WO2014023041A1 - 有机电致发光二极管有机材料蒸镀用掩模装置 - Google Patents

有机电致发光二极管有机材料蒸镀用掩模装置 Download PDF

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Publication number
WO2014023041A1
WO2014023041A1 PCT/CN2012/080289 CN2012080289W WO2014023041A1 WO 2014023041 A1 WO2014023041 A1 WO 2014023041A1 CN 2012080289 W CN2012080289 W CN 2012080289W WO 2014023041 A1 WO2014023041 A1 WO 2014023041A1
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Prior art keywords
mask
organic electroluminescent
size
plate
organic
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PCT/CN2012/080289
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English (en)
French (fr)
Inventor
吴泰必
吴元均
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US13/699,637 priority Critical patent/US20140041587A1/en
Priority to DE112012006798.3T priority patent/DE112012006798B4/de
Publication of WO2014023041A1 publication Critical patent/WO2014023041A1/zh
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60—Organic compounds having low molecular weight
    • H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
    • H10K85/624—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene containing six or more rings

Definitions

  • the present invention relates to an organic electroluminescent diode (OLED), and more particularly to a mask device for vapor deposition of an organic electroluminescent diode organic material.
  • Organic Light Emitting Diode Display also known as organic electroluminescent diode
  • OLED Organic Light Emitting Diode Display
  • organic electroluminescent diode is a new display technology developed since the mid-20th century. Compared with liquid crystal displays, organic electroluminescent diodes have all solid state, active illumination, high brightness, high contrast, ultra-thin, low cost, low power consumption, fast response, wide viewing angle, wide operating temperature range, easy flexible display, etc. advantage.
  • the structure of an organic electroluminescent diode generally includes: a substrate, an anode, a cathode, and an organic functional layer.
  • the principle of light emission is a very thin multilayer organic material vapor-deposited between the anode and the cathode, and is injected into the organic semiconductor film by a positive carrier. The combination produces luminescence.
  • the organic functional layer of the organic electroluminescent diode is generally composed of three functional layers, namely a Hole Transmittion Layer (HTL), an Emissive Layer (EML), and an Electron Transmittion (Electron Transmittion). Layer, ETL).
  • Each functional layer may be one layer, or more than one layer, such as a hole transport functional layer, sometimes subdivided into a hole injection layer and a hole transport layer; an electron transport functional layer, which may be subdivided into an electron transport layer and an electron
  • the injection layer but its functions are similar, so it is collectively referred to as a hole transport functional layer and an electron transport functional layer.
  • the production method of full-color organic electroluminescent diode is mainly composed of red, green and blue (RGB) three-color parallel independent illumination method, white light plus color filter method and color conversion method, among which red, green and blue are juxtaposed.
  • RGB red, green and blue
  • Independent luminescence has the most potential and is the most practical.
  • the magnetic adsorption of the metal mask causes different blocks of different quality to be adsorbed in different order, so that the opening of the mask is not effectively flattened at a fixed designated position.
  • organic electroluminescent diodes especially active matrix organic light-emitting diodes
  • AMOLED Active Matrix Organic Light Emitting Diode
  • An object of the present invention is to provide a mask device for vapor deposition of an organic electroluminescent diode organic material, wherein the mask ineffective area of the device does not have a difference between the quality of the ineffective area and the quality of the active area of the mask by providing an opening. Therefore, the difference in the adsorption order caused by the difference in the quality of the effective area and the ineffective area of the mask during the adsorption of the disk, and the resulting shift of the pixel position are solved, and the non-steaming of the organic material to the substrate is avoided by providing the mask cover. Plating area.
  • the present invention provides a mask device for vapor deposition of an organic electroluminescent diode organic material, comprising: a mask frame; a mask cover attached to the side of the mask frame facing the vapor deposition surface; Forming a mask on the mask, the mask frame is rectangular, and a rectangular receiving port is disposed therebetween, and the size of the receiving port is adjusted by adjusting a mounting position of the mask, and the mask is evenly distributed. Covered with several openings.
  • the mask is made of a non-magnetic material, and the mask is made of a magnetic material.
  • the mask cover is made of stainless steel.
  • the mask cover is fixedly mounted on the mask frame.
  • the reticle is a whole stencil or is spliced by several stencils.
  • the size of the receiving opening is equal to the size of the light emitting layer on the glass substrate of the organic electroluminescent diode to be evaporated.
  • a magnetic disk disposed above the glass substrate of the organic electroluminescent diode to be evaporated, the magnetic disk being disposed corresponding to the mask frame, and the size of the magnetic disk being greater than or equal to the size of the mask frame.
  • the openings have the same structure and size, which are disposed corresponding to sub-pixel points of the pixel units of the light-emitting layer on the glass substrate of the organic electroluminescent diode to be evaporated.
  • the opening is a slit type opening.
  • the opening is a slot type opening.
  • the invention also provides a mask device for organic material vapor deposition organic material evaporation, which comprises a mask frame, a mask plate mounted on the side of the mask frame facing the two sides of the mask frame toward the vapor deposition surface, and a mask plate attached to the mask cover.
  • the mask frame has a rectangular shape with a rectangular shape therebetween.
  • the accommodating port adjusts the size of the accommodating opening by adjusting the mounting position of the mask, and the reticle is evenly covered with a plurality of openings;
  • the mask is made of a non-magnetic material, and the mask is made of a magnetic material;
  • cover plate is made of stainless steel
  • the mask cover is fixedly mounted on the mask frame
  • the mask is an entire stencil or is spliced by several stencils;
  • the size of the receiving port is equal to the size of the light emitting layer on the glass substrate of the organic electroluminescent diode to be evaporated;
  • a magnetic disk disposed above the glass substrate of the organic electroluminescent diode to be evaporated, the magnetic disk being disposed corresponding to the mask frame, and the size of the magnetic disk being greater than or equal to the size of the mask frame;
  • the openings have the same structure and size, and are disposed corresponding to sub-pixel points of the pixel units of the light-emitting layer on the glass substrate of the organic electroluminescent diode to be evaporated;
  • the opening is a slit type opening.
  • the mass distribution of the mask of the organic electroluminescent diode organic material vapor deposition mask device according to the present invention is relatively uniform, thereby avoiding the adsorption order of different quality blocks in the case of magnetic adsorption of the mask.
  • FIG. 1 is a schematic structural view of an embodiment of a mask device for vapor deposition of an organic electroluminescent diode organic material according to the present invention
  • FIG. 2 is a schematic structural view of a mask cover in the mask device illustrated in FIG. 1; 3 is a schematic structural view of a mask plate in the mask device of FIG. 1; FIG. 4 is a schematic structural view of another embodiment of a mask device for vapor deposition of an organic electroluminescent diode organic material according to the present invention;
  • Fig. 5 is a view showing the structure of still another embodiment of the organic electroluminescent diode organic material vapor deposition mask device of the present invention. detailed description
  • the present invention provides a mask device for vapor deposition of an organic electroluminescent diode organic material, comprising: a mask frame 2 mounted on the side of the mask frame 2 opposite to the vapor deposition surface The mask cover 4 and the mask 6 attached to the mask cover 4.
  • the mask frame 2 has a rectangular shape with a rectangular receiving opening 20 therebetween.
  • the size of the receiving opening 20 corresponds to the size of the light emitting layer of the substrate of the vapor-deposited organic electroluminescent diode.
  • the mask cover 4 is fixedly mounted on the mask frame 2, and is made of a non-magnetic material, preferably stainless steel (SUS). When vapor deposition, it can be adjusted by adjusting the position of the mask cover 4 mounted on the mask frame 2.
  • the accommodating port 20 is sized to match the size of the luminescent layer of the glass substrate of the organic electroluminescent diode to be evaporated, and to prevent the organic material from adhering to the non-evaporation zone of the substrate.
  • the mask 6 is made of a magnetic material (e.g., iron or the like), and is hooked with a plurality of openings 62.
  • the opening 62 is a slit-type opening.
  • the openings 62 have the same structure and size, which are disposed corresponding to the sub-pixel points of the pixel units of the light-emitting layer on the glass substrate of the organic electroluminescent diode to be evaporated.
  • the mask 6 is an entire stencil.
  • the present invention provides an organic electroluminescent diode organic material evaporation mask device further comprising a magnetic disk (not shown) disposed above the glass substrate of the organic electroluminescent diode to be evaporated, the magnetic disk corresponding to the mask frame 2 is provided for adsorbing the mask 6 to the surface to be vapor-deposited of the glass substrate of the organic electroluminescent diode to be evaporated, and adsorbing the mask frame 2 to press the mask 6.
  • the size of the disk is greater than or equal to the size of the mask frame 2.
  • the mass distribution of the entire mask 6 is relatively uniform, and the disk is adsorbed at the same time in the adsorption mask 6, thereby avoiding the difference in quality between the effective area and the ineffective area in the prior art.
  • the magnetic disk adsorbs the mask 6 on the surface to be vapor-deposited of the glass substrate of the organic electroluminescent diode to be evaporated, and adsorbs the mask frame 2 and the mask 4 to the mask 6
  • the mask frame 2 and the mask 4 are closely attached to the mask 6 and further An evaporation effective region and an evaporation ineffective region are formed on the mask 6 to realize an evaporation process.
  • FIG. 4 is a schematic structural view of another embodiment of an organic electroluminescent diode organic material vapor deposition mask device according to the present invention.
  • the opening 62 of the mask 6 is a slot type opening.
  • the opening 62 has the same structure and size, and is disposed corresponding to a sub-pixel point of the pixel unit of the light-emitting layer on the glass substrate of the organic electroluminescent diode to be evaporated.
  • FIG. 5 is a schematic structural view of another embodiment of an organic electroluminescent diode organic material evaporation mask device according to the present invention.
  • the mask plate 6" is formed by splicing two stencils.
  • the openings 62 on the mask 6" are slot-type openings, and the openings 62 have the same structure and size, and correspond to the sub-pixels of the pixel unit on the glass substrate of the organic electroluminescent diode to be evaporated.
  • Pixel point setting the two screens have the same structure and size, and the gap width between them is equal to the width of the sub-pixel point of the pixel unit of the light-emitting layer on the glass substrate of the organic electroluminescent diode to be evaporated, and further An entire sub-pixel point is formed at the gap, and the entire sub-pixel point may be any one of R, G, and B three-color sub-pixels.
  • the mask of the organic electroluminescent diode organic material evaporation mask of the present invention has a uniform mass distribution, thereby avoiding the difference in the order of adsorption of the different masses of the blocks caused by the magnetic attraction of the mask, resulting in a pixel position deviation.
  • the problem of migration; the mask device avoids the organic material adhering to the non-evaporation zone of the substrate, reduces the production cost of the organic electroluminescent diode, improves the production efficiency, and facilitates evaporation of the large-sized organic electroluminescent diode.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Description

有机电致发光二极管有机材料蒸镀用掩模装置 技术领域
本发明涉及有机电致发光二极管 （OLED ) , 尤其涉及一种有机电致 发光二极管有机材料蒸镀用掩模装置。 背景技术
有机发光二极管或有机发光显示器 （Organic Light Emitting Diode Display, OLED ) 又称为有机电致发光二极管， 是自 20世纪中期发展起来 的一种新型显示技术。 与液晶显示器相比， 有机电致发光二极管具有全固 态、 主动发光、 高亮度、 高对比度、 超薄、 低成本、 低功耗、 快速响应、 宽视角、 工作温度范围宽、 易于柔性显示等诸多优点。 有机电致发光二极 管的结构一般包括： 基板、 阳极、 阴极和有机功能层， 其发光原理是通过 阳极和阴极间蒸镀的非常薄的多层有机材料， 由正负载流子注入有机半导 体薄膜后复合产生发光。 有机电致发光二极管的有机功能层， 一般由三个 功能层构成， 分别为空穴传输功能层（Hole Transmittion Layer, HTL ) 、 发光功能层 （ Emissive Layer , EML ) 、 电子传输功能层 （ Electron Transmittion Layer, ETL ) 。 每个功能层可以是一层， 或者一层以上， 例 如空穴传输功能层， 有时可以细分为空穴注入层和空穴传输层； 电子传输 功能层， 可以细分为电子传输层和电子注入层， 但其功能相近， 故统称为 空穴传输功能层， 电子传输功能层。
目前， 全彩有机电致发光二极管的制作方法以红绿蓝 （RGB )三色并 列独立发光法、 白光加彩色滤光片法、 色转换法三种方式为主， 其中红绿 蓝三色并列独立发光法最有潜力， 实际应用最多。
在以红绿蓝三色并列独立发光法制作有机电致发光二极管的制作过程 中， 需要使用金属掩模板来达到对玻璃基板上发光层的发光像素部分区域 蒸镀有机材料以实现彩色显示。 金属掩模板的开口大小取决于待蒸镀的有 机电致发光二极管玻璃基板的发光层的大小， 蒸镀前位于玻璃基板下方的 磁盘吸附金属掩模板使其完全平贴玻璃基板上， 进而避免阴影效应 ( shadow effect ) 的产生而影响蒸镀质量。 然而， 由于金属掩模板的开口 有效区块与无效区块质量不同， 导致磁力吸附金属掩模板时造成质量不同 的区块吸附先后顺序不一， 使掩模板开口未能有效平贴于固定指定位置。 而且， 随着有机电致发光二极管的发展， 尤其是主动矩阵式有机发光二极 管 （Active Matrix Organic Light Emitting Diode, AMOLED ) 的发展， 有机 电致发光二极管产品尺寸及玻璃基板尺寸都在不断增加， 这就要求蒸镀金 属掩模板的尺寸不断增大， 但是金属掩模板一般都很薄 （一般不超过 50um ) , 而且有机电致发光二极管蒸镀工艺要求金属掩模板和玻璃基板之 间要有很高的对位精度（金属掩模板单元器件与玻璃基板的像素单元之间 对位误差在 -3um~+3um ) , 因此， 随着有机电致发光二极管大尺寸化的生 产， 往往会产生由于金属掩模板与玻璃基板之间对位不准导致有机材料蒸 镀到其他区域， 造成产品不良， 极大影响了生产效率和生产成本。 发明内容
本发明的目的在于提供一种有机电致发光二极管有机材料蒸镀用掩模 装置， 所述装置的掩模板无效区通过设置开口使该无效区质量和所述掩模 板有效区质量不存在差异， 从而解决了磁盘吸附时因掩模板有效区和无效 区的质量不同造成的吸附顺序差异， 及由此产生的像素位置偏移的问题， 并通过设置掩盖板避免了有机材料附着于基板的非蒸镀区。
为实现上述目的， 本发明提供一种有机电致发光二极管有机材料蒸镀 用掩模装置， 包括： 一掩模框架、 安装于该掩模框架相对两边框朝向蒸镀 面侧的掩盖板及贴合于该掩盖板上的掩模板， 所述掩模框架呈矩形， 其中 间设有矩形的容置口， 通过调整掩盖板的安装位置调整所述容置口的大 小， 所述掩模板上均匀布满数个开口。
所述掩盖板由无磁性材料制成， 所述掩模板由磁吸性材料制成。
所述掩盖板由不锈钢制成。
所述掩盖板焊接固定安装于所述掩模框架上。
所述掩模板为一整张网板或由数张网板拼接而成。
所述容置口的大小等于待蒸镀的有机电致发光二极管的玻璃基板上的 发光层的大小。
还包括设于待蒸镀的有机电致发光二极管的玻璃基板上方的磁盘， 该 磁盘对应所述掩模框架设置， 且该磁盘的大小大于或等于所述掩模框架的 大小。
所述开口具有相同的结构与大小， 其对应待蒸镀的有机电致发光二极 管的玻璃基板上的发光层像素单元的子像素点设置。
所述开口为缝隙型开口。
所述开口为插槽型开口。
本发明还提供一种有机电致发光二极管有机材料蒸镀用掩模装置， 包 括： 一掩模框架、 安装于该掩模框架相对两边框朝向蒸镀面侧的掩盖板及 贴合于该掩盖板上的掩模板， 所述掩模框架呈矩形， 其中间设有矩形的容 置口， 通过调整掩盖板的安装位置调整所述容置口的大小， 所述掩模板上 均匀布满数个开口；
其中， 所述掩盖板由无磁性材料制成， 所述掩模板由磁吸性材料制 成；
其中， 所述掩盖板由不锈钢制成；
其中， 所述掩盖板焊接固定安装于所述掩模框架上；
其中， 所述掩模板为一整张网板或由数张网板拼接而成；
其中， 所述容置口的大小等于待蒸镀的有机电致发光二极管的玻璃基 板上的发光层的大小；
还包括设于待蒸镀的有机电致发光二极管的玻璃基板上方的磁盘， 该 磁盘对应所述掩模框架设置， 且该磁盘的大小大于或等于所述掩模框架的 大小；
其中， 所述开口具有相同的结构与大小， 其对应待蒸镀的有机电致发 光二极管的玻璃基板上的发光层像素单元的子像素点设置；
其中， 所述开口为缝隙型开口。
本发明的有益效果： 本发明所述的有机电致发光二极管有机材料蒸镀 用掩模装置的掩模板的质量分布较均匀， 从而避免磁力吸附掩模板时造成 质量不同区块吸附先后顺序不一， 导致像素位置偏移的问题； 所述掩模装 置的掩模板的成本降低， 效率提高； 所述掩模装置避免了有机材料附着于 基板的非蒸镀区， 降低有机电致发光二极管的生产成本， 提高其生产效 率， 还有利于大尺寸有机电致发光二极管的蒸镀技术的发展。
为了能更进一步了解本发明的特征以及技术内容， 请参阅以下有关本 发明的详细说明与附图， 然而附图仅提供参考与说明用， 并非用来对本发 明加以限制。 附图说明
下面结合附图， 通过对本发明的具体实施方式详细描述， 将使本发明 的技术方案及其它有益效果显而易见。
附图中，
图 1 为本发明有机电致发光二极管有机材料蒸镀用掩模装置一实施例 的结构示意图；
图 2为图 1所述的掩模装置中的掩盖板的结构示意图； 图 3为图 1所述的掩模装置中的掩模板的结构示意图； 图 4为本发明有机电致发光二极管有机材料蒸镀用掩模装置另一实施 例的结构示意图；
图 5 为本发明有机电致发光二极管有机材料蒸镀用掩模装置又一实施 例的结构示意图。 具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果， 以下结合本发明 的优选实施例及其附图进行详细描述。
请参阅图 1 至图 3 , 本发明提供一种有机电致发光二极管有机材料蒸 镀用掩模装置， 包括： 一掩模框架 2、 安装于该掩模框架 2相对两边框朝 向蒸镀面侧的掩盖板 4及贴合于该掩盖板 4上的掩模板 6。
所述掩模框架 2呈矩形， 其中间设有矩形的容置口 20, 该容置口 20 的大小对应蒸镀的有机电致发光二极管的基板的发光层的大小设置。
所述掩盖板 4固定安装于所述掩模框架 2上， 其由非磁性材料制成， 优选不锈钢 ( SUS ) , 蒸镀时， 可通过调整掩盖板 4安装于掩模框架 2的 位置来调整该容置口 20 的大小， 以配合待蒸镀的有机电致发光二极管的 玻璃基板的发光层的大小， 并避免有机材料附着于基板的非蒸镀区。
所述掩模板 6 由磁吸性材料制成（如， 铁等） ， 上均勾布满数个开口 62, 在本实施例中， 所述开口 62为缝隙型开口。 所述开口 62具有相同的 结构与大小， 其对应待蒸镀的有机电致发光二极管的玻璃基板上的发光层 像素单元的子像素点设置。
在本实施例中， 所述掩模板 6为一整张网板。
本发明提供有机电致发光二极管有机材料蒸镀用掩模装置还包括一设 于待蒸镀的有机电致发光二极管的玻璃基板上方的磁盘（未图示） ， 该磁 盘对应所述掩模框架 2设置， 用于将掩模板 6吸附于待蒸镀的有机电致发 光二极管的玻璃基板的待蒸镀面上， 并吸附掩模框架 2 以压紧所述掩模板 6。 优选的， 该磁盘的大小大于或等于所述掩模框架 2 的大小。 由于所述 掩模板 6上均匀布满开口 62, 使得整个掩模板 6的质量分布较均匀， 磁盘 在吸附掩模板 6将同时吸附， 进而避免现有技术中因有效区和无效区的质 量差别较大而造成的吸附顺序差异， 及由此产生的像素位置偏移的现象。
蒸镀时， 所述磁盘吸附所述掩模板 6 于待蒸镀的有机电致发光二极管 的玻璃基板的待蒸镀面上， 并将掩模框架 2及掩盖板 4吸附于所述掩模板 6上， 这时， 所述掩模框架 2与掩盖板 4紧密贴合于掩模板 6上， 进而在 掩模板 6上形成蒸镀有效区及蒸镀无效区， 以实现蒸镀制程。
请参阅图 4为本发明有机电致发光二极管有机材料蒸镀用掩模装置另 一实施例的结构示意图， 在本实施例中， 所述掩模板 6，上的开口 62，为插 槽型开口， 所述开口 62，具有相同的结构与大小， 其对应待蒸镀的有机电 致发光二极管的玻璃基板上的发光层像素单元的子像素点设置。
请参阅图 5 为本发明有机电致发光二极管有机材料蒸镀用掩模装置又 一实施例的结构示意图， 在本实施例中， 所述掩模板 6"由两张网板拼接而 成， 所述掩模板 6"上的开口 62，为插槽型开口， 该些开口 62， 具有相同的 结构与大小， 其对应待蒸镀的有机电致发光二极管的玻璃基板上的发光层 像素单元的子像素点设置， 所述两网板具有相同的结构与大小， 其之间的 间隙宽度等于待蒸镀的有机电致发光二极管的玻璃基板上的发光层像素单 元的子像素点的宽度， 进而在该间隙处形成一整条的子像素点， 该整条的 子像素点可为 R、 G、 B三色子像素中的任意一个。
综上所述， 本发明有机电致发光二极管有机材料蒸镀用掩模装置的掩 模板的质量分布均匀， 从而避免磁力吸附掩模板时造成质量不同区块吸附 先后顺序不一， 导致像素位置偏移的问题； 所述掩模装置避免了有机材料 附着于基板的非蒸镀区， 降低有机电致发光二极管的生产成本， 提高其生 产效率， 还有利于大尺寸有机电致发光二极管的蒸镀技术的发展。
以上所述， 对于本领域的普通技术人员来说， 可以根据本发明的技术 方案和技术构思作出其他各种相应的改变和变形， 而所有这些改变和变形 都应属于本发明权利要求的保护范围。

Claims

权 利 要 求
1、 一种有机电致发光二极管有机材料蒸镀用掩模装置， 包括： 一掩 模框架、 安装于该掩模框架相对两边框朝向蒸镀面侧的掩盖板及贴合于该 掩盖板上的掩模板， 所述掩模框架呈矩形， 其中间设有矩形的容置口， 通 过调整掩盖板的安装位置调整所述容置口的大小， 所述掩模板上均匀布满 数个开口。
2、 如权利要求 1 所述的有机电致发光二极管有机材料蒸镀用掩模装 置， 其中， 所述掩盖板由无磁性材料制成， 所述掩模板由磁吸性材料制 成。
3、 如权利要求 2 所述的有机电致发光二极管有机材料蒸镀用掩模装 置， 其中， 所述掩盖板由不锈钢制成。
4、 如权利要求 1 所述的有机电致发光二极管有机材料蒸镀用掩模装 置， 其中， 所述掩盖板焊接固定安装于所述掩模框架上。
5、 如权利要求 1 所述的有机电致发光二极管有机材料蒸镀用掩模装 置， 其中， 所述掩模板为一整张网板或由数张网板拼接而成。
6、 如权利要求 1 所述的有机电致发光二极管有机材料蒸镀用掩模装 置， 其中， 所述容置口的大小等于待蒸镀的有机电致发光二极管的玻璃基 板上的发光层的大小。
7、 如权利要求 2 所述的有机电致发光二极管有机材料蒸镀用掩模装 置， 还包括设于待蒸镀的有机电致发光二极管的玻璃基板上方的磁盘， 该磁盘对应所述掩模框架设置， 且该磁盘的大小大于或等于所述掩模框架 的大小。
8、 如权利要求 1 所述的有机电致发光二极管有机材料蒸镀用掩模装 置， 其中， 所述开口具有相同的结构与大小， 其对应待蒸镀的有机电致发 光二极管的玻璃基板上的发光层像素单元的子像素点设置。
9、 如权利要求 8 所述的有机电致发光二极管有机材料蒸镀用掩模装 置， 其中， 所述开口为缝隙型开口。
10、 如权利要求 8所述的有机电致发光二极管有机材料蒸镀用掩模装 置， 其中， 所述开口为插槽型开口。
11、 一种有机电致发光二极管有机材料蒸镀用掩模装置， 包括： 一掩 模框架、 安装于该掩模框架相对两边框朝向蒸镀面侧的掩盖板及贴合于该 掩盖板上的掩模板， 所述掩模框架呈矩形， 其中间设有矩形的容置口， 通 过调整掩盖板的安装位置调整所述容置口的大小， 所述掩模板上均匀布满 数个开口；
其中， 所述掩盖板由无磁性材料制成， 所述掩模板由磁吸性材料制 成；
其中， 所述掩盖板由不锈钢制成；
其中， 所述掩盖板焊接固定安装于所述掩模框架上；
其中， 所述掩模板为一整张网板或由数张网板拼接而成；
其中， 所述容置口的大小等于待蒸镀的有机电致发光二极管的玻璃基 板上的发光层的大小；
还包括设于待蒸镀的有机电致发光二极管的玻璃基板上方的磁盘， 该 磁盘对应所述掩模框架设置， 且该磁盘的大小大于或等于所述掩模框架的 大小；
其中， 所述开口具有相同的结构与大小， 其对应待蒸镀的有机电致发 光二极管的玻璃基板上的发光层像素单元的子像素点设置；
其中， 所述开口为缝隙型开口。
PCT/CN2012/080289 2012-08-10 2012-08-17 有机电致发光二极管有机材料蒸镀用掩模装置 Ceased WO2014023041A1 (zh)

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