KR960013553A - Filler composition for ceramic joining and ceramic joining method using the same - Google Patents

Filler composition for ceramic joining and ceramic joining method using the same Download PDF

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Publication number
KR960013553A
KR960013553A KR1019940025779A KR19940025779A KR960013553A KR 960013553 A KR960013553 A KR 960013553A KR 1019940025779 A KR1019940025779 A KR 1019940025779A KR 19940025779 A KR19940025779 A KR 19940025779A KR 960013553 A KR960013553 A KR 960013553A
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KR
South Korea
Prior art keywords
ceramic
filler
ceramics
ceramic joining
metal
Prior art date
Application number
KR1019940025779A
Other languages
Korean (ko)
Other versions
KR0120956B1 (en
Inventor
고명완
신승용
Original Assignee
김영욱
생산기술연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 김영욱, 생산기술연구원 filed Critical 김영욱
Priority to KR1019940025779A priority Critical patent/KR0120956B1/en
Publication of KR960013553A publication Critical patent/KR960013553A/en
Application granted granted Critical
Publication of KR0120956B1 publication Critical patent/KR0120956B1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Products (AREA)

Abstract

본 발명은 세라믹의 접합에 사용되는 용가재(Fller)용 합금조성물 및 이러한 용가재를 사용하여 세라믹과 금속, 또는 세라믹과 세라믹을 접합시키는 접합방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an alloy composition for filler materials used for bonding ceramics and a bonding method for bonding ceramics and metals or ceramics and ceramics using such filler materials.

본 발명에 따르면, Cu 40-70wt%, Ti 20-40wt%, Mn 10-20wt%의 조성비를 가진 세라믹과 금속의 접합용 용가재합금 조성물이 제공된다.According to the present invention, there is provided a filler metal alloy composition for joining ceramics and metals having a composition ratio of 40 to 70 wt% Cu, 20 to 40 wt% Ti, and 10 to 20 wt% Mn.

또한, 본 발명에 따르면, Cu 40-45wt%, Ti 45-50wt%, Al 5-10wt%의 조성비를 가진 세라믹과 금속의 접합용 용가재합금 조성물이 제공된다.In addition, according to the present invention, there is provided a filler metal alloy composition for joining ceramics and metals having a composition ratio of 40 to 45 wt% Cu, 45 to 50 wt% Ti, and 5 to 10 wt% Al.

본 발명에 따른 용가재를 피접합모재인 세라믹기판과 금속부재 또는 세라믹부재를 올려놓은 후, 용가재의 용융온도 이상으로 가열함으로서 간단한 공정으로 세라믹과 금속 또는 세라믹을 접합시킬 수 있다.After placing the filler metal according to the present invention on the ceramic substrate, the metal member or the ceramic member, which is to be joined, and heating the melting material above the melting temperature of the filler metal, the ceramic and the metal or ceramic can be joined in a simple process.

Description

세라믹 접합용 용가재 조성물 및 이를 이용한 세라믹의 접합방법Filler composition for ceramic joining and ceramic joining method using the same

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명의 실시예의 경도를 비교한 도표,1 is a table comparing the hardness of the embodiments of the present invention,

제2도는 본 발명에 따른 용가재를 사용하여 접합한 접합체의 강도비교표,2 is a strength comparison table of the bonded body bonded using the filler metal according to the present invention,

제3도는 종래의 메탈라이즈 브레이징 접합법의 개략 공정도,3 is a schematic process diagram of a conventional metallized brazing bonding method,

제4도는 본 발명에 따른 접합법의 개략공정도.4 is a schematic process diagram of a bonding method according to the present invention.

Claims (3)

Cu 40-70wt%, Ti 20-40wt%, Mn 10-20wt%의 조성비를 가진 세라믹 접합용 용가재합금 조성물.A filler alloy composition for ceramic joining having a composition ratio of 40-70 wt% Cu, 20-40 wt% Ti, and 10-20 wt% Mn. Cu 40-45wt%, Ti 45-50wt%, Al 5-10wt%의 조성비를 가진 세라믹 접합용 용가재합금 조성물.A filler alloy composition for ceramic joining having a composition ratio of 40-45 wt% Cu, 45-50 wt% Ti, and 5-10 wt% Al. 세라믹기판 상에 Cu-Ti-Mn 또는 Cu-Ti-Al계 합금으로 된 용가재를 배치하고, 용가재 위에 피접합 금속부재 또는 세라믹부재를 올려놓은 후, 용가재의 용융온도 이상으로 가열하여 세라믹 기판과 금속부재 또는 세라믹부재를 접합시키는 것을 특지으로 하는 세라믹의 접합방법.The filler metal made of Cu-Ti-Mn or Cu-Ti-Al-based alloy is placed on the ceramic substrate, the metal member or ceramic member to be joined is placed on the filler metal, and then heated above the melting temperature of the filler metal, thereby heating the ceramic substrate and the metal. A ceramic joining method characterized by joining members or ceramic members. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940025779A 1994-10-08 1994-10-08 A composition for ceramic joining KR0120956B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940025779A KR0120956B1 (en) 1994-10-08 1994-10-08 A composition for ceramic joining

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940025779A KR0120956B1 (en) 1994-10-08 1994-10-08 A composition for ceramic joining

Publications (2)

Publication Number Publication Date
KR960013553A true KR960013553A (en) 1996-05-22
KR0120956B1 KR0120956B1 (en) 1997-10-22

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ID=19394703

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940025779A KR0120956B1 (en) 1994-10-08 1994-10-08 A composition for ceramic joining

Country Status (1)

Country Link
KR (1) KR0120956B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013129891A1 (en) * 2012-02-29 2013-09-06 한국생산기술연구원 Heterojunction structure and method for manufacturing same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013129891A1 (en) * 2012-02-29 2013-09-06 한국생산기술연구원 Heterojunction structure and method for manufacturing same

Also Published As

Publication number Publication date
KR0120956B1 (en) 1997-10-22

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