WO2013133147A1 - Illuminating apparatus - Google Patents

Illuminating apparatus Download PDF

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Publication number
WO2013133147A1
WO2013133147A1 PCT/JP2013/055622 JP2013055622W WO2013133147A1 WO 2013133147 A1 WO2013133147 A1 WO 2013133147A1 JP 2013055622 W JP2013055622 W JP 2013055622W WO 2013133147 A1 WO2013133147 A1 WO 2013133147A1
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WO
WIPO (PCT)
Prior art keywords
semiconductor light
light source
diffusion
lighting fixture
housing
Prior art date
Application number
PCT/JP2013/055622
Other languages
French (fr)
Japanese (ja)
Inventor
草谷 雅弘
安男 中村
範彦 小林
Original Assignee
株式会社小糸製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社小糸製作所 filed Critical 株式会社小糸製作所
Priority to JP2014503810A priority Critical patent/JP6063926B2/en
Publication of WO2013133147A1 publication Critical patent/WO2013133147A1/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • F21S8/02Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F21S8/026Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters intended to be recessed in a ceiling or like overhead structure, e.g. suspended ceiling
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04BGENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B9/00Ceilings; Construction of ceilings, e.g. false ceilings; Ceiling construction with regard to insulation
    • E04B9/32Translucent ceilings, i.e. permitting both the transmission and diffusion of light
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/02Globes; Bowls; Cover glasses characterised by the shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/02Wall, ceiling, or floor bases; Fixing pendants or arms to the bases
    • F21V21/04Recessed bases
    • F21V21/048Mounting arrangements for fastening lighting devices to false ceiling frameworks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F21V23/023Power supplies in a casing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the present invention relates to a lighting fixture.
  • the lighting fixture of patent document 1 is made to radiate
  • This luminaire emits light over a large area by arranging a plurality of rectangular openings.
  • this lighting fixture controls the light emission direction by providing a louver or a condenser lens for each light source unit. For this reason, each light source unit appears to shine, and a dark portion is generated at the boundary of the opening of each light source unit.
  • light emitted from a semiconductor light emitting element such as a light emitting diode has high directivity, so that the light tends to concentrate locally, and light and darkness tends to occur on the light emitting surface.
  • a lighting fixture in which a diffusion cover is arranged in the emission direction of the semiconductor light emitting element to make the diffusion cover shine can be considered.
  • the distance between the semiconductor light emitting element and the diffusion cover is set large, the light from the semiconductor light emitting element spreads to some extent and then enters the diffusion cover, so that the diffusion cover can emit light uniformly.
  • the separation distance between the semiconductor light emitting element and the diffusion cover is set large, the thickness of the lighting fixture increases and the lighting fixture becomes large.
  • an object of the present invention is to provide a lighting apparatus that is thin and emits light uniformly.
  • a substrate A plurality of semiconductor light source units arranged in a grid pattern on the substrate; A light diffusion member provided apart from the semiconductor light source unit so as to cover the semiconductor light source unit,
  • a luminaire is provided that is configured to satisfy 1.0.
  • the thinning coefficient T is formed so as to satisfy 0.4 ⁇ T ⁇ 1.0. Therefore, even if a highly directional semiconductor light emitting element is used as a light source, the semiconductor It is possible to provide a lighting fixture that uniformly emits light while setting the distance between the light emitting element and the light diffusing member as small as possible to reduce the thickness of the lighting fixture.
  • a base member A diffusion cover attached to the base member and forming a housing space with the base member; A substrate provided in the housing space and attached to the base member; A plurality of semiconductor light sources provided in the accommodation space and arranged in a lattice pattern on the substrate,
  • the diffusion cover has a main diffusion portion provided so as to cover the semiconductor light source, and a sub-diffusion portion protruding from the main diffusion portion to the base member side, In a plan view of the substrate, a separation distance between the sub-diffusion unit and the semiconductor light source disposed at the outermost edge is set to be smaller than a separation distance between the semiconductor light sources, and light from the semiconductor light source is A luminaire is provided that is emitted from the sub-diffusion unit.
  • the separation distance between the sub-diffusion part and the semiconductor light source disposed at the outermost edge is set smaller than the separation distance between the semiconductor light sources. It is easy to make incident light incident on the sub-diffusion part. Therefore, light can be actively emitted from the sub-diffusion part also to the side of the lighting fixture. Thereby, the lighting fixture which a user feels bright can be provided.
  • a panel-type lighting fixture attached to a system ceiling partitioned in a lattice shape, A power supply unit capable of outputting power supplied from an external power source to the output line at a predetermined voltage or current; A mounting unit that is attached to a support member of the system ceiling, and a lamp unit that is driven by electric power input from an input line, The power supply unit is provided separately from the lamp unit, A lighting fixture is provided in which the output line and the input line are electrically connected by a connectable / detachable connector.
  • the panel-type lighting fixture of the present invention first, electrical work for connecting the power supply unit to the external power supply is performed, and then the lamp unit is attached to the support member of the system ceiling, and the connector is connected to connect the lamp unit and the power supply. Connect the unit. Therefore, when the lamp unit is attached to the system ceiling, since the connection between the power supply unit and the external power supply is completed, the installation of the lighting fixture on the system ceiling can be completed simply by connecting the connector. Therefore, a panel-type lighting fixture with a simple mounting operation and a high mounting efficiency is provided.
  • a panel-type lighting fixture supported by a support member of the system ceiling, A box-shaped metal housing with an open bottom surface; A box-shaped diffusion member having an upper surface opened and forming a housing space with the housing; A substrate provided in the housing space and attached to the housing; A semiconductor light source provided in the housing space, mounted on the substrate and emitting light to the diffusing member,
  • the housing includes a first flange portion projecting from an end portion of the side wall to the outer side of the housing space,
  • the diffusion member includes a second flange portion that protrudes from the end portion of the side wall to the outer side of the housing space and faces the first flange portion,
  • a lighting fixture is provided in which the first flange portion and the second flange portion are supported by a support member of a system ceiling in a state where the first flange portion and the second flange portion are overlapped.
  • the diffusing member is formed in a box shape with the upper surface opened, the ridge line between the lower surface and the side wall shines, and the entire lower surface of the luminaire can emit light. Therefore, it is possible to provide a panel-type lighting fixture having a good appearance in which the ceiling board and the lower surface of the lighting fixture can be seen integrally.
  • the luminaire according to the present invention it is possible to provide a luminaire that is thin and emits light uniformly even when a highly directional semiconductor light emitting element is employed as a light source.
  • FIG. 3 is a cross-sectional view taken along the line III-III in FIG. 1.
  • FIG. 5 is a cross-sectional view taken along line VV in FIG. 1.
  • FIG. 5 is a figure explaining a thinning coefficient.
  • FIG. 1 is a plan view of a panel-type lighting fixture 100 according to the present embodiment, in which a part of a diffusion cover 40 is cut away.
  • FIG. 2 is a side view of the lighting apparatus 100 shown in FIG.
  • the vertical direction means the X direction shown in FIG. 2
  • the horizontal direction means the Y direction shown in FIG.
  • the lighting fixture 100 is a flat rectangular parallelepiped panel type lighting fixture as shown in FIGS.
  • the system ceiling to which the luminaire 100 according to the present embodiment is attached is provided with a panel space partitioned by beams extending in a lattice pattern.
  • the lighting fixture 100 is fitted in this panel space.
  • the lighting fixture 100 of the present embodiment is a square shape with a vertical and horizontal dimension of 600 mm in a plan view of FIG. Is formed.
  • the luminaire 100 is supported by a plurality of fixtures called T-bars (support members) 200.
  • the T-bar 200 is attached so as to protrude downward from the beam on the system ceiling, and a support portion 201 that supports the lighting device 100 is provided at the tip thereof.
  • the lighting apparatus 100 includes a lamp unit 1 and a power supply unit 3 that is formed separately from the lamp unit 1 and connected via a power cable 2.
  • the power cable 2 extends from the upper surface of the lamp unit 1 to the outside.
  • the power cable 2 includes a lamp side cable (output line) 2a and a power source side cable (input line) 2b.
  • the power cable 2 is electrically connected to a power unit 3 connected to an external power source 4 via a connector 5.
  • the power supply unit 3 can output a predetermined voltage or current as an alternating current from the external power supply 4.
  • the lamp unit 1 is driven by electric power supplied from a power supply unit 3 via a power cable 2.
  • the connector 5 includes a lamp-side connector 5a provided at one end of the lamp-side cable 2a and a power-side connector 5b provided at one end of the power-side cable 2b.
  • the lamp unit 1 can be separated from the power supply unit 3 by separating the lamp side connector 5a and the power supply side connector 5b.
  • FIG. 3 is a cross-sectional view taken along the line III-III in FIG.
  • the lamp unit 1 includes a base plate (base member) 10, a circuit board (substrate) 20, semiconductor light source units 30 arranged in a grid on the circuit board 20, and a diffusion cover (light Diffusion member) 40.
  • This luminaire 100 is attached to the system ceiling with the diffusion cover 40 facing downward.
  • the base plate 10 is a single plate member made of metal that constitutes the upper surface of the lamp unit 1.
  • the base plate 10 is provided with a through hole, and the power cable 2 connected to the power source is inserted into the through hole.
  • the circuit board 20 can be constituted by a printed board or the like. Printed wiring is formed on the circuit board 20 to supply power from the power source to the semiconductor light source unit 30 mounted on the circuit board 20.
  • 25 semiconductor light source units 30 are arranged in a lattice pattern on one circuit board 20, and nine circuit boards 20 are arranged on one base plate 10. It is attached.
  • FIG. 4 is a schematic diagram showing the wiring of the lighting apparatus 100.
  • the lighting fixture 100 is supplied with power from the external power supply 4 to the power supply unit 3. Further, the power supply unit 3 is connected to the lamp unit 1 via the connector 5.
  • Nine circuit boards 20 are connected to the power supply unit 3.
  • the nine circuit boards 20 are connected in series with three circuit boards 20, and three sets of these three circuit boards 20 connected in series are connected in parallel. Thereby, an alternating current from the external power supply 4 is supplied to the power supply unit 3, the alternating current is converted into a direct current by the power supply unit 3, and the direct current is supplied to each LED element 31 on the circuit board 20.
  • the circuit board 20 is attached to the base plate 10 by fasteners 50.
  • the circuit board 20 is in surface contact with the base plate 10 so that heat from the semiconductor light source unit 30 is efficiently released to the base plate 10.
  • the heat released to the base plate 10 is radiated from the upper surface of the base plate 10 to the atmosphere.
  • the diffusion cover 40 is a resin molded product integrally formed of milky white acrylic resin or the like.
  • the diffusion cover 40 has a box shape opened upward.
  • the diffusion cover 40 is attached to the base plate 10 with the opening surface facing the base plate 10.
  • a lamp chamber (accommodating space) S is formed between the diffusion cover 40 and the base plate 10.
  • a circuit board 20 and a semiconductor light source unit 30 are accommodated in the lamp chamber S.
  • the side wall of the diffusion cover 40 has a shape in which the central portion of the side wall is slightly curved outward from the corner portion in plan view.
  • the diffusion cover 40 is provided so as to cover the semiconductor light source unit 30 and be separated from the semiconductor light source unit 30.
  • the diffusion cover 40 is provided at a position facing the circuit board 20 and has a main light emitting surface (main diffusion portion) 41 constituting the lower surface of the lamp unit 1, and a side surface protruding from the periphery of the main light emitting surface 41 toward the base plate 10 ( Sub-diffusion part) 42.
  • the side surface 42 is formed thinner than the thickness of the main light emitting surface 41.
  • the angle ⁇ formed by the main light emitting surface 41 and the side surface 42 is set to 90 ° or more.
  • a part of the side surface 42 of the diffusion cover 40 is provided with a protruding portion 47 in which a part on the base plate 10 side protrudes outside the lamp chamber S from the main light emitting surface 41 side.
  • the lower surface of the protruding portion 47 is a stepped portion (attachment portion) 43.
  • FIG. 5 is a cross-sectional view taken along line VV in FIG. As shown in FIG. 5, at the portion where the protrusion 47 of the diffusion cover 40 is not formed, the upper end 45 of the diffusion cover 40 extends outward in parallel with the base plate 10.
  • the diffusion cover 40 is fixed to the base plate 10 by sandwiching the base plate 10 and the end portion 45 of the diffusion cover 40 with the clip 60.
  • an LED element (semiconductor light source) 31 arranged in a lattice shape and a lens (lens member) 32 formed so as to cover the LED element 31 are provided on the circuit board 20.
  • a semiconductor light source unit 30 is mounted.
  • the LED element 31 that emits white light having a color similar to that of a conventional fluorescent lamp is employed.
  • an LD (Laser Diode) element may be employed instead of the LED (Light Emitting Diode) element.
  • the lens 32 covering the LED element 31 refracts the light from the LED element 31 and emits light over a wide range. More specifically, the light refracted by the lens 32 enters the region 48 of the diffusion cover 40 that faces the LED element 31 adjacent to the LED element 31 from which the light is emitted and is positioned on the optical axis Ax. Thus, the lens 32 is formed. Thereby, the light from the LED element 31 enters the main light emitting surface 41 of the diffusion cover 40 in a spread state, and the main light emitting surface 41 emits light uniformly. This will be described in detail below.
  • FIG. 6 is a diagram similar to FIG. 5 and is a diagram for explaining the thinning coefficient T.
  • the separation distance d is set to 40 [mm]
  • the separation distance h is set to 20 [mm]
  • the thinning coefficient T is set to 0.5.
  • the diffusion cover 40 is separated from the semiconductor light source unit 30, the light emitted from the semiconductor light source unit 30 is diffused in a spread state. Incident on the cover 40. Therefore, the light and darkness of the light by the semiconductor light source unit 30 hardly occurs in the diffusion cover 40.
  • the lighting fixture 100 which concerns on this embodiment can be made into a thin shape, making a main light emission surface emit light uniformly.
  • the state where the thinning coefficient T is large is a case where the luminaire 100 is large in the left-right dimension, the separation distance d of the semiconductor light source unit 30 is wide, or the diffusion cover 40 is low and the separation distance h is small. That is, when the thinning coefficient T is large, the lighting fixture 100 becomes flat, and the lighting fixture 100 can be thinned. Instead, since the separation distance d of the semiconductor light source unit 30 is wide, a region where the light from the semiconductor light source unit 30 does not enter is easily formed on the main light emitting surface 41 of the diffusion cover 40, and the main light emitting surface 41 emits light uniformly. It is difficult.
  • the separation distance h is small, it is easy to reach the main light emitting surface 41 before the light from the semiconductor light source unit 30 spreads, and it is difficult to cause the main light emitting surface 41 to emit light uniformly. That is, it is difficult to make the main light emitting surface 41 emit light uniformly as the thinning coefficient T increases.
  • the present inventors have examined lighting devices 100 having various shapes using the thinning factor T.
  • the thinning factor T is set to 0.4 or more and 1.0 or less, the lighting device 100 is mainly thinned. It has been found that the light emitting surface 41 can emit light uniformly.
  • the thinning coefficient T is set to be smaller than 0.4, even if the shape of the lens 32 is devised, the light of the LED element 31 is refracted so as to enter the region 48 facing the adjacent LED element 31. Is difficult.
  • region 48 which opposes the adjacent LED element 31 among the main light emission surfaces 41 the area
  • the separation distance d is decreased in order to increase the thinning coefficient T
  • the number of LED elements 31 required to cause the entire main light emitting surface 41 of the diffusion cover 40 to emit light increases. Therefore, since the number of the LED elements 31 mounted on one lighting fixture 100 increases, if the thinning coefficient T is increased more than necessary, the cost of the lighting fixture 100 increases. Therefore, the present inventors have found that even when the thinning coefficient T is larger than 1.0, the luminance uniformity of the main light emitting surface 41 does not change greatly. For this reason, in order to make the lighting fixture 100 thinner, the thinning factor T is set to 1 or less.
  • the height dimension of the lighting fixture 100 is set to the height of the T bar 200 in order to fit the lighting fixture 100 in the space between the system ceiling and the T bar 200. It is preferable to make it smaller than the size.
  • the vertical and horizontal sizes of the lighting fixture 100 are set so as to fit in the grid-like panel space of the system ceiling without any gap, and the thinning factor T is set larger than 1, the height dimension of the lighting fixture 100 is There is a concern that the height dimension of the T-bar 200 may be larger. For this reason, when using the lighting fixture 100 for a system ceiling especially, it is preferable to make the thinning coefficient T into 1.0 or less.
  • the main light emitting surface 41 is uniformly illuminated with as few semiconductor light source units 30 as possible, and the lighting apparatus 100 that is as thin as possible is provided. Can do.
  • the separation interval d of the semiconductor light source unit 30 is 30 mm ⁇ d ⁇ 90 mm. If the separation distance d is shorter than 30 mm, the number of the semiconductor light source units 30 required for configuring the large luminaire 100 for a system ceiling or the like increases, and the cost increases. In addition, when the separation distance d is longer than 90 mm, even if the thinning factor T is within a predetermined range, the thickness of the lighting fixture 100 may be increased and may not be attached to the system ceiling.
  • the separation distance h from the semiconductor light source unit 30 to the diffusion cover 40 is preferably 20 mm ⁇ h ⁇ 50 mm. If the separation distance h is shorter than 20 mm, the light from the LED element 31 reaches the main light emitting surface 41 of the diffusion cover 40 before the light is diffused, and the main light emitting surface 41 may be bright and dark. In addition, if the separation distance h is longer than 50 mm, it may be larger than the height dimension of the T-bar 200 and cannot be attached to the system ceiling.
  • each semiconductor light source unit 30 is separated from the LED element 31 a located on the outermost edge in a plan view and the side surface 42. It arrange
  • FIG. As described above, the distance B between the LED elements 31 is set so that the light emitted from the LED elements 31 enters the region 48 located on the optical axis Ax of the adjacent LED elements 31. Therefore, the light emitted from the LED element 31 a located at the outermost edge surely enters the side surface 42.
  • the distance A between the LED element 31a located at the outermost edge and the side surface 42 is larger than the distance B between the LED elements 31, almost all of the light from the LED element 31a located at the outermost edge is mainly used. The light is incident on the light emitting surface 41 and is not incident on the side surface 42.
  • the lighting fixture 100 According to the lighting fixture 100 according to the present embodiment configured as described above, light can be actively emitted from the side surface 42 located on the side of the lighting fixture 100. Thereby, it is possible to make light incident on the user not only from above but also from the side. For this reason, while being able to illuminate a user's hand reliably and a ceiling surface and a wall, the lighting fixture 100 which a user feels bright can be provided.
  • light from the LED element 31b and a total of nine LED elements 31b surrounding the LED element 31b is incident on the region of the main light emitting surface 41 facing the LED element 31b that is not located at the outermost edge.
  • light from the LED element 31a located at the outermost edge and a total of three LED elements 31a on both sides thereof enters the region 42a where the side surface 42 is present. That is, the amount of light incident on the side surface 42 is smaller than the amount of light incident on the main light emitting surface 41.
  • the thickness of the side surface 42 is formed thinner than the thickness of the main light emitting surface 41, and the light transmittance of the side surface 42 is larger than the light transmittance of the main light emitting surface 41. It is set high. For this reason, light can be efficiently emitted from the side surface 42 to the outside, and the amount of light that goes around to the side can be increased.
  • the angle formed between the main light emitting surface 41 and the side surface 42 of the diffusion cover 40 is 90 ° or more. Thereby, the dimension of the left-right direction of the lighting fixture 100 is made equal or small toward the main light emission surface 41 side from the baseplate 10 side.
  • the lamp unit 1 is attached to the T-bar 200 by lowering the lamp unit 1 from above into a space surrounded by a plurality of T-bars 200 and bringing the stepped portion 43 of the lamp unit 1 into contact with the support portion 201 of the T-bar 200. To do. Since the shape of the lamp unit 1 is reduced downward, the lamp unit 1 can be easily lowered from above into a space surrounded by the plurality of T bars 200, and attachment to the T bar 200 is facilitated.
  • the diffusion cover 40 is formed by integral molding of the resin, it is easy to remove the mold that forms the inner surface 40b of the diffusion cover 40 from the opening on the upper surface that is wide open, and from the mold of the molded diffusion cover It is easy to take out.
  • the semiconductor light source unit 30 is provided up to the vicinity of the side surface 42 of the diffusion cover 40, the entire light including the edge of the main light emitting surface 41 emits light uniformly. Further, since the size of the diffusion cover 40 is set so as to be fitted in the panel space of the system ceiling without any gap, it seems that the entire lower surface of the panel space emits light. Therefore, by setting the length from the stepped portion 43 of the lighting fixture 100 to the main light emitting surface 41 so that the ceiling board of the system ceiling and the main light emitting surface 41 of the lighting fixture 100 are continuous, a part of the flat ceiling is formed. It can appear as if it is emitting light. Thereby, the aesthetics of the whole system ceiling can be improved.
  • the outer surface 40a of the diffusion cover 40 may be a satin surface on which minute irregularities having a surface roughness of about several ⁇ m are formed.
  • the light from the semiconductor light source unit 30 can be emitted to the outside while diffusing the light from the outer surface 40a of the diffusion cover 40, and reflection on a peripheral object can be prevented.
  • this makes it possible to share the texture with the ceiling board of the system ceiling. For this reason, when the lighting fixture 100 is turned off, the ceiling board and the lighting fixture 100 appear to have a sense of unity, and the aesthetics of the entire system ceiling can be enhanced.
  • the inner surface 40b of the diffusion cover 40 may be a glossy surface with a smooth surface. Accordingly, light having a large incident angle of the diffusion cover 40 is positively reflected by the inner surface 40b, and the reflected light is reflected by the surface of the circuit board 20 or the like, so that it can be incident on the diffusion cover 40 again.
  • the light from the semiconductor light source unit 30 By using the light from the semiconductor light source unit 30 to be emitted to the outside as much as possible, the light use efficiency of the lighting fixture 100 can be improved.
  • 25 semiconductor light source units 30 are arranged in a grid pattern on one circuit board 20, and nine circuit boards 20 are attached to the base plate 10. ing.
  • a lighting fixture is configured with a single circuit board, if one semiconductor light source unit fails, it is necessary to replace the entire circuit board on which all the semiconductor light source units are mounted. .
  • the circuit board 20 is divided into a plurality of parts, only the circuit board 20 on which the failed semiconductor light source unit 30 is mounted needs to be replaced. Therefore, according to the lighting fixture 100 which concerns on this embodiment, a maintenance cost can be reduced.
  • the lighting fixture 100 comprised as mentioned above is attached to a system ceiling as follows. First, the lamp side connector 5a is separated from the power source side connector 5b, and the lamp unit 1 and the power source unit 3 are separated. The separated power supply unit 3 is installed on the system ceiling.
  • the power supply unit 3 may be attached to the back of the ceiling, or may be attached to a beam or a T-bar 200.
  • the external power supply 4 and the power supply unit 3 are electrically connected.
  • a specialist in electric construction works to handle the cable 4 a that is supplied with relatively high output power extending from the external power supply 4.
  • the lamp unit 1 separated from the power supply unit 3 is attached to the T bar 200. Specifically, the lamp unit 1 is lowered from above the T bar 200 toward the support portion 201 of the T bar 200, and the stepped portion 43 provided on the side surface 42 of the diffusion cover 40 is placed on the support portion 201. Next, the lamp-side connector 5a and the power supply-side connector 5b are connected, the lamp unit 1 and the power supply unit 3 are electrically connected, and the attachment of the lighting fixture 100 to the system ceiling is completed.
  • the attachment work of the lamp unit 1 to the T-bar 200 and the connection of the connector 5 do not require handling of the cable 4a to which the high output power of the external power supply 4 is supplied. For this reason, since the construction by a specialist in electrical work is not necessary, a trader who handles normal interior work can construct it. Therefore, at the time of interior construction for attaching a ceiling panel or the like to the system ceiling, the interior construction contractor can attach the lamp unit 1 to the system ceiling.
  • the lighting unit has a built-in power supply unit as in the past, and when the cable extending from the external power source is pulled into the lighting fixture and connected, the lighting fixture and the external power source are connected to the system ceiling. Need to be connected. In this case, it was necessary to install an illuminating device on the ceiling of the system, and then an electrical contractor entered the narrow ceiling space to perform the electrical work, resulting in poor work efficiency. In addition, since the electrical work was performed after the lighting fixture was installed, it was difficult to match the schedule with the usual ceiling work in which the ceiling panel was installed after wiring the ceiling.
  • the work of attaching the power supply unit 3 to the system ceiling and the work of attaching the lamp unit 1 to the system ceiling are separated. Therefore, the operation of attaching the power supply unit 3 can be performed before attaching the lamp unit 1 to the system ceiling. As a result, the electrical work can be performed using a wide work space in which the lamp unit 1 is not attached, so that work efficiency is good.
  • the lighting fixture 100 can be installed on the system ceiling simply by connecting the connector 5. Can be completed.
  • a contractor of the interior work can attach the lamp unit 1 to the system ceiling in accordance with the work of attaching the ceiling panel or the like, for example.
  • the attachment of the power supply unit 3 and the connection with the external power supply 4 can be performed together when performing electrical work on the back of the ceiling such as wiring of an air conditioning facility or LAN wiring.
  • the installation work of the lamp unit 1 can be performed simultaneously with the installation work of the ceiling panel. That is, since it is not necessary to perform the installation work of the lighting fixture 100 and the installation work of the ceiling panel separately, the installation work of the lighting fixture 100 can be easily matched with the schedule of other ceiling constructions, and the construction period can be shortened.
  • the side wall housing 10A of the diffusion cover 40 of the lamp unit 1 has a curved shape so that the center portion of the side surface protrudes outward from the corner portion in plan view. Therefore, even when the rectangular panel space surrounded by the T-bar 200 is distorted due to an earthquake or the like, stress is not concentrated on the corners of the lamp unit 1, and the lighting apparatus 100 can be prevented from being damaged. Even if the lamp unit 1 is displaced from a predetermined position in the panel space, at least a part of the lamp unit 1 always contacts the T bar 200, so that the T bar 200 can continue to support the lamp unit 1.
  • FIG. 7 is a partial cross-sectional view of the lamp unit 1A of the lighting fixture 100A according to the second embodiment of the present invention.
  • the housing 10A is a metal member that constitutes the upper surface of the lighting fixture 100A.
  • the housing 10A is a box-shaped member having an open bottom surface.
  • the housing 10 ⁇ / b> A has a bottom plate (support plate portion) 11 and side walls (side wall portions) 12.
  • the side wall 12 is bent from the bottom plate 11 so as to extend to the diffusion cover 40 side.
  • the side wall 12 extends from the bottom plate 11 to at least the same height as the lens 32.
  • the circuit board 20 on which the semiconductor light source unit 30 is mounted is accommodated in the inner space S1 of the housing 10A.
  • the portion near the side of the LED element 31a having a short distance from the outermost LED element 31a is covered with the side wall 12 of the light-shielding housing 10A, not the side surface 42 of the diffusion cover 40. .
  • the side surface 42 is disposed in a region having a certain distance from the outermost LED element 31a, the light spread from the LED element 31a is incident on the side surface 42.
  • the side surface 42 emits light uniformly, and it is possible to provide the lighting apparatus 100A with a good appearance from the side.
  • the side wall 12 located in the vicinity of the right side of the outermost LED element 31a with a reflecting surface, the light of the outermost LED element 31a can be reflected to the main light emitting surface 41 of the diffusion cover 40. Thereby, the utilization efficiency of the light of 100 A of lighting fixtures can be improved.
  • the bottom plate 11 of the housing 10A is formed with a convex portion 13 protruding toward the diffusion cover 40, and the convex portion 13 is provided with a locking hole 15.
  • the circuit board 20 is also provided with a through hole 21. The circuit board 20 is fixed to the housing 10A by inserting the rivets 51 through the locking holes 15 of the housing 10A and the through holes 21 of the circuit board 20. Thereby, the circuit board 20 is being fixed to the housing 10A in the state which contacted the convex part 13 of 10A of housings.
  • a space S2 is provided between the circuit board 20 and the bottom plate 11 of the housing 10A by the convex portion 13 of the housing 10A. Therefore, the electrical wiring 33 extending from the semiconductor light source unit 30 of the circuit board 20 is placed in this space S2. Thereby, the electrical wiring 33 extended from the semiconductor light source unit 30 can be easily taken out to the housing 10A side.
  • a cover side flange portion (second flange portion) 46 that protrudes outward from the accommodation space S is provided at the upper end of the side surface 42 of the diffusion cover 40. Further, a housing-side flange portion (first flange portion) 14 projecting outward from the housing space S is also provided at the lower end of the side wall 12 of the housing 10A so as to face the cover-side flange portion 46. . In a state where the cover side flange portion 46 and the housing side flange portion 14 are overlapped, the cover side flange portion 46 and the housing side flange portion 14 are supported by the support portion 201 of the T-bar 200.
  • the housing side flange portion 14 is caulked to the cover side flange portion 46 and is bent along the outline shape of the cover side flange portion 46.
  • the diffusion cover 40 is caulked and fixed to the housing 10A.
  • the thickness of the diffusion cover 40 (the thickness of the outer peripheral edge) is preferably 2 mm or more.
  • the diffusion cover 40 is formed in a box shape, the ridge line 44 corresponding to the boundary between the main light emitting surface 41 and the side surface 42 also emits light. be able to. Thereby, it seems that the whole lower surface of the lamp unit 1A emits light.
  • panel-type lighting fixtures have a design requirement to show the ceiling board and the light-emitting surface of the lighting fixture as one body.
  • the outer periphery of the lower surface of the diffusion cover is not covered with a frame or the like, and the outer periphery of the lower surface of the diffusion cover 40, in particular, the ridge line 44 is exposed to the outside. For this reason, the whole lower surface of 100 A of lighting fixtures can be light-emitted, and a lighting fixture with high designability can be provided.
  • the housing side flange portion 14 is bent and the strength is improved. Therefore, the lighting fixture 100A is supported by contacting the supporting portion 201 of the T-bar 200 at a portion where the strength of the lighting fixture 100A is high. For this reason, even when vibration is applied to the system ceiling due to an earthquake or the like, the lighting apparatus 100A can be reliably supported.
  • a through electrode 16 penetrating from the mounting surface 20a on which the LED element of the circuit board 20 is mounted to the back surface 20b may be provided.
  • a heat radiation film 17 that conducts heat from the through electrode 16 and can radiate heat from the front surface may be provided on the back surface of the circuit board 20.
  • the heat generated in the LED element can be guided to the back surface 20 b side, and this heat can be efficiently radiated from the heat radiation film 17.
  • a heat sink such as a heat radiating fin for radiating the heat generated in the LED element 31. Therefore, the cooling property of the LED element 31 is high, and a small lighting fixture 100A can be provided.
  • a metal film such as a copper or aluminum film can be used. Further, the heat dissipation film may be used as wiring on the back surface 20b side of the circuit board 20.
  • the lighting device for the system ceiling has been described as an example.
  • the present invention can be applied to a surface-emitting type and thin lighting device, for example, a living room.
  • ADVANTAGE OF THE INVENTION is a lighting fixture by which the semiconductor light emitting element with high directivity was employ

Abstract

Provided is an illuminating apparatus, which is thin, and uniformly emits light. This illuminating apparatus is provided with: a substrate (20); a plurality of semiconductor light source units (30), which are disposed in the form of lattice on the substrate (20); and a light diffusion member (40), which is provided by being spaced apart from the semiconductor light source unit (30). The illuminating apparatus is formed such that a thinning coefficient T=h/d satisfies the formula of 0.4≤T≤1.0, where the intervals at which the semiconductor light source units (30) are disposed is represented by d[mm], and the distance between the semiconductor light source units (30) and the light diffusion member (40) is represented by h [mm].

Description

照明器具lighting equipment
 本発明は、照明器具に関する。 The present invention relates to a lighting fixture.
 特許文献1などに、消費電力の少ないLED等の半導体発光素子を採用した照明器具が知られている。 Japanese Patent Application Laid-Open No. H10-228867 and the like have known lighting fixtures that employ semiconductor light emitting elements such as LEDs with low power consumption.
日本国特開2010-118186号公報Japanese Unexamined Patent Publication No. 2010-118186
 近年、大面積の発光面が均一に発光する見栄えの良い照明器具が求められている。
 特許文献1の照明器具は、発光ダイオードを有する光源ユニットからの光を、矩形状の開口から出射させている。この照明器具は、矩形状の開口を複数個並べることで、大面積に発光させている。ところが、この照明器具は、各光源ユニットに対してルーバを設けたり、集光レンズを設けたりして光の出射方向を制御している。このため、各光源ユニットが点光りするように見えてしまい、各光源ユニットの開口の境界に暗部が生じている。また、一般に発光ダイオードのような半導体発光素子から出射される光は指向性が高いため、局部的に光が集中しやすく、発光面に明暗が生じやすい。
In recent years, there has been a demand for a luminaire having a good appearance in which a large area light emitting surface emits light uniformly.
The lighting fixture of patent document 1 is made to radiate | emit the light from the light source unit which has a light emitting diode from rectangular opening. This luminaire emits light over a large area by arranging a plurality of rectangular openings. However, this lighting fixture controls the light emission direction by providing a louver or a condenser lens for each light source unit. For this reason, each light source unit appears to shine, and a dark portion is generated at the boundary of the opening of each light source unit. In general, light emitted from a semiconductor light emitting element such as a light emitting diode has high directivity, so that the light tends to concentrate locally, and light and darkness tends to occur on the light emitting surface.
 また、半導体発光素子の出射方向に拡散カバーを配置し、拡散カバーを光らせる照明器具も考えられる。この場合、半導体発光素子と拡散カバーとの離間距離を大きく設定すれば、半導体発光素子からの光はある程度広がってから拡散カバーに入射するため、拡散カバーを均一に発光させることができる。しかし半導体発光素子と拡散カバーとの離間距離を大きく設定すると、照明器具の厚みが大きくなり、照明器具が大型化してしまう。 Also, a lighting fixture in which a diffusion cover is arranged in the emission direction of the semiconductor light emitting element to make the diffusion cover shine can be considered. In this case, if the distance between the semiconductor light emitting element and the diffusion cover is set large, the light from the semiconductor light emitting element spreads to some extent and then enters the diffusion cover, so that the diffusion cover can emit light uniformly. However, if the separation distance between the semiconductor light emitting element and the diffusion cover is set large, the thickness of the lighting fixture increases and the lighting fixture becomes large.
 そこで本発明は、厚みが薄く、均一に発光する照明器具を提供することを目的とする。 Therefore, an object of the present invention is to provide a lighting apparatus that is thin and emits light uniformly.
 本発明によれば上記目的を達成するために
 基板と、
 前記基板の上に格子状に配列された複数の半導体光源ユニットと、
 前記半導体光源ユニットを覆うように前記半導体光源ユニットから離間して設けられた光拡散部材と、を備え、
 前記半導体光源ユニットの互いの離間間隔d[mm]、前記半導体光源ユニットから前記光拡散部材までの離間距離h[mm]としたとき、薄型化係数T=h/dが0.4≦T≦1.0を満たすように形成されている、照明器具が提供される。
According to the present invention, in order to achieve the above object, a substrate,
A plurality of semiconductor light source units arranged in a grid pattern on the substrate;
A light diffusion member provided apart from the semiconductor light source unit so as to cover the semiconductor light source unit,
When the separation distance d [mm] between the semiconductor light source units and the separation distance h [mm] from the semiconductor light source unit to the light diffusion member, the thinning coefficient T = h / d is 0.4 ≦ T ≦. A luminaire is provided that is configured to satisfy 1.0.
 本発明に係る照明器具によれば、薄型化係数Tが0.4≦T≦1.0を満たすように形成されているので、指向性の高い半導体発光素子を光源に採用しても、半導体発光素子と光拡散部材の離間距離をできるだけ小さく設定して照明器具の厚みを薄くしつつ、均一に発光する照明器具を提供することができる。 According to the lighting apparatus of the present invention, the thinning coefficient T is formed so as to satisfy 0.4 ≦ T ≦ 1.0. Therefore, even if a highly directional semiconductor light emitting element is used as a light source, the semiconductor It is possible to provide a lighting fixture that uniformly emits light while setting the distance between the light emitting element and the light diffusing member as small as possible to reduce the thickness of the lighting fixture.
 また、本発明によれば、
 ベース部材と、
 前記ベース部材に取り付けられ、前記ベース部材との間に収容空間を形成する拡散カバーと、
 前記収容空間内に設けられ、前記ベース部材に取り付けられた基板と、
 前記収容空間内に設けられ、前記基板に格子状に配列された複数の半導体光源と、を備え、
 前記拡散カバーは、前記半導体光源を覆うように設けられた主拡散部と、前記主拡散部から前記ベース部材側に突出する副拡散部とを有し、
 前記基板の平面視において、前記副拡散部と最外縁に配置された前記半導体光源との離間距離は、前記半導体光源の互いの離間距離よりも小さく設定されており、前記半導体光源からの光が副拡散部から出射されることを特徴とする照明器具が提供される。
Moreover, according to the present invention,
A base member;
A diffusion cover attached to the base member and forming a housing space with the base member;
A substrate provided in the housing space and attached to the base member;
A plurality of semiconductor light sources provided in the accommodation space and arranged in a lattice pattern on the substrate,
The diffusion cover has a main diffusion portion provided so as to cover the semiconductor light source, and a sub-diffusion portion protruding from the main diffusion portion to the base member side,
In a plan view of the substrate, a separation distance between the sub-diffusion unit and the semiconductor light source disposed at the outermost edge is set to be smaller than a separation distance between the semiconductor light sources, and light from the semiconductor light source is A luminaire is provided that is emitted from the sub-diffusion unit.
 また本発明に係る照明器具によれば、副拡散部と最外縁に配置された半導体光源との離間距離が、半導体光源の互いの離間距離よりも小さく設定されているので、半導体光源からの出射光を副拡散部に入射させやすい。したがって、照明器具の側方にも、副拡散部から積極的に光を出射させることができる。これにより、使用者が明るく感じる照明器具を提供することができる。 Further, according to the luminaire according to the present invention, the separation distance between the sub-diffusion part and the semiconductor light source disposed at the outermost edge is set smaller than the separation distance between the semiconductor light sources. It is easy to make incident light incident on the sub-diffusion part. Therefore, light can be actively emitted from the sub-diffusion part also to the side of the lighting fixture. Thereby, the lighting fixture which a user feels bright can be provided.
 また、本発明によれば、格子状に区画されたシステム天井に取り付けられるパネル型の照明器具であって、
 外部電源から供給される電力を所定の電圧または電流で出力線に出力可能な電源ユニットと、
 システム天井の支持部材に取り付けられる取付部を備え、入力線から入力される電力によって駆動される灯具ユニットとを備え、
 前記電源ユニットは、前記灯具ユニットとは別体に設けられ、
 前記出力線および前記入力線は、接離可能なコネクタによって電気的に接続されている、照明器具が提供される。
Moreover, according to the present invention, a panel-type lighting fixture attached to a system ceiling partitioned in a lattice shape,
A power supply unit capable of outputting power supplied from an external power source to the output line at a predetermined voltage or current;
A mounting unit that is attached to a support member of the system ceiling, and a lamp unit that is driven by electric power input from an input line,
The power supply unit is provided separately from the lamp unit,
A lighting fixture is provided in which the output line and the input line are electrically connected by a connectable / detachable connector.
 本発明に係るパネル型照明器具によれば、まず電源ユニットを外部電源に接続する電気工事を行い、その後に、灯具ユニットをシステム天井の支持部材に取り付け、コネクタを接続することによって灯具ユニットと電源ユニットとを接続する。したがって、灯具ユニットがシステム天井に取り付けられる時には、電源ユニットと外部電源との接続が完了しているため、コネクタを接続するだけで照明器具のシステム天井への設置を完了させることができる。したがって、照明器具の取付作業が簡便であり、取付の作業効率のよいパネル型照明器具が提供される。 According to the panel-type lighting fixture of the present invention, first, electrical work for connecting the power supply unit to the external power supply is performed, and then the lamp unit is attached to the support member of the system ceiling, and the connector is connected to connect the lamp unit and the power supply. Connect the unit. Therefore, when the lamp unit is attached to the system ceiling, since the connection between the power supply unit and the external power supply is completed, the installation of the lighting fixture on the system ceiling can be completed simply by connecting the connector. Therefore, a panel-type lighting fixture with a simple mounting operation and a high mounting efficiency is provided.
 また、本発明によれば、システム天井の支持部材に支持されるパネル型の照明器具であって、
 下面が開口する箱型の金属製ハウジングと、
 上面が開口し、前記ハウジングとの間に収容空間を形成する箱型の拡散部材と、
 前記収容空間内に設けられ、前記ハウジングに取り付けられる基板と、
 前記収容空間内に設けられ、前記基板に搭載され前記拡散部材に光を出射する半導体光源と、を有し、
 前記ハウジングは、側壁の端部から収容空間の外側側方に張り出した第一フランジ部を備え、
 前記拡散部材は、側壁の端部から収容空間の外側側方に張り出して前記第一フランジ部と対向する第二フランジ部を備え、
 前記第一フランジ部と前記第二フランジ部とが重ね合わされた状態で、前記第一フランジ部および前記第二フランジ部がシステム天井の支持部材に支持される照明器具が提供される。
Moreover, according to the present invention, a panel-type lighting fixture supported by a support member of the system ceiling,
A box-shaped metal housing with an open bottom surface;
A box-shaped diffusion member having an upper surface opened and forming a housing space with the housing;
A substrate provided in the housing space and attached to the housing;
A semiconductor light source provided in the housing space, mounted on the substrate and emitting light to the diffusing member,
The housing includes a first flange portion projecting from an end portion of the side wall to the outer side of the housing space,
The diffusion member includes a second flange portion that protrudes from the end portion of the side wall to the outer side of the housing space and faces the first flange portion,
A lighting fixture is provided in which the first flange portion and the second flange portion are supported by a support member of a system ceiling in a state where the first flange portion and the second flange portion are overlapped.
 本発明に係る照明器具によれば、拡散部材は上面が開口した箱型形状に形成されているので、下面と側壁との間の稜線が光り、照明器具の下面全体を発光させることができる。したがって、天井ボードと照明器具の下面が一体的に見える見栄えの良いパネル型照明器具を提供することができる。 According to the luminaire according to the present invention, since the diffusing member is formed in a box shape with the upper surface opened, the ridge line between the lower surface and the side wall shines, and the entire lower surface of the luminaire can emit light. Therefore, it is possible to provide a panel-type lighting fixture having a good appearance in which the ceiling board and the lower surface of the lighting fixture can be seen integrally.
 本発明に係る照明器具によれば、指向性の高い半導体発光素子を光源に採用しても、厚みが薄く均一に発光する照明器具を提供することができる。 According to the luminaire according to the present invention, it is possible to provide a luminaire that is thin and emits light uniformly even when a highly directional semiconductor light emitting element is employed as a light source.
本発明の第一実施形態にかかる照明器具の平面図であり、拡散カバーの一部を切り欠いて内部構造を示している。It is a top view of the lighting fixture concerning 1st embodiment of this invention, and a part of diffusion cover is notched and the internal structure is shown. 図1に示した照明器具の側面図である。It is a side view of the lighting fixture shown in FIG. 図1のIII-III線矢視断面図である。FIG. 3 is a cross-sectional view taken along the line III-III in FIG. 1. 図1に示した照明器具の配線を示す模式図である。It is a schematic diagram which shows the wiring of the lighting fixture shown in FIG. 図1のV-V線矢視断面図である。FIG. 5 is a cross-sectional view taken along line VV in FIG. 1. 薄型化係数を説明する図である。It is a figure explaining a thinning coefficient. 本発明の第二実施形態に係る照明器具の灯具ユニットの部分断面図である。It is a fragmentary sectional view of the lamp unit of the lighting fixture which concerns on 2nd embodiment of this invention.
(第一実施形態)
 本発明の第一実施形態に係る照明器具100を、図1から図6を参照しつつ説明する。
 図1は本実施形態に係るパネル型の照明器具100の平面図であり、拡散カバー40の一部を切り欠いて示している。図2は図1に示した照明器具100の側面図である。なお、以降の説明において、上下方向とは図2に示すX方向を言い、左右方向とは図2に示すY方向を言う。
(First embodiment)
The lighting fixture 100 which concerns on 1st embodiment of this invention is demonstrated referring FIGS. 1-6.
FIG. 1 is a plan view of a panel-type lighting fixture 100 according to the present embodiment, in which a part of a diffusion cover 40 is cut away. FIG. 2 is a side view of the lighting apparatus 100 shown in FIG. In the following description, the vertical direction means the X direction shown in FIG. 2, and the horizontal direction means the Y direction shown in FIG.
 照明器具100は、図1,2に示したように、扁平な直方体形状のパネル型の照明器具である。本実施形態に係る照明器具100が取り付けられるシステム天井には、格子状に張り巡らされた梁によって区切られたパネル空間が設けられている。このパネル空間内に照明器具100が嵌めこまれる。 The lighting fixture 100 is a flat rectangular parallelepiped panel type lighting fixture as shown in FIGS. The system ceiling to which the luminaire 100 according to the present embodiment is attached is provided with a panel space partitioned by beams extending in a lattice pattern. The lighting fixture 100 is fitted in this panel space.
 本実施形態の照明器具100は、システム天井の矩形状に区切られた縦横が600mmの直方体状のパネル状の空間に隙間無く嵌め込むために、図1の平面視で縦横が600mmの正方形の形状に形成されている。この照明器具100は複数のTバー(支持部材)200と呼ばれる固定具に支持される。このTバー200は、システム天井の梁から下方に突き出すように取り付けられており、その先端に照明器具100が支持される支持部201が設けられている。 The lighting fixture 100 of the present embodiment is a square shape with a vertical and horizontal dimension of 600 mm in a plan view of FIG. Is formed. The luminaire 100 is supported by a plurality of fixtures called T-bars (support members) 200. The T-bar 200 is attached so as to protrude downward from the beam on the system ceiling, and a support portion 201 that supports the lighting device 100 is provided at the tip thereof.
 図1,2に示したように、照明器具100は、灯具ユニット1と、灯具ユニット1と別体に形成され電源ケーブル2を介して接続された電源ユニット3とを備えている。 As shown in FIGS. 1 and 2, the lighting apparatus 100 includes a lamp unit 1 and a power supply unit 3 that is formed separately from the lamp unit 1 and connected via a power cable 2.
 図2で示したように、電源ケーブル2は灯具ユニット1の上面から外部に向かって延びている。この電源ケーブル2は、灯具側ケーブル(出力線)2aおよび電源側ケーブル(入力線)2bとから構成されている。この電源ケーブル2は、外部電源4と接続された電源ユニット3に、コネクタ5を介して電気的に接続されている。電源ユニット3は、外部電源4からの交流電流を所定の電圧または電流を出力可能である。この灯具ユニット1は、電源ケーブル2を介して電源ユニット3から供給される電力によって駆動される。 As shown in FIG. 2, the power cable 2 extends from the upper surface of the lamp unit 1 to the outside. The power cable 2 includes a lamp side cable (output line) 2a and a power source side cable (input line) 2b. The power cable 2 is electrically connected to a power unit 3 connected to an external power source 4 via a connector 5. The power supply unit 3 can output a predetermined voltage or current as an alternating current from the external power supply 4. The lamp unit 1 is driven by electric power supplied from a power supply unit 3 via a power cable 2.
 コネクタ5は、灯具側ケーブル2aの一端に設けられた灯具側コネクタ5aと、電源側ケーブル2bの一端に設けられた電源側コネクタ5bとから構成されている。灯具側コネクタ5aと電源側コネクタ5bとを分離させることにより、灯具ユニット1は電源ユニット3から分離可能とされている。 The connector 5 includes a lamp-side connector 5a provided at one end of the lamp-side cable 2a and a power-side connector 5b provided at one end of the power-side cable 2b. The lamp unit 1 can be separated from the power supply unit 3 by separating the lamp side connector 5a and the power supply side connector 5b.
 図3は、図1のIII-III線矢視断面図である。図3に示したように、灯具ユニット1は、ベースプレート(ベース部材)10と、回路基板(基板)20と、回路基板20上に格子状に配列された半導体光源ユニット30と、拡散カバー(光拡散部材)40とを備えている。この照明器具100は、拡散カバー40を下方に向けてシステム天井に取り付けられている。 FIG. 3 is a cross-sectional view taken along the line III-III in FIG. As shown in FIG. 3, the lamp unit 1 includes a base plate (base member) 10, a circuit board (substrate) 20, semiconductor light source units 30 arranged in a grid on the circuit board 20, and a diffusion cover (light Diffusion member) 40. This luminaire 100 is attached to the system ceiling with the diffusion cover 40 facing downward.
 ベースプレート10は灯具ユニット1の上面を構成する金属製の1枚の板状部材である。ベースプレート10には貫通穴が設けられており、この貫通孔に電源と接続された電源ケーブル2が挿通されている。 The base plate 10 is a single plate member made of metal that constitutes the upper surface of the lamp unit 1. The base plate 10 is provided with a through hole, and the power cable 2 connected to the power source is inserted into the through hole.
 回路基板20は、プリント基板などによって構成することができる。回路基板20上にはプリント配線が形成され、電源からの電力を回路基板20上に搭載された半導体光源ユニット30に供給する。本実施形態では、図1に示したように、1枚の回路基板20上に25個の半導体光源ユニット30が格子状に配列されており、9枚の回路基板20が1枚のベースプレート10に取り付けられている。 The circuit board 20 can be constituted by a printed board or the like. Printed wiring is formed on the circuit board 20 to supply power from the power source to the semiconductor light source unit 30 mounted on the circuit board 20. In the present embodiment, as shown in FIG. 1, 25 semiconductor light source units 30 are arranged in a lattice pattern on one circuit board 20, and nine circuit boards 20 are arranged on one base plate 10. It is attached.
 図4は、照明器具100の配線を示す模式図である。照明器具100は、外部電源4からの電力が電源ユニット3に供給される。また、電源ユニット3はコネクタ5を介して灯具ユニット1と接続されている。また、9枚の回路基板20は電源ユニット3に接続されている。なお、9枚の回路基板20は、3枚の回路基板20が直列に接続され、これらの直列接続された3枚の回路基板20が並列に3組接続されている。これにより、外部電源4からの交流電流が電源ユニット3に供給され、電源ユニット3によって交流電流が直流電流に変換され、直流電流が回路基板20上の各LED素子31に供給される。 FIG. 4 is a schematic diagram showing the wiring of the lighting apparatus 100. The lighting fixture 100 is supplied with power from the external power supply 4 to the power supply unit 3. Further, the power supply unit 3 is connected to the lamp unit 1 via the connector 5. Nine circuit boards 20 are connected to the power supply unit 3. The nine circuit boards 20 are connected in series with three circuit boards 20, and three sets of these three circuit boards 20 connected in series are connected in parallel. Thereby, an alternating current from the external power supply 4 is supplied to the power supply unit 3, the alternating current is converted into a direct current by the power supply unit 3, and the direct current is supplied to each LED element 31 on the circuit board 20.
 図3に示したように、回路基板20はベースプレート10にファスナ50によって取り付けられている。また、回路基板20はベースプレート10に面接触されており、半導体光源ユニット30からの熱を効率よくベースプレート10に逃がすようにされている。なお、ベースプレート10に逃がされた熱はベースプレート10の上面から大気中に放熱される。 As shown in FIG. 3, the circuit board 20 is attached to the base plate 10 by fasteners 50. The circuit board 20 is in surface contact with the base plate 10 so that heat from the semiconductor light source unit 30 is efficiently released to the base plate 10. The heat released to the base plate 10 is radiated from the upper surface of the base plate 10 to the atmosphere.
 拡散カバー40は、乳白色のアクリル樹脂などにより一体成形された樹脂成形品である。拡散カバー40は上方に開口した箱型形状をなしている。拡散カバー40は、開口面をベースプレート10に向けた状態で、ベースプレート10に取り付けられている。これにより、拡散カバー40はベースプレート10との間に灯室(収容空間)Sを形成している。この灯室S内に回路基板20と半導体光源ユニット30とが収容されている。なお、この拡散カバー40の側壁は、平面視で側壁の中央部が角部よりも外側に若干湾曲した形状とされている。 The diffusion cover 40 is a resin molded product integrally formed of milky white acrylic resin or the like. The diffusion cover 40 has a box shape opened upward. The diffusion cover 40 is attached to the base plate 10 with the opening surface facing the base plate 10. Thus, a lamp chamber (accommodating space) S is formed between the diffusion cover 40 and the base plate 10. A circuit board 20 and a semiconductor light source unit 30 are accommodated in the lamp chamber S. The side wall of the diffusion cover 40 has a shape in which the central portion of the side wall is slightly curved outward from the corner portion in plan view.
 拡散カバー40は、半導体光源ユニット30を覆って半導体光源ユニット30から離間して設けられている。この拡散カバー40は、回路基板20と対向する位置に設けられ灯具ユニット1の下面を構成する主発光面(主拡散部)41と、主発光面41の周縁からベースプレート10側へ突出する側面(副拡散部)42とを有している。なお、この側面42は主発光面41の厚みよりも薄く形成されている。また、この主発光面41と側面42とのなす角度θは90°以上に設定されている。 The diffusion cover 40 is provided so as to cover the semiconductor light source unit 30 and be separated from the semiconductor light source unit 30. The diffusion cover 40 is provided at a position facing the circuit board 20 and has a main light emitting surface (main diffusion portion) 41 constituting the lower surface of the lamp unit 1, and a side surface protruding from the periphery of the main light emitting surface 41 toward the base plate 10 ( Sub-diffusion part) 42. The side surface 42 is formed thinner than the thickness of the main light emitting surface 41. The angle θ formed by the main light emitting surface 41 and the side surface 42 is set to 90 ° or more.
 図3に示したように、拡散カバー40の側面42の一部には、ベースプレート10側の一部が主発光面41側よりも灯室Sの外側に突出した突出部47が設けられている。また、この突出部47の下面は段差部(取付部)43とされている。この段差部43をTバー200の支持部201に支持させることにより、灯具ユニット1を安定的にシステム天井に取り付けることができる。 As shown in FIG. 3, a part of the side surface 42 of the diffusion cover 40 is provided with a protruding portion 47 in which a part on the base plate 10 side protrudes outside the lamp chamber S from the main light emitting surface 41 side. . Further, the lower surface of the protruding portion 47 is a stepped portion (attachment portion) 43. By supporting the step portion 43 on the support portion 201 of the T-bar 200, the lamp unit 1 can be stably attached to the system ceiling.
 図5は図1のV-V線矢視断面図である。図5に示したように、拡散カバー40の突出部47の形成されていない部位では、拡散カバー40の上方の端部45がベースプレート10と平行に外側に延びている。ベースプレート10と拡散カバー40の端部45とをクリップ60で挟み込むことにより、拡散カバー40がベースプレート10に固定されている。 FIG. 5 is a cross-sectional view taken along line VV in FIG. As shown in FIG. 5, at the portion where the protrusion 47 of the diffusion cover 40 is not formed, the upper end 45 of the diffusion cover 40 extends outward in parallel with the base plate 10. The diffusion cover 40 is fixed to the base plate 10 by sandwiching the base plate 10 and the end portion 45 of the diffusion cover 40 with the clip 60.
 図5に示したように、回路基板20の上には、格子状に配列されたLED素子(半導体光源)31と、LED素子31を覆うように形成されたレンズ(レンズ部材)32とを備える半導体光源ユニット30が搭載されている。本実施形態ではLED素子31として、従来の蛍光灯に近い色合いの白色光を出射するものが採用されている。なお、LED(Light Emitting Diode)素子に代えてLD(Laser Diode)素子を採用してもよい。 As shown in FIG. 5, an LED element (semiconductor light source) 31 arranged in a lattice shape and a lens (lens member) 32 formed so as to cover the LED element 31 are provided on the circuit board 20. A semiconductor light source unit 30 is mounted. In this embodiment, the LED element 31 that emits white light having a color similar to that of a conventional fluorescent lamp is employed. Note that an LD (Laser Diode) element may be employed instead of the LED (Light Emitting Diode) element.
 LED素子31を覆うレンズ32は、LED素子31からの光を屈折させて広範囲に光を出射させる。より具体的には、レンズ32によって屈折された光が、拡散カバー40のうち、光が出射されたLED素子31に隣接するLED素子31に対向し光軸Ax上に位置する領域48に入射するように、レンズ32が形成されている。これにより、拡散カバー40の主発光面41にはLED素子31からの光が広がった状態で入射することになり、主発光面41が均一に発光する。これについて次に詳しく説明する。 The lens 32 covering the LED element 31 refracts the light from the LED element 31 and emits light over a wide range. More specifically, the light refracted by the lens 32 enters the region 48 of the diffusion cover 40 that faces the LED element 31 adjacent to the LED element 31 from which the light is emitted and is positioned on the optical axis Ax. Thus, the lens 32 is formed. Thereby, the light from the LED element 31 enters the main light emitting surface 41 of the diffusion cover 40 in a spread state, and the main light emitting surface 41 emits light uniformly. This will be described in detail below.
<薄型化係数T>
 図6は、図5と同様の図であり、薄型化係数Tを説明するための図である。図6に示すように、半導体光源ユニット30は、互いの離間間隔d[mm]が、半導体光源ユニット30から拡散カバー40までの離間距離h[mm]に対して、薄型化係数T=h/dが0.4≦T≦1.0以下を満たすように形成されている。また、本実施形態では、一例として離間間隔dを40[mm]、離間距離hを20[mm]とし、薄型化係数Tが0.5に設定されている。
<Thinning factor T>
FIG. 6 is a diagram similar to FIG. 5 and is a diagram for explaining the thinning coefficient T. As shown in FIG. 6, the semiconductor light source unit 30 has a thinning coefficient T = h / with respect to the separation distance h [mm] from the semiconductor light source unit 30 to the diffusion cover 40. It is formed so that d satisfies 0.4 ≦ T ≦ 1.0. In this embodiment, as an example, the separation distance d is set to 40 [mm], the separation distance h is set to 20 [mm], and the thinning coefficient T is set to 0.5.
 上述のように構成された本実施形態に係る照明器具100によれば、拡散カバー40が半導体光源ユニット30から離間されているので、半導体光源ユニット30から出射された光は、広がった状態で拡散カバー40に入射する。したがって、拡散カバー40に半導体光源ユニット30による光の明暗が生じにくい。 According to the lighting fixture 100 according to the present embodiment configured as described above, since the diffusion cover 40 is separated from the semiconductor light source unit 30, the light emitted from the semiconductor light source unit 30 is diffused in a spread state. Incident on the cover 40. Therefore, the light and darkness of the light by the semiconductor light source unit 30 hardly occurs in the diffusion cover 40.
 また、複数の半導体光源ユニット30は、互いの離間間隔d[mm]が、半導体光源ユニット30から拡散カバー40までの離間距離h[mm]に対して、薄型化係数T=h/dが0.4≦T≦1.0以下を満たすように形成されている。これにより、本実施形態に係る照明器具100は、主発光面を均一に発光させつつ、薄型の形状とすることができる。 In addition, the plurality of semiconductor light source units 30 have a distance d [mm] between each other, and the thinning coefficient T = h / d is 0 with respect to the distance h [mm] from the semiconductor light source unit 30 to the diffusion cover 40. .4 ≦ T ≦ 1.0 or less. Thereby, the lighting fixture 100 which concerns on this embodiment can be made into a thin shape, making a main light emission surface emit light uniformly.
 薄型化係数Tが大きい状態とは、照明器具100の左右方向寸法が大きく半導体光源ユニット30の離間間隔dが広かったり、あるいは、拡散カバー40の高さが低く離間距離hが小さい場合である。つまり、薄型化係数Tが大きいと、照明器具100は扁平になり、照明器具100を薄型化できる。
 その代わりに、半導体光源ユニット30の離間間隔dが広いので、拡散カバー40の主発光面41には半導体光源ユニット30からの光が入射しない領域ができやすく、主発光面41を均一に発光させることが難しい。あるいは、離間距離hが小さいので、半導体光源ユニット30からの光が広がる前に主発光面41に到達しやすく、主発光面41を均一に発光させることが難しい。つまり、薄型化係数Tが大きいほど、主発光面41を均一に発光させることが難しい。
The state where the thinning coefficient T is large is a case where the luminaire 100 is large in the left-right dimension, the separation distance d of the semiconductor light source unit 30 is wide, or the diffusion cover 40 is low and the separation distance h is small. That is, when the thinning coefficient T is large, the lighting fixture 100 becomes flat, and the lighting fixture 100 can be thinned.
Instead, since the separation distance d of the semiconductor light source unit 30 is wide, a region where the light from the semiconductor light source unit 30 does not enter is easily formed on the main light emitting surface 41 of the diffusion cover 40, and the main light emitting surface 41 emits light uniformly. It is difficult. Alternatively, since the separation distance h is small, it is easy to reach the main light emitting surface 41 before the light from the semiconductor light source unit 30 spreads, and it is difficult to cause the main light emitting surface 41 to emit light uniformly. That is, it is difficult to make the main light emitting surface 41 emit light uniformly as the thinning coefficient T increases.
 そこで本発明者らは、薄型化係数Tを用いて様々な形状の照明器具100を検討したところ、薄型化係数Tを0.4以上1.0以下とすると、照明器具100を薄型化しつつ主発光面41を均一に発光させることができることを見出した。 Therefore, the present inventors have examined lighting devices 100 having various shapes using the thinning factor T. When the thinning factor T is set to 0.4 or more and 1.0 or less, the lighting device 100 is mainly thinned. It has been found that the light emitting surface 41 can emit light uniformly.
 薄型化係数Tを0.4よりも小さく設定すると、レンズ32の形状を工夫しても、LED素子31の光を隣接するLED素子31に対向する領域48に入射させるように光を屈折させることが難しい。なお、LED素子31の光を主発光面41のうち隣接するLED素子31に対向する領域48に照射することができないと、光が届きにくい領域ができてしまう。このため、主発光面41を外から見た場合に、それぞれのLED素子31に対向する複数の明るい領域48と、この明るい領域48の間に形成された暗い領域とが視認されてしまう。したがって、主発光面41を均一に発光させるために、薄型化係数Tは0.4以上に設定する。 When the thinning coefficient T is set to be smaller than 0.4, even if the shape of the lens 32 is devised, the light of the LED element 31 is refracted so as to enter the region 48 facing the adjacent LED element 31. Is difficult. In addition, when the light of the LED element 31 cannot be irradiated to the area | region 48 which opposes the adjacent LED element 31 among the main light emission surfaces 41, the area | region where light cannot reach easily will be made. For this reason, when the main light emitting surface 41 is viewed from the outside, a plurality of bright regions 48 facing the LED elements 31 and dark regions formed between the bright regions 48 are visually recognized. Therefore, in order to make the main light emitting surface 41 emit light uniformly, the thinning coefficient T is set to 0.4 or more.
 一方で、薄型化係数Tを大きくするために離間間隔dを小さくすると、拡散カバー40の主発光面41全体を発光させるために要するLED素子31の個数が増大する。そのため、一つの照明器具100に搭載するLED素子31の個数が多くなるため、薄型化係数Tを必要以上に大きくすると、照明器具100のコストが増大する。そこで本発明者らは、薄型化係数Tを1.0よりも大きくしても、主発光面41の輝度の均一性は大きく変わらないことを見出した。このため、照明器具100を薄型化するために薄型化係数Tは1以下に設定する。 On the other hand, if the separation distance d is decreased in order to increase the thinning coefficient T, the number of LED elements 31 required to cause the entire main light emitting surface 41 of the diffusion cover 40 to emit light increases. Therefore, since the number of the LED elements 31 mounted on one lighting fixture 100 increases, if the thinning coefficient T is increased more than necessary, the cost of the lighting fixture 100 increases. Therefore, the present inventors have found that even when the thinning coefficient T is larger than 1.0, the luminance uniformity of the main light emitting surface 41 does not change greatly. For this reason, in order to make the lighting fixture 100 thinner, the thinning factor T is set to 1 or less.
 特に、本実施形態のようにシステム天井に取り付ける照明器具100の場合、照明器具100をシステム天井とTバー200との間の空間に収めるため、照明器具100の高さ寸法をTバー200の高さ寸法よりも小さくすることが好ましい。しかし、システム天井の格子状のパネル空間に隙間無くはめ込まれるように照明器具100の縦横の大きさを設定し、薄型化係数Tを1よりも大きく設定した場合、照明器具100の高さ寸法がTバー200の高さ寸法よりも大きくなる虞がある。このため、特に照明器具100をシステム天井に用いる場合には、薄型化係数Tを1.0以下とすることが好ましい。 In particular, in the case of the lighting fixture 100 attached to the system ceiling as in the present embodiment, the height dimension of the lighting fixture 100 is set to the height of the T bar 200 in order to fit the lighting fixture 100 in the space between the system ceiling and the T bar 200. It is preferable to make it smaller than the size. However, when the vertical and horizontal sizes of the lighting fixture 100 are set so as to fit in the grid-like panel space of the system ceiling without any gap, and the thinning factor T is set larger than 1, the height dimension of the lighting fixture 100 is There is a concern that the height dimension of the T-bar 200 may be larger. For this reason, when using the lighting fixture 100 for a system ceiling especially, it is preferable to make the thinning coefficient T into 1.0 or less.
 以上のように、薄型化係数Tを0.4以上1.0以下に設定すると、できるだけ少ない半導体光源ユニット30で主発光面41を均一に光らせ、かつ、できるだけ薄型の照明器具100を提供することができる。 As described above, when the thinning coefficient T is set to 0.4 or more and 1.0 or less, the main light emitting surface 41 is uniformly illuminated with as few semiconductor light source units 30 as possible, and the lighting apparatus 100 that is as thin as possible is provided. Can do.
 なお、半導体光源ユニット30の離間間隔dは30mm≦d≦90mmとすることが好ましい。離間間隔dが30mmより短いと、システム天井用等の大型の照明器具100を構成するために要する半導体光源ユニット30の個数が多くなり、コストが嵩む。また、離間間隔dが90mmより長いと、薄型化係数Tを所定範囲内に収めても、照明器具100の厚みが大きくなりシステム天井に取り付けられなくなることがある。 In addition, it is preferable that the separation interval d of the semiconductor light source unit 30 is 30 mm ≦ d ≦ 90 mm. If the separation distance d is shorter than 30 mm, the number of the semiconductor light source units 30 required for configuring the large luminaire 100 for a system ceiling or the like increases, and the cost increases. In addition, when the separation distance d is longer than 90 mm, even if the thinning factor T is within a predetermined range, the thickness of the lighting fixture 100 may be increased and may not be attached to the system ceiling.
 また、半導体光源ユニット30から拡散カバー40までの離間距離hは20mm≦h≦50mmとすることが好ましい。離間距離hが20mmより短いと、LED素子31からの光が拡散するまえに拡散カバー40の主発光面41に到達してしまい、主発光面41に明暗が生じる虞がある。また、離間距離hが50mmより長いと、Tバー200の高さ寸法よりも大きくなりシステム天井に取り付けられなくなる虞がある。 Further, the separation distance h from the semiconductor light source unit 30 to the diffusion cover 40 is preferably 20 mm ≦ h ≦ 50 mm. If the separation distance h is shorter than 20 mm, the light from the LED element 31 reaches the main light emitting surface 41 of the diffusion cover 40 before the light is diffused, and the main light emitting surface 41 may be bright and dark. In addition, if the separation distance h is longer than 50 mm, it may be larger than the height dimension of the T-bar 200 and cannot be attached to the system ceiling.
<離間距離A,Bの関係>
 ところで、半導体発光素子から出射される光は指向性が高いため、光軸方向に光が集中し、側方へ出射される光の量が少ない。このため、天井に取り付けられる照明器具の光源として半導体発光素子を用いた場合、照明器具の下方のみが明るく照らされる。その結果、例えば使用者の机の上には、もっぱら上方から光が照射され、側方から回り込む光が少ない。このため、使用者は部屋全体が暗く感じられたり、あるいは手元が暗く感じたりする。
 そこで本実施形態に係る照明器具100によれば、図1および図5に示したように、各々の半導体光源ユニット30は、平面視において最外縁に位置するLED素子31aと側面42との離間距離Aが、複数のLED素子31の互いの離間距離Bよりも小さくなるように、配置されている。上述したように、LED素子31の互いの離間距離Bは、LED素子31から出射された光が隣接するLED素子31の光軸Ax上に位置する領域48に入射するように設定されている。したがって、最外縁に位置するLED素子31aから出射された光は確実に側面42に入射する。
 なお、最外縁に位置するLED素子31aと側面42との離間距離Aが、LED素子31の互いの離間距離Bよりも大きいと、最外縁に位置するLED素子31aからの光のほぼ全てが主発光面41に入射してしまい、側面42に入射されない。
<Relationship between distances A and B>
By the way, since the light emitted from the semiconductor light emitting element has high directivity, the light is concentrated in the optical axis direction, and the amount of light emitted to the side is small. For this reason, when a semiconductor light emitting element is used as a light source of a lighting fixture attached to the ceiling, only the lower part of the lighting fixture is illuminated brightly. As a result, for example, light is irradiated from above exclusively on the user's desk, and there is little light that wraps around from the side. For this reason, the user feels that the whole room is dark or the hand feels dark.
Therefore, according to the luminaire 100 according to the present embodiment, as shown in FIGS. 1 and 5, each semiconductor light source unit 30 is separated from the LED element 31 a located on the outermost edge in a plan view and the side surface 42. It arrange | positions so that A may become smaller than the mutual separation distance B of the some LED element 31. FIG. As described above, the distance B between the LED elements 31 is set so that the light emitted from the LED elements 31 enters the region 48 located on the optical axis Ax of the adjacent LED elements 31. Therefore, the light emitted from the LED element 31 a located at the outermost edge surely enters the side surface 42.
When the distance A between the LED element 31a located at the outermost edge and the side surface 42 is larger than the distance B between the LED elements 31, almost all of the light from the LED element 31a located at the outermost edge is mainly used. The light is incident on the light emitting surface 41 and is not incident on the side surface 42.
 上述のように構成された本実施形態に係る照明器具100によれば、照明器具100の側方に位置する側面42から積極的に光を出射させることができる。これにより、使用者に対して上方からのみならず、側方から回り込むように光を入射させることができる。このため、使用者の手元を確実に照らすことができると共に天井面や壁も照らすことができ、使用者が明るく感じる照明器具100を提供することができる。 According to the lighting fixture 100 according to the present embodiment configured as described above, light can be actively emitted from the side surface 42 located on the side of the lighting fixture 100. Thereby, it is possible to make light incident on the user not only from above but also from the side. For this reason, while being able to illuminate a user's hand reliably and a ceiling surface and a wall, the lighting fixture 100 which a user feels bright can be provided.
 なお、図1に示したように、最外縁に位置しないLED素子31bに対向する主発光面41の領域には、LED素子31bとこれを囲む合計9個のLED素子31bからの光が入射する。ところが、側面42のある領域42aには、最外縁に位置するLED素子31aとその両隣の合計3個のLED素子31aからの光が入射する。つまり、側面42への光の入射量は主発光面41への光の入射量よりも少ない。
 しかし、本実施形態に係る照明器具100によれば、側面42の厚みが主発光面41の厚みよりも薄く形成されており、側面42の光透過率が主発光面41の光透過率よりも高く設定されている。このため、側面42から外部へ効率よく光を出射し、側方へ回り込む光を多くすることができる。
As shown in FIG. 1, light from the LED element 31b and a total of nine LED elements 31b surrounding the LED element 31b is incident on the region of the main light emitting surface 41 facing the LED element 31b that is not located at the outermost edge. . However, light from the LED element 31a located at the outermost edge and a total of three LED elements 31a on both sides thereof enters the region 42a where the side surface 42 is present. That is, the amount of light incident on the side surface 42 is smaller than the amount of light incident on the main light emitting surface 41.
However, according to the lighting fixture 100 according to the present embodiment, the thickness of the side surface 42 is formed thinner than the thickness of the main light emitting surface 41, and the light transmittance of the side surface 42 is larger than the light transmittance of the main light emitting surface 41. It is set high. For this reason, light can be efficiently emitted from the side surface 42 to the outside, and the amount of light that goes around to the side can be increased.
 また、拡散カバー40の主発光面41と側面42とのなす角度が90°以上とされている。これにより照明器具100の左右方向の寸法がベースプレート10側から主発光面41側に向かって同等または小さくされている。灯具ユニット1のTバー200への取り付けは、複数のTバー200で囲まれた空間に上方から灯具ユニット1を下降させ、灯具ユニット1の段差部43をTバー200の支持部201に当接させることにより行う。灯具ユニット1の形状が下方に向かって小さくされているので、複数のTバー200で囲まれた空間に上方から灯具ユニット1を下降させやすく、Tバー200への取り付けが容易となる。
 また、拡散カバー40は樹脂の一体成形で形成されるため、拡散カバー40の内側表面40bを形成する金型を広く開口した上面の開口から抜きやすく、また、成型された拡散カバーの金型からの取り出しも容易である。
The angle formed between the main light emitting surface 41 and the side surface 42 of the diffusion cover 40 is 90 ° or more. Thereby, the dimension of the left-right direction of the lighting fixture 100 is made equal or small toward the main light emission surface 41 side from the baseplate 10 side. The lamp unit 1 is attached to the T-bar 200 by lowering the lamp unit 1 from above into a space surrounded by a plurality of T-bars 200 and bringing the stepped portion 43 of the lamp unit 1 into contact with the support portion 201 of the T-bar 200. To do. Since the shape of the lamp unit 1 is reduced downward, the lamp unit 1 can be easily lowered from above into a space surrounded by the plurality of T bars 200, and attachment to the T bar 200 is facilitated.
Further, since the diffusion cover 40 is formed by integral molding of the resin, it is easy to remove the mold that forms the inner surface 40b of the diffusion cover 40 from the opening on the upper surface that is wide open, and from the mold of the molded diffusion cover It is easy to take out.
 また、本実施形態に係る照明器具100は、半導体光源ユニット30が拡散カバー40の側面42の近傍まで設けられているので、主発光面41の縁部を含む全体が均一に発光する。また、拡散カバー40の大きさは、システム天井のパネル空間に隙間無く嵌めこまれるように設定されているため、パネル空間の下面全体が発光するように見える。そこで、システム天井の天井ボードと照明器具100の主発光面41とが連続するように照明器具100の段差部43から主発光面41までの長さを設定することにより、フラットな天井の一部分が発光しているように見せることができる。これにより、システム天井全体の美観を高めることができる。 Further, in the lighting fixture 100 according to the present embodiment, since the semiconductor light source unit 30 is provided up to the vicinity of the side surface 42 of the diffusion cover 40, the entire light including the edge of the main light emitting surface 41 emits light uniformly. Further, since the size of the diffusion cover 40 is set so as to be fitted in the panel space of the system ceiling without any gap, it seems that the entire lower surface of the panel space emits light. Therefore, by setting the length from the stepped portion 43 of the lighting fixture 100 to the main light emitting surface 41 so that the ceiling board of the system ceiling and the main light emitting surface 41 of the lighting fixture 100 are continuous, a part of the flat ceiling is formed. It can appear as if it is emitting light. Thereby, the aesthetics of the whole system ceiling can be improved.
 また、拡散カバー40の外側表面40aを表面粗さが数μm程度の微小凹凸が形成された梨地面としてもよい。これにより、拡散カバー40の外側表面40aで半導体光源ユニット30からの光を拡散しながら外部に出射することができると共に、周辺物体への映り込みを防止することができる。また、これによりシステム天井の天井ボードと質感を共通させることができる。このため、照明器具100を消灯している場合に、天井ボードと照明器具100とが一体感を持つように見え、システム天井全体の美観を高めることができる。 Alternatively, the outer surface 40a of the diffusion cover 40 may be a satin surface on which minute irregularities having a surface roughness of about several μm are formed. Thereby, the light from the semiconductor light source unit 30 can be emitted to the outside while diffusing the light from the outer surface 40a of the diffusion cover 40, and reflection on a peripheral object can be prevented. In addition, this makes it possible to share the texture with the ceiling board of the system ceiling. For this reason, when the lighting fixture 100 is turned off, the ceiling board and the lighting fixture 100 appear to have a sense of unity, and the aesthetics of the entire system ceiling can be enhanced.
 また、拡散カバー40の内側表面40bは表面が滑らかな光沢面としてもよい。これにより、拡散カバー40の入射角が大きい光を内側表面40bで積極的に反射し、この反射光を回路基板20の表面などで反射させることで、再び拡散カバー40に入射させることができる。半導体光源ユニット30からの光ができるだけ外部に出射させることで、照明器具100の光の利用効率を向上させることができる。 The inner surface 40b of the diffusion cover 40 may be a glossy surface with a smooth surface. Accordingly, light having a large incident angle of the diffusion cover 40 is positively reflected by the inner surface 40b, and the reflected light is reflected by the surface of the circuit board 20 or the like, so that it can be incident on the diffusion cover 40 again. By using the light from the semiconductor light source unit 30 to be emitted to the outside as much as possible, the light use efficiency of the lighting fixture 100 can be improved.
 また、本実施形態では、図1に示したように、1つの回路基板20上に25個の半導体光源ユニット30が格子状に配列されており、9個の回路基板20がベースプレート10に取り付けられている。これとは逆に、単一の回路基板で照明器具を構成した場合には、1つの半導体光源ユニットが故障した場合には、全ての半導体光源ユニットが搭載された回路基板ごと交換する必要がある。しかし、本実施形態に係る照明器具100は、回路基板20が複数個に分割されているので、故障した半導体光源ユニット30が搭載されている回路基板20のみを交換すればよい。したがって、本実施形態に係る照明器具100によれば、メインテナンス費用を軽減することができる。 In the present embodiment, as shown in FIG. 1, 25 semiconductor light source units 30 are arranged in a grid pattern on one circuit board 20, and nine circuit boards 20 are attached to the base plate 10. ing. On the other hand, when a lighting fixture is configured with a single circuit board, if one semiconductor light source unit fails, it is necessary to replace the entire circuit board on which all the semiconductor light source units are mounted. . However, in the luminaire 100 according to this embodiment, since the circuit board 20 is divided into a plurality of parts, only the circuit board 20 on which the failed semiconductor light source unit 30 is mounted needs to be replaced. Therefore, according to the lighting fixture 100 which concerns on this embodiment, a maintenance cost can be reduced.
<システム天井への取付方法>
 以上のように構成される照明器具100は、次のようにしてシステム天井に取り付けられる。まず、灯具側コネクタ5aを電源側コネクタ5bから分離し、灯具ユニット1と電源ユニット3とを分離する。分離された電源ユニット3を、システム天井に設置する。
<Mounting method on system ceiling>
The lighting fixture 100 comprised as mentioned above is attached to a system ceiling as follows. First, the lamp side connector 5a is separated from the power source side connector 5b, and the lamp unit 1 and the power source unit 3 are separated. The separated power supply unit 3 is installed on the system ceiling.
 電源ユニット3は天井裏に取り付けても良いし、梁やTバー200に取り付けても良い。電源ユニット3をシステム天井に取り付ける際に、外部電源4と電源ユニット3とを電気的に接続する。外部電源4と電源ユニット3とを接続する際には、外部電源4から延びている比較的高出力の電力が供給されているケーブル4aを取り扱うため、電気工事の専門業者が施工する。 The power supply unit 3 may be attached to the back of the ceiling, or may be attached to a beam or a T-bar 200. When the power supply unit 3 is attached to the system ceiling, the external power supply 4 and the power supply unit 3 are electrically connected. When connecting the external power supply 4 and the power supply unit 3, a specialist in electric construction works to handle the cable 4 a that is supplied with relatively high output power extending from the external power supply 4.
 次に、電源ユニット3から分離された灯具ユニット1をTバー200に取り付ける。具体的には、灯具ユニット1をTバー200の上方からTバー200の支持部201に向かって下降させ、拡散カバー40の側面42に設けられた段差部43を支持部201に載せる。次に、灯具側コネクタ5aと電源側コネクタ5bとを接続し、灯具ユニット1と電源ユニット3とを電気的に接続し、照明器具100のシステム天井への取付が完了する。 Next, the lamp unit 1 separated from the power supply unit 3 is attached to the T bar 200. Specifically, the lamp unit 1 is lowered from above the T bar 200 toward the support portion 201 of the T bar 200, and the stepped portion 43 provided on the side surface 42 of the diffusion cover 40 is placed on the support portion 201. Next, the lamp-side connector 5a and the power supply-side connector 5b are connected, the lamp unit 1 and the power supply unit 3 are electrically connected, and the attachment of the lighting fixture 100 to the system ceiling is completed.
 このように、灯具ユニット1のTバー200への取付作業およびコネクタ5の接続は、外部電源4の高出力の電力が供給されているケーブル4aを取り扱う必要がない。このため、電気工事の専門業者による施工が必要ないので、通常の内装工事を取り扱う業者が施工できる。したがって、システム天井へ天井パネルなどを取り付ける内装工事の時に、内装工事の業者が灯具ユニット1をシステム天井に取り付けることができる。 Thus, the attachment work of the lamp unit 1 to the T-bar 200 and the connection of the connector 5 do not require handling of the cable 4a to which the high output power of the external power supply 4 is supplied. For this reason, since the construction by a specialist in electrical work is not necessary, a trader who handles normal interior work can construct it. Therefore, at the time of interior construction for attaching a ceiling panel or the like to the system ceiling, the interior construction contractor can attach the lamp unit 1 to the system ceiling.
 なお、従来のように照明器具に電源ユニットが内蔵されており、外部電源から延びるケーブルを照明器具に引き込んで接続する場合は、照明器具をシステム天井に取り付けた状態で、照明器具と外部電源とを接続する必要がある。この場合は、照明器具をシステム天井に取り付けた後に、狭い天井裏空間に電気工事の業者が入り込んで電気工事を行う必要があり、作業効率が悪かった。また、照明器具を取り付けた後に電気工事を行うため、天井裏の配線を行ってから天井パネルを設置する通常の天井工事とスケジュールを合わせ難かった。 In addition, the lighting unit has a built-in power supply unit as in the past, and when the cable extending from the external power source is pulled into the lighting fixture and connected, the lighting fixture and the external power source are connected to the system ceiling. Need to be connected. In this case, it was necessary to install an illuminating device on the ceiling of the system, and then an electrical contractor entered the narrow ceiling space to perform the electrical work, resulting in poor work efficiency. In addition, since the electrical work was performed after the lighting fixture was installed, it was difficult to match the schedule with the usual ceiling work in which the ceiling panel was installed after wiring the ceiling.
 しかし、本実施形態に係る照明器具100は、上述の如く、電源ユニット3をシステム天井に取り付ける作業と、灯具ユニット1をシステム天井に取り付ける作業とが分離されている。したがって、電源ユニット3を取り付ける作業は、灯具ユニット1をシステム天井に取り付ける前に行うことができる。これにより、電気工事は灯具ユニット1が取り付けられていない広い作業空間を使って行うことができるので、作業効率が良い。 However, in the lighting fixture 100 according to the present embodiment, as described above, the work of attaching the power supply unit 3 to the system ceiling and the work of attaching the lamp unit 1 to the system ceiling are separated. Therefore, the operation of attaching the power supply unit 3 can be performed before attaching the lamp unit 1 to the system ceiling. As a result, the electrical work can be performed using a wide work space in which the lamp unit 1 is not attached, so that work efficiency is good.
 また、内装工事の業者が灯具ユニット1をシステム天井に取り付ける時、電源ユニット3と外部電源4との接続が完了しているため、コネクタ5を接続するだけで照明器具100のシステム天井への設置を完了させることができる。このように、内装工事における作業が簡単であるため、内装工事の業者は、例えば、天井パネル等の取付作業にあわせて灯具ユニット1をシステム天井に取り付けることができる。 Further, when the interior construction company attaches the lamp unit 1 to the system ceiling, since the connection between the power supply unit 3 and the external power supply 4 has been completed, the lighting fixture 100 can be installed on the system ceiling simply by connecting the connector 5. Can be completed. Thus, since the work in the interior work is simple, a contractor of the interior work can attach the lamp unit 1 to the system ceiling in accordance with the work of attaching the ceiling panel or the like, for example.
 また、例えば、電源ユニット3の取付および外部電源4との接続は、空調設備の配線やLAN配線などの天井裏の電気工事をする時に、合わせて行うことができる。また、上述したように灯具ユニット1の取付工事を天井パネルの取付工事と同時に行うことができる。つまり、照明器具100の取付工事と天井パネルの取付工事とを別々に施工する必要がないので、照明器具100の取付作業を他の天井工事のスケジュールに合わせやすく、工期を短縮することができる。 Also, for example, the attachment of the power supply unit 3 and the connection with the external power supply 4 can be performed together when performing electrical work on the back of the ceiling such as wiring of an air conditioning facility or LAN wiring. Further, as described above, the installation work of the lamp unit 1 can be performed simultaneously with the installation work of the ceiling panel. That is, since it is not necessary to perform the installation work of the lighting fixture 100 and the installation work of the ceiling panel separately, the installation work of the lighting fixture 100 can be easily matched with the schedule of other ceiling constructions, and the construction period can be shortened.
 灯具ユニット1の拡散カバー40の側面42ハウジング10Aは、平面視で側面の中央部が角部よりも外側に突出するように湾曲した形状とされている。したがって、地震などによって、Tバー200が取り囲む矩形状のパネル空間がゆがんだ場合でも、灯具ユニット1の角部に応力が集中せず、照明器具100が破損することを抑制することができる。また、灯具ユニット1がパネル空間内の所定位置からずれても、灯具ユニット1の少なくとも一部が常にTバー200に接触するので、Tバー200は灯具ユニット1を支持し続けることができる。 The side wall housing 10A of the diffusion cover 40 of the lamp unit 1 has a curved shape so that the center portion of the side surface protrudes outward from the corner portion in plan view. Therefore, even when the rectangular panel space surrounded by the T-bar 200 is distorted due to an earthquake or the like, stress is not concentrated on the corners of the lamp unit 1, and the lighting apparatus 100 can be prevented from being damaged. Even if the lamp unit 1 is displaced from a predetermined position in the panel space, at least a part of the lamp unit 1 always contacts the T bar 200, so that the T bar 200 can continue to support the lamp unit 1.
(第二実施形態)
 なお、上述の第一実施形態では、板状のベースプレート10に箱型形状の拡散カバー40を組み合わせた例を挙げて説明したが、本発明はこの例に限られない。図7は、本発明の第二実施形態に係る照明器具100Aの灯具ユニット1Aの部分断面図である。
(Second embodiment)
In the first embodiment described above, an example in which the box-shaped diffusion cover 40 is combined with the plate-like base plate 10 has been described. However, the present invention is not limited to this example. FIG. 7 is a partial cross-sectional view of the lamp unit 1A of the lighting fixture 100A according to the second embodiment of the present invention.
 図7に示したように、ハウジング10Aは照明器具100Aの上面を構成する金属製の部材である。ハウジング10Aは下面が開口した箱型形状の部材である。ハウジング10Aは、底板(支持板部)11と、側壁(側壁部)12とを有している。側壁12は拡散カバー40側に延びるように底板11から折り曲げられている。この側壁12は、少なくともレンズ32と同じ高さまで底板11から延出している。このハウジング10Aの内側空間S1に半導体光源ユニット30が搭載された回路基板20が収容されている。 As shown in FIG. 7, the housing 10A is a metal member that constitutes the upper surface of the lighting fixture 100A. The housing 10A is a box-shaped member having an open bottom surface. The housing 10 </ b> A has a bottom plate (support plate portion) 11 and side walls (side wall portions) 12. The side wall 12 is bent from the bottom plate 11 so as to extend to the diffusion cover 40 side. The side wall 12 extends from the bottom plate 11 to at least the same height as the lens 32. The circuit board 20 on which the semiconductor light source unit 30 is mounted is accommodated in the inner space S1 of the housing 10A.
 照明器具100Aの側面のうち、最外縁のLED素子31aとの離間距離が短いLED素子31aの真横近傍は、拡散カバー40の側面42ではなく、遮光性のハウジング10Aの側壁12で覆われている。このように、側面42は最外縁のLED素子31aからある程度離間距離の長い領域に配置されているので、LED素子31aから広がった光が側面42に入射する。つまり、側面42には最外縁のLED素子31aから広がった光が入射されるので、明暗が生じにくい。このため、側面42が均一に発光し、側方からの見栄えの良い照明器具100Aを提供することができる。 Of the side surface of the luminaire 100A, the portion near the side of the LED element 31a having a short distance from the outermost LED element 31a is covered with the side wall 12 of the light-shielding housing 10A, not the side surface 42 of the diffusion cover 40. . Thus, since the side surface 42 is disposed in a region having a certain distance from the outermost LED element 31a, the light spread from the LED element 31a is incident on the side surface 42. In other words, since the light spread from the outermost LED element 31a is incident on the side surface 42, it is difficult for light and dark to occur. For this reason, the side surface 42 emits light uniformly, and it is possible to provide the lighting apparatus 100A with a good appearance from the side.
 また、最外縁のLED素子31aの真横近傍に位置する側壁12を反射面で形成することにより、最外縁のLED素子31aの光を拡散カバー40の主発光面41に反射することができる。これにより、照明器具100Aの光の利用効率を高めることができる。 Further, by forming the side wall 12 located in the vicinity of the right side of the outermost LED element 31a with a reflecting surface, the light of the outermost LED element 31a can be reflected to the main light emitting surface 41 of the diffusion cover 40. Thereby, the utilization efficiency of the light of 100 A of lighting fixtures can be improved.
 また、ハウジング10Aの底板11には、拡散カバー40側に突出された凸部13が形成されており、この凸部13には係止孔15が設けられている。また、回路基板20にも貫通孔21が設けられている。ハウジング10Aの係止孔15および回路基板20の貫通孔21にリベット51を挿通することで、回路基板20がハウジング10Aに固定されている。これにより、回路基板20はハウジング10Aの凸部13に接触した状態で、ハウジング10Aに固定されている。 Further, the bottom plate 11 of the housing 10A is formed with a convex portion 13 protruding toward the diffusion cover 40, and the convex portion 13 is provided with a locking hole 15. The circuit board 20 is also provided with a through hole 21. The circuit board 20 is fixed to the housing 10A by inserting the rivets 51 through the locking holes 15 of the housing 10A and the through holes 21 of the circuit board 20. Thereby, the circuit board 20 is being fixed to the housing 10A in the state which contacted the convex part 13 of 10A of housings.
 ハウジング10Aの凸部13によって回路基板20とハウジング10Aの底板11との間に空間S2が設けられている。そこで、回路基板20の半導体光源ユニット30から延びる電気配線33を、この空間S2に這わせている。これにより、半導体光源ユニット30から延びる電気配線33を、ハウジング10A側に簡単に取り出すことができる。 A space S2 is provided between the circuit board 20 and the bottom plate 11 of the housing 10A by the convex portion 13 of the housing 10A. Therefore, the electrical wiring 33 extending from the semiconductor light source unit 30 of the circuit board 20 is placed in this space S2. Thereby, the electrical wiring 33 extended from the semiconductor light source unit 30 can be easily taken out to the housing 10A side.
<下面全体の発光>
 拡散カバー40の側面42の上端には、収容空間Sから外側側方に張り出したカバー側フランジ部(第二フランジ部)46が設けられている。また、このカバー側フランジ部46と対向するように、ハウジング10Aの側壁12の下端にも、収容空間Sの外側側方に張り出したハウジング側フランジ部(第一フランジ部)14が設けられている。このカバー側フランジ部46とハウジング側フランジ部14とが重ね合わされた状態で、カバー側フランジ部46とハウジング側フランジ部14とがTバー200の支持部201に支持されている。
<Light emission of the entire bottom surface>
At the upper end of the side surface 42 of the diffusion cover 40, a cover side flange portion (second flange portion) 46 that protrudes outward from the accommodation space S is provided. Further, a housing-side flange portion (first flange portion) 14 projecting outward from the housing space S is also provided at the lower end of the side wall 12 of the housing 10A so as to face the cover-side flange portion 46. . In a state where the cover side flange portion 46 and the housing side flange portion 14 are overlapped, the cover side flange portion 46 and the housing side flange portion 14 are supported by the support portion 201 of the T-bar 200.
 また、ハウジング側フランジ部14はカバー側フランジ部46にかしめられ、カバー側フランジ部46の外郭形状に沿って折り曲げられている。これにより拡散カバー40はハウジング10Aにかしめ固定されている。なお、かしめに必要な強度を確保するために、拡散カバー40の厚み(外周縁の厚み)は2mm以上とすることが好ましい。このように、ハウジング側フランジ部14をかしめることにより、灯室Sを密閉することができる。これにより、灯室Sに埃や虫が侵入することを防止できる。 The housing side flange portion 14 is caulked to the cover side flange portion 46 and is bent along the outline shape of the cover side flange portion 46. As a result, the diffusion cover 40 is caulked and fixed to the housing 10A. In addition, in order to ensure the strength required for caulking, the thickness of the diffusion cover 40 (the thickness of the outer peripheral edge) is preferably 2 mm or more. Thus, the lamp chamber S can be sealed by caulking the housing side flange portion 14. Thereby, it is possible to prevent dust and insects from entering the lamp chamber S.
 以上のように構成される本実施形態に係る照明器具100Aによれば、拡散カバー40は箱型形状に形成されているので、その主発光面41と側面42との境界にあたる稜線44も発光させることができる。これにより、灯具ユニット1Aの下面全体が発光するように見える。特にパネル型照明器具には、天井ボードと照明器具の発光面とを一体的に見せたいというデザイン上の要請がある。本実施形態に係る照明器具100Aによれば、拡散カバーの下面の外周が枠などで覆われておらず、拡散カバー40の下面の外周、特に稜線44が外部に露出されている。このため、照明器具100Aの下面全体を発光させることができ、意匠性の高い照明器具を提供することができる。 According to the lighting fixture 100A according to the present embodiment configured as described above, since the diffusion cover 40 is formed in a box shape, the ridge line 44 corresponding to the boundary between the main light emitting surface 41 and the side surface 42 also emits light. be able to. Thereby, it seems that the whole lower surface of the lamp unit 1A emits light. In particular, panel-type lighting fixtures have a design requirement to show the ceiling board and the light-emitting surface of the lighting fixture as one body. According to the lighting fixture 100A according to the present embodiment, the outer periphery of the lower surface of the diffusion cover is not covered with a frame or the like, and the outer periphery of the lower surface of the diffusion cover 40, in particular, the ridge line 44 is exposed to the outside. For this reason, the whole lower surface of 100 A of lighting fixtures can be light-emitted, and a lighting fixture with high designability can be provided.
 また、ハウジング側フランジ部14は折り曲げられており、強度が向上されている。したがって、照明器具100Aの強度が高い部位でTバー200の支持部201と当接させ、照明器具100Aを支持している。このため、地震などでシステム天井に振動が加わった場合でも、確実に照明器具100Aを支持し続けることができる。 Also, the housing side flange portion 14 is bent and the strength is improved. Therefore, the lighting fixture 100A is supported by contacting the supporting portion 201 of the T-bar 200 at a portion where the strength of the lighting fixture 100A is high. For this reason, even when vibration is applied to the system ceiling due to an earthquake or the like, the lighting apparatus 100A can be reliably supported.
 また、回路基板20のLED素子を搭載した搭載面20aからその裏面20bへと貫通する貫通電極16を設けてもよい。さらに、回路基板20の裏面に、貫通電極16からの熱が伝導されその表面から放熱が可能な放熱膜17を設けてもよい。 Further, a through electrode 16 penetrating from the mounting surface 20a on which the LED element of the circuit board 20 is mounted to the back surface 20b may be provided. Furthermore, a heat radiation film 17 that conducts heat from the through electrode 16 and can radiate heat from the front surface may be provided on the back surface of the circuit board 20.
 貫通電極16により、LED素子で発生した熱を裏面20b側へと導き、放熱膜17からこの熱を効率的に放熱することができる。これにより、LED素子31で発生した熱を放熱するための放熱フィンなどのヒートシンクを別途設ける必要がない。したがって、LED素子31の冷却性が高く、小型の照明器具100Aを提供することができる。なお、放熱膜17には銅やアルミニウム膜などの金属膜を用いることができる。また、放熱膜を回路基板20の裏面20b側の配線として利用してもよい。 Through the through electrode 16, the heat generated in the LED element can be guided to the back surface 20 b side, and this heat can be efficiently radiated from the heat radiation film 17. Thereby, it is not necessary to separately provide a heat sink such as a heat radiating fin for radiating the heat generated in the LED element 31. Therefore, the cooling property of the LED element 31 is high, and a small lighting fixture 100A can be provided. For the heat dissipation film 17, a metal film such as a copper or aluminum film can be used. Further, the heat dissipation film may be used as wiring on the back surface 20b side of the circuit board 20.
 以上、本発明をその実施形態を用いて説明したが、本発明の技術的範囲は上記実施形態に記載の範囲には限定されない。上記実施形態に多様な変更または改良を加えることができることは、当業者にとって明らかである。 As mentioned above, although this invention was demonstrated using the embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications and improvements can be made to the above-described embodiment.
 上述の説明ではシステム天井用の照明器具を例に挙げて説明したが、本発明は面発光型で薄型の、例えばリビング用の照明器具に適用することができる。 In the above description, the lighting device for the system ceiling has been described as an example. However, the present invention can be applied to a surface-emitting type and thin lighting device, for example, a living room.
 また、上述したLED素子の個数、回路基板の個数は一例であって、本発明はこれらの個数に限定されることはない。 In addition, the number of LED elements and the number of circuit boards described above are examples, and the present invention is not limited to these numbers.
 本出願は、2012年3月9日出願の日本特許出願(特願2012-053356)、2012年3月9日出願の日本特許出願(特願2012-053359)、2012年3月9日出願の日本特許出願(特願2012-053363)、2012年3月9日出願の日本特許出願(特願2012-053364)に基づくものであり、その内容はここに参照として取り込まれる。 This application consists of a Japanese patent application filed on March 9, 2012 (Japanese Patent Application 2012-053356), a Japanese patent application filed on March 9, 2012 (Japanese Patent Application 2012-053359), and an application filed on March 9, 2012. This is based on a Japanese patent application (Japanese Patent Application No. 2012-053363) and a Japanese patent application filed on March 9, 2012 (Japanese Patent Application No. 2012-053364), the contents of which are incorporated herein by reference.
 本発明によれば、
 本発明によれば、指向性の高い半導体発光素子が光源に採用された照明器具であって、厚みが薄く均一に発光する照明器具を提供することができる。
According to the present invention,
ADVANTAGE OF THE INVENTION According to this invention, it is a lighting fixture by which the semiconductor light emitting element with high directivity was employ | adopted for the light source, Comprising: The thickness which is thin and can light-emit uniformly can be provided.
100,100A:照明器具、1:灯具ユニット、2:電源ケーブル、10:ベースプレート、20:回路基板、30:半導体光源ユニット、31:LED素子、32:レンズ、40:拡散カバー、41:主拡散面、42:副拡散面、43:段差部、40a:外側表面、40b:内側表面、46:端部、47:突出部、50:ファスナ、60:クリップ、S:灯室、100:Tバー、101:支持部
 
100, 100A: lighting fixture, 1: lamp unit, 2: power cable, 10: base plate, 20: circuit board, 30: semiconductor light source unit, 31: LED element, 32: lens, 40: diffusion cover, 41: main diffusion Surface, 42: sub-diffusion surface, 43: stepped portion, 40a: outer surface, 40b: inner surface, 46: end portion, 47: protruding portion, 50: fastener, 60: clip, S: lamp chamber, 100: T bar 101: Support part

Claims (16)

  1.  基板と、
     前記基板の上に格子状に配列された複数の半導体光源ユニットと、
     前記半導体光源ユニットを覆うように前記半導体光源ユニットから離間して設けられた光拡散部材と、を備え、
     前記半導体光源ユニットの互いの離間間隔d[mm]、前記半導体光源ユニットから前記光拡散部材までの離間距離h[mm]としたとき、薄型化係数T=h/dが0.4≦T≦1.0を満たすように形成されている、照明器具。
    A substrate,
    A plurality of semiconductor light source units arranged in a grid pattern on the substrate;
    A light diffusion member provided apart from the semiconductor light source unit so as to cover the semiconductor light source unit,
    When the separation distance d [mm] between the semiconductor light source units and the separation distance h [mm] from the semiconductor light source unit to the light diffusion member, the thinning coefficient T = h / d is 0.4 ≦ T ≦. A luminaire formed to satisfy 1.0.
  2.  前記半導体光源ユニットの離間間隔dが30mm≦d≦90mmを満たす、請求項1に記載の照明器具。 The lighting fixture according to claim 1, wherein a separation distance d of the semiconductor light source units satisfies 30 mm ≦ d ≦ 90 mm.
  3.  前記半導体光源ユニットから前記光拡散部材までの離間距離hが20mm≦h≦50mmを満たす、請求項1または2に記載の照明器具。 The lighting fixture according to claim 1 or 2, wherein a separation distance h from the semiconductor light source unit to the light diffusion member satisfies 20 mm ≦ h ≦ 50 mm.
  4.  前記光拡散部材の外側表面は微小凹凸が形成された梨地面であり、
     前記光拡散部材の内側表面は光沢面である、請求項1から3のいずれか一項に記載の照明器具。
    The outer surface of the light diffusing member is a textured surface on which minute irregularities are formed,
    The lighting fixture according to any one of claims 1 to 3, wherein an inner surface of the light diffusing member is a glossy surface.
  5.  前記光拡散部材の外周縁の厚みは2mm以上である、請求項1から4のいずれか一項に記載の照明器具。 The lighting fixture according to any one of claims 1 to 4, wherein a thickness of an outer peripheral edge of the light diffusing member is 2 mm or more.
  6.  ベース部材と、
     前記ベース部材に取り付けられ、前記ベース部材との間に収容空間を形成する拡散カバーと、
     前記収容空間内に設けられ、前記ベース部材に取り付けられた基板と、
     前記収容空間内に設けられ、前記基板に格子状に配列された複数の半導体光源と、を備え、
     前記拡散カバーは、前記半導体光源を覆うように設けられた主拡散部と、前記主拡散部から前記ベース部材側に突出する副拡散部とを有し、
     前記基板の平面視において、前記副拡散部と最外縁に配置された前記半導体光源との離間距離は、前記半導体光源の互いの離間距離よりも小さく設定されており、前記半導体光源からの光が副拡散部から出射されることを特徴とする照明器具。
    A base member;
    A diffusion cover attached to the base member and forming a housing space with the base member;
    A substrate provided in the housing space and attached to the base member;
    A plurality of semiconductor light sources provided in the accommodation space and arranged in a lattice pattern on the substrate,
    The diffusion cover has a main diffusion portion provided so as to cover the semiconductor light source, and a sub-diffusion portion protruding from the main diffusion portion to the base member side,
    In a plan view of the substrate, a separation distance between the sub-diffusion unit and the semiconductor light source disposed at the outermost edge is set to be smaller than a separation distance between the semiconductor light sources, and light from the semiconductor light source is A luminaire emitted from the sub-diffusion unit.
  7.  前記副拡散部の厚みが前記主拡散部の厚みよりも薄いことを特徴とする請求項6に記載の照明器具。 The lighting fixture according to claim 6, wherein a thickness of the sub-diffusion part is thinner than a thickness of the main diffusion part.
  8.  前記主拡散部と前記副拡散部とのなす角度が、90°以上とされている、請求項6または7に記載の照明器具。 The lighting fixture according to claim 6 or 7, wherein an angle formed by the main diffusion portion and the sub-diffusion portion is 90 ° or more.
  9.  前記半導体光源は、前記主拡散部のうち、隣接する前記半導体光源に対向する領域に向けて光を出射することを特徴とする請求項6から8のいずれか一項に記載の照明器具。 The lighting device according to any one of claims 6 to 8, wherein the semiconductor light source emits light toward a region facing the adjacent semiconductor light source in the main diffusion portion.
  10.  前記半導体光源はレンズ部材により覆われており、
     前記ベース部材は、前記基板が取り付けられる支持板部と、前記支持板部から立ち上がる側壁部と、を有し、
     前記側壁部は、少なくとも前記レンズ部材と同じ高さまで延出されている、請求項6から9のいずれか一項に記載の照明器具。
    The semiconductor light source is covered with a lens member,
    The base member has a support plate portion to which the substrate is attached, and a side wall portion rising from the support plate portion,
    The lighting device according to any one of claims 6 to 9, wherein the side wall portion extends to at least the same height as the lens member.
  11.  格子状に区画されたシステム天井に取り付けられるパネル型の照明器具であって、
     外部電源から供給される電力を所定の電圧または電流で出力線に出力可能な電源ユニットと、
     システム天井の支持部材に取り付けられる取付部を備え、入力線から入力される電力によって駆動される灯具ユニットとを備え、
     前記電源ユニットは、前記灯具ユニットとは別体に設けられ、
     前記出力線および前記入力線は、接離可能なコネクタによって電気的に接続されている、照明器具。
    A panel-type lighting fixture attached to a system ceiling partitioned in a grid pattern,
    A power supply unit capable of outputting power supplied from an external power source to the output line at a predetermined voltage or current;
    A mounting unit that is attached to a support member of the system ceiling, and a lamp unit that is driven by electric power input from an input line,
    The power supply unit is provided separately from the lamp unit,
    The lighting apparatus, wherein the output line and the input line are electrically connected by a connectable / detachable connector.
  12.  前記灯具ユニットは、半導体光源と、前記半導体光源が搭載される基板と、前記基板が取り付けられるハウジングと、を備え、
     前記ハウジングは、金属板を折り曲げて箱型に形成されている、請求項11に記載の照明器具。
    The lamp unit includes a semiconductor light source, a substrate on which the semiconductor light source is mounted, and a housing to which the substrate is attached.
    The lighting device according to claim 11, wherein the housing is formed in a box shape by bending a metal plate.
  13.  前記基板は、前記半導体光源の搭載面の裏面に貫通する貫通電極を有し、
     前記基板の前記裏面には放熱膜が設けられ、前記半導体光源からの熱が前記貫通電極を介して前記放熱膜で放熱されることを特徴とする請求項12に記載の照明器具。
    The substrate has a through electrode penetrating the back surface of the mounting surface of the semiconductor light source,
    The lighting device according to claim 12, wherein a heat dissipation film is provided on the back surface of the substrate, and heat from the semiconductor light source is radiated by the heat dissipation film through the through electrode.
  14.  システム天井の支持部材に支持されるパネル型の照明器具であって、
     下面が開口する箱型の金属製ハウジングと、
     上面が開口し、前記ハウジングとの間に収容空間を形成する箱型の拡散部材と、
     前記収容空間内に設けられ、前記ハウジングに取り付けられる基板と、
     前記収容空間内に設けられ、前記基板に搭載され前記拡散部材に光を出射する半導体光源と、を有し、
     前記ハウジングは、側壁の端部から収容空間の外側側方に張り出した第一フランジ部を備え、
     前記拡散部材は、側壁の端部から収容空間の外側側方に張り出して前記第一フランジ部と対向する第二フランジ部を備え、
     前記第一フランジ部と前記第二フランジ部とが重ね合わされた状態で、前記第一フランジ部および前記第二フランジ部がシステム天井の支持部材に支持される照明器具。
    A panel-type lighting fixture supported by a support member of the system ceiling,
    A box-shaped metal housing with an open bottom surface;
    A box-shaped diffusion member having an upper surface opened and forming a housing space with the housing;
    A substrate provided in the housing space and attached to the housing;
    A semiconductor light source provided in the housing space, mounted on the substrate and emitting light to the diffusing member,
    The housing includes a first flange portion projecting from an end portion of the side wall to the outer side of the housing space,
    The diffusion member includes a second flange portion that protrudes from the end portion of the side wall to the outer side of the housing space and faces the first flange portion,
    A lighting fixture in which the first flange portion and the second flange portion are supported by a support member of the system ceiling in a state where the first flange portion and the second flange portion are overlapped.
  15.  前記第一フランジ部を前記第二フランジ部に折り曲げてかしめることにより、前記拡散部材は前記ハウジングに固定されている、請求項14に記載の照明器具。 The lighting device according to claim 14, wherein the diffusion member is fixed to the housing by bending and crimping the first flange portion to the second flange portion.
  16.  前記ハウジングの側壁は、側壁の中央部が角部よりも外側に湾曲した形状とされている、請求項14または15に記載の照明器具。 The lighting device according to claim 14 or 15, wherein the side wall of the housing has a shape in which a central portion of the side wall is curved outward from a corner portion.
PCT/JP2013/055622 2012-03-09 2013-03-01 Illuminating apparatus WO2013133147A1 (en)

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