WO2013145602A1 - 太陽電池封止材および太陽電池モジュール - Google Patents
太陽電池封止材および太陽電池モジュール Download PDFInfo
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- WO2013145602A1 WO2013145602A1 PCT/JP2013/001659 JP2013001659W WO2013145602A1 WO 2013145602 A1 WO2013145602 A1 WO 2013145602A1 JP 2013001659 W JP2013001659 W JP 2013001659W WO 2013145602 A1 WO2013145602 A1 WO 2013145602A1
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- WIPO (PCT)
- Prior art keywords
- solar cell
- ethylene
- olefin copolymer
- sheet
- encapsulant
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- 239000003566 sealing material Substances 0.000 title claims abstract description 86
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims abstract description 208
- 239000005977 Ethylene Substances 0.000 claims abstract description 208
- 239000004711 α-olefin Substances 0.000 claims abstract description 205
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims abstract description 175
- 239000011737 fluorine Substances 0.000 claims abstract description 26
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 26
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 25
- 238000004255 ion exchange chromatography Methods 0.000 claims abstract description 11
- 238000009841 combustion method Methods 0.000 claims abstract description 10
- 239000008393 encapsulating agent Substances 0.000 claims description 166
- 230000001681 protective effect Effects 0.000 claims description 56
- 238000004132 cross linking Methods 0.000 claims description 51
- 239000003381 stabilizer Substances 0.000 claims description 50
- 150000001451 organic peroxides Chemical class 0.000 claims description 43
- 150000001412 amines Chemical class 0.000 claims description 26
- 239000004611 light stabiliser Substances 0.000 claims description 26
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 25
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 23
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 21
- 239000011574 phosphorus Substances 0.000 claims description 21
- 229910052698 phosphorus Inorganic materials 0.000 claims description 21
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 17
- 125000004432 carbon atom Chemical group C* 0.000 claims description 15
- 239000000654 additive Substances 0.000 claims description 12
- 239000006096 absorbing agent Substances 0.000 claims description 9
- 238000004898 kneading Methods 0.000 claims description 8
- 238000003490 calendering Methods 0.000 claims description 5
- 238000004458 analytical method Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 130
- 150000001875 compounds Chemical class 0.000 description 64
- 238000000034 method Methods 0.000 description 56
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 54
- -1 or the like Inorganic materials 0.000 description 50
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 40
- 238000006116 polymerization reaction Methods 0.000 description 35
- 238000001125 extrusion Methods 0.000 description 34
- 238000000465 moulding Methods 0.000 description 34
- 150000008040 ionic compounds Chemical class 0.000 description 30
- 239000010409 thin film Substances 0.000 description 30
- 229910052751 metal Inorganic materials 0.000 description 27
- 239000002184 metal Substances 0.000 description 27
- 239000011342 resin composition Substances 0.000 description 26
- 238000010030 laminating Methods 0.000 description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 20
- 229910052710 silicon Inorganic materials 0.000 description 20
- 239000010703 silicon Substances 0.000 description 20
- 238000004519 manufacturing process Methods 0.000 description 19
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 18
- 229920005989 resin Polymers 0.000 description 18
- 239000011347 resin Substances 0.000 description 18
- 238000010248 power generation Methods 0.000 description 17
- 238000007789 sealing Methods 0.000 description 17
- 239000000243 solution Substances 0.000 description 17
- 239000011521 glass Substances 0.000 description 16
- 239000002904 solvent Substances 0.000 description 16
- 239000000203 mixture Substances 0.000 description 15
- 230000015572 biosynthetic process Effects 0.000 description 14
- 230000007423 decrease Effects 0.000 description 14
- 239000000499 gel Substances 0.000 description 14
- 230000008569 process Effects 0.000 description 14
- 238000003786 synthesis reaction Methods 0.000 description 14
- 239000003054 catalyst Substances 0.000 description 12
- 239000010408 film Substances 0.000 description 12
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 12
- 150000002500 ions Chemical class 0.000 description 12
- 238000003475 lamination Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 11
- 229910052739 hydrogen Inorganic materials 0.000 description 11
- 239000001257 hydrogen Substances 0.000 description 11
- 239000011259 mixed solution Substances 0.000 description 11
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 10
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 230000007774 longterm Effects 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 8
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- 229910021419 crystalline silicon Inorganic materials 0.000 description 8
- 230000006866 deterioration Effects 0.000 description 8
- 238000004049 embossing Methods 0.000 description 8
- 150000003254 radicals Chemical class 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 7
- 229930195733 hydrocarbon Natural products 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 7
- 230000000704 physical effect Effects 0.000 description 7
- OLFPYUPGPBITMH-UHFFFAOYSA-N tritylium Chemical compound C1=CC=CC=C1[C+](C=1C=CC=CC=1)C1=CC=CC=C1 OLFPYUPGPBITMH-UHFFFAOYSA-N 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 6
- 238000000354 decomposition reaction Methods 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 230000002349 favourable effect Effects 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- 239000008188 pellet Substances 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 238000007493 shaping process Methods 0.000 description 6
- 229910000077 silane Inorganic materials 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- MCULRUJILOGHCJ-UHFFFAOYSA-N triisobutylaluminium Chemical compound CC(C)C[Al](CC(C)C)CC(C)C MCULRUJILOGHCJ-UHFFFAOYSA-N 0.000 description 6
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 6
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 6
- 239000004215 Carbon black (E152) Substances 0.000 description 5
- HFKJQIJFRMRSKM-UHFFFAOYSA-N [3,5-bis(trifluoromethyl)phenoxy]boronic acid Chemical compound OB(O)OC1=CC(C(F)(F)F)=CC(C(F)(F)F)=C1 HFKJQIJFRMRSKM-UHFFFAOYSA-N 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 5
- 230000015556 catabolic process Effects 0.000 description 5
- 230000006378 damage Effects 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 238000009472 formulation Methods 0.000 description 5
- 239000012760 heat stabilizer Substances 0.000 description 5
- 230000035699 permeability Effects 0.000 description 5
- 229920006254 polymer film Polymers 0.000 description 5
- 230000037048 polymerization activity Effects 0.000 description 5
- 229920005672 polyolefin resin Polymers 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 239000011800 void material Substances 0.000 description 5
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 4
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 4
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 4
- SGVYKUFIHHTIFL-UHFFFAOYSA-N 2-methylnonane Chemical compound CCCCCCCC(C)C SGVYKUFIHHTIFL-UHFFFAOYSA-N 0.000 description 4
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 4
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000007334 copolymerization reaction Methods 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 4
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 4
- 125000001153 fluoro group Chemical group F* 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 150000002430 hydrocarbons Chemical class 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 4
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 4
- 229920000098 polyolefin Polymers 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000001226 reprecipitation Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910052723 transition metal Inorganic materials 0.000 description 4
- 150000003624 transition metals Chemical class 0.000 description 4
- 238000004383 yellowing Methods 0.000 description 4
- AFABGHUZZDYHJO-UHFFFAOYSA-N 2-Methylpentane Chemical compound CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- 239000002033 PVDF binder Substances 0.000 description 3
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 3
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 3
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000003851 corona treatment Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 3
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 3
- 239000005357 flat glass Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- VFLWKHBYVIUAMP-UHFFFAOYSA-N n-methyl-n-octadecyloctadecan-1-amine Chemical compound CCCCCCCCCCCCCCCCCCN(C)CCCCCCCCCCCCCCCCCC VFLWKHBYVIUAMP-UHFFFAOYSA-N 0.000 description 3
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 3
- 238000009832 plasma treatment Methods 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 150000004291 polyenes Chemical class 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- YBRBMKDOPFTVDT-UHFFFAOYSA-N tert-butylamine Chemical compound CC(C)(C)N YBRBMKDOPFTVDT-UHFFFAOYSA-N 0.000 description 3
- DLSMLZRPNPCXGY-UHFFFAOYSA-N tert-butylperoxy 2-ethylhexyl carbonate Chemical compound CCCCC(CC)COC(=O)OOOC(C)(C)C DLSMLZRPNPCXGY-UHFFFAOYSA-N 0.000 description 3
- ZWYDDDAMNQQZHD-UHFFFAOYSA-L titanium(ii) chloride Chemical compound [Cl-].[Cl-].[Ti+2] ZWYDDDAMNQQZHD-UHFFFAOYSA-L 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- OJOWICOBYCXEKR-APPZFPTMSA-N (1S,4R)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound CC=C1C[C@@H]2C[C@@H]1C=C2 OJOWICOBYCXEKR-APPZFPTMSA-N 0.000 description 2
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 2
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 2
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 2
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 2
- HNSDLXPSAYFUHK-UHFFFAOYSA-N 1,4-bis(2-ethylhexyl) sulfosuccinate Chemical compound CCCCC(CC)COC(=O)CC(S(O)(=O)=O)C(=O)OCC(CC)CCCC HNSDLXPSAYFUHK-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- XGIDEUICZZXBFQ-UHFFFAOYSA-N 1h-benzimidazol-2-ylmethanethiol Chemical compound C1=CC=C2NC(CS)=NC2=C1 XGIDEUICZZXBFQ-UHFFFAOYSA-N 0.000 description 2
- GZBSIABKXVPBFY-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO GZBSIABKXVPBFY-UHFFFAOYSA-N 0.000 description 2
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- GTJOHISYCKPIMT-UHFFFAOYSA-N 2-methylundecane Chemical compound CCCCCCCCCC(C)C GTJOHISYCKPIMT-UHFFFAOYSA-N 0.000 description 2
- OCKGFTQIICXDQW-ZEQRLZLVSA-N 5-[(1r)-1-hydroxy-2-[4-[(2r)-2-hydroxy-2-(4-methyl-1-oxo-3h-2-benzofuran-5-yl)ethyl]piperazin-1-yl]ethyl]-4-methyl-3h-2-benzofuran-1-one Chemical compound C1=C2C(=O)OCC2=C(C)C([C@@H](O)CN2CCN(CC2)C[C@H](O)C2=CC=C3C(=O)OCC3=C2C)=C1 OCKGFTQIICXDQW-ZEQRLZLVSA-N 0.000 description 2
- INYHZQLKOKTDAI-UHFFFAOYSA-N 5-ethenylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C=C)CC1C=C2 INYHZQLKOKTDAI-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 0 CCC1(C)N(*)C(C)(C)CCC1 Chemical compound CCC1(C)N(*)C(C)(C)CCC1 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004641 Diallyl-phthalate Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- RWNKSTSCBHKHTB-UHFFFAOYSA-N Hexachloro-1,3-butadiene Chemical compound ClC(Cl)=C(Cl)C(Cl)=C(Cl)Cl RWNKSTSCBHKHTB-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 2
- 229920003354 Modic® Polymers 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000008346 aqueous phase Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- UHOVQNZJYSORNB-MZWXYZOWSA-N benzene-d6 Chemical compound [2H]C1=C([2H])C([2H])=C([2H])C([2H])=C1[2H] UHOVQNZJYSORNB-MZWXYZOWSA-N 0.000 description 2
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 2
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- DVRDHUBQLOKMHZ-UHFFFAOYSA-N chalcopyrite Chemical compound [S-2].[S-2].[Fe+2].[Cu+2] DVRDHUBQLOKMHZ-UHFFFAOYSA-N 0.000 description 2
- 229910052951 chalcopyrite Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 239000003426 co-catalyst Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- LPIQUOYDBNQMRZ-UHFFFAOYSA-N cyclopentene Chemical compound C1CC=CC1 LPIQUOYDBNQMRZ-UHFFFAOYSA-N 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- JLTDJTHDQAWBAV-UHFFFAOYSA-O dimethyl(phenyl)azanium Chemical compound C[NH+](C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-O 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- QHZOMAXECYYXGP-UHFFFAOYSA-N ethene;prop-2-enoic acid Chemical compound C=C.OC(=O)C=C QHZOMAXECYYXGP-UHFFFAOYSA-N 0.000 description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 2
- 239000011152 fibreglass Substances 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 125000001841 imino group Chemical group [H]N=* 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- VKPSKYDESGTTFR-UHFFFAOYSA-N isododecane Natural products CC(C)(C)CC(C)CC(C)(C)C VKPSKYDESGTTFR-UHFFFAOYSA-N 0.000 description 2
- QWTDNUCVQCZILF-UHFFFAOYSA-N isopentane Chemical compound CCC(C)C QWTDNUCVQCZILF-UHFFFAOYSA-N 0.000 description 2
- 239000003350 kerosene Substances 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- GDOPTJXRTPNYNR-UHFFFAOYSA-N methylcyclopentane Chemical compound CC1CCCC1 GDOPTJXRTPNYNR-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- DZCCLNYLUGNUKQ-UHFFFAOYSA-N n-(4-nitrosophenyl)hydroxylamine Chemical compound ONC1=CC=C(N=O)C=C1 DZCCLNYLUGNUKQ-UHFFFAOYSA-N 0.000 description 2
- ZCYXXKJEDCHMGH-UHFFFAOYSA-N nonane Chemical compound CCCC[CH]CCCC ZCYXXKJEDCHMGH-UHFFFAOYSA-N 0.000 description 2
- BKIMMITUMNQMOS-UHFFFAOYSA-N normal nonane Natural products CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 2
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 239000002685 polymerization catalyst Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- 239000002516 radical scavenger Substances 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 229920001897 terpolymer Polymers 0.000 description 2
- ZUSDEBDNDIJDMZ-UHFFFAOYSA-N tert-butyl 7-methyloctaneperoxoate Chemical compound CC(C)CCCCCC(=O)OOC(C)(C)C ZUSDEBDNDIJDMZ-UHFFFAOYSA-N 0.000 description 2
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- VOITXYVAKOUIBA-UHFFFAOYSA-N triethylaluminium Chemical compound CC[Al](CC)CC VOITXYVAKOUIBA-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 150000003751 zinc Chemical class 0.000 description 2
- VPGLGRNSAYHXPY-UHFFFAOYSA-L zirconium(2+);dichloride Chemical compound Cl[Zr]Cl VPGLGRNSAYHXPY-UHFFFAOYSA-L 0.000 description 2
- NSBJGTVSOLZXPI-UHFFFAOYSA-N (1-ethyl-2,2,6,6-tetramethylpiperidin-4-yl) 2-methylprop-2-enoate Chemical compound CCN1C(C)(C)CC(OC(=O)C(C)=C)CC1(C)C NSBJGTVSOLZXPI-UHFFFAOYSA-N 0.000 description 1
- KDWZUULSWJRAPK-UHFFFAOYSA-N (1-ethyl-2,2,6,6-tetramethylpiperidin-4-yl) prop-2-enoate Chemical compound CCN1C(C)(C)CC(OC(=O)C=C)CC1(C)C KDWZUULSWJRAPK-UHFFFAOYSA-N 0.000 description 1
- XMCLXVNPGNYTRE-VOTSOKGWSA-N (2,2,6,6-tetramethylpiperidin-4-yl) (e)-but-2-enoate Chemical compound C\C=C\C(=O)OC1CC(C)(C)NC(C)(C)C1 XMCLXVNPGNYTRE-VOTSOKGWSA-N 0.000 description 1
- UFLXKQBCEYNCDU-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CC(C)(C)NC(C)(C)C1 UFLXKQBCEYNCDU-UHFFFAOYSA-N 0.000 description 1
- BUFCQVRLKYIQJP-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) prop-2-enoate Chemical compound CC1(C)CC(OC(=O)C=C)CC(C)(C)N1 BUFCQVRLKYIQJP-UHFFFAOYSA-N 0.000 description 1
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 1
- RIPYNJLMMFGZSX-UHFFFAOYSA-N (5-benzoylperoxy-2,5-dimethylhexan-2-yl) benzenecarboperoxoate Chemical compound C=1C=CC=CC=1C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C1=CC=CC=C1 RIPYNJLMMFGZSX-UHFFFAOYSA-N 0.000 description 1
- AQSGIPQBQYCRLQ-UHFFFAOYSA-N (6,6-dihydroxy-4-methoxycyclohexa-2,4-dien-1-yl)-phenylmethanone Chemical compound C1=CC(OC)=CC(O)(O)C1C(=O)C1=CC=CC=C1 AQSGIPQBQYCRLQ-UHFFFAOYSA-N 0.000 description 1
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- BLKRGXCGFRXRNQ-SNAWJCMRSA-N (z)-3-carbonoperoxoyl-4,4-dimethylpent-2-enoic acid Chemical compound OC(=O)/C=C(C(C)(C)C)\C(=O)OO BLKRGXCGFRXRNQ-SNAWJCMRSA-N 0.000 description 1
- VMJIDDGLSSJEFK-UHFFFAOYSA-N 1,1,5-trimethyl-3,3-bis(2-methylbutan-2-ylperoxy)cyclohexane Chemical compound CCC(C)(C)OOC1(OOC(C)(C)CC)CC(C)CC(C)(C)C1 VMJIDDGLSSJEFK-UHFFFAOYSA-N 0.000 description 1
- IMYCVFRTNVMHAD-UHFFFAOYSA-N 1,1-bis(2-methylbutan-2-ylperoxy)cyclohexane Chemical compound CCC(C)(C)OOC1(OOC(C)(C)CC)CCCCC1 IMYCVFRTNVMHAD-UHFFFAOYSA-N 0.000 description 1
- QIMNMPKJEMBZKM-UHFFFAOYSA-N 1,1-bis(butylperoxy)cyclohexane Chemical compound CCCCOOC1(OOCCCC)CCCCC1 QIMNMPKJEMBZKM-UHFFFAOYSA-N 0.000 description 1
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- VDYWHVQKENANGY-UHFFFAOYSA-N 1,3-Butyleneglycol dimethacrylate Chemical compound CC(=C)C(=O)OC(C)CCOC(=O)C(C)=C VDYWHVQKENANGY-UHFFFAOYSA-N 0.000 description 1
- AYMDJPGTQFHDSA-UHFFFAOYSA-N 1-(2-ethenoxyethoxy)-2-ethoxyethane Chemical compound CCOCCOCCOC=C AYMDJPGTQFHDSA-UHFFFAOYSA-N 0.000 description 1
- GRSGFPUWHKVFJW-UHFFFAOYSA-N 1-[1-(1-hydroxypropan-2-yloxy)propan-2-yloxy]-3-methoxypropan-2-ol;prop-2-enoic acid Chemical compound OC(=O)C=C.COCC(O)COC(C)COC(C)CO GRSGFPUWHKVFJW-UHFFFAOYSA-N 0.000 description 1
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 1
- GIKJRHVSVIXCDQ-UHFFFAOYSA-N 1-[bis(3,5-dimethylphenyl)methyl]-3,5-dimethylbenzene Chemical compound CC1=CC(C)=CC([C+](C=2C=C(C)C=C(C)C=2)C=2C=C(C)C=C(C)C=2)=C1 GIKJRHVSVIXCDQ-UHFFFAOYSA-N 0.000 description 1
- VQCMTPXZRXULMQ-UHFFFAOYSA-N 1-[bis(4-methylphenyl)methyl]-4-methylbenzene Chemical compound C1=CC(C)=CC=C1[C+](C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 VQCMTPXZRXULMQ-UHFFFAOYSA-N 0.000 description 1
- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 description 1
- NVZWEEGUWXZOKI-UHFFFAOYSA-N 1-ethenyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C=C NVZWEEGUWXZOKI-UHFFFAOYSA-N 0.000 description 1
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 description 1
- OGHKVCJFHNKOEC-UHFFFAOYSA-N 1-methoxyethane-1,2-diol;2-methylprop-2-enoic acid Chemical compound COC(O)CO.CC(=C)C(O)=O OGHKVCJFHNKOEC-UHFFFAOYSA-N 0.000 description 1
- WAUKBOOEPYNAGU-UHFFFAOYSA-N 1-phenylprop-2-enyl acetate Chemical compound CC(=O)OC(C=C)C1=CC=CC=C1 WAUKBOOEPYNAGU-UHFFFAOYSA-N 0.000 description 1
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 1
- RKMGAJGJIURJSJ-UHFFFAOYSA-N 2,2,6,6-Tetramethylpiperidine Substances CC1(C)CCCC(C)(C)N1 RKMGAJGJIURJSJ-UHFFFAOYSA-N 0.000 description 1
- HQOVXPHOJANJBR-UHFFFAOYSA-N 2,2-bis(tert-butylperoxy)butane Chemical compound CC(C)(C)OOC(C)(CC)OOC(C)(C)C HQOVXPHOJANJBR-UHFFFAOYSA-N 0.000 description 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 1
- GJDRKHHGPHLVNI-UHFFFAOYSA-N 2,6-ditert-butyl-4-(diethoxyphosphorylmethyl)phenol Chemical compound CCOP(=O)(OCC)CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 GJDRKHHGPHLVNI-UHFFFAOYSA-N 0.000 description 1
- FTALTLPZDVFJSS-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl prop-2-enoate Chemical compound CCOCCOCCOC(=O)C=C FTALTLPZDVFJSS-UHFFFAOYSA-N 0.000 description 1
- LHPPDQUVECZQSW-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-ditert-butylphenol Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=CC=CC3=N2)=C1O LHPPDQUVECZQSW-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 1
- XUDBVJCTLZTSDC-UHFFFAOYSA-N 2-ethenylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C=C XUDBVJCTLZTSDC-UHFFFAOYSA-N 0.000 description 1
- CTHJQRHPNQEPAB-UHFFFAOYSA-N 2-methoxyethenylbenzene Chemical compound COC=CC1=CC=CC=C1 CTHJQRHPNQEPAB-UHFFFAOYSA-N 0.000 description 1
- WGRZHLPEQDVPET-UHFFFAOYSA-N 2-methoxyethoxysilane Chemical compound COCCO[SiH3] WGRZHLPEQDVPET-UHFFFAOYSA-N 0.000 description 1
- HFCUBKYHMMPGBY-UHFFFAOYSA-N 2-methoxyethyl prop-2-enoate Chemical compound COCCOC(=O)C=C HFCUBKYHMMPGBY-UHFFFAOYSA-N 0.000 description 1
- IFXDUNDBQDXPQZ-UHFFFAOYSA-N 2-methylbutan-2-yl 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)CC IFXDUNDBQDXPQZ-UHFFFAOYSA-N 0.000 description 1
- HDCMRFUDMYGBFU-UHFFFAOYSA-N 2-methylbutan-2-yl 7-methyloctaneperoxoate Chemical compound CCC(C)(C)OOC(=O)CCCCCC(C)C HDCMRFUDMYGBFU-UHFFFAOYSA-N 0.000 description 1
- BTOVVHWKPVSLBI-UHFFFAOYSA-N 2-methylprop-1-enylbenzene Chemical compound CC(C)=CC1=CC=CC=C1 BTOVVHWKPVSLBI-UHFFFAOYSA-N 0.000 description 1
- XLLXMBCBJGATSP-UHFFFAOYSA-N 2-phenylethenol Chemical compound OC=CC1=CC=CC=C1 XLLXMBCBJGATSP-UHFFFAOYSA-N 0.000 description 1
- PFANXOISJYKQRP-UHFFFAOYSA-N 2-tert-butyl-4-[1-(5-tert-butyl-4-hydroxy-2-methylphenyl)butyl]-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(CCC)C1=CC(C(C)(C)C)=C(O)C=C1C PFANXOISJYKQRP-UHFFFAOYSA-N 0.000 description 1
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 description 1
- XOUQAVYLRNOXDO-UHFFFAOYSA-N 2-tert-butyl-5-methylphenol Chemical compound CC1=CC=C(C(C)(C)C)C(O)=C1 XOUQAVYLRNOXDO-UHFFFAOYSA-N 0.000 description 1
- PKXHXOTZMFCXSH-UHFFFAOYSA-N 3,3-dimethylbut-1-ene Chemical compound CC(C)(C)C=C PKXHXOTZMFCXSH-UHFFFAOYSA-N 0.000 description 1
- AIBRSVLEQRWAEG-UHFFFAOYSA-N 3,9-bis(2,4-ditert-butylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP1OCC2(COP(OC=3C(=CC(=CC=3)C(C)(C)C)C(C)(C)C)OC2)CO1 AIBRSVLEQRWAEG-UHFFFAOYSA-N 0.000 description 1
- WPMYUUITDBHVQZ-UHFFFAOYSA-N 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoic acid Chemical compound CC(C)(C)C1=CC(CCC(O)=O)=CC(C(C)(C)C)=C1O WPMYUUITDBHVQZ-UHFFFAOYSA-N 0.000 description 1
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical compound CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 description 1
- IYMZEPRSPLASMS-UHFFFAOYSA-N 3-phenylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C=CC=CC=2)=C1 IYMZEPRSPLASMS-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- QRLSTWVLSWCGBT-UHFFFAOYSA-N 4-((4,6-bis(octylthio)-1,3,5-triazin-2-yl)amino)-2,6-di-tert-butylphenol Chemical compound CCCCCCCCSC1=NC(SCCCCCCCC)=NC(NC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=N1 QRLSTWVLSWCGBT-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- PRWJPWSKLXYEPD-UHFFFAOYSA-N 4-[4,4-bis(5-tert-butyl-4-hydroxy-2-methylphenyl)butan-2-yl]-2-tert-butyl-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(C)CC(C=1C(=CC(O)=C(C=1)C(C)(C)C)C)C1=CC(C(C)(C)C)=C(O)C=C1C PRWJPWSKLXYEPD-UHFFFAOYSA-N 0.000 description 1
- IFQUPKAISSPFTE-UHFFFAOYSA-N 4-benzoylbenzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C(=O)C1=CC=CC=C1 IFQUPKAISSPFTE-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- PCBPVYHMZBWMAZ-UHFFFAOYSA-N 5-methylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C)CC1C=C2 PCBPVYHMZBWMAZ-UHFFFAOYSA-N 0.000 description 1
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 description 1
- ZVVFVKJZNVSANF-UHFFFAOYSA-N 6-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]hexyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCCCCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 ZVVFVKJZNVSANF-UHFFFAOYSA-N 0.000 description 1
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 1
- UYQYTUYNNYZATF-UHFFFAOYSA-N 6-methyl-4,6-bis(octylsulfanylmethyl)cyclohexa-1,3-dien-1-ol Chemical compound CCCCCCCCSCC1=CC=C(O)C(C)(CSCCCCCCCC)C1 UYQYTUYNNYZATF-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- YJVIKVWFGPLAFS-UHFFFAOYSA-N 9-(2-methylprop-2-enoyloxy)nonyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCCOC(=O)C(C)=C YJVIKVWFGPLAFS-UHFFFAOYSA-N 0.000 description 1
- PGDIJTMOHORACQ-UHFFFAOYSA-N 9-prop-2-enoyloxynonyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCCCCOC(=O)C=C PGDIJTMOHORACQ-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- YBNOEZKARHCDRT-UHFFFAOYSA-N C(C(=C)C)(=O)O.C(C(=C)C)(=O)O.C(C(=C)C)(=O)O.C(O)C(CC)(CO)CO.C(C=C)(=O)OCC(COC(C=C)=O)(COC(C=C)=O)CO Chemical compound C(C(=C)C)(=O)O.C(C(=C)C)(=O)O.C(C(=C)C)(=O)O.C(O)C(CC)(CO)CO.C(C=C)(=O)OCC(COC(C=C)=O)(COC(C=C)=O)CO YBNOEZKARHCDRT-UHFFFAOYSA-N 0.000 description 1
- CYTPJUBIQMZICX-UHFFFAOYSA-N C(C=C)(=O)O.C(C=C)(=O)O.C(C=C)(=O)O.C(C=C)(=O)O.C(COCCOCCOCCO)O Chemical class C(C=C)(=O)O.C(C=C)(=O)O.C(C=C)(=O)O.C(C=C)(=O)O.C(COCCOCCOCCO)O CYTPJUBIQMZICX-UHFFFAOYSA-N 0.000 description 1
- QBGCSLJFKGCXHX-UHFFFAOYSA-N C(C=C)(=O)OC1CC(N(C(C1)(C)C)CCCC)(C)C.C(C=C)(=O)OC1CC(N(C(C1)(C)C)CCC)(C)C Chemical compound C(C=C)(=O)OC1CC(N(C(C1)(C)C)CCCC)(C)C.C(C=C)(=O)OC1CC(N(C(C1)(C)C)CCC)(C)C QBGCSLJFKGCXHX-UHFFFAOYSA-N 0.000 description 1
- QKOUDQLPNRPSPF-UHFFFAOYSA-N C(CCCCCCC)SC1=NC(=NC(=N1)SCCCCCCCC)N[S] Chemical compound C(CCCCCCC)SC1=NC(=NC(=N1)SCCCCCCCC)N[S] QKOUDQLPNRPSPF-UHFFFAOYSA-N 0.000 description 1
- 229910004612 CdTe—CdS Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- 239000003508 Dilauryl thiodipropionate Substances 0.000 description 1
- 239000002656 Distearyl thiodipropionate Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- NHTMVDHEPJAVLT-UHFFFAOYSA-N Isooctane Chemical compound CC(C)CC(C)(C)C NHTMVDHEPJAVLT-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 238000000944 Soxhlet extraction Methods 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- ULQMPOIOSDXIGC-UHFFFAOYSA-N [2,2-dimethyl-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)COC(=O)C(C)=C ULQMPOIOSDXIGC-UHFFFAOYSA-N 0.000 description 1
- SWHLOXLFJPTYTL-UHFFFAOYSA-N [2-methyl-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(COC(=O)C(C)=C)COC(=O)C(C)=C SWHLOXLFJPTYTL-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- HCIMXTXCDVBLOA-UHFFFAOYSA-N [4-(trifluoromethyl)phenoxy]boronic acid Chemical compound OB(O)OC1=CC=C(C(F)(F)F)C=C1 HCIMXTXCDVBLOA-UHFFFAOYSA-N 0.000 description 1
- BEIOEBMXPVYLRY-UHFFFAOYSA-N [4-[4-bis(2,4-ditert-butylphenoxy)phosphanylphenyl]phenyl]-bis(2,4-ditert-butylphenoxy)phosphane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(C=1C=CC(=CC=1)C=1C=CC(=CC=1)P(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C BEIOEBMXPVYLRY-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000005234 alkyl aluminium group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 230000003373 anti-fouling effect Effects 0.000 description 1
- 229940121375 antifungal agent Drugs 0.000 description 1
- 239000003429 antifungal agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- UORVGPXVDQYIDP-BJUDXGSMSA-N borane Chemical class [10BH3] UORVGPXVDQYIDP-BJUDXGSMSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000001460 carbon-13 nuclear magnetic resonance spectrum Methods 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000011437 continuous method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 150000007973 cyanuric acids Chemical class 0.000 description 1
- ZXIJMRYMVAMXQP-UHFFFAOYSA-N cycloheptene Chemical compound C1CCC=CCC1 ZXIJMRYMVAMXQP-UHFFFAOYSA-N 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- GGSUCNLOZRCGPQ-UHFFFAOYSA-O diethyl(phenyl)azanium Chemical compound CC[NH+](CC)C1=CC=CC=C1 GGSUCNLOZRCGPQ-UHFFFAOYSA-O 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 235000019304 dilauryl thiodipropionate Nutrition 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- JVSWJIKNEAIKJW-UHFFFAOYSA-N dimethyl-hexane Natural products CCCCCC(C)C JVSWJIKNEAIKJW-UHFFFAOYSA-N 0.000 description 1
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 1
- 235000019305 distearyl thiodipropionate Nutrition 0.000 description 1
- 229940069096 dodecene Drugs 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 150000002221 fluorine Chemical class 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000012685 gas phase polymerization Methods 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- JVWYAVMRKSBOGJ-UHFFFAOYSA-N hexadecyl 2-methylprop-2-enoate;2-methylprop-2-enoic acid Chemical class CC(=C)C(O)=O.CCCCCCCCCCCCCCCCOC(=O)C(C)=C JVWYAVMRKSBOGJ-UHFFFAOYSA-N 0.000 description 1
- PZDUWXKXFAIFOR-UHFFFAOYSA-N hexadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCOC(=O)C=C PZDUWXKXFAIFOR-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- GNARHXWTMJZNTP-UHFFFAOYSA-N methoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[SiH2]CCCOCC1CO1 GNARHXWTMJZNTP-UHFFFAOYSA-N 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- CPOFMOWDMVWCLF-UHFFFAOYSA-N methyl(oxo)alumane Chemical compound C[Al]=O CPOFMOWDMVWCLF-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- JESXATFQYMPTNL-UHFFFAOYSA-N mono-hydroxyphenyl-ethylene Natural products OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- XKIVKIIBCJIWNU-UHFFFAOYSA-N o-[3-pentadecanethioyloxy-2,2-bis(pentadecanethioyloxymethyl)propyl] pentadecanethioate Chemical compound CCCCCCCCCCCCCCC(=S)OCC(COC(=S)CCCCCCCCCCCCCC)(COC(=S)CCCCCCCCCCCCCC)COC(=S)CCCCCCCCCCCCCC XKIVKIIBCJIWNU-UHFFFAOYSA-N 0.000 description 1
- 229940078552 o-xylene Drugs 0.000 description 1
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 description 1
- 125000005474 octanoate group Chemical group 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 238000010525 oxidative degradation reaction Methods 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000005453 pelletization Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical group OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 150000003017 phosphorus Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 150000003053 piperidines Chemical class 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005650 polypropylene glycol diacrylate Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical group C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 150000003902 salicylic acid esters Chemical class 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000011856 silicon-based particle Substances 0.000 description 1
- 229940100890 silver compound Drugs 0.000 description 1
- 150000003379 silver compounds Chemical class 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- LVEOKSIILWWVEO-UHFFFAOYSA-N tetradecyl 3-(3-oxo-3-tetradecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCC LVEOKSIILWWVEO-UHFFFAOYSA-N 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- MZHULIWXRDLGRR-UHFFFAOYSA-N tridecyl 3-(3-oxo-3-tridecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCC MZHULIWXRDLGRR-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- ZMANZCXQSJIPKH-UHFFFAOYSA-O triethylammonium ion Chemical compound CC[NH+](CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-O 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F210/00—Copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
- C08F210/16—Copolymers of ethene with alpha-alkenes, e.g. EP rubbers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/204—Applications use in electrical or conductive gadgets use in solar cells
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
Definitions
- the present invention relates to a solar cell sealing material and a solar cell module.
- solar cells are attracting attention as a means of generating energy that is clean and free from depletion.
- a solar cell When a solar cell is used outdoors such as a roof portion of a building, it is generally used in the form of a solar cell module.
- the above solar cell module is generally manufactured by the following procedure. First, a crystalline solar cell element (hereinafter referred to as a power generation element or a cell) formed of polycrystalline silicon, single crystal silicon, or the like, or amorphous silicon or crystalline silicon is placed on a substrate such as glass by several ⁇ m. A thin-film solar cell element obtained by forming a very thin film is manufactured. Next, in order to obtain a crystalline solar cell module, a solar cell module protective sheet (surface side transparent protective member) / solar cell encapsulant / crystalline solar cell element / solar cell encapsulant / protection for solar cell module The sheets (back side protective member) are laminated in this order.
- a solar cell module protective sheet surface side transparent protective member
- solar cell encapsulant / crystalline solar cell element / solar cell encapsulant / protection for solar cell module The sheets (back side protective member) are laminated in this order.
- the thin film solar cell element / solar cell sealing material / solar cell module protective sheet (back surface side protective member) are laminated in this order. Then, a solar cell module is manufactured by utilizing the lamination method etc. which vacuum-suck these and heat-press them.
- the solar cell module manufactured in this way has weather resistance and is suitable for outdoor use such as a roof portion of a building.
- an ethylene / vinyl acetate copolymer (EVA) film is widely used because it is excellent in transparency, flexibility, adhesiveness, and the like.
- EVA ethylene / vinyl acetate copolymer
- the EVA composition is used as a constituent material of the solar cell sealing material, there is a concern that components such as acetic acid gas generated by the decomposition of EVA may affect the solar cell element.
- Patent Document 1 Japanese Patent Laid-Open No. 2010-258439 discloses a solar battery characterized by containing an ethylene / ⁇ -olefin copolymer that satisfies specific conditions such as density, molecular weight, and melt viscosity. A resin composition for a battery sealing material is described.
- the scale of power generation systems such as mega solar is increasing, and there is a movement to increase the system voltage for the purpose of reducing transmission loss.
- the potential difference between the frame and the cell increases in the solar cell module. That is, the frame of the solar cell module is generally grounded, and when the system voltage of the solar cell array is 600V to 1000V, in the module having the highest voltage, the potential difference between the frame and the cell is the system voltage 600V to 1000V as it is.
- glass has a lower electrical resistance than a sealing material, and a high voltage is generated between the glass and the cell via the frame.
- the present inventors have found that the solar cell encapsulant containing an ethylene / ⁇ -olefin copolymer as described in Patent Document 1 is satisfactory in properties such as adhesion and heat resistance.
- the volume resistivity is low and is not satisfactory in terms of insulation. Therefore, this invention makes it a subject to provide the solar cell sealing material which is excellent in insulation.
- the present inventors have adjusted the content of the elemental fluorine in the ethylene / ⁇ -olefin copolymer to a specific amount or less, thereby providing a solar cell encapsulant excellent in insulation. Has been found, and the present invention has been completed.
- the following solar cell encapsulant is provided.
- a solar cell encapsulant comprising an ethylene / ⁇ -olefin copolymer, A solar cell encapsulant, wherein the content of fluorine element in the ethylene / ⁇ -olefin copolymer as determined by a combustion method and an ion chromatography method is 30 ppm or less.
- the fluorine element content in the ethylene / ⁇ -olefin copolymer as determined by a combustion method and an ion chromatography method is 3.0 ppm or less
- the solar cell encapsulating material according to [1], wherein the content of aluminum element in the ethylene / ⁇ -olefin copolymer as determined by ICP emission analysis is 20 ppm or less.
- the Shore A hardness measured according to ASTM D2240 is 60 to 85.
- the MFR of the ethylene / ⁇ -olefin copolymer measured under the conditions of 190 ° C. and 2.16 kg load is 10 to 50 g / 10 min. Stop material.
- the MFR of the ethylene / ⁇ -olefin copolymer measured at 190 ° C. under a load of 2.16 kg is 0.1 g / 10 min or more and less than 10 g / 10 min, [3]
- the organic peroxide has a 1 minute half-life temperature of 100 to 170 ° C., [1] to [5], wherein the content of the organic peroxide in the solar cell encapsulant is 0.1 to 3 parts by weight with respect to 100 parts by weight of the ethylene / ⁇ -olefin copolymer.
- the solar cell sealing material as described in any one.
- the solar cell sealing material as described in any one.
- the solar cell element formed by crosslinking the solar cell sealing material according to any one of the above is sealed between the front surface side transparent protective member and the back surface side protective member.
- a step of polymerizing to produce an ethylene / ⁇ -olefin copolymer b) treating the ethylene / ⁇ -olefin copolymer by one or more methods selected from the group consisting of a distillation operation, a deashing operation with an acid or alkali, and a reprecipitation operation with a poor solvent, A step of adjusting the content of elemental fluorine in the ethylene / ⁇ -olefin copolymer as determined by a combustion method and an ion chromatography method to 30 ppm or less; c) a step of forming the obtained ethylene / ⁇ -olefin copolymer into a sheet by extrusion molding or calendering, and a method for producing a solar cell encapsulant.
- R e + is H + , a carbenium cation, an oxonium cation, an ammonium cation, a phosphonium cation, a cycloheptyltrienyl cation, or a ferrocenium cation having a transition metal.
- R f to R i may be the same or different from each other, and are aryl groups having a fluorine substituent.
- the content of fluorine element in the ⁇ -olefin copolymer is 3.0 ppm or less
- the encapsulant may be deformed even when the temperature rises during use of the solar cell module. It is possible to avoid such troubles. And the solar cell module excellent in economical efficiency, such as cost, can be provided, without impairing the external appearance of a solar cell.
- the solar cell encapsulant of this embodiment contains an ethylene / ⁇ -olefin copolymer, and the ethylene / ⁇ -olefin copolymer is quantified by a combustion method and an ion chromatography method.
- the fluorine element content is 30 ppm or less, preferably 20 ppm or less, more preferably 10 ppm or less, still more preferably 3.0 ppm or less, particularly preferably 2.5 ppm or less, Preferably it is 2.0 ppm or less.
- the ethylene / ⁇ -olefin copolymer usually contains elemental fluorine as an essential component, and the content of elemental fluorine is, for example, 0.1 ppm or more, and usually 1 ppm or more.
- the inventors of the present invention have intensively studied the factors that cause the solar cell encapsulant containing ethylene / ⁇ -olefin copolymer as a main component to have a low volume resistivity and poor insulation. As a result, the following knowledge was obtained.
- the ethylene / ⁇ -olefin copolymer is a compound that forms an ion pair by reacting with the metallocene compound (I) used as a polymerization catalyst in the production of an ethylene / ⁇ -olefin copolymer described later.
- Fluorine element-containing compounds such as This fluorine element-containing compound forms an ion pair after polymerization and remains in the ethylene / ⁇ -olefin copolymer, and causes charge transfer by ions when charged. That is, it has been clarified that this compound is a factor that decreases the volume resistivity in the solar cell encapsulant. That is, the present inventors have found for the first time that the fluorine element-containing compound mixed in the production of the ethylene / ⁇ -olefin copolymer has an influence on the volume resistivity in the solar cell encapsulant. It was. In addition, content of the fluorine element in the solar cell sealing material specified by this invention has shown the parameter
- the ethylene / ⁇ -olefin copolymer used for the solar cell encapsulant of the present embodiment is obtained by copolymerizing ethylene and an ⁇ -olefin having 3 to 20 carbon atoms.
- ⁇ -olefin ⁇ -olefins having 3 to 20 carbon atoms can be used singly or in combination of two or more.
- Examples of the ⁇ -olefin having 3 to 20 carbon atoms include linear or branched ⁇ -olefins such as propylene, 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene, 3, 3 -Dimethyl-1-butene, 4-methyl-1-pentene, 1-octene, 1-decene, 1-dodecene and the like can be mentioned.
- ⁇ -olefins having 10 or less carbon atoms are preferable, and ⁇ -olefins having 3 to 8 carbon atoms are particularly preferable.
- Propylene, 1-butene, 1-pentene, 1-hexene, 4-methyl-1-pentene and 1-octene are preferred because of their availability.
- the ethylene / ⁇ -olefin copolymer may be a random copolymer or a block copolymer, but a random copolymer is preferred from the viewpoint of flexibility.
- the ethylene / ⁇ -olefin copolymer used in the solar cell encapsulant of the present embodiment may be a copolymer comprising ethylene, an ⁇ -olefin having 3 to 20 carbon atoms, and a non-conjugated polyene.
- the ⁇ -olefin is the same as described above, and examples of the non-conjugated polyene include 5-ethylidene-2-norbornene (ENB), 5-vinyl-2-norbornene (VNB), and dicyclopentadiene (DCPD).
- ENB 5-ethylidene-2-norbornene
- VNB 5-vinyl-2-norbornene
- DCPD dicyclopentadiene
- the ethylene / ⁇ -olefin copolymer used for the solar cell encapsulant of this embodiment is an aromatic vinyl compound such as styrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, o, p- Styrenes such as dimethyl styrene, methoxy styrene, vinyl benzoic acid, methyl vinyl benzoate, vinyl benzyl acetate, hydroxystyrene, p-chlorostyrene, divinylbenzene; 3-phenylpropylene, 4-phenylpropylene, ⁇ -methylstyrene, carbon Cyclic olefins having a number of 3 to 20 such as cyclopentene, cycloheptene, norbornene, 5-methyl-2-norbornene and the like may be used in combination.
- aromatic vinyl compound such as styrene, o-methylsty
- the ethylene / ⁇ -olefin copolymer of the present embodiment preferably further satisfies the following requirements a1) to a4).
- the content ratio of the structural unit derived from ethylene contained in the ethylene / ⁇ -olefin copolymer is preferably 80 to 90 mol%, more preferably 80 to 88 mol%, still more preferably 82 to 88 mol%, particularly preferably. Is 82 to 87 mol%.
- the content of the structural unit derived from the ⁇ -olefin having 3 to 20 carbon atoms (hereinafter also referred to as “ ⁇ -olefin unit”) contained in the ethylene / ⁇ -olefin copolymer is preferably 10 to 20 mol%. More preferably 12 to 20 mol%, still more preferably 12 to 18 mol%, and particularly preferably 13 to 18 mol%.
- the content ratio of the ⁇ -olefin unit contained in the ethylene / ⁇ -olefin copolymer is 10 mol% or more, high transparency can be obtained. Further, extrusion molding at a low temperature can be easily performed, and for example, extrusion molding at 130 ° C. or lower is possible. For this reason, even when the organic peroxide is kneaded into the ethylene / ⁇ -olefin copolymer, it is possible to suppress the progress of the crosslinking reaction in the extruder, and the gel-like foreign matter is not present on the sheet of the solar cell encapsulant. Occurrence and deterioration of the appearance of the sheet can be prevented. Moreover, since moderate softness
- the crystallization speed of the ethylene / ⁇ -olefin copolymer becomes appropriate, so that it was extruded from an extruder. Since the sheet is not sticky, it can be easily peeled off by a cooling roll, and a sheet-like sheet of solar cell encapsulant can be obtained efficiently. Further, since no stickiness is generated on the sheet, blocking can be prevented, and the sheet feeding property is good. In addition, a decrease in heat resistance can be prevented.
- melt flow rate (MFR) of an ethylene / ⁇ -olefin copolymer measured at 190 ° C. under a load of 2.16 kg is usually 0.1 to 50 g / 10 min, preferably Is 2 to 50 g / 10 min, more preferably 10 to 50 g / 10 min, still more preferably 10 to 40 g / 10 min, particularly preferably 12 to 27 g / 10 min, and most preferably 15 to 25 g / 10 min. Minutes.
- the MFR of the ethylene / ⁇ -olefin copolymer can be adjusted by adjusting the polymerization temperature, the polymerization pressure, the molar ratio of the ethylene and ⁇ -olefin monomer concentrations and the hydrogen concentration in the polymerization system, which will be described later. Can be adjusted.
- the crosslinking characteristic at the time of laminate molding of the solar cell module is improved, it is possible to sufficiently crosslink and suppress a decrease in heat resistance.
- the MFR is 27 g / 10 min or less, the draw-down during sheet molding can be further suppressed, a wide sheet can be formed, the cross-linking characteristics and heat resistance are further improved, and the best solar cell encapsulant sheet Can be obtained.
- the resin composition is not subjected to crosslinking treatment in the solar cell module laminating step, which will be described later, since the influence of decomposition of the organic peroxide is small in the melt extrusion step, the MFR is 0.1 g / 10 min or more and 10 g / 10 min.
- a sheet can also be obtained by extrusion molding using a resin composition of less than, preferably 0.5 g / 10 min or more and less than 8.5 g / 10 min.
- a resin composition having an MFR of 0.1 g / 10 min or more and less than 10 g / 10 min is used. It is also possible to produce a sheet by extrusion molding at a molding temperature of 170 to 250 ° C. while performing a crosslinking treatment. When the MFR is within this range, it is preferable in that the laminating apparatus can be prevented from being soiled by the molten resin that protrudes when the sheet is laminated with the solar cell element.
- the density of the ethylene / ⁇ -olefin copolymer measured according to ASTM D1505 is preferably 0.865 to 0.884 g / cm 3 , more preferably 0.866 to 0.883 g / cm 3 , It is preferably 0.866 to 0.880 g / cm 3 , particularly preferably 0.867 to 0.880 g / cm 3 .
- the density of the ethylene / ⁇ -olefin copolymer can be adjusted by a balance between the content ratio of ethylene units and the content ratio of ⁇ -olefin units.
- the density of the ethylene / ⁇ -olefin copolymer is 0.884 g / cm 3 or less, the crystallinity is lowered and the transparency can be enhanced. Furthermore, extrusion molding at low temperature becomes easy, and for example, extrusion molding can be performed at 130 ° C. or lower. For this reason, even if an organic peroxide is kneaded into the ethylene / ⁇ -olefin copolymer, the cross-linking reaction in the extruder is prevented from progressing, and the generation of gel-like foreign matters on the solar cell encapsulant sheet is suppressed. And deterioration of the appearance of the sheet can be suppressed. Moreover, since it is highly flexible, it is possible to prevent the occurrence of cell cracks and thin film electrode cracks, which are solar cell elements, when the solar cell module is laminated.
- the density of the ethylene / ⁇ -olefin copolymer is 0.865 g / cm 3 or more, the crystallization speed of the ethylene / ⁇ -olefin copolymer can be increased, so that the sheet extruded from the extruder is sticky. It is difficult, peeling with a cooling roll becomes easy, and the sheet
- the Shore A hardness of the ethylene / ⁇ -olefin copolymer is preferably 60 to 85, more preferably 62 to 83, still more preferably 62 to 80, and particularly preferably 65 to 85. 80.
- the Shore A hardness of the ethylene / ⁇ -olefin copolymer can be adjusted by controlling the content and density of the ethylene units in the ethylene / ⁇ -olefin copolymer within the above-mentioned numerical range. That is, an ethylene / ⁇ -olefin copolymer having a high ethylene unit content and a high density has a high Shore A hardness.
- an ethylene / ⁇ -olefin copolymer having a low content of ethylene units and a low density has a low Shore A hardness.
- the Shore A hardness is measured after 15 seconds or more have elapsed after loading the test piece sheet.
- the Shore A hardness is 60 or more, the ethylene / ⁇ -olefin copolymer is less sticky and blocking can be suppressed. Moreover, when processing a solar cell sealing material into a sheet form, the drawing
- the Shore A hardness is 85 or less, the crystallinity is lowered and the transparency can be increased. Furthermore, since it is highly flexible, it is possible to prevent cracking of cells that are solar cell elements and chipping of thin film electrodes during laminate molding of the solar cell module.
- the solar cell encapsulant of the present embodiment further satisfies the following requirements.
- the melting peak of the ethylene / ⁇ -olefin copolymer based on differential scanning calorimetry is preferably in the range of 30 to 90 ° C., more preferably in the range of 33 to 90 ° C., It is particularly preferable that it exists in the range of ⁇ 88 ° C.
- the melting peak is 90 ° C. or lower, the degree of crystallinity is lowered, and the flexibility of the obtained solar cell encapsulant is increased. Therefore, when the solar cell module is laminated, cell cracks and thin film electrode cracks are observed. Occurrence can be prevented.
- the melting peak is 30 ° C.
- the flexibility of the resin composition can be appropriately increased, and thus a solar cell encapsulant sheet can be easily obtained by extrusion molding. Further, blocking due to stickiness of the sheet can be prevented, and deterioration of the sheet feeding property can be suppressed.
- the solar cell encapsulant of this embodiment has a volume specific resistance of 1.0 ⁇ 10 13 to 1.0 ⁇ 10 18 ⁇ ⁇ cm measured at a temperature of 100 ° C. and an applied voltage of 500 V in accordance with JIS K6911. It is preferable.
- a solar cell encapsulant having a large volume resistivity tends to have a characteristic of suppressing the occurrence of the PID phenomenon.
- the module temperature of a conventional solar cell module may be, for example, 70 ° C. or higher. Therefore, from the viewpoint of long-term reliability, conventionally reported normal temperature (23 ° C.)
- the volume resistivity under a high temperature condition is demanded from the volume resistivity at 1 and the volume resistivity at a temperature of 100 ° C. is important.
- the volume specific resistance (hereinafter also simply referred to as “volume specific resistance”) measured at a temperature of 100 ° C. and an applied voltage of 500 V in accordance with JIS K6911 is more preferably 1.0 ⁇ 10 14 to 1.0 ⁇ 10. 18 ⁇ ⁇ cm, more preferably 5.0 ⁇ 10 14 to 1.0 ⁇ 10 18 ⁇ ⁇ cm, and particularly preferably 1.0 ⁇ 10 15 to 1.0 ⁇ 10 18 ⁇ ⁇ cm.
- the volume resistivity is 1.0 ⁇ 10 13 ⁇ ⁇ cm or more, the occurrence of the PID phenomenon in a short period of about one day can be suppressed in the constant temperature and humidity test at 85 ° C. and 85% rh.
- the volume resistivity is 1.0 ⁇ 10 18 ⁇ ⁇ cm or less, static electricity is less likely to be generated on the sheet, so that adsorption of dust can be prevented and dust is mixed into the solar cell module to generate power. It is possible to suppress a decrease in efficiency and long-term reliability.
- it is desirable that the volume resistivity is 5.0 ⁇ 10 14 ⁇ ⁇ cm or more because the PID phenomenon tends to be further prolonged in the constant temperature and humidity test at 85 ° C. and 85% rh.
- the volume resistivity is measured after being molded into a sealing material sheet and then processed into a cross-linked and flat sheet by a vacuum laminator, a hot press, a cross-linking furnace, or the like.
- seat in a module laminated body measures by removing another layer.
- an aluminum element may be contained in the ethylene / ⁇ -olefin copolymer.
- the content (residue amount) of aluminum element (hereinafter also referred to as “Al”) contained in the ethylene / ⁇ -olefin copolymer is preferably 20 ppm or less, more preferably 18 ppm or less, and even more preferably 10 ppm. It is as follows.
- the Al content depends on the concentration of the organoaluminum oxy compound or organoaluminum compound added in the polymerization process of the ethylene / ⁇ -olefin copolymer.
- the Al content is 20 ppm or less, a solar cell encapsulant with better transparency of the ethylene / ⁇ -olefin copolymer can be obtained.
- the Al content in the ethylene / ⁇ -olefin copolymer is usually 0.5 ppm or more.
- the ethylene / ⁇ -olefin copolymer is preferably produced using various metallocene compounds shown below as catalysts.
- the metallocene compound for example, the metallocene compounds described in JP-A-2006-077261, JP-A-2008-231265, JP-A-2005-314680 and the like can be used.
- a metallocene compound having a structure different from the metallocene compounds described in these patent documents may be used, or two or more metallocene compounds may be used in combination.
- Examples of (II) a compound that reacts with the metallocene compound (I) to form an ion pair, and (III-1) an organoaluminum oxy compound and (III-2) an organoaluminum compound include, for example, JP-A-2006-077261
- the metallocene compounds described in JP-A-2008-231265, JP-A-2005-314680, JP-A-2008-308619 and the like can be used. However, you may use the metallocene compound of a structure different from the metallocene compound described in these patent documents. These compounds may be put into the polymerization atmosphere individually or in advance in contact with each other.
- ionic compound (II) As a compound that forms an ion pair by reacting with the metallocene compound (I) (hereinafter sometimes abbreviated as “ionic compound (II)”), JP-A-1-501950, Lewis acids and ions described in Kaihei 1-502036, JP-A-3-179005, JP-A-3-179006, JP-A-3-207703, JP-A-3-207704, USP5321106, etc. Compounds, borane compounds and carborane compounds.
- the ionic compound (II) (also referred to as a fluorine element-containing compound) that is preferably employed is a compound represented by the following general formula [VI].
- examples of R e + include H + , carbenium cation, oxonium cation, ammonium cation, phosphonium cation, cycloheptyltrienyl cation, and ferrocenium cation having a transition metal.
- R f to R i may be the same or different from each other, and are an organic group having a fluorine substituent, preferably an aryl group having a fluorine substituent, particularly preferably an aryl group having a fluorine substituent.
- ionic compound (II) examples include tripentafluorophenyl borate, triphenylcarbenium tetrakis (pentafluorophenyl) borate, triphenylcarbenium tetrakis (3,5-ditrifluoromethylphenyl) borate, tris (4 -Methylphenyl) carbenium tetrakis (pentafluorophenyl) borate, tris (3,5-dimethylphenyl) carbenium tetrakis (pentafluorophenyl) borate, tri (n-butyl) ammonium tetrakis (pentafluorophenyl) borate, triethylammonium Tetrakis (pentafluorophenyl) borate, tripropylammonium tetrakis (pentafluorophenyl) borate, tri (n-butyl) ammonium tetrakis (
- the ethylene / ⁇ -olefin copolymer can be polymerized by any of the conventionally known gas phase polymerization methods and liquid phase polymerization methods such as slurry polymerization methods and solution polymerization methods. Preferably, it is carried out by a liquid phase polymerization method such as a solution polymerization method.
- a liquid phase polymerization method such as a solution polymerization method.
- the ionic compound (II) reacts with the metallocene compound (I) to form an ion pair and activates the catalyst.
- the ionic compound (II) reacts with a small amount of water or a polar compound present in the polymerization system. It is easy to lose the ability to form ion pairs.
- an alkylaluminum compound such as triethylaluminum or triisobutylaluminum is used as a scavenger for the catalyst component, but the ability to form an ion pair is easily lost by contact with the alkylaluminum.
- the ionic compound (II) is decomposed before reacting with the metallocene compound (I), the polymerization activity of the metallocene compound (I) decreases. Therefore, in an ethylene / ⁇ -olefin copolymer for normal use such as a packaging material, the ionic compound (II) is usually used in a larger amount than the metallocene compound (I) in view of productivity.
- the compound (II) has a molar ratio [(II) / M] of 1 to 10 with respect to the total transition metals (M) in the compound (I), preferably The amount used is 1 to 5, more preferably 1.
- the amount of compound (II) used within the above range the content of the fluorine element in the ethylene / ⁇ -olefin copolymer can be made within the above range. Since a battery sealing material can be obtained, it is preferable.
- Compound (III-1) or (III-2) is usually used in an amount of 0.01 to 2.0 mmol, preferably about 0.01 to 1.0 mmol, per liter of polymerization volume. it can.
- the amount of the metallocene compound (I) used relative to the yield of the ethylene / ⁇ -olefin copolymer can be reduced. The remaining content can also be reduced.
- the polymerization activity of the metallocene compound (I) is low, the molar ratio [(II) / M] of the compound (II) and the total transition metal (M) in the compound (I) may be increased as much as possible. desirable.
- the solution polymerization method by copolymerizing ethylene and an ⁇ -olefin having 3 to 20 carbon atoms in the presence of the metallocene compound as described above, the comonomer content is high, the composition distribution is narrow, and the molecular weight distribution is narrow. An ethylene / ⁇ -olefin copolymer can be produced efficiently.
- the “solution polymerization method” is a general term for a method of performing polymerization in a state where a polymer is dissolved in an inert hydrocarbon solvent described later.
- the polymerization temperature in the solution polymerization method is usually 0 to 200 ° C., preferably 20 to 190 ° C., more preferably 40 to 180 ° C.
- the polymerization temperature is less than 0 ° C.
- the polymerization activity is extremely lowered, and it is difficult to remove the heat of polymerization, which is not practical in terms of productivity.
- the polymerization temperature exceeds 200 ° C., the polymerization activity is extremely lowered, so that it is not practical in terms of productivity.
- the polymerization pressure is usually from normal pressure to 10 MPa gauge pressure, preferably from normal pressure to 8 MPa gauge pressure.
- Copolymerization can be carried out in any of batch, semi-continuous and continuous methods. Reaction time (when the copolymerization reaction is carried out in a continuous process, the average residence time varies depending on conditions such as the catalyst concentration and polymerization temperature, and can be selected as appropriate, but is usually 1 minute to 3 hours, preferably Further, the polymerization can be carried out in two or more stages with different reaction conditions, and the molecular weight of the resulting ethylene / ⁇ -olefin copolymer is determined in the polymerization system.
- It can also be adjusted by changing the hydrogen concentration and polymerization temperature, and can also be adjusted by the amount of compound (II) used.
- About 0.001 to 5,000 NL per 1 kg of the olefin copolymer is suitable, and the vinyl group and vinylid present at the molecular end of the obtained ethylene / ⁇ -olefin copolymer. Down group, increasing the polymerization temperature, it can be adjusted by minimizing the amount of hydrogen addition.
- the solvent used in the solution polymerization method is usually an inert hydrocarbon solvent, preferably a saturated hydrocarbon having a boiling point of 50 ° C. to 200 ° C. under normal pressure.
- aliphatic hydrocarbons such as pentane, hexane, heptane, octane, nonane, decane, undecane, dodecane, kerosene; branched aliphatic hydrocarbons such as isohexane, isopentane, isooctane, isodecane, isododecane; cyclopentane, cyclohexane And alicyclic hydrocarbons such as methylcyclopentane.
- Aromatic hydrocarbons such as benzene, toluene and xylene, and halogenated hydrocarbons such as ethylene chloride, chlorobenzene and dichloromethane are also included in the category of “inert hydrocarbon solvents” and their use is not limited. .
- the solution polymerization method not only a conventionally used organoaluminum oxy compound that dissolves in an aromatic hydrocarbon, but also a modification such as MMAO that dissolves in an aliphatic hydrocarbon or an alicyclic hydrocarbon. Methylaluminoxane can be used.
- MMAO a modification such as MMAO that dissolves in an aliphatic hydrocarbon or an alicyclic hydrocarbon.
- Methylaluminoxane can be used.
- aliphatic hydrocarbons or alicyclic hydrocarbons are used as the solvent for solution polymerization, there is a possibility that aromatic hydrocarbons are mixed in the polymerization system or in the ethylene / ⁇ -olefin copolymer produced. It becomes possible to eliminate almost completely. That is, the solution polymerization method has characteristics that it can reduce the environmental burden and can minimize the influence on human health.
- the ethylene / ⁇ -olefin copolymer obtained by the polymerization reaction and other components added as desired are melted by any method, and kneaded, granulated, etc. Preferably it is applied.
- organoaluminum oxy compound, or organoaluminum compound described above remains in the obtained ethylene / ⁇ -olefin copolymer, for example, a deashing operation with an acid or alkali, It is preferable to remove the residue in the ethylene / ⁇ -olefin copolymer by performing purification such as reprecipitation with a poor solvent. By performing such an operation, the content of fluorine element and the content of aluminum element in the ethylene / ⁇ -olefin copolymer can be within the above ranges.
- the decalcification operation with an acid or alkali and the reprecipitation operation with a poor solvent can be generally performed according to a known method.
- aliphatic hydrocarbons such as octane, nonane, decane, undecane, dodecane, and kerosene having a boiling point of 110 ° C. or higher; a single or mixed inert hydrocarbon solvent such as branched aliphatic hydrocarbons such as isododecane and mixed isoparaffin are used.
- the solar cell sealing material of this embodiment may contain an organic peroxide.
- the organic peroxide is used as a radical initiator for graft modification of a silane coupling agent and an ethylene / ⁇ -olefin copolymer, and also for the laminate molding of an ethylene / ⁇ -olefin copolymer solar cell module. It is used as a radical initiator in the crosslinking reaction.
- the organic peroxides preferably used are particularly those that can graft-modify a silane coupling agent on the ethylene / ⁇ -olefin copolymer or crosslink the ethylene / ⁇ -olefin copolymer.
- the one minute half-life temperature of the organic peroxide is preferably 100 to 170 ° C. in view of the balance between productivity in extrusion sheet molding and the crosslinking rate at the time of laminate molding of the solar cell module.
- the half-life temperature of the organic peroxide is 100 ° C. or higher, gels are less likely to occur in the solar cell encapsulating sheet obtained from the resin composition during extrusion sheet molding, and thus the increase in the torque of the extruder is suppressed.
- Sheet forming can be facilitated. Moreover, since it can suppress that an unevenness
- the adhesiveness with a surface side transparent protection member, a cell, an electrode, and a back surface side protection member becomes favorable at the time of the lamination process of a solar cell module, and adhesiveness also improves. If the extrusion temperature of extrusion sheet molding is lowered to 90 ° C. or lower, molding is possible, but productivity is greatly reduced. When the one-minute half-life temperature of the organic peroxide is 170 ° C. or lower, it is possible to suppress a decrease in the crosslinking rate when the solar cell module is laminated, and thus it is possible to prevent a decrease in the productivity of the solar cell module. Moreover, the heat resistance of a solar cell sealing material and the fall of adhesiveness can also be prevented.
- organic peroxides can be used.
- Preferred examples of the organic peroxide having a 1 minute half-life temperature in the range of 100 to 170 ° C. include dilauroyl peroxide, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate Dibenzoyl peroxide, t-amylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate, t-butylperoxyisobutyrate, t-butylperoxymaleic acid, 1 , 1-Di (t-amylperoxy) -3,3,5-trimethylcyclohexane, 1,1-di (t-amylperoxy) cyclohexane, t-amylperoxyisononanoate, t-amylperoxynormal Octoate, 1,1-di (t-butylperoxy) -3,3,5-trimethyl
- dilauroyl peroxide t-butyl peroxyisopropyl carbonate, t-butyl peroxyacetate, t-butyl peroxyisononanoate, t-butyl peroxy-2-ethylhexyl carbonate, t-butyl peroxybenzoate, etc.
- the said organic peroxide may be used individually by 1 type, and may mix and use 2 or more types.
- the content of the organic peroxide in the solar cell encapsulant is preferably 0.1 to 3 parts by weight with respect to 100 parts by weight of the aforementioned ethylene / ⁇ -olefin copolymer, 0.2 to The amount is more preferably 3 parts by weight, and particularly preferably 0.2 to 2.5 parts by weight.
- the content of the organic peroxide is 0.1 parts by weight or more, the deterioration of the crosslinking characteristics such as the crosslinking degree and crosslinking rate of the solar cell encapsulant is suppressed, and the ethylene copolymer of the silane coupling agent It is possible to improve the graft reaction to the main chain and suppress the decrease in heat resistance and adhesiveness.
- the organic peroxide content is 3.0 parts by weight or less, the solar cell encapsulating sheet obtained from the resin composition at the time of extrusion sheet molding does not generate gel, and the torque of the extruder can be suppressed. Becomes easy. Since the sheet does not generate a gel in the extruder, the surface of the sheet is not uneven and the appearance is good.
- the solar cell sealing material of this embodiment may further contain a silane coupling agent.
- the content of the silane coupling agent in the solar cell encapsulant of this embodiment is preferably 0.1 to 5 parts by weight, more preferably 100 parts by weight of the ethylene / ⁇ -olefin copolymer.
- the amount is 0.1 to 4 parts by weight, and particularly preferably 0.1 to 3 parts by weight.
- the content of the silane coupling agent is 0.1 parts by weight or more, the adhesion is improved.
- the content of the silane coupling agent is 5% or less, the balance between the cost and performance of the solar cell encapsulant is good, and the ethylene / ⁇ -olefin co-polymer is used when laminating the solar cell module.
- the amount of organic peroxide added to cause a graft reaction on the polymer can be suppressed. For this reason, when obtaining a solar cell sealing material into a sheet form with an extruder, gelatinization can be suppressed, the torque of an extruder can be suppressed, and extrusion sheet forming becomes easy.
- a conventionally well-known silane coupling agent can be used, and there is no restriction in particular.
- vinyltriethoxysilane, vinyltrimethoxysilane, vinyltris ( ⁇ -methoxyethoxysilane), ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -aminopropyltriethoxysilane, ⁇ -methacryloxypropyltrimethoxysilane Etc. can be used.
- ⁇ -glycidoxypropylmethoxysilane, ⁇ -aminopropyltriethoxysilane, ⁇ -methacryloxypropyltrimethoxysilane, vinyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyl with good adhesion examples include trimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethylditriethoxysilane, and 3-glycidoxypropyltriethoxysilane.
- examples thereof include ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, and 3-glycidoxypropylmethylditriethoxysilane.
- the solar cell encapsulant of this embodiment preferably further contains a hindered amine light stabilizer.
- a hindered amine light stabilizer By including a hindered amine light stabilizer, harmful radical species can be captured in the ethylene / ⁇ -olefin copolymer, and generation of new radicals can be suppressed.
- hindered amine light stabilizers include bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, poly [ ⁇ 6- (1,1,3,3-tetramethylbutyl) amino-1,3. , 5-triazine-2,4-diyl ⁇ ⁇ (2,2,6,6-tetramethyl-4-piperidyl) imino ⁇ hexamethylene ⁇ (2,2,6,6-tetramethyl-4-piperidyl) imino ⁇ ]
- hindered piperidine compounds, and the like can be used.
- the low molecular weight hindered amine light stabilizer of the following general formula (1) can also be used.
- R 1 and R 2 represent hydrogen, an alkyl group, or the like. R 1 and R 2 may be the same or different. R 1 and R 2 are preferably hydrogen or a methyl group.
- R 3 represents hydrogen, an alkyl group, an alkenyl group or the like. R 3 is preferably hydrogen or a methyl group.
- hindered amine light stabilizer represented by the general formula (1) include 4-acryloyloxy-2,2,6,6-tetramethylpiperidine, 4-acryloyloxy-1,2,2. , 6,6-pentamethylpiperidine, 4-acryloyloxy-1-ethyl-2,2,6,6-tetramethylpiperidine, 4-acryloyloxy-1-propyl-2,2,6,6-tetramethylpiperidine 4-acryloyloxy-1-butyl-2,2,6,6-tetramethylpiperidine, 4-methacryloyloxy-2,2,6,6-tetramethylpiperidine, 4-methacryloyloxy-1,2,2, 6,6-pentamethylperidine, 4-methacryloyloxy-1-ethyl-2,2,6,6-tetramethylpiperidine, 4-methacryloyl Xyl-1-butyl-2,2,6,6-tetramethylpiperidine, 4-crotonoyloxy-2,2,6,6-te
- the content of the hindered amine light stabilizer in the solar cell encapsulant of this embodiment is preferably 0.01 to 2.0 parts by weight with respect to 100 parts by weight of the ethylene / ⁇ -olefin copolymer described above. More preferably 0.01 to 1.6 parts by weight, particularly preferably 0.05 to 1.6 parts by weight.
- the content of the hindered amine light stabilizer is 0.01 parts by weight or more, the weather resistance and heat resistance are good.
- the content of the hindered amine light stabilizer is 2.0 parts by weight or less, extinction of radicals generated by the organic peroxide can be suppressed, and adhesiveness, heat resistance, and crosslinking characteristics are good.
- the solar cell sealing material of this embodiment further contains a hindered phenol-based stabilizer.
- a hindered phenol-based stabilizer harmful radical species can be captured in the ethylene / ⁇ -olefin copolymer in the presence of oxygen, generation of new radicals can be suppressed, and oxidative degradation can be prevented.
- the hindered phenol stabilizer a conventionally known compound can be used.
- the content of the hindered phenol stabilizer in the solar cell encapsulant of this embodiment is preferably 0.005 to 0.1 parts by weight with respect to 100 parts by weight of the ethylene / ⁇ -olefin copolymer. More preferably, it is 0.01 to 0.1 parts by weight, particularly preferably 0.01 to 0.06 parts by weight.
- the content of the hindered phenol stabilizer is 0.005 parts by weight or more, the heat resistance is good, and for example, in a heat aging test at a high temperature of 120 ° C. or more, yellowing of the solar cell sealing material can be suppressed. There is a tendency.
- the content of the hindered phenol stabilizer is 0.1 parts by weight or less, the crosslinking property of the solar cell encapsulant is good, and the heat resistance and adhesiveness are good.
- the hydroxyl group of the hindered phenol stabilizer forms a salt, forming a conjugated bisquinone methide compound that is quinonated and dimerized, and is sealed with solar cells.
- the hindered phenol-based stabilizer is 0.1 parts by weight or less, the yellowing of the solar cell sealing material can be suppressed.
- the solar cell sealing material of this embodiment further contains a phosphorus-based stabilizer.
- a phosphorus-based stabilizer When the phosphorus stabilizer is contained, decomposition of the organic peroxide during extrusion molding can be suppressed, and a sheet having a good appearance can be obtained.
- hindered amine light stabilizers and hindered phenol stabilizers are included, the generated radicals can be extinguished and a sheet with good appearance can be produced, but the sheet extrusion process consumes stabilizers and is heat resistant. Tend to decrease long-term reliability such as heat resistance and weather resistance.
- a conventionally known compound can be used, for example, tris (2,4-di-tert-butylphenyl) phosphite, bis [2,4-bis (1,1-dimethylethyl) -6-methylphenyl] ethyl ester phosphorous acid, tetrakis (2,4-di-tert-butylphenyl) [1,1-biphenyl] -4,4′-diylbisphosphonite, and bis (2,4 -Di-tert-butylphenyl) pentaerythritol diphosphite.
- tris (2,4-di-tert-butylphenyl) phosphite is preferable.
- the content of the phosphorus stabilizer in the solar cell encapsulant of the present embodiment is preferably 0.005 to 0.5 parts by weight with respect to 100 parts by weight of the ethylene / ⁇ -olefin copolymer, and more The amount is preferably 0.01 to 0.5 parts by weight, particularly preferably 0.02 to 0.2 parts by weight.
- the content of the phosphorus stabilizer is 0.005 parts by weight or more, decomposition of the organic peroxide during extrusion molding can be suppressed, and a sheet having a good appearance can be obtained.
- heat resistance is favorable, and it exists in the tendency which can suppress yellowing of a solar cell sealing material, for example in the heat-resistant aging test in 120 degreeC or more high temperature.
- the content of the phosphorus stabilizer is 0.5 parts by weight or less, the crosslinking property of the solar cell encapsulant is good, and the heat resistance and adhesiveness are good. In addition, there is no influence of acid generated by the decomposition of the phosphorus stabilizer, and metal corrosion does not occur.
- a stabilizer having a phosphite structure and a hindered phenol structure in the same molecule but in a composition containing a large amount of organic peroxide like the solar cell sealing material of this embodiment. Has insufficient performance to suppress the decomposition of the organic peroxide during extrusion molding, and tends to produce a gel and a sheet having a good appearance.
- the solar cell sealing material of this embodiment further contains an ultraviolet absorber.
- the content of the ultraviolet absorber in the solar cell encapsulant of this embodiment is preferably 0.005 to 5 parts by weight with respect to 100 parts by weight of the ethylene / ⁇ -olefin copolymer. It is preferable for the content of the ultraviolet absorber to be in the above-mentioned range since the balance between weather resistance stability and crosslinking properties is excellent.
- the ultraviolet absorber examples include 2-hydroxy-4-normal-octyloxybenzophenone, 2-hydroxy-4methoxybenzophenone, 2,2-dihydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxy- Benzophenones such as 4-carboxybenzophenone and 2-hydroxy-4-N-octoxybenzophenone; 2- (2-hydroxy-3,5-di-t-butylphenyl) benzotriazole, 2- (2-hydroxy-5 Benzotriazoles such as -methylphenyl) benzotriazole; salicylic acid esters such as phenylsulcylate and p-octylphenylsulcylate are used.
- various components other than the components detailed above can be appropriately contained within a range not impairing the object of the present invention.
- examples include various polyolefins other than ethylene / ⁇ -olefin copolymers, styrene-based, ethylene-based block copolymers, and propylene-based polymers.
- the content of various components in the solar cell encapsulant is preferably 0.0001 to 50 parts by weight, more preferably 0.001 to 40 parts by weight with respect to 100 parts by weight of the ethylene / ⁇ -olefin copolymer. Parts by weight.
- Other heat stabilizers other than hindered phenol stabilizers and phosphorus stabilizers include 3-hydroxy-5,7-di-tert-butyl-furan-2-one, o-xylene, and the like. Lactone heat-resistant stabilizers such as reaction products, dimyristylthiodipropionate, dilaurylthiodipropionate, distearylthiodipropionate, ditridecylthiodipropionate, pentaerythritol-tetrakis- ( ⁇ -lauryl- Thiopropionate), 2-mercaptobenzimidazole, zinc salt of 2-mercaptobenzimidazole, 2-mercaptomethylbenzimidazole, zinc salt of 2-mercaptomethylbenzimidazole, 4,4′-thiobis (6-t-butyl) -3-methylphenol), 2,6-di-t-butyl-4 And the like amine heat stabilizer; (4,6-bis (octylthio
- the content of the crosslinking aid in the solar cell encapsulant of this embodiment is preferably 0.05 with respect to 100 parts by weight of the ethylene / ⁇ -olefin copolymer. -5 parts by weight, more preferably 0.1-3 parts by weight. It is preferable for the content of the crosslinking aid to be in the above-mentioned range since an appropriate crosslinked structure can be obtained, and heat resistance, mechanical properties and adhesiveness can be improved.
- crosslinking aid conventionally known ones generally used for olefinic resins can be used.
- a crosslinking aid is a compound having two or more double bonds in the molecule.
- monoacrylates such as t-butyl acrylate, lauryl acrylate, cetyl acrylate, stearyl acrylate, 2-methoxyethyl acrylate, ethyl carbitol acrylate, methoxytripropylene glycol acrylate; t-butyl methacrylate, lauryl methacrylate, cetyl methacrylate
- Monomethacrylates such as stearyl methacrylate, methoxyethylene glycol methacrylate, methoxypolyethylene glycol methacrylate; 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, 1,9-nonanediol diacrylate, neopentyl glycol diacrylate , Diethylene glycol diacryl
- triacrylates such as diacrylate, dimethacrylate, divinyl aromatic compound, trimethylolpropane triacrylate, tetramethylolmethane triacrylate, pentaerythritol triacrylate; trimethylolpropane trimethacrylate , Trimethacrylates such as trimethylolethane trimethacrylate; tetraacrylates such as pentaerythritol tetraacrylate and tetramethylolmethane tetraacrylate; cyanurates such as triallyl cyanurate and triallyl isocyanurate; diallyl compounds such as diallyl phthalate; triallyl compounds; p -Oximes such as quinonedioxime and pp'-dibenzoylquinonedioxime; phenylmaleimi And maleimides. Further, among these, triallyl isocyanurate is particularly preferable, and the balance between
- the solar cell encapsulant of this embodiment has an organic peroxide content of 0.1 to 3 parts by weight with respect to 100 parts by weight of the above-mentioned ethylene / ⁇ -olefin copolymer, and is a hindered phenol-based material.
- the stabilizer content is 0.005 to 0.1 parts by weight
- the hindered amine light stabilizer content is 0.01 to 2.0 parts by weight
- the phosphorus stabilizer content is 0.005. It is a preferred embodiment that the resin composition is in an amount of ⁇ 0.5 parts by weight.
- the solar cell encapsulant of this embodiment has an organic peroxide content of 0.2 to 2.5 parts by weight with respect to 100 parts by weight of the above-mentioned ethylene / ⁇ -olefin copolymer,
- the hindered phenol stabilizer content is 0.01 to 0.06 parts by weight
- the hindered amine light stabilizer content is 0.05 to 1.6 parts by weight
- the phosphorus stabilizer content is It is a particularly preferred embodiment that the resin composition comprises 0.02 to 0.2 parts by weight.
- the solar cell encapsulant of this embodiment is excellent in volume resistivity, and further has adhesion and heat resistance with various solar cell members such as a front surface side transparent protective member, a back surface side protective member, a thin film electrode, aluminum, and a solar cell element. Properties, extrudability and cross-linking properties, transparency, flexibility, appearance, weather resistance, electrical insulation, moisture permeability, electrode corrosion, and process stability. For this reason, it is used suitably as a solar cell sealing material of a conventionally well-known solar cell module.
- a commonly used method can be used, but it is preferably produced by melt blending with a kneader, a Banbury mixer, an extruder or the like. In particular, the production with an extruder capable of continuous production is preferred.
- the solar cell encapsulant has a sheet shape as a whole.
- seat which consists of the above-mentioned resin composition can also be used suitably.
- the thickness of the solar cell encapsulant layer is usually 0.01 to 2 mm, preferably 0.05 to 1.5 mm, more preferably 0.1 to 1.2 mm, still more preferably 0.2 to 1 mm, particularly preferably. Is 0.3 to 0.9 mm, most preferably 0.3 to 0.8 mm. When the thickness is within this range, damage to the surface side transparent protective member, solar cell element, thin film electrode, etc. in the laminating step can be suppressed, and a high amount of photovoltaic power can be obtained by ensuring sufficient light transmittance. be able to. Furthermore, it is preferable because the solar cell module can be laminated at a low temperature.
- ethylene / ⁇ -olefin copolymer in an extruder and, if necessary, organic peroxide, silane coupling agent, hindered amine light stabilizer, hindered phenol stabilizer, phosphorus stabilizer, UV absorption Ethylene / ⁇ -olefin blended with additives, crosslinking aids, and other additives, for example, by hand blending in a bag such as a plastic bag or using a stirring mixer such as a Henschel mixer, tumbler, super mixer, etc.
- a stirring mixer such as a Henschel mixer, tumbler, super mixer, etc.
- the most preferable implementation is to obtain a sheet-like solar cell encapsulant by charging a resin composition containing a copolymer and various additives into an extrusion sheet molding hopper and performing extrusion sheet molding while melt kneading. It is a form.
- pelletized resin composition when the pelletized resin composition is once pelletized with the compounded resin composition and further formed into a sheet by extrusion molding or press molding, generally an aqueous layer is passed through or an underwater cutter type extrusion is performed. The strand is cooled using a machine and cut to obtain pellets. Therefore, since moisture adheres, deterioration of additives, particularly silane coupling agents, occurs, for example, when a sheet is formed again with an extruder, the condensation reaction between silane coupling agents proceeds, and the adhesiveness tends to decrease. Therefore, it is not preferable.
- Additives other than ethylene / ⁇ -olefin copolymers and organic peroxides and silane coupling agents (stabilizers such as hindered phenol stabilizers, phosphorus stabilizers, hindered amine light stabilizers, UV absorbers, etc.) ) Is pre-mastered using an extruder, blended with an organic peroxide or silane coupling agent, and then sheeted again with an extruder or the like, a hindered phenol stabilizer and phosphorus stabilizer Stabilizers such as hindered amine light stabilizers and UV absorbers are passed through an extruder twice, so that the stabilizer is deteriorated and long-term reliability such as weather resistance and heat resistance tends to be lowered.
- stabilizers such as hindered phenol stabilizers, phosphorus stabilizers, hindered amine light stabilizers, UV absorbers, etc.
- the extrusion temperature is 100 to 130 ° C.
- the productivity of the solar cell encapsulant can be improved.
- the extrusion temperature is 130 ° C. or lower, gelation hardly occurs when the resin composition is formed into a sheet with an extruder to obtain a solar cell sealing material. Therefore, an increase in the torque of the extruder can be prevented and sheet forming can be facilitated.
- seat the fall of an external appearance can be prevented.
- a sheet or film having a desired thickness is produced by rolling the molten resin with a heated metal roll (calender roll).
- a heated metal roll calender roll
- ethylene / ⁇ -olefin copolymer, silane coupling agent, organic peroxide, UV absorber, light stabilizer, heat stabilizer, and other additives used as required It is also possible to obtain a sheet-shaped solar cell encapsulant by calendering while performing melt kneading.
- the calendar molding machine various known calendar molding machines can be used, and a mixing roll, a three-calendar roll, and a four-calendar roll can be used.
- the four calender rolls I type, S type, inverted L type, Z type, oblique Z type, etc. can be used.
- the roll temperature is usually preferably 40 to 100 ° C.
- the surface of the solar cell encapsulant sheet may be embossed.
- embossing By decorating the sheet surface of the solar cell encapsulant by embossing, blocking between the encapsulant sheets or between the encapsulant sheet and other sheets can be prevented.
- embossing reduces the storage elastic modulus of the solar cell encapsulant (solar cell encapsulant sheet), it becomes a cushion for the solar cell element when laminating the solar cell encapsulant sheet and the solar cell element. Thus, damage to the solar cell element can be prevented.
- Porosity P expressed as a percentage V H / V A ⁇ 100 of the total volume V H of the recesses per unit area of the solar cell encapsulant sheet and the apparent volume VA of the solar cell encapsulant sheet (%) Is preferably 10 to 50%, more preferably 10 to 40%, and still more preferably 15 to 40%.
- the apparent volume VA of the solar cell encapsulant sheet is obtained by multiplying the unit area by the maximum thickness of the solar cell encapsulant.
- the porosity P is 10% or more, the elastic modulus of the solar cell encapsulating material can be sufficiently lowered, so that sufficient cushioning properties can be obtained.
- the crystalline solar cell prevents the cracking of the silicon cell and the solder that fixes the silicon cell and the electrode, and the thin film solar cell Then, the crack of a silver electrode can be prevented. That is, when the porosity of the solar cell encapsulating material including the sheet made of the resin composition is 10% or more, pressure is applied even when pressure is locally applied to the solar cell encapsulating material. The convex part is deformed so as to be crushed. For this reason, even when a large pressure is locally applied to the silicon cell, for example, during the lamination process, the silicon cell can be prevented from being broken.
- the passage of air can be ensured as the porosity of the solar cell encapsulant is 10% or more, it can be well deaerated during lamination. For this reason, it is possible to prevent the appearance of the solar cell module from deteriorating due to air remaining, or the corrosion of the electrode due to the remaining moisture in the air during long-term use. Furthermore, since the voids generated in the fluidized resin composition during lamination are reduced, it is possible to prevent the laminator from being contaminated by protruding outside the adherends of the solar cell module.
- the porosity P can be obtained by the following calculation.
- V A (mm 3 ) t max (mm) ⁇ 10 6 (mm 2 ) (12)
- the actual volume V 0 (mm 3 ) of the solar cell encapsulant of this unit area is based on the specific gravity ⁇ (g / mm 3 ) and unit area (1 m 2 ) of the resin constituting the solar cell encapsulant.
- the porosity P (%) can be obtained by the above calculation formula, but it can also be obtained by taking an image of a cross section or an embossed surface of an actual solar cell encapsulant and performing image processing. it can.
- the depth of the recess formed by embossing is preferably 20 to 95% of the maximum thickness of the solar cell encapsulant, more preferably 50 to 95%, and 65 to 95%. More preferred.
- the percentage of the depth D of the recess with respect to the maximum thickness t max of the sheet may be referred to as the “depth ratio” of the recess.
- the depth of the embossed concave portion indicates a height difference D between the topmost portion of the convex portion and the deepest portion of the concave portion of the uneven surface of the solar cell sealing material by the embossing.
- the maximum thickness t max of the solar cell encapsulant is, when embossed on one surface of the solar cell encapsulant, the solar cell encapsulant from the top of the convex portion on one surface to the other surface (solar cell).
- the distance from the top of the convex portion on one surface to the maximum of the convex portion on the other surface is shown. The distance (in the solar cell encapsulant thickness direction) to the top is shown.
- Embossing may be performed on one side of the solar cell encapsulant or on both sides. When increasing the depth of the embossed recess, it is preferably formed only on one side of the solar cell encapsulant.
- the maximum thickness t max of the solar cell encapsulant is 0.01 mm to 2 mm, preferably 0.05 to 1 mm, more preferably 0.1 to 1 mm, more preferably 0.15 to 1 mm, more preferably 0.2 to 1 mm, further preferably 0.2 to 0.9 mm, and particularly preferably 0.3 to 1 mm. 0.9 mm, most preferably 0.3 to 0.8 mm.
- the maximum thickness t max of the solar cell encapsulant is within this range, damage to the surface side transparent protective member, solar cell element, thin film electrode, etc. in the laminating step can be suppressed, and the solar cell module laminate can be performed even at a relatively low temperature. It is preferable because it can be molded. Moreover, the solar cell sealing material can ensure sufficient light transmittance, and the solar cell module using the solar cell encapsulant has a high photovoltaic power generation amount.
- the sheet can be used as a solar cell encapsulant in a single wafer form cut to fit the solar cell module size or a roll form that can be cut to fit the size just before producing the solar cell module.
- the sheet-like solar cell encapsulant (solar cell encapsulant sheet), which is a preferred embodiment of the present embodiment, may have at least one layer made of the solar cell encapsulant. Therefore, the number of layers made of the solar cell encapsulant of this embodiment may be one layer or two or more layers. From the viewpoint of simplifying the structure and reducing costs, and from the viewpoint of effectively utilizing light by minimizing interfacial reflection between layers, it is preferable to be further increased.
- the solar cell encapsulant sheet may be composed of only a layer made of the solar cell encapsulant of the present embodiment, or a layer other than the layer containing the solar cell encapsulant (hereinafter “other layers”). May also be included). Examples of other layers include a hard coat layer, an adhesive layer, an antireflection layer, a gas barrier layer, and an antifouling layer for protecting the front or back surface, if classified for purposes.
- layer made of UV curable resin layer made of thermosetting resin, layer made of polyolefin resin, layer made of carboxylic acid modified polyolefin resin, layer made of fluorine-containing resin, cyclic olefin (co)
- layer made of UV curable resin layer made of thermosetting resin
- layer made of polyolefin resin layer made of carboxylic acid modified polyolefin resin
- layer made of fluorine-containing resin layer made of fluorine-containing resin
- cyclic olefin (co) examples thereof include a layer made of a polymer and a layer made of an inorganic compound.
- the positional relationship between the layer made of the solar cell encapsulant of this embodiment and the other layers is not particularly limited, and a preferable layer configuration is appropriately selected in relation to the object of the present invention. That is, the other layer may be provided between layers made of two or more solar cell encapsulants, or may be provided in the outermost layer of the solar cell encapsulant sheet, or in other locations. It may be provided. In addition, other layers may be provided only on one side of the layer made of the solar cell sealing material, or other layers may be provided on both sides. There is no restriction
- the other layers are not provided, and only the layer made of the solar cell encapsulant of the present embodiment is used. What is necessary is just to produce a battery sealing material sheet. However, if there are other layers necessary or useful in relation to the purpose, such other layers may be provided as appropriate. In the case of providing other layers, there are no particular restrictions on the method of laminating the layer made of the solar cell encapsulant of this embodiment and the other layers, but there are no limitations on cast molding machines, extrusion sheet molding machines, inflation molding machines, injections.
- a method of obtaining a laminate by co-extrusion using a known melt extruder such as a molding machine, or a method of obtaining a laminate by melting or heating and laminating the other layer on one previously formed layer is preferred.
- suitable adhesives for example, maleic anhydride-modified polyolefin resin (trade name “Admer (registered trademark)” manufactured by Mitsui Chemicals, Inc., product name “Modic (registered trademark)” manufactured by Mitsubishi Chemical Corporation, etc.)), unsaturated Including low (non) crystalline soft polymers such as polyolefins, ethylene / acrylic acid ester / maleic anhydride terpolymers (trade name “Bondaine (registered trademark)” manufactured by Sumika DF Chemical Co., Ltd.), etc.
- An acrylic adhesive, an ethylene / vinyl acetate copolymer, or an adhesive resin composition containing these) may be laminated by a dry laminating method or a heat laminating method.
- the adhesive those having a heat resistance of about 120 to 150 ° C. are preferably used, and a polyester-based or polyurethane-based adhesive is exemplified as a suitable one.
- a silane coupling treatment, a titanium coupling treatment, a corona treatment, a plasma treatment, or the like may be used.
- a solar cell module is a crystalline solar cell in which, for example, a solar cell element usually formed of polycrystalline silicon or the like is sandwiched between solar cell sealing material sheets, and both front and back surfaces are covered with a protective sheet.
- a typical solar cell module includes a solar cell module protective sheet (front surface side transparent protective member) / solar cell encapsulant / solar cell element / solar cell encapsulant / solar cell module protective sheet (back side protection). Member).
- the solar cell module which is one of the preferred embodiments of the present embodiment is not limited to the above-described configuration, and a part of each of the above layers is appropriately omitted as long as the object of the present invention is not impaired. Layers other than the above can be provided as appropriate.
- Examples of the layer other than the above include an adhesive layer, a shock absorbing layer, a coating layer, an antireflection layer, a back surface rereflection layer, and a light diffusion layer. These layers are not particularly limited, but can be provided at appropriate positions in consideration of the purpose and characteristics of each layer.
- FIG. 1 is a cross-sectional view schematically showing one embodiment of the solar cell module of the present invention.
- the solar cell module 20 includes a plurality of crystalline silicon-based solar cell elements 22 electrically connected by an interconnector 29, a pair of front surface side transparent protective members 24 and a back surface thereof.
- a side protection member 26 is provided, and a sealing layer 28 is filled between these protection members and the plurality of solar cell elements 22.
- the sealing layer 28 is obtained by bonding the solar cell sealing material of the present embodiment and then thermocompression bonding, and is in contact with the electrodes formed on the light receiving surface and the back surface of the solar cell element 22.
- the electrode is a current collecting member formed on each of the light receiving surface and the back surface of the solar cell element 22 and includes a power collecting wire, a tabbed bus, a back electrode layer, and the like which will be described later.
- FIG. 2 is a plan view schematically showing one configuration example of the light receiving surface and the back surface of the solar cell element.
- FIG. 2 an example of the configuration of the light receiving surface 22A and the back surface 22B of the solar cell element 22 is shown.
- the light receiving surface 22A of the solar cell element 22 collects a large number of linearly-collected current lines 32, charges from the current collector lines 32, and interconnector 29 (FIG. 1).
- a bus bar with a tab (bus bar) 34 ⁇ / b> A connected thereto.
- a conductive layer (back electrode) 36 is formed on the entire back surface 22B of the solar cell element 22, and charges are collected from the conductive layer 36 on the back surface 22B.
- a tabbed bus bar (bus bar) 34B connected to the connector 29 (FIG. 1) is formed.
- the line width of the collector line 32 is, for example, about 0.1 mm; the line width of the tabbed bus 34A is, for example, about 2 to 3 mm; and the line width of the tabbed bus 34B is, for example, about 5 to 7 mm. is there.
- the thickness of the current collector 32, the tabbed bus 34A and the tabbed bus 34B is, for example, about 20 to 50 ⁇ m.
- the current collector 32, the tabbed bus 34A, and the tabbed bus 34B preferably contain a highly conductive metal.
- highly conductive metals include gold, silver, copper, and the like. From the viewpoint of high conductivity and high corrosion resistance, silver, silver compounds, alloys containing silver, and the like are preferable.
- the conductive layer 36 contains not only a highly conductive metal but also a highly light reflective component, for example, aluminum from the viewpoint of improving the photoelectric conversion efficiency of the solar cell element by reflecting light received by the light receiving surface. It is preferable.
- the current collector 32, the tabbed bus 34 ⁇ / b> A, the tabbed bus 34 ⁇ / b> B, and the conductive layer 36 are formed by applying a conductive material paint containing the above highly conductive metal to the light receiving surface 22 ⁇ / b> A or the back surface 22 ⁇ / b> B of the solar cell element 22, for example, a screen. It is formed by applying to a coating thickness of 50 ⁇ m by printing, drying, and baking at, for example, 600 to 700 ° C. as necessary.
- the surface side transparent protective member 24 Since the surface side transparent protective member 24 is disposed on the light receiving surface side, it needs to be transparent. Examples of the surface side transparent protective member 24 include a transparent glass plate and a transparent resin film. On the other hand, the back surface side protection member 26 does not need to be transparent, and the material is not particularly limited. Examples of the back surface side protection member 26 include a glass substrate and a plastic film, but a glass substrate is preferably used from the viewpoint of durability and transparency.
- the solar cell module 20 can be obtained by any manufacturing method.
- the solar cell module 20 is a process of obtaining a laminated body in which, for example, the back surface side protective member 26, the solar cell sealing material, the plurality of solar cell elements 22, the solar cell sealing material, and the front surface side transparent protective member 24 are stacked in this order.
- the solar cell element is usually provided with a collecting electrode for taking out the generated electricity. Examples of current collecting electrodes include bus bar electrodes, finger electrodes, and the like.
- the collector electrode has a structure in which the collector electrode is disposed on both the front and back surfaces of the solar cell element.
- the collector electrode blocks light and power generation efficiency is reduced. Problems can arise.
- a back contact type solar cell element that does not require a collector electrode on the light receiving surface can be used.
- p-doped regions and n-doped regions are alternately provided on the back surface side provided on the opposite side of the light receiving surface of the solar cell element.
- a p / n junction is formed on a substrate provided with a through hole (through hole), and the surface (light-receiving surface) side of the through hole inner wall and the through hole peripheral portion on the back surface side is formed.
- a doped layer is formed, and the current on the light receiving surface is taken out on the back side.
- the above-mentioned solar cell modules are connected in series from several units to several dozen units, 50V to 500V even in a small scale for residential use, and 600 to 1000V in a large scale called mega solar. Is operated.
- An aluminum frame or the like is used for the outer frame of the solar cell module for the purpose of maintaining strength, and the aluminum frame is often grounded (grounded) from the viewpoint of safety.
- the solar cell when the solar cell generates power, a voltage difference due to power generation occurs between the surface-side transparent protective member surface having a lower electrical resistance than the sealing material and the solar cell element.
- the solar cell encapsulant that is sealed between the power generation cell and the surface-side transparent protective member or the aluminum frame is required to have good electrical characteristics such as high electrical insulation and high resistance.
- the thin-film silicon-based solar cell module has (1) a surface-side transparent protective member (glass substrate) / thin-film solar cell element / sealing layer / back-side protective member stacked in this order; (2) a surface-side transparent protective member / Sealing layer / thin film solar cell element / sealing layer / back surface side protective member may be laminated in this order.
- the front surface side transparent protective member, the back surface side protective member, and the sealing layer are the same as those in the above-mentioned “crystalline silicon solar cell module”.
- the thin film solar cell element in the aspect of (1) includes, for example, transparent electrode layer / pin type silicon layer / back electrode layer in this order.
- the transparent electrode layer include semiconductor oxides such as In 2 O 3 , SnO 2 , ZnO, Cd 2 SnO 4 , ITO (In 2 O 3 with Sn added).
- the back electrode layer includes, for example, a silver thin film layer. Each layer is formed by a plasma CVD (chemical vapor deposition) method or a sputtering method.
- a sealing layer is arrange
- the thin-film solar cell element in the aspect (2) includes, for example, a transparent electrode layer / pin type silicon layer / metal foil, or a metal thin film layer (for example, a silver thin film layer) disposed on a heat-resistant polymer film.
- the metal foil include stainless steel foil.
- the heat resistant polymer film include a polyimide film.
- the transparent electrode layer and the pin type silicon layer are formed by the CVD method or the sputtering method as described above. That is, the pin-type silicon layer is formed on a metal foil or a metal thin film layer disposed on a heat-resistant polymer film; and the transparent electrode layer is formed on a pin-type silicon layer.
- positioned on a heat resistant polymer film can also be formed by CVD method or a sputtering method.
- the sealing layer is disposed between the transparent electrode layer and the front surface side transparent protective member; and between the metal foil or the heat resistant polymer film and the back surface side protective member.
- the sealing layer obtained from a solar cell sealing material is in contact with electrodes, such as a current collection line of a solar cell element, a bus bar with a tab, and a conductive layer.
- the thin-film solar cell element in the aspect (2) has a silicon layer that is thinner than a crystalline silicon-based solar cell element. Hard to do. For this reason, the softness
- the electrode of the thin film solar cell element is a metal thin film layer as described above, when it is deteriorated by corrosion, the power generation efficiency may be significantly reduced.
- Solar cell modules using silicon for solar cell elements include hybrid type (HIT type) solar cell modules in which crystalline silicon and amorphous silicon are laminated, and multi-junction type (tandem type) solar cells in which silicon layers having different absorption wavelength ranges are laminated.
- HIT type hybrid type
- tandem type multi-junction type
- a battery module a back contact solar cell module in which p-doped regions and n-doped regions are alternately provided on the back side provided on the opposite side of the light-receiving surface of the solar cell element, innumerable spherical silicon particles (diameter of about 1 mm) and Examples include a spherical silicon solar cell module combined with a concave mirror (also serving as an electrode) having a diameter of 2 to 3 mm for increasing the light collecting ability. Further, in a solar cell module using silicon as a solar cell element, the role of an amorphous silicon type p-type window layer having a conventional pin junction structure is induced by “field effect” from “insulated transparent electrode”.
- a field effect solar cell module having a structure replaced with an “inversion layer” is also included.
- a GaAs solar cell module using single crystal GaAs for the solar cell element I-III called chalcopyrite system made of Cu, In, Ga, Al, Se, S, etc., instead of silicon as the solar cell element -CIS or CIGS (chalcopyrite) solar cell module using a group VI compound; CdTe-CdS solar cell using a Cd compound thin film as a solar cell element, Cu 2 ZnSnS 4 (CZTS) solar cell module, etc. It is done.
- the solar cell encapsulant of this embodiment can be used as a solar cell encapsulant for all these solar cell modules.
- the sealing material layer laminated under the photovoltaic element constituting the solar cell module has an adhesive property with the sealing material layer / electrode / back surface protection layer laminated on the photovoltaic element. It is necessary to have. Moreover, in order to maintain the smoothness of the back surface of the solar cell element as a photovoltaic element, it is necessary to have thermoplasticity. Furthermore, in order to protect the solar cell element as a photovoltaic element, it is necessary to be excellent in scratch resistance, shock absorption and the like.
- the sealing material layer preferably has heat resistance.
- sealing is performed by heating such as in the lamination method in which vacuum suction is applied and thermocompression bonding, or by the action of heat such as sunlight in long-term use of solar cell modules, etc.
- the resin composition constituting the material layer does not change in quality or deteriorate or decompose. If the additives contained in the resin composition are eluted or decomposed products are generated, they act on the electromotive force surface (element surface) of the solar cell element, deteriorating its function and performance. It will end up. Therefore, heat resistance is indispensable as a characteristic of the sealing material layer of the solar cell module.
- the sealing material layer is preferably excellent in moisture resistance. In this case, moisture permeation from the back side of the solar cell module can be prevented, and corrosion and deterioration of the photovoltaic element of the solar cell module can be prevented.
- the sealing material layer does not necessarily need to have transparency.
- the solar cell encapsulant of the present embodiment has the above-described characteristics, and the solar cell encapsulant on the back surface side of the crystalline solar cell module and the solar cell encapsulant of the thin-film solar cell module vulnerable to moisture penetration Can be suitably used.
- the solar cell module of the present embodiment may appropriately include any member as long as the object of the present invention is not impaired.
- an adhesive layer, a shock absorbing layer, a coating layer, an antireflection layer, a back surface rereflection layer, a light diffusion layer, and the like can be provided, but not limited thereto.
- the layers can be provided at appropriate positions in consideration of the purpose of providing such layers and the characteristics of such layers.
- the surface side transparent protective member for the solar cell module used in the solar cell module is not particularly limited, but because it is located on the outermost layer of the solar cell module, including weather resistance, water repellency, contamination resistance, mechanical strength, It is preferable to have a performance for ensuring long-term reliability in outdoor exposure of the solar cell module. Moreover, in order to utilize sunlight effectively, it is preferable that it is a highly transparent sheet
- Examples of the material for the surface side transparent protective member for solar cell modules include resin films and glass substrates made of polyester resin, fluororesin, acrylic resin, cyclic olefin (co) polymer, ethylene-vinyl acetate copolymer, and the like.
- the resin film is preferably a polyester resin excellent in transparency, strength, cost and the like, particularly a polyethylene terephthalate resin, a fluorine resin having good weather resistance, and the like.
- fluororesins examples include tetrafluoroethylene-ethylene copolymer (ETFE), polyvinyl fluoride resin (PVF), polyvinylidene fluoride resin (PVDF), polytetrafluoroethylene resin (TFE), and tetrafluoroethylene.
- ETFE tetrafluoroethylene-ethylene copolymer
- PVDF polyvinylidene fluoride resin
- TFE polytetrafluoroethylene resin
- FEP hexafluoropropylene copolymer
- CTFE polytrifluoroethylene chloride
- Polyvinylidene fluoride resin is excellent from the viewpoint of weather resistance, but tetrafluoroethylene-ethylene copolymer is excellent from the viewpoint of both weather resistance and mechanical strength.
- the glass substrate When a glass substrate is used as the surface side transparent protective member for a solar cell module, the glass substrate preferably has a total light transmittance of light having a wavelength of 350 to 1400 nm of 80% or more, more preferably 90% or more. .
- a glass substrate it is common to use white plate glass with little absorption in the infrared region, but even blue plate glass has little influence on the output characteristics of the solar cell module as long as the thickness is 3 mm or less.
- tempered glass can be obtained by heat treatment to increase the mechanical strength of the glass substrate, but float plate glass without heat treatment may be used.
- an antireflection coating may be provided on the light receiving surface side of the glass substrate in order to suppress reflection.
- the solar cell module back surface side protective member used for the solar cell module is not particularly limited, but is located on the outermost surface layer of the solar cell module, so that the weather resistance, mechanical strength, etc. are similar to the above surface side transparent protective member. Are required. Therefore, you may comprise the back surface side protection member for solar cell modules with the material similar to a surface side transparent protection member. That is, the above-mentioned various materials used as the front surface side transparent protective member can also be used as the back surface side protective member. In particular, a polyester resin and glass can be preferably used. Moreover, since the back surface side protection member does not presuppose passage of sunlight, the transparency calculated
- a reinforcing plate may be attached to increase the mechanical strength of the solar cell module or to prevent distortion and warpage due to temperature change.
- a steel plate, a plastic plate, an FRP (glass fiber reinforced plastic) plate or the like can be preferably used as the reinforcing plate.
- the solar cell sealing material of this embodiment may be integrated with the back surface side protective member for the solar cell module.
- the process of cutting the solar cell encapsulant and the back side protection member for the solar cell module into a module size at the time of module assembly can be shortened.
- the process of laying up the solar cell encapsulant and the back side protection member for the solar cell module can be shortened or omitted by making the process of laying up with an integrated sheet.
- the method for laminating the solar cell sealing material and the solar cell module back surface protection member in the case of integrating the solar cell sealing material and the solar cell module back surface side protection member is not particularly limited.
- the lamination method includes a method of obtaining a laminate by co-extrusion using a known melt extruder such as a cast molding machine, an extrusion sheet molding machine, an inflation molding machine, an injection molding machine, or the like; A method of obtaining a laminate by melting or heat laminating the other layer is preferred.
- a known melt extruder such as a cast molding machine, an extrusion sheet molding machine, an inflation molding machine, an injection molding machine, or the like.
- suitable adhesives for example, maleic anhydride-modified polyolefin resin (trade name “Admer (registered trademark)” manufactured by Mitsui Chemicals, Inc., product name “Modic (registered trademark)” manufactured by Mitsubishi Chemical Corporation, etc.)), unsaturated Including low (non) crystalline soft polymers such as polyolefins, ethylene / acrylic acid ester / maleic anhydride terpolymers (trade name “Bondaine (registered trademark)” manufactured by Sumika DF Chemical Co., Ltd.), etc.
- An acrylic adhesive, an ethylene / vinyl acetate copolymer, or an adhesive resin composition containing these may be laminated by a dry laminating method or a heat laminating method.
- the adhesive preferably has a heat resistance of about 120 to 150 ° C., and specifically, a polyester-based or polyurethane-based adhesive is preferable.
- at least one of the layers may be subjected to, for example, a silane coupling treatment, a titanium coupling treatment, a corona treatment, or a plasma treatment.
- the solar cell element used for the solar cell module is not particularly limited as long as it can generate power using the photovoltaic effect of the semiconductor.
- Solar cell elements include, for example, silicon (single crystal, polycrystal, amorphous) solar cells, compound semiconductor (III-III, II-VI, etc.) solar cells, wet solar cells, organic A semiconductor solar cell or the like can be used.
- a polycrystalline silicon solar cell is preferable from the viewpoint of balance between power generation performance and cost.
- Both silicon solar cell elements and compound semiconductor solar cell elements have excellent characteristics as solar cell elements, but are known to be easily damaged by external stress and impact. Since the solar cell sealing material of this embodiment is excellent in flexibility, it has a great effect of absorbing stress, impact, etc. on the solar cell element and preventing damage to the solar cell element. Therefore, in the solar cell module of this embodiment, it is desirable that the layer made of the solar cell sealing material of this embodiment is directly joined to the solar cell element. In addition, when the solar cell encapsulant has thermoplasticity, the solar cell element can be taken out relatively easily even after the solar cell module is once produced. Yes. Since the ethylene-based resin composition constituting the solar cell encapsulant of the present embodiment has thermoplasticity, the entire solar cell encapsulant has thermoplasticity, which is also preferable from the viewpoint of recyclability.
- the structure and material of the metal electrode used for a solar cell module are not specifically limited, In a specific example, it has a laminated structure of a transparent conductive film and a metal film.
- the transparent conductive film is made of SnO 2 , ITO, ZnO or the like.
- the metal film is made of a metal such as silver, gold, copper, tin, aluminum, cadmium, zinc, mercury, chromium, molybdenum, tungsten, nickel, and vanadium. These metal films may be used alone or as a composite alloy.
- the transparent conductive film and the metal film are formed by a method such as CVD, sputtering, or vapor deposition.
- the metal electrode is coated with the flux on the electrode surface using a well-known rosin-based flux or IPA (isopropyl alcohol) of water-soluble flux or water, and then dried with a heater or hot air, and thereafter
- a method in which the surface of the metal electrode is coated with solder through the solder melt melted in the solder melting tank, reheated, and the solar cell element and the metal electrode or metal electrodes are joined is also taken.
- the manufacturing method of the solar cell module of this embodiment includes (i) a front surface side transparent protective member, a solar cell sealing material of this embodiment, a solar cell element (cell), a solar cell sealing material, and a back surface side. It includes a step of laminating protective members in this order to form a laminated body, and (ii) a step of pressing and heating the obtained laminated body to integrate them.
- step (i) it is preferable that the surface on which the uneven shape (embossed shape) of the solar cell encapsulant is formed is disposed on the solar cell element side.
- step (ii) the laminate obtained in step (i) is integrated (sealed) by heating and pressing using a vacuum laminator or a hot press according to a conventional method.
- sealing since the solar cell sealing material of this embodiment has high cushioning properties, damage to the solar cell element can be prevented. Moreover, since the deaeration property is good, there is no air entrainment, and a high-quality product can be manufactured with a high yield.
- the ethylene / ⁇ -olefin resin composition constituting the solar cell encapsulant is crosslinked and cured. This crosslinking step may be performed simultaneously with step (ii) or after step (ii).
- step (ii) When the cross-linking step is performed after step (ii), vacuum and heating is performed for 3 to 6 minutes at a temperature of 125 to 160 ° C. and a vacuum pressure of 10 Torr or less in step (ii); The above laminate is integrated for about one minute.
- the crosslinking step performed after step (ii) can be performed by a general method. For example, a tunnel-type continuous crosslinking furnace may be used, or a shelf-type batch-type crosslinking furnace may be used. .
- the crosslinking conditions are usually 130 to 155 ° C. and about 20 to 60 minutes.
- the crosslinking step is performed in the step (ii) except that the heating temperature in the step (ii) is 145 to 170 ° C. and the pressurization time at atmospheric pressure is 6 to 30 minutes.
- the solar cell encapsulant of this embodiment has excellent cross-linking properties by containing a specific organic peroxide, and does not need to go through a two-step bonding process in step (ii), and at a high temperature. It can be completed in a short time, the cross-linking step performed after step (ii) may be omitted, and the module productivity can be significantly improved.
- the solar cell module of this embodiment is manufactured at a temperature at which the crosslinking agent is not substantially decomposed and the solar cell sealing material of this embodiment melts.
- the solar cell encapsulant is temporarily adhered to the substrate, and then the temperature is raised to sufficiently bond and crosslink the encapsulant.
- What is necessary is just to select the additive prescription which can satisfy various conditions, for example, what is necessary is just to select the kind and impregnation amount, such as the said crosslinking agent and the said crosslinking adjuvant.
- the crosslinking is preferably carried out to such an extent that the gel fraction of the crosslinked ethylene / ⁇ -olefin copolymer is 50 to 95%.
- the gel fraction is more preferably 50 to 90%, still more preferably 60 to 90%, and most preferably 65 to 90%.
- the gel fraction can be calculated by the following method. For example, 1 g of a sample of the encapsulant sheet is taken from the solar cell module and subjected to Soxhlet extraction with boiling toluene for 10 hours. The extract is filtered through a stainless mesh of 30 mesh, and the mesh is dried under reduced pressure at 110 ° C. for 8 hours.
- the weight of the residue remaining on the mesh is measured, and the ratio (%) of the weight of the residue remaining on the mesh to the sample amount (1 g) before the treatment is defined as the gel fraction.
- the gel fraction is equal to or higher than the lower limit, the heat resistance of the solar cell encapsulant is improved.
- a constant temperature and humidity test at 85 ° C. ⁇ 85% RH, high intensity xenon irradiation at a black panel temperature of 83 ° C. It is possible to suppress a decrease in adhesion in a test, a heat cycle test at -40 ° C to 90 ° C, and a heat resistance test.
- the gel fraction is not more than the above upper limit value, it becomes a highly flexible solar cell encapsulant, and the temperature followability in the heat cycle test at ⁇ 40 ° C. to 90 ° C. is improved. Can be prevented.
- the solar cell module of this embodiment is excellent in productivity, power generation efficiency, life, and the like. For this reason, the power generation equipment using such a solar cell module is excellent in cost, power generation efficiency, life and the like, and has a high practical value.
- the power generation equipment described above is suitable for long-term use, both outdoors and indoors, such as being installed on the roof of a house, used as a mobile power source for outdoor activities such as camping, and used as an auxiliary power source for automobile batteries. .
- MFR Based on ASTM D1238, the MFR of the ethylene / ⁇ -olefin copolymer was measured under the conditions of 190 ° C. and 2.16 kg load.
- the ethylene / ⁇ -olefin copolymer is wet-decomposed and then fixed in pure water, and aluminum is quantified using an ICP emission analyzer (ICPS-8100, manufactured by Shimadzu Corporation) to determine the content of aluminum element. It was.
- ICP emission analyzer ICPS-8100, manufactured by Shimadzu Corporation
- the obtained sheet was cut into a size of 10 cm ⁇ 10 cm, and then laminated with a laminating apparatus (manufactured by NPC, LM-110X160S) at 150 ° C., 3 minutes under vacuum, and 15 minutes under pressure to produce a cross-linked sheet for measurement. .
- the volume specific resistance ( ⁇ ⁇ cm) of the prepared crosslinked sheet was measured at an applied voltage of 500 V in accordance with JIS K6911. At the time of measurement, the temperature was set to 100 ⁇ 2 ° C. using a high temperature measurement chamber “12708” (manufactured by Advanced), and a micro ammeter “R8340A” (manufactured by Advanced) was used.
- ethylene is continuously supplied at a rate of 3 kg / hr, 1-butene at 4.2 kg / hr, and hydrogen at a rate of 120 NL / hr, at a polymerization temperature of 90 ° C., a total pressure of 3 MPaG, a residence time of 1 kg.
- Continuous solution polymerization was carried out under the condition of 0.0 hour.
- the ethylene / ⁇ -olefin copolymer normal hexane / toluene mixed solution produced in the polymerization vessel is continuously discharged through a discharge port provided at the bottom of the polymerization vessel, and the ethylene / ⁇ -olefin copolymer solution is discharged.
- the jacket portion was led to a connecting pipe heated with 3 to 25 kg / cm 2 steam so that the normal hexane / toluene mixed solution had a temperature of 150 to 190 ° C.
- a supply port for injecting methanol which is a catalyst deactivator, is attached. Methanol is injected at a rate of about 0.75 L / hr, and ethylene / ⁇ -olefin copolymer is injected.
- the mixture was merged into a combined normal hexane / toluene mixed solution.
- the normal hexane / toluene mixed solution of the ethylene / ⁇ -olefin copolymer kept at about 190 ° C.
- ethylene is continuously supplied at a rate of 3 kg / hr, 1-butene at 4.2 kg / hr, and hydrogen at a rate of 120 NL / hr, at a polymerization temperature of 90 ° C., a total pressure of 3 MPaG, a residence time of 1 kg.
- Continuous solution polymerization was carried out under the condition of 0.0 hour.
- the normal hexane / toluene mixed solution of ethylene / ⁇ -olefin copolymer produced in the polymerization vessel is continuously discharged through a discharge port provided at the bottom of the polymerization vessel, and after depressurization in a stock tank, A normal hexane / toluene mixed solution of an ethylene / ⁇ -olefin copolymer was obtained.
- a normal hexane / toluene mixed solution of an ethylene / ⁇ -olefin copolymer was obtained.
- 5 ml of 0.1N hydrochloric acid and 1 L of distilled water were added and stirred.
- aqueous phase Separate the aqueous phase from the above mixture using a separatory funnel, add 1 L of distilled water to the remaining normal hexane / toluene mixed solution of the ethylene / ⁇ -olefin copolymer, and stir and separate the aqueous phase. Was repeated until the was neutralized. 3 L of methanol was added to the resulting mixed solution of ethylene / ⁇ -olefin copolymer in normal hexane / toluene while stirring the mixed solvent, and the precipitated ethylene / ⁇ -olefin copolymer was sampled and collected at 130 ° C., 10 Torr.
- a mixed isoparaffin / toluene mixed solution of ethylene / ⁇ -olefin copolymer was obtained in the same manner as in Synthesis Example 1B, except that soparaffin was continuously supplied; hydrogen was supplied at a rate of 10 NL / hr.
- the resulting mixed isoparaffin / toluene mixed solution of ethylene / ⁇ -olefin copolymer was distilled on a rotary evaporator at 110 ° C. to obtain an ethylene / ⁇ -olefin copolymer.
- Pelletization was performed in the same manner as in Synthesis Example 1B. The physical properties are shown in Table 1B.
- Example 2A An embossed sheet (solar cell encapsulant sheet) was obtained in the same manner as in Example 1A described above except that the formulation shown in Table 2A was used. All the void ratios of the obtained sheets were 28%. Various evaluation results of the obtained sheet are shown in Table 2A.
- Example 1A An embossed sheet (solar cell encapsulant sheet) was obtained in the same manner as in Example 1A described above except that the formulation shown in Table 2A was used. All the void ratios of the obtained sheets were 28%. Various evaluation results of the obtained sheet are shown in Table 2A.
- Example 1B An embossed sheet (solar cell sealing material sheet) was obtained in the same manner as in Example 1A described above except that the formulation shown in Table 2B was used. All the void ratios of the obtained sheets were 28%. Various evaluation results of the obtained sheet are shown in Table 2B.
- Example 2B An embossed sheet (solar cell sealing material sheet) was obtained in the same manner as in Example 1A described above except that the formulation shown in Table 2B was used. All the void ratios of the obtained sheets were 28%. Various evaluation results of the obtained sheet are shown in Table 2B.
- Example 3B An embossed sheet (solar cell sealing material sheet) was obtained in the same manner as in Example 1A described above except that the formulation shown in Table 2B was used. All the void ratios of the obtained sheets were 28%. Various evaluation results of the obtained sheet are shown in Table 2B.
- the present invention includes the following aspects.
- a solar cell encapsulant comprising an ethylene / ⁇ -olefin copolymer
- a solar cell encapsulant wherein the content of fluorine element in the ethylene / ⁇ -olefin copolymer as determined by a combustion method and an ion chromatography method is 30 ppm or less.
- a1 The content of structural units derived from ethylene is 80 to 90 mol%, and the content of structural units derived from ⁇ -olefins having 3 to 20 carbon atoms is 10 to 20 mol%.
- a2) Based on ASTM D1238, MFR measured under the conditions of 190 ° C. and 2.16 kg load is 10 to 50 g / 10 min. a3)
- the density measured according to ASTM D1505 is 0.865 to 0.884 g / cm 3 .
- the Shore A hardness measured according to ASTM D2240 is 60 to 85. [A3] According to ASTM D1238, the MFR of the ethylene / ⁇ -olefin copolymer measured under the conditions of 190 ° C.
- the organic peroxide has a 1 minute half-life temperature of 100 to 170 ° C., The sun according to [A1], wherein the content of the organic peroxide in the solar cell encapsulant is 0.1 to 3 parts by weight with respect to 100 parts by weight of the ethylene / ⁇ -olefin copolymer. Battery encapsulant.
- the solar cell sealing material according to.
- the content of the hindered amine light stabilizer in the solar cell encapsulant is 0.01 to 2.0 parts by weight with respect to 100 parts by weight of the ethylene / ⁇ -olefin copolymer.
- the solar cell sealing material as described.
- Solar cell encapsulant is 0.005 to 0.5 parts by weight with respect to 100 parts by weight of the ethylene / ⁇ -olefin copolymer.
- Solar cell module with [B1] A solar cell encapsulant comprising an ethylene / ⁇ -olefin copolymer, The fluorine element content in the ethylene / ⁇ -olefin copolymer as determined by a combustion method and an ion chromatography method is 3.0 ppm or less, A solar cell encapsulating material, wherein the content of aluminum element in the ethylene / ⁇ -olefin copolymer is 20 ppm or less as determined by ICP emission analysis.
- the Shore A hardness measured according to ASTM D2240 is 60 to 85.
- the MFR of the ethylene / ⁇ -olefin copolymer measured under the conditions of 190 ° C. and 2.16 kg load is 10 to 27 g / 10 min. Stop material.
- the organic peroxide has a 1 minute half-life temperature of 100 to 170 ° C., The sun according to [B1], wherein the content of the organic peroxide in the solar cell encapsulant is 0.1 to 3 parts by weight with respect to 100 parts by weight of the ethylene / ⁇ -olefin copolymer. Battery encapsulant.
- the content of the hindered amine light stabilizer in the solar cell encapsulant is 0.01 to 2.0 parts by weight with respect to 100 parts by weight of the ethylene / ⁇ -olefin copolymer.
- the solar cell sealing material as described.
- Solar cell encapsulant is 0.005 to 0.5 parts by weight with respect to 100 parts by weight of the ethylene / ⁇ -olefin copolymer.
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Abstract
Description
次に、結晶型太陽電池モジュールを得るには、太陽電池モジュール用保護シート(表面側透明保護部材)/太陽電池封止材/結晶型太陽電池素子/太陽電池封止材/太陽電池モジュール用保護シート(裏面側保護部材)の順に積層する。
一方、薄膜系太陽電池モジュールを得るには、薄膜型太陽電池素子/太陽電池封止材/太陽電池モジュール用保護シート(裏面側保護部材)の順に積層する。その後、これらを真空吸引して加熱圧着するラミネーション法などを利用することにより、太陽電池モジュールが製造される。このようにして製造される太陽電池モジュールは、耐候性を有し、建物の屋根部分などの屋外での使用にも適したものとなっている。
したがって、本発明は、絶縁性に優れる太陽電池封止材を提供することを課題とする。
エチレン・α-オレフィン共重合体を含む太陽電池封止材であって、
燃焼法およびイオンクロマトグラフ法により定量される、上記エチレン・α-オレフィン共重合体中のフッ素元素の含有量が30ppm以下である、太陽電池封止材。
[2]
燃焼法およびイオンクロマトグラフ法により定量される、上記エチレン・α-オレフィン共重合体中の上記フッ素元素の含有量が3.0ppm以下であり、
ICP発光分析により定量される、上記エチレン・α-オレフィン共重合体中のアルミニウム元素の含有量が20ppm以下である、[1]に記載の太陽電池封止材。
[3]
上記エチレン・α-オレフィン共重合体が、以下の要件a1)~a4)を満たす[1]または[2]に記載の太陽電池封止材。
a1)エチレンに由来する構成単位の含有割合が80~90mol%であり、炭素数3~20のα-オレフィンに由来する構成単位の含有割合が10~20mol%である。
a2)ASTM D1238に準拠し、190℃、2.16kg荷重の条件で測定されるMFRが0.1~50g/10分である。
a3)ASTM D1505に準拠して測定される密度が0.865~0.884g/cm3である。
a4)ASTM D2240に準拠して測定されるショアA硬度が60~85である。
[4]
ASTM D1238に準拠し、190℃、2.16kg荷重の条件で測定される上記エチレン・α-オレフィン共重合体のMFRが、10~50g/10分である、[3]に記載の太陽電池封止材。
[5]
ASTM D1238に準拠し、190℃、2.16kg荷重の条件で測定される上記エチレン・α-オレフィン共重合体のMFRが、0.1g/10分以上10g/10分未満である、[3]に記載の太陽電池封止材。
[6]
有機過酸化物をさらに含み、
上記有機過酸化物の1分間半減期温度が100~170℃であり、
当該太陽電池封止材中の上記有機過酸化物の含有量が、上記エチレン・α-オレフィン共重合体100重量部に対して0.1~3重量部である、[1]乃至[5]いずれか一つに記載の太陽電池封止材。
[7]
シランカップリング剤をさらに含み、
当該太陽電池封止材中の上記シランカップリング剤の含有量が、上記エチレン・α-オレフィン共重合体100重量部に対して0.1~5重量部である、[1]乃至[6]いずれか一つに記載の太陽電池封止材。
[8]
ヒンダードフェノール系安定剤、ヒンダードアミン系光安定剤、リン系安定剤、紫外線吸収剤、架橋助剤からなる群から選ばれる添加剤を一種または二種以上さらに含む、[1]乃至[7]いずれか一つに記載の太陽電池封止材。
[9]
上記エチレン・α-オレフィン共重合体を溶融混錬後、シート状に押出成形して得られた、[1]乃至[8]いずれか一つに記載の太陽電池封止材。
[10]
上記エチレン・α-オレフィン共重合体を溶融混錬後、シート状にカレンダー成形して得られた、[1]乃至[9]いずれか一つに記載の太陽電池封止材。
[11]
シート状である、[1]乃至[10]いずれか一つに記載の太陽電池封止材。
[12]
表面側透明保護部材と、
裏面側保護部材と、
太陽電池素子と、
[1]乃至[11]いずれか一つに記載の太陽電池封止材を架橋させて形成された、上記太陽電池素子を上記表面側透明保護部材と上記裏面側保護部材との間に封止する封止層と、
を備えた太陽電池モジュール。
[13]
[1]に記載の太陽電池封止材を製造するための製造方法であって、
a)メタロセン化合物と、上記メタロセン化合物と反応してイオン対を形成する下記一般式[VI]で表される化合物(II)を用いて、エチレンと炭素数3~20のα-オレフィンとの共重合を行い、エチレン・α-オレフィン共重合体を製造する工程と、
b)蒸留操作、酸またはアルカリによる脱灰操作、貧溶媒による再沈殿操作、からなる群から選択される1種または2種以上の方法により、上記エチレン・α-オレフィン共重合体を処理し、燃焼法およびイオンクロマトグラフ法により定量される、上記エチレン・α-オレフィン共重合体中のフッ素元素の含有量を30ppm以下とする工程と、
c)得られた上記エチレン・α-オレフィン共重合体を押出成形またはカレンダー成形によりシート状に成形する工程と、を含む、太陽電池封止材の製造方法。
[14]
蒸留操作、酸またはアルカリによる脱灰操作、貧溶媒による再沈殿操作、からなる群から選択される1種または2種以上の方法により、燃焼法およびイオンクロマトグラフ法により定量される、上記エチレン・α-オレフィン共重合体中のフッ素元素の含有量を3.0ppm以下とし、
ICP発光分析により定量される、上記エチレン・α-オレフィン共重合体中のアルミニウム元素の含有量が20ppm以下とする工程をさらに含む、[13]に記載の太陽電池封止材の製造方法。
本実施形態の太陽電池封止材は、エチレン・α-オレフィン共重合体を含んでおり、上記エチレン・α-オレフィン共重合体は、燃焼法およびイオンクロマトグラフ法により定量される、フッ素元素の含有量が30ppm以下であり、好ましくは20ppm以下であり、より好ましくは10ppm以下であり、さらに好ましくは3.0ppm以下であり、特に好ましくは2.5ppm以下であり、最も好ましくは2.0ppm以下である。
上記エチレン・α-オレフィン共重合体中のフッ素元素の含有量が上記上限値以下であると、得られる太陽電池封止材の体積固有抵抗率が高くなり、絶縁性が向上する。
また、上記エチレン・α-オレフィン共重合体は、通常、フッ素元素を必須成分として含んでおり、フッ素元素の含有量は、例えば0.1ppm以上であり、通常は1ppm以上である。
エチレン・α-オレフィン共重合体は、後述するエチレン・α-オレフィン共重合体を製造する際の重合触媒として用いられる(II-2)メタロセン化合物(I)と反応してイオン対を形成する化合物などのフッ素元素含有化合物を含んでいる。このフッ素元素含有化合物は、重合後もイオン対を形成してエチレン・α-オレフィン共重合体中に残っており、電荷を掛けた際にイオンによる電荷の移動を引き起こしてしまう。つまり、この化合物が太陽電池封止材中の体積固有抵抗率を低下させる要因であることが明らかになった。
すなわち、本発明者らは、エチレン・α-オレフィン共重合体を製造する際に混入するフッ素元素含有化合物が、太陽電池封止材中の体積固有抵抗率に影響を与えていることを初めて見出した。
なお、本発明で特定する太陽電池封止材中のフッ素元素の含有量は、上記フッ素元素含有化合物の含有量の指標を示している。
本実施形態の太陽電池封止材に用いられるエチレン・α-オレフィン共重合体は、エチレンと、炭素数3~20のα-オレフィンとを共重合することによって得られる。α-オレフィンとしては、通常、炭素数3~20のα-オレフィンを1種類単独でまたは2種類以上を組み合わせて用いることができる。炭素数3~20のα-オレフィンとしては、直鎖状または分岐状のα-オレフィン、例えば、プロピレン、1-ブテン、1-ペンテン、1-ヘキセン、3-メチル-1-ブテン、3,3-ジメチル-1-ブテン、4-メチル-1-ペンテン、1-オクテン、1-デセン、1-ドデセンなどを挙げることができる。中でも好ましいのは、炭素数が10以下であるα-オレフィンであり、とくに好ましいのは炭素数が3~8のα-オレフィンである。入手の容易さからプロピレン、1-ブテン、1-ペンテン、1-ヘキセン、4-メチル-1-ペンテンおよび1-オクテンが好ましい。なお、エチレン・α-オレフィン共重合体はランダム共重合体であっても、ブロック共重合体であってもよいが、柔軟性の観点からランダム共重合体が好ましい。
エチレン・α-オレフィン共重合体に含まれる、エチレンに由来する構成単位の含有割合は、好ましくは80~90mol%であり、より好ましくは80~88mol%、さらに好ましくは82~88mol%、とくに好ましくは82~87mol%である。エチレン・α-オレフィン共重合体に含まれる、炭素数3~20のα-オレフィンに由来する構成単位(以下、「α-オレフィン単位」とも記す)の含有割合は、好ましくは10~20mol%であり、より好ましくは12~20mol%、さらに好ましくは12~18mol%、とくに好ましくは13~18mol%である。
ASTM D1238に準拠し、190℃、2.16kg荷重の条件で測定されるエチレン・α-オレフィン共重合体のメルトフローレ-ト(MFR)は、通常0.1~50g/10分であり、好ましくは2~50g/10分であり、より好ましくは10~50g/10分であり、さらに好ましくは10~40g/10分、特に好ましくは12~27g/10分、最も好ましくは15~25g/10分である。エチレン・α-オレフィン共重合体のMFRは、後述する重合反応の際の重合温度、重合圧力、並びに重合系内のエチレンおよびα-オレフィンのモノマー濃度と水素濃度のモル比率などを調整することにより、調整することができる。
MFRが0.1g/10分以上10g/10分未満であると、カレンダー成形によってシートを製造することができる。MFRが0.1g/10分以上10g/10分未満であると、エチレン・α-オレフィン共重合体を含む樹脂組成物の流動性が低いため、シートを電池素子とラミネートする際にはみ出した溶融樹脂によるラミネート装置の汚れを防止できる点で好ましい。
さらに、MFRが2g/10分以上、好ましくは10g/10分以上であると、エチレン・α-オレフィン共重合体を含む樹脂組成物の流動性が向上し、シート押出成形時の生産性を向上させることができる。
MFRが50g/10分以下であると、分子量が大きくなるため、チルロールなどのロール面への付着を抑制できるため、剥離を不要とし、均一な厚みのシートに成形することができる。さらに、「コシ」がある樹脂組成物となるため、0.1mm以上の厚いシートを容易に成形することができる。また、太陽電池モジュールのラミネート成形時の架橋特性が向上するため、十分に架橋させて、耐熱性の低下を抑制することができる。
MFRが27g/10分以下であると、さらに、シート成形時のドローダウンを抑制でき幅の広いシートを成形でき、また架橋特性および耐熱性がさらに向上し、最も良好な太陽電池封止材シートを得ることができる。
なお後述する太陽電池モジュールのラミネート工程において樹脂組成物の架橋処理を行わない場合は溶融押出工程において有機過酸化物の分解の影響が小さいため、MFRが0.1g/10分以上10g/10分未満、好ましくは0.5g/10分以上8.5g/10分未満の樹脂組成物を用い、押出成形によってシートを得ることもできる。樹脂組成物の有機過酸化物含有量が0.15重量部以下である場合には、MFRが0.1g/10分以上10g/10分未満の樹脂組成物を用い、シラン変性処理、または微架橋処理を行いつつ170~250℃の成形温度で押出成形によってシートを製造することもできる。MFRがこの範囲にあるとシートを太陽電池素子とラミネートする際にはみ出した溶融樹脂によるラミネート装置の汚れを防止できる点で好ましい。
ASTM D1505に準拠して測定されるエチレン・α-オレフィン共重合体の密度は好ましくは0.865~0.884g/cm3であり、より好ましくは0.866~0.883g/cm3、さらに好ましくは0.866~0.880g/cm3、とくに好ましくは0.867~0.880g/cm3である。エチレン・α-オレフィン共重合体の密度は、エチレン単位の含有割合とα-オレフィン単位の含有割合とのバランスにより調整することができる。すなわち、エチレン単位の含有割合を高くすると結晶性が高くなり、密度の高いエチレン・α-オレフィン共重合体を得ることができる。一方、エチレン単位の含有割合を低くすると結晶性が低くなり、密度の低いエチレン・α-オレフィン共重合体を得ることができる。
ASTM D2240に準拠して測定される、エチレン・α-オレフィン共重合体のショアA硬度は好ましくは60~85であり、より好ましくは62~83、さらに好ましくは62~80、とくに好ましくは65~80である。エチレン・α-オレフィン共重合体のショアA硬度は、エチレン・α-オレフィン共重合体のエチレン単位の含有割合や密度を上述の数値範囲に制御することにより、調整することができる。すなわち、エチレン単位の含有割合が高く、密度が高いエチレン・α-オレフィン共重合体は、ショアA硬度が高くなる。一方、エチレン単位の含有割合が低く、密度が低いエチレン・α-オレフィン共重合体は、ショアA硬度が低くなる。なおショアA硬度は、試験片シートに荷重後、15秒以上経過してから測定する。
エチレン・α-オレフィン共重合体の、示差走査熱量測定(DSC)に基づく融解ピークは30~90℃の範囲に存在することが好ましく、33~90℃の範囲に存在することがさらに好ましく、33~88℃の範囲に存在することがとくに好ましい。融解ピークが90℃以下であると、結晶化度が低くなり、得られる太陽電池封止材の柔軟性が高まるため、太陽電池モジュールをラミネート成形する際に、セルの割れや薄膜電極のカケの発生を防止することができる。一方、融解ピークが30℃以上であると、樹脂組成物の柔軟性を適度に高くできるため、押出成形にて太陽電池封止材シートを容易に得ることができる。また、シートのベタつきによるブロッキングを防止して、シートの繰り出し性の悪化を抑制することができる。
本実施形態の太陽電池封止材は、JIS K6911に準拠し、温度100℃、印加電圧500Vで測定される体積固有抵抗が1.0×1013~1.0×1018Ω・cmであることが好ましい。体積固有抵抗が大きい太陽電池封止材は、PID現象の発生を抑制するという特性を有する傾向にある。さらに、太陽光が照射される時間帯には、従来の太陽電池モジュールではモジュール温度が例えば70℃以上になることがあるので、長期信頼性の観点から、従来報告されている常温(23℃)での体積固有抵抗より高温条件下での体積固有抵抗が求められており、温度100℃での体積固有抵抗が重要となる。
なお、体積固有抵抗が、5.0×1014Ω・cm以上であると、85℃,85%rhでの恒温恒湿試験においてPID現象の発生がさらに長期化できる傾向にあり、望ましい。
体積固有抵抗は、封止材シートに成形した後、真空ラミネーター、熱プレス、架橋炉などで架橋および平坦なシートに加工された後に測定される。また、モジュール積層体中のシートは、他の層を除去して測定する。
また、触媒成分にスカベンジャーとして、トリエチルアルミニウムやトリイソブチルアルミニウム等のアルキルアルミニウム化合物や有機アルミニウムオキシ化合物を用いる場合、アルミニウム元素がエチレン・α-オレフィン共重合体に含まれることがある。エチレン・α-オレフィン共重合体に含まれる、アルミニウム元素(以下、「Al」とも記す)の含有量(残渣量)が好ましくは20ppm以下であり、より好ましくは18ppm以下であり、さらに好ましくは10ppm以下である。Al含有量は、エチレン・α-オレフィン共重合体の重合過程において添加する有機アルミニウムオキシ化合物や有機アルミニウム化合物の濃度に依存する。
Al含有量が20ppm以下の場合は、エチレン・α-オレフィン共重合体の透明性がより良好な太陽電池封止材が得られる。
また、上記エチレン・α-オレフィン共重合体中のAl含有量は、通常は0.5ppm以上である。
エチレン・α-オレフィン共重合体は、以下に示す種々のメタロセン化合物を触媒として用いて製造することが好ましい。メタロセン化合物としては、例えば、特開2006-077261号公報、特開2008-231265号公報、特開2005-314680号公報などに記載のメタロセン化合物を用いることができる。ただし、これらの特許文献に記載のメタロセン化合物とは異なる構造のメタロセン化合物を使用してもよいし、二種以上のメタロセン化合物を組み合わせて使用してもよい。
(II)上記メタロセン化合物(I)と反応してイオン対を形成する化合物(以下、「イオン性化合物(II)」と略称する場合がある。)としては、特開平1-501950号公報、特開平1-502036号公報、特開平3-179005号公報、特開平3-179006号公報、特開平3-207703号公報、特開平3-207704号公報、USP5321106号などに記載されたルイス酸、イオン性化合物、ボラン化合物およびカルボラン化合物などを挙げることができる。
イオン性化合物(II)の具体例としては、トリペンタフルオロフェニルボレート、トリフェニルカルベニウムテトラキス(ペンタフルオロフェニル)ボレート、トリフェニルカルベニウムテトラキス(3,5-ジトリフルオロメチルフェニル)ボレート、トリス(4-メチルフェニル)カルベニウムテトラキス(ペンタフルオロフェニル)ボレート、トリス(3,5-ジメチルフェニル)カルベニウムテトラキス(ペンタフルオロフェニル)ボレート、トリ(n-ブチル)アンモニウムテトラキス(ペンタフルオロフェニル)ボレート、トリエチルアンモニウムテトラキス(ペンタフルオロフェニル)ボレート、トリプロピルアンモニウムテトラキス(ペンタフルオロフェニル)ボレート、トリ(n-ブチル)アンモニウムテトラキス(4-トリフルオロメチルフェニル)ボレート、トリ(n-ブチル)アンモニウムテトラキス(3,5-ジトリフルオロメチルフェニル)ボレート、ジオクタデシルメチルアンモニウムテトラキス(ペンタフルオロフェニル)ボレート、ジオクタデシルメチルアンモニウムテトラキス(4-トリフルオロメチルフェニル)ボレート、ジオクタデシルメチルアンモニウムテトラキス(3,5-ジトリフルオロメチルフェニル)ボレート、ジオクタデシルメチルアンモニウム、N,N-ジメチルアニリニウムテトラキス(ペンタフルオロフェニル)ボレート、 N,N-ジメチルアニリニウムテトラキス(3,5-ジトリフルオロメチルフェニル)ボレート、N,N-ジエチルアニリニウムテトラキス(ペンタフルオロフェニル)ボレート、N,N-ジエチルアニリニウムテトラキス(3,5-ジトリフルオロメチルフェニル)ボレート、N,N-2,4,6-ペンタメチルアニリニウムテトラキス(ペンタフルオロフェニル)ボレート、ジ(1-プロピル)アンモニウムテトラキス(ペンタフルオロフェニル)ボレートなどが挙げられる。
上記のイオン性化合物(II)は、1種単独で用いてもよく、2種以上混合して用いることもできる。
そのため包装材など通常の用途向けエチレン・α-オレフィン共重合体では、生産性を鑑みてイオン性化合物(II)を、メタロセン化合物(I)に比して大量に用いるのが通常であった。
一方、本実施形態における太陽電池封止材においては、化合物(II)は、化合物(I)中の全遷移金属(M)とのモル比[(II)/M]が1~10、好ましくは1~5、さらに好ましくは1となるような量で用いられる。
化合物(II)の使用量を上記範囲内とすることにより、上記エチレン・α-オレフィン共重合体中のフッ素元素の含有量を上記範囲内とすることができるため、高い体積固有抵抗率の太陽電池封止材を得ることができるため好ましい。化合物(III-1)又は(III-2)は、重合容積1リットル当り、通常0.01~2.0ミリモル、好ましくは約0.01~1.0ミリモルとなるような量で用いることができる。
また、メタロセン化合物(I)の重合活性が低い場合には、化合物(II)と化合物(I)中の全遷移金属(M)とのモル比[(II)/M]をなるべく高くすることが望ましい。
また、沸点が110℃以上のオクタン、ノナン、デカン、ウンデカン、ドデカン、灯油などの脂肪族炭化水素;イソドデカン、混合イソパラフィンなどの分岐脂肪族炭化水素などの単体または混合した不活性炭化水素溶媒を用いてエチレンとα-オレフィンの共重合を行い、溶媒を除去しエチレン・α-オレフィン共重合体を得ると、高沸点溶媒とイオン性化合物(II)が共沸し、エチレン・α-オレフィン共重合体中の上記残存物を取り除くことができる傾向にある。
本実施形態の太陽電池封止材は、有機過酸化物を含んでいてもよい。有機過酸化物は、シランカップリング剤と、エチレン・α-オレフィン共重合体とのグラフト変性の際のラジカル開始剤として、さらに、エチレン・α-オレフィン共重合体の太陽電池モジュールのラミネート成形時の架橋反応の際のラジカル開始剤として用いられる。エチレン・α-オレフィン共重合体に、シランカップリング剤をグラフト変性することにより、表面側透明保護部材、裏面側保護部材、セル、電極との接着性が良好な太陽電池モジュールが得られる。さらに、エチレン・α-オレフィン共重合体を架橋することにより、耐熱性、接着性に優れた太陽電池モジュールを得ることができる。
有機過酸化物の含有量が3.0重量部以下であると、押出シート成形時に樹脂組成物から得られる太陽電池封止シートにゲルの発生がなく、押出機のトルクを抑制でき、シート成形が容易となる。シートも、押出機内でゲル物を発生しないためシートの表面に凹凸がなく、外観が良好である。また、ゲルがないため、電圧をかけてもシート内部のゲル物に起因するクラックが生じないため、絶縁破壊抵抗が良好である。また、透湿性も良好である。さらに、シート表面に凹凸がないため、太陽電池モジュールのラミネート加工時に表面側透明保護部材、セル、電極、裏面側保護部材との接着性も良好である。
本実施形態の太陽電池封止材は、さらにシランカップリング剤を含んでいてもよい。本実施形態の太陽電池封止材中のシランカップリング剤の含有量は、エチレン・α-オレフィン共重合体100重量部に対して、好ましくは0.1~5重量部であり、より好ましくは0.1~4重量部であり、とくに好ましくは0.1~3重量部である。
本実施形態の太陽電池封止材は、ヒンダードアミン系光安定剤をさらに含むのが好ましい。ヒンダードアミン系光安定剤を含むことで、エチレン・α-オレフィン共重合体に有害なラジカル種を補足し、新たなラジカルの発生を抑制できる。
また、下記一般式(1)の低分子量ヒンダードアミン系光安定剤も使用できる。
また、下記式で表される高分子量ヒンダードアミン系光安定剤も使用できる。高分子量ヒンダードアミン系光安定剤とは、分子量が1000~5000のものを言う。
本実施形態の太陽電池封止材は、ヒンダードフェノール系安定剤をさらに含むのが好ましい。ヒンダードフェノール系安定剤を含むことにより、酸素存在下でエチレン・α-オレフィン共重合体に有害なラジカル種を補足し、新たなラジカルの発生を抑制でき、酸化劣化を防止できる。
ヒンダードフェノール系安定剤としては、従来公知の化合物を用いることができ、例えば、1,1,3-トリス-(2-メチル-4-ヒドロキシ-5-t-ブチルフェニル)ブタン、4,4'-ブチリデンビス-(3-メチル-6-t-ブチルフェノール)、2,2-チオビス(4-メチル-6-t-ブチルフェノール)、7-オクタデシル-3-(4'-ヒドロキシ-3',5'-ジ-t-ブチルフェニル)プロピオネート、テトラキス-[メチレン-3-(3',5'-ジ-t-ブチル-4'-ヒドロキシフェニル)プロピオネート]メタン、ペンタエリスリトール-テトラキス[3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート]、トリエチレングリコール-ビス[3-(3-t-ブチル-5-メチル-4-ヒドロキシフェニル)プロピオネート]、1,6-ヘキサンジオール-ビス[3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート]、2,4-ビス(n-オクチルチオ)-6-(4-ヒドロキシ-3,5-ジ-t-ブチルアニリノ)-1,3,5-トリアジン、トリス-(3,5-ジ-t-ブチル-4-ヒドロキシベンジル)-イソシアヌレート、2,2-チオ-ジエチレンビス[3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート]、N,N'-ヘキサメチレンビス(3,5-ジ-t-ブチル-4-ヒドロキシ)-ヒドロシンナアミド、2,4-ビス[(オクチルチオ)メチル]-o-クレゾール、3,5-ジ-t-ブチル-4-ヒドロキシベンジル-ホスホネート-ジエチルエステル、テトラキス[メチレン(3,5-ジ-t-ブチル-4-ヒドロキシヒドロシンナメイト)]メタン、オクタデシル-3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオン酸エステル、3,9-ビス[2-{3-(3-t-ブチル-4-ヒドロキシ-5-メチルフェニル)プロピオニルオキシ}-1,1-ジメチルエチル]-2,4-8,10-テトラオキサスピロ[5.5]ウンデカンなどを挙げることができる。中でも、特にペンタエリスリトール-テトラキス[3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート]、オクタデシル-3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオン酸エステルが好ましい。
本実施形態の太陽電池封止材は、リン系安定剤をさらに含むのが好ましい。リン系安定剤を含んでいると、押出成形時の有機過酸化物の分解を抑制でき、外観が良好なシートを得ることができる。ヒンダードアミン系光安定剤、ヒンダードフェノール系安定剤を含んでいると発生したラジカルを消滅し、外観が良好なシートを生産することもできるが、シート押出工程で安定剤を消費してしまい、耐熱性、耐候性などの長期信頼性が低下する傾向にある。
なお、同一分子内に亜リン酸エステル構造とヒンダードフェノール構造を有する安定剤があるが、本実施形態の太陽電池封止材のように有機過酸化物が多量に含有している組成物においては、押出成形時に有機過酸化物の分解を抑制する性能が不十分であり、ゲルを生成して外観が良好なシートが得られない傾向にある。
本実施形態の太陽電池封止材は、紫外線吸収剤をさらに含むのが好ましい。
本実施形態の太陽電池封止材中の紫外線吸収剤の含有量は、エチレン・α-オレフィン共重合体100重量部に対して、0.005~5重量部であることが好ましい。紫外線吸収剤の含有量が上記範囲内にあると、耐候安定性、架橋特性のバランスが優れるので好ましい。
本実施形態の太陽電池封止材を構成する樹脂組成物には、以上詳述した諸成分以外の各種成分を、本発明の目的を損なわない範囲において、適宜含有させることができる。例えば、エチレン・α-オレフィン共重合体以外の各種ポリオレフィン、スチレン系やエチレン系ブロック共重合体、プロピレン系重合体などが挙げられる。太陽電池封止材中の各種成分の含有量は、上記エチレン・α-オレフィン共重合体100重量部に対して、好ましくは0.0001~50重量部であり、より好ましくは0.001~40重量部である。また、ポリオレフィン以外の各種樹脂、および/または各種ゴム、可塑剤、充填剤、顔料、染料、帯電防止剤、抗菌剤、防黴剤、難燃剤、架橋助剤、ヒンダードフェノール系安定剤およびリン系安定剤以外のその他の耐熱安定剤、および分散剤などから選ばれる一種以上の添加剤を適宜含有することができる。
これらの架橋助剤の中でより好ましいのは、ジアクリレート、ジメタクリレート、ジビニル芳香族化合物、トリメチロールプロパントリアクリレート、テトラメチロールメタントリアクリレート、ペンタエリスリトールトリアクリレートなどのトリアクリレート;トリメチロールプロパントリメタクリレート、トリメチロールエタントリメタクリレートなどのトリメタクリレート;ペンタエリスリトールテトラアクリレート、テトラメチロールメタンテトラアクリレートなどのテトラアクリレート、トリアリルシアヌレート、トリアリルイソシアヌレートなどのシアヌレート、ジアリルフタレートなどのジアリル化合物;トリアリル化合物;p-キノンジオキシム、p-p'-ジベンゾイルキノンジオキシムなどのオキシム;フェニルマレイミドなどのマレイミドである。さらにこれらの中でとくに好ましいのは、トリアリルイソシアヌレートであり、ラミネート後の太陽電池封止材の気泡発生や架橋特性のバランスが最も優れる。
本実施形態の太陽電池封止材は、体積固有抵抗率に優れ、さらに表面側透明保護部材、裏面側保護部材、薄膜電極、アルミニウム、太陽電池素子などの各種太陽電池部材との接着性、耐熱性、押出成形性および架橋特性のバランス、透明性、柔軟性、外観、耐候性、電気絶縁性、透湿性、電極腐食性、プロセス安定性のバランスに優れている。このため、従来公知の太陽電池モジュールの太陽電池封止材として好適に用いられる。本実施形態の太陽電池封止材の製造方法としては通常用いられている方法が利用できるが、ニーダー、バンバリミキサー、押出機などにより溶融ブレンドすることにより製造することが好ましい。とくに、連続生産が可能な押出機での製造が好ましい。
カレンダー成形機としては、公知の各種カレンダー成形機を用いることができ、ミキシングロール、三本カレンダーロール、四本カレンダーロールを用いることができる。四本カレンダーロールとしては、とくに、I型、S型、逆L型、Z型、斜Z型などを用いることができる。また、カレンダーロールに掛ける前に、エチレン系樹脂組成物を適度な温度まで熱しておくことも好ましく、例えば、バンバリーミキサー、ニーダー、押出機などを設置することも好ましい実施形態の一つである。カレンダー成形の温度範囲は、ロール温度を、通常40~100℃とすることが好ましい。
VA(mm3)=tmax(mm)×106(mm2) (12)
一方、この単位面積の太陽電池封止材の実際の体積V0(mm3)は、太陽電池封止材を構成する樹脂の比重ρ(g/mm3)と単位面積(1m2)当りの太陽電池封止材の実際の重さW(g)と、を下記式(13)に当てはめることにより算出される。
V0(mm3)=W/ρ (13)
太陽電池封止材の単位面積当りの凹部の合計体積VH(mm3)は、下記式(14)に示されるように、「太陽電池封止材の見掛けの体積VA」から「実際の体積V0」を差し引くことによって算出される。
VH(mm3)=VA-V0=VA-(W/ρ) (14)
したがって、空隙率(%)は次のようにして求めることができる。
空隙率P(%)=VH/VA×100
=(VA-(W/ρ))/VA×100
=1-W/(ρ・VA)×100
=1-W/(ρ・tmax・106)×100
太陽電池モジュールは、例えば、通常、多結晶シリコンなどにより形成された太陽電池素子を太陽電池封止材シートで挟み積層し、さらに、表裏両面を保護シートでカバーした結晶型太陽電池モジュールが挙げられる。すなわち、典型的な太陽電池モジュールは、太陽電池モジュール用保護シート(表面側透明保護部材)/太陽電池封止材/太陽電池素子/太陽電池封止材/太陽電池モジュール用保護シート(裏面側保護部材)という構成になっている。ただし、本実施形態の好ましい実施形態の1つである太陽電池モジュールは、上記の構成には限定されず、本発明の目的を損なわない範囲で、上記の各層の一部を適宜省略し、または上記以外の層を適宜設けることができる。上記以外の層としては、例えば接着層、衝撃吸収層、コーティング層、反射防止層、裏面再反射層、および光拡散層などを挙げることができる。これらの層は、とくに限定はないが、各層を設ける目的や特性を考慮して、適切な位置に設けることができる。
図1は、本発明の太陽電池モジュールの一実施形態を模式的に示す断面図である。なお、図1においては、結晶シリコン系の太陽電池モジュール20の構成の一例が示されている。図1に示されるように、太陽電池モジュール20は、インターコネクタ29により電気的に接続された複数の結晶シリコン系の太陽電池素子22と、それを挟持する一対の表面側透明保護部材24と裏面側保護部材26とを有し、これらの保護部材と複数の太陽電池素子22との間に、封止層28が充填されている。封止層28は、本実施形態の太陽電池用封止材を貼り合わせた後、加熱圧着されて得られ、太陽電池素子22の受光面および裏面に形成された電極と接している。電極とは、太陽電池素子22の受光面および裏面にそれぞれ形成された集電部材であり、後述する集電線、タブ付用母線、および裏面電極層などを含む。
太陽電池素子には、通常、発生した電気を取り出すための集電電極が配置される。集電電極の例には、バスバー電極、フィンガー電極などが含まれる。一般に、集電電極は、太陽電池素子の表面と裏面の両面に配置した構造をとるが、受光面に集電電極を配置すると、集電電極が光を遮ってしまうため発電効率が低下するという問題が生じうる。
その結果、発電セルと表面側透明保護部材またはアルミフレームとの間に封止される、太陽電池封止材には、高い電気絶縁性、高抵抗などの良好な電気特性が求められる。
薄膜シリコン系の太陽電池モジュールは、(1)表面側透明保護部材(ガラス基板)/薄膜太陽電池素子/封止層/裏面側保護部材をこの順に積層したもの;(2)表面側透明保護部材/封止層/薄膜太陽電池素子/封止層/裏面側保護部材をこの順に積層したものなどでありうる。表面側透明保護部材、裏面側保護部材、および封止層は、前述の「結晶シリコン系の太陽電池モジュール」の場合と同様である。
さらに、上記封止材層は、防湿性に優れていることが好ましい。この場合、太陽電池モジュールの裏面側からの水分の透過を防ぐことができ、太陽電池モジュールの光起電力素子の腐食、劣化を防ぐことができる。
太陽電池モジュールに用いられる太陽電池モジュール用表面側透明保護部材は、とくに制限はないが、太陽電池モジュールの最表層に位置するため、耐候性、撥水性、耐汚染性、機械強度をはじめとして、太陽電池モジュールの屋外暴露における長期信頼性を確保するための性能を有することが好ましい。また、太陽光を有効に活用するために、光学ロスの小さい、透明性の高いシートであることが好ましい。
太陽電池モジュールに用いられる太陽電池モジュール用裏面側保護部材は、とくに制限はないが、太陽電池モジュールの最表層に位置するため、上述の表面側透明保護部材と同様に、耐候性、機械強度などの諸特性を求められる。したがって、表面側透明保護部材と同様の材質で太陽電池モジュール用裏面側保護部材を構成してもよい。すなわち、表面側透明保護部材として用いられる上述の各種材料を、裏面側保護部材としても用いることができる。とくに、ポリエステル樹脂、およびガラスを好ましく用いることができる。また、裏面側保護部材は、太陽光の通過を前提としないため、表面側透明保護部材で求められる透明性は必ずしも要求されない。そこで、太陽電池モジュールの機械的強度を増すために、あるいは温度変化による歪み、反りを防止するために、補強板を張り付けてもよい。補強板は、例えば、鋼板、プラスチック板、FRP(ガラス繊維強化プラスチック)板などを好ましく使用することができる。
太陽電池モジュールに用いられる太陽電池素子は、半導体の光起電力効果を利用して発電できるものであれば、とくに制限はない。太陽電池素子は、例えば、シリコン(単結晶系、多結晶系、非結晶(アモルファス)系)太陽電池、化合物半導体(III-III族、II-VI族、その他)太陽電池、湿式太陽電池、有機半導体太陽電池などを用いることができる。これらの中では、発電性能とコストとのバランスなどの観点から、多結晶シリコン太陽電池が好ましい。
太陽電池モジュールに用いられる金属電極の構成および材料は、とくに限定されないが、具体的な例では、透明導電膜と金属膜の積層構造を有する。透明導電膜は、SnO2、ITO、ZnOなどからなる。金属膜は、銀、金、銅、錫、アルミニウム、カドミウム、亜鉛、水銀、クロム、モリブデン、タングステン、ニッケル、バナジウムなどの金属からなる。これらの金属膜は、単独で用いてもよいし、複合化された合金として用いてもよい。透明導電膜と金属膜とは、CVD、スパッタ、蒸着などの方法により形成される。
本実施形態の太陽電池モジュールの製造方法は、(i)表面側透明保護部材と、本実施形態の太陽電池封止材と、太陽電池素子(セル)と、太陽電池封止材と、裏面側保護部材とをこの順に積層して積層体を形成する工程と、(ii)得られた積層体を加圧および加熱して一体化する工程と、を含むことを特徴とする。
上記ゲル分率が上記下限値以上であると、太陽電池封止材の耐熱性が良好となり、例えば85℃×85%RHでの恒温恒湿試験、ブラックパネル温度83℃での高強度キセノン照射試験、-40℃~90℃でのヒートサイクル試験、耐熱試験での接着性の低下を抑制することができる。一方、ゲル分率が上記上限値以下であると、高い柔軟性を有する太陽電池封止材となり、-40℃~90℃でのヒートサイクル試験での温度追従性が向上するため、剥離の発生を防止することができる。
本実施形態の太陽電池モジュールは、生産性、発電効率、寿命などに優れている。このため、この様な太陽電池モジュールを用いた発電設備は、コスト、発電効率、寿命などに優れ、実用上高い価値を有する。上記の発電設備は、家屋の屋根に設置する、キャンプなどのアウトドア向けの移動電源として利用する、自動車バッテリーの補助電源として利用するなどの、屋外、屋内を問わず長期間の使用に好適である。
[エチレン単位およびα-オレフィン単位の含有割合]
試料0.35gをヘキサクロロブタジエン2.0mlに加熱溶解させて得られた溶液をグラスフィルター(G2)で濾過した後、重水素化ベンゼン0.5mlを加え、内径10mmのNMRチューブに装入した。日本電子社製のJNM GX-400型NMR測定装置を使用し、120℃で13C-NMR測定を行った。積算回数は8000回以上とした。得られた13C-NMRスペクトルより、共重合体中のエチレン単位の含有割合、およびα-オレフィン単位の含有割合を定量した。
ASTM D1238に準拠し、190℃、2.16kg荷重の条件にてエチレン・α-オレフィン共重合体のMFRを測定した。
ASTM D1505に準拠して、エチレン・α-オレフィン共重合体の密度を測定した。
エチレン・α-オレフィン共重合体を190℃、加熱4分、10MPaで加圧した後、10MPaで常温まで5分間加圧冷却して3mm厚のシートを得た。得られたシートを用いて、ASTM D2240に準拠してエチレン・α-オレフィン共重合体のショアA硬度を測定した。
エチレン・α-オレフィン共重合体約2gを石英製試料ボードに精秤し、アルゴン/酸素気流中で、燃焼炉設定温度900℃で燃焼分解した。発生したガスを吸収缶に吸収させ、純水で定容し、該溶液中のフッ素元素をイオンクロマトグラフ法にて定量した。
イオンクロマトグラフ:ICS-1600(Dionex社製)
カラム:IonPac AS22(Dionex社製)
エチレン・α-オレフィン共重合体を湿式分解した後、純水にて定容し、ICP発光分析装置(島津製作所社製、ICPS-8100)により、アルミニウムを定量し、アルミニウム元素の含有量を求めた。
得られたシートを10cm×10cmのサイズに裁断した後、150℃、真空3分、加圧15分でラミネート装置(NPC社製、LM-110X160S)でラミネートして測定用の架橋シートを作製した。作製した架橋シートの体積固有抵抗(Ω・cm)を、JIS K6911に準拠し、印加電圧500Vで測定した。なお、測定時、高温測定チャンバー「12708」(アドバンスト社製)を用いて温度100±2℃とし、微小電流計「R8340A」(アドバンスト社製)を使用した。
(合成例1A)
撹拌羽根を備えた内容積50Lの連続重合器の一つの供給口に、共触媒としてトリフェニルカルベニウム(テトラキスペンタフルオロフェニル)ボレートのトルエン溶液を0.05mmol/hr、主触媒として[ジメチル(t-ブチルアミド)(テトラメチル-η5-シクロペンタジエニル)シラン]チタンジクロライドのヘキサン溶液を0.012mmol/hr、トリイソブチルアルミニウムのヘキサン溶液を0.4mmol/hrの割合で供給し、触媒溶液と重合溶媒として用いる脱水精製したノルマルヘキサンの合計が20L/hrとなるように脱水精製したノルマルヘキサンを連続的に供給した。同時に重合器の別の供給口に、エチレンを3kg/hr、1-ブテンを4.2kg/hr、水素を120NL/hrの割合で連続供給し、重合温度90℃、全圧3MPaG、滞留時間1.0時間の条件下で連続溶液重合を行った。重合器で生成したエチレン・α-オレフィン共重合体のノルマルヘキサン/トルエン混合溶液は、重合器の底部に設けられた排出口を介して連続的に排出させ、エチレン・α-オレフィン共重合体のノルマルヘキサン/トルエン混合溶液が150~190℃となるように、ジャケット部が3~25kg/cm2スチームで加熱された連結パイプに導いた。なお、連結パイプに至る直前には、触媒失活剤であるメタノールが注入される供給口が付設されており、約0.75L/hrの速度でメタノールを注入してエチレン・α-オレフィン共重合体のノルマルヘキサン/トルエン混合溶液に合流させた。スチームジャケット付き連結パイプ内で約190℃に保温されたエチレン・α-オレフィン共重合体のノルマルヘキサン/トルエン混合溶液は、約4.3MPaGを維持するように、連結パイプ終端部に設けられた圧力制御バルブの開度の調整によって連続的にフラッシュ槽に送液された。なお、フラッシュ槽内への移送においては、フラッシュ槽内の圧力が約0.1MPaG、フラッシュ槽内の蒸気部の温度が約180℃を維持するように溶液温度と圧力調整バルブ開度設定が行われた。その後、ダイス温度を180℃に設定した単軸押出機を通し、水槽にてストランドを冷却し、ペレットカッターにてストランドを切断し、ペレットとしてエチレン・α-オレフィン共重合体を得た。収量は1.3kg/hrであった。物性を表1Aに示す。
主触媒としてビス(p-トリル)メチレン(シクロペンタジエニル)(1,1,4,4,7,7,10,10-オクタメチル-1,2,3,4,7,8,9,10-オクタヒドロジベンズ(b,h)-フルオレニル)ジルコニウムジクロリドのヘキサン溶液を0.003mmol/hr、共触媒としてのトリフェニルカルベニウム(テトラキスペンタフルオロフェニル)ボレートのトルエン溶液を0.03mmol/hr、トリイソブチルアルミニウムのヘキサン溶液を0.5mmol/hrの割合でそれぞれ供給したこと;1-オクテンを6.2kg/hrの割合で供給したこと;1-オクテンと触媒溶液と重合溶媒として用いる脱水精製したノルマルヘキサンの合計が20L/hrとなるように脱水精製したノルマルヘキサンを連続的に供給したこと;水素を10NL/hrの割合で供給したこと以外は、合成例1Aと同様にしてエチレン・α-オレフィン共重合体を得た。収量は3kg/hrであった。物性を表1Aに示す。
主触媒としての[ジメチル(t-ブチルアミド)(テトラメチル-η5-シクロペンタジエニル)シラン]チタンジクロライドのヘキサン溶液を0.011mmol/hr、共触媒としてのトリフェニルカルベニウム(テトラキスペンタフルオロフェニル)ボレートのトルエン溶液を0.11mmol/hrの割合でそれぞれ供給した以外は、前述の合成例1Aと同様にしてエチレン・α-オレフィン共重合体を得た。収量は1.3kg/hrであった。物性を表1Aに示す。
撹拌羽根を備えた内容積50Lの連続重合器の一つの供給口に、共触媒としてトリフェニルカルベニウム(テトラキスペンタフルオロフェニル)ボレートのトルエン溶液を0.05mmol/hr、主触媒として[ジメチル(t-ブチルアミド)(テトラメチル-η5-シクロペンタジエニル)シラン]チタンジクロライドのヘキサン溶液を0.012mmol/hr、トリイソブチルアルミニウムのヘキサン溶液を0.4mmol/hrの割合で供給し、触媒溶液と重合溶媒として用いる脱水精製したノルマルヘキサンの合計が20L/hrとなるように脱水精製したノルマルヘキサンを連続的に供給した。同時に重合器の別の供給口に、エチレンを3kg/hr、1-ブテンを4.2kg/hr、水素を120NL/hrの割合で連続供給し、重合温度90℃、全圧3MPaG、滞留時間1.0時間の条件下で連続溶液重合を行った。重合器で生成したエチレン・α-オレフィン共重合体のノルマルヘキサン/トルエン混合溶液は、重合器の底部に設けられた排出口を介して連続的に排出させ、さらにストックタンクにて脱圧後、エチレン・α-オレフィン共重合体のノルマルヘキサン/トルエン混合溶液を得た。
得られたエチレン・α-オレフィン共重合体のノルマルヘキサン/トルエン混合溶液1Lに対し、0.1Nの塩酸を5ml、蒸留水1Lを加え攪拌した。上記混合液を分液ロートにて水相を分離し、残存するエチレン・α-オレフィン共重合体のノルマルヘキサン/トルエン混合溶液に対し蒸留水1Lをさらに添加し、攪拌、水相分離を水相が中和されるまで繰り返し行った。得られたエチレン・α-オレフィン共重合体のノルマルヘキサン/トルエン混合溶液に対し、混合溶媒を攪拌しながらメタノール3Lを加え、析出したエチレン・α-オレフィン共重合体を採取し、130℃、10Torr減圧下で12時間乾燥し、エチレン・α-オレフィン共重合体を採取した。
上記で得られたエチレン・α-オレフィン共重合体を粉砕し、ダイス温度を180℃に設定した単軸押出機を通し、水槽にてストランドを冷却し、ペレットカッターにてストランドを切断し、ペレットとしてエチレン・α-オレフィン共重合体を得た。物性を表1Bに示す。
主触媒としてビス(p-トリル)メチレン(シクロペンタジエニル)(1,1,4,4,7,7,10,10-オクタメチル-1,2,3,4,7,8,9,10-オクタヒドロジベンズ(b,h)-フルオレニル)ジルコニウムジクロリドのヘキサン溶液を0.003mmol/hr、共触媒としてのトリフェニルカルベニウム(テトラキスペンタフルオロフェニル)ボレートのトルエン溶液を0.03mmol/hr、トリイソブチルアルミニウムのヘキサン溶液を0.5mmol/hrの割合でそれぞれ供給したこと;1-オクテンを6.2kg/hrの割合で供給したこと;1-オクテンと触媒溶液と重合溶媒として用いる脱水精製した混合イソパラフィン(ISOPAR E)の合計が20L/hrとなるように脱水精製した混合イソパラフィンを連続的に供給したこと;水素を10NL/hrの割合で供給したこと以外は、合成例1Bと同様にしてエチレン・α-オレフィン共重合体の混合イソパラフィン/トルエン混合溶液を得た。
得られたエチレン・α-オレフィン共重合体の混合イソパラフィン/トルエン混合溶液をロータリーエバポレーターにて110℃の条件下で蒸留し、エチレン・α-オレフィン共重合体を採取した。
ペレット化は、合成例1Bと同様に行った。
物性を表1Bに示す。
合成例2Bの重合溶媒をノルマルヘキサンとし、ロータリーエバポレーターの温度を60℃とした以外は、合成例2Bと同様にしてエチレン・α-オレフィン共重合体のペレットを得た。
物性を表1Bに示す。
(実施例1A)
合成例1Aのエチレン・α-オレフィン共重合体100重量部に対し、有機過酸化物として1分間半減期温度が166℃のt-ブチルパーオキシ-2-エチルヘキシルカーボネートを1.0重量部、シランカップリング剤として3-メタクリロキシプロピルトリメトキシシランを0.5重量部、架橋助剤としてトリアリルイソシアヌレートを1.2重量部、紫外線吸収剤として2-ヒドロキシ-4-ノルマル-オクチルオキシベンゾフェノンを0.4重量部、ヒンダードアミン系光安定剤としてビス(2,2,6,6-テトラメチル-4-ピペリジル)セバケートを0.2重量部、ヒンダードフェノール系安定剤としてオクタデシル-3-(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)プロピオネート0.05重量部、リン系安定剤としてトリス(2,4-ジ-tert-ブチルフェニル)ホスファイト0.1重量部を配合した。
表2Aに示す配合としたこと以外は、前述の実施例1Aと同様にしてエンボスシート(太陽電池封止材シート)を得た。得られたシートの空隙率は全て28%であった。得られたシートの各種評価結果を表2Aに示す。
表2Aに示す配合としたこと以外は、前述の実施例1Aと同様にしてエンボスシート(太陽電池封止材シート)を得た。得られたシートの空隙率は全て28%であった。得られたシートの各種評価結果を表2Aに示す。
表2Bに示す配合としたこと以外は、前述の実施例1Aと同様にしてエンボスシート(太陽電池封止材シート)を得た。得られたシートの空隙率は全て28%であった。得られたシートの各種評価結果を表2Bに示す。
表2Bに示す配合としたこと以外は、前述の実施例1Aと同様にしてエンボスシート(太陽電池封止材シート)を得た。得られたシートの空隙率は全て28%であった。得られたシートの各種評価結果を表2Bに示す。
表2Bに示す配合としたこと以外は、前述の実施例1Aと同様にしてエンボスシート(太陽電池封止材シート)を得た。得られたシートの空隙率は全て28%であった。得られたシートの各種評価結果を表2Bに示す。
[A1]
エチレン・α-オレフィン共重合体を含む太陽電池封止材であって、
燃焼法およびイオンクロマトグラフ法により定量される、上記エチレン・α-オレフィン共重合体中のフッ素元素の含有量が30ppm以下である、太陽電池封止材。
[A2]
上記エチレン・α-オレフィン共重合体が、以下の要件a1)~a4)を満たす[A1]に記載の太陽電池封止材。
a1)エチレンに由来する構成単位の含有割合が80~90mol%であり、炭素数3~20のα-オレフィンに由来する構成単位の含有割合が10~20mol%である。
a2)ASTM D1238に準拠し、190℃、2.16kg荷重の条件で測定されるMFRが10~50g/10分である。
a3)ASTM D1505に準拠して測定される密度が0.865~0.884g/cm3である。
a4)ASTM D2240に準拠して測定されるショアA硬度が60~85である。
[A3]
ASTM D1238に準拠し、190℃、2.16kg荷重の条件で測定される上記エチレン・α-オレフィン共重合体のMFRが、10~27g/10分である、[A1]に記載の太陽電池封止材。
[A4]
有機過酸化物をさらに含み、
上記有機過酸化物の1分間半減期温度が100~170℃であり、
当該太陽電池封止材中の上記有機過酸化物の含有量が、上記エチレン・α-オレフィン共重合体100重量部に対して0.1~3重量部である、[A1]に記載の太陽電池封止材。
[A5]
シランカップリング剤をさらに含み、
当該太陽電池封止材中の上記シランカップリング剤の含有量が、上記エチレン・α-オレフィン共重合体100重量部に対して0.1~5重量部である、[A1]に記載の太陽電池封止材。
[A6]
ヒンダードフェノール系安定剤をさらに含み、
当該太陽電池封止材中の上記ヒンダードフェノール系安定剤の含有量が、上記エチレン・α-オレフィン共重合体100重量部に対して0.005~0.1重量部である、[A1]に記載の太陽電池封止材。
[A7]
ヒンダードアミン系光安定剤をさらに含み、
当該太陽電池封止材中の上記ヒンダードアミン系光安定剤の含有量が、上記エチレン・α-オレフィン共重合体100重量部に対して0.01~2.0重量部である、[A1]に記載の太陽電池封止材。
[A8]
リン系安定剤をさらに含み、
当該太陽電池封止材中の上記リン系安定剤の含有量が、上記エチレン・α-オレフィン共重合体100重量部に対して0.005~0.5重量部である、[A1]に記載の太陽電池封止材。
[A9]
紫外線吸収剤をさらに含み、
当該太陽電池封止材中の上記紫外線吸収剤の含有量が、上記エチレン・α-オレフィン共重合体100重量部に対して0.005~5重量部である、[A1]に記載の太陽電池封止材。
[A10]
架橋助剤をさらに含み、
当該太陽電池封止材中の上記架橋助剤の含有量が、上記エチレン・α-オレフィン共重合体100重量部に対して0.05~5重量部である、[A1]に記載の太陽電池封止材。
[A11]
上記エチレン・α-オレフィン共重合体を溶融混錬後、シート状に押出成形して得られた、[A1]に記載の太陽電池封止材。
[A12]
シート状である、[A1]に記載の太陽電池封止材。
[A13]
表面側透明保護部材と、
裏面側保護部材と、
太陽電池素子と、
[A1]に記載の太陽電池封止材を架橋させて形成された、上記太陽電池素子を上記表面側透明保護部材と上記裏面側保護部材との間に封止する封止層と、
を備えた太陽電池モジュール。
[B1]
エチレン・α-オレフィン共重合体を含む太陽電池封止材であって、
燃焼法およびイオンクロマトグラフ法により定量される、上記エチレン・α-オレフィン共重合体中のフッ素元素の含有量が3.0ppm以下であり、
ICP発光分析により定量される、上記エチレン・α-オレフィン共重合体中のアルミニウム元素の含有量が20ppm以下である、太陽電池封止材。
[B2]
上記エチレン・α-オレフィン共重合体が、以下の要件a1)~a4)を満たす[B1]に記載の太陽電池封止材。
a1)エチレンに由来する構成単位の含有割合が80~90mol%であり、炭素数3~20のα-オレフィンに由来する構成単位の含有割合が10~20mol%である。
a2)ASTM D1238に準拠し、190℃、2.16kg荷重の条件で測定されるMFRが10~50g/10分である。
a3)ASTM D1505に準拠して測定される密度が0.865~0.884g/cm3である。
a4)ASTM D2240に準拠して測定されるショアA硬度が60~85である。
[B3]
ASTM D1238に準拠し、190℃、2.16kg荷重の条件で測定される上記エチレン・α-オレフィン共重合体のMFRが、10~27g/10分である、[B1]に記載の太陽電池封止材。
[B4]
有機過酸化物をさらに含み、
上記有機過酸化物の1分間半減期温度が100~170℃であり、
当該太陽電池封止材中の上記有機過酸化物の含有量が、上記エチレン・α-オレフィン共重合体100重量部に対して0.1~3重量部である、[B1]に記載の太陽電池封止材。
[B5]
シランカップリング剤をさらに含み、
当該太陽電池封止材中の上記シランカップリング剤の含有量が、上記エチレン・α-オレフィン共重合体100重量部に対して0.1~5重量部である、[B1]に記載の太陽電池封止材。
[B6]
ヒンダードフェノール系安定剤をさらに含み、
当該太陽電池封止材中の上記ヒンダードフェノール系安定剤の含有量が、上記エチレン・α-オレフィン共重合体100重量部に対して0.005~0.1重量部である、[B1]に記載の太陽電池封止材。
[B7]
ヒンダードアミン系光安定剤をさらに含み、
当該太陽電池封止材中の上記ヒンダードアミン系光安定剤の含有量が、上記エチレン・α-オレフィン共重合体100重量部に対して0.01~2.0重量部である、[B1]に記載の太陽電池封止材。
[B8]
リン系安定剤をさらに含み、
当該太陽電池封止材中の上記リン系安定剤の含有量が、上記エチレン・α-オレフィン共重合体100重量部に対して0.005~0.5重量部である、[B1]に記載の太陽電池封止材。
[B9]
紫外線吸収剤をさらに含み、
当該太陽電池封止材中の上記紫外線吸収剤の含有量が、上記エチレン・α-オレフィン共重合体100重量部に対して0.005~5重量部である、[B1]に記載の太陽電池封止材。
[B10]
架橋助剤をさらに含み、
当該太陽電池封止材中の上記架橋助剤の含有量が、上記エチレン・α-オレフィン共重合体100重量部に対して0.05~5重量部である、[B1]に記載の太陽電池封止材。
[B11]
上記エチレン・α-オレフィン共重合体を溶融混錬後、シート状に押出成形して得られた、[B1]に記載の太陽電池封止材。
[B12]
シート状である、[B1]に記載の太陽電池封止材。
[B13]
表面側透明保護部材と、
裏面側保護部材と、
太陽電池素子と、
[B1]に記載の太陽電池封止材を架橋させて形成された、上記太陽電池素子を上記表面側透明保護部材と上記裏面側保護部材との間に封止する封止層と、
を備えた太陽電池モジュール。
Claims (12)
- エチレン・α-オレフィン共重合体を含む太陽電池封止材であって、
燃焼法およびイオンクロマトグラフ法により定量される、前記エチレン・α-オレフィン共重合体中のフッ素元素の含有量が30ppm以下である、太陽電池封止材。 - 燃焼法およびイオンクロマトグラフ法により定量される、前記エチレン・α-オレフィン共重合体中の前記フッ素元素の含有量が3.0ppm以下であり、
ICP発光分析により定量される、前記エチレン・α-オレフィン共重合体中のアルミニウム元素の含有量が20ppm以下である、請求項1に記載の太陽電池封止材。 - 前記エチレン・α-オレフィン共重合体が、以下の要件a1)~a4)を満たす請求項1または2に記載の太陽電池封止材。
a1)エチレンに由来する構成単位の含有割合が80~90mol%であり、炭素数3~20のα-オレフィンに由来する構成単位の含有割合が10~20mol%である。
a2)ASTM D1238に準拠し、190℃、2.16kg荷重の条件で測定されるMFRが0.1~50g/10分である。
a3)ASTM D1505に準拠して測定される密度が0.865~0.884g/cm3である。
a4)ASTM D2240に準拠して測定されるショアA硬度が60~85である。 - ASTM D1238に準拠し、190℃、2.16kg荷重の条件で測定される前記エチレン・α-オレフィン共重合体のMFRが、10~50g/10分である、請求項3に記載の太陽電池封止材。
- ASTM D1238に準拠し、190℃、2.16kg荷重の条件で測定される前記エチレン・α-オレフィン共重合体のMFRが、0.1g/10分以上10g/10分未満である、請求項3に記載の太陽電池封止材。
- 有機過酸化物をさらに含み、
前記有機過酸化物の1分間半減期温度が100~170℃であり、
当該太陽電池封止材中の前記有機過酸化物の含有量が、前記エチレン・α-オレフィン共重合体100重量部に対して0.1~3重量部である、請求項1乃至5いずれか一項に記載の太陽電池封止材。 - シランカップリング剤をさらに含み、
当該太陽電池封止材中の前記シランカップリング剤の含有量が、前記エチレン・α-オレフィン共重合体100重量部に対して0.1~5重量部である、請求項1乃至6いずれか一項に記載の太陽電池封止材。 - ヒンダードフェノール系安定剤、ヒンダードアミン系光安定剤、リン系安定剤、紫外線吸収剤、架橋助剤からなる群から選ばれる添加剤を一種または二種以上さらに含む、請求項1乃至7いずれか一項に記載の太陽電池封止材。
- 前記エチレン・α-オレフィン共重合体を溶融混錬後、シート状に押出成形して得られた、請求項1乃至8いずれか一項に記載の太陽電池封止材。
- 前記エチレン・α-オレフィン共重合体を溶融混錬後、シート状にカレンダー成形して得られた、請求項1乃至9いずれか一項に記載の太陽電池封止材。
- シート状である、請求項1乃至10いずれか一項に記載の太陽電池封止材。
- 表面側透明保護部材と、
裏面側保護部材と、
太陽電池素子と、
請求項1乃至11いずれか一項に記載の太陽電池封止材を架橋させて形成された、前記太陽電池素子を前記表面側透明保護部材と前記裏面側保護部材との間に封止する封止層と、
を備えた太陽電池モジュール。
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JP2019527929A (ja) * | 2016-07-15 | 2019-10-03 | ボレアリス エージー | 熱可塑性のエンボス加工したフィルム |
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EP3157065B1 (en) * | 2015-10-12 | 2020-12-09 | LG Electronics Inc. | Apparatus and method for attaching interconnector of solar cell panel |
CA3003311C (en) * | 2015-11-04 | 2020-12-29 | Borealis Ag | A photovoltaic module |
US10026857B1 (en) * | 2016-11-23 | 2018-07-17 | Vanguard Space Technologies, Inc. | Assembly and mounting of solar cells on airfoils |
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Cited By (2)
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JP2019527929A (ja) * | 2016-07-15 | 2019-10-03 | ボレアリス エージー | 熱可塑性のエンボス加工したフィルム |
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EP2833415B1 (en) | 2018-05-02 |
SG11201406117PA (en) | 2014-11-27 |
JPWO2013145602A1 (ja) | 2015-12-10 |
TW201341414A (zh) | 2013-10-16 |
US9865752B2 (en) | 2018-01-09 |
EP2833415A4 (en) | 2015-08-12 |
JP5830600B2 (ja) | 2015-12-09 |
TWI606068B (zh) | 2017-11-21 |
KR101617573B1 (ko) | 2016-05-02 |
US20150075616A1 (en) | 2015-03-19 |
CN104247042B (zh) | 2016-07-06 |
KR20140135841A (ko) | 2014-11-26 |
CN104247042A (zh) | 2014-12-24 |
EP2833415A1 (en) | 2015-02-04 |
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