WO2014008733A1 - 触摸屏、包含该触摸屏的电子设备及触摸屏的制造方法 - Google Patents
触摸屏、包含该触摸屏的电子设备及触摸屏的制造方法 Download PDFInfo
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- WO2014008733A1 WO2014008733A1 PCT/CN2012/085371 CN2012085371W WO2014008733A1 WO 2014008733 A1 WO2014008733 A1 WO 2014008733A1 CN 2012085371 W CN2012085371 W CN 2012085371W WO 2014008733 A1 WO2014008733 A1 WO 2014008733A1
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- touch screen
- protective layer
- metal bridge
- substrate
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Classifications
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K17/9618—Touch switches using a plurality of detectors, e.g. keyboard
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K2017/9602—Touch switches characterised by the type or shape of the sensing electrodes
- H03K2017/9604—Touch switches characterised by the type or shape of the sensing electrodes characterised by the number of electrodes
- H03K2017/9613—Touch switches characterised by the type or shape of the sensing electrodes characterised by the number of electrodes using two electrodes per touch switch
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
- H03K2217/96—Touch switches
- H03K2217/96015—Constructional details for touch switches
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49105—Switch making
Definitions
- Touch screen electronic device including the same, and manufacturing method of touch screen
- Embodiments of the present invention relate to a touch screen, an electronic device including the touch screen, and a method of manufacturing the touch screen. Background technique
- touch screens are increasingly used in various computers and various electronic devices as a human-machine interaction device.
- the touch screen is the simplest, most convenient and natural way of human-computer interaction.
- the user can use the finger to touch the icon or text on the touch screen to realize the operation of the host, thereby making the human-computer interaction more straightforward, and greatly facilitating users who do not understand the computer operation.
- FIG. 1 a schematic diagram of a touch screen structure currently under development includes: a glass substrate 8 ′, a black matrix layer 7 ′, a thermosetting transparent polymeric organic layer 6 ′, a lower substrate ITO layer 5 , and a metal bridge 4 . , a transparent polymeric organic layer 3, a sensing electrode layer 2, and a driving electrode layer ⁇ .
- the inventors of the present invention have found that in the current touch screen structure, the transparent polymeric organic layer is usually directly covered on the metal bridge, but the transparent polymerized organic layer is subjected to a post-baking process after exposure and development of the transparent polymeric organic layer to form a hole.
- the part of the hole close to the metal bridge will have a side slip and will react with the metal bridge to form a metal oxide layer with a large impedance on the surface of the metal bridge.
- the metal oxide layer reduces or hinders the electrical conductivity of the metal bridge, resulting in the performance of the touch screen product. Reduced or malfunctioned. Summary of the invention
- the embodiment of the invention provides a touch screen, an electronic device including the touch screen, and a manufacturing method of the touch screen, which are used to reduce the failure rate of the touch screen and improve the product performance of the touch screen.
- the touch screen provided in the embodiment of the present invention includes: a plurality of sensing electrode layers arranged in parallel and arranged in parallel, and a plurality of driving electrode layers spaced apart by the sensing electrode layer, and are arranged in parallel in the same sensing electrode layer.
- the protective layer can prevent the metal bridge from being oxidized by reacting with other substances due to being exposed, thereby ensuring the electrical conductivity of the metal bridge, reducing product scrapping caused by oxidation of the metal bridge, and improving The output of the product.
- the protective layer may be made of indium tin oxide ITO or indium oxide.
- Indium Tin Oxide ITO or Indium Oxide IZO has electrical conductivity and good adhesion to metals, and can function as a good barrier to transparent polymeric organics, preventing the reaction between transparent polymeric organics and metal bridges.
- the embodiment of the invention further provides an electronic device comprising the touch screen of the foregoing technical solution.
- Embodiments of the present invention provide a method of manufacturing a touch screen, including:
- thermosetting transparent polymeric organic layer covering the substrate, and forming a substrate ITO layer on the thermosetting transparent polymeric organic layer by one patterning process a metal bridge over the ITO layer of the substrate, and a protective layer over the metal bridge, the protective layer being used to prevent oxidation of the metal bridge and to have electrical conductivity;
- the protective layer may be made of indium tin oxide ITO or indium oxide.
- the metal bridge does not undergo oxidation reaction due to contact with the transparent polymer organic substance, thereby effectively ensuring the conductivity of the metal bridge and avoiding the oxide layer impedance. , improve the yield of the touch screen.
- FIG. 1 is a schematic diagram of a layer structure of a touch screen in the prior art
- FIG. 2 is a top plan view showing a partial structure of a touch screen according to an embodiment of the present invention
- Fig. 3 is a cross-sectional structural view taken along line A-A of Fig. 2; detailed description
- the transparent polymeric organic layer is usually directly covered on the metal bridge, but the post-baking process is performed after the transparent polymeric organic layer is exposed and developed into a hole, so as to increase the transmittance of the transparent polymeric organic substance and Hardness, and in the post-baking process, the hole in the transparent polymerized organic layer close to the metal bridge will be side-slip, and will react with the metal bridge, causing the metal bridge to form a metal oxide layer with higher impedance, and the metal oxide layer is lowered. Or hindering the conductive properties of the driving electrode layer and the metal bridge, resulting in degradation or malfunction of the touch screen product.
- a protective layer capable of protecting and having electrical conductivity is added to the metal bridge, so that the transparent polymeric organic layer does not contact the metal bridge when sliding, ensuring that the metal bridge does not It is oxidized to increase the yield of the product.
- a touch screen includes: a plurality of spaced apart and parallel arrays of sensing electrode layers 2, a plurality of driving electrode layers 1 separated by a sensing electrode layer 2, and parallel conduction lines arranged in parallel A metal bridge 5 of the two driving electrode layers 1 on both sides of the sensing electrode layer 2.
- the touch screen further includes: a protective layer 4 for preventing oxidation of the metal bridge 5 and having electrical conductivity, between the driving electrode layer 1 and the metal bridge 5.
- Step 101 Form a black matrix layer located in the frame region by a patterning process on the transparent substrate;
- Step 102 forming a thermosetting transparent polymeric organic layer covering the substrate, and forming a substrate ITO layer over the thermosetting transparent polymeric organic layer, a metal bridge over the substrate ITO layer, and located by a patterning process a protective layer over the metal bridge, the protective layer being used to prevent oxidation of the metal bridge and to have electrical conductivity;
- Step 103 forming a transparent polymer organic layer on the protective layer and covering the substrate by one patterning process, the transparent polymerizable organic layer having a hole above the protective layer;
- Step 104 forming a plurality of spaced and parallel arrayed sensing electrode layers on the transparent polymeric organic layer by a patterning process, and a plurality of driving electrode layers spaced apart by the sensing electrode layer, wherein each driving electrode layer is worn
- the via hole is in conductive contact with the protective layer.
- the processing process of the touch screen it is first necessary to apply a black matrix layer 8 on the frame region of the transparent substrate 9, and the main purpose of coating the black matrix layer 8 is to block the peripheral metal lines and the peripheral light leakage regions.
- thermosetting transparent polymeric organic layer 7 covering the entire transparent substrate 9 is applied over the black matrix layer 8; not only can the edge of the black matrix layer 8 be flattened, but also due to thermosetting transparency
- the polymerized organic layer 7 covers the black matrix layer 8 so as not to cause residue and oil stains to contaminate the chamber of the subsequent sputtering apparatus.
- the substrate ITO layer 6 can be sputtered on the thermosetting transparent polymeric organic layer 7, and the metal layer is further sputtered on the underlying ITO layer 6.
- the main function of the underlying ITO layer 6 is to prevent the sputtered metal layer.
- the metal ions directly impinge on the thermosetting transparent polymeric organic layer to contaminate the chamber.
- a protective layer 4 is continuously covered on the metal layer.
- the main function of the protective layer 4 is to insulate the metal bridge 5, so that the metal bridge 5 does not react with other materials to react.
- the driving electrode layer 1 is directly in contact with the metal bridge 5 through the holes 11, and conduction between the driving electrodes of the same row is realized by the metal bridge 5. Therefore, in the embodiment of the present invention, the added protective layer 4 should have characteristics that can protect the metal bridge 5 from being oxidized and electrically conductive, so as to achieve conduction between the driving electrode layer 1 and the metal bridge 5.
- the protective layer 4 may be directly covered on the metal bridge 5.
- the protective layer 4 can be made of indium tin oxide ITO material because the adhesion between the ITO and the metal layer is good, the metal layer can be well protected, and the ITO has electrical conductivity and does not affect the driving electrode layer. 1 and conduction of the metal bridge 5.
- the protective layer 4 may also be selected from indium oxide as the IZO material.
- the metal layer and the underlying ITO layer 6 are all sputtered, a photoresist is applied over the protective layer 4, and the next layer of the structure can be exposed by using the same mask. Processes such as development, etching, and photoresist stripping retain the desired portion, and the etched metal layer forms the structure of the metal bridge 5. Then, the transparent polymer layer 3 covering the entire substrate is further coated; after the transparent polymer layer 3 is coated, it is further required to perform exposure and development on the transparent polymer layer 3 to form holes 19, and the holes 11 are Directly facing the metal bridge 5 from the vertical direction, the depth of the hole 11 is to contact the protective layer 4.
- a transparent conductive film is deposited on the transparent polymer organic layer 3 and the protective layer 4, and a pattern of the driving electrode layer 1 and the sensing electrode layer 2 is formed by a series of patterning processes such as exposure, development, etching, etc.; wherein the driving electrode layer 1 conductive communication is formed between the hole 11 and the protective layer 4, and the protective layer 4 and the metal bridge 5 are electrically conductive, thereby achieving overall electrical conduction of the driving electrode layer 1, the protective layer 4 and the metal bridge 5.
- the structure allows the metal bridge 5 to be connected to the drive electrode layer 1 arranged side by side on the same sensing electrode layer 2.
- the sensing electrode layer 2 and the driving electrode layer 1 are located at the top
- the protective layer 4 is located under the driving electrode layer 1 at the hole 11
- the metal bridge 5 is located under the protective layer 4
- the substrate ITO layer 6 is located under the metal bridge 5
- the thermosetting transparent polymeric organic layer 7 is located under the substrate ITO layer 6
- the black matrix layer 8 is located in the lower peripheral region of the thermosetting transparent polymeric organic layer 7, and the transparent substrate 9 is located in the black matrix. Below the layer 8, it is the bottom layer.
- the metal bridge 5 can be made of a material such as aluminum, copper or aluminum-bismuth alloy, and has the advantages of good electrical conductivity and being difficult to be oxidized.
- the touch screen provided by the embodiment of the invention is provided with a protective layer on the metal bridge to isolate the metal bridge from the external environment, and does not cause an oxidation reaction due to contact with the transparent polymeric organic substance, which is effective.
- the conductivity of the metal bridge is ensured, the impedance of the generated oxide layer is reduced, and the yield of the touch screen is improved.
- the embodiment of the invention further provides an electronic device including the above touch screen, which has the advantages of good touch performance and low failure rate.
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Description
触摸屏、 包含该触摸屏的电子设备及触摸屏的制造方法 技术领域
本发明实施例涉及一种触摸屏、 包含该触摸屏的电子设备及一种触摸屏 的制造方法。 背景技术
随着计算机技术以及各种电子设备的发展应用, 触摸屏作为一种人机交 互装置, 越来越多的用在各种计算机以及各种电子设备上。 作为一种最新的 输入设备, 触摸屏是目前最简单、 方便、 自然的一种人机交互方式。 利用这 种技术, 用户只要用手指触碰触摸屏上的图符或文字, 就能实现对主机的操 作, 从而使人机交互更为直截了当, 大大方便了那些不懂电脑操作的用户。
触摸屏的广泛应用同时推动了触摸屏的技术进步, 也一直不断推动人们 对触摸屏生产技术进行改进。 如图 1所示, 为目前开发研究的触摸屏结构示 意图, 包括: 玻璃基板 8' 、 黑矩阵层 7' 、 热固型透明聚合有机物层 6' 、 下衬底 ITO层 5, 、 金属桥 4, 、 透明聚合有机物层 3, 、 感应电极层 2, 以 及驱动电极层 Γ 。
本申请发明人发现, 在目前的触摸屏结构中, 通常只是在金属桥之上直 接覆盖透明聚合有机物层, 但是由于对透明聚合有机物层曝光显影成孔之后 还进行后烘过程, 透明聚合有机物层的孔洞位置接近金属桥的部分会发生侧 滑, 并且会与金属桥发生反应, 使金属桥表面生成阻抗较大的金属氧化层, 金属氧化层降低或阻碍了金属桥的导电性能 , 造成触摸屏产品性能的降低或 故障。 发明内容
本发明实施例提出一种触摸屏、 包含该触摸屏的电子设备及一种触摸屏 的制造方法, 用以减少触摸屏的故障率, 提高触摸屏的产品性能。
本发明实施例提出的触摸屏包括:多条间隔并且平行排列的感应电极层, 被感应电极层间隔开的多个驱动电极层, 导通并列排布在同一条感应电极层
两侧的两个驱动电极层的金属桥, 以及防止金属桥氧化并具有导电性能的保 护层, 其位于所述驱动电极层和所述金属桥之间。
在上述触摸屏的制作过程中, 保护层可以使金属桥不因暴露在外而与其 它物质发生反应以被氧化, 保证了金属桥的导电性, 减少了因金属桥的氧化 而造成的产品报废, 提高了产品的产量。
在一个实施例中, 所述保护层的材质可以为氧化铟锡 ITO或氧化铟辞
IZO。
氧化铟锡 ITO或氧化铟辞 IZO具有导电性能,并且与金属的附着力良好, 能够起到很好的隔绝透明聚合有机物的作用, 防止透明聚合有机物与金属桥 之间发生反应。
本发明实施例还提供了一种电子设备, 其包括前述技术方案所述的触摸 屏。
本发明实施例提供了触摸屏的制造方法, 其包括:
在透明基板上通过一次构图工艺形成位于边框区域的黑矩阵层; 形成覆盖基板的热固型透明聚合有机物层, 并通过一次构图工艺形成位 于热固型透明聚合有机物层之上的衬底 ITO层、位于衬底 ITO层之上的金属 桥, 以及位于金属桥之上的保护层, 所述保护层用于防止金属桥氧化并具有 导电性能;
通过一次构图工艺形成位于保护层之上并覆盖基板的透明聚合有机物 层, 所述透明聚合有机物层在保护层的上方具有孔洞; 以及
通过一次构图工艺形成位于透明聚合有机物层之上的多条间隔并且平行 排列的感应电极层, 以及被感应电极层间隔开的多个驱动电极层, 其中, 每 一个驱动电极层穿过孔洞与保护层导电接触。
在一个实施例中, 所述保护层的材质可以为氧化铟锡 ITO或氧化铟辞 IZO。
在本发明实施例提出的触摸屏中, 通过在金属桥上覆盖保护层, 使金属 桥不会因为接触到透明聚合有机物而发生氧化反应, 有效的保证了金属桥的 导电性, 避免产生氧化层阻抗, 提高了触摸屏的成品率。 附图说明
为了更清楚地说明本发明实施例的技术方案, 下面将对实施例的附图作 简单地介绍,显而易见地,下面描述中的附图仅仅涉及本发明的一些实施例, 而非对本发明的限制。 其中:
图 1是现有技术中的触摸屏的层结构示意图;
图 2是本发明实施例提供的触摸屏局部结构的俯视示意图;
图 3是图 2的 A-A处剖视结构示意图。 具体实施方式
为使本发明实施例的目的、 技术方案和优点更加清楚, 下面将结合本发 明实施例的附图,对本发明实施例的技术方案进行清楚、 完整地描述。显然, 所描述的实施例是本发明的一部分实施例, 而不是全部的实施例。 基于所描 述的本发明的实施例, 本领域普通技术人员在无需创造性劳动的前提下所获 得的所有其他实施例, 都属于本发明保护的范围。
在目前的触摸屏结构中, 通常只是在金属桥之上直接覆盖透明聚合有机 物层, 但是由于对透明聚合有机物层曝光显影成孔之后还进行后烘过程, 目 的是增加透明聚合有机物的透过率和硬度, 而在后烘过程中, 透明聚合有机 物层的孔洞位置接近金属桥的部分会发生侧滑, 并且会与金属桥发生反应, 使金属桥生成阻抗较大的金属氧化层, 金属氧化层降低或阻碍了驱动电极层 和金属桥的导电性能, 造成触摸屏产品性能的降低或故障。 在本发明实施例 中, 在金属桥上增加了一层可以起到保护作用并具有导电性能的保护层, 从 而使透明聚合有机物层在侧滑时不会接触到金属桥,保证了金属桥不被氧化, 从而提高产品的成品率。
下面详细描述本发明的实施例, 所述实施例的示例在附图中示出, 其中 自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的 元件。 下面通过参考附图描述的实施例是示例性的, 仅用于解释本发明, 而 不能解释为对本发明的限制。
在本发明实施例的描述中, 术语 "上部" 、 "下部" "上方" 、 "下方" 等指示的方位或位置关系为基于附图所示的方位或位置关系, 仅是为了便于 描述本发明实施例而不是要求本发明实施例必须以特定的方位构造和操作, 因此不能理解为对本发明的限制。
如图 2所示, 本发明一实施例的触摸屏包括: 多条间隔并且平行排列的 感应电极层 2,被感应电极层 2间隔开的多个驱动电极层 1 , 以及导通并列排 布在同一条感应电极层 2两侧的两个驱动电极层 1的金属桥 5。如图 3所示, 触摸屏还包括: 防止金属桥 5氧化并具有导电性能的保护层 4, 位于所述驱 动电极层 1和所述金属桥 5之间。
根据本发明实施例的触摸屏的制造方法包括:
步骤 101、 在透明基板上通过一次构图工艺形成位于边框区域的黑矩阵 层;
步骤 102、 形成覆盖基板的热固型透明聚合有机物层, 并通过一次构图 工艺形成位于热固型透明聚合有机物层之上的衬底 ITO层、位于衬底 ITO层 之上的金属桥, 以及位于金属桥之上的保护层, 所述保护层用于防止金属桥 氧化并具有导电性能;
步骤 103、 通过一次构图工艺形成位于保护层之上并覆盖基板的透明聚 合有机物层, 所述透明聚合有机物层在保护层的上方具有孔洞;
步骤 104、 通过一次构图工艺形成位于透明聚合有机物层之上的多条间 隔并且平行排列的感应电极层,以及被感应电极层间隔开的多个驱动电极层, 其中, 每一个驱动电极层穿过孔洞与保护层导电接触。
以下结合图 2和图 3对触摸屏的制造方法作进一步详尽说明:
在触摸屏的加工工艺过程中, 首先需要在透明基板 9的边框区域涂覆一 层黑矩阵层 8, 而涂覆黑矩阵层 8的主要目的是遮挡周边金属线及周边漏光 区域。
接着就要在黑矩阵层 8的上方涂覆上一层能够覆盖整个透明基板 9的热 固型透明聚合有机物层 7; 不仅可以对黑矩阵层 8的边缘进行平坦化, 而且 由于热固型透明聚合有机物层 7覆盖住黑矩阵层 8, 使其不产生残渣和油污 而对后续溅射设备的腔室造成污染。
之后就可以在热固型透明聚合有机物层 7上溅射衬底 ITO层 6, 并在衬 底 ITO层 6上继续溅射金属层,衬底 ITO层 6的主要作用是防止在溅射金属 层时, 金属离子直接冲击热固型透明聚合有机物层而污染腔室。
进一步, 在金属层上继续覆盖一层保护层 4, 保护层 4的主要作用是隔 绝金属桥 5, 使金属桥 5不会和别的材质接触而发生反应。 在现有的技术中 ,
驱动电极层 1是通过孔洞 11直接与金属桥 5相接触,并通过金属桥 5实现同 一行驱动电极之间的导通。 因此本发明实施例中, 添加的保护层 4的特性应 当是既可以保护金属桥 5不被氧化, 又能够导电, 使驱动电极层 1和金属桥 5之间实现导通。 另外, 保护层 4可以是直接覆盖在金属桥 5上。 在实际应 用中,保护层 4可以釆用氧化铟锡 ITO材料,原因是 ITO与金属层的附着力 良好, 可以很好的将金属层保护起来, 而且 ITO具有导电性能, 不会影响驱 动电极层 1和金属桥 5的导通。 此外, 保护层 4也可以选用氧化铟辞 IZO材 料。
当保护层 4、 金属层和衬底 ITO层 6全部溅射完毕后, 在保护层 4上方 涂覆光刻胶, 下一步就可以利用同一张掩模板 ( mask )对此三层结构进行曝 光、 显影、 刻蚀以及光刻胶剥离等工艺, 保留下需要部分, 此时被刻蚀后的 金属层形成金属桥 5的结构。 之后继续涂覆上一层覆盖整个基板的透明聚合 有机物层 3; 在透明聚合有机物层 3涂覆完毕之后, 还需要在透明聚合有机 物层 3上进行曝光显影成孔从而形成孔洞 11 , 孔洞 11是从竖直方向直接对 着金属桥 5 , 孔洞 11的深度是以接触到保护层 4为止。 之后在透明聚合有机 物层 3和保护层 4的上方沉积形成透明导电薄膜, 并通过曝光、 显影、 刻蚀 等一系列构图工艺形成驱动电极层 1和感应电极层 2的图案; 其中, 驱动电 极层 1通过孔洞 11与保护层 4之间形成导电连通, 而保护层 4和金属桥 5 之间又是可以电导通的, 因此实现了驱动电极层 1、 保护层 4和金属桥 5的 整体电导通结构, 使金属桥 5可以连通并列排布在同一条感应电极层 2两侧 的驱动电极层 1。
最终, 形成的整体结构是: 感应电极层 2和驱动电极层 1位于最上方, 保护层 4位于孔洞 11处的驱动电极层 1的下面,金属桥 5位于保护层 4的下 面, 衬底 ITO层 6位于金属桥 5的下面, 热固型透明聚合有机物层 7位于衬 底 ITO层 6的下面, 黑矩阵层 8位于热固型透明聚合有机物层 7的下面的周 边区域, 透明基板 9位于黑矩阵层 8的下面, 是最底层。
金属桥 5可以釆用铝、 铜或铝钕合金等材质, 具有导电性能良好, 较难 被氧化的优点。
本发明实施例提出的触摸屏, 通过在金属桥上覆盖保护层, 使金属桥和 外界环境隔绝开, 不会因为接触到透明聚合有机物而发生氧化反应, 有效的
保证了金属桥的导电性,减少了产生的氧化层阻抗,提高了触摸屏的成品率。 本发明实施例还提供一种包括上述触摸屏的电子设备, 具有触控性能良 好, 故障率低的优点。
以上所述仅是本发明的示范性实施方式, 而非用于限制本发明的保护范 围, 本发明的保护范围由所附的权利要求确定。
Claims
1、 一种触摸屏, 包括多条间隔并且平行排列的感应电极层(2 ) , 被感 应电极层 ( 2 ) 间隔开的多个驱动电极层(1 ) , 导通并列排布在同一条感应 电极层 ( 2 )两侧的两个驱动电极层( 1 )的金属桥( 5 ) , , 以及防止金属桥 ( 5 )氧化并具有导电性能的保护层( 4 ) , 其位于所述驱动电极层 ( 1 )和所 述金属桥(5 )之间。
2、 如权利要求 1所述的触摸屏, 其中, 所述保护层( 4 )覆盖在金属桥 ( 5 )上。
3、 如权利要求 1或 2所述的触摸屏, 其中, 所述保护层(4 ) 的材质为 氧化铟锡 ITO或氧化铟辞 IZOo
4、 如权利要求 1-3中任一所述的触摸屏, 其中, 所述金属桥(5 ) 的材 质为铝、 铜或铝钕合金。
5、 如权利要求 1-4中任一所述的触摸屏, 还包括位于金属桥(5 )下面 的衬底 ITO层(6 ) 。
6、 如权利要求 5所述的触摸屏, 还包括位于所述衬底 ITO层( 6 )下面 的热固型透明聚合有机物层(7 ) 。
7、如权利要求 6所述的触摸屏,还包括位于所述热固型透明聚合有机物 层(7 )下面的黑矩阵层(8 ) 。
8、 如权利要求 7所述的触摸屏, 还包括位于黑矩阵层(8 )下面的透明 基板( 9 ) 。
9、 一种电子设备, 包括权利要求 1~8任一所述的触摸屏。
10、 一种触摸屏的制造方法, 包括:
在透明基板上通过一次构图工艺形成位于边框区域的黑矩阵层; 形成覆盖基板的热固型透明聚合有机物层, 并通过一次构图工艺形成位 于热固型透明聚合有机物层之上的衬底 ITO层、位于衬底 ITO层之上的金属 桥, 以及位于金属桥之上的保护层, 所述保护层用于防止金属桥氧化并具有 导电性能;
通过一次构图工艺形成位于保护层之上并覆盖基板的透明聚合有机物 层, 所述透明聚合有机物层在保护层的上方具有孔洞; 以及
通过一次构图工艺形成位于透明聚合有机物层之上的多条间隔并且平行 排列的感应电极层, 以及被感应电极层间隔开的多个驱动电极层, 其中, 每 一个驱动电极层穿过孔洞与保护层导电接触。
11、如权利要求 10所述的制造方法, 其中, 所述通过一次构图工艺形成 衬底 ITO层、 金属桥和保护层的步骤包括:
依次沉积衬底 ITO薄膜、 金属薄膜和保护层薄膜, 在所述保护层薄膜上 方涂覆光刻胶, 并釆用一张掩模板对形成有衬底 ITO薄膜、 金属薄膜和保护 层薄膜的基板进行曝光、 显影、 刻蚀工艺以形成衬底 ITO层、 金属桥和保护 层。
12、 如权利要求 10或 11所述的制造方法, 其中, 所述保护层的材质为 氧化铟锡 ITO或氧化铟辞 IZOo
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| US9385710B2 (en) | 2016-07-05 |
| CN102799311A (zh) | 2012-11-28 |
| CN102799311B (zh) | 2015-03-04 |
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