WO2013129891A1 - Structure d'hétérojonction et son procédé de fabrication - Google Patents

Structure d'hétérojonction et son procédé de fabrication Download PDF

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WO2013129891A1
WO2013129891A1 PCT/KR2013/001684 KR2013001684W WO2013129891A1 WO 2013129891 A1 WO2013129891 A1 WO 2013129891A1 KR 2013001684 W KR2013001684 W KR 2013001684W WO 2013129891 A1 WO2013129891 A1 WO 2013129891A1
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carbon
heterojunction structure
aluminum
filler
ceramic
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PCT/KR2013/001684
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English (en)
Korean (ko)
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신승용
선주현
이장훈
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한국생산기술연구원
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Priority claimed from KR1020120086714A external-priority patent/KR101411956B1/ko
Application filed by 한국생산기술연구원 filed Critical 한국생산기술연구원
Publication of WO2013129891A1 publication Critical patent/WO2013129891A1/fr

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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
    • C04B37/006—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of metals or metal salts
    • C—CHEMISTRY; METALLURGY
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C—CHEMISTRY; METALLURGY
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/124—Metallic interlayers based on copper
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C—CHEMISTRY; METALLURGY
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/363—Carbon
    • C—CHEMISTRY; METALLURGY
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
    • C—CHEMISTRY; METALLURGY
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/38—Fiber or whisker reinforced
    • C04B2237/385—Carbon or carbon composite
    • C—CHEMISTRY; METALLURGY
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/402—Aluminium
    • C—CHEMISTRY; METALLURGY
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/66—Forming laminates or joined articles showing high dimensional accuracy, e.g. indicated by the warpage

Definitions

  • the present invention relates to a heterojunction structure and a method of manufacturing the same, and more particularly, to a heterojunction structure of a low thermal expansion composite comprising a ceramic and carbon and a method of manufacturing the same.
  • ceramic materials unlike metal materials, have corrosion resistance, insulation properties, and dielectric properties.
  • aluminum nitride is ceramic and has excellent thermal conductivity properties equivalent to or greater than that of aluminum metal. Due to these characteristics, the ceramic material can be used for, for example, an insulating substrate on which circuits for LED and power semiconductor packages are formed.
  • such ceramic materials can be used to control the temperature of these substrates, for example, while passing through the wafer and glass substrates in chemical vapor deposition (CVD), physical vapor deposition (PVD), and plasma etching processes for manufacturing semiconductor and display devices. Complex flow paths of heating devices or cooling media are used in susceptors.
  • aluminum coated with an oxide coating layer may be used by an anodizing and thermal spraying process of the ceramic material.
  • the oxide film layer is destroyed in a rapid temperature cycle to realize a wide temperature range or a high process speed, and its use is very limited.
  • a metal substrate and a heterogeneous material such as a ceramic material may be used to join and assemble a ceramic substrate material having an electrostatic chuck function on an aluminum body in which a complicated flow path is embedded.
  • a component of a type bonded to the polymer adhesive at room temperature is used.
  • the use of such an adhesive due to the low thermal conductivity of the adhesive, not only does not effectively control the temperature rise of the substrate, but also has a problem of impairing the large-area deposition and the temperature uniformity of the etching substrate. Problems include the low heat resistance of the joints and the contamination of the process chamber due to the polymer adhesive in an elevated temperature atmosphere caused by the collision.
  • a heating plate made of aluminum nitride (AlN) containing a metal heating element coil such as molybdenum or tungsten having a thermal expansion coefficient close to ceramic is used as a high temperature heating part used in a chemical vapor deposition process.
  • AlN aluminum nitride
  • a metal heating element coil such as molybdenum or tungsten having a thermal expansion coefficient close to ceramic
  • the present invention has been made to solve the above problems, to provide a heterojunction structure that can withstand high temperature and wide temperature cycle environment, for this purpose, it is possible to precise cutting processing, such as metal, thermal conductivity In order to minimize the thermal stress of the dissimilar junction, most of all, the application of a new low thermal expansion material close to the thermal expansion coefficient of the ceramic and the joint assembly method that can form and maintain a good interface with the ceramic even in a wide and rapid temperature cycle. To provide.
  • This problem of the present invention has been presented by way of example, and therefore, the present invention is not limited to this problem.
  • a heterojunction structure according to one aspect of the present invention is provided.
  • the heterojunction structure has a first portion comprising ceramic and a second portion comprising carbon and brazing bonded to the first portion.
  • the second portion may include a hybrid composite including carbon.
  • the hybrid composite may include a body portion including carbon and a canning portion including aluminum and surrounding the outer surface of the body portion.
  • the hybrid composite includes a plurality of carbon layers spaced apart from each other, a sintered composite layer of aluminum and carbon and aluminum interposed between the plurality of carbon layers and the plurality of carbon layers Canning unit surrounding the outer surface of the sintered composite layer may be provided.
  • the hybrid composite includes a plurality of carbon layers disposed to be spaced apart from each other, aluminum and a thermally conductive layer and aluminum interposed between the plurality of carbon layers and the plurality of carbon layers and the Canning portion surrounding the outer surface of the thermal conductive layer may be provided.
  • the thermal expansion coefficient ⁇ 2 of the hybrid composite may satisfy the relationship between the thermal expansion coefficient ⁇ 1 and ( ⁇ 1 x 0.9) ⁇ 2 ⁇ ( ⁇ 1 x 1.1) of the ceramic.
  • the second portion may be a body portion composed only of carbon.
  • the carbon may include at least one of isotropic carbon and anisotropic carbon.
  • the ceramic may include aluminum nitride (AlN), and the first part may be directly brazed to the second part.
  • AlN aluminum nitride
  • the ceramic includes alumina (Al 2 O 3 ), and the first part is brazed with the second part via a molybdenum-manganese metallization layer formed on a surface facing the second part. Can be bonded.
  • a method of manufacturing a heterojunction structure includes preparing a first part including a ceramic, forming a second part including carbon, and brazing the first part and the second part.
  • the forming of the second portion including carbon may include forming a first structure including carbon and a canning portion including aluminum to surround an outer surface of the first structure. It may comprise the step of forming.
  • the first structure may include a body portion including carbon.
  • the first structure may include a plurality of carbon layers disposed spaced apart from each other and a sintered composite layer of aluminum and carbon interposed between the plurality of carbon layers.
  • the first structure may include a plurality of carbon layers and aluminum disposed to be spaced apart from each other, and may include a thermal conductive layer interposed between the plurality of carbon layers.
  • forming a metallization layer surrounding the outer surface of the first structure may be further provided.
  • the forming of the metallizing layer may include disposing a metal foil on the outer surface of the first structure via a first filler and performing a first heat treatment of the first structure, the first filler, and the metal foil. It may be provided with a step.
  • the forming of the canning part may include disposing an aluminum plate on an outer surface of the first structure via a second filler and the first structure, the second filler, and the aluminum. And a second heat treatment of the plate material. Furthermore, the step of brazing bonding may include a third heat treatment of the first part, the second part and the third filler via a third filler between the first part and the second part. .
  • the second filler and the third filler may be made of the same material, and the second heat treatment and the third heat treatment may be simultaneously performed under the same heat treatment conditions.
  • FIG. 1 is a cross-sectional view illustrating a heterojunction structure according to an embodiment of the present invention.
  • FIG. 2 is a photograph showing the appearance of a heterojunction structure after brazing of an aluminum nitride / carbon material.
  • FIG. 3A is a photograph showing the appearance of a heterojunction structure after brazing of an aluminum nitride (AlN) / carbon material (ET-10) according to an embodiment of the present invention
  • FIG. 3B is an aluminum nitride according to a comparative example of the present invention ( Photograph showing appearance of heterojunction structure after brazing of AlN) / Al6061 series alloy.
  • 4A and 4B are planar and cross-sectional texture photographs of a sintered composite of aluminum powder and 50 vol% carbon fiber, respectively.
  • FIG. 5 is a cross-sectional view illustrating a heterojunction structure according to another embodiment of the present invention.
  • FIG. 6 is a cross-sectional view illustrating a heterojunction structure according to still another embodiment of the present invention.
  • FIG. 7 is a cross-sectional view illustrating a heterojunction structure according to still another embodiment of the present invention.
  • 8A to 8F illustrate a method of forming a heterojunction structure according to still another embodiment of the present invention.
  • 9A and 9B illustrate a modified method of forming a heterojunction structure according to another embodiment of the present invention.
  • Part 1 composed of ceramic
  • top or bottom mentioned in the description of this embodiment may be used to describe the relative relationship of certain elements to other elements, as illustrated in the figures. That is, relative terms may be understood to include other directions of the structure separately from the direction depicted in the figures. For example, if the top and bottom of the structure in the figures are upside down, elements depicted as being on the top of other elements may be on the bottom of the other elements. Thus, by way of example, the term “top” may include both “top” and “bottom” directions, relative to a particular direction in the figures.
  • the component when referring to a component "on” or “connected” to another component, the component is located directly on the other component. Alternatively, the present invention may be directly connected to the other components. Furthermore, one or more intervening components may be present therebetween. However, when referring to a component “directly” to another component, “directly connected” to another component, or “direct contact” to another component, unless otherwise stated, This means that there are no components intervening in.
  • the x-axis, y-axis and z-axis are not limited to three axes on the Cartesian coordinate system, but may be interpreted in a broad sense including the same.
  • the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.
  • a heterojunction structure according to an embodiment of the present invention includes a first part 410 including ceramic and a second part 201 including carbon. Since the first part 410 and the second part 201 are brazed, the brazing joint 310 is interposed between the first part 410 and the second part 201.
  • the brazing joint 310 may be understood as a heterojunction in which at least a portion of the filler and the bonding base material used for the brazing joint are melt-diffused. Although explicitly shown in the drawings, the brazing joint 310 may include the first part ( 410 and / or second portion 201 may not be clearly distinguished.
  • the first part 410 may include a ceramic material, and may include, for example, aluminum nitride (AlN) or alumina (Al 2 O 3 ).
  • the second portion 201 may be a body portion 112 composed of only carbon.
  • the second portion 201 may be configured to include isotropic carbon or anisotropic carbon.
  • the second portion 201 may be composed of a sintered composite of aluminum and carbon.
  • the first part 410 includes aluminum nitride (AlN)
  • the first part 410 and the second part 201 may be directly brazed, but the first part 410 may be alumina (AlN). 2 O 3 )
  • the first portion 410 may be brazed to the second portion 201 via a molybdenum-manganese metallization layer formed on a surface opposite the second portion 201. Can be.
  • Table 1 shows the coefficient of thermal expansion and thermal conductivity of carbon materials, sintered composite materials and ceramic materials that can be applied to the present invention.
  • a heterojunction structure in which a carbon material having a coefficient of thermal expansion equal to or less than that of an aluminum nitride (AlN) ceramic is directly bonded to an aluminum nitride (AlN) ceramic using an active filler metal.
  • AlN aluminum nitride
  • Ag-Cu-Ti-based and Au-Ni-Ti-based filler metals may be used as the active filler metal.
  • Ti-Zr-based active filler metals containing a large amount of active metals such as titanium (Ti) and zirconium (Zr) may be used.
  • FIG. 2 is a photograph showing the appearance of a heterojunction structure of aluminum nitride (AlN) / carbon material (ET-10) bonded by brazing.
  • AlN aluminum nitride
  • ET-10 carbon material
  • the size of the aluminum nitride (AlN) ceramic substrate was 125mm x 62mm x 0.2mmt and the carbon material was 125mm x 62mm x 10mmt graphite material (ET-10).
  • the thermal expansion coefficient of aluminum nitride (AlN) is 4.5 x 10 -6 / K
  • the thermal expansion coefficient of ET-10 which is a kind of carbon material, is 3.8 x 10 -6 / K. It is possible to implement a stable heterojunction structure.
  • a heterojunction structure was formed in which a base material of aluminum nitride (AlN) and an Al6061 series alloy were joined by brazing.
  • FIG. 3A is a photograph showing the appearance of a heterojunction structure after brazing of an aluminum nitride (AlN) / carbon material (ET-10) according to an embodiment of the present invention
  • FIG. 3B is an aluminum nitride according to a comparative example of the present invention ( Photograph showing appearance of heterojunction structure after brazing of AlN) / Al6061 series alloy.
  • Ti-43.5Zr-6.5Ni-8.1Cu alloy was used as a filler, and a high vacuum graphite furnace having a vacuum degree of 1 x 10 -5 Torr or less was used for 900 minutes for 30 minutes. The temperature of °C was maintained.
  • the second portion 201 may be composed of a sintered composite of aluminum and carbon.
  • Carbon is a reinforcing material of the sintered composite material, and for example, carbon fiber may be applied, and chopped carbon fiber (milled carbon fiber) having a length of 100 microns or less may be used.
  • chopped carbon fiber milled carbon fiber
  • the blending ratio of aluminum powder and carbon may be up to 20 to 60 vol%, but the range is preferably 30 to 50 vol% in consideration of the coefficient of thermal expansion and sintering.
  • the aluminum powder and the carbon fiber may be mixed by dry and wet methods, and then sintered and bulked by a general sintering method such as, for example, a hot press method, energizing pressure sintering method, or HIP method.
  • a favorable sintered compact can be obtained through vacuum sintering at 500-650 degreeC and pressing force which are below the melting
  • 4A and 4B show the top and cross-section views of the structure photographs of the sintered composite of aluminum powder and 50 vol% carbon fiber, respectively.
  • a heterojunction structure according to another embodiment of the present invention includes a first part 410 including ceramic and a second part 202 including carbon. Since the first part 410 and the second part 202 are brazed, a brazing joint 310 is interposed between the first part 410 and the second part 202.
  • the brazing joint 310 may be understood as a heterojunction in which at least some of the filler and the bonding base material used for the brazing joint are melt-diffused.
  • the first part 410 is actually implemented in the structure. And / or not distinct from the second portion 202.
  • the first part 410 may include a ceramic material, and may include, for example, aluminum nitride (AlN) or alumina (Al 2 O 3 ).
  • the second portion 202 is a hybrid composite including carbon and includes a body portion 112 including carbon and a canning portion 144 including aluminum and surrounding the outer surface of the body portion 112.
  • Body portion 112 is configured to include carbon, for example, may be configured to include isotropic carbon or anisotropic carbon, shown in Table 1.
  • the body portion 112 may be composed of a sintered composite of aluminum and carbon.
  • the first part 410 includes aluminum nitride (AlN)
  • the first part 410 and the second part 202 may be directly brazed, but the first part 410 is made of alumina (AlN). 2 O 3 ), the first portion 410 may be brazed to the second portion 202 via a molybdenum-manganese metallization layer formed on a surface opposite the second portion 202. Can be.
  • the canning part 144 may be implemented by performing a canning process to surround the top, bottom, and side surfaces of the body part 112, and may include, for example, aluminum.
  • the canning unit 144 may be implemented by arranging an aluminum plate including an Al6061 series alloy on the outer surface of the body portion 112 through a filler including an Al4047 series alloy, and then heat treating the aluminum plate. .
  • a metallizing process of forming a metal layer on the body portion 112 may be performed first.
  • the coefficient of thermal expansion ⁇ 2 of the hybrid composite body 202 including the body 112 and the canning unit 144 is the coefficient of thermal expansion ⁇ Al and the volume fraction t Al of the canning unit 144 as shown in Equation 1 below.
  • Is equal to the sum of the product of the coefficient of thermal expansion ( ⁇ g ) and the volume fraction (t g ) of the body portion 112.
  • the volume fraction of each component corresponds to the ratio of the total thickness of each component to the total thickness of the hybrid composite 202, where the thickness direction is a direction along the line A-A 'in the figure (y direction). it means.
  • ⁇ 2 ⁇ Al t Al + ⁇ g t g
  • Table 2 shows the thermal expansion coefficient of the hybrid composite 202 according to various embodiments consisting of the body portion 112 and the canning unit 144.
  • the thermal expansion coefficient of the hybrid composite body 202 can be designed suitably. have.
  • the thermal expansion coefficient ⁇ 2 of the hybrid composite 202 implemented in the heterojunction structure according to the embodiments of the present invention may be controlled within a predetermined level range with the thermal expansion coefficient ⁇ 1 of the ceramic 410, for example, The relationship of Equation 2 may be satisfied.
  • the thermal expansion of the hybrid composite constituting the second part 202 implemented in cases 1 to 2 of Table 2 is described.
  • the coefficient (4.428 or 4.42) satisfies Equation 2 above.
  • the ceramic constituting the first part 410 is alumina having a coefficient of thermal expansion of about 7.8
  • the thermal expansion coefficient of the hybrid composite constituting the second part 202 implemented in cases 3 to 5 of Table 2 is Equation 2 is satisfied.
  • the heterojunction structure according to another embodiment of the present invention includes a first part 410 including ceramic and a second part 203 including carbon. Since the first part 410 and the second part 203 are brazed, the brazing joint 310 is interposed between the first part 410 and the second part 203.
  • the brazing joint 310 may be understood as a heterojunction in which at least a portion of the filler and the bonding base material used for the brazing joint are melt-diffused.
  • the first part 410 is used. And / or the second portion 203 may not be clearly distinguished.
  • the first part 410 may include a ceramic material, and may include, for example, aluminum nitride (AlN) or alumina (Al 2 O 3 ).
  • the second part 203 is a hybrid composite including carbon, and the sintered composite layer 114 of aluminum and carbon interposed between the plurality of carbon layers 113 and the plurality of carbon layers 113 disposed to be spaced apart from each other. ). Further, the second portion 203 includes aluminum and includes a plurality of carbon layers 113 and a canning portion 144 surrounding the outer surface of the sintered composite layer 114. Since the sintered composite layer 114 has already been described above with reference to FIGS. 4A and 4B, description thereof will be omitted. Meanwhile, the carbon constituting the plurality of carbon layers 113 and the sintered composite layer 114 may include, for example, isotropic carbon or anisotropic carbon disclosed in Table 1.
  • the first part 410 includes aluminum nitride (AlN)
  • the first part 410 and the second part 203 may be directly brazed, but the first part 410 is made of alumina (AlN). 2 O 3 ), the first portion 410 may be brazed to the second portion 203 via a molybdenum-manganese metallization layer formed on a surface opposite the second portion 203. Can be.
  • the canning unit 144 may be implemented by performing a canning process to surround the top, bottom, and side surfaces of the plurality of carbon layers 113 and the sintered composite layer 114 except for the mutual contact surface. It can be configured to include.
  • the canning unit 144 may be formed on an outer surface of the plurality of carbon layers 113 and the sintered composite layer 114 by interposing a filler including an Al4047 series alloy, and forming an aluminum plate including an Al6061 series alloy. After placement, it may be formed by heat treatment. Meanwhile, before performing a canning process on the laminate structure composed of the plurality of carbon layers 113 and the sintered composite layer 114, a metallizing process of selectively forming a metal layer on the laminate structure may be performed first. It may be.
  • the thermal expansion coefficient ⁇ 2 of the hybrid composite 203 composed of the plurality of carbon layers 113, the sintered composite layer 114, and the canning unit 144 is the thermal expansion coefficient of the canning unit 144 as shown in Equation 3 below.
  • the coefficient of thermal expansion of ( ⁇ Al) and the volume fraction of a product of a (t Al) to the product of the coefficient of thermal expansion ( ⁇ g) and the volume fraction (t g) of the plurality of carbon layers 113 and the sintered composite layer (114) ( ⁇ cf ) and the product of the volume fraction (t cf ).
  • the volume fraction of each component corresponds to the ratio of the total thickness of each component to the total thickness of the hybrid composite 203, where the thickness direction is a direction along the line A-A 'in the figure (y direction). it means.
  • ⁇ 2 ⁇ Al t Al + ⁇ g t g + ⁇ cf t cf
  • Table 3 shows the coefficient of thermal expansion of the hybrid composite 203 according to various embodiments consisting of a plurality of carbon layers 113, the sintered composite layer 114 and the canning unit 144.
  • Types of carbon materials that control the volume fraction of the plurality of carbon layers 113, the sintered composite layer 114, and the canning unit 144, and constitute the plurality of carbon layers 113 and the sintered composite layer 114.
  • the thermal expansion coefficient ⁇ 2 of the hybrid composite 203 implemented in the heterojunction structure according to the embodiments of the present invention may be controlled within a predetermined level range with the thermal expansion coefficient ⁇ 1 of the ceramic 410, for example, The relationship of Equation 2 may be satisfied.
  • the thermal expansion of the hybrid composite constituting the second part 203 implemented in cases 1 to 2 of Table 3 is described.
  • the coefficient 4.654 or 4.177 satisfies Equation 2 above.
  • the heterojunction structure according to another embodiment of the present invention includes a first part 410 including ceramic and a second part 204 including carbon. Since the first portion 410 and the second portion 204 are brazed, a brazing junction 310 is interposed between the first portion 410 and the second portion 204.
  • the brazing joint 310 may be understood as a heterojunction in which at least some of the filler and the bonding base material used for the brazing joint are melt-diffused.
  • the first part 410 is actually implemented in the structure. And / or not distinct from the second portion 204.
  • the first part 410 may include a ceramic material, and may include, for example, aluminum nitride (AlN) or alumina (Al 2 O 3 ).
  • the second part 204 is a hybrid composite including carbon, and includes a plurality of carbon layers 113 and aluminum disposed apart from each other, and a thermal conductive layer 146 interposed between the plurality of carbon layers 113. It is provided. Since the thermal conductive layer 146 includes, for example, aluminum having a relatively high thermal conductivity, the thermal conductivity of the second portion 204 may be increased. Further, the second portion 204 includes, for example, aluminum and includes a plurality of carbon layers 113 and a canning portion 144 surrounding the outer surface of the thermal conductive layer 146.
  • Carbon constituting the plurality of carbon layers 113 may include, for example, isotropic carbon or anisotropic carbon, which is disclosed in Table 1 below. Also, in the modified embodiment, the plurality of carbon layers 113 may be made of a sintered composite of aluminum and carbon.
  • the first part 410 includes aluminum nitride (AlN)
  • the first part 410 and the second part 204 may be directly brazed, but the first part 410 is made of alumina (AlN). 2 O 3 ), the first portion 410 may be brazed to the second portion 204 via a molybdenum-manganese metallization layer formed on a surface opposite the second portion 204. Can be.
  • the canning unit 144 may be implemented by performing a canning process to surround the top, bottom, and side surfaces of the plurality of carbon layers 113 and the thermal conductive layer 146 except for the mutual contact surface, and may include aluminum.
  • the canning unit 144 may be formed on the outer surface of the plurality of carbon layers 113 and the thermal conductive layer 146 by interposing a filler including an Al4047 series alloy, and forming an aluminum plate including an Al6061 series alloy. After placement, it may be formed by heat treatment. Meanwhile, before performing a canning process on the laminate structure composed of the plurality of carbon layers 113 and the heat conductive layer 146, optionally, a metallizing process of forming a metal layer on the laminate structure may be performed first. have.
  • the thermal expansion coefficient ⁇ 2 of the hybrid composite 204 composed of the plurality of carbon layers 113, the thermal conductive layer 146, and the canning unit 144 may be represented by the canning unit 144 and the thermal conductive layer ( It is equal to the sum of the product of the coefficient of thermal expansion ⁇ Al and the volume fraction t Al of 146 and the product of the coefficient of thermal expansion ⁇ g and the volume fraction t g of the carbon layers 113.
  • the volume fraction of each component corresponds to the ratio of the total thickness of each component to the total thickness of the hybrid composite, and the direction of the thickness refers to the direction (y direction) along the line A-A 'in the figure.
  • ⁇ 2 ⁇ Al t Al + ⁇ g t g
  • Table 4 shows the coefficient of thermal expansion of the hybrid composite 204 according to various embodiments consisting of a plurality of carbon layers 113, the thermal conductive layer 146 and the canning unit 144.
  • the thermal expansion coefficient ⁇ 2 of the hybrid composite 204 implemented in the heterojunction structure according to the embodiments of the present invention may be controlled within a predetermined level range with the thermal expansion coefficient ⁇ 1 of the ceramic 410, for example, The relationship of Equation 2 may be satisfied.
  • the coefficient of thermal expansion of the hybrid composite constituting the second portion 204 when the ceramic constituting the first portion 410 is alumina having a coefficient of thermal expansion of 7.8, the coefficient of thermal expansion of the hybrid composite constituting the second portion 204, implemented in cases 1 to 3 of Table 4, 7.69, 7.72, or 7.84 satisfies Equation 2 above.
  • the structure 201 including the carbon shown in FIG. 1 and the hybrid composites 202, 203, and 204 shown in FIGS. 5 to 7 have excellent machinability to complex shapes,
  • the thermal expansion coefficient is close to alumina ceramics (7.8 x 10 -6 / k) and aluminum nitride ceramics (4.5 x 10 -6 / k) to reduce the thermal stress of the heterojunction structure. That is, according to the embodiments of the present invention, the carbon material and its hybrid composite material may be applied instead of the conventional aluminum material or copper material that is joined to the ceramic, and a heterojunction structure having a good bonding interface may be realized by brazing. Therefore, it is possible to provide a structure that can be used with durability even in a wide and rapid temperature cycle.
  • 8A to 8F illustrate a method of manufacturing a heterojunction structure according to another embodiment of the present invention, and exemplarily illustrate a method of manufacturing the heterojunction structure shown in FIG. 5.
  • a structure including a body part 112 including carbon is prepared. Description of the structure consisting of the body portion 112 including the carbon is the same as that described above with reference to Figure 5 will be omitted here.
  • the structure consisting of the body portion 112 containing carbon as shown in Figure 6, a plurality of carbon layers 113 and a plurality of carbon layers disposed spaced apart from each other It can be replaced by a laminated structure composed of a sintered composite layer 114 of aluminum and carbon interposed between the (113).
  • the structure composed of the body portion 112 including carbon as shown in Figure 7, a plurality of carbon layers 113 and a plurality of carbon disposed to be spaced apart from each other It may be replaced by a laminated structure composed of a thermally conductive layer 146 interposed between the layers 113.
  • a stainless foil 124 is provided on an outer surface (upper surface, lower surface and side surfaces except for mutual contact surfaces) of the structure 112 via a first filler 122.
  • the first filler 122 and the stainless foil 124 were first heat treated, for example, at a temperature of 1050 ° C. for 30 minutes to form an outer surface of the structure 112.
  • the surrounding metalizing layer 126 may be formed.
  • the first filler 122 may include, for example, BNi 2 .
  • the aluminum plate 142 is disposed on the structure 112 on which the metallization layer 126 is formed on the outer surface via the second filler 141.
  • the aluminum plate 142 may be understood as a case containing aluminum.
  • the structure 112, the second filler 141, and the aluminum plate 142 are subjected to a second heat treatment, for example, at a temperature of 600 ° C. for 30 minutes, thereby forming the canning portion 144 on the structure 112.
  • a second portion 202 comprising carbon is implemented.
  • the second filler 141 may include, for example, an Al4047 series alloy that is an aluminum alloy containing 12% of silicon.
  • the aluminum plate 142 may include, for example, an Al6061 series alloy.
  • a first part 410 including ceramic is prepared, and the first part 410 and the second part 202 are brazed.
  • the brazing joint is, for example, 30 minutes at a temperature of 600 ° C. after interposing a third filler 312 between the first portion 410 and the second portion 202, which includes, for example, an Al4047 series alloy. It can be performed by a third heat treatment.
  • the brazing bonding portion 310 is interposed between the first portion 410 and the second portion 201.
  • the brazing joint 310 may be understood as a heterojunction in which at least a portion of the filler and the joining base material used for the brazing joint are melt-diffused.
  • the brazing joint 310 may include the first part 410 and And / or may not be distinct from the second portion 202.
  • the second heat treatment performed to form the canning unit 144 and the third heat treatment performed for brazing bonding may be heat treatments performed simultaneously under the same heat treatment conditions. This is because the second filler 141 required for the second heat treatment and the third filler 312 required for the third heat treatment may be made of the same Al4047-based alloy, and may have the same heat treatment temperature and time. Do. Therefore, according to the method of manufacturing a heterojunction structure according to an embodiment of the present invention, the second heat treatment performed for forming the canning unit 144 and the third heat treatment performed for brazing bonding are not performed separately, respectively. Since it can be performed at the same time at the same time, the thermal burden applied to the heterojunction structure is lowered, and furthermore, the effect of lowering the production cost can be expected.
  • the first part 410 when the first part 410 includes aluminum nitride (AlN), the first part 410 and the second part 202 may be directly brazed.
  • 9A and 9B when the first portion 410 includes alumina (Al 2 O 3 ), the first portion 410 is formed of molybdenum on a surface opposite to the second portion 202. It may be brazed to the second portion 202 through the manganese metallization layer 320.
  • the canning unit 144, the thermal conductive layer 146, the ceramic material constituting the first portion 410, the first filler 122, the second filler 141, the third filler 312, the metallizing layer Components 126 and 320, the metal plate 142 and the metal foil 124, and the like mentioned above are illustrative, and it is apparent that the technical spirit of the present invention is not limited thereto.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Products (AREA)

Abstract

La présente invention se rapporte à une structure d'hétérojonction et à son procédé de fabrication, et plus particulièrement à une structure d'hétérojonction présentant une aptitude à la découpe de précision et une meilleure conductibilité thermique afin de réduire au minimum la contrainte thermique dans une région d'hétérojonction, et à un procédé de fabrication de celle-ci. A cette fin, la structure d'hétérojonction comprend : une première partie comprenant de la céramique ; et une seconde partie comprenant du carbone et jointe à la première partie par brasage.
PCT/KR2013/001684 2012-02-29 2013-02-28 Structure d'hétérojonction et son procédé de fabrication WO2013129891A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20120021442 2012-02-29
KR10-2012-0021442 2012-02-29
KR1020120086714A KR101411956B1 (ko) 2012-02-29 2012-08-08 이종접합 구조체 및 그 제조방법
KR10-2012-0086714 2012-08-08

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WO2013129891A1 true WO2013129891A1 (fr) 2013-09-06

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4981761A (en) * 1988-06-03 1991-01-01 Hitachi, Ltd. Ceramic and metal bonded composite
KR960013553A (ko) * 1994-10-08 1996-05-22 김영욱 세라믹 접합용 용가재 조성물 및 이를 이용한 세라믹의 접합방법
US5807626A (en) * 1995-07-21 1998-09-15 Kabushiki Kaisha Toshiba Ceramic circuit board
EP1500455A1 (fr) * 2003-07-24 2005-01-26 Ansaldo Ricerche S.p.A. Procédé pour fabriquer des joints brasés de haute résistance dans des matériaux composites multicouches et matériau composite multicouches obtenu par ladite méthode
KR20120078270A (ko) * 2010-12-31 2012-07-10 한국생산기술연구원 저열팽창 복합소재를 이용한 서셉터 및 ｅｓｃ 부품 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4981761A (en) * 1988-06-03 1991-01-01 Hitachi, Ltd. Ceramic and metal bonded composite
KR960013553A (ko) * 1994-10-08 1996-05-22 김영욱 세라믹 접합용 용가재 조성물 및 이를 이용한 세라믹의 접합방법
US5807626A (en) * 1995-07-21 1998-09-15 Kabushiki Kaisha Toshiba Ceramic circuit board
EP1500455A1 (fr) * 2003-07-24 2005-01-26 Ansaldo Ricerche S.p.A. Procédé pour fabriquer des joints brasés de haute résistance dans des matériaux composites multicouches et matériau composite multicouches obtenu par ladite méthode
KR20120078270A (ko) * 2010-12-31 2012-07-10 한국생산기술연구원 저열팽창 복합소재를 이용한 서셉터 및 ｅｓｃ 부품 제조 방법

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