WO2013185342A1 - 一种液晶显示装置用pcb板及液晶显示装置 - Google Patents

一种液晶显示装置用pcb板及液晶显示装置 Download PDF

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Publication number
WO2013185342A1
WO2013185342A1 PCT/CN2012/076988 CN2012076988W WO2013185342A1 WO 2013185342 A1 WO2013185342 A1 WO 2013185342A1 CN 2012076988 W CN2012076988 W CN 2012076988W WO 2013185342 A1 WO2013185342 A1 WO 2013185342A1
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WO
WIPO (PCT)
Prior art keywords
jumper
liquid crystal
display device
crystal display
pcb board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2012/076988
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English (en)
French (fr)
Inventor
张先明
杨翔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US13/574,416 priority Critical patent/US9107328B2/en
Publication of WO2013185342A1 publication Critical patent/WO2013185342A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components

Definitions

  • the present invention relates to the field of liquid crystal display, and more particularly to a PCB board for a liquid crystal display device and a liquid crystal display device.
  • the liquid crystal display device includes a plurality of PCB boards, such as a power board, a main control board, an interface board, a key board, and a remote control board.
  • PCBs are provided with many circuits and components, and the design trend of the liquid crystal display device is more and more Thin, PCB board design trends are getting thinner and thinner, and the area is getting smaller and smaller.
  • the components on the PCB board are more and more densely arranged, and the heat dissipation area is insufficient, which causes the temperature of some components to be too high, affecting the PCB.
  • the performance of the board, especially the components such as ICs and MOS tubes on the power board and main control board are more likely to be damaged due to excessive temperature, and the heat dissipation performance of the PCB board needs to be further improved.
  • the technical problem to be solved by the present invention is to provide a PCB board and a liquid crystal display device for a liquid crystal display device having better heat dissipation performance.
  • the technical solution of the present invention is: a PCB board for a liquid crystal display device, comprising a front side and a back side, the front side of the PCB board is a component densely arranged surface, and the back side is a non-component densely arranged surface, on the back side of the PCB board a jumper for heat dissipation is provided, the jumper is connected to an end leg of the component, the jumper is formed by etching a copper film on a back surface of the PCB, and the jumper is a metal wire exposed, the plurality of The same signal end of the component is connected by the jumper, or the common ground end of the plurality of components is connected by the jumper, the number of the jumper is multiple, and the component is an IC and/or a MOS
  • the PCB board for the liquid crystal display device is a power board or a main control board.
  • a PCB board for a liquid crystal display device comprising a front side and a back side, the front side of the PCB board is a component densely arranged surface, and the back side is a non-component densely arranged surface, in the PCB
  • the rear side of the board is provided with a heat-dissipating jumper, and the jumper is connected to the end leg of the component.
  • the jumper is etched by a copper film on the back side of the PCB board, that is, the jumper is fabricated at the same time as the circuit on the back side of the PCB board, and does not increase the process, and basically does not increase the cost.
  • the jumper is a exposed metal wire, so the heat dissipation effect is very good.
  • the jumper is covered with a heat conducting insulating layer to prevent the jumper from contacting the other metal parts to cause a short circuit.
  • the same signal terminals of the plurality of components are connected by the jumper, or the common ground ends of the plurality of components are connected by the jumper.
  • the jumper is no longer connected to the end legs of other components.
  • the number of the jumpers is multiple.
  • the component is an IC and/or a MOS transistor.
  • the IC and MOS transistors are high heat generating devices, and jumpers should preferably be used for heat dissipation.
  • the PCB board for the liquid crystal display device is a power board or a main control board.
  • the present invention also discloses another technical solution: a liquid crystal display device comprising the above-mentioned PCB board.
  • the beneficial effects of the present invention are as follows: the front side of the PCB board of the present invention is a component densely arranged surface, the back side is a non-component densely arranged surface, and a jumper is arranged on the back side of the PCB board, and the jumper and the component end leg Connected, the heat on the components is transferred to the jumper through the end pins, and the jumper is used to enhance the heat dissipation. Since the back side of the PCB is a non-component dense layout surface, the temperature is lower than the front side of the PCB board, and the jumper and the back of the PCB board The temperature difference of the environment is large, so the heat transfer speed is fast, and the heat dissipation effect is obviously improved.
  • FIG. 1 is a front view of a first embodiment of a PCB for a liquid crystal display device of the present invention
  • FIG. 2 is a schematic view of a back surface of a first embodiment of a PCB for a liquid crystal display device according to the present invention
  • FIG. 4 is a schematic rear view of a third embodiment of a PCB for a liquid crystal display device according to the present invention
  • the invention discloses a liquid crystal display device, which comprises a PCB board.
  • the PCB board can be a power board, a main control board, or other PCB board with high heat generating components, and the high heat generating component can be an IC.
  • MOS tube, etc. as a first embodiment of a PCB for a liquid crystal display device, as shown in FIGS. 1 and 2, the PCB board includes a front side and a back side, and the front side of the PCB board is a component densely arranged surface, and the back side is a non-component.
  • the heat-dissipating component is disposed on the front surface of the PCB, and the heat-dissipating jumper is disposed on the back surface of the PCB, and the jumper is connected to the end of the component with high heat-generating component.
  • the front side of the PCB board of the invention is a component densely arranged surface
  • the back side is a non-component densely arranged surface
  • the high heat generating component is arranged on the front side of the PCB board
  • a jumper is arranged on the back side of the PCB board, the jumper and the jumper
  • the terminals of the components are connected, the heat on the components is transmitted to the jumpers through the pins, and the jumpers are used to enhance the heat dissipation.
  • the back of the PCB is a non-component densely arranged surface
  • the temperature is lower than the front of the PCB.
  • the temperature difference between the line and the back of the PCB board is large, so the heat transfer speed is fast and the heat dissipation effect is obviously improved.
  • the component with high heat generation is IC 1
  • the jumper 2 is etched by a copper film on the back surface of the PCB board, that is, the jumper 2 is a line on the back side of the PCB board. What is produced does not increase the process, and basically does not increase the cost.
  • the jumper 2 is a exposed metal wire, so the heat dissipation effect is very good.
  • jumpers 2 are disposed at two common ground ends of the same IC 1, and heat is transferred from the solder joints of the IC common ground to the jumper 2, and the jumper 2 has a certain length and width. , that is, has a certain heat dissipation area, thereby enhancing auxiliary heat dissipation.
  • the difference from the first embodiment is that the number of the jumpers 2 is multiple, and the two common ends of the IC 1 are respectively connected with a jump.
  • Line 2 the two jumpers 2 are not connected, and the jumper 2 is no longer connected to the end legs of other components.
  • the shape of the jumper 2 is T-shaped, and may also be other shapes, the jumper 2 as long as there is a certain amount of heat dissipation area, Plays a clear auxiliary cooling effect.
  • the difference from the first embodiment is that the common ground ends of the plurality of components on the PCB are connected by jumpers, and the components of the embodiment are Two ICs 1 , in order to increase the heat dissipation area of the jumper 2, the branch jumper 3 is specially added.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

一种液晶显示装置用 PCB板及液晶显示装置
【技术领域】
本发明属于液晶显示领域， 更具体的说， 涉及一种液晶显示装置用 PCB板 及液晶显示装置。
【背景技术】
液晶显示装置中包括多块 PCB板， 比如电源板、 主控制板、 接口板、 按 键板和遥控板等， 部分 PCB板上设有很多电路和元器件， 液晶显示装置的设计 趋势是越来越薄， PCB 板设计趋势也是越来越薄， 面积越来越小， 这样一来， PCB 板上的元器件布置也越来越密集， 散热面积不足， 导致一些元器件的温度 过高， 影响 PCB板的性能， 尤其是电源板和主控制板上的 IC、 MOS管等发热 量高的元器件， 更容易因温度过高而损坏，需要进一步提高 PCB板的散热性能。
【发明内容】
本发明所要解决的技术问题是提供一种散热性能更好的液晶显示装置用 PCB板及液晶显示装置。
本发明的技术方案为： 一种液晶显示装置用 PCB板， 包括正面和背面， 所 述 PCB板的正面为元器件密集布置面，背面为非元器件密集布置面，在所述 PCB 板的背面设有散热用跳线， 所述跳线与元器件的端脚相连接， 所述跳线由 PCB 板背面的铜膜蚀刻而成， 所述跳线为棵露的金属线， 所述多个元器件的同信号 端通过所述跳线连接， 或者所述多个元器件的共地端通过所述跳线连接， 所述 跳线数量为多条， 所述元器件为 IC和 /或 MOS管， 所述液晶显示装置用 PCB板 为电源板或主控制板。
本发明的另一种技术方案为： 一种液晶显示装置用 PCB板， 包括正面和背 面， 所述 PCB板的正面为元器件密集布置面， 背面为非元器件密集布置面， 在 所述 PCB板的背面设有散热用跳线， 所述跳线与元器件的端脚相连接。 优选的，所述跳线由 PCB板背面的铜膜蚀刻而成，即所述跳线是在制作 PCB 板背面的线路的同时制作出来的， 并不增加工序， 基本上不会增加成本。
优选的， 所述跳线为棵露的金属线， 所以散热效果非常好。
优选的， 所述跳线上覆盖有导热的绝缘层， 可以防止跳线与其它的金属件 接触造成短路。
优选的， 所述多个元器件的同信号端通过所述跳线连接， 或者所述多个元 器件的共地端通过所述跳线连接。
优选的， 所述跳线不再与其它元器件的端脚相连接。
优选的， 所述跳线数量为多条。
优选的， 所述元器件为 IC和 /或 MOS管。 IC和 MOS管为高发热量的元器 件， 应该优选使用跳线进行散热。
优选的， 所述液晶显示装置用 PCB板为电源板或主控制板。
本发明还公开了另一种技术方案：一种液晶显示装置，包括上面所述的 PCB 板。
本发明的有益效果为： 本发明所述 PCB板的正面为元器件密集布置面， 背 面为非元器件密集布置面， 在 PCB板的背面设置跳线， 所述跳线与元器件的端 脚相连接， 元器件上的热量通过端脚传递给跳线， 利用跳线辅助加强散热， 由 于 PCB板的背面为非元器件密集布置面，温度低于 PCB板的正面，跳线与 PCB 板背面的环境温差大， 所以热传递速度快， 散热效果明显提高。
【附图说明】
图 1是本发明所述液晶显示装置用 PCB板实施例一的正面结构示意图； 图 2是本发明所述液晶显示装置用 PCB板实施例一的背面结构示意图； 图 3是本发明所述液晶显示装置用 PCB板实施例二的背面结构示意图； 图 4是本发明所述液晶显示装置用 PCB板实施例三的背面结构示意图。 其中： 1、 IC; 2、 跳线； 3、 分支跳线。 【具体实施方式】
本发明公开一种液晶显示装置， 包括 PCB板， 所述 PCB板可以为电源板、 主控制板， 也可以为其它具有发热量高元器件的 PCB板， 所述发热量高元器件 可以为 IC、 MOS管等等， 作为液晶显示装置用 PCB板的实施例一， 如图 1和 图 2所示， PCB板包括正面和背面， PCB板的正面为元器件密集布置面， 背面 为非元器件密集布置面，所述发热量高元器件布置在 PCB板的正面，在所述 PCB 板的背面设有散热用跳线， 所述跳线与发热量高元器件的端脚相连接。
本发明所述 PCB板的正面为元器件密集布置面， 背面为非元器件密集布置 面， 发热量高元器件布置在 PCB板的正面， 在 PCB板的背面设置跳线， 所述跳 线与元器件的端脚相连接， 元器件上的热量通过端脚传递给跳线， 利用跳线辅 助加强散热， 由于 PCB板的背面为非元器件密集布置面， 温度低于 PCB板的正 面， 跳线与 PCB板背面的环境温差大， 所以热传递速度快，散热效果明显提高。
在本实施例中，所述发热量高的元器件为 IC 1,所述跳线 2由 PCB板背面的 铜膜蚀刻而成， 即所述跳线 2是在制作 PCB板背面的线路的同时制作出来的， 并不增加工序， 基本上不会增加成本。
在本实施例中， 所述跳线 2为棵露的金属线， 所以散热效果非常好。 为了 防止棵露的跳线 2与其它的金属件接触造成短路， 也可以在跳线上覆盖一层导 热的绝缘层， 比如绿油。
在本实施例中， 是在同一个 IC 1的两个共地端设置有跳线 2, 热量从 IC共 地端的焊接点传递到跳线 2上， 所述跳线 2具有一定的长度和宽度， 即具有一 定的散热面积， 从而加强辅助散热。
作为液晶显示装置用 PCB板的实施例二， 如图 3所示， 与实施例一不同之 处在于， 所述跳线 2数量为多条， IC 1的两个共地端分别连接有一段跳线 2, 两 段跳线 2并未连通， 所述跳线 2也不再与其它元器件的端脚相连接， 跳线 2的 形状为 T形， 也可以为其它的形状， 所述跳线 2只要有一定的散热面积， 就能 起到明显的辅助散热效果。
作为液晶显示装置用 PCB板的实施例三， 如图 4所示， 与实施例一不同之 处在于， PCB 板上有多个元器件的共地端通过跳线连接， 本实施例元器件为两 个 IC 1 , 为了增加跳线 2的散热面积， 特别增加了分支跳线 3。
在本实施例中， 也可以是多个元器件的同信号端通过所述跳线连接， 能起 到同样的辅助散热效果。
以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明， 不 能认定本发明的具体实施只局限于这些说明。 对于本发明所属技术领域的普通 技术人员来说， 在不脱离本发明构思的前提下， 还可以做出若干筒单推演或替 换， 都应当视为属于本发明的保护范围。

Claims

权利要求
1、 一种液晶显示装置用 PCB板， 包括正面和背面， 所述 PCB板的正面为 元器件密集布置面， 背面为非元器件密集布置面， 在所述 PCB板的背面设有散 热用跳线， 所述跳线与元器件的端脚相连接， 所述跳线由 PCB板背面的铜膜蚀 刻而成， 所述跳线为棵露的金属线， 所述多个元器件的同信号端通过所述跳线 连接， 或者所述多个元器件的共地端通过所述跳线连接， 所述元器件为 IC 和 / 或 MOS管， 所述液晶显示装置用 PCB板为电源板或主控制板。
2、 一种液晶显示装置用 PCB板， 包括正面和背面， 所述 PCB板的正面为 元器件密集布置面， 背面为非元器件密集布置面， 在所述 PCB板的背面设有散 热用跳线， 所述跳线与元器件的端脚相连接。
3、 如权利要求 2所述的液晶显示装置用 PCB板， 其中， 所述跳线由 PCB 板背面的铜膜蚀刻而成。
4、如权利要求 3所述的液晶显示装置用 PCB板， 其中， 所述跳线为棵露的 金属线。
5、如权利要求 3所述的液晶显示装置用 PCB板， 其中， 所述跳线上覆盖有 导热的绝缘层。
6、如权利要求 2所述的液晶显示装置用 PCB板， 其中， 所述多个元器件的 同信号端通过所述跳线连接， 或者所述多个元器件的共地端通过所述跳线连接。
7、如权利要求 2所述的液晶显示装置用 PCB板， 其中， 所述跳线不再与其 它元器件的端脚相连接。
8、如权利要求 2所述的液晶显示装置用 PCB板， 其中， 所述跳线数量为多 条。
9、 如权利要求 2所述的液晶显示装置用 PCB板， 其中， 所述元器件为 IC 和 /或 MOS管。
10、 如权利要求 2所述的液晶显示装置用 PCB板， 其中， 所述液晶显示装 置用 PCB板为电源板或主控制板。
11、 一种液晶显示装置， 包括 PCB板， 所述 PCB板包括正面和背面， 所述 PCB板的正面为元器件密集布置面， 背面为非元器件密集布置面， 在所述 PCB 板的背面设有散热用跳线， 所述跳线与元器件的端脚相连接。
12、如权利要求 11所述的液晶显示装置， 其中， 所述跳线由 PCB板背面的 铜膜蚀刻而成。
13、如权利要求 12所述的液晶显示装置， 其中， 所述跳线为棵露的金属线。
14、 如权利要求 12所述的液晶显示装置， 其中， 所述跳线上覆盖有导热的 绝缘层。
15、 如权利要求 11所述的液晶显示装置， 其中， 所述多个元器件的同信号 端通过所述跳线连接， 或者所述多个元器件的共地端通过所述跳线连接。
16、 如权利要求 11所述的液晶显示装置， 其中， 所述跳线不再与其它元器 件的端脚相连接。
17、 如权利要求 11所述的液晶显示装置， 其中， 所述跳线数量为多条。
18、如权利要求 11所述的液晶显示装置，其中，所述元器件为 IC和 /或 MOS 管。
19、 如权利要求 11所述的液晶显示装置， 其中， 所述液晶显示装置用 PCB 板为电源板或主控制板。
PCT/CN2012/076988 2012-06-13 2012-06-15 一种液晶显示装置用pcb板及液晶显示装置 Ceased WO2013185342A1 (zh)

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Application Number Priority Date Filing Date Title
US13/574,416 US9107328B2 (en) 2012-06-13 2012-06-15 PCB for LCD device and LCD device

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CN201210194406.9A CN102724811B (zh) 2012-06-13 2012-06-13 一种液晶显示装置用pcb板及液晶显示装置
CN201210194406.9 2012-06-13

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