power element IGBT input terminal, can have and improve the effect that terminal burns phenomenon;
(3) the megohmite insulant coatings such as epoxy resin, polyurethane, silicones are utilized to be exposed to the 1st, the 2nd lead division of the busbar of the exterior housing exterior of capacitor, after the 1st, the 2nd lead division fitly inserts insulating trip between overlap mutually, fundamentally solve between P pole and N pole conductivity busbar, the problem of arcing or short circuit occurs between P/N pole conductivity busbar and main body;
(4) in order to solve owing to using the material thicker than element wire connecting portion to cause problem at splicing ear part generation staggered floor for improving current density, according to the thickness forming staggered floor, conductive material (copper, iron, stainless steel) is processed into liner form, to combine modes such as (press-in, press-in+welding, press-in+soldering, press-in+solderings), make the split-level height of terminal identical; In addition, import guide ribs, have easily and the effect of combined body horizontal integration;
(5) in practical application, owing to improving foregoing teachings, thus exploitation makes it possible to improve the reliability of the new forms of energy inverters electricity container such as (solar generator use, wind-driven generator, tital generator use, wave-activated generator use high-power inverter), life-span can ensure 80 between 10 years, more than 000 hour.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the stereogram of the shell carrying type parallel connection type capacitor decomposition texture of the utility model embodiment;
Fig. 2 is the shell carrying type parallel connection type capacitor bonding state stereogram of the utility model embodiment;
Fig. 3 is the shell carrying type parallel connection type capacitor overall structure schematic diagram of the utility model embodiment;
Fig. 4 adds for increasing associativity the shell carrying type parallel connection type capacitor stereogram forming liner and guide ribs at exposed division;
Fig. 5 is existing shell carrying type parallel connection type capacitor schematic diagram.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
As shown in Figure 1 to Figure 3, the shell carrying type parallel connection type capacitor of the utility model embodiment comprises capacitor element 10, the 1st busbar forming portion 30, the 2nd busbar forming portion 40, insulating trip 50 and outer casing 60.
As shown in Figure 1 to Figure 3, in the shell carrying type parallel connection type capacitor of the utility model embodiment, capacitor element 10 is batched by thin dielectric film and is formed, and is formed with the thermal spraying face of conductivity, fitly arranges with multiple row on top and bottom.1st busbar forming portion 30 is electrically connected in the thermal spraying face, bottom of a part in described capacitor element 10.
As shown in Figure 1 to Figure 3, in the shell carrying type parallel connection type capacitor of the utility model embodiment, the 2nd busbar forming portion 40 is electrically connected in the thermal spraying face, top of all the other capacitor elements 10 be not connected with described 1st busbar forming portion 30 in capacitor element 10.
As shown in Figure 1, insulating trip 50 between the 1st busbar forming portion 30 and the 2nd busbar forming portion 40 overlapped and be exposed to the part of outer casing, namely, insulating trip 50 is positioned at the 1st, the 2nd lead division region in overlapped region shown in Fig. 1, and do not mean that the 1st busbar forming portion 30 and the 2nd busbar forming portion 40 mutually between Zone Full is overlapping for insulating.Outer casing 60 is laid for capacitor element 10, the 1st busbar forming portion 30, the 2nd busbar forming portion 40 and insulating trip 50.
As shown in Figure 1 to Figure 3, in the shell carrying type parallel connection type capacitor of the utility model embodiment, 1st busbar forming portion 30 comprises: the 1st element wire connecting portion 31, it is conductivity tabular, be electrically connected in the thermal spraying face, bottom of capacitor element 10, be flatly built in described outer casing 60; 1st vertical extension 39, it is incorporated into another side of the 1st element wire connecting portion 31 below, and after upwards extending, top is combined with a side of the 1st lead division 35; 1st lead division 35, it is conductivity tabular, and one side is incorporated into the top of the described 1st vertical extension 39, and the 1st main part, to opposite side horizontal extension, is exposed to outer casing 60; 1st splicing ear 37, its another side at described 1st lead division 35 protrudes and is formed.
As shown in Figure 1 to Figure 3, in the shell carrying type parallel connection type capacitor of the utility model embodiment, 2nd busbar forming portion 40 comprises: the 2nd element wire connecting portion 41, it is conductivity tabular, be electrically connected in the thermal spraying face, top of capacitor element 10, be flatly built in described outer casing 60; 2nd lead division 45, it is conductivity tabular, and a side is incorporated into another side of described 2nd element wire connecting portion 41, and the 2nd main part, to opposite side horizontal extension, is exposed to outer casing 60; 2nd splicing ear 47, its another side at the 2nd lead division 45 protrudes and is formed.
As shown in Figure 1, in the shell carrying type parallel connection type capacitor of the utility model embodiment, preferably the thickness of the 1st element wire connecting portion 31 and the 2nd element wire connecting portion 41 is 0.2 ~ 3mm, the thickness of described 1st splicing ear 37 and the 2nd splicing ear 47 is 0.5 ~ 10mm, described 1st element wire connecting portion 31 thickness is less than the thickness of described 1st splicing ear 37, and the thickness of described 2nd element wire connecting portion 41 is less than the thickness of described 2nd splicing ear 47.
As shown in Figure 1, in the shell carrying type parallel connection type capacitor of the utility model embodiment, preferred insulating trip 50 is between described 1st lead division 35 and the 2nd lead division 45.
As shown in Figure 1 and Figure 2, in the shell carrying type parallel connection type capacitor of the utility model embodiment, described 1st, the 2nd lead division 35,45 preferably in flat is coated with megohmite insulant.Preferably the 1st, the 2nd lead division 35,45 is by (sand blasting) process of sandblasting, and after surface forms fine scar, is coated with at least one megohmite insulant be selected from epoxy resin, polyurethane, silicones.
Table 1 shows the table carrying out sandblasting and process and improve effect with the tack of not carrying out processor.
Table 1
Fig. 4 adds for increasing associativity the shell carrying type parallel connection type capacitor stereogram forming liner and guide ribs at exposed division.As shown in Figure 4, in the shell carrying type parallel connection type capacitor of the utility model embodiment, preferably also comprise staggered floor adjustment 1st liner 71 of combination (press-in, press-in+welding, press-in+soldering, press-in+soldering) above the 1st splicing ear 37 or at least one of staggered floor adjustment in the 2nd liner 73 be incorporated into below described 2nd splicing ear 47.
As shown in Figure 4, in the shell carrying type parallel connection type capacitor of the utility model embodiment, preferably at another side of the 1st lead division 35 and the 2nd lead division 45, the 1st, the 2nd guide ribs 75,76 is protruded respectively to opposite side and is equipped with.Guide ribs causes electrical connection damage to prevent the pulling force because being delivered to terminal from combined body, replaces mechanical force support.
1st, the 2nd busbar forming portion 30,40 is by copper coin, copper coin+aluminium+cover copper, aluminium+copper facing or nickel plating, aluminium+copper facing+plating tourmaline or nickel plating to form.Outer casing 60 is made up of injection casing, iron shell, aluminium shell, stainless steel casing.
Table 2 is tables that the capacitor of display the utility model embodiment has the inductance less than the capacitor of prior art form as shown in Figure 5.Demonstrate because inductance reduces, heating reduces, and electrical characteristic becomes outstanding.
| Classification | Inductance | Decrease |
| Comparative example | 55nH | |
| Fig. 1 embodiment | 25nH | 30nH |
Table 2
The present invention is illustrated with regard to the above-mentioned preferred embodiment mentioned, but not scope of the present invention is defined in this embodiment.
Scope of the present invention is determined by following claims, comprises and belonging to and the multiple amendment of equivalency range of the present invention and distortion.
It is pointed out that the reference numeral recorded in following claims is merely for the understanding of auxiliary invention, does not have an impact to the explanation of interest field, reference numeral historically must not reduce explanation interest field.
Commercial Application feasibility
According to the present invention, first, 31,41) or the conductivity busbar (lead division: 35,45) be drawn out to outside outer casing being wired to thin conductivity busbar (the element wire connecting portion: of a large amount of element in capacitor, part or all is configured P, N pole conductivity busbar is fitly overlapped or overlap mutually, the noise occurred when the IGBT newly regenerated in inverter is switched is cancelled out each other, thus inductance reduces, and has the heat rising that capacitor and IGBT are occurred and realizes minimized effect.
Claims (9)
1. a shell carrying type parallel connection type capacitor, is characterized in that, comprising:
Capacitor element (10), it is batched by thin dielectric film and is formed, and is formed with the thermal spraying face of conductivity, fitly arranges with multiple row on top and bottom;
1st busbar forming portion (30), it is electrically connected in the thermal spraying face, bottom of a part in described capacitor element (10);
2nd busbar forming portion (40), it is electrically connected in the thermal spraying face, top of all the other capacitor elements (10) be not connected with described 1st busbar forming portion (30) in described capacitor element (10);
Insulating trip (50), its between described 1st busbar forming portion (30) and the 2nd busbar forming portion (40) overlapped and between the part being exposed to outer casing;
Outer casing (60), it is laid for described capacitor element (10), the 1st busbar forming portion (30), the 2nd busbar forming portion (40) and insulating trip (50).
2. shell carrying type parallel connection type capacitor according to claim 1, is characterized in that,
Described 1st busbar forming portion (30) comprising:
1st element wire connecting portion (31), it is conductivity tabular, is electrically connected in the thermal spraying face, bottom of described capacitor element (10), is flatly built in described outer casing (60);
1st vertical extension (39), it is incorporated into another side of the 1st element wire connecting portion (31) below, and after upwards extending, top is combined with a side of the 1st lead division (35);
1st lead division (35), it is conductivity tabular, and one side is incorporated into the top of the described 1st vertical extension (39), and the 1st main part, to opposite side horizontal extension, is exposed to outer casing (60);
1st splicing ear (37), its another side at described 1st lead division (35) protrudes and is formed;
Described 2nd busbar forming portion (40) comprising:
2nd element wire connecting portion (41), it is conductivity tabular, is electrically connected in the thermal spraying face, top of described capacitor element (10), is flatly built in described outer casing (60);
2nd lead division (45), it is conductivity tabular, and a side is incorporated into another side of described 2nd element wire connecting portion (41), and the 2nd main part, to opposite side horizontal extension, is exposed to outer casing (60);
2nd splicing ear (47), its another side at described 2nd lead division (45) protrudes and is formed.
3. shell carrying type parallel connection type capacitor according to claim 2, is characterized in that,
Described 1st element wire connecting portion (31) is 0.2 ~ 3mm with the thickness of the 2nd element wire connecting portion (41),
Described 1st splicing ear (37) is 0.5 ~ 10mm with the thickness of the 2nd splicing ear (47),
Described 1st element wire connecting portion (31) thickness is less than the thickness of described 1st splicing ear (37),
The thickness of described 2nd element wire connecting portion (41) is less than the thickness of described 2nd splicing ear (47).
4. shell carrying type parallel connection type capacitor according to claim 2, is characterized in that,
Described insulating trip (50) is between described 1st lead division (35) and the 2nd lead division (45).
5. shell carrying type parallel connection type capacitor according to claim 2, is characterized in that,
Described 1st, the 2nd lead division (35,45) coating in flat is with megohmite insulant.
6. shell carrying type parallel connection type capacitor according to claim 5, is characterized in that,
Described 1st, the 2nd lead division (35,45), by process of sandblasting, after surface forms fine scar, is coated with a kind of megohmite insulant be selected from epoxy resin, polyurethane, silicones.
7. shell carrying type parallel connection type capacitor according to claim 3, is characterized in that,
Also comprise staggered floor adjustment the 1st liner (71) be incorporated into above described 1st splicing ear (37) or at least one of staggered floor adjustment in the 2nd liner (73) be incorporated into below described 2nd splicing ear (47).
8. shell carrying type parallel connection type capacitor according to claim 3, is characterized in that,
At another side of described 1st lead division (35) and the 2nd lead division (45), the 1st, the 2nd guide ribs (75,76) is protruded to opposite side and is equipped with.
9. shell carrying type parallel connection type capacitor according to claim 4, is characterized in that,
The part (51) that the part being arranged in exterior shell (60) outside in described insulating trip (50) is exposed to outer casing (60) outside than described 1st lead division (35) and the 2nd lead division (45) is wider, formation is exposed to the exposed area (51a) between described 1st lead division (35) and the 2nd lead division (45)
1st lead division (35) is identical with described 2nd element wire connecting portion (41) with the 1st element wire connecting portion (31) with the thickness of the 2nd lead division (45), and Thickness Ratio the 1st lead division (35) and the 2nd lead division (45) of the 1st splicing ear (37) and the 2nd splicing ear (47) are thick.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120089063A KR101256347B1 (en) | 2012-08-14 | 2012-08-14 | Case molding type parallel condensor |
| KR10-2012-0089063 | 2012-08-14 | ||
| PCT/KR2012/008554 WO2014027720A1 (en) | 2012-08-14 | 2012-10-18 | Parallel capacitor installed in case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204596630U true CN204596630U (en) | 2015-08-26 |
Family
ID=48665164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201290000996.0U Expired - Lifetime CN204596630U (en) | 2012-08-14 | 2012-10-18 | Shell carrying type parallel connection type capacitor |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101256347B1 (en) |
| CN (1) | CN204596630U (en) |
| WO (1) | WO2014027720A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355426A (en) * | 2015-11-13 | 2016-02-24 | 纽茵泰克株式会社 | Light-weighting output terminal front lead-out type capacitor shell with improved heat radiation |
| CN108369863A (en) * | 2015-12-08 | 2018-08-03 | 三菱重工制冷空调系统株式会社 | Capacitor unit and power inverter |
| CN111292959A (en) * | 2016-02-25 | 2020-06-16 | 松下知识产权经营株式会社 | Thin film capacitor |
| CN115053308A (en) * | 2020-11-28 | 2022-09-13 | 纽茵泰克株式会社 | Capacitor with insert injection molding type metal plastic double-material shell |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204424090U (en) | 2014-11-28 | 2015-06-24 | 比亚迪股份有限公司 | Film capacitor |
| CN204332695U (en) * | 2014-11-28 | 2015-05-13 | 比亚迪股份有限公司 | For the film capacitor of electric automobile |
| JP7118939B2 (en) * | 2019-10-02 | 2022-08-16 | 株式会社デンソー | capacitor |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006338933A (en) | 2005-05-31 | 2006-12-14 | Fuji Heavy Ind Ltd | Electrode connecting structure of storage capacitor cell |
| JP4946618B2 (en) * | 2007-05-15 | 2012-06-06 | パナソニック株式会社 | Case mold type capacitor |
| KR101079128B1 (en) * | 2009-09-18 | 2011-11-02 | 주식회사 뉴인텍 | Capacotor |
| KR101098297B1 (en) * | 2010-03-08 | 2011-12-23 | 주식회사 뉴인텍 | capacitor module |
| KR101079129B1 (en) * | 2010-03-08 | 2011-11-02 | 주식회사 뉴인텍 | capacitor assembly |
-
2012
- 2012-08-14 KR KR1020120089063A patent/KR101256347B1/en active IP Right Grant
- 2012-10-18 CN CN201290000996.0U patent/CN204596630U/en not_active Expired - Lifetime
- 2012-10-18 WO PCT/KR2012/008554 patent/WO2014027720A1/en active Application Filing
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355426A (en) * | 2015-11-13 | 2016-02-24 | 纽茵泰克株式会社 | Light-weighting output terminal front lead-out type capacitor shell with improved heat radiation |
| CN108369863A (en) * | 2015-12-08 | 2018-08-03 | 三菱重工制冷空调系统株式会社 | Capacitor unit and power inverter |
| CN111292959A (en) * | 2016-02-25 | 2020-06-16 | 松下知识产权经营株式会社 | Thin film capacitor |
| CN111292959B (en) * | 2016-02-25 | 2021-10-15 | 松下知识产权经营株式会社 | Thin film capacitor |
| CN115053308A (en) * | 2020-11-28 | 2022-09-13 | 纽茵泰克株式会社 | Capacitor with insert injection molding type metal plastic double-material shell |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014027720A1 (en) | 2014-02-20 |
| KR101256347B1 (en) | 2013-05-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20150826 |