WO2013171929A1 - エタロン及びエタロンの製造方法 - Google Patents
エタロン及びエタロンの製造方法 Download PDFInfo
- Publication number
- WO2013171929A1 WO2013171929A1 PCT/JP2012/082647 JP2012082647W WO2013171929A1 WO 2013171929 A1 WO2013171929 A1 WO 2013171929A1 JP 2012082647 W JP2012082647 W JP 2012082647W WO 2013171929 A1 WO2013171929 A1 WO 2013171929A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- transmitting body
- light
- etalon
- light transmitting
- change
- Prior art date
Links
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 title claims abstract description 73
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 230000003287 optical effect Effects 0.000 claims description 43
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 31
- 239000010408 film Substances 0.000 description 91
- 239000010409 thin film Substances 0.000 description 27
- 238000000034 method Methods 0.000 description 20
- 239000000463 material Substances 0.000 description 19
- 230000005540 biological transmission Effects 0.000 description 13
- 239000002131 composite material Substances 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 238000013461 design Methods 0.000 description 10
- 125000006850 spacer group Chemical group 0.000 description 10
- 238000004364 calculation method Methods 0.000 description 8
- 238000005304 joining Methods 0.000 description 8
- 238000010030 laminating Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical group [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000012886 linear function Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/28—Interference filters
- G02B5/284—Interference filters of etalon type comprising a resonant cavity other than a thin solid film, e.g. gas, air, solid plates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/02—Details
- G01J3/0286—Constructional arrangements for compensating for fluctuations caused by temperature, humidity or pressure, or using cooling or temperature stabilization of parts of the device; Controlling the atmosphere inside a spectrometer, e.g. vacuum
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/12—Generating the spectrum; Monochromators
- G01J3/26—Generating the spectrum; Monochromators using multiple reflection, e.g. Fabry-Perot interferometer, variable interference filters
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/28—Interference filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/13—Stabilisation of laser output parameters, e.g. frequency or amplitude
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49764—Method of mechanical manufacture with testing or indicating
- Y10T29/49771—Quantitative measuring or gauging
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Definitions
- the present invention relates to an etalon used in a laser system or an optical communication system and a method for manufacturing the etalon.
- a composite type etalon configured to suppress changes in characteristics due to temperature changes is known (for example, Patent Document 1).
- a transparent thin plate having a positive change in optical path length with respect to a change in temperature and a transparent thin plate having a negative change in optical path length with respect to a change in temperature are bonded together to form a flat plate-like light transmitting body.
- the optical path length is represented by nd when light passes through a medium having a refractive index n by a distance d.
- One surface of the translucent body is an entrance surface, the other surface is an exit surface, and a reflective film is formed on the entrance surface and the exit surface.
- An antireflection film is provided between the transparent thin plates.
- the change in characteristics due to the temperature change is suppressed by canceling the change in the optical path length due to the temperature change between the transparent thin plates. Further, according to Patent Document 1, by providing the antireflection film between the transparent thin plates, the waveform of the spectrum of the intensity of the light transmitted through the etalon becomes periodic, and the maximum value and the minimum value are aligned. ing.
- An object of the present invention is to provide a new type of etalon and a manufacturing method thereof.
- An etalon according to an aspect of the present invention has a first outer surface that constitutes one of an incident surface and an output surface, and a first inner surface on the back surface, and the change in the optical path length with respect to a temperature increase is positive.
- a second light-transmitting member having a first light-transmitting body, a second outer surface that constitutes the other of the incident surface and the light-emitting surface, and a second inner surface on the rear surface thereof, the change of the optical path length with respect to the temperature rise change being negative.
- a second antireflection film covering the first inner surface and the second inner surface are opposed to each other with a gap interposed therebetween.
- the manufacturing method of the etalon which concerns on 1 aspect of this invention has a 1st outer surface and the 1st inner surface of the back surface,
- the step which prepares the 1st light transmission body with which the change of the optical path length with respect to a temperature rise change is positive
- a second translucent body having a second outer side surface and a second inner side surface on the back side thereof, wherein the change in the optical path length with respect to the temperature rise change is negative, and the first covering the first outer side surface
- Forming a reflective film forming a first antireflection film covering the first inner surface; forming a second reflective film covering the second outer surface; and covering the second inner surface.
- a step of forming a second antireflection film, and the first inner side surface covered with the first antireflection film and the second inner side surface covered with the second antireflection film are opposed to each other through a gap.
- the first light transmitting body and the second light transmitting body are fixed to each other. And, with a.
- a new type of etalon can be provided.
- the typical side view of the etalon which concerns on embodiment of this invention The figure which shows typically the transmission characteristic of an etalon.
- the flowchart which shows the procedure of the manufacturing method of the etalon of FIG.
- the block diagram which shows the application example of an etalon.
- FIG. 1 is a side view or a cross-sectional view schematically showing an etalon 1 according to an embodiment of the present invention.
- the etalon is provided on the translucent part 3 having the first outer surface 51A and the second outer surface 51B parallel to each other, the first reflective film 5A provided on the first outer surface 51A, and the second outer surface 51B.
- a second reflective film 5B is provided on the translucent part 3 having the first outer surface 51A and the second outer surface 51B parallel to each other, the first reflective film 5A provided on the first outer surface 51A, and the second outer surface 51B.
- a second reflective film 5B is provided on the translucent part 3 having the first outer surface 51A and the second outer surface 51B parallel to each other, the first reflective film 5A provided on the first outer surface 51A, and the second outer surface 51B.
- a second reflective film 5B is provided on the translucent part 3 having the first outer surface 51A and the second outer surface 51B parallel to each other, the first reflective film 5A provided on the first outer surface 51A, and the second outer surface 51B.
- first and “A”, etc. may be omitted for the configurations given “first” and “A” or “second” and “B”.
- first outer surface 51A and the second outer surface 51B are simply referred to as the “outer surface 51” and may not be distinguished from each other.
- first outer surface 51A in the example of FIG. 1 constitutes an incident surface of the light Lt
- second outer surface 51B in the example of FIG. 1 emits the light Lt.
- the light Lt incident on the light transmitting part 3 is repeatedly reflected between the pair of reflecting films 5, and only light having a predetermined frequency defined by the optical path length of the light transmitting part 3 is emitted.
- FIG. 1 illustrates the case where the light Lt is incident on the incident surface perpendicularly, the light Lt may be incident on the incident surface obliquely.
- the translucent part 3 is located on the first translucent body 7A, the second translucent body 7B that faces the first translucent body 7A across the gap 53, and the gap 53 of the first translucent body 7A. Between the first antireflection film 9A, the second antireflection film 9B located on the gap 53 side of the second light transmitting body 7B, and the pair of light transmitting bodies 7 (more specifically, between the pair of antireflection films 9) And a spacer 11 interposed.
- the first light transmitting body 7A has the first outer side surface 51A described above and the first inner side surface 55A serving as the back surface thereof.
- the 2nd translucent body 7B has the 2nd outer surface 51B mentioned above and the 2nd inner surface 55B used as the back surface.
- the first inner side surface 55A and the second inner side surface 55B are opposed to each other with the gap 53 interposed therebetween.
- each translucent body 7 the outer side surface 51 and the inner side surface 55 are parallel, for example.
- the shape of each light-transmitting body 7 viewed in the light Lt transmission direction may be an appropriate shape such as a rectangle or a circle.
- the outer side surfaces 51 are parallel to each other as described above, and the inner side surfaces 55 are also parallel to each other.
- the thickness and the like of the translucent body 7 may be appropriately set according to desired optical characteristics, and are, for example, 100 ⁇ m to 2 mm.
- the surface roughness and parallelism of each surface may be appropriately set according to desired optical characteristics and the accuracy thereof. For example, the surface roughness is less than 1 nm and the parallelism is less than 1 minute. Such a minute surface roughness and high-precision parallelism can be obtained by optical polishing of each surface, for example.
- One of the pair of translucent bodies 7 is formed of a material that has a positive change in optical path length (a characteristic index is positive) with respect to a change in temperature.
- the first light-transmitting body 7A is made of a material whose change in optical path length with respect to a change in temperature is negative (characteristic index is negative).
- a material with a positive characteristic index is located on the exit side and a material with a negative characteristic index is located on the incident side.
- the relationship between the entrance and exit and the sign of the characteristic index is opposite to that in FIG. May be.
- An example of the material having a positive characteristic index is quartz (SiO 2 ).
- An example of a material having a negative characteristic index is strontium titanate (SrTiO 3 ).
- the antireflection film 9 is for suppressing reflection at the interface between the translucent body 7 and the gap 53. Accordingly, the antireflection film 9 is formed so that the optical path length thereof is close to or coincides with a quarter wavelength of the light transmitted through the etalon 1, and more preferably, the refractive index of the antireflection film 9 has an antireflection property.
- the transparent body 7 located on both sides of the film 9 and the gap 53 are formed so as to be close to or coincident with the geometric average of the refractive indexes. In designing, the optical path length and refractive index of each medium may be those at an appropriate temperature within the range of the assumed operating temperature of the etalon 1.
- the antireflection film 9 is configured, for example, by laminating a plurality of thin films having different refractive indexes, although not particularly illustrated.
- the materials, the number of layers, and the thickness of the plurality of thin films are designed so that desired optical characteristics (for example, reflectance) can be obtained.
- the material of each thin film is, for example, a dielectric.
- the dielectric is, for example, silicon dioxide (SiO 2 ), titanium dioxide (TiO 2 ), or tantalum pentoxide (Ta 2 O 5 ).
- the thickness of each thin film is, for example, about submicron.
- the thickness of each thin film is constant in each thin film, and as a result, the thickness of the antireflection film 9 is constant.
- the number of laminated thin films is, for example, 10 or less.
- the plurality of thin films are fixed in close contact with each other, and the antireflection film 9 is fixed in close contact with the light transmitting body 7.
- the spacer 11 contributes to fixing the pair of translucent members to each other while keeping the gap 53 at an appropriate size.
- the spacer 11 is located outside the region through which the light Lt is transmitted, that is, on the outer edge side of the inner side surface 55.
- the spacer 11 is formed in an annular shape along the outer periphery of the inner side surface 55.
- the spacer 11 is formed to have a constant thickness over the whole, and the pair of inner side surfaces 55 (antireflection film 9) are kept parallel to each other (the gap 53 is kept constant). .
- the spacer 11 is formed of, for example, a metal layer. More specifically, the spacer 11 includes, for example, a first metal layer 13A overlaid on the first antireflection film 9A and a second metal layer 13B overlaid on the second antireflection film 9B. .
- Each metal layer 13 is configured by, for example, laminating Cr and Au or laminating Ta and Au from the antireflection film 9 side, although not particularly illustrated.
- the pair of metal layers 13 are joined to each other by joining Au to each other by metal diffusion.
- a pair of metals is formed.
- the translucent body 7 is preferably fixed.
- the gap 53 together with the translucent body 7 and the antireflection film 9, constitutes a region through which the light Lt is transmitted.
- the gap 53 may be sealed or may not be sealed. In the case of being sealed, the gap 53 may be filled with air or a specific gas, or may be in a vacuum or a state close to a vacuum. Further, when a gas such as air is filled, the pressure in the gap 53 may be higher or lower than the atmospheric pressure.
- interval of the gap 53 is smaller than the thickness of each translucent body 7, for example.
- the gap 53 has an interval of submicron order to micron order. Since the refractive index of the gap 53 is relatively smaller than that of the light transmitting body 7, the gap 53 is relatively small and the light transmitting body 7 is relatively large while ensuring the optical path length nd.
- the translucent part 3 can be made small as a whole. However, the gap 53 may be larger than the thickness of the translucent body 7.
- the reflective film 5 is configured by, for example, laminating a plurality of thin films having different refractive indexes, although not particularly illustrated.
- the materials, the number of layers, and the thickness of the plurality of thin films are designed so that desired optical characteristics (for example, reflectance) can be obtained.
- the material of each thin film is made of a dielectric, for example.
- the dielectric is, for example, silicon dioxide (SiO 2 ), titanium dioxide (TiO 2 ), or tantalum pentoxide (Ta 2 O 5 ).
- the thickness of each thin film is, for example, about submicron. Further, the thickness of each thin film is constant in each thin film, and as a result, the thickness of the reflective film 5 is constant.
- the number of laminated thin films is, for example, 10 or less.
- the plurality of thin films are fixed in close contact with each other, and the reflective film 5 is fixed in close contact with the light transmitting body 7.
- FIG. 2 is a diagram schematically showing the transmission characteristics of the etalon 1.
- the horizontal axis indicates the wavelength ⁇
- the vertical axis indicates the transmission coefficient T.
- the transmission coefficient T is a ratio I out / I in between the intensity I in of the light Lt before being incident on the etalon 1 and the intensity I out of the light Lt after being emitted from the etalon 1.
- the transmission coefficient T periodically increases at the m-th order peak wavelength ⁇ m (peak frequency ⁇ m ).
- the FSR is expressed by an interval of the peak frequency ⁇ m ( ⁇ m ⁇ m + 1 ).
- the FSR is shown between peak wavelengths for the purpose of understanding.
- the FSR is schematically represented by the following equation (1) using the optical path length nd of a medium sandwiched between a pair of reflective films.
- n is the refractive index of the medium
- d is the thickness of the medium
- ⁇ is the refraction angle of the light in the medium.
- the translucent part 3 serving as a medium between the pair of reflective films 5 includes a first translucent body 7A having a positive characteristic index and a second translucent body 7B having a negative characteristic index. is doing. Therefore, the change in the optical path length nd due to the temperature change is canceled at least partially between the pair of light transmitting bodies 7. That is, as a whole of the light transmitting part 3, a change in the optical path length nd is suppressed. As a result, the temperature change of the FSR due to the temperature change is suppressed.
- the pair of light-transmitting bodies 7 are made of a material (refractive index) so that the change in the optical path length nd caused by the temperature change is substantially canceled (so that the absolute values of the changes are substantially equal). Selection and setting of thickness are made. That is, when it is assumed that the change in the optical path length due to the temperature change is expressed by a linear function, the pair of light-transmitting bodies 7 is made of a material (refractive index so that the following expression (2) is generally satisfied. ) And thickness are set.
- n 1 and d 1 are the refractive index and thickness of the first light transmitting body 7A
- n 2 and d 2 are the refractive index and thickness of the second light transmitting body 7B
- T is the temperature
- the change of the optical path length in these may also be added to the left side of the equation (2) to select the material and set the thickness.
- the absolute value of the wavelength temperature characteristic of the etalon 1 is set to 1 pm / ° C. or less, for example.
- the wavelength-temperature characteristic is a characteristic in which the transmittance characteristic when light passes through the etalon 1 changes to the short wavelength side or the long wavelength side depending on the temperature.
- Method for setting the thickness of the medium Usually, the material (refractive index) of a medium (such as the translucent body 7) through which light is transmitted is first selected, and then the thickness of the medium is set. In the following description, it is assumed that the thickness setting method is described on the assumption that the material has already been specified.
- the thickness of the translucent body 7 and the gap 53 may be set using a known etalon design method.
- the thickness of the translucent body 7 and the gap 53 may be obtained so as to satisfy the above equation (1) and the equation (2) for a desired FSR.
- the thicknesses of the antireflection film 9 and the reflection film 5 are set so as to obtain a desired reflectance and the like as described above. However, the influence of these thicknesses on the FSR may be considered.
- the FSR is defined by a medium between a pair of reflection films. It was discovered that the FSR changes as the number of layers, thickness, etc. change.
- the present inventor has devised an FSR calculation method that takes into account the influence of the reflective film 5.
- the calculation method is based on the matrix method of Florin Abeles.
- the FSR calculation method of the present inventor may be used instead of the equation (1).
- FSR may be calculated (predicted) by the FSR calculation method of the present inventor by varying the thickness of the medium, and the thickness at which a desired FSR is obtained may be searched.
- the FSR calculation method of the present inventor is as follows.
- the entire etalon 1 including the translucent part 3 and the reflective film 5 is considered as a multilayer structure composed of m layers of medium.
- the characteristic matrix Mj of the j-th (1 ⁇ j ⁇ m) medium is expressed by the following equations (3) and (4).
- ⁇ is the wavelength
- n j is the refractive index of the j-th medium
- d j is the thickness of the j-th medium
- ⁇ j is the refraction angle in the j-th medium
- ⁇ j is the phase of the j-th medium
- i Is an imaginary unit.
- the characteristic matrix M of the multilayer structure is represented by the product of the matrix of each layer as shown in the following equation (5).
- the Fresnel reflection coefficient ⁇ and Fresnel transmission coefficient ⁇ of this multilayer structure are expressed by the following equations (6) and (7).
- n 0 is the refractive index of a medium serving as an incident medium among m layers of medium
- n m is the refractive index of a medium serving as an output medium among m layers of medium.
- the transmission coefficient T is calculated by using the wavelength ⁇ as a variable to obtain a maximum value, and the FSR is calculated from the wavelength interval between the maximum values.
- the refractive index n it is preferable to consider wavelength dispersion (wavelength dependence).
- the refractive index n is preferably calculated based on the wavelength ⁇ according to the following equation (10).
- a 0 to A 6 are dispersion coefficients.
- the substrate or thin film has absorption, it is preferable to consider not only the refractive index but also the extinction coefficient and its wavelength dependency.
- the FSR is generally obtained without considering the order m as exemplified in the equation (1). However, if the FSR is obtained in consideration of the variation according to the order m, the FSR includes the number of peak frequency intervals, the maximum peak frequency, and the minimum frequency included in the frequency range in which the etalon is used.
- the peak frequency is L, ⁇ m , ⁇ m + L respectively.
- FSR ( ⁇ m ⁇ m + L ) / L May be required.
- FIG. 3 is a flowchart showing a procedure of the manufacturing method of the etalon 1.
- the manufacturing method shown in this flow chart compensates for variations in processing accuracy of the translucent body 7 by adjusting the gap 53, and a pair of translucent bodies when a problem occurs in the formation of the antireflection film 9 7 includes the point that the joining is not performed. Specifically, it is as follows.
- step ST1 the design thickness d t of the light transmitting body 7 (and the gap 53 gap, and the thickness of another medium as required) is determined. As described above, the thickness d t is obtained so that a desired FSR can be obtained (see the formula (1) or (3) to (10)), and the change in the optical path length with respect to the temperature change is suppressed ( (See equation (2)).
- the translucent body 7 is formed.
- the translucent body 7 is formed such that its thickness is the designed thickness dt .
- the formation method of the translucent body 7 may be the same as a well-known method.
- the measurement may be performed by a known method such as using a micrometer or a laser length meter.
- the measurement is preferably performed with an accuracy of 0.1 ⁇ m or less.
- step ST4 based on the actual thickness d r, as desired FSR is obtained (equation (1) or (3) to (10) see formula), again, to calculate the distance g of the gap 53.
- the thicknesses of the reflection film 5 and the antireflection film 9 may be the values determined in step ST1 and the like.
- the gap 53 or the like may be ignored, but the gap 53 or the like may be reset in consideration of the change. In case the difference between the actual thickness d r and thickness d t of the design is within a predetermined allowable range may not be performed resetting the interval g.
- step ST5 the reflection film 5 and the antireflection film 9 are formed on the light transmitting body 7.
- These film forming methods may be similar to known methods, and for example, thin film forming methods such as physical vapor deposition and chemical vapor deposition may be used.
- step ST6 the reflectance of the antireflection film 9 (and the reflection film 5) is measured.
- the measurement may be performed by a known method such as using a known photometer.
- step ST7 it is determined whether or not the difference between the reflectance of the antireflection film 9 (and the reflection film 5) measured in step ST6 and the desired reflectance is within an allowable range. If it is determined that the value is within the allowable range, the process proceeds to step ST8. On the other hand, when it is determined that it is not within the allowable range, the translucent body 7 on which the antireflection film 9 (or the reflection film 5) is formed is regarded as a defective product, and subsequent bonding or the like is not performed.
- step ST8 the metal layer 13 is formed on the antireflection film 9.
- the thickness of the metal layer 13 is set to a thickness corresponding to the gap g of the gap 53 determined in step ST4.
- the thickness of the thin film may be set to a desired thickness only by the thin film forming method, or may be set to a desired thickness by polishing or the like after the thin film is formed.
- the metal layer 13 is formed, for example, by first forming a thin film made of Cr or Ta and then forming a thin film made of Au thereon.
- the formation of the thin film may be performed by a known method.
- a thin film forming method such as physical vapor deposition, chemical vapor deposition, or electroless plating may be used.
- the metal layer 13 is patterned so as to be located outside the light transmission region of the light Lt.
- the patterning may be performed by forming and etching a mask (for example, a photoresist formed by photolithography) after a thin film to be the metal layer 13 is formed over the entire surface of the antireflection film 9.
- a mask for example, a photoresist formed by photolithography
- this may be performed by forming a thin film to be the metal layer 13 after a mask is previously disposed on the antireflection film 9.
- step ST9 the first light-transmitting body 7A on which the first metal layer 13A is formed and the second light-transmitting body 7B on which the second metal layer 13B is formed are brought into contact with each other, and heated and pressed to form a pair.
- the metal layers 13 (Au layers) are joined together by metal diffusion.
- the thickness of the metal layer 13 may be adjusted in consideration of the change in the thickness of the metal layer 13 at this time.
- FIG. 4 is a chart showing a calculation example in the case where the processing accuracy variation of the translucent body 7 is compensated by adjusting the gap 53 (steps ST1 to ST4).
- the incident angle is 0 °
- the wavelength range is 1530 to 1610 nm
- the reflectance of the reflective film 5 is 50%
- the FSR target value
- each column corresponds to each configuration example, and each row indicates a feature of each configuration example. Specifically, it is as follows.
- the top row “No.” indicates a number given to the configuration example for convenience.
- No. 1A, no. 1B, No. 1 2A and No. 5B configuration examples of 2B are shown.
- No. 1A-0, No. 1 1B-0, No. 1 2A-0, No. 2 2B-0 is No.
- a difference between the configuration example of 0 and another configuration example is shown.
- no. 1A-0 is No.1.
- the difference in the configuration example of 1A is shown.
- “C” in which a plurality of lines are collected in the center of FIG. 4 indicates the configuration of the etalon 1.
- “R2” indicates the configuration of the second reflective film 5B
- “P2” indicates the configuration of the second light-transmitting body 7B
- “A2” indicates the configuration of the second antireflection film 9B.
- “G” indicates the configuration of the gap 53
- “A1” indicates the configuration of the first antireflection film 9A
- “P1” indicates the configuration of the first light transmitting body 7A
- “R1” indicates the first reflection film.
- the structure of 5A is shown.
- the first light transmitting body 7A is made of crystal
- the second light transmitting body 7B is made of strontium titanate
- the gap 53 is made of air.
- the reflection film 5 and the antireflection film 9 are configured by alternately laminating silicon dioxide and tantalum pentoxide.
- the mass corresponding to each column indicates the thickness (unit: nm) of each medium.
- the thickness of the second light transmitting body 7B (quartz) is 1449700 nm.
- the bottom row “FSR” in FIG. 4 shows the FSR value (unit: GHz) calculated by the inventor's FSR calculation method based on the material and thickness of the medium shown in the plurality of rows “C”. Show.
- FIG. 0 indicates the design value determined in step ST1.
- No. 1A is No. 1;
- actual thickness d r of the transparent body 7 is No.
- the value when it is assumed that the thickness has become smaller than the design thickness dt at 0 is shown (see the rows “P2” and “P1”). That is, no.
- an error of ⁇ 300 nm occurs for the second light transmitting body 7B, and an error of ⁇ 100 nm occurs for the first light transmitting body 7A.
- the 1 A FSR is 50.01 GHz, which deviates from the target value of 50.00 GHz.
- the gap g of the gap 53 is reset so that the FSR becomes the target value of 50.00 GHz (step ST4).
- No. 1B shows the configuration after the resetting. No. As shown in the 1B-0, in response to the actual thickness d r of the transparent body 7 is smaller than the thickness d t of the design, spacing g of the gap 53, the original design It is larger than the value.
- the thickness variation of the transparent body 7 and the change amount of the gap 53 to compensate for the variation are not greatly different as absolute values, and The sign is reversed.
- No. 2A is No. Contrary to 1A, actual thickness d r of the transparent body 7 is No. The value when it is assumed that it has become large with respect to the design thickness dt at 0 is shown.
- No. 2B is No. 2; As in 1B, No. 1B. A configuration example is shown when the gap 53 is reset so as to compensate for the 2A error.
- FIG. 5 is a block diagram showing an application example of the etalon 1.
- the etalon 1 is incorporated in a wavelength locker 103 for keeping the wavelength of light of the laser system 101 constant.
- the wavelength locker 103 includes, for example, a beam splitter 105 on which light dropped from the laser system 101 enters, an etalon 1 on which light transmitted through the beam splitter 105 enters, and a first light detection on which light transmitted through the etalon 1 enters. 107A and a second photodetector 107B on which the light reflected by the beam splitter 105 enters. Then, the control device 109 detects the wavelength of the light by comparing the intensity of the light detected by the first photodetector 107A and the intensity of the light detected by the second photodetector 107B, and the detected wavelength is constant. Control of the laser system 101 is executed so that
- the etalon 1 with the FSR adjusted with high accuracy is used for such a wavelength locker 103, so that the wavelength of light can be monitored with high accuracy.
- the etalon 1 of the present embodiment includes the first light transmitting body 7A in which the change in the optical path length with respect to the temperature increase change is positive, and the second light transmitting body 7B in which the change in the optical path length with respect to the temperature increase change is negative.
- the first inner side surface 55A and the second inner side surface 55B are opposed to each other with the gap 53 interposed therebetween.
- an etalon composite air gap etalon having a new basic configuration in which an optical path along which the light Lt reciprocates is constituted by the two light transmitting bodies 7 and the gap 53 is provided. That is, there is an etalon having a different configuration from a solid etalon (including a conventional composite etalon) in which an optical path in which light reciprocates is constituted only by a transparent body and an air gap etalon in which an optical path in which light reciprocates is constituted only by a gap Provided.
- This composite air gap etalon with this new basic configuration has various advantageous effects.
- the characteristic change due to the temperature change is suppressed by combining the two light-transmitting bodies 7 as in the conventional composite type etalon, while the antireflection film 9 has two transparent parts. Since the antireflection film 9 is formed on the light transmitting body 7 (step ST5), the characteristics of the antireflection film 9 after bonding can be grasped (step ST5) because it is not sandwiched between the bonding surfaces of the light bodies. ST6). As a result, it is possible to avoid joining of defective products (steps ST7 to ST9).
- the pair of translucent members are bonded by optical adhesion directly or indirectly through an antireflection film, and thus the bonding strength is weak.
- a bonding method with high bonding strength such as bonding a pair of light-transmitting bodies 7 using a metal layer 13 (metal diffusion).
- the composite air gap etalon includes a light transmitting body 7 having a higher refractive index than air as a medium constituting an optical path through which light reciprocates. Smaller than etalon.
- the present invention is not limited to the above embodiment, and may be implemented in various modes.
- the materials of the light transmitting body, the reflection film, and the antireflection film are not limited to those exemplified in the embodiment, and may be appropriately changed.
- the translucent body may be made of quartz glass instead of quartz, or rutile may be used instead of strontium titanate.
- the fixing of the pair of translucent members is not limited to that performed by a spacer interposed between them.
- the spacer is not limited to one made of metal, and may be made of, for example, a resin adhesive.
- the metal layer which comprises a spacer does not need to be provided in each translucent body, and the metal layer of one layer which consists of one type of material may interpose between translucent bodies.
- the metal layer formed in each light-transmitting body may be formed from three or more metal layers.
- the variation in the processing accuracy of the light transmitting body may be achieved by adjusting the material and / or film thickness in the reflective film and / or antireflection film.
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optical Filters (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Semiconductor Lasers (AREA)
- Surface Treatment Of Optical Elements (AREA)
Abstract
Description
図1は、本発明の実施形態に係るエタロン1を模式的に示す側面図乃至は断面図である。
通常は、光が透過する媒質(透光体7等)の材料(屈折率)を先に選択して、次に、その媒質の厚みを設定する。以下の説明においては、材料が既に特定されていることを前提として、厚みの設定方法を説明することがあるものとする。
FSR=(νm-νm+L)/L
により求められてもよい。
図3は、エタロン1の製造方法の手順を示すフローチャートである。
図4は、透光体7の加工精度のばらつきをギャップ53の間隔の調整で補償する(ステップST1~ST4)場合の計算例を示す図表である。
図5は、エタロン1の応用例を示すブロック図である。
Claims (6)
- 入射面及び出射面の一方を構成する第1外側面、及び、その背面の第1内側面を有し、温度上昇変化に対する光路長の変化が正である第1透光体と、
入射面及び出射面の他方を構成する第2外側面、及び、その背面の第2内側面を有し、温度上昇変化に対する光路長の変化が負である第2透光体と、
前記第1外側面を覆う第1反射膜と、
前記第1内側面を覆う第1反射防止膜と、
前記第2外側面を覆う第2反射膜と、
前記第2内側面を覆う第2反射防止膜と、
を有し、
前記第1内側面と前記第2内側面とがギャップを挟んで対向している
エタロン。 - 前記第1内側面及び前記第2内側面の外縁側においてこれら内側面の間に介在して前記第1透光体及び前記第2透光体を接合する金属層を更に有する
請求項1に記載のエタロン。 - 第1外側面及びその背面の第1内側面を有し、温度上昇変化に対する光路長の変化が正である第1透光体を準備するステップと、
第2外側面及びその背面の第2内側面を有し、温度上昇変化に対する光路長の変化が負である第2透光体を準備するステップと、
前記第1外側面を覆う第1反射膜を形成するステップと、
前記第1内側面を覆う第1反射防止膜を形成するステップと、
前記第2外側面を覆う第2反射膜を形成するステップと、
前記第2内側面を覆う第2反射防止膜を形成するステップと、
前記第1反射防止膜に覆われた前記第1内側面と前記第2反射防止膜に覆われた前記第2内側面とをギャップを介して対向させた状態で前記第1透光体と前記第2透光体とを互いに固定するステップと、
を有するエタロンの製造方法。 - 前記第1透光体と前記第2透光体とを互いに固定する前に、前記第1透光体及び前記第2透光体の厚みを測定するステップを更に有し、
前記第1透光体と前記第2透光体とを互いに固定するステップでは、測定された前記第1透光体及び前記第2透光体の厚みに基づいて前記ギャップの間隔を調整する
請求項3に記載のエタロンの製造方法。 - 前記第1透光体と前記第2透光体とを互いに固定するステップでは、前記第1内側面及び前記第2内側面の少なくとも一方の面においてその外縁側に金属層を成膜して当該金属層により前記第1透光体と前記第2透光体とを固定し、また、前記金属層を成膜するときの厚みの調整により前記ギャップの間隔を調整する
請求項4に記載のエタロンの製造方法。 - 前記第1透光体と前記第2透光体とを互いに固定するステップの前に、
形成された前記第1反射防止膜の反射率を測定するステップと、
形成された前記第2反射防止膜の反射率を測定するステップと、
を更に有し、
測定された反射率が所定の許容範囲内に収まるときにのみ、前記第1透光体と前記第2透光体とを固定するステップを行う
請求項3~5のいずれか1項に記載のエタロンの製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/371,342 US20140347735A1 (en) | 2012-05-15 | 2012-12-17 | Etalon and method for producing etalon |
KR20147019585A KR20150021012A (ko) | 2012-05-15 | 2012-12-17 | 에탈론 및 에탈론의 제조 방법 |
CN201280038609.7A CN103733112B (zh) | 2012-05-15 | 2012-12-17 | 标准具及标准具的制造方法 |
DE112012005599.3T DE112012005599T5 (de) | 2012-05-15 | 2012-12-17 | Etalon und Verfahren zur Herstellung eines Etalons |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012111530A JP5508469B2 (ja) | 2012-05-15 | 2012-05-15 | エタロン及びエタロンの製造方法 |
JP2012-111530 | 2012-05-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013171929A1 true WO2013171929A1 (ja) | 2013-11-21 |
Family
ID=49583365
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2012/082647 WO2013171929A1 (ja) | 2012-05-15 | 2012-12-17 | エタロン及びエタロンの製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20140347735A1 (ja) |
JP (1) | JP5508469B2 (ja) |
KR (1) | KR20150021012A (ja) |
CN (1) | CN103733112B (ja) |
DE (1) | DE112012005599T5 (ja) |
WO (1) | WO2013171929A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015132781A (ja) * | 2014-01-16 | 2015-07-23 | 京セラクリスタルデバイス株式会社 | エタロンフィルタ及びその製造方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104060221B (zh) | 2013-03-23 | 2018-01-23 | 京瓷株式会社 | 光学器件制造方法 |
JP2016161802A (ja) * | 2015-03-03 | 2016-09-05 | 富士通株式会社 | 可変光減衰器及び光モジュール |
JP2017111092A (ja) * | 2015-12-18 | 2017-06-22 | 株式会社フジクラ | 光学素子および光学装置、光学素子および光学装置の検査装置、並びに光学素子および光学装置の検査方法 |
CN113365032A (zh) * | 2021-05-28 | 2021-09-07 | 武汉光迅科技股份有限公司 | 一种温度补偿标准具及可调激光器封装结构 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03185402A (ja) * | 1989-12-15 | 1991-08-13 | Nippon Telegr & Teleph Corp <Ntt> | 光周波数フイルタ |
JPH0461181A (ja) * | 1990-06-22 | 1992-02-27 | Mitsubishi Electric Corp | エタロン |
JP2001281443A (ja) * | 2000-03-28 | 2001-10-10 | Toyo Commun Equip Co Ltd | エアーギャップ型ファブリペローエタロン |
JP2002076513A (ja) * | 2000-09-01 | 2002-03-15 | Fujitsu Ltd | 温度無依存分布ブラッグ反射型ミラー及び面型光学素子 |
JP2002314179A (ja) * | 2001-04-09 | 2002-10-25 | Mitsubishi Cable Ind Ltd | 光利得等化器、光増幅装置及び光伝送システム |
JP2003195031A (ja) * | 2001-12-27 | 2003-07-09 | Toyo Commun Equip Co Ltd | エアギャップ型エタロンフィルタとその製造方法 |
JP2005010734A (ja) * | 2003-05-28 | 2005-01-13 | Kogaku Giken:Kk | 複合型エタロン素子及び該複合型エタロン素子を用いたレーザ装置 |
JP2012078474A (ja) * | 2010-09-30 | 2012-04-19 | Kyocera Kinseki Corp | エタロンフィルタ |
JP2012078475A (ja) * | 2010-09-30 | 2012-04-19 | Kyocera Kinseki Corp | エタロンフィルタ |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5802086A (en) * | 1996-01-29 | 1998-09-01 | Laser Power Corporation | Single cavity solid state laser with intracavity optical frequency mixing |
JP3294986B2 (ja) * | 1996-03-22 | 2002-06-24 | 富士通株式会社 | 温度依存性のない光素子 |
TW348903U (en) * | 1997-02-25 | 1998-12-21 | Yung-Fu Chen | Excitation-type single module solid state laser apparatus tightly sticked with optical-fiber coupling diode |
US6005995A (en) * | 1997-08-01 | 1999-12-21 | Dicon Fiberoptics, Inc. | Frequency sorter, and frequency locker for monitoring frequency shift of radiation source |
US7734131B2 (en) * | 2006-04-18 | 2010-06-08 | Xerox Corporation | Fabry-Perot tunable filter using a bonded pair of transparent substrates |
CN201499170U (zh) * | 2009-09-01 | 2010-06-02 | 武汉光迅科技股份有限公司 | 基于标准具结构的差分正交相移键控格式解调器 |
US20120075636A1 (en) * | 2010-09-23 | 2012-03-29 | Zilkie Aaron J | Tunable optical filters using cascaded etalons |
CN102253485A (zh) * | 2011-04-14 | 2011-11-23 | 福州高意通讯有限公司 | 一种精密标准具 |
-
2012
- 2012-05-15 JP JP2012111530A patent/JP5508469B2/ja active Active
- 2012-12-17 US US14/371,342 patent/US20140347735A1/en not_active Abandoned
- 2012-12-17 CN CN201280038609.7A patent/CN103733112B/zh not_active Expired - Fee Related
- 2012-12-17 WO PCT/JP2012/082647 patent/WO2013171929A1/ja active Application Filing
- 2012-12-17 KR KR20147019585A patent/KR20150021012A/ko not_active Application Discontinuation
- 2012-12-17 DE DE112012005599.3T patent/DE112012005599T5/de not_active Withdrawn
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03185402A (ja) * | 1989-12-15 | 1991-08-13 | Nippon Telegr & Teleph Corp <Ntt> | 光周波数フイルタ |
JPH0461181A (ja) * | 1990-06-22 | 1992-02-27 | Mitsubishi Electric Corp | エタロン |
JP2001281443A (ja) * | 2000-03-28 | 2001-10-10 | Toyo Commun Equip Co Ltd | エアーギャップ型ファブリペローエタロン |
JP2002076513A (ja) * | 2000-09-01 | 2002-03-15 | Fujitsu Ltd | 温度無依存分布ブラッグ反射型ミラー及び面型光学素子 |
JP2002314179A (ja) * | 2001-04-09 | 2002-10-25 | Mitsubishi Cable Ind Ltd | 光利得等化器、光増幅装置及び光伝送システム |
JP2003195031A (ja) * | 2001-12-27 | 2003-07-09 | Toyo Commun Equip Co Ltd | エアギャップ型エタロンフィルタとその製造方法 |
JP2005010734A (ja) * | 2003-05-28 | 2005-01-13 | Kogaku Giken:Kk | 複合型エタロン素子及び該複合型エタロン素子を用いたレーザ装置 |
JP2012078474A (ja) * | 2010-09-30 | 2012-04-19 | Kyocera Kinseki Corp | エタロンフィルタ |
JP2012078475A (ja) * | 2010-09-30 | 2012-04-19 | Kyocera Kinseki Corp | エタロンフィルタ |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015132781A (ja) * | 2014-01-16 | 2015-07-23 | 京セラクリスタルデバイス株式会社 | エタロンフィルタ及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
DE112012005599T5 (de) | 2014-10-02 |
US20140347735A1 (en) | 2014-11-27 |
JP2013238722A (ja) | 2013-11-28 |
JP5508469B2 (ja) | 2014-05-28 |
CN103733112B (zh) | 2018-02-13 |
KR20150021012A (ko) | 2015-02-27 |
CN103733112A (zh) | 2014-04-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20150253564A1 (en) | INTERFERENCE FILTER HAVING Ag-Sm-Cu REFLECTIVE FILM | |
JP5508469B2 (ja) | エタロン及びエタロンの製造方法 | |
CN103217730B (zh) | 一种渐变光学厚度窄带负滤光片膜系 | |
JP2012108440A (ja) | 干渉フィルター、光モジュール、及び光分析装置 | |
Gao et al. | Design, fabrication and characterization of a distributed Bragg reflector for reducing the étendue of a wavelength converting system | |
US20120044570A1 (en) | Interference filter, optical module, and analysis device | |
CN106124096B (zh) | 光学微腔、力测量装置及方法、模量测量方法及显示面板 | |
JP2007171735A (ja) | 広帯域反射防止膜 | |
EP2410369A1 (en) | Interference filter, optical module, and analyzing device | |
Shiraishi et al. | Silver-film subwavelength gratings for polarizers in the terahertz and mid-infrared regions | |
Morsy et al. | Highly selective ultraviolet aluminum plasmonic filters on silicon | |
JP5470842B2 (ja) | 光学フィルタ及び受光装置 | |
CN106324732B (zh) | 一种超宽带激光薄膜反射镜 | |
US9019606B2 (en) | Multilayer thin film attenuators | |
US10359544B2 (en) | Long-wave infrared anti-reflective laminate | |
US7508567B1 (en) | Metal etalon with enhancing stack | |
JP5978506B2 (ja) | 干渉フィルター、光モジュール、及び分析装置 | |
US20220244430A1 (en) | Optical filter, sensor system comprising same, and method for manufacturing halogenated amorphous silicon thin film for optical filter | |
JP2010185916A (ja) | ビームスプリット膜及びそれを用いたビームスプリッタ | |
CN106443848A (zh) | 一种宽带激光薄膜反射镜 | |
JP2017207659A (ja) | 光学フィルタ及びその製造方法 | |
JP5566968B2 (ja) | エタロンフィルタ及びエタロンフィルタの設計方法 | |
JP2001350024A (ja) | 偏光ビームスプリッタ | |
JP6761215B2 (ja) | 光学素子、エタロン、および回折格子、ならびに光学素子の製造方法 | |
JP5416175B2 (ja) | エタロンフィルタの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 12876842 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14371342 Country of ref document: US |
|
ENP | Entry into the national phase |
Ref document number: 20147019585 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 112012005599 Country of ref document: DE Ref document number: 1120120055993 Country of ref document: DE |
|
32PN | Ep: public notification in the ep bulletin as address of the adressee cannot be established |
Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 19/02/2015) |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 12876842 Country of ref document: EP Kind code of ref document: A1 |