WO2013155835A1 - 薄膜晶体管、阵列基板及其制造方法和显示面板 - Google Patents
薄膜晶体管、阵列基板及其制造方法和显示面板 Download PDFInfo
- Publication number
- WO2013155835A1 WO2013155835A1 PCT/CN2012/084323 CN2012084323W WO2013155835A1 WO 2013155835 A1 WO2013155835 A1 WO 2013155835A1 CN 2012084323 W CN2012084323 W CN 2012084323W WO 2013155835 A1 WO2013155835 A1 WO 2013155835A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- active layer
- layer pattern
- drain
- source
- gate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 105
- 239000010409 thin film Substances 0.000 title claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 claims description 19
- 230000005684 electric field Effects 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 138
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000000059 patterning Methods 0.000 description 7
- 239000012535 impurity Substances 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 229920001621 AMOLED Polymers 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1288—Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1296—Multistep manufacturing methods adapted to increase the uniformity of device parameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41733—Source or drain electrodes for field effect devices for thin film transistors with insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
- H01L29/78621—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/876,673 US9166059B2 (en) | 2012-04-16 | 2012-11-08 | Thin film transistor, array substrate and manufacturing method thereof, and display panel |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210112450.0 | 2012-04-16 | ||
CN2012101124500A CN102651403A (zh) | 2012-04-16 | 2012-04-16 | 薄膜晶体管、阵列基板及其制造方法和显示面板 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013155835A1 true WO2013155835A1 (zh) | 2013-10-24 |
Family
ID=46693363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2012/084323 WO2013155835A1 (zh) | 2012-04-16 | 2012-11-08 | 薄膜晶体管、阵列基板及其制造方法和显示面板 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9166059B2 (zh) |
CN (1) | CN102651403A (zh) |
WO (1) | WO2013155835A1 (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102651403A (zh) * | 2012-04-16 | 2012-08-29 | 京东方科技集团股份有限公司 | 薄膜晶体管、阵列基板及其制造方法和显示面板 |
CN103018974B (zh) * | 2012-11-30 | 2016-05-25 | 京东方科技集团股份有限公司 | 液晶显示装置、多晶硅阵列基板及制作方法 |
CN104576523A (zh) | 2013-10-16 | 2015-04-29 | 北京京东方光电科技有限公司 | 一种阵列基板及其制作方法和显示装置 |
CN103647028B (zh) * | 2013-12-19 | 2016-11-09 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法、显示装置 |
CN103681489B (zh) * | 2013-12-23 | 2016-01-06 | 京东方科技集团股份有限公司 | 阵列基板及其制造方法、显示装置 |
CN104600080B (zh) * | 2014-12-30 | 2018-10-19 | 深圳市华星光电技术有限公司 | 阵列基板、显示面板及阵列基板的制备方法 |
KR20170034169A (ko) * | 2015-09-18 | 2017-03-28 | (주)아모레퍼시픽 | 묻어남이 개선된 화장료 조성물 |
CN107154409A (zh) * | 2017-05-27 | 2017-09-12 | 京东方科技集团股份有限公司 | 一种薄膜晶体管及其制作方法、阵列基板、显示装置 |
CN109755261A (zh) * | 2018-12-26 | 2019-05-14 | 深圳市华星光电半导体显示技术有限公司 | 一种阵列基板及其制作方法 |
CN109976056B (zh) * | 2019-04-08 | 2023-04-14 | 京东方科技集团股份有限公司 | 阵列基板、其制作方法、显示面板及显示装置 |
CN110161761A (zh) * | 2019-05-10 | 2019-08-23 | 香港科技大学 | 液晶显示面板及其制作方法以及显示设备 |
CN112530978B (zh) * | 2020-12-01 | 2024-02-13 | 京东方科技集团股份有限公司 | 开关器件结构及其制备方法、薄膜晶体管膜层、显示面板 |
CN113687549A (zh) * | 2021-09-23 | 2021-11-23 | 合肥京东方显示技术有限公司 | 显示面板及显示面板的制作方法、显示装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090059110A1 (en) * | 2007-09-04 | 2009-03-05 | Hitachi Displays, Ltd. | Liquid crystal display device |
CN101894807A (zh) * | 2009-05-22 | 2010-11-24 | 北京京东方光电科技有限公司 | Tft-lcd阵列基板及其制造方法 |
CN202093289U (zh) * | 2011-06-30 | 2011-12-28 | 北京京东方光电科技有限公司 | 一种阵列基板及显示装置 |
CN102651403A (zh) * | 2012-04-16 | 2012-08-29 | 京东方科技集团股份有限公司 | 薄膜晶体管、阵列基板及其制造方法和显示面板 |
CN202512328U (zh) * | 2012-04-05 | 2012-10-31 | 北京京东方光电科技有限公司 | 一种阵列基板及显示装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6630977B1 (en) * | 1999-05-20 | 2003-10-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device with capacitor formed around contact hole |
-
2012
- 2012-04-16 CN CN2012101124500A patent/CN102651403A/zh active Pending
- 2012-11-08 WO PCT/CN2012/084323 patent/WO2013155835A1/zh active Application Filing
- 2012-11-08 US US13/876,673 patent/US9166059B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090059110A1 (en) * | 2007-09-04 | 2009-03-05 | Hitachi Displays, Ltd. | Liquid crystal display device |
CN101894807A (zh) * | 2009-05-22 | 2010-11-24 | 北京京东方光电科技有限公司 | Tft-lcd阵列基板及其制造方法 |
CN202093289U (zh) * | 2011-06-30 | 2011-12-28 | 北京京东方光电科技有限公司 | 一种阵列基板及显示装置 |
CN202512328U (zh) * | 2012-04-05 | 2012-10-31 | 北京京东方光电科技有限公司 | 一种阵列基板及显示装置 |
CN102651403A (zh) * | 2012-04-16 | 2012-08-29 | 京东方科技集团股份有限公司 | 薄膜晶体管、阵列基板及其制造方法和显示面板 |
Also Published As
Publication number | Publication date |
---|---|
US20150028418A1 (en) | 2015-01-29 |
CN102651403A (zh) | 2012-08-29 |
US9166059B2 (en) | 2015-10-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2013155835A1 (zh) | 薄膜晶体管、阵列基板及其制造方法和显示面板 | |
US10438973B2 (en) | Display device and method for manufacturing same | |
TWI618123B (zh) | 陣列基板、顯示裝置及陣列基板的製備方法 | |
JP2010003910A (ja) | 表示素子 | |
US9964854B2 (en) | Doping method for array substrate and manufacturing equipment of the same | |
JP5150555B2 (ja) | キャパシタ及び薄膜トランジスタを有する基板、これを具備した平板ディスプレイ装置及び該キャパシタ及び薄膜トランジスタを有する基板の製造方法 | |
US9548324B2 (en) | Array substrate and method for fabricating the same | |
CN106486522A (zh) | 有机发光显示装置及其制造方法 | |
WO2016157351A1 (ja) | 薄膜トランジスタ及び表示パネル | |
WO2017118158A1 (zh) | 薄膜晶体管、阵列基板及其制造方法、和显示装置 | |
JP2006287220A (ja) | 薄膜トランジスタ、平板表示装置及びその製造方法 | |
US10157940B2 (en) | Method for manufacturing LTPS array substrate | |
JP6239606B2 (ja) | 薄膜トランジスタ、アレイ基板及びその製造方法 | |
JP2018049919A5 (ja) | 半導体装置 | |
WO2016072024A1 (ja) | 薄膜トランジスタの製造方法、薄膜トランジスタ及び表示パネル | |
WO2020244292A1 (zh) | 发光二极管驱动背板及其制备方法、显示装置 | |
WO2019205334A1 (zh) | 阵列基板及其制作方法 | |
US9343483B2 (en) | Method for manufacturing thin film transistor array substrate | |
US9057923B2 (en) | Wire, method of manufacture, and related apparatus | |
KR102174921B1 (ko) | 박막트랜지스터 어레이 기판 및 그의 제조방법 | |
KR101892264B1 (ko) | 복수의 박막 트랜지스터를 갖는 표시 장치의 제조 방법 및 이 제조 방법에 의해 제조된 표시 장치 | |
US9041001B2 (en) | Thin film transistor array panel and manufacturing method thereof | |
CN105489499B (zh) | Ltps薄膜晶体管制造方法 | |
KR101310911B1 (ko) | 평판 표시장치용 폴리실리콘 박막 트랜지스터 기판의제조방법 | |
KR20080024338A (ko) | 박막 트랜지스터 기판 및 이의 제조 방법 그리고 이를 갖는표시 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 13876673 Country of ref document: US |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 12874593 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
32PN | Ep: public notification in the ep bulletin as address of the adressee cannot be established |
Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 03/03/2015) |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 12874593 Country of ref document: EP Kind code of ref document: A1 |