WO2014023030A1 - 电子设备 - Google Patents
电子设备 Download PDFInfo
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- WO2014023030A1 WO2014023030A1 PCT/CN2012/079982 CN2012079982W WO2014023030A1 WO 2014023030 A1 WO2014023030 A1 WO 2014023030A1 CN 2012079982 W CN2012079982 W CN 2012079982W WO 2014023030 A1 WO2014023030 A1 WO 2014023030A1
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- WIPO (PCT)
- Prior art keywords
- printed circuit
- electronic device
- heat
- circuit board
- perforation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Definitions
- the present invention relates to electronic devices, and more particularly to an electronic device having a heat generating component.
- High-power communication equipment such as relay stations, car platforms and channel machines need to use heat-generating components such as power amplifier tubes with high power. It is the key to heat-generating components to have good heat dissipation and ensure stable electrical performance.
- Many of the heat-generating components in the related art are directly soldered on a printed circuit board, and the printed circuit board is assembled to the heat sink.
- heat cannot be quickly transferred to the heat sink. The heat accumulates on the heating components, causing the temperature of the heating components to rise sharply, affecting the normal operation of the heating components, and the severe conditions may cause the heating components to be burned out.
- the technical problem to be solved by the present invention is to provide an improved electronic device and a method of manufacturing the same according to the above-mentioned deficiencies in the related art.
- the technical solution adopted by the present invention to solve the technical problem is to construct an electronic device including a printed circuit board and at least one heat generating component, the printed circuit board including a printed circuit corresponding to the at least one heat generating component, a surface and a second surface opposite the first surface; the printed circuit board includes a escaping through slot, the evasive channel extending from the first surface to the second surface; the electronic device further The heat conducting member includes a third surface and a fourth surface opposite to the third surface, the third surface is coupled to the second surface; the at least one heat generating component is disposed at the avoidance
- the through slot is electrically connected to the printed circuit and thermally coupled to the third surface.
- the third surface is soldered to the second surface, and the at least one heat generating component is soldered to the third surface.
- the at least one heat generating component includes at least one lead, the printed circuit is formed on the first surface, and the at least one lead is soldered to the first surface to be electrically connected to the printed circuit .
- the third surface is formed with a plating layer.
- the electronic device includes a heat sink, a second surface of the printed circuit board is attached to the heat sink; the heat sink includes a mating surface that mates with a second surface of the printed circuit board, A receiving groove is formed on the mating surface; the heat conducting member is received in the receiving groove and is in heat conduction contact with the heat sink.
- the heat sink includes a buffer shallow groove disposed at a periphery of the accommodating groove, and the heat conducting member has a thickness equal to or slightly larger than a depth of the accommodating groove.
- the electronic device includes a buckle, the buckle includes a pressing member made of a material having good thermal conductivity and heat dissipation performance, and the pressing member is pressed against the first surface of the printed circuit board, and Bonding to the top surface of the at least one heat generating component.
- the two ends of the bottom surface of the accommodating groove are respectively formed with at least one locking hole, and the two ends of the heat conducting member are respectively provided with at least one first through hole corresponding to the at least one locking hole, the printed circuit Forming at least one second perforation corresponding to the at least one first perforation, the two ends of the pressing member are respectively formed with at least one third perforation corresponding to the at least one second perforation;
- the buckle includes at least one fastener, the at least one fastener sequentially locking through the at least one third perforation, the at least one second perforation, and the at least one first perforation in the at least one locking hole in.
- Two ends of the pressing member respectively protrude downwardly, and an accommodating space is formed between the two legs; the two legs are pressed against the printed circuit board a surface of the accommodating space is thermally conductively attached to the top surface of the at least one heat generating component; the at least one third through hole includes two third through holes, and the two third through holes are respectively The two legs are longitudinally penetrated.
- the at least one second through hole is in communication with the escape route.
- the beneficial effects of the present invention are: compared with the related art, since the printed circuit board includes the escaping through slot, and the electronic device further includes a heat conducting member, the heat generating component is disposed in the escaping through groove and thermally coupled to the heat conducting member So that the heat generated by the heating components can be better derived.
- FIG. 1 is a perspective assembled view of an electronic component of an electronic device in some embodiments of the present invention.
- FIG. 2 is a perspective exploded view of the electronic component shown in FIG. 1;
- Figure 3 is a longitudinal cross-sectional view of the electronic component of Figure 1;
- FIG. 4 is a schematic perspective view of an electronic device in some embodiments of the present invention.
- FIG. 5 is a perspective exploded view of the electronic device shown in FIG. 4;
- FIG. 6 is a cross-sectional view of the electronic device of FIG. 4 when the electronic component is mounted on the heat sink;
- Figure 7 is a partial enlarged view of the circle I in Figure 6.
- FIG. 1 through 3 illustrate an electronic component 10 in an electronic device 1 in some embodiments of the invention, which in some embodiments may include a printed circuit board 11 and two mounted on a printed circuit board 11 The heat generating component 13 and the heat conducting member 15.
- the printed circuit board 11 may, in some embodiments, include a first surface 111 and a second surface 112 opposite the first surface 111, on which a printed circuit may be disposed, it being understood that the printed circuit is not limited It is arranged on the first surface 111, which can also be arranged in the middle or on the second surface 112 of the printed circuit board 11.
- a central portion of the printed circuit board 11 is formed with a escaping channel 110 that is substantially rectangular in some embodiments and that extends from the first surface 111 of the printed circuit board 11 to the second surface 112.
- Two through holes 113 and 114 are formed at two ends of the avoidance through groove 110 for the fastener 30 to be worn.
- the two through holes 113, 114 of the printed circuit board 11 are also in communication with the escaping slot 110.
- the arrangement has at least the following advantages: (1) the space of the printed circuit board 11 can be effectively saved, and is convenient. (2) making the edges of the two through holes 113, 114 of the printed circuit board 11 more susceptible to a slight deformation under control, and better matching the buffer groove 212 of the heat sink 20; (3) The distance between the two perforations 153, 154 of the heat conducting plate is reduced as much as possible to ensure that the heat conducting plate 15 has better strength and is less susceptible to deformation by force.
- the heat transfer member 15 is substantially rectangular in some embodiments, and may be made of a material having excellent thermal conductivity such as copper, aluminum, and a plate type heat pipe, and the heat conductive member 15 may include a third surface 151 and a first surface opposite to the third surface 151. Four surfaces 152.
- the two ends of the heat conducting member 15 are respectively formed with two through holes 153, 154 corresponding to the two through holes 113, 114 of the printed circuit board 11, respectively, for the fastener 30 to be worn.
- the third surface 151 of the heat conducting member 15 is soldered to the second surface 112 of the printed circuit board 11 and partially or wholly covered on the evasive channel 110 on the printed circuit board 11 to ensure excellent grounding.
- the third surface 151 of the heat conductive member 15 may be formed with a plating layer to improve solderability, reduce the porosity of the solder, and make the contact between the heat conductive member 15 and the printed circuit board 11 tighter and more fully, and the heat dissipation effect is obtained. More ideal.
- the heat generating component 13 may be in the form of a block in some embodiments, and includes a bottom surface 131 and a top surface 132 opposite to the bottom surface 131. The opposite sides of the heat generating component 13 respectively extend outwardly from the two pins 133, 134.
- the heat generating component 13 is disposed in the avoidance channel 110, and the bottom surface 131 is soldered to the third surface 151 of the heat conducting component 15 to transfer heat generated by the heat generating component 13 from the bottom surface 131 to the heat conducting component 15 by the heat conducting component. 15 passed out to ensure excellent heat dissipation and grounding.
- the two leads 133, 134 of the heat generating component 13 are soldered to the first surface 111 of the printed circuit board 11 and electrically connected to the printed circuit on the first surface 111 of the printed circuit board 11.
- the heat generating component 13 may be, but is not limited to, a power amplifier tube of a high power communication device such as a repeater, a vehicle, and a channel machine in some embodiments.
- the number of the heat generating components 13 is not limited to two, one or two or more; the shape of the heat generating component 13 is not limited to a square shape, for example, may be cylindrical; the heat generating component 13
- the number of pins is not limited to two, for example, one or two or more.
- the position of the pins is not limited to the side of the heat generating component 13, and may be provided, for example, at the top of the heat generating component 13.
- FIGS. 4 and 5 illustrate an electronic device 1 in some embodiments of the invention, which may include an electronic component 10, a heat sink 20, and a clip 30.
- the electronic component 10 is disposed on the heat sink 20 to dissipate heat by the heat sink 20.
- the clip 30 is pressed against the electronic component 10, and the electronic component 10 and the heat sink 20 are tightly fastened together, so that the whole electronic device 1 is integrated into one body, and the electronic component 10 and the heat sink 20 can be ensured well. Hot contact.
- the heat sink 20 can include a base 21 and a plurality of spaced apart fins 23 extending from the base 21 in some embodiments.
- the base 21 is generally rectangular parallelepiped in some embodiments and includes a mating face 210 that mates with the electronic component 10.
- the receiving surface 210 is recessed to form a receiving groove 211.
- the depth of the receiving groove 211 ie, the distance between the bottom surface of the buffering shallow groove 212 and the bottom surface of the receiving groove 211) is equal to or slightly smaller than the thickness of the heat conducting member 15.
- Two locking holes 213, 214 are formed in the two ends of the bottom surface of the accommodating groove 211, respectively, for the fastener 30 to be locked therein.
- the locking holes 213, 214 may be screw holes in some embodiments.
- the size of the receiving groove 211 is adapted to the size of the heat conducting member 15 for the heat conducting member 15 of the electronic component 10 to be received therein, so that the heat on the heat conducting member 15 can be better transmitted to the base 21, the base 21
- the heat is transferred to the heat dissipation fins 23 to be dissipated.
- an appropriate amount of thermal conductive glue (not shown) may be disposed in the accommodating groove 211.
- a fan (not shown) may be added to blow the heat dissipation fins 23.
- the mating face 210 of the base 21 is also recessed in some embodiments to form a buffer shallow groove 212 that surrounds the receiving groove 211.
- a slit is formed between the second surface 112 of the printed circuit board 11 and the bottom surface of the buffer shallow groove 212.
- the printed circuit board 11 is slightly bent downward to be in contact with the bottom surface of the buffer shallow groove 212 under the pressing force of the buckle 30.
- the heat conductive member When the thickness of 15 is equal to or slightly larger than the depth of the accommodating groove 211, the fourth surface 152 of the heat conducting member 15 can be in close contact with the bottom surface of the accommodating groove 211 of the heat sink 20, so that the dimensional tolerance band can be better absorbed. The assembly error comes to ensure that the heat conducting member 15 is in full contact with the heat sink 20.
- the buckle 30 can include a pressing member 31 and two locking members 32 that are disposed in the pressing member 31 in some embodiments.
- the pressing member 31 can be made of a metal material having good thermal conductivity and heat dissipation performance in some embodiments, and two legs 33, 34 are respectively protruded downwardly from opposite ends thereof, and the two legs 33, 34 are respectively protruded.
- An accommodating space 37 is formed therebetween, and the pressing member 31 is formed in a U shape as a whole.
- the two ends of the pressing member 31 are respectively open with two through holes 35, 36 extending through the two legs 33, 34 in the axial direction, and the two through holes 35, 36 and the two through holes 113 on the printed circuit board 11, respectively. , 114 corresponds.
- the two fasteners 32 are threaded into the two perforations 35, 36, which in some embodiments may be bolts.
- the number of the locks 32 is not limited to two, and may be one or two or more; correspondingly, the crimping member 31, the printed circuit board 11 and the heat conducting member 15 have perforations corresponding to the locking member 32.
- the number and the number of corresponding locking holes on the heat sink 20 may also be one or two or more.
- the buckle 30 is not limited to the engagement of the pressing member 31 and the locking member 32, and other similar clamps are also possible.
- the electronic component 10 When the electronic device 1 is assembled, the electronic component 10 can be placed on the mating surface 210 of the base 21 of the heat sink 20, and the heat conducting member 15 of the electronic component 10 can be received in the receiving slot 211 of the base 21, in some
- an appropriate amount of thermal conductive glue (not shown) may be disposed in the accommodating groove 211.
- the pressing member 31 of the clip 30 is then placed on the first surface 111 of the printed circuit board 11 of the electronic component 10, and the two through holes 35, 36 of the pressing member 31 are respectively associated with the two on the printed circuit board 11.
- the through holes 113 and 114 are opposite to each other, and the two heat generating components 13 of the electronic component 10 are received in the accommodating space 37 of the pressing member 31, and the top surface 133 of the two heat generating components 13 and the bottom surface of the accommodating space 37 are
- the top surface 133 of the two heat generating components 13 and the bottom surface of the accommodating space 37 may be An appropriate amount of thermal adhesive 40 is disposed between them.
- the two locking members 32 of the clip 30 are sequentially passed through the through holes 35, 36 on the pressing member 31, the through holes 113, 114 on the printed circuit board 11, and the through holes 153, 154 on the heat conducting member 15, respectively.
- the grounding is fixed in the locking holes 213, 214 on the heat sink 20, and the entire electronic device 1 is assembled.
- the pressing member 31 is mounted above the heat generating component 13, and the two legs 33, 34 are pressed against the first surface 111 of the printed circuit board 11, in addition to having the electronic component 10 firmly It is fixed to the heat sink 20 to ensure good thermal contact between the heat conducting member 15 and the heat sink 20. It is also possible to increase the force receiving area of the printed circuit board 11, so that the force of the printed circuit board 11 is more uniform and local stress is avoided. The resulting deformation.
- the pressing member 31 is made of a material having good thermal conductivity and heat dissipation performance, it can also increase the heat dissipation effect of the top surface of the heat generating component 13.
- the heat generated by the heat generating component 13 is transferred from the bottom surface 131 to the heat conducting member 15, and the heat conducting member 15 transfers heat to the heat sink 20, and the heat is radiated by the heat sink 20.
- a small portion of the heat generated by the heat generating component 13 is transmitted from the top surface to the pressing member 31, and the heat is dissipated by the pressing member 31.
- the heat generated by the heat generating component 13 can avoid excessive accumulation and can achieve better protection.
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Abstract
提供一种电子设备，包括印刷电路板以及至少一个发热元器件（13）。印刷电路板包括与至少一个发热元器件（13）对应的印刷电路、第一表面（111）以及与第一表面（111）相对的第二表面（112）；印刷电路板包括避位通槽（110），其由第一表面（111）贯穿至第二表面（112）。电子设备还包括导热件（15），其包括第三表面(151）以及与第三表面（151）相对的第四表面（152），第三表面（151）结合于第二表面（112）。至少一个发热元器件（13）设置于避位通槽（110）中，与印刷电路电性连接并导热地结合于第三表面（151）上。
Description
本发明涉及电子设备，更具体地说，涉及一种具有发热元器件的电子设备。
诸如中转台、车台及信道机等大功率通信设备，需要使用功率较大的功放管等发热元器件，具备良好的散热性及保证稳定的电性能指标是发热元器件的关键。相关技术中的很多发热元器件都是直接锡焊在印刷电路板上，印刷电路板再装配到散热器上，然而，由于印刷电路板的纵向导热性差，不能快速地将热量传递到散热器上，热量聚集在发热元器件上，导致发热元器件的温度急剧升高，影响发热元器件的正常工作，严重的情况还会导致发热元器件被烧坏。
本发明要解决的技术问题在于，针对相关技术中的上述不足，提供一种改进的电子设备及制造该电子设备的方法。
本发明解决其技术问题所采用的技术方案是：构造一种电子设备，包括印刷电路板以及至少一个发热元器件，所述印刷电路板包括与所述至少一个发热元器件对应的印刷电路、第一表面以及与该第一表面相对的第二表面；所述印刷电路板包括避位通槽，所述避位通槽由所述第一表面贯穿至所述第二表面；所述电子设备还包括导热件，所述导热件包括第三表面以及与该第三表面相对的第四表面，所述第三表面结合于所述第二表面；所述至少一个发热元器件设置于所述避位通槽中，与所述印刷电路电性连接，并导热地结合于所述第三表面上。
在本发明所述的 电子设备中
，所述第三表面焊接于所述第二表面上，所述至少一个发热元器件焊接于所述第三表面上。
在本发明所述的 电子设备中
，所述至少一个发热元器件包括至少一个引脚，所述印刷电路形成于所述第一表面上，所述至少一个引脚焊接于所述第一表面上，与所述印刷电路电性连接。
在本发明所述的 电子设备中 ，所述第三表面形成有电镀层。
在本发明所述的 电子设备中
，所述电子设备包括散热器，所述印刷电路板的第二表面贴合在所述散热器上；所述散热器包括与所述印刷电路板的第二表面相配合的配合面，所述配合面上形成有容置槽；所述导热件收容于该容置槽中，并与所述散热器导热地接触。
在本发明所述的 电子设备中
，所述散热器包括布置于所述容置槽外围的缓冲浅槽，所述导热件的厚度等于或略大于所述容置槽的深度。
在本发明所述的 电子设备中
，所述电子设备包括扣具，所述扣具包括采用导热性能及散热性能良好的材料制成的抵压件，所述抵压件抵压在所述印刷电路板的第一表面上，并与所述至少一个发热元器件的顶面导热地贴合。
在本发明所述的 电子设备中
，所述容置槽的底面两端部分别形成有至少一个锁固孔，所述导热件的两端分别设有与所述至少一个锁固孔对应的至少一个第一穿孔，所述印刷电路板上形成有分别与所述至少一个第一穿孔对应的至少一个第二穿孔，所述抵压件的两端形成有分别与所述至少一个第二穿孔对应的至少一个第三穿孔；所述扣具包括至少一个锁固件，所述至少一个锁固件分别依次贯穿所述至少一个第三穿孔、所述至少一个第二穿孔以及所述至少一个第一穿孔锁固在所述至少一个锁固孔中。
在本发明所述的 电子设备中
，所述抵压件的两端分别向下伸出有两个支腿，所述两个支腿之间形成有容置空间；所述两个支腿抵压在所述印刷电路板的第一表面上，所述容置空间的底面导热地贴合于所述至少一个发热元器件的顶面；所述至少一个第三穿孔包括两个第三穿孔，所述两个第三穿孔分别沿纵向贯穿所述两个支腿。
在本发明所述的 电子设备中 ，所述至少一个第二穿孔与所述避位通槽相连通。
本发明的有益效果是：与相关技术相比，由于印刷电路板包括避位通槽，且电子设备还包括导热件，发热元器件设置于避位通槽中，并导热地结合于导热件上，使得发热元器件产生的热量能够较好地导出。
下面将结合附图及实施例对本发明作进一步说明，附图中：
图1是本发明一些实施例中的电子设备的电子组件的立体组装示意图；
图2是图1所示电子组件的立体分解示意图；
图3是图1所示电子组件的纵向剖面示意图；
图4是本发明一些实施例中的电子设备的立体组装示意图；
图5是图4所示电子设备的立体分解示意图；
图6是图4所示电子设备在电子组件安装到散热器上时的剖面示意图；
图7是图6中圆圈I处的局部放大图。
以下结合具体实施例和说明书附图对本发明做进一步详细说明。
图1至图3示出了本发明一些实施例中的电子设备1中的电子组件10，该电子组件10在一些实施例中可包括印刷电路板11以及安装于印刷电路板11上的两个发热元器件13和导热件15。
印刷电路板11在一些实施例中可包括第一表面111以及与该第一表面111相对的第二表面112，第一表面111上可布置有印刷电路，可以理解地，印刷电路并不局限于布置在第一表面111上，其也可以布置在印刷电路板11的中间或第二表面112上。印刷电路板11中部形成有避位通槽110，该避位通槽110在一些实施例中大致呈长方形，并由印刷电路板11的第一表面111贯穿至第二表面112。避位通槽110的两端分别形成有两个穿孔113、114，用于供扣具30穿置。
在一些实施例中，印刷电路板11的两个穿孔113、114还与避位通槽110相连通，如此设置至少具备如下诸多优点：（1）可以有效地节省印刷电路板11的空间，便于线路布板走线；（2）使印刷电路板11的两个穿孔113、114边缘在较小压力时更容易发生可控的轻微变形，更好的配合散热器20的缓冲槽212；（3）尽可能地缩小导热板的两个穿孔153、154的距离，保证导热板15具有更好的强度，受力不易变形。
传热件15在一些实施例中大致呈长方形，其可采用铜、铝以及板型热管等导热性能优良的材料制成，导热件15可包括第三表面151以及与第三表面151相对的第四表面152。导热件15的两端分别形成有两个穿孔153、154，该两个穿孔153、154分别与印刷电路板11的两个穿孔113、114对应，用于供扣具30穿置。导热件15的第三表面151焊接在印刷电路板11的第二表面112上，并部分地或全部地覆盖在印刷电路板11上的避位通槽110上，以保证优良的接地性。在一些实施例中，导热件15的第三表面151可形成有电镀层，以提高焊锡性，减少焊锡的孔隙率，使得导热件15与印刷电路板11的接触更紧密、更充分，散热效果更理想。
发热元器件13在一些实施例中可呈方块状，其包括底面131以及与底面131相对的顶面132，发热元器件13的两相对侧分别朝外延伸出两个引脚133、134。发热元器件13设置于该避位通槽110中，且底面131焊接于导热件15的第三表面151上，以将发热元器件13产生的热量从底面131传递给导热件15，由导热件15传递出去，保证优良的散热性和接地性。发热元器件13的两个引脚133、134均焊接于印刷电路板11的第一表面111上，与印刷电路板11的第一表面111上的印刷电路相电性连接。该发热元器件13在一些实施例中可以是但不限于中转台、车台及信道机等大功率通信设备的功放管。
可以理解地，发热元器件13的数量并不局限于两个，一个或两个以上也可以；发热元器件13的形状也不局限于方块状，例如可以呈圆柱状；发热元器件13的引脚数量也不局限于两个，例如一个或两个以上也可以；引脚的位置也不局限于设置于发热元器件13的侧部，例如，设置于发热元器件13的顶部也可以。
图4及图5示出了本发明一些实施例中的电子设备1，该电子设备1可包括电子组件10、散热器20以及扣具30。电子组件10设置在散热器20上，以借由散热器20进行散热。扣具30抵压在电子组件10上，将电子组件10与散热器20紧密地扣合在一起，使整个电子设备1组合成一个整体，并可以保证将电子组件10与散热器20之间良好的热接触。
再如图4及图5所示，散热器20在一些实施例中可包括基座21以及从基座21上延伸出来的若干间隔排列的散热鳍片23。基座21在一些实施例中大致呈长方体状，并包括一个与电子组件10相配合的配合面210。配合面210上内凹形成有一个容置槽211，容置槽211的深度（即缓冲浅槽212底面到容置槽211底面的距离）等于或略小于导热件15的厚度。容置槽211底面上的两端部分别形成有两个锁固孔213、214，以供扣具30锁固于其中，锁固孔213、214在一些实施例中可为螺孔。
容置槽211的尺寸与导热件15的尺寸相适配，以供电子组件10的导热件15容置于其中，让导热件15上的热量能够较好地传递给基座21，基座21再将热量传递给散热鳍片23散发出去。在一些实施例中，为了使热量更好地由导热件15传递给基座21，可在容置槽211中布置适量的导热胶（未图示）。在另一些实施例中，为了提高散热鳍片23的散热能力，还可增加风扇（未图示）对散热鳍片23进行吹风。
基座21的配合面210在一些实施例中还内凹形成一个缓冲浅槽212，该缓冲浅槽212环绕容置槽211。一同参阅图6及图7，当电子组件10放置在基座21的配合面210上时，印刷电路板11的第二表面112与缓冲浅槽212的底面之间形成有狭缝。当用扣具30将电子组件10安装到散热器20上时，印刷电路板11在扣具30的抵压下，轻微向下弯折即可与缓冲浅槽212的底面接触，如此，导热件15的厚度等于或略大于容置槽211的深度时，均能够使导热件15的第四表面152与散热器20的容置槽211的底面紧密接触，从而能够较好地吸收由尺寸公差带来的装配误差，保证导热件15与散热器20充分接触。
再如图5所示，扣具30在一些实施例中可包括抵压件31以及穿设于抵压件31中的两个锁固件32。抵压件31在一些实施例中可采用导热性能及散热性能均良好的金属材料制成，其两端分别向下伸出有两个支腿33、34，该两个支腿33、34之间形成有一个容置空间37，而使抵压件31整体呈U形。抵压件31的两端还分别开设有沿轴向贯穿该两个支腿33、34的两个穿孔35、36，该两个穿孔35、36分别与印刷电路板11上的两个穿孔113、114对应。该两个锁固件32穿置于该两个穿孔35、36中，锁固件32在一些实施例中可为螺栓。可以理解地，锁固件32的数量并不局限于两个，也可以是一个或两个以上；相应地，抵压件31、印刷电路板11以及导热件15上与锁固件32对应的穿孔的数量以及散热器20上对应的锁固孔的数量也可以是一个或两个以上。再可以理解地，扣具30并不局限于为抵压件31以及锁固件32的配合，其他的类似夹具也可以。
电子设备1组装时，可先将电子组件10放置到散热器20的基座21的配合面210上，并让电子组件10的导热件15收容在基座21的容置槽211中，在一些实施例中，为了提高导热件15与基座21之间的热传导能力，可先在容置槽211中布置适量的导热胶（未图示）。然后将扣具30的抵压件31放置到电子组件10的印刷电路板11的第一表面111上，并令抵压件31的两个穿孔35、36分别与印刷电路板11上的两个穿孔113、114正对，电子组件10的两个发热元器件13收容在抵压件31的容置空间37内，且该两个发热元器件13的顶面133与容置空间37的底面之间导热接触，在一些实施例中，为了提高该两个发热元器件13与抵压件31的热传导能力，还可在该两个发热元器件13的顶面133与容置空间37的底面之间设置适量的导热胶40。最后，将扣具30的两个锁固件32分别依次贯穿抵压件31上的穿孔35、36，印刷电路板11上的穿孔113、114，以及导热件15上的穿孔153、154之后，紧密地锁固在散热器20上的锁固孔213、214中，而将整个电子设备1组装完成。
在电子设备1中，抵压件31安装在发热元器件13上方，且该两个支腿33、34抵压在印刷电路板11的第一表面111上，其除具有将电子组件10牢固地固定到散热器20上，保证导热件15与散热器20良好的热接触的功能之外；还可以增加印刷电路板11的受力面积，使印刷电路板11的受力更加均匀，避免局部应力导致的变形。另外，由于抵压件31采用导热性能及散热性能良好的材料制成，其还可增加发热元器件13顶面的散热效果。
工作时，发热元器件13产生的热量大部分从底面131传递给导热件15，导热件15再将热量传递给散热器20，由散热器20将该部分热量散发出去。发热元器件13产生的热量的少部分从顶面传递给抵压件31，由抵压件31将热量散发出去。如此，发热元器件13产生的热量可以避免过多的积聚，可以达到较好地保护作用。
以上所述仅是本发明的优选实施方式，本发明的保护范围并不仅局限于上述实施例，凡属于本发明思路下的技术方案均属于本发明的保护范围。应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理前提下的若干个改进和润饰，这些改进和润饰也应视为本发明的保护范围。
Claims (10)
- 一种电子设备，包括印刷电路板以及至少一个发热元器件，所述印刷电路板包括与所述至少一个发热元器件对应的印刷电路、第一表面以及与该第一表面相对的第二表面，其特征在于，所述印刷电路板包括避位通槽，所述避位通槽由所述第一表面贯穿至所述第二表面；所述电子设备还包括导热件，所述导热件包括第三表面以及与该第三表面相对的第四表面，所述第三表面结合于所述第二表面；所述至少一个发热元器件设置于所述避位通槽中，与所述印刷电路电性连接，并导热地结合于所述第三表面上。
- 根据权利要求1所述的电子设备，其特征在于，所述第三表面焊接于所述第二表面上，所述至少一个发热元器件焊接于所述第三表面上。
- 根据权利要求2所述的电子设备，其特征在于，所述至少一个发热元器件包括至少一个引脚，所述印刷电路形成于所述第一表面上，所述至少一个引脚焊接于所述第一表面上，与所述印刷电路电性连接。
- 根据权利要求1-3任一项所述的电子设备，其特征在于，所述第三表面形成有电镀层。
- 根据权利要求1-3任一项所述的电子设备，其特征在于，所述电子设备包括散热器，所述印刷电路板的第二表面贴合在所述散热器上；所述散热器包括与所述印刷电路板的第二表面相配合的配合面，所述配合面上形成有容置槽；所述导热件收容于该容置槽中，并与所述散热器导热地接触。
- 根据权利要求5所述的电子设备，其特征在于，所述散热器包括布置于所述容置槽外围的缓冲浅槽，所述导热件的厚度等于或略大于所述容置槽的深度。
- 根据权利要求6所述的电子设备，其特征在于，所述电子设备包括扣具，所述扣具包括采用导热性能及散热性能良好的材料制成的抵压件，所述抵压件抵压在所述印刷电路板的第一表面上，并与所述至少一个发热元器件的顶面导热地贴合。
- 根据权利要求7所述的电子设备，其特征在于，所述容置槽的底面形成有至少一个锁固孔，所述导热件上设有与所述至少一个锁固孔对应的至少一个第一穿孔，所述印刷电路板上形成有与所述至少一个第一穿孔对应的至少一个第二穿孔，所述抵压件上形成有与所述至少一个第二穿孔对应的至少一个第三穿孔；所述扣具包括至少一个锁固件，所述至少一个锁固件依次贯穿所述至少一个第三穿孔、所述至少一个第二穿孔以及所述至少一个第一穿孔而锁固在所述至少一个锁固孔中。
- 根据权利要求8所述的电子设备，其特征在于，所述抵压件的两端分别向下伸出有两个支腿，所述两个支腿之间形成有容置空间；所述两个支腿抵压在所述印刷电路板的第一表面上，所述容置空间的底面导热地贴合于所述至少一个发热元器件的顶面；所述至少一个第三穿孔包括两个第三穿孔，所述两个第三穿孔分别沿纵向贯穿所述两个支腿。
- 根据权利要求8所述的电子设备，其特征在于，所述至少一个第二穿孔与所述避位通槽相连通。
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