WO2013133147A1 - Appareil d'éclairage - Google Patents

Appareil d'éclairage Download PDF

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Publication number
WO2013133147A1
WO2013133147A1 PCT/JP2013/055622 JP2013055622W WO2013133147A1 WO 2013133147 A1 WO2013133147 A1 WO 2013133147A1 JP 2013055622 W JP2013055622 W JP 2013055622W WO 2013133147 A1 WO2013133147 A1 WO 2013133147A1
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WO
WIPO (PCT)
Prior art keywords
semiconductor light
light source
diffusion
lighting fixture
housing
Prior art date
Application number
PCT/JP2013/055622
Other languages
English (en)
Japanese (ja)
Inventor
草谷　雅弘
安男 中村
範彦 小林
Original Assignee
株式会社小糸製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社小糸製作所 filed Critical 株式会社小糸製作所
Priority to JP2014503810A priority Critical patent/JP6063926B2/ja
Publication of WO2013133147A1 publication Critical patent/WO2013133147A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F21S8/026—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters intended to be recessed in a ceiling or like overhead structure, e.g. suspended ceiling
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B9/00—Ceilings; Construction of ceilings, e.g. false ceilings; Ceiling construction with regard to insulation
    • E04B9/32—Translucent ceilings, i.e. permitting both the transmission and diffusion of light
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/02—Wall, ceiling, or floor bases; Fixing pendants or arms to the bases
    • F21V21/04—Recessed bases
    • F21V21/048—Mounting arrangements for fastening lighting devices to false ceiling frameworks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F21V23/023—Power supplies in a casing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a lighting fixture.
  • the lighting fixture of patent document 1 is made to radiate
  • This luminaire emits light over a large area by arranging a plurality of rectangular openings.
  • this lighting fixture controls the light emission direction by providing a louver or a condenser lens for each light source unit. For this reason, each light source unit appears to shine, and a dark portion is generated at the boundary of the opening of each light source unit.
  • light emitted from a semiconductor light emitting element such as a light emitting diode has high directivity, so that the light tends to concentrate locally, and light and darkness tends to occur on the light emitting surface.
  • a lighting fixture in which a diffusion cover is arranged in the emission direction of the semiconductor light emitting element to make the diffusion cover shine can be considered.
  • the distance between the semiconductor light emitting element and the diffusion cover is set large, the light from the semiconductor light emitting element spreads to some extent and then enters the diffusion cover, so that the diffusion cover can emit light uniformly.
  • the separation distance between the semiconductor light emitting element and the diffusion cover is set large, the thickness of the lighting fixture increases and the lighting fixture becomes large.
  • an object of the present invention is to provide a lighting apparatus that is thin and emits light uniformly.
  • a substrate A plurality of semiconductor light source units arranged in a grid pattern on the substrate; A light diffusion member provided apart from the semiconductor light source unit so as to cover the semiconductor light source unit,
  • a luminaire is provided that is configured to satisfy 1.0.
  • the thinning coefficient T is formed so as to satisfy 0.4 ⁇ T ⁇ 1.0. Therefore, even if a highly directional semiconductor light emitting element is used as a light source, the semiconductor It is possible to provide a lighting fixture that uniformly emits light while setting the distance between the light emitting element and the light diffusing member as small as possible to reduce the thickness of the lighting fixture.
  • a base member A diffusion cover attached to the base member and forming a housing space with the base member; A substrate provided in the housing space and attached to the base member; A plurality of semiconductor light sources provided in the accommodation space and arranged in a lattice pattern on the substrate,
  • the diffusion cover has a main diffusion portion provided so as to cover the semiconductor light source, and a sub-diffusion portion protruding from the main diffusion portion to the base member side, In a plan view of the substrate, a separation distance between the sub-diffusion unit and the semiconductor light source disposed at the outermost edge is set to be smaller than a separation distance between the semiconductor light sources, and light from the semiconductor light source is A luminaire is provided that is emitted from the sub-diffusion unit.
  • the separation distance between the sub-diffusion part and the semiconductor light source disposed at the outermost edge is set smaller than the separation distance between the semiconductor light sources. It is easy to make incident light incident on the sub-diffusion part. Therefore, light can be actively emitted from the sub-diffusion part also to the side of the lighting fixture. Thereby, the lighting fixture which a user feels bright can be provided.
  • a panel-type lighting fixture attached to a system ceiling partitioned in a lattice shape, A power supply unit capable of outputting power supplied from an external power source to the output line at a predetermined voltage or current; A mounting unit that is attached to a support member of the system ceiling, and a lamp unit that is driven by electric power input from an input line, The power supply unit is provided separately from the lamp unit, A lighting fixture is provided in which the output line and the input line are electrically connected by a connectable / detachable connector.
  • the panel-type lighting fixture of the present invention first, electrical work for connecting the power supply unit to the external power supply is performed, and then the lamp unit is attached to the support member of the system ceiling, and the connector is connected to connect the lamp unit and the power supply. Connect the unit. Therefore, when the lamp unit is attached to the system ceiling, since the connection between the power supply unit and the external power supply is completed, the installation of the lighting fixture on the system ceiling can be completed simply by connecting the connector. Therefore, a panel-type lighting fixture with a simple mounting operation and a high mounting efficiency is provided.
  • a panel-type lighting fixture supported by a support member of the system ceiling, A box-shaped metal housing with an open bottom surface; A box-shaped diffusion member having an upper surface opened and forming a housing space with the housing; A substrate provided in the housing space and attached to the housing; A semiconductor light source provided in the housing space, mounted on the substrate and emitting light to the diffusing member,
  • the housing includes a first flange portion projecting from an end portion of the side wall to the outer side of the housing space,
  • the diffusion member includes a second flange portion that protrudes from the end portion of the side wall to the outer side of the housing space and faces the first flange portion,
  • a lighting fixture is provided in which the first flange portion and the second flange portion are supported by a support member of a system ceiling in a state where the first flange portion and the second flange portion are overlapped.
  • the diffusing member is formed in a box shape with the upper surface opened, the ridge line between the lower surface and the side wall shines, and the entire lower surface of the luminaire can emit light. Therefore, it is possible to provide a panel-type lighting fixture having a good appearance in which the ceiling board and the lower surface of the lighting fixture can be seen integrally.
  • the luminaire according to the present invention it is possible to provide a luminaire that is thin and emits light uniformly even when a highly directional semiconductor light emitting element is employed as a light source.
  • FIG. 3 is a cross-sectional view taken along the line III-III in FIG. 1.
  • FIG. 5 is a cross-sectional view taken along line VV in FIG. 1.
  • FIG. 5 is a figure explaining a thinning coefficient.
  • FIG. 1 is a plan view of a panel-type lighting fixture 100 according to the present embodiment, in which a part of a diffusion cover 40 is cut away.
  • FIG. 2 is a side view of the lighting apparatus 100 shown in FIG.
  • the vertical direction means the X direction shown in FIG. 2
  • the horizontal direction means the Y direction shown in FIG.
  • the lighting fixture 100 is a flat rectangular parallelepiped panel type lighting fixture as shown in FIGS.
  • the system ceiling to which the luminaire 100 according to the present embodiment is attached is provided with a panel space partitioned by beams extending in a lattice pattern.
  • the lighting fixture 100 is fitted in this panel space.
  • the lighting fixture 100 of the present embodiment is a square shape with a vertical and horizontal dimension of 600 mm in a plan view of FIG. Is formed.
  • the luminaire 100 is supported by a plurality of fixtures called T-bars (support members) 200.
  • the T-bar 200 is attached so as to protrude downward from the beam on the system ceiling, and a support portion 201 that supports the lighting device 100 is provided at the tip thereof.
  • the lighting apparatus 100 includes a lamp unit 1 and a power supply unit 3 that is formed separately from the lamp unit 1 and connected via a power cable 2.
  • the power cable 2 extends from the upper surface of the lamp unit 1 to the outside.
  • the power cable 2 includes a lamp side cable (output line) 2a and a power source side cable (input line) 2b.
  • the power cable 2 is electrically connected to a power unit 3 connected to an external power source 4 via a connector 5.
  • the power supply unit 3 can output a predetermined voltage or current as an alternating current from the external power supply 4.
  • the lamp unit 1 is driven by electric power supplied from a power supply unit 3 via a power cable 2.
  • the connector 5 includes a lamp-side connector 5a provided at one end of the lamp-side cable 2a and a power-side connector 5b provided at one end of the power-side cable 2b.
  • the lamp unit 1 can be separated from the power supply unit 3 by separating the lamp side connector 5a and the power supply side connector 5b.
  • FIG. 3 is a cross-sectional view taken along the line III-III in FIG.
  • the lamp unit 1 includes a base plate (base member) 10, a circuit board (substrate) 20, semiconductor light source units 30 arranged in a grid on the circuit board 20, and a diffusion cover (light Diffusion member) 40.
  • This luminaire 100 is attached to the system ceiling with the diffusion cover 40 facing downward.
  • the base plate 10 is a single plate member made of metal that constitutes the upper surface of the lamp unit 1.
  • the base plate 10 is provided with a through hole, and the power cable 2 connected to the power source is inserted into the through hole.
  • the circuit board 20 can be constituted by a printed board or the like. Printed wiring is formed on the circuit board 20 to supply power from the power source to the semiconductor light source unit 30 mounted on the circuit board 20.
  • 25 semiconductor light source units 30 are arranged in a lattice pattern on one circuit board 20, and nine circuit boards 20 are arranged on one base plate 10. It is attached.
  • FIG. 4 is a schematic diagram showing the wiring of the lighting apparatus 100.
  • the lighting fixture 100 is supplied with power from the external power supply 4 to the power supply unit 3. Further, the power supply unit 3 is connected to the lamp unit 1 via the connector 5.
  • Nine circuit boards 20 are connected to the power supply unit 3.
  • the nine circuit boards 20 are connected in series with three circuit boards 20, and three sets of these three circuit boards 20 connected in series are connected in parallel. Thereby, an alternating current from the external power supply 4 is supplied to the power supply unit 3, the alternating current is converted into a direct current by the power supply unit 3, and the direct current is supplied to each LED element 31 on the circuit board 20.
  • the circuit board 20 is attached to the base plate 10 by fasteners 50.
  • the circuit board 20 is in surface contact with the base plate 10 so that heat from the semiconductor light source unit 30 is efficiently released to the base plate 10.
  • the heat released to the base plate 10 is radiated from the upper surface of the base plate 10 to the atmosphere.
  • the diffusion cover 40 is a resin molded product integrally formed of milky white acrylic resin or the like.
  • the diffusion cover 40 has a box shape opened upward.
  • the diffusion cover 40 is attached to the base plate 10 with the opening surface facing the base plate 10.
  • a lamp chamber (accommodating space) S is formed between the diffusion cover 40 and the base plate 10.
  • a circuit board 20 and a semiconductor light source unit 30 are accommodated in the lamp chamber S.
  • the side wall of the diffusion cover 40 has a shape in which the central portion of the side wall is slightly curved outward from the corner portion in plan view.
  • the diffusion cover 40 is provided so as to cover the semiconductor light source unit 30 and be separated from the semiconductor light source unit 30.
  • the diffusion cover 40 is provided at a position facing the circuit board 20 and has a main light emitting surface (main diffusion portion) 41 constituting the lower surface of the lamp unit 1, and a side surface protruding from the periphery of the main light emitting surface 41 toward the base plate 10 ( Sub-diffusion part) 42.
  • the side surface 42 is formed thinner than the thickness of the main light emitting surface 41.
  • the angle ⁇ formed by the main light emitting surface 41 and the side surface 42 is set to 90 ° or more.
  • a part of the side surface 42 of the diffusion cover 40 is provided with a protruding portion 47 in which a part on the base plate 10 side protrudes outside the lamp chamber S from the main light emitting surface 41 side.
  • the lower surface of the protruding portion 47 is a stepped portion (attachment portion) 43.
  • FIG. 5 is a cross-sectional view taken along line VV in FIG. As shown in FIG. 5, at the portion where the protrusion 47 of the diffusion cover 40 is not formed, the upper end 45 of the diffusion cover 40 extends outward in parallel with the base plate 10.
  • the diffusion cover 40 is fixed to the base plate 10 by sandwiching the base plate 10 and the end portion 45 of the diffusion cover 40 with the clip 60.
  • an LED element (semiconductor light source) 31 arranged in a lattice shape and a lens (lens member) 32 formed so as to cover the LED element 31 are provided on the circuit board 20.
  • a semiconductor light source unit 30 is mounted.
  • the LED element 31 that emits white light having a color similar to that of a conventional fluorescent lamp is employed.
  • an LD (Laser Diode) element may be employed instead of the LED (Light Emitting Diode) element.
  • the lens 32 covering the LED element 31 refracts the light from the LED element 31 and emits light over a wide range. More specifically, the light refracted by the lens 32 enters the region 48 of the diffusion cover 40 that faces the LED element 31 adjacent to the LED element 31 from which the light is emitted and is positioned on the optical axis Ax. Thus, the lens 32 is formed. Thereby, the light from the LED element 31 enters the main light emitting surface 41 of the diffusion cover 40 in a spread state, and the main light emitting surface 41 emits light uniformly. This will be described in detail below.
  • FIG. 6 is a diagram similar to FIG. 5 and is a diagram for explaining the thinning coefficient T.
  • the separation distance d is set to 40 [mm]
  • the separation distance h is set to 20 [mm]
  • the thinning coefficient T is set to 0.5.
  • the diffusion cover 40 is separated from the semiconductor light source unit 30, the light emitted from the semiconductor light source unit 30 is diffused in a spread state. Incident on the cover 40. Therefore, the light and darkness of the light by the semiconductor light source unit 30 hardly occurs in the diffusion cover 40.
  • the lighting fixture 100 which concerns on this embodiment can be made into a thin shape, making a main light emission surface emit light uniformly.
  • the state where the thinning coefficient T is large is a case where the luminaire 100 is large in the left-right dimension, the separation distance d of the semiconductor light source unit 30 is wide, or the diffusion cover 40 is low and the separation distance h is small. That is, when the thinning coefficient T is large, the lighting fixture 100 becomes flat, and the lighting fixture 100 can be thinned. Instead, since the separation distance d of the semiconductor light source unit 30 is wide, a region where the light from the semiconductor light source unit 30 does not enter is easily formed on the main light emitting surface 41 of the diffusion cover 40, and the main light emitting surface 41 emits light uniformly. It is difficult.
  • the separation distance h is small, it is easy to reach the main light emitting surface 41 before the light from the semiconductor light source unit 30 spreads, and it is difficult to cause the main light emitting surface 41 to emit light uniformly. That is, it is difficult to make the main light emitting surface 41 emit light uniformly as the thinning coefficient T increases.
  • the present inventors have examined lighting devices 100 having various shapes using the thinning factor T.
  • the thinning factor T is set to 0.4 or more and 1.0 or less, the lighting device 100 is mainly thinned. It has been found that the light emitting surface 41 can emit light uniformly.
  • the thinning coefficient T is set to be smaller than 0.4, even if the shape of the lens 32 is devised, the light of the LED element 31 is refracted so as to enter the region 48 facing the adjacent LED element 31. Is difficult.
  • region 48 which opposes the adjacent LED element 31 among the main light emission surfaces 41 the area
  • the separation distance d is decreased in order to increase the thinning coefficient T
  • the number of LED elements 31 required to cause the entire main light emitting surface 41 of the diffusion cover 40 to emit light increases. Therefore, since the number of the LED elements 31 mounted on one lighting fixture 100 increases, if the thinning coefficient T is increased more than necessary, the cost of the lighting fixture 100 increases. Therefore, the present inventors have found that even when the thinning coefficient T is larger than 1.0, the luminance uniformity of the main light emitting surface 41 does not change greatly. For this reason, in order to make the lighting fixture 100 thinner, the thinning factor T is set to 1 or less.
  • the height dimension of the lighting fixture 100 is set to the height of the T bar 200 in order to fit the lighting fixture 100 in the space between the system ceiling and the T bar 200. It is preferable to make it smaller than the size.
  • the vertical and horizontal sizes of the lighting fixture 100 are set so as to fit in the grid-like panel space of the system ceiling without any gap, and the thinning factor T is set larger than 1, the height dimension of the lighting fixture 100 is There is a concern that the height dimension of the T-bar 200 may be larger. For this reason, when using the lighting fixture 100 for a system ceiling especially, it is preferable to make the thinning coefficient T into 1.0 or less.
  • the main light emitting surface 41 is uniformly illuminated with as few semiconductor light source units 30 as possible, and the lighting apparatus 100 that is as thin as possible is provided. Can do.
  • the separation interval d of the semiconductor light source unit 30 is 30 mm ⁇ d ⁇ 90 mm. If the separation distance d is shorter than 30 mm, the number of the semiconductor light source units 30 required for configuring the large luminaire 100 for a system ceiling or the like increases, and the cost increases. In addition, when the separation distance d is longer than 90 mm, even if the thinning factor T is within a predetermined range, the thickness of the lighting fixture 100 may be increased and may not be attached to the system ceiling.
  • the separation distance h from the semiconductor light source unit 30 to the diffusion cover 40 is preferably 20 mm ⁇ h ⁇ 50 mm. If the separation distance h is shorter than 20 mm, the light from the LED element 31 reaches the main light emitting surface 41 of the diffusion cover 40 before the light is diffused, and the main light emitting surface 41 may be bright and dark. In addition, if the separation distance h is longer than 50 mm, it may be larger than the height dimension of the T-bar 200 and cannot be attached to the system ceiling.
  • each semiconductor light source unit 30 is separated from the LED element 31 a located on the outermost edge in a plan view and the side surface 42. It arrange
  • FIG. As described above, the distance B between the LED elements 31 is set so that the light emitted from the LED elements 31 enters the region 48 located on the optical axis Ax of the adjacent LED elements 31. Therefore, the light emitted from the LED element 31 a located at the outermost edge surely enters the side surface 42.
  • the distance A between the LED element 31a located at the outermost edge and the side surface 42 is larger than the distance B between the LED elements 31, almost all of the light from the LED element 31a located at the outermost edge is mainly used. The light is incident on the light emitting surface 41 and is not incident on the side surface 42.
  • the lighting fixture 100 According to the lighting fixture 100 according to the present embodiment configured as described above, light can be actively emitted from the side surface 42 located on the side of the lighting fixture 100. Thereby, it is possible to make light incident on the user not only from above but also from the side. For this reason, while being able to illuminate a user's hand reliably and a ceiling surface and a wall, the lighting fixture 100 which a user feels bright can be provided.
  • light from the LED element 31b and a total of nine LED elements 31b surrounding the LED element 31b is incident on the region of the main light emitting surface 41 facing the LED element 31b that is not located at the outermost edge.
  • light from the LED element 31a located at the outermost edge and a total of three LED elements 31a on both sides thereof enters the region 42a where the side surface 42 is present. That is, the amount of light incident on the side surface 42 is smaller than the amount of light incident on the main light emitting surface 41.
  • the thickness of the side surface 42 is formed thinner than the thickness of the main light emitting surface 41, and the light transmittance of the side surface 42 is larger than the light transmittance of the main light emitting surface 41. It is set high. For this reason, light can be efficiently emitted from the side surface 42 to the outside, and the amount of light that goes around to the side can be increased.
  • the angle formed between the main light emitting surface 41 and the side surface 42 of the diffusion cover 40 is 90 ° or more. Thereby, the dimension of the left-right direction of the lighting fixture 100 is made equal or small toward the main light emission surface 41 side from the baseplate 10 side.
  • the lamp unit 1 is attached to the T-bar 200 by lowering the lamp unit 1 from above into a space surrounded by a plurality of T-bars 200 and bringing the stepped portion 43 of the lamp unit 1 into contact with the support portion 201 of the T-bar 200. To do. Since the shape of the lamp unit 1 is reduced downward, the lamp unit 1 can be easily lowered from above into a space surrounded by the plurality of T bars 200, and attachment to the T bar 200 is facilitated.
  • the diffusion cover 40 is formed by integral molding of the resin, it is easy to remove the mold that forms the inner surface 40b of the diffusion cover 40 from the opening on the upper surface that is wide open, and from the mold of the molded diffusion cover It is easy to take out.
  • the semiconductor light source unit 30 is provided up to the vicinity of the side surface 42 of the diffusion cover 40, the entire light including the edge of the main light emitting surface 41 emits light uniformly. Further, since the size of the diffusion cover 40 is set so as to be fitted in the panel space of the system ceiling without any gap, it seems that the entire lower surface of the panel space emits light. Therefore, by setting the length from the stepped portion 43 of the lighting fixture 100 to the main light emitting surface 41 so that the ceiling board of the system ceiling and the main light emitting surface 41 of the lighting fixture 100 are continuous, a part of the flat ceiling is formed. It can appear as if it is emitting light. Thereby, the aesthetics of the whole system ceiling can be improved.
  • the outer surface 40a of the diffusion cover 40 may be a satin surface on which minute irregularities having a surface roughness of about several ⁇ m are formed.
  • the light from the semiconductor light source unit 30 can be emitted to the outside while diffusing the light from the outer surface 40a of the diffusion cover 40, and reflection on a peripheral object can be prevented.
  • this makes it possible to share the texture with the ceiling board of the system ceiling. For this reason, when the lighting fixture 100 is turned off, the ceiling board and the lighting fixture 100 appear to have a sense of unity, and the aesthetics of the entire system ceiling can be enhanced.
  • the inner surface 40b of the diffusion cover 40 may be a glossy surface with a smooth surface. Accordingly, light having a large incident angle of the diffusion cover 40 is positively reflected by the inner surface 40b, and the reflected light is reflected by the surface of the circuit board 20 or the like, so that it can be incident on the diffusion cover 40 again.
  • the light from the semiconductor light source unit 30 By using the light from the semiconductor light source unit 30 to be emitted to the outside as much as possible, the light use efficiency of the lighting fixture 100 can be improved.
  • 25 semiconductor light source units 30 are arranged in a grid pattern on one circuit board 20, and nine circuit boards 20 are attached to the base plate 10. ing.
  • a lighting fixture is configured with a single circuit board, if one semiconductor light source unit fails, it is necessary to replace the entire circuit board on which all the semiconductor light source units are mounted. .
  • the circuit board 20 is divided into a plurality of parts, only the circuit board 20 on which the failed semiconductor light source unit 30 is mounted needs to be replaced. Therefore, according to the lighting fixture 100 which concerns on this embodiment, a maintenance cost can be reduced.
  • the lighting fixture 100 comprised as mentioned above is attached to a system ceiling as follows. First, the lamp side connector 5a is separated from the power source side connector 5b, and the lamp unit 1 and the power source unit 3 are separated. The separated power supply unit 3 is installed on the system ceiling.
  • the power supply unit 3 may be attached to the back of the ceiling, or may be attached to a beam or a T-bar 200.
  • the external power supply 4 and the power supply unit 3 are electrically connected.
  • a specialist in electric construction works to handle the cable 4 a that is supplied with relatively high output power extending from the external power supply 4.
  • the lamp unit 1 separated from the power supply unit 3 is attached to the T bar 200. Specifically, the lamp unit 1 is lowered from above the T bar 200 toward the support portion 201 of the T bar 200, and the stepped portion 43 provided on the side surface 42 of the diffusion cover 40 is placed on the support portion 201. Next, the lamp-side connector 5a and the power supply-side connector 5b are connected, the lamp unit 1 and the power supply unit 3 are electrically connected, and the attachment of the lighting fixture 100 to the system ceiling is completed.
  • the attachment work of the lamp unit 1 to the T-bar 200 and the connection of the connector 5 do not require handling of the cable 4a to which the high output power of the external power supply 4 is supplied. For this reason, since the construction by a specialist in electrical work is not necessary, a trader who handles normal interior work can construct it. Therefore, at the time of interior construction for attaching a ceiling panel or the like to the system ceiling, the interior construction contractor can attach the lamp unit 1 to the system ceiling.
  • the lighting unit has a built-in power supply unit as in the past, and when the cable extending from the external power source is pulled into the lighting fixture and connected, the lighting fixture and the external power source are connected to the system ceiling. Need to be connected. In this case, it was necessary to install an illuminating device on the ceiling of the system, and then an electrical contractor entered the narrow ceiling space to perform the electrical work, resulting in poor work efficiency. In addition, since the electrical work was performed after the lighting fixture was installed, it was difficult to match the schedule with the usual ceiling work in which the ceiling panel was installed after wiring the ceiling.
  • the work of attaching the power supply unit 3 to the system ceiling and the work of attaching the lamp unit 1 to the system ceiling are separated. Therefore, the operation of attaching the power supply unit 3 can be performed before attaching the lamp unit 1 to the system ceiling. As a result, the electrical work can be performed using a wide work space in which the lamp unit 1 is not attached, so that work efficiency is good.
  • the lighting fixture 100 can be installed on the system ceiling simply by connecting the connector 5. Can be completed.
  • a contractor of the interior work can attach the lamp unit 1 to the system ceiling in accordance with the work of attaching the ceiling panel or the like, for example.
  • the attachment of the power supply unit 3 and the connection with the external power supply 4 can be performed together when performing electrical work on the back of the ceiling such as wiring of an air conditioning facility or LAN wiring.
  • the installation work of the lamp unit 1 can be performed simultaneously with the installation work of the ceiling panel. That is, since it is not necessary to perform the installation work of the lighting fixture 100 and the installation work of the ceiling panel separately, the installation work of the lighting fixture 100 can be easily matched with the schedule of other ceiling constructions, and the construction period can be shortened.
  • the side wall housing 10A of the diffusion cover 40 of the lamp unit 1 has a curved shape so that the center portion of the side surface protrudes outward from the corner portion in plan view. Therefore, even when the rectangular panel space surrounded by the T-bar 200 is distorted due to an earthquake or the like, stress is not concentrated on the corners of the lamp unit 1, and the lighting apparatus 100 can be prevented from being damaged. Even if the lamp unit 1 is displaced from a predetermined position in the panel space, at least a part of the lamp unit 1 always contacts the T bar 200, so that the T bar 200 can continue to support the lamp unit 1.
  • FIG. 7 is a partial cross-sectional view of the lamp unit 1A of the lighting fixture 100A according to the second embodiment of the present invention.
  • the housing 10A is a metal member that constitutes the upper surface of the lighting fixture 100A.
  • the housing 10A is a box-shaped member having an open bottom surface.
  • the housing 10 ⁇ / b> A has a bottom plate (support plate portion) 11 and side walls (side wall portions) 12.
  • the side wall 12 is bent from the bottom plate 11 so as to extend to the diffusion cover 40 side.
  • the side wall 12 extends from the bottom plate 11 to at least the same height as the lens 32.
  • the circuit board 20 on which the semiconductor light source unit 30 is mounted is accommodated in the inner space S1 of the housing 10A.
  • the portion near the side of the LED element 31a having a short distance from the outermost LED element 31a is covered with the side wall 12 of the light-shielding housing 10A, not the side surface 42 of the diffusion cover 40. .
  • the side surface 42 is disposed in a region having a certain distance from the outermost LED element 31a, the light spread from the LED element 31a is incident on the side surface 42.
  • the side surface 42 emits light uniformly, and it is possible to provide the lighting apparatus 100A with a good appearance from the side.
  • the side wall 12 located in the vicinity of the right side of the outermost LED element 31a with a reflecting surface, the light of the outermost LED element 31a can be reflected to the main light emitting surface 41 of the diffusion cover 40. Thereby, the utilization efficiency of the light of 100 A of lighting fixtures can be improved.
  • the bottom plate 11 of the housing 10A is formed with a convex portion 13 protruding toward the diffusion cover 40, and the convex portion 13 is provided with a locking hole 15.
  • the circuit board 20 is also provided with a through hole 21. The circuit board 20 is fixed to the housing 10A by inserting the rivets 51 through the locking holes 15 of the housing 10A and the through holes 21 of the circuit board 20. Thereby, the circuit board 20 is being fixed to the housing 10A in the state which contacted the convex part 13 of 10A of housings.
  • a space S2 is provided between the circuit board 20 and the bottom plate 11 of the housing 10A by the convex portion 13 of the housing 10A. Therefore, the electrical wiring 33 extending from the semiconductor light source unit 30 of the circuit board 20 is placed in this space S2. Thereby, the electrical wiring 33 extended from the semiconductor light source unit 30 can be easily taken out to the housing 10A side.
  • a cover side flange portion (second flange portion) 46 that protrudes outward from the accommodation space S is provided at the upper end of the side surface 42 of the diffusion cover 40. Further, a housing-side flange portion (first flange portion) 14 projecting outward from the housing space S is also provided at the lower end of the side wall 12 of the housing 10A so as to face the cover-side flange portion 46. . In a state where the cover side flange portion 46 and the housing side flange portion 14 are overlapped, the cover side flange portion 46 and the housing side flange portion 14 are supported by the support portion 201 of the T-bar 200.
  • the housing side flange portion 14 is caulked to the cover side flange portion 46 and is bent along the outline shape of the cover side flange portion 46.
  • the diffusion cover 40 is caulked and fixed to the housing 10A.
  • the thickness of the diffusion cover 40 (the thickness of the outer peripheral edge) is preferably 2 mm or more.
  • the diffusion cover 40 is formed in a box shape, the ridge line 44 corresponding to the boundary between the main light emitting surface 41 and the side surface 42 also emits light. be able to. Thereby, it seems that the whole lower surface of the lamp unit 1A emits light.
  • panel-type lighting fixtures have a design requirement to show the ceiling board and the light-emitting surface of the lighting fixture as one body.
  • the outer periphery of the lower surface of the diffusion cover is not covered with a frame or the like, and the outer periphery of the lower surface of the diffusion cover 40, in particular, the ridge line 44 is exposed to the outside. For this reason, the whole lower surface of 100 A of lighting fixtures can be light-emitted, and a lighting fixture with high designability can be provided.
  • the housing side flange portion 14 is bent and the strength is improved. Therefore, the lighting fixture 100A is supported by contacting the supporting portion 201 of the T-bar 200 at a portion where the strength of the lighting fixture 100A is high. For this reason, even when vibration is applied to the system ceiling due to an earthquake or the like, the lighting apparatus 100A can be reliably supported.
  • a through electrode 16 penetrating from the mounting surface 20a on which the LED element of the circuit board 20 is mounted to the back surface 20b may be provided.
  • a heat radiation film 17 that conducts heat from the through electrode 16 and can radiate heat from the front surface may be provided on the back surface of the circuit board 20.
  • the heat generated in the LED element can be guided to the back surface 20 b side, and this heat can be efficiently radiated from the heat radiation film 17.
  • a heat sink such as a heat radiating fin for radiating the heat generated in the LED element 31. Therefore, the cooling property of the LED element 31 is high, and a small lighting fixture 100A can be provided.
  • a metal film such as a copper or aluminum film can be used. Further, the heat dissipation film may be used as wiring on the back surface 20b side of the circuit board 20.
  • the lighting device for the system ceiling has been described as an example.
  • the present invention can be applied to a surface-emitting type and thin lighting device, for example, a living room.
  • ADVANTAGE OF THE INVENTION is a lighting fixture by which the semiconductor light emitting element with high directivity was employ

Abstract

L'invention porte sur un appareil d'éclairage, lequel appareil est mince et émet de la lumière de façon uniforme. Cet appareil d'éclairage comporte : un substrat (20) ; une pluralité d'unités de source de lumière à semi-conducteurs (30), qui sont disposées sous la forme d'un réseau sur le substrat (20) ; et un élément de diffusion de la lumière (40), qui est disposé en étant espacé vis-à-vis de l'unité de source de lumière à semi-conducteurs (30). L'appareil d'éclairage est formé de telle sorte qu'un coefficient d'amincissement T = h/d satisfait à la formule 0,4 ≤ T ≤ 1,0, les intervalles auxquels les unités de source de lumière à semi-conducteurs (30) sont disposées étant représentés par d [mm], et la distance entre les unités de source de lumière à semi-conducteurs (30) et l'élément de diffusion de la lumière (40) étant représentée par h [mm].
PCT/JP2013/055622 2012-03-09 2013-03-01 Appareil d'éclairage WO2013133147A1 (fr)

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JP2012-053364 2012-03-09
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JP2012053356 2012-03-09
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JP2015185216A (ja) * 2014-03-20 2015-10-22 三菱電機株式会社 照明器具
JP2015228320A (ja) * 2014-05-30 2015-12-17 パナソニックＩｐマネジメント株式会社 照明装置
JP2017084727A (ja) * 2015-10-30 2017-05-18 日亜化学工業株式会社 照明モジュールおよび照明装置
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JP2017157533A (ja) * 2016-03-05 2017-09-07 アイリスオーヤマ株式会社 照明装置
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JP2018078113A (ja) * 2017-12-22 2018-05-17 東芝ライテック株式会社 照明器具
JP2019145522A (ja) * 2017-12-22 2019-08-29 東芝ライテック株式会社 照明器具
WO2021210226A1 (fr) * 2020-04-13 2021-10-21 株式会社島津製作所 Dispositif de source de lumière, projecteur, dispositif d'usinage, unité de source de lumière et procédé de réglage de dispositif de source de lumière
EP4163535A1 (fr) * 2021-10-08 2023-04-12 J.M.B.C. Dispositif d'éclairage à effet décoratif comprenant une dalle lumineuse et un élément décoratif amovible
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JP2015149133A (ja) * 2014-02-05 2015-08-20 パナソニックＩｐマネジメント株式会社 照明装置
JP2015185216A (ja) * 2014-03-20 2015-10-22 三菱電機株式会社 照明器具
JP2015228320A (ja) * 2014-05-30 2015-12-17 パナソニックＩｐマネジメント株式会社 照明装置
JP2017084727A (ja) * 2015-10-30 2017-05-18 日亜化学工業株式会社 照明モジュールおよび照明装置
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US10451225B2 (en) 2015-10-30 2019-10-22 Nichia Corporation Lighting module and lighting apparatus
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WO2017154314A1 (fr) * 2016-03-05 2017-09-14 アイリスオーヤマ株式会社 Dispositif d'éclairage
CN108779900A (zh) * 2016-03-05 2018-11-09 爱丽思欧雅玛株式会社 照明装置
JP2017157533A (ja) * 2016-03-05 2017-09-07 アイリスオーヤマ株式会社 照明装置
CN108779900B (zh) * 2016-03-05 2021-11-05 爱丽思欧雅玛株式会社 照明装置
JP2018078113A (ja) * 2017-12-22 2018-05-17 東芝ライテック株式会社 照明器具
JP2019145522A (ja) * 2017-12-22 2019-08-29 東芝ライテック株式会社 照明器具
JP7390820B2 (ja) 2019-08-08 2023-12-04 三菱電機株式会社 照明器具
WO2021210226A1 (fr) * 2020-04-13 2021-10-21 株式会社島津製作所 Dispositif de source de lumière, projecteur, dispositif d'usinage, unité de source de lumière et procédé de réglage de dispositif de source de lumière
US11835205B2 (en) 2020-04-13 2023-12-05 Shimadzu Corporation Light source device, projector, machining device, light source unit, and light source device adjusting method
EP4163535A1 (fr) * 2021-10-08 2023-04-12 J.M.B.C. Dispositif d'éclairage à effet décoratif comprenant une dalle lumineuse et un élément décoratif amovible
FR3128005A1 (fr) * 2021-10-08 2023-04-14 J.M.B.C. Dispositif d’éclairage à effet décoratif comprenant une dalle lumineuse et un élément décoratif amovible

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