WO2013129891A1

WO2013129891A1 - Heterojunction structure and method for manufacturing same

Info

Publication number: WO2013129891A1
Application number: PCT/KR2013/001684
Authority: WO
Inventors: 신승용; 선주현; 이장훈
Original assignee: 한국생산기술연구원
Priority date: 2012-02-29
Filing date: 2013-02-28
Publication date: 2013-09-06

Abstract

The present invention relates to a heterojunction structure and a method for manufacturing same, and more particularly to a heterojunction structure having precision cutting processability and superior thermal conductivity to minimize thermal stress at a heterojunction region, and a method for manufacturing same. To this end, the heterojunction structure includes: a first part including ceramic; and a second part including carbon and being junctioned to the first part by brazing.

Description

Heterojunction structure and manufacturing method

The present invention relates to a heterojunction structure and a method of manufacturing the same, and more particularly, to a heterojunction structure of a low thermal expansion composite comprising a ceramic and carbon and a method of manufacturing the same.

Fundamentally, ceramic materials, unlike metal materials, have corrosion resistance, insulation properties, and dielectric properties. In particular, aluminum nitride is ceramic and has excellent thermal conductivity properties equivalent to or greater than that of aluminum metal. Due to these characteristics, the ceramic material can be used for, for example, an insulating substrate on which circuits for LED and power semiconductor packages are formed. In addition, such ceramic materials can be used to control the temperature of these substrates, for example, while passing through the wafer and glass substrates in chemical vapor deposition (CVD), physical vapor deposition (PVD), and plasma etching processes for manufacturing semiconductor and display devices. Complex flow paths of heating devices or cooling media are used in susceptors. As a material applicable to these parts, in addition to the ceramic material, aluminum coated with an oxide coating layer may be used by an anodizing and thermal spraying process of the ceramic material. However, due to the difference in the coefficient of thermal expansion between the oxide and the aluminum material, the oxide film layer is destroyed in a rapid temperature cycle to realize a wide temperature range or a high process speed, and its use is very limited.

For example, as a cooling plate component used in a plasma etching or gap fill process, a metal substrate and a heterogeneous material such as a ceramic material may be used to join and assemble a ceramic substrate material having an electrostatic chuck function on an aluminum body in which a complicated flow path is embedded. In consideration of the warpage phenomenon and thermal stress crack generation due to the difference in coefficient of thermal expansion, a component of a type bonded to the polymer adhesive at room temperature is used. However, the use of such an adhesive, due to the low thermal conductivity of the adhesive, not only does not effectively control the temperature rise of the substrate, but also has a problem of impairing the large-area deposition and the temperature uniformity of the etching substrate. Problems include the low heat resistance of the joints and the contamination of the process chamber due to the polymer adhesive in an elevated temperature atmosphere caused by the collision.

As another example, as a high temperature heating part used in a chemical vapor deposition process, a heating plate made of aluminum nitride (AlN) containing a metal heating element coil such as molybdenum or tungsten having a thermal expansion coefficient close to ceramic is used. The use of ceramics increases the manufacturing cost of components.

Accordingly, the present invention has been made to solve the above problems, to provide a heterojunction structure that can withstand high temperature and wide temperature cycle environment, for this purpose, it is possible to precise cutting processing, such as metal, thermal conductivity In order to minimize the thermal stress of the dissimilar junction, most of all, the application of a new low thermal expansion material close to the thermal expansion coefficient of the ceramic and the joint assembly method that can form and maintain a good interface with the ceramic even in a wide and rapid temperature cycle. To provide. This problem of the present invention has been presented by way of example, and therefore, the present invention is not limited to this problem.

A heterojunction structure according to one aspect of the present invention is provided. The heterojunction structure has a first portion comprising ceramic and a second portion comprising carbon and brazing bonded to the first portion.

In the heterojunction structure, the second portion may include a hybrid composite including carbon.

In the heterojunction structure, the hybrid composite may include a body portion including carbon and a canning portion including aluminum and surrounding the outer surface of the body portion.

In the heterojunction structure, the hybrid composite includes a plurality of carbon layers spaced apart from each other, a sintered composite layer of aluminum and carbon and aluminum interposed between the plurality of carbon layers and the plurality of carbon layers Canning unit surrounding the outer surface of the sintered composite layer may be provided.

In the heterojunction structure, the hybrid composite includes a plurality of carbon layers disposed to be spaced apart from each other, aluminum and a thermally conductive layer and aluminum interposed between the plurality of carbon layers and the plurality of carbon layers and the Canning portion surrounding the outer surface of the thermal conductive layer may be provided.

In the heterojunction structure, the thermal expansion coefficient α ₂ of the hybrid composite may satisfy the relationship between the thermal expansion coefficient α ₁ and (α ₁ x 0.9) <α ₂ <(α ₁ x 1.1) of the ceramic.

In the heterojunction structure, the second portion may be a body portion composed only of carbon.

In the heterojunction structure, the carbon may include at least one of isotropic carbon and anisotropic carbon.

In the heterojunction structure, the ceramic may include aluminum nitride (AlN), and the first part may be directly brazed to the second part.

In the heterojunction structure, the ceramic includes alumina (Al ₂ O ₃ ), and the first part is brazed with the second part via a molybdenum-manganese metallization layer formed on a surface facing the second part. Can be bonded.

According to another aspect of the present invention, a method of manufacturing a heterojunction structure is provided. The method of manufacturing a heterojunction structure includes preparing a first part including a ceramic, forming a second part including carbon, and brazing the first part and the second part.

In the method of manufacturing a heterojunction structure, the forming of the second portion including carbon may include forming a first structure including carbon and a canning portion including aluminum to surround an outer surface of the first structure. It may comprise the step of forming.

In the method of manufacturing the heterojunction structure, the first structure may include a body portion including carbon.

In the method of manufacturing a heterojunction structure, the first structure may include a plurality of carbon layers disposed spaced apart from each other and a sintered composite layer of aluminum and carbon interposed between the plurality of carbon layers.

In the method of manufacturing a heterojunction structure, the first structure may include a plurality of carbon layers and aluminum disposed to be spaced apart from each other, and may include a thermal conductive layer interposed between the plurality of carbon layers.

In the method of manufacturing a heterojunction structure, between the step of forming the first structure and the step of forming the canning, forming a metallization layer surrounding the outer surface of the first structure may be further provided. . Further, the forming of the metallizing layer may include disposing a metal foil on the outer surface of the first structure via a first filler and performing a first heat treatment of the first structure, the first filler, and the metal foil. It may be provided with a step.

In the method of manufacturing a heterojunction structure, the forming of the canning part may include disposing an aluminum plate on an outer surface of the first structure via a second filler and the first structure, the second filler, and the aluminum. And a second heat treatment of the plate material. Furthermore, the step of brazing bonding may include a third heat treatment of the first part, the second part and the third filler via a third filler between the first part and the second part. . Here, the second filler and the third filler may be made of the same material, and the second heat treatment and the third heat treatment may be simultaneously performed under the same heat treatment conditions.

According to one embodiment of the present invention made as described above, it is possible to implement a heterojunction structure and a method of manufacturing the same excellent in heat transfer performance while suppressing the generation of particles, reducing the manufacturing cost.

1 is a cross-sectional view illustrating a heterojunction structure according to an embodiment of the present invention.

2 is a photograph showing the appearance of a heterojunction structure after brazing of an aluminum nitride / carbon material.

3A is a photograph showing the appearance of a heterojunction structure after brazing of an aluminum nitride (AlN) / carbon material (ET-10) according to an embodiment of the present invention, and FIG. 3B is an aluminum nitride according to a comparative example of the present invention ( Photograph showing appearance of heterojunction structure after brazing of AlN) / Al6061 series alloy.

4A and 4B are planar and cross-sectional texture photographs of a sintered composite of aluminum powder and 50 vol% carbon fiber, respectively.

5 is a cross-sectional view illustrating a heterojunction structure according to another embodiment of the present invention.

6 is a cross-sectional view illustrating a heterojunction structure according to still another embodiment of the present invention.

7 is a cross-sectional view illustrating a heterojunction structure according to still another embodiment of the present invention.

8A to 8F illustrate a method of forming a heterojunction structure according to still another embodiment of the present invention.

9A and 9B illustrate a modified method of forming a heterojunction structure according to another embodiment of the present invention.

112: body portion containing carbon

113: a plurality of carbon layers

114: sintered composite layer of aluminum and carbon

126: metallizing layer

144: canning unit

146: thermal conductive layer

201, 202, 203, 204: second part consisting of carbon

310: brazing joint

410: Part 1 composed of ceramic

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the present embodiments are intended to complete the disclosure of the present invention and to those skilled in the art to fully understand the scope of the invention. It is provided to inform you. In the drawings, the components may be exaggerated or reduced in size for convenience of description.

Terms such as "top" or "bottom" mentioned in the description of this embodiment may be used to describe the relative relationship of certain elements to other elements, as illustrated in the figures. That is, relative terms may be understood to include other directions of the structure separately from the direction depicted in the figures. For example, if the top and bottom of the structure in the figures are upside down, elements depicted as being on the top of other elements may be on the bottom of the other elements. Thus, by way of example, the term "top" may include both "top" and "bottom" directions, relative to a particular direction in the figures.

Further, in the course of describing the present embodiment, when referring to a component "on" or "connected" to another component, the component is located directly on the other component. Alternatively, the present invention may be directly connected to the other components. Furthermore, one or more intervening components may be present therebetween. However, when referring to a component "directly" to another component, "directly connected" to another component, or "direct contact" to another component, unless otherwise stated, This means that there are no components intervening in.

In the following embodiments, the x-axis, y-axis and z-axis are not limited to three axes on the Cartesian coordinate system, but may be interpreted in a broad sense including the same. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

The present invention claims priority to Korean Patent Application No. 10-2012-0021442 filed on February 29, 2012 by the applicant, the contents of which are incorporated herein by reference in their entirety.

1 is a cross-sectional view illustrating a heterojunction structure according to an embodiment of the present invention. Referring to FIG. 1, a heterojunction structure according to an embodiment of the present invention includes a first part 410 including ceramic and a second part 201 including carbon. Since the first part 410 and the second part 201 are brazed, the brazing joint 310 is interposed between the first part 410 and the second part 201. The brazing joint 310 may be understood as a heterojunction in which at least a portion of the filler and the bonding base material used for the brazing joint are melt-diffused. Although explicitly shown in the drawings, the brazing joint 310 may include the first part ( 410 and / or second portion 201 may not be clearly distinguished.

The first part 410 may include a ceramic material, and may include, for example, aluminum nitride (AlN) or alumina (Al ₂ O ₃ ). The second portion 201 may be a body portion 112 composed of only carbon. For example, the second portion 201 may be configured to include isotropic carbon or anisotropic carbon. On the other hand, in the modified embodiment, the second portion 201 may be composed of a sintered composite of aluminum and carbon. When the first part 410 includes aluminum nitride (AlN), the first part 410 and the second part 201 may be directly brazed, but the first part 410 may be alumina (AlN). ₂ O ₃ ), the first portion 410 may be brazed to the second portion 201 via a molybdenum-manganese metallization layer formed on a surface opposite the second portion 201. Can be.

The difference between the coefficients of thermal expansion between the first part 410 and the second part 201 is an important factor affecting the thermal stress of the heterojunction structure, and the ceramic material and the second part ( It may be desirable to minimize the difference in the coefficient of thermal expansion of the carbon material constituting 201). Table 1 shows the coefficient of thermal expansion and thermal conductivity of carbon materials, sintered composite materials and ceramic materials that can be applied to the present invention.

TABLE 1

In the present invention, for example, a heterojunction structure in which a carbon material having a coefficient of thermal expansion equal to or less than that of an aluminum nitride (AlN) ceramic is directly bonded to an aluminum nitride (AlN) ceramic using an active filler metal. And the manufacturing method is presented. Ag-Cu-Ti-based and Au-Ni-Ti-based filler metals may be used as the active filler metal. In addition, Ti-Zr-based active filler metals containing a large amount of active metals such as titanium (Ti) and zirconium (Zr) may be used.

2 is a photograph showing the appearance of a heterojunction structure of aluminum nitride (AlN) / carbon material (ET-10) bonded by brazing. Referring to FIG. 2, in the present embodiment, the bonding condition of Ti-43.5Zr-6.5Ni-8.1Cu (% by weight) of an active filler metal having a liquidus temperature of 855 ° C. was used, and 1 × 10 ⁻⁵ Torr The temperature of 900 degreeC was maintained for 30 minutes using the high vacuum graphite furnace which has the following vacuum degree. At this time, the size of the aluminum nitride (AlN) ceramic substrate was 125mm x 62mm x 0.2mmt and the carbon material was 125mm x 62mm x 10mmt graphite material (ET-10). The thermal expansion coefficient of aluminum nitride (AlN) is 4.5 x 10 ^-6 / K, and the thermal expansion coefficient of ET-10, which is a kind of carbon material, is 3.8 x 10 ^-6 / K. It is possible to implement a stable heterojunction structure. In comparison, a heterojunction structure was formed in which a base material of aluminum nitride (AlN) and an Al6061 series alloy were joined by brazing.

3A is a photograph showing the appearance of a heterojunction structure after brazing of an aluminum nitride (AlN) / carbon material (ET-10) according to an embodiment of the present invention, and FIG. 3B is an aluminum nitride according to a comparative example of the present invention ( Photograph showing appearance of heterojunction structure after brazing of AlN) / Al6061 series alloy. As a bonding condition of the heterojunction structure shown in FIG. 3a, Ti-43.5Zr-6.5Ni-8.1Cu alloy was used as a filler, and a high vacuum graphite furnace having a vacuum degree of 1 x 10 ^-5 Torr or less was used for 900 minutes for 30 minutes. The temperature of ℃ was maintained. On the contrary, Al-12Si alloy was used as a filler for the heterojunction structure shown in FIG. 3B, and the temperature was 600 ° C. for 30 minutes using a high vacuum graphite furnace having a vacuum degree of 1 × 10 ⁻⁵ Torr or less. Maintained. The heterojunction structure (FIG. 3A) according to an embodiment of the present invention was confirmed that there is little deformation of the structure due to thermal stress despite the high brazing temperature compared to the heterojunction structure (FIG. 3B) according to the prior art. .

On the other hand, as described above, in a modified embodiment of the present invention, the second portion 201 may be composed of a sintered composite of aluminum and carbon. Carbon is a reinforcing material of the sintered composite material, and for example, carbon fiber may be applied, and chopped carbon fiber (milled carbon fiber) having a length of 100 microns or less may be used. On the other hand, in addition to the carbon fiber, it is also possible to substitute graphite carbon or carbon powder having low thermal expansion and high thermal conductivity.

The blending ratio of aluminum powder and carbon may be up to 20 to 60 vol%, but the range is preferably 30 to 50 vol% in consideration of the coefficient of thermal expansion and sintering. The aluminum powder and the carbon fiber may be mixed by dry and wet methods, and then sintered and bulked by a general sintering method such as, for example, a hot press method, energizing pressure sintering method, or HIP method. A favorable sintered compact can be obtained through vacuum sintering at 500-650 degreeC and pressing force which are below the melting | fusing point of aluminum powder at 20-100 MPa conditions. 4A and 4B show the top and cross-section views of the structure photographs of the sintered composite of aluminum powder and 50 vol% carbon fiber, respectively.

5 is a cross-sectional view illustrating a heterojunction structure according to another embodiment of the present invention. Referring to FIG. 5, a heterojunction structure according to another embodiment of the present invention includes a first part 410 including ceramic and a second part 202 including carbon. Since the first part 410 and the second part 202 are brazed, a brazing joint 310 is interposed between the first part 410 and the second part 202. The brazing joint 310 may be understood as a heterojunction in which at least some of the filler and the bonding base material used for the brazing joint are melt-diffused. Although explicitly shown in FIG. 5, the first part 410 is actually implemented in the structure. And / or not distinct from the second portion 202.

The first part 410 may include a ceramic material, and may include, for example, aluminum nitride (AlN) or alumina (Al ₂ O ₃ ). The second portion 202 is a hybrid composite including carbon and includes a body portion 112 including carbon and a canning portion 144 including aluminum and surrounding the outer surface of the body portion 112. Body portion 112 is configured to include carbon, for example, may be configured to include isotropic carbon or anisotropic carbon, shown in Table 1. On the other hand, in the modified embodiment, the body portion 112 may be composed of a sintered composite of aluminum and carbon. When the first part 410 includes aluminum nitride (AlN), the first part 410 and the second part 202 may be directly brazed, but the first part 410 is made of alumina (AlN). ₂ O ₃ ), the first portion 410 may be brazed to the second portion 202 via a molybdenum-manganese metallization layer formed on a surface opposite the second portion 202. Can be.

The canning part 144 may be implemented by performing a canning process to surround the top, bottom, and side surfaces of the body part 112, and may include, for example, aluminum. For example, the canning unit 144 may be implemented by arranging an aluminum plate including an Al6061 series alloy on the outer surface of the body portion 112 through a filler including an Al4047 series alloy, and then heat treating the aluminum plate. . Meanwhile, before performing the canning process on the body portion 112, optionally, a metallizing process of forming a metal layer on the body portion 112 may be performed first.

The coefficient of thermal expansion α ₂ of the hybrid composite body 202 including the body 112 and the canning unit 144 is the coefficient of thermal expansion α _Al and the volume fraction t _{Al of the} canning unit 144 as shown in Equation 1 below. ) Is equal to the sum of the product of the coefficient of thermal expansion (α _g ) and the volume fraction (t _g ) of the body portion 112. Here, the volume fraction of each component corresponds to the ratio of the total thickness of each component to the total thickness of the hybrid composite 202, where the thickness direction is a direction along the line A-A 'in the figure (y direction). it means.

[Equation 1]

α ₂ = α _Al t _Al + α _g t _g

Table 2 shows the thermal expansion coefficient of the hybrid composite 202 according to various embodiments consisting of the body portion 112 and the canning unit 144. By adjusting the volume fraction of the canning part 144 and the body part 112, and selecting the kind of carbon material which comprises the body part 112 suitably, the thermal expansion coefficient of the hybrid composite body 202 can be designed suitably. have.

TABLE 2

The thermal expansion coefficient α ₂ of the hybrid composite 202 implemented in the heterojunction structure according to the embodiments of the present invention may be controlled within a predetermined level range with the thermal expansion coefficient α ₁ of the ceramic 410, for example, The relationship of Equation 2 may be satisfied.

[Equation 2]

(α ₁ x 0.9) <α ₂ <(α ₁ x 1.1)

Specifically, in the case where the ceramic constituting the first part 410 is aluminum nitride having a thermal expansion coefficient of about 4.5, the thermal expansion of the hybrid composite constituting the second part 202 implemented in cases 1 to 2 of Table 2 is described. The coefficient (4.428 or 4.42) satisfies Equation 2 above. In addition, when the ceramic constituting the first part 410 is alumina having a coefficient of thermal expansion of about 7.8, the thermal expansion coefficient of the hybrid composite constituting the second part 202 implemented in cases 3 to 5 of Table 2 is Equation 2 is satisfied. The smaller the relative difference between the coefficient of thermal expansion of the ceramic material constituting the first portion 410 and the coefficient of thermal expansion of the hybrid composite 202 constituting the second portion 202, the lower the thermal stress generated in the heterojunction structure. Can be stabilized.

6 is a cross-sectional view illustrating a heterojunction structure according to still another embodiment of the present invention. Referring to FIG. 6, the heterojunction structure according to another embodiment of the present invention includes a first part 410 including ceramic and a second part 203 including carbon. Since the first part 410 and the second part 203 are brazed, the brazing joint 310 is interposed between the first part 410 and the second part 203. The brazing joint 310 may be understood as a heterojunction in which at least a portion of the filler and the bonding base material used for the brazing joint are melt-diffused. Although explicitly shown in FIG. 6, in the structure actually implemented, the first part 410 is used. And / or the second portion 203 may not be clearly distinguished.

The first part 410 may include a ceramic material, and may include, for example, aluminum nitride (AlN) or alumina (Al ₂ O ₃ ). The second part 203 is a hybrid composite including carbon, and the sintered composite layer 114 of aluminum and carbon interposed between the plurality of carbon layers 113 and the plurality of carbon layers 113 disposed to be spaced apart from each other. ). Further, the second portion 203 includes aluminum and includes a plurality of carbon layers 113 and a canning portion 144 surrounding the outer surface of the sintered composite layer 114. Since the sintered composite layer 114 has already been described above with reference to FIGS. 4A and 4B, description thereof will be omitted. Meanwhile, the carbon constituting the plurality of carbon layers 113 and the sintered composite layer 114 may include, for example, isotropic carbon or anisotropic carbon disclosed in Table 1.

When the first part 410 includes aluminum nitride (AlN), the first part 410 and the second part 203 may be directly brazed, but the first part 410 is made of alumina (AlN). ₂ O ₃ ), the first portion 410 may be brazed to the second portion 203 via a molybdenum-manganese metallization layer formed on a surface opposite the second portion 203. Can be.

The canning unit 144 may be implemented by performing a canning process to surround the top, bottom, and side surfaces of the plurality of carbon layers 113 and the sintered composite layer 114 except for the mutual contact surface. It can be configured to include. For example, the canning unit 144 may be formed on an outer surface of the plurality of carbon layers 113 and the sintered composite layer 114 by interposing a filler including an Al4047 series alloy, and forming an aluminum plate including an Al6061 series alloy. After placement, it may be formed by heat treatment. Meanwhile, before performing a canning process on the laminate structure composed of the plurality of carbon layers 113 and the sintered composite layer 114, a metallizing process of selectively forming a metal layer on the laminate structure may be performed first. It may be.

The thermal expansion coefficient α ₂ of the hybrid composite 203 composed of the plurality of carbon layers 113, the sintered composite layer 114, and the canning unit 144 is the thermal expansion coefficient of the canning unit 144 as shown in Equation 3 below. the coefficient of thermal expansion of (α _Al) and the volume fraction of a product of a (t _Al) to the product of the coefficient of thermal expansion (α _g) and the volume fraction (t _g) of the plurality of carbon layers 113 and the sintered composite layer (114) (α _cf ) and the product of the volume fraction (t _cf ). Here, the volume fraction of each component corresponds to the ratio of the total thickness of each component to the total thickness of the hybrid composite 203, where the thickness direction is a direction along the line A-A 'in the figure (y direction). it means.

[Equation 3]

α ₂ = α _Al t _Al + α _g t _g + α _cf t _cf

Table 3 shows the coefficient of thermal expansion of the hybrid composite 203 according to various embodiments consisting of a plurality of carbon layers 113, the sintered composite layer 114 and the canning unit 144. Types of carbon materials that control the volume fraction of the plurality of carbon layers 113, the sintered composite layer 114, and the canning unit 144, and constitute the plurality of carbon layers 113 and the sintered composite layer 114. By appropriately selecting, the thermal expansion coefficient of the hybrid composite body 203 can be appropriately designed.

TABLE 3

The thermal expansion coefficient α ₂ of the hybrid composite 203 implemented in the heterojunction structure according to the embodiments of the present invention may be controlled within a predetermined level range with the thermal expansion coefficient α ₁ of the ceramic 410, for example, The relationship of Equation 2 may be satisfied.

Specifically, when the ceramic constituting the first part 410 is aluminum nitride having a thermal expansion coefficient of about 4.5, the thermal expansion of the hybrid composite constituting the second part 203 implemented in cases 1 to 2 of Table 3 is described. The coefficient 4.654 or 4.177 satisfies Equation 2 above. The smaller the relative difference between the coefficient of thermal expansion of the ceramic material constituting the first part 410 and the coefficient of thermal expansion of the hybrid composite 203 is, the lower the thermal stress generated in the heterojunction structure can be structurally stable.

7 is a cross-sectional view illustrating a heterojunction structure according to still another embodiment of the present invention. Referring to FIG. 7, the heterojunction structure according to another embodiment of the present invention includes a first part 410 including ceramic and a second part 204 including carbon. Since the first portion 410 and the second portion 204 are brazed, a brazing junction 310 is interposed between the first portion 410 and the second portion 204. The brazing joint 310 may be understood as a heterojunction in which at least some of the filler and the bonding base material used for the brazing joint are melt-diffused. Although explicitly shown in FIG. 7, the first part 410 is actually implemented in the structure. And / or not distinct from the second portion 204.

The first part 410 may include a ceramic material, and may include, for example, aluminum nitride (AlN) or alumina (Al ₂ O ₃ ). The second part 204 is a hybrid composite including carbon, and includes a plurality of carbon layers 113 and aluminum disposed apart from each other, and a thermal conductive layer 146 interposed between the plurality of carbon layers 113. It is provided. Since the thermal conductive layer 146 includes, for example, aluminum having a relatively high thermal conductivity, the thermal conductivity of the second portion 204 may be increased. Further, the second portion 204 includes, for example, aluminum and includes a plurality of carbon layers 113 and a canning portion 144 surrounding the outer surface of the thermal conductive layer 146. Carbon constituting the plurality of carbon layers 113 may include, for example, isotropic carbon or anisotropic carbon, which is disclosed in Table 1 below. Also, in the modified embodiment, the plurality of carbon layers 113 may be made of a sintered composite of aluminum and carbon.

When the first part 410 includes aluminum nitride (AlN), the first part 410 and the second part 204 may be directly brazed, but the first part 410 is made of alumina (AlN). ₂ O ₃ ), the first portion 410 may be brazed to the second portion 204 via a molybdenum-manganese metallization layer formed on a surface opposite the second portion 204. Can be.

The canning unit 144 may be implemented by performing a canning process to surround the top, bottom, and side surfaces of the plurality of carbon layers 113 and the thermal conductive layer 146 except for the mutual contact surface, and may include aluminum. have. For example, the canning unit 144 may be formed on the outer surface of the plurality of carbon layers 113 and the thermal conductive layer 146 by interposing a filler including an Al4047 series alloy, and forming an aluminum plate including an Al6061 series alloy. After placement, it may be formed by heat treatment. Meanwhile, before performing a canning process on the laminate structure composed of the plurality of carbon layers 113 and the heat conductive layer 146, optionally, a metallizing process of forming a metal layer on the laminate structure may be performed first. have.

The thermal expansion coefficient α ₂ of the hybrid composite 204 composed of the plurality of carbon layers 113, the thermal conductive layer 146, and the canning unit 144 may be represented by the canning unit 144 and the thermal conductive layer ( It is equal to the sum of the product of the coefficient of thermal expansion α _Al and the volume fraction t _Al of 146 and the product of the coefficient of thermal expansion α _g and the volume fraction t _g of the carbon layers 113. Here, the volume fraction of each component corresponds to the ratio of the total thickness of each component to the total thickness of the hybrid composite, and the direction of the thickness refers to the direction (y direction) along the line A-A 'in the figure.

[Equation 4]

α ₂ = α _Al t _Al + α _g t _g

Table 4 shows the coefficient of thermal expansion of the hybrid composite 204 according to various embodiments consisting of a plurality of carbon layers 113, the thermal conductive layer 146 and the canning unit 144. By controlling the volume fraction of the plurality of carbon layers 113, the thermal conductive layer 146, and the canning unit 144, and appropriately selecting the kind of carbon material constituting the plurality of carbon layers 113, the hybrid composite body The thermal expansion coefficient of 204 can be appropriately designed.

TABLE 4

The thermal expansion coefficient α ₂ of the hybrid composite 204 implemented in the heterojunction structure according to the embodiments of the present invention may be controlled within a predetermined level range with the thermal expansion coefficient α ₁ of the ceramic 410, for example, The relationship of Equation 2 may be satisfied.

Specifically, when the ceramic constituting the first portion 410 is alumina having a coefficient of thermal expansion of 7.8, the coefficient of thermal expansion of the hybrid composite constituting the second portion 204, implemented in cases 1 to 3 of Table 4, 7.69, 7.72, or 7.84 satisfies Equation 2 above. The smaller the relative difference between the coefficient of thermal expansion of the ceramic material constituting the first part 410 and the coefficient of thermal expansion of the hybrid composite 204 is, the lower the thermal stress generated in the heterojunction structure can be structurally stable.

In the heterojunction structure described so far, the structure 201 including the carbon shown in FIG. 1 and the hybrid composites 202, 203, and 204 shown in FIGS. 5 to 7 have excellent machinability to complex shapes, In addition to having high thermal conductivity, the thermal expansion coefficient is close to alumina ceramics (7.8 x 10 ^-6 / k) and aluminum nitride ceramics (4.5 x 10 ^-6 / k) to reduce the thermal stress of the heterojunction structure. That is, according to the embodiments of the present invention, the carbon material and its hybrid composite material may be applied instead of the conventional aluminum material or copper material that is joined to the ceramic, and a heterojunction structure having a good bonding interface may be realized by brazing. Therefore, it is possible to provide a structure that can be used with durability even in a wide and rapid temperature cycle.

Hereinafter, a method of manufacturing a heterojunction structure according to embodiments of the present invention will be described. 8A to 8F illustrate a method of manufacturing a heterojunction structure according to another embodiment of the present invention, and exemplarily illustrate a method of manufacturing the heterojunction structure shown in FIG. 5.

First, referring to FIG. 8A, a structure including a body part 112 including carbon is prepared. Description of the structure consisting of the body portion 112 including the carbon is the same as that described above with reference to Figure 5 will be omitted here. On the other hand, in a modified embodiment of the present invention, the structure consisting of the body portion 112 containing carbon, as shown in Figure 6, a plurality of carbon layers 113 and a plurality of carbon layers disposed spaced apart from each other It can be replaced by a laminated structure composed of a sintered composite layer 114 of aluminum and carbon interposed between the (113). In addition, in another modified embodiment of the present invention, the structure composed of the body portion 112 including carbon, as shown in Figure 7, a plurality of carbon layers 113 and a plurality of carbon disposed to be spaced apart from each other It may be replaced by a laminated structure composed of a thermally conductive layer 146 interposed between the layers 113.

8B and 8C, a stainless foil 124 is provided on an outer surface (upper surface, lower surface and side surfaces except for mutual contact surfaces) of the structure 112 via a first filler 122. After arranging the structure 112, the first filler 122 and the stainless foil 124 were first heat treated, for example, at a temperature of 1050 ° C. for 30 minutes to form an outer surface of the structure 112. The surrounding metalizing layer 126 may be formed. The first filler 122 may include, for example, BNi ₂ .

8D and 8E, the aluminum plate 142 is disposed on the structure 112 on which the metallization layer 126 is formed on the outer surface via the second filler 141. The aluminum plate 142 may be understood as a case containing aluminum. Thereafter, the structure 112, the second filler 141, and the aluminum plate 142 are subjected to a second heat treatment, for example, at a temperature of 600 ° C. for 30 minutes, thereby forming the canning portion 144 on the structure 112. By forming, a second portion 202 comprising carbon is implemented. The second filler 141 may include, for example, an Al4047 series alloy that is an aluminum alloy containing 12% of silicon. The aluminum plate 142 may include, for example, an Al6061 series alloy.

8E and 8F, a first part 410 including ceramic is prepared, and the first part 410 and the second part 202 are brazed. The brazing joint is, for example, 30 minutes at a temperature of 600 ° C. after interposing a third filler 312 between the first portion 410 and the second portion 202, which includes, for example, an Al4047 series alloy. It can be performed by a third heat treatment.

By the brazing bonding process, the brazing bonding portion 310 is interposed between the first portion 410 and the second portion 201. The brazing joint 310 may be understood as a heterojunction in which at least a portion of the filler and the joining base material used for the brazing joint are melt-diffused. Although explicitly illustrated in the drawings, the brazing joint 310 may include the first part 410 and And / or may not be distinct from the second portion 202.

Meanwhile, the second heat treatment performed to form the canning unit 144 and the third heat treatment performed for brazing bonding may be heat treatments performed simultaneously under the same heat treatment conditions. This is because the second filler 141 required for the second heat treatment and the third filler 312 required for the third heat treatment may be made of the same Al4047-based alloy, and may have the same heat treatment temperature and time. Do. Therefore, according to the method of manufacturing a heterojunction structure according to an embodiment of the present invention, the second heat treatment performed for forming the canning unit 144 and the third heat treatment performed for brazing bonding are not performed separately, respectively. Since it can be performed at the same time at the same time, the thermal burden applied to the heterojunction structure is lowered, and furthermore, the effect of lowering the production cost can be expected.

Meanwhile, as shown in FIGS. 8E and 8F, when the first part 410 includes aluminum nitride (AlN), the first part 410 and the second part 202 may be directly brazed. 9A and 9B, when the first portion 410 includes alumina (Al ₂ O ₃ ), the first portion 410 is formed of molybdenum on a surface opposite to the second portion 202. It may be brazed to the second portion 202 through the manganese metallization layer 320.

The heterojunction structure and its manufacturing method according to various embodiments of the present invention have been described so far. In particular, the canning unit 144, the thermal conductive layer 146, the ceramic material constituting the first portion 410, the first filler 122, the second filler 141, the third filler 312, the metallizing layer Components 126 and 320, the metal plate 142 and the metal foil 124, and the like mentioned above are illustrative, and it is apparent that the technical spirit of the present invention is not limited thereto.

The foregoing description of specific embodiments of the invention has been presented for purposes of illustration and description. Therefore, the present invention is not limited to the above embodiments, and various modifications and changes can be made by those skilled in the art within the technical spirit of the present invention in combination with the above embodiments. Do.

Claims

A first portion comprising a ceramic; And

A second portion comprising carbon and brazing bonded to the first portion;

Heterojunction structure having a.
The heterojunction structure of claim 1, wherein the second part comprises a hybrid composite including carbon.
The method of claim 2, wherein the hybrid complex

A body part containing carbon; And

A canning portion comprising aluminum and surrounding an outer surface of the body portion;

Heterojunction structure having a.
The method of claim 2, wherein the hybrid complex

A plurality of carbon layers disposed spaced apart from each other;

A sintered composite layer of aluminum and carbon interposed between the plurality of carbon layers; And

A canning unit comprising aluminum and surrounding the outer surfaces of the plurality of carbon layers and the sintered composite layer;

Heterojunction structure having a.
The method of claim 2, wherein the hybrid complex

A plurality of carbon layers disposed spaced apart from each other;

A heat conductive layer including aluminum and interposed between the plurality of carbon layers; And

A canning unit including aluminum and surrounding the outer surfaces of the plurality of carbon layers and the thermal conductive layer;

Heterojunction structure having a.
The heterojunction structure according to claim 2, wherein the thermal expansion coefficient α 2 of the hybrid composite satisfies the relationship between the thermal expansion coefficient α 1 of the ceramic and (α 1 x 0.9) <α 2 <(α 1 x 1.1).
The heterojunction structure of claim 1, wherein the second portion is a body portion composed only of carbon.
The heterojunction structure of claim 1, wherein the carbon comprises at least one of isotropic carbon and anisotropic carbon.
2. The heterojunction structure of claim 1, wherein the ceramic comprises aluminum nitride (AlN), the first portion being directly brazed to the second portion.
The ceramic of claim 1, wherein the ceramic comprises alumina (Al 2 O 3 ), and the first part is brazed with the second part via a molybdenum-manganese metallization layer formed on a surface facing the second part. Bonded, heterojunction structure.
Preparing a first part comprising a ceramic;

Forming a second portion comprising carbon; And

Brazing the first portion and the second portion;

Method for producing a heterojunction structure having a.
12. The method of claim 11, wherein forming a second portion comprising carbon

Forming a first structure comprising carbon; And

Forming a canning portion comprising aluminum to surround an outer surface of the first structure;

Method for producing a heterojunction structure comprising a.
13. The method of claim 12, wherein the first structure comprises a body portion comprising carbon.
The method of claim 12, wherein the first structure comprises: a plurality of carbon layers spaced apart from each other; And a sintered composite layer of aluminum and carbon interposed between the plurality of carbon layers.
The method of claim 12, wherein the first structure comprises: a plurality of carbon layers spaced apart from each other; And a heat conduction layer including aluminum and interposed between the plurality of carbon layers.
13. The heterojunction structure of claim 12, further comprising forming a metallization layer surrounding an outer surface of the first structure between forming the first structure and forming the canning portion. Manufacturing method.
The method of claim 16, wherein forming the metallizing layer

Disposing a metal foil on an outer surface of the first structure via a first filler; And

First heat treating the first structure, the first filler, and the metal foil;

Method for producing a heterojunction structure comprising a.
The method of claim 12, wherein the forming of the canning unit

Disposing an aluminum plate on an outer surface of the first structure via a second filler; And

Performing a second heat treatment of the first structure, the second filler, and the aluminum plate;

Method for producing a heterojunction structure comprising a.
19. The method of claim 18, wherein the step of brazing

And a third heat treatment of the first part, the second part, and the third filler via a third filler between the first part and the second part.
20. The method of claim 19, wherein the second filler and the third filler are made of the same material, and the second heat treatment and the third heat treatment are performed simultaneously under the same heat treatment conditions. .