WO2014000688A1 - 一种多层布线式双界面ic卡天线模块 - Google Patents

一种多层布线式双界面ic卡天线模块 Download PDF

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Publication number
WO2014000688A1
WO2014000688A1 PCT/CN2013/078365 CN2013078365W WO2014000688A1 WO 2014000688 A1 WO2014000688 A1 WO 2014000688A1 CN 2013078365 W CN2013078365 W CN 2013078365W WO 2014000688 A1 WO2014000688 A1 WO 2014000688A1
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WIPO (PCT)
Prior art keywords
layer
antenna
card
antenna module
rfid antenna
Prior art date
Application number
PCT/CN2013/078365
Other languages
English (en)
French (fr)
Inventor
刘彩凤
王忠于
闾邱祁刚
王丹宁
Original Assignee
北京豹驰智能科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 北京豹驰智能科技有限公司 filed Critical 北京豹驰智能科技有限公司
Priority to EP13809156.6A priority Critical patent/EP2869244A4/en
Priority to US14/411,514 priority patent/US9373071B2/en
Publication of WO2014000688A1 publication Critical patent/WO2014000688A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07794—Antenna details the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0386—Paper sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors

Definitions

  • Multi-layer wiring type Han interface IC card antenna module The application is submitted to the Chinese Patent Office on June 29, 2012, the application number is 201210226559.7, and the invention name is "a multi-layer wiring type dual interface IC card antenna module" Priority of Chinese Patent Application, the entire contents of which is incorporated herein by reference.
  • the present invention relates to the field of integrated circuits and information interaction, and in particular to a multi-layer wired dual interface IC card antenna module. Background technique
  • the dual interface card also known as the dual interface card (Dua l Interface Card), is based on a single chip, and provides both "contact” and “non-contact” modes. Smart card. Its shape is consistent with the contact IC card, it has metal contacts in line with international standards, and can access the chip through contact contacts; its internal structure is similar to non-contact IC card, there are RF modules such as antennas and chips, which can be at a certain distance. (10cm) Access the chip by radio frequency.
  • the contact interface conforms to the IS0/IEC7816 standard; the contactless processor, the operating system and the EEPR0M (Electr ica l ly Erasable Programmable Read-Only Memory, electrically erasable Programmable read only memory). Therefore, it combines the advantages of the contact IC card and the non-contact IC card, and is a multi-function card having wide applicability, especially for users who have already used the non-contact IC card or the contact IC card system. There is no need to replace hardware devices such as systems and implements, and you can upgrade to use dual-interface IC cards by simply modifying them on the software.
  • dual interface cards In public transportation systems, such as buses, city rail transit, taxis, ferries, etc., the use of dual interface cards can be directly settled with the banking department; in the public charging areas of urban life, such as telephones, electricity meters, gas meters, water meters, etc.
  • the use of dual-interface IC cards will enable remote payment or settlement through banks; in highway toll collection systems, such as highways, road and bridge tolls, terminals, port parking, parking charges, entertainment venues, etc., using a dual-interface IC card swipe system, It will realize more convenient charging methods such as non-stop charging; and in the fields of finance, securities, etc., such as banking, postal, telecommunications, securities trading, shopping mall consumption, etc.; in the entrance and exit management system, above-the-job management, attendance management, access control management Etc.; in areas such as encryption authentication, such as mobile phones SIM card, e-commerce transaction security authentication card, electronic fund transfer card, software encryption card, anti-counterfeit card, anti-theft card, etc.
  • the basic manufacturing method of the dual interface IC card in the prior art is: a plurality of metal contacts of the dual interface IC card chip are connected with the electrode film; a radio frequency identification antenna for making a non-contact IC card; a radio frequency identification antenna Laminated into the card base; slotted in the chip package position of the card base, the two ends of the radio frequency identification antenna are exposed in the slot; the dual interface IC card chip is embedded in the slot of the card base; the two metal of the chip The contacts are respectively in contact with the two ends of the RFID antenna in the milling slot; the dual interface IC card chip is packaged in the milling slot.
  • the main object of the present invention is to provide a multi-layer wired dual-interface IC card antenna module, which solves the problem that two ends of the antenna and the electrode film are required to be fabricated by manual soldering in the prior art. Metal contact connections, solder joints are easy to fall off, stability is poor, and manufacturing methods are inefficient.
  • a multi-layer wiring type dual interface IC card antenna module comprises: an electrode film layer, a card base layer, a radio frequency identification RFID antenna layer, an insulating layer and a bridge layer;
  • the electrode film layer includes an antenna and an electrode film
  • the card base layer includes eight first through hole points under the electrode film layer, and the eight first through hole points are located directly under the eight metal contacts on the electrode film;
  • the RFID antenna layer under the card base layer, includes an RFID antenna, a connection contact, and a first a chip attaching point and a second chip attaching point, wherein the connecting contact and the first chip attaching point are respectively connected to two ends of the RFID antenna;
  • the insulating layer, under the RFID antenna layer, includes eight second via points, a third via point, a fourth via point, and a fifth via point, and the eight second via points Located directly below the eight first via points, the third via point is located directly below the connection contact, and the fourth via point is located directly below the first chip attachment point The fifth through hole point is located directly below the second chip attachment point;
  • the bridge layer under the insulating layer, includes a bridge that connects the connection contact and the second chip attachment point.
  • the antenna, the RFID antenna and the bridge form a multi-layer stereo RFID tag module.
  • the multi-layer stereo RFID tag module is a high frequency RFID tag module.
  • the position and size of the eight metal contacts on the electrode diaphragm conform to the international standard IS0/IEC7816 of the smart card.
  • the antenna is distributed around the outer side of the electrode film.
  • the RF I D antenna is distributed around the edge of the RF I D antenna layer.
  • the electrode film layer is a metal having a certain thickness.
  • the electrode film layer, the card base layer and the RFID antenna layer are a double-sided metal-clad integral material.
  • the electrode film layer, the card base layer, the radio frequency identification RFID antenna layer, the insulating layer and the bridge layer are the same size.
  • the material of the card base layer comprises polyvinyl chloride PVC, polycarbonate PC, acrylonitrile-butadiene-styrene copolymer ABS, polyethylene terephthalate PET, poly-p-benzoquinone A combination of one or more of acid glycol ester-1, 4-cyclohexanedetyl ester PETG, paper.
  • the present invention has the following beneficial effects:
  • the dual-interface IC card antenna module of the invention is realized by the layered structure of the electrode film layer, the card base layer, the RFID antenna layer, the insulating layer and the bridge layer, so that the two ends of the antenna and the electrode film can be prevented from being manually soldered.
  • the metal contacts are connected to improve the stability of the connection, so that it has high quality and long service life, which can meet the user's needs.
  • the card base layer includes through-hole points to avoid modern craftsmanship In the punching process, the insulating layer can avoid long connecting flying wires, and at the same time, it can be produced by printing, which is more convenient to manufacture.
  • the dual-interface IC card antenna module of the invention can realize large-scale full-automatic production, the production process is simple, and the production speed is obviously improved.
  • FIG. 1 is a schematic diagram of connection between a prior art dual interface IC card antenna and an electrode diaphragm
  • FIG. 2 is a schematic structural view of an electrode film layer of a multilayer wiring type dual interface IC card antenna module according to the present invention
  • FIG. 3 is a schematic structural view of a card base layer of a multilayer wiring type dual interface IC card antenna module according to the present invention
  • FIG. 5 is a schematic structural diagram of an insulating layer of a multi-layer wiring type dual interface IC card antenna module according to the present invention
  • FIG. 6 is a multi-layer wiring type dual interface IC card according to the present invention
  • FIG. 7 is a schematic structural view of the antenna module of the present invention after the card base layer is covered by the electrode film layer
  • FIG. 8 is a schematic structural view of the antenna module of the antenna module of the present invention after covering the card base layer
  • 9 is a schematic structural view of the insulating layer covering the RFID antenna layer of the present invention
  • FIG. 10 is a schematic structural view of the bridge layer after the insulating layer is covered by the present invention.
  • FIG. 11 is a cross-sectional view showing the structure of a multi-layer wiring type dual interface IC card antenna module according to the present invention. detailed description
  • the invention is directed to the prior art that the double interface IC card is required to realize the connection between the two ends of the antenna and the two metal contacts on the electrode film by hand soldering, the soldering point is easy to fall off, the stability is poor, and the manufacturing method has low production efficiency. .
  • a multi-layer wired dual-interface IC card antenna module comprising: an electrode film layer, a card base layer, a radio frequency identification RFID (Radio Frequency Ident ica t ion) antenna layer, an insulating layer and a bridge layer;
  • RFID Radio Frequency Ident ica t ion
  • An electrode film layer including an antenna and an electrode film
  • the card base layer under the electrode film layer, includes eight first through hole points, and the eight first through hole points are directly under the eight metal contacts on the electrode film;
  • the RFID antenna layer under the card base layer, includes an RFID antenna, a connection contact, a first chip attachment point and a second chip attachment point, and the connection contact point and the first chip attachment point are respectively connected to the two ends of the RFID antenna ;
  • the insulating layer, under the RFID antenna layer includes 8 second via points, a third via point, a fourth via point, and a fifth via point, and the 8 second via points are located in the 8 first pass Directly below the hole point, the third through hole point is directly below the connection contact point, the fourth through hole point is located directly below the first chip attachment point, and the fifth through hole point is located directly below the second chip attachment point ;
  • the bridge layer below the insulating layer, includes a bridge that connects the second chip attachment point and the connection contact.
  • the dual-interface IC card antenna module of the present invention is realized by the layered structure of the electrode film layer, the card base layer, the RFID antenna layer, the insulating layer and the bridge layer, and the two ends of the antenna and the electrode film can be prevented from being manually soldered.
  • the connection of the two metal contacts improves the stability of the connection, so it has high quality and long service life, which can meet the user's needs.
  • the card base layer includes through-hole points, which avoids the punching process of the modern process, and the insulating layer can avoid long connecting flying wires, and is manufactured by a printing method, which is more convenient to manufacture.
  • the dual-interface IC card antenna module of the invention can realize large-scale full-automatic production, the production process is simple, and the production speed is obviously improved.
  • the invention provides a multilayer wiring type dual interface IC card antenna module, comprising: an electrode film layer 1.
  • the card base layer 2 the radio frequency identification 'J RFID (Radio Frequency Ident if icat ion) antenna layer 3, the insulating layer 4 and the bridge layer 5.
  • radio frequency identification 'J RFID Radio Frequency Ident if icat ion
  • the electrode film layer 1 includes an antenna 11 and an electrode film 12 for contact data transmission with a reader/writer.
  • the size of the electrode diaphragm conforms to the international standard IS0/ IEC7816 of the smart card, and there are 8 metal contacts on the electrode diaphragm. The position and size of the 8 metal contacts are in accordance with the international standard IS0/ IEC7816 of the smart card.
  • the antenna 11 is distributed around the outside of the electrode film 12.
  • FIG. 3 it is a schematic structural view of the card base layer 2.
  • the card base layer 2 is below the electrode film layer and includes eight first through hole points 21, eight first through hole points 21 are located directly under the eight metal contacts on the electrode film, and eight first through holes Point and 8 metal contacts on the electrode diaphragm - corresponding settings.
  • eight first through-hole points in the card base layer other versions of the full version exist.
  • FIG. 4 it is a schematic structural view of the RFID antenna layer 3.
  • the RFID antenna layer 3 is below the card base layer 2, including the RFID antenna 31, the connection contact 34, the first chip attachment point 32 and the second chip attachment point 33, the connection contact 34, and the first chip attachment point 32 respectively Connected to both ends of the RFID antenna 31.
  • the RFID antenna layer is empty except for the RFID antenna 31, the connection contact 34, the first chip attachment point 32, and the second chip attachment point 33.
  • the RFID antenna is distributed around the edge of the RFID antenna layer.
  • FIG. 5 it is a schematic structural view of the insulating layer 4.
  • the insulating layer 4 is below the RFID antenna layer 3 and includes eight second via holes 41, third via holes 44, fourth via holes 42 and fifth via holes 43, and eight second via dots 41.
  • eight first through hole points 21 eight second through hole points 41 and eight first through hole points 21 are correspondingly disposed, and the third through hole points 44 are located directly below the connection contacts 34.
  • the fourth through hole point 42 is located directly below the first chip attaching point 32, and the fifth through hole point 43 is located directly below the second chip attaching point 33.
  • the other layers of the insulating layer are present.
  • FIG. 6 it is a schematic structural view of the bridge layer 5.
  • the bridge layer 5 is below the insulating layer 4, and includes a bridge 51 which is a line segment connecting the position of the second chip attaching point and the position of the connecting contact, connecting the second chip attaching point 33 and the connecting contact 34.
  • the antenna, the RFID antenna and the bridge can form a multi-layered stereo RFID tag module to realize an IC card contactless access chip.
  • the multi-layer stereo RFID tag module can be a high frequency RFID tag module, and the frequency of the radio frequency identification tag module can be in the range of 3 MHz to 30 MHz.
  • FIG. 7 it is a schematic structural view of the card base layer 2 covering the electrode film layer 1 .
  • the card base layer 2 covers the reverse surface of the electrode film layer 1 , and the front surface is the electrode film layer 1 and the reverse surface is the card base layer 2 .
  • the eight metal contacts on the electrode film 12 in the electrode film layer 1 can be directly connected through the eight first via holes 21 on the card base layer 2.
  • FIG. 8 is a schematic structural view of the RFID antenna layer 3 covering the card base layer 2 on the basis of FIG. 7, the RFID antenna coil 31, the connection contact 34, and the first chip attaching point 32 are exposed on the outside. And the second chip attaching point 33, and the eight through-holes 21 on the card base layer 2 can directly reach the eight metal contacts of the electrode film 12 of the electrode film layer 1 and the base of the card base layer 2.
  • the structure of the insulating layer 4 is covered behind the RFID antenna layer 3 on the basis of FIG. 8.
  • the exposed portion is the RFID antenna coil 31, the connecting contact 34, and the first chip attaching point. 32 and the second chip attaching point 33, and the eight metal contacts of the electrode film 12 of the electrode film layer 1 can be directly reached through the eight through hole points 21 on the card base layer 2.
  • FIG. 11 there is shown a cross-sectional structural view of the multilayer wiring type dual interface IC card antenna module of the present invention in the A-B direction.
  • the electrode film layer 1, the card base layer 2, the radio frequency identification RFID antenna layer 3, the insulating layer 4 and the bridge layer 5 are distributed layer by layer to form a multilayer wiring type IC card antenna module.
  • the eight first through holes 21 may be connected to the air layer at one end and to the electrode film layer at one end.
  • the electrode film layer 1 may be a metal having a certain thickness
  • the electrode film layer 1, the card base layer 2 and the RFID antenna layer 3 may be a double-sided metal-clad integral material
  • the electrode film layer 1, the card base layer 2, the radio frequency identification RFID antenna layer 3, the insulating layer 4 and the bridge layer 5 are the same size, and the size conforms to the smart card international standard IS0/IEC7816;
  • the material of the card base layer 2 may include polyvinyl chloride PVC, polycarbonate PC, acrylonitrile-butadiene-styrene copolymer ABS, polyethylene terephthalate PET, and polyethylene terephthalate.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)

Abstract

公开了一种多层布线式双界面IC卡天线模块，包括：电极膜片层（1）、卡基层（2）、RFID天线层（3）、绝缘层（4）和过桥层（5）。电极膜片层（1）包括天线和电极膜片；卡基层（2）在电极膜片层（1）之下，包括8个第一通孔点（21），位于电极膜片上的8个金属触点的正下方；RFID天线层（3）在卡基层（2）之下，包括RFID天线、连接触点、第一芯片贴附点和第二芯片贴附点，连接触点、第一芯片贴附点连接RFID天线两端；绝缘层（4）在天线层（3）之下，包括8个第二通孔点，位于8个第一通孔点正下方，第三通孔点位于连接触点正下方，第四通孔点位于第一芯片贴附点正下方，第五通孔点位于第二芯片贴附点正下方；过桥层（5）在绝缘层（4）之下，过桥连接第二芯片贴附点和连接触点。该天线模块可以实现全自动化生产。

Description

一种多层布线式汉界面 IC卡天线模块 本申请要求于 2012 年 6 月 29 日提交中国专利局、 申请号为 201210226559.7、发明名称为"一种多层布线式双界面 IC卡天线模块"的中国 专利申请的优先权， 其全部内容通过引用结合在本申请中。 技术领域
本发明涉及集成电路和信息交互领域，具体涉及一种多层布线式双界面 IC 卡天线模块。 背景技术
双界面卡，也称为双接口卡（Dua l Interface Card) ,是指在一张 IC卡上， 基于单芯片， 同时提供 "接触式" 和 "非接触式" 两种与外^妻口方式的智能 卡。 其外形与接触式 IC卡一致， 具有符合国际标准的金属触点， 可以通过接 触触点访问芯片； 其内部结构则与非接触式 IC卡相似， 有天线、 芯片等射频 模块， 可以在一定距离 （10cm 内） 以射频方式访问芯片。 因此， 它有两个操 作界面， 分别遵循两个不同的标准， 接触界面符合 IS0/ IEC7816标准； 非接触 处理器、操作系统和 EEPR0M( Electr ica l ly Erasable Programmable Read-Only Memory, 电可擦写可编程只读存储器）。 因此， 它集合了接触式 IC卡与非接 触式 IC卡的优点， 是一种多功能卡， 具有广泛的适用性， 尤其对于原来已经 使用非接触式 IC卡或接触式 IC卡系统的用户，不需要更换系统和机具等硬件 设备， 只需在软件上作修改就可以升级使用双界面 IC卡。 在公共交通系统， 如公共汽车、 市内轨道交通、 出租车、 轮渡等， 使用双界面卡， 可以与银行部 门直接结算； 在城市生活公用收费领域， 如电话、 电表、 煤气表、 水表等， 使 用双界面 IC卡， 将实现远程交费， 或通过银行结算； 在公路收费系统， 如高 速公路、 路桥收费、 码头、 港口停泊、 停车收费、 娱乐场所等， 使用双界面 IC 卡的刷卡系统， 将实现不停车收费等更便捷的收费方式； 和在金融、 证券 等的交易领域， 如银行、 邮政、 电信、 证券交易、 商场消费等； 在出入口管理 系统， 如上岗管理、 考勤管理、 门禁管理等； 在加密认证等领域， 如移动电话 SIM卡、 电子商务交易安全认证卡、 电子资金转帐卡、 软件加密卡、 防伪卡、 防盗卡等， 均可以使用双界面 IC卡实现安全、 可靠、 方便、 快捷的操作。
目前，现有技术中双界面 IC卡的基本制造方法是： 双界面 IC卡芯片的若 干个金属触点与电极膜片相连接； 制作非接触 IC卡的无线射频识别天线； 将 无线射频识别天线层压到卡基中； 在卡基的芯片封装位置铣槽，槽内棵露出无 线射频识别天线的两个端头； 双界面 IC卡芯片嵌入到卡基的铣槽内； 芯片的 两个金属触点与铣槽内的无线射频识别天线的两个端头分别接触连接；双界面 IC卡芯片封装在铣槽内。
参见图 1所示，现有技术中电极膜片上没有天线的设置， 电极膜片上放置 双界面卡的芯片， 其中电极膜片的 8个金属触点中的 6个作为接触式使用， 其 余两个触点作为非接触式使用，天线的两端和电极膜片作为接触式使用的两个 触点连接。 目前的技术制作双界面 IC卡， 天线的两端与电极膜片上的两个金 属触点连接，通过飞线后在触点位置由焊接的方法实现连接， 这种方法在金属 触点与无线射频识别天线端头的连接的时候需要手工操作，通过手工焊接的方 式连接， 手工方式速度慢， 焊接点容易脱落， 稳定性不好， 而且制造方法工艺 难度较大， 生产效率很低， 且使用寿命较短， 无法满足应用需求。 发明内容
有鉴于此， 本发明的主要目的是提供一种多层布线式双界面 IC卡天线模 块， 解决现有技术中制作双界面 IC卡需要通过手工焊接方式实现天线两端与 电极膜片上两个金属触点连接， 焊接点容易脱落， 稳定性差， 而且制造方法生 产效率低等问题。
为解决上述问题， 本发明提供的技术方案如下：
一种多层布线式双界面 IC卡天线模块， 所述天线模块包括： 电极膜片层、 卡基层、 射频识别 RFID天线层、 绝缘层和过桥层；
所述电极膜片层， 包括天线和电极膜片；
所述卡基层， 在所述电极膜片层之下， 包括 8个第一通孔点， 所述 8个第 一通孔点位于所述电极膜片上的 8个金属触点的正下方；
所述 RFID天线层， 在所述卡基层之下， 包括 RFID天线、 连接触点、 第一 芯片贴附点和第二芯片贴附点， 所述连接触点、 所述第一芯片贴附点分别连接 于所述 RFID天线的两端；
所述绝缘层， 在所述 RFID天线层之下， 包括 8个第二通孔点、 第三通孔 点、第四通孔点和第五通孔点， 所述 8个第二通孔点位于所述 8个第一通孔点 的正下方， 所述第三通孔点位于所述连接触点的正下方， 所述第四通孔点位于 所述第一芯片贴附点的正下方，所述第五通孔点位于所述第二芯片贴附点的正 下方；
所述过桥层， 在所述绝缘层之下， 包括过桥， 所述过桥连接所述连接触点 和所述第二芯片贴附点。
相应的， 所述天线、所述 RFID天线和所述过桥组成多层立体式 RFID标签 模块。
相应的， 所述多层立体式 RFID标签模块是高频 RFID标签模块。
相应的， 所述电极膜片上的 8个金属触点的位置、 大小符合智能卡国际标 准 IS0/ IEC7816。
相应的， 所述天线环绕分布在所述电极膜片的外侧。
相应的， 所述 RF I D天线沿所述 RF I D天线层的边缘环绕分布。
相应的， 所述电极膜片层是有一定厚度的金属。
相应的， 所述电极膜片层、 所述卡基层和所述 RFID天线层是一种双面覆 金属的整体材料。
相应的， 所述电极膜片层、 所述卡基层、 所述射频识别 RFID天线层、 所 述绝缘层和所述过桥层大小相同。
相应的， 所述卡基层的材料包括聚氯乙烯 PVC、 聚碳酸酯 PC、 丙烯腈- 丁二烯-苯乙烯共聚物 ABS、 聚对苯二曱酸乙二醇酯 PET、 聚对苯二曱酸乙二 醇酯 -1， 4-环己烷二曱醇酯 PETG、 纸中的一种或多种的组合。
由此可见， 本发明具有如下有益效果：
本发明双界面 IC卡天线模块通过电极膜片层、 卡基层、 RFID天线层、 绝缘 层和过桥层这种分层结构实现，可以避免由手工焊接方式实现天线两端与电极 膜片上两个金属触点连接，使连接稳定性提高， 因此具有较高的质量和较长的 使用寿命， 可以满足用户的使用需求。 卡基层包括通孔点， 避免了现代工艺的 打孔过程， 绝缘层可以避免较长的连接飞线， 同时通过印刷的方法制作， 制作 更方便。本发明双界面 IC卡天线模块可以实现大规模的全自动化生产， 生产工 艺简单， 制作速度明显提高。 附图说明
图 1为现有技术双界面 IC卡天线与电极膜片连接示意图；
图 2为本发明多层布线式双界面 IC卡天线模块的电极膜片层结构示意图； 图 3为本发明多层布线式双界面 IC卡天线模块的卡基层结构示意图； 图 4为本发明多层布线式双界面 IC卡天线模块的 RFID天线层结构示意图; 图 5为本发明多层布线式双界面 IC卡天线模块的绝缘层结构示意图； 图 6为本发明多层布线式双界面 IC卡天线模块的过桥层结构示意图； 图 7为本发明天线模块的卡基层覆盖在电极膜片层之后的结构示意图； 图 8为本发明天线模块 RFID天线层覆盖在卡基层之后的结构示意图； 图 9为本发明绝缘层覆盖在 RFID天线层之后的结构示意图；
图 10为本发明过桥层覆盖在绝缘层之后的结构示意图；
图 11为本发明多层布线式双界面 IC卡天线模块剖面结构示意图。 具体实施方式
为使本发明的上述目的、特征和优点能够更加明显易懂， 下面结合附图和 具体实施方式对本发明实施例作进一步详细的说明。
本发明是针对现有技术中制作双界面 IC卡需要通过手工焊接方式实现天 线两端与电极膜片上两个金属触点连接， 焊接点容易脱落， 稳定性差， 而且制 造方法生产效率低的问题。
提供了一种多层布线式双界面 IC卡天线模块， 包括： 电极膜片层、 卡基 层、 射频识别 RFID ( Radio Frequency Ident if ica t ion ) 天线层、 绝缘层和 过桥层；
电极膜片层， 包括天线和电极膜片；
卡基层， 在电极膜片层之下， 包括 8个第一通孔点， 8个第一通孔点位于 电极膜片上的 8个金属触点的正下方； RFID天线层， 在卡基层之下， 包括 RFID天线、 连接触点、 第一芯片贴附 点和第二芯片贴附点， 连接触点、 第一芯片贴附点分别连接于 RFID天线的两 端；
绝缘层， 在 RFID天线层之下， 包括 8个第二通孔点、 第三通孔点、 第四 通孔点和第五通孔点， 8个第二通孔点位于 8个第一通孔点的正下方， 第三通 孔点位于连接触点的正下方， 第四通孔点位于第一芯片贴附点的正下方， 第五 通孔点位于第二芯片贴附点的正下方；
过桥层，在绝缘层之下， 包括过桥，过桥连接第二芯片贴附点和连接触点。 这样， 本发明双界面 IC卡天线模块通过电极膜片层、 卡基层、 RFID天线 层、绝缘层和过桥层这种分层结构实现， 可以避免由手工焊接方式实现天线两 端与电极膜片上两个金属触点连接，使连接稳定性提高， 因此具有较高的质量 和较长的使用寿命， 可以满足用户的使用需求。 卡基层包括通孔点， 避免了现 代工艺的打孔过程， 绝缘层可以避免较长的连接飞线， 同时通过印刷的方法制 作， 制作更方便。 本发明双界面 IC卡天线模块可以实现大规模的全自动化生 产， 生产工艺简单， 制作速度明显提高。
以上是本申请的核心思想， 下面将结合本发明实施例中的附图，对本发明 实施例中的技术方案进行清楚、 完整地描述， 显然， 所描述的实施例仅仅是本 发明一部分实施例， 而不是全部的实施例。 基于本发明中的实施例， 本领域普 通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例 ,都属于本 发明保护的范围。
在下面的描述中阐述了很多具体细节以便于充分理解本发明，但是本发明 还可以采用其他不同于在此描述的其它方式来实施，本领域技术人员可以在不 违背本发明内涵的情况下做类似推广，因此本发明不受下面公开的具体实施例 的限制。
其次， 本发明结合示意图进行详细描述， 在详述本发明实施例时， 为便于 说明，表示双界面 IC卡天线模块结构示意图及剖面图会不依一般比例作局部放 大， 而且所述示意图只是示例， 其在此不应限制本发明保护的范围。 此外， 在 实际制作中应包含长度、 宽度及深度的三维空间尺寸。
本发明提供了一种多层布线式双界面 IC卡天线模块， 包括： 电极膜片层 1、 卡基层 2、 射频识另' J RFID ( Radio Frequency Ident i f icat ion )天线层 3、 绝缘层 4和过桥层 5。
参见图 2所示， 是电极膜片层 1的结构示意图， 电极膜片层 1包括天线 11和电极膜片 12 , 电极膜片用于和读写机进行接触式数据传输。 电极膜片的 大小符合智能卡国际标准 IS0/ IEC7816 , 同时电极膜片上具有 8个金属触点， 8个金属触点的位置、 大小均符合智能卡国际标准 IS0/ IEC7816。 天线 11环绕 分布在电极膜片 12的外侧。
参见图 3所示， 是卡基层 2的结构示意图。 卡基层 2在电极膜片层之下， 包括 8个第一通孔点 21 , 8个第一通孔点 21位于电极膜片上的 8个金属触点 的正下方， 8个第一通孔点与电极膜片上的 8个金属触点——对应设置。 卡基 层除 8个第一通孔点外， 其他版面满版存在。
参见图 4所示， 是 RFID天线层 3的结构示意图。 RFID天线层 3在卡基 层 2之下， 包括 RFID天线 31、 连接触点 34、 第一芯片贴附点 32和第二芯片 贴附点 33 ,连接触点 34、第一芯片贴附点 32分别连接于 RFID天线 31的两端。 RFID天线层除 RFID天线 31、 连接触点 34、 第一芯片贴附点 32和第二芯片贴 附点 33外， 其他版面为空。 RFID天线沿 RFID天线层的边缘环绕分布。
参见图 5所示， 是绝缘层 4的结构示意图。 绝缘层 4在 RFID天线层 3之 下， 包括 8个第二通孔点 41、 第三通孔点 44、 第四通孔点 42和第五通孔点 43 , 8个第二通孔点 41位于 8个第一通孔点 21的正下方， 8个第二通孔点 41 和 8个第一通孔点 21——对应设置， 第三通孔点 44位于连接触点 34的正下 方， 第四通孔点 42位于第一芯片贴附点 32的正下方， 第五通孔点 43位于第 二芯片贴附点 33的正下方。 绝缘层除 8个第二通孔点 41、 第三通孔点 44、 第 四通孔点 42和第五通孔点 43外， 其他版面满版存在。
参见图 6所示， 是过桥层 5的结构示意图。 过桥层 5在绝缘层 4之下， 包括过桥 51 , 过桥是连接第二芯片贴附点位置和连接触点位置的线段， 连接 第二芯片贴附点 33和连接触点 34。
这样， 通过电极膜片层、 卡基层、 RFID 天线层、 绝缘层和过桥层这种五 层分层结构， 由过桥连接第二芯片贴附点和连接触点， 可以使天线的两端与电 极膜片上的两个金属触点连接更简单。 另外， 天线、 RFID天线和过桥可以组成多层立体式 RFID标签模块， 实现 IC卡非接触式访问芯片。 该多层立体式 RFID标签模块可以是高频 RFID标签 模块， 射频识别标签模块的频率可以在 3MHz-30MHz范围内。
参见图 7所示， 是卡基层 2覆盖在电极膜片层 1之后的结构示意图， 卡 基层 2覆盖在电极膜片层 1的反面， 覆盖后正面为电极膜片层 1 , 反面为卡基 层 2 , 通过卡基层 2上的 8个第一通孔点 21可以直接连接电极膜片层 1中电 极膜片 12上的 8个金属触点。
参见图 8所示， 是在图 7的基础上 RFID天线层 3覆盖在卡基层 2之后 的结构示意图， 棵露在外面的是 RFID天线线圈 31、 连接触点 34、 第一芯片贴 附点 32和第二芯片贴附点 33 , 以及通过卡基层 2上的 8个通孔点 21可以直 接到达电极膜片层 1的电极膜片 12的八个金属触点和卡基层 2的基底。
参见图 9所示， 是在图 8的基础上绝缘层 4覆盖在 RFID天线层 3之后 的结构示意图， 棵露在外面的部分是 RFID天线线圈 31、 连接触点 34、 第一芯 片贴附点 32和第二芯片贴附点 33 , 以及通过卡基层 2上的 8个通孔点 21可 以直接到达电极膜片层 1的电极膜片 12的八个金属触点。
参见图 10所示， 是在图 9的基础上过桥层 5覆盖在绝缘层 4之后的结 构示意图， 过桥层 5的过桥 51连接了连接触点 34和第二芯片贴附点 33。 通 过过桥连接第二芯片贴附点和连接触点，相当于第一芯片贴附点和第二芯片贴 附点分别与 RFID天线两端相连， 再将芯片与第一芯片贴附点和第二芯片贴附 点相连， 方便连接， 避免了过长飞线的产生。
参见图 11所示，是本发明多层布线式双界面 IC卡天线模块在 A— B方向 上的剖面结构示意图。 电极膜片层 1、 卡基层 2、 射频识别 RFID天线层 3、 绝 缘层 4和过桥层 5逐层分布， 构成多层布线式 IC卡天线模块。 8个第一通孔 21可以一端连接空气层， 一端到达电极膜片层。
在上述实施例中， 电极膜片层 1可以是有一定厚度的金属；
电极膜片层 1、 卡基层 2和 RFID天线层 3可以是一种双面覆金属的整体 材料；
电极膜片层 1、 卡基层 2、 射频识别 RFID天线层 3、 绝缘层 4和过桥层 5 大小相同， 尺寸符合智能卡国际标准 IS0/ IEC7816; 卡基层 2的材料可以包括聚氯乙烯 PVC、 聚碳酸酯 PC、 丙烯腈 -丁二烯- 苯乙烯共聚物 ABS、聚对苯二曱酸乙二醇酯 PET、聚对苯二曱酸乙二醇酯 -1， 4- 环己烷二曱醇酯 PETG、 纸中的一种或多种的组合。
需要说明的是， 本说明书中各个实施例采用递进的方式描述， 每个实施 例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似部分互 相参见即可。
还需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来 将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这 些实体或操作之间存在任何这种实际的关系或者顺序。 而且， 术语 "包括"、 "包含"或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列 要素的过程、 方法、 物品或者设备不仅包括那些要素， 而且还包括没有明确列 出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。 在没有更多限制的情况下， 由语句 "包括一个 ... ... " 限定的要素， 并不排除在 包括所述要素的过程、 方法、 物品或者设备中还存在另外的相同要素。
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本 发明。 对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见 的， 本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下， 在 其它实施例中实现。 因此， 本发明将不会被限制于本文所示的这些实施例， 而 是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。

Claims

权 利 要 求
1、一种多层布线式双界面 IC卡天线模块， 其特征在于， 所述天线模块包 括： 电极膜片层、 卡基层、 射频识别 RFID天线层、 绝缘层和过桥层；
所述电极膜片层， 包括天线和电极膜片；
所述卡基层， 在所述电极膜片层之下， 包括 8个第一通孔点， 所述 8个第 一通孔点位于所述电极膜片上的 8个金属触点的正下方；
所述 RFID天线层， 在所述卡基层之下， 包括 RFID天线、 连接触点、 第一 芯片贴附点和第二芯片贴附点， 所述连接触点、 所述第一芯片贴附点分别连接 于所述 RFID天线的两端；
所述绝缘层， 在所述 RFID天线层之下， 包括 8个第二通孔点、 第三通孔 点、第四通孔点和第五通孔点， 所述 8个第二通孔点位于所述 8个第一通孔点 的正下方， 所述第三通孔点位于所述连接触点的正下方， 所述第四通孔点位于 所述第一芯片贴附点的正下方，所述第五通孔点位于所述第二芯片贴附点的正 下方；
所述过桥层， 在所述绝缘层之下， 包括过桥， 所述过桥连接所述连接触点 和所述第二芯片贴附点。
2、 根据权利要求 1所述的天线模块， 其特征在于， 所述天线、 所述 RFID 天线和所述过桥组成多层立体式 RFID标签模块。
3、 根据权利要求 2所述的天线模块， 其特征在于， 所述多层立体式 RFID 标签模块是高频 RFID标签模块。
4、 根据权利要求 1所述的天线模块， 其特征在于， 所述电极膜片上的 8 个金属触点的位置、 大小符合智能卡国际标准 IS0/ IEC7816。
5、 根据权利要求 1所述的天线模块， 其特征在于， 所述天线环绕分布在 所述电极膜片的外侧。
6、根据权利要求 1所述的天线模块， 其特征在于， 所述 RFID天线沿所述
RFID天线层的边缘环绕分布。
7、 根据权利要求 1所述的天线模块， 其特征在于， 所述电极膜片层是有 一定厚度的金属。
8、 根据权利要求 1所述的天线模块， 其特征在于， 所述电极膜片层、 所 述卡基层和所述 RFID天线层是一种双面覆金属的整体材料。
9、 根据权利要求 1所述的天线模块， 其特征在于， 所述电极膜片层、 所 述卡基层、 所述射频识别 RFID天线层、 所述绝缘层和所述过桥层大小相同。
10、 根据权利要求 1所述的天线模块， 其特征在于， 所述卡基层的材料包 括聚氯乙烯 PVC、 聚碳酸酯 PC、 丙烯腈-丁二烯-苯乙烯共聚物 ABS、 聚对苯 二曱酸乙二醇酯 PET、 聚对苯二曱酸乙二醇酯 -1 , 4-环己烷二曱醇酯 PETG、 纸 中的一种或多种的组合。
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