WO2013129020A1 - サーマルヘッドおよびこれを備えるサーマルプリンタ - Google Patents
サーマルヘッドおよびこれを備えるサーマルプリンタ Download PDFInfo
- Publication number
- WO2013129020A1 WO2013129020A1 PCT/JP2013/052155 JP2013052155W WO2013129020A1 WO 2013129020 A1 WO2013129020 A1 WO 2013129020A1 JP 2013052155 W JP2013052155 W JP 2013052155W WO 2013129020 A1 WO2013129020 A1 WO 2013129020A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat generating
- thermal head
- convex portion
- coating layer
- recording medium
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/3353—Protective layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/3351—Electrode layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/33515—Heater layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/33525—Passivation layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/33535—Substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/3354—Structure of thermal heads characterised by geometry
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33545—Structure of thermal heads characterised by dimensions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/3355—Structure of thermal heads characterised by materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33555—Structure of thermal heads characterised by type
- B41J2/3357—Surface type resistors
Definitions
- the present invention relates to a thermal head and a thermal printer including the same.
- a thermal head described in Patent Document 1 includes a substrate, a heat storage layer provided on the substrate, a heat generating part provided on the heat storage layer, an electrode electrically connected to the heat generating part, And a coating layer disposed on the downstream side of the heat generating portion in the recording medium conveyance direction.
- the coating layer has a convex portion. For this reason, when the thermal head is used to print on the recording medium, the printing medium may come into contact with the convex portion, so that the printing medium may be scratched or blurred.
- a thermal head includes a substrate, a heat storage layer provided on the substrate, a heat generating portion provided on the heat storage layer, and an electrode electrically connected to the heat generating portion.
- a protective layer covering a part of the heat generating part and the electrode, and a first covering layer covering a part of the protective layer and disposed downstream of the heat generating part in the conveyance direction of the recording medium.
- the first coating layer has a first convex portion that protrudes toward the recording medium side, and an end portion of the first coating layer on the heat generating portion side is formed between the first convex portion and the heat generating portion.
- the distance between the heat generating part and the first convex part is L
- the end of the first coating layer on the heat generating part side is L / 2 from the heat generating part.
- a thermal printer includes the thermal head described above, a transport mechanism that transports a recording medium onto a heat generating portion, and a platen roller that presses the recording medium onto the heat generating portion.
- FIG. 2 is a cross-sectional view of the thermal head shown in FIG. 1 taken along the line II.
- FIG. 2 is a sectional view of the thermal head shown in FIG. 1 taken along the line II-II. It is an expanded sectional view which expands and shows the heat generating part vicinity of the thermal head shown in FIG. It is an expanded sectional view corresponding to FIG. 4 of the conventional thermal head.
- substrate which comprises the thermal head shown in FIG.
- FIG. 7 is a plan view of the head substrate of FIG. 6, omitting illustration of a protective layer, a coating layer, a driving IC, and a coating member.
- FIG. 1 is a schematic diagram showing a schematic configuration of an embodiment of a thermal printer of the present invention. It is an expanded sectional view concerning other embodiments of the thermal head of the present invention. It is a top view which shows other embodiment of the thermal head of this invention.
- (A) is a sectional view taken along line III-III shown in FIG. 11, and (b) is a sectional view taken along line IV-IV shown in FIG.
- FIG. 14 is a plan view showing a thermal head according to still another embodiment of the present invention, and FIG.
- FIG. 13B is a sectional view taken along line VV of the thermal head shown in FIG. (A) is a sectional view taken along the line VI-VI of the thermal head shown in FIG. 13 (b), and (b) is a sectional view taken along the line VII-VII of the thermal head shown in FIG. 13 (b). It is an enlarged plan view showing a thermal head according to still another embodiment of the present invention.
- the thermal head X1 according to the first embodiment will be described with reference to the drawings.
- the thermal head X1 of the present embodiment includes a radiator 1, a head substrate 3 disposed on the radiator 1, and a flexible printed wiring board 5 connected to the head substrate 3 (hereinafter referred to as the head substrate 3). , Referred to as FPC5).
- the radiator 1 is made of, for example, a metal material such as copper or aluminum, and has a base portion 1a that is rectangular in plan view, and a protruding portion 1b that extends along one long side of the base portion 1a. It has. As shown in FIG. 2, the head base 3 is bonded to the upper surface of the base portion 1a excluding the protruding portion 1b by a double-sided tape or an adhesive (not shown). Further, the FPC 5 is bonded on the protruding portion 1b by a double-sided tape or an adhesive (not shown). As will be described later, the radiator 1 has a function of radiating a part of heat generated in the heat generating portion 9 of the head base 3 that does not contribute to printing.
- a metal material such as copper or aluminum
- the head base 3 has a rectangular substrate 7 and a plurality of substrates arranged on the substrate 7 along the longitudinal direction of the substrate 7 in plan view.
- the heat generating unit 9 and a plurality of driving ICs 11 arranged on the substrate 7 along the arrangement direction of the heat generating units 9 (hereinafter referred to as the arrangement direction) are provided.
- the substrate 7 is made of an electrically insulating material such as alumina ceramic or a semiconductor material such as single crystal silicon.
- a heat storage layer 13 is formed on the upper surface of the substrate 7.
- the heat storage layer 13 includes a base layer 13a and a raised portion 13b.
- the foundation layer 13 a is formed on the entire top surface of the substrate 7.
- the raised portion 13 partially rises from the base portion 13a, extends in a strip shape along a plurality of arrangement directions, and has a substantially semi-elliptical cross-sectional shape.
- the raised portion 13 b functions to favorably press the recording medium P to be printed against the protective layer 25 formed on the heat generating portion 9.
- the heat storage layer 13 can be formed of, for example, glass with low thermal conductivity, and temporarily stores a part of the heat generated in the heat generating portion 9. This shortens the time required to raise the temperature of the heat generating portion 9 and functions to improve the thermal response characteristics of the thermal head X1.
- a predetermined glass paste obtained by mixing a glass powder with an appropriate organic solvent is applied to the upper surface of the substrate 7 by screen printing or the like known in the art, and is baked at a high temperature. Is formed.
- Examples of the glass forming the heat storage layer 13 include those containing SiO 2 , Al 2 O 3 , CaO and BaO, those containing SiO 2 , Al 2 O 3 and PbO, SiO 2 , Al 2 O 3 and Examples include those containing BaO, and those containing SiO 2 , B 2 O 3 , PbO, Al 2 O 3 , CaO and MgO.
- An electrical resistance layer 15 is provided on the upper surface of the heat storage layer 13.
- the electrical resistance layer 15 is interposed between the heat storage layer 13 and a common electrode 17, an individual electrode 19, a ground electrode 21, and an IC control electrode 23 described later.
- the electrical resistance layer 15 has a region (hereinafter referred to as an intervening region) having the same shape as the individual electrode 19, the common electrode 17, the ground electrode 21, and the IC control electrode 23 in plan view. ing.
- the electric resistance layer 15 has a plurality of regions (hereinafter referred to as exposed regions) exposed from between the individual electrodes 19 and the common electrode 17.
- Each exposed region of the electrical resistance layer 15 forms the heat generating portion 9 described above.
- the plurality of heat generating portions 9 are arranged in a row on the raised portion 13 b of the heat storage layer 13.
- the plurality of heat generating portions 9 are shown in a simplified manner in FIGS. 1, 6, and 7, but are arranged at a density of 180 to 2400 dpi (dot per inch), for example.
- the electric resistance layer 15 is formed of a material having a relatively high electric resistance such as TaN, TaSiO, TaSiNO, TiSiO, TiSiCO, or NbSiO. Therefore, when a voltage is applied between the common electrode 17 and the individual electrode 19 and a current is supplied to the heat generating portion 9, the heat generating portion 9 generates heat due to Joule heat generation.
- a common electrode 17, an individual electrode 19, a ground electrode 21, and an IC control electrode 23 are provided on the upper surface of the intervening region.
- These common electrode 17, individual electrode 19, ground electrode 21 and IC control electrode 23 are made of a conductive material, for example, any one of aluminum, gold, silver and copper, or These alloys are formed.
- the common electrode 17 has a main wiring portion 17a, a sub wiring portion 17b, and a lead portion 17c.
- the main wiring portion 17a extends along one long side 7a of the substrate 7 and forms a thick portion 17d thicker than other portions of the common electrode 17, as shown in FIG. Therefore, the wiring resistance of the common electrode 17 can be reduced.
- the sub wiring portion 17b extends along one short side 7c and the other short side 7d of the substrate 7, and one end thereof is connected to the main wiring portion 17a.
- the lead portion 17c extends from the main wiring portion 17a toward each heat generating portion 9.
- the other end of the sub wiring part 17 b is connected to the FPC 5, and the tip of the lead part 17 c is connected to the heat generating part 9. Thereby, the FPC 5 and the heat generating part 9 are electrically connected.
- the individual electrode 19 extends between each heat generating portion 9 and the drive IC 11, and electrically connects each heat generating portion 9 and the drive IC 11.
- the individual electrode 19 divides a plurality of heat generating portions 9 into a plurality of groups, and electrically connects the heat generating portions 9 of each group to a drive IC 11 provided corresponding to each group.
- the ground electrode 21 extends in a strip shape in the vicinity of the other long side 7b of the substrate 7 along the arrangement direction.
- the FPC 5 and the drive IC 11 are connected on the ground electrode 21. More specifically, as shown in FIG. 8, the FPC 5 is connected to an end region 21E located at one end and the other end of the ground electrode 21.
- the FPC 5 is connected to the first intermediate region 21M of the ground electrode 21 located between the adjacent drive ICs 11.
- the driving IC 11 is connected to the second intermediate region 21N between the end region 21E of the ground electrode 21 and the first intermediate region 21M.
- the drive IC 11 is connected to the third intermediate region 21L between the adjacent first intermediate regions 21M. Thereby, the drive IC 11 and the FPC 5 are electrically connected.
- the drive IC 11 is disposed corresponding to each group of the plurality of heat generating units 9, and is connected to one end of the individual electrode 19 and the ground electrode 21.
- the drive IC 11 is for controlling the energization state of each heat generating part 9, and has a plurality of switching elements inside as will be described later.
- the internal energization state is changed by switching the switching element.
- Each drive IC 11 has a first connection terminal 11 a connected to an internal switching element (not shown) connected to the individual electrode 19.
- the second connection terminal 11 b connected to the switching element is connected to the ground electrode 21.
- first connection terminals 11 a connected to the individual electrodes 19 and second connection terminals 11 b connected to the ground electrodes 21 are provided corresponding to the individual electrodes 19.
- the plurality of first connection terminals 11 a are individually connected to the individual electrodes 19.
- the plurality of second connection terminals 11 b are connected in common to the ground electrode 21.
- the IC control electrode 23 is for controlling the driving IC 11, and includes an IC power electrode 23a and an IC signal electrode 23b as shown in FIGS.
- the IC power supply electrode 23a has an end power supply electrode portion 23aE and an intermediate power supply electrode portion 23aM.
- the end power supply electrode portion 23 a E is disposed in the vicinity of the other long side 7 b of the substrate 7 at both ends in the longitudinal direction of the substrate 7.
- the intermediate power supply electrode portion 23aM is disposed between the adjacent drive ICs 11, and electrically connects the adjacent drive ICs 11.
- the end power supply electrode portion 23 a ⁇ / i> E has one end portion disposed in the region where the drive IC 11 is disposed and wraps around the ground electrode 21, and the other end portion is the other long side 7 b of the substrate 7. It is arranged in the vicinity.
- the end power electrode portion 23aE has one end connected to the drive IC 11 and the other end connected to the FPC 5. Thereby, the drive IC 11 and the FPC 5 are electrically connected.
- the intermediate power supply electrode portion 23aM extends along the ground electrode 21 and has one end portion arranged in one arrangement region of the adjacent drive IC 11 and the other end portion arranged in the other arrangement region of the adjacent drive IC 11. Yes.
- the intermediate power supply electrode portion 23aM has one end connected to one of the adjacent drive ICs 11, the other end connected to the other of the adjacent drive ICs 11, and the intermediate connected to the FPC 5 (see FIG. 3). Thereby, the drive IC 11 and the FPC 5 are electrically connected.
- the end power supply electrode part 23aE and the intermediate power supply electrode part 23aM are electrically connected inside the drive IC 11 to which both of them are connected. Further, the adjacent intermediate power supply electrode portions 23aM are electrically connected inside the drive IC 11 to which both of them are connected.
- the IC power electrode 23a is electrically connected between each drive IC 11 and the FPC 5 by connecting the IC power electrode 23a to each drive IC 11.
- the thermal head X1 can supply current to each driving IC 11 from the FPC 5 via the end power electrode part 23aE and the intermediate power electrode part 23aM, as will be described later.
- the IC signal electrode 23b has an end signal electrode portion 23bE and an intermediate signal electrode portion 23bM, as shown in FIGS.
- the end signal electrode portion 23bE is disposed in the vicinity of the other long side 5b of the substrate 7 at both ends in the longitudinal direction of the substrate 7. Further, the central signal electrode portion 23bM is disposed between adjacent drive ICs 11.
- the end signal electrode portion 23bE has one end portion disposed in the region where the drive IC 11 is disposed and the other end portion around the ground electrode 21, similarly to the end power electrode portion 23aE. Is disposed in the vicinity of the long side on the right side of the substrate 7.
- the end signal electrode portion 23bE has one end connected to the drive IC 11 and the other end connected to the FPC 5.
- the intermediate signal electrode portion 23bM is arranged in one arrangement region of the driving IC 11 with one end portion adjacent to the other arrangement region of the driving IC 11 with the other end portion so as to wrap around the intermediate power electrode portion 23aM. Has been placed.
- the intermediate signal electrode portion 23bM has one end connected to one of the adjacent drive ICs 11 and the other end connected to the other of the adjacent drive ICs 11.
- the end signal electrode portion 23bE and the intermediate signal electrode portion 23bM are electrically connected inside the drive IC 11 to which both of them are connected. Further, the adjacent intermediate signal electrode portions 23bM are electrically connected inside the drive IC to which both of them are connected.
- the IC signal electrode 23b electrically connects each drive IC 11 and the FPC 5.
- the control signal transmitted from the FPC 5 to the drive IC 11 via the end signal electrode portion 23bE is further transmitted to the adjacent drive IC 11 via the intermediate signal electrode portion 23bM.
- the electric resistance layer 15, common electrode 17, individual electrode 19, ground electrode 21, and IC control electrode 23 are, for example, a conventionally well-known thin film molding such as a sputtering method, for example, by forming a material layer constituting each of them on the heat storage layer 13. After sequentially laminating by a technique, the laminate is formed by processing into a predetermined pattern using a conventionally known photolithography technique or etching technique.
- the thick portion 17d can be formed by forming the common electrode 17 by the above method and then applying and baking Ag paste by a thick film forming technique such as a screen printing method.
- the common electrode 17, the individual electrode 19, the ground electrode 21, and the IC control electrode 23 can have a thickness of 0.4 to 2.0 ⁇ m, and the thick portion 17d of the common electrode 17 can have a thickness of 5 to 40 ⁇ m.
- a protective layer 25 is formed on the heat storage layer 13 formed on the upper surface of the substrate 7 to cover the heat generating portion 9, a part of the common electrode 17 and a part of the individual electrode 19. ing.
- the protective layer 25 is formed along the arrangement direction and is provided so as to cover a substantially left half region of the upper surface of the heat storage layer 13 in plan view.
- the protective layer 25 covers the heat generating portion 9, a part of the common electrode 17 and a part of the individual electrode 19, and can reduce the possibility that each coated member is oxidized by reaction with oxygen. Further, it is possible to reduce the possibility that the heat generating portion 9, the common electrode 17 and the individual electrode 19 are corroded due to adhesion of moisture or dust contained in the atmosphere.
- the protective layer 25 can be formed of, for example, Si 3 N 4 , SiON, SiC, glass, SiCN, or the like.
- the protective layer 25 may contain other elements such as Al or Y.
- the protective layer 25 may be formed of a single layer, or a plurality of layers having different compositions may be stacked.
- a covering layer that partially covers the common electrode 17, the individual electrode 19, the IC control electrode 23, and the ground electrode 21. 27 is provided.
- the covering layer 27 is provided so as to partially cover a substantially right half region of the upper surface of the heat storage layer 13.
- the covering layer 27 protects the coated common electrode 17, individual electrode 19, IC control electrode 23, and ground electrode 21 from oxidation due to contact with the atmosphere or corrosion due to adhesion of moisture or the like contained in the atmosphere. belongs to.
- the covering layer 27 is formed so as to overlap the end portion of the protective layer 25 in order to ensure the protection of the common electrode 17, the individual electrode 19 and the IC control electrode 23.
- the covering layer 27 can be formed of a resin material such as an epoxy resin or a polyimide resin, for example.
- the covering layer 27 can be formed using a thick film forming technique such as a screen printing method.
- the covering layer 27 has openings for exposing the end portions of the individual electrodes 19 that connect the drive IC 11, the second intermediate region 21 N and the third intermediate region 21 L of the ground electrode 21, and the end portions of the IC control electrode 23. (Not shown) is formed, and these wirings are connected to the driving IC 11 through the opening.
- the drive IC 11 is connected to the individual electrode 19, the ground electrode 21, and the IC control electrode 23 in order to protect the drive IC 11 itself and the connection between the drive IC 11 and these wirings. It is sealed by being covered with a covering member 29 made of a resin such as silicone resin.
- the FPC 5 is connected to the common electrode 17, the ground electrode 21, and the IC control electrode 23 as shown in FIG.
- the FPC 5 is a well-known one in which a plurality of printed wirings are wired inside an insulating resin layer, and each printed wiring is connected via a connector 31 (see FIGS. 1 and 8) to an external power supply device and a control (not shown). It is electrically connected to a device or the like.
- each printed wiring formed therein is soldered by solder 33 (see FIG. 3), the end of the sub wiring portion 17b of the common electrode 17, the end of the ground electrode 21, and the IC control electrode 23. Are connected to the end of each.
- FIGS. 4 and 5 schematically show how the recording medium P is conveyed during printing, and the platen roller 10 is indicated by a two-dot chain line. Further, the stress generated in the thermal head X1 is virtually indicated by a broken-line arrow. Further, the thermal head X1 shows an example in which the second convex portion 4 is provided at the end portion 16 of the first coating layer 27a. FIG. 5 shows a conventional thermal head X101.
- the coating layer 27 includes a first coating layer 27 a provided on the downstream side in the transport direction S (hereinafter referred to as the transport direction S) of the recording medium P with respect to the heat generating unit 9, and the upstream in the transport direction S with respect to the heat generating unit 9. And a second coating layer 27b provided on the side.
- the first covering layer 27 a is provided on the end portion of the substrate 7 on the one long side 7 a side across the common electrode 17 from the heat storage layer 13.
- the second coating layer 27 b is provided so as to cover a part of the individual electrode 19 and a part of the IC control electrode 23 from the heat storage layer 13.
- the first covering layer 27a has a first convex portion 2 provided on the thick portion 17d of the common electrode 17, and an end portion 16 disposed between the first convex portion 2 and the heat generating portion 9. ing.
- the first covering layer 27 a has the second convex portion 4 at the end portion 16.
- the second convex part 4 is located closer to the heat generating part 9 than the first convex part 2.
- the end portion 16 on the heat generating portion 9 side of the first covering layer 27a indicates a region of 50 to 250 ⁇ m from the edge on the heat generating portion 9 side of the first covering layer 27a.
- the length of the first coating layer 27a in the transport direction S is a region up to 20% from the edge of the first coating layer 27a on the heat generating portion 9 side.
- the second convex portion 4 is a portion of the end portion 16 that protrudes toward the recording medium.
- the end portion 16 of the first coating layer 27a is disposed between the first coating layer 27a and the heat generating portion 9.
- the distance between the heat generating portion 9 and the first convex portion 2 is L
- the end portion 16 of the first coating layer 27a is located between the heat generating portion 9 and L / 2.
- the distance between the heat generating portion 9 and the first convex portion 2 is the distance from the edge of the heat generating portion 9 on the first covering layer 27a side to the apex of the first convex portion 2.
- the thermal head X101 shown in FIG. 5 is a conventional one in which the second convex portion 4 is not provided.
- the thermal head X101 performs printing by controlling the platen roller 101 to press the recording medium P against the heat generating portion 109 with the stress F109.
- a space V in which the first covering layer 127 a does not exist is formed between the first convex portion 102 and the heat generating portion 109, and the platen roller 110 generates heat between the first convex portion 102 and the heat generating portion 109.
- the stress F109 on the heat generating portion 109 is reduced, and the stress F102 on the first convex portion 102 is increased.
- the end portion 16 of the first coating layer 27a when the end portion 16 of the first coating layer 27a has a distance L between the heat generating portion 9 and the first convex portion 2, the end portion 16 of the first coating layer 27a is Since it is located between the heat generating portion 9 and L / 2, the amount of the platen roller 10 entering between the first convex portion 2 and the heat generating portion 9 can be reduced, and the deformation of the platen roller 10 can be reduced. Can be small. Therefore, the possibility that the stress F9 generated in the protective layer 25 on the heat generating portion 9 is reduced can be reduced, and the possibility that the image quality is lowered can be reduced. Moreover, since the hit to the 1st convex part 2 becomes small, the possibility that the printing flaw of a print of the thermal head X1 or a blur will arise can be reduced.
- the thermal head X1 has the second convex portion 4 at the end portion 16 of the first coating layer 27a, the deformation amount of the platen roller 10 can be further reduced, and printing scratches or blurring may occur. It becomes easy to reduce the property.
- the stress F2 generated in the first convex portion 2, the stress F4 generated in the end portion 16, and the stress F9 generated in the protective layer 25 located on the heat generating portion 9 are the first convex portion 2, the end portion 16 and the heat generating portion 9. It occurs in a direction perpendicular to the contact surface of the recording medium P in contact with the protective layer 25 positioned above. Further, forces F2 ′, F4 ′, and F9 ′ (not shown) generated by the reaction of the stresses F2, F4, and F9 are generated in the opposite directions to the stresses F2, F4, and F9. ', F9'.
- the first convex portion 102 comes into contact with the recording medium P, whereby pressure is generated in the first convex portion 102. For this reason, stress may be generated inside the first convex portion 102 and the first convex portion 102 may be damaged. Further, since the first convex portion 102 is in contact with the recording medium P, in addition to the compressive stress generated toward the first convex portion 102, a tensile stress is generated in the transport direction, and the first convex portion 102 is covered with the coating layer. May cause the thermal head to break.
- the thermal head X1 has the second convex part 4 between the first convex part 2 and the heat generating part 9, so that the recording medium P has the first convex part 2 and the second convex part 4. Both will be in contact.
- the recording medium P comes into contact with at least two places of the first convex portion 2 and the second convex portion 4 of the coating layer 27, and the stress F2 generated in the first convex portion 2 can be reduced. That is, the stress F ⁇ b> 2 generated in the first convex portion 2 can be dispersed by a force F ⁇ b> 4 ′ (not shown) generated by a reaction generated in the second convex portion 4. Therefore, possibility that the coating layer 27 will be damaged can be reduced.
- the recording medium P comes into contact with the first convex portion 2, the recording medium P is separated from the first covering layer 27a, and the first convex portion 2 has a function of guiding the recording medium P.
- the thermal head X1 can apply forces F2 ′ and F4 ′ generated by the reaction from the thermal head X1 to the recording medium P at at least two locations of the first convex portion 2 and the second convex portion 4, and the first convex portion 2 Compared to the case where the recording medium P is guided only by this, the recording medium P can be separated from the thermal head X1.
- the stress F4 is applied to the recording medium P so that the second convex portion 4 relieves the stress F2 generated in the first convex portion 2, the stress F2 generated in the first convex portion 2 can be reduced. Therefore, it is possible to reduce the possibility that an image printed on the heat generating portion 9 is strongly pressed against the first convex portion 2, and to reduce the possibility that the print is scratched or blurred. Further, since the recording medium P receives the force F4 ′ generated by the reaction of the recording medium P from the second convex portion 4, the recording medium is removed from the first coating layer 27a on the downstream side in the transport direction S of the second convex portion 4. P can be peeled efficiently.
- the first convex portion 2 is provided on the thick portion 17d. Therefore, since the first convex portion 2 can be formed by forming the thick portion 17d on the common electrode 17 and printing the first covering layer 27a, the first convex portion 2 can be easily provided. Can do.
- the surface roughness of the first convex portion 2 is rougher than the surface roughness of the end portion 16.
- the contact point between the recording medium P and the first convex portion 2 is set at the first convex portion 2 where a large stress F2 is generated because the surface roughness of the first convex portion 2 is larger than the surface roughness of the end portion 16.
- the stress F2 generated in the first convex portion 2 can be dispersed.
- a resin to be the first coating layer 27a is applied on the protective layer 25, and then dried and cured. Thereafter, the surface of the first coating layer 27a on the end portion 16 may be filed to roughen the surface. Further, the surface of the first coating layer 27a on the end portion 16 may be chemically treated.
- the thermal head X ⁇ b> 1 is configured such that the height Ha of the first convex portion 2 from the substrate 7 is higher than the height Hb of the second convex portion 4 from the substrate 7. Therefore, a large stress F4 may be generated from the recording medium P in the second convex portion 4 located on the heat generating portion 9 side with respect to the first convex portion 2, but the height Hb of the second convex portion 4 is By making it lower than the height Ha of the 1 convex part 2, it can reduce that the excessive stress F4 arises in the 2nd convex part 4.
- the height Ha of the first convex portion 2 from the substrate 7 can be 35 to 45 ⁇ m, and the height Hb of the second convex portion 4 from the substrate 7 can be 20 to 30 ⁇ m.
- the height Hb of the second convex portion 4 from the substrate 7 is preferably 0.4 to 0.8 times the height Ha of the first convex portion 2 from the substrate 7.
- the height Ha of the first convex portion 2 from the substrate 7 and the height Hb of the second convex portion 4 from the substrate 7 may be appropriately set according to the size of the thermal head X1 and the recording medium P.
- the height Hb of the second convex portion 4 from the substrate 7 is synonymous with the height of the end portion 16 from the substrate 7.
- the end portion 16 of the first covering layer 27a is disposed on the raised portion 13b of the heat storage layer 13 in plan view. Therefore, the protrusion height of the second protrusion 4 and the protrusion height of the raised portion 13b can be the height Ha of the second protrusion 4 from the substrate 7. Therefore, the height Ha of the second convex portion 4 from the substrate 7 can be easily increased.
- the thermal head X1 has a configuration in which the length Wa between the first covering layer 27a and the heat generating portion 9 is shorter than the length Wb between the second covering layer 27b and the heat generating portion 9.
- the distance between the first cover layer 27a and the heat generating portion 9 indicates the distance from the edge of the heat generating portion 9 to the first cover layer 27a when viewed in plan.
- the distance between the second covering layer 27b and the heat generating portion 9 indicates the distance from the edge of the heat generating portion 9 to the second covering layer 27b when viewed in plan.
- the length Wa between the first covering layer 27a and the heat generating portion 9 disposed on the downstream side in the transport direction S is equal to the length Wa between the second covering layer 27b and the heat generating portion 9 disposed on the upstream side in the transport direction S. Since the length Wb of the recording medium P is shorter than the length Wb, the force F2 ′ generated by the reaction of the recording medium P from the first protrusion 2 provided on the first coating layer 27a disposed on the downstream side in the transport direction S and the second protrusion 4, the force F4 ′ generated by the reaction of the recording medium P can be increased, and the recording medium P can be efficiently peeled from the first coating layer 27a. At this time, the 1st convex part 2 and the 2nd convex part 4 are functioning as a guide.
- the thermal head X1 the height Hc from the substrate 7 of the protective layer 25 located on the heat generating portion 9 is higher than the height Hb from the substrate 7 of the second convex portion 4, and the first convex portion 2 It is lower than the height Ha from the substrate 7. Therefore, the first convex portion 2 that is far from the heat generating portion 9 can function as the recording medium P, and the second convex portion 4 disposed on the heat generating portion 9 side than the first convex portion 2 is It can function as a stress relaxation part. As a result, the recording medium P can be efficiently conveyed and the stress F2 generated on the first convex portion 2 can be reduced.
- 1st convex part 2 and 2nd convex part 4 can form the 1st covering layer 27a with the above-mentioned resin with big viscosity. Further, after forming the first coating layer 27a with a uniform thickness, by further applying a material for forming the first coating layer 27a to the position where the first convex portion 2 and the second convex portion 4 are formed, The 1st convex part 2 and the 2nd convex part 4 can be provided.
- the example which provided the 2nd convex part 4 in the 1st coating layer 27a was shown, it is not limited to this. Two or more second convex portions 4 may be provided. In that case, the plurality of second convex portions 4 function as stress relaxation portions. Moreover, what is necessary is just to form the 1st convex part 2 and the 2nd convex part 4 with the same method also when providing the 1st convex part 2 and the 2nd convex part 4 in the 2nd coating layer 27b.
- the recording medium P can be exemplified by thermal paper or image receiving paper that is printed by applying heat. Further, in the present specification, what is printed on a medium through an ink ribbon that sublimes when heated is referred to as a recording medium P.
- the thermal printer Z of the present embodiment includes the above-described thermal head X1, the transport mechanism 40, the platen roller 50, the power supply device 60, and the control device 70.
- the thermal head X1 is attached to an attachment surface 80a of an attachment member 80 provided in a housing (not shown) of the thermal printer Z.
- the thermal head X1 is attached to the attachment member 80 so that the arrangement direction of the heat generating portions 9 is along a direction orthogonal to the conveyance direction S of the recording medium P described later.
- the downstream side in the transport direction S of the recording medium P is the first coating layer 27a.
- the transport mechanism 40 is for transporting a recording medium P such as thermal paper or image receiving paper onto which ink is transferred in the direction of arrow S in FIG. 9 and transporting the recording medium P onto the plurality of heat generating portions 9 of the thermal head X1. And conveying rollers 43, 45, 47, and 49.
- the transport rollers 43, 45, 47, and 49 are formed by, for example, covering cylindrical shaft bodies 43a, 45a, 47a, and 49a made of metal such as stainless steel with elastic members 43b, 45b, 47b, and 49b made of butadiene rubber or the like. Can be configured.
- the recording medium P is an image receiving paper or the like to which ink is transferred, an ink film is conveyed together with the recording medium P between the recording medium P and the heat generating portion 9 of the thermal head X1. ing.
- the platen roller 50 is for pressing the recording medium P onto the heat generating part 9 of the thermal head X1, and is arranged so as to extend along a direction orthogonal to the transport direction S. Both end portions are supported so as to be rotatable while being pressed.
- the platen roller 50 can be configured by, for example, covering a cylindrical shaft body 50a made of metal such as stainless steel with an elastic member 50b made of butadiene rubber or the like.
- the power supply device 60 is for supplying a current for causing the heat generating portion 9 of the thermal head X1 to generate heat and a current for operating the driving IC 11 as described above.
- the control device 70 is for supplying a control signal for controlling the operation of the drive IC 11 to the drive IC 11 in order to selectively generate heat in the heat generating portion 9 of the thermal head X1 as described above.
- the thermal printer Z presses the recording medium P onto the heat generating portion 9 of the thermal head X ⁇ b> 1 by the platen roller 50 and moves the recording medium P onto the heat generating portion 9 by the transport mechanism 40.
- a predetermined printing can be performed on the recording medium P by selectively causing the heat generating unit 9 to generate heat by the power supply device 60 and the control device 70 while being conveyed.
- the recording medium P is an image receiving paper or the like
- printing on the recording medium P can be performed by thermally transferring ink of an ink film (not shown) conveyed together with the recording medium P to the recording medium P.
- the thermal head X2 will be described with reference to FIG.
- the recording medium P is indicated by a dotted line.
- the end portion 16 of the first coating layer 27a is formed by the inclined portion 12 whose upper surface is a hypotenuse.
- the dashed-dotted line is taken down below.
- the other points are the same in that the inclined portion 12 is provided.
- the same members as those of the thermal head X1 are denoted by the same reference numerals, and the same shall apply hereinafter.
- the inclined portion 12 has an inclined surface whose upper surface is inclined from the first convex portion 2 toward the second convex portion 4 provided on the heat generating portion 9 side.
- the inclined portion 12 is inclined downward toward the second convex portion 4. Therefore, the first convex portion 2 and the second convex portion 4 are smoothly connected, and a concave portion into which a platen roller (not shown) enters is formed between the first convex portion 2 and the second convex portion 4. Not. This can reduce the possibility of print scratches or blurring caused by the platen roller entering.
- the inclined surface which is the upper surface of the inclined portion 12 is also in contact with the recording medium P, the stress F2 generated in the first convex portion 2 and the stress F4 generated in the second convex portion 4 can be relieved. The possibility that the first convex portion 2 and the second convex portion 4 are damaged can be reduced.
- the inclined portion 12 can be formed by forming the first convex portion 2 and the second convex portion 4 and then applying and curing the same material as the coating layer 27. Further, the inclined portion 12 may be provided simultaneously with the first convex portion 2 and the second convex portion 4.
- the example which provided the inclination part 12 which inclines below toward the 2nd convex part 4 from the 1st convex part 2 was shown in the edge part 16 of the 1st coating layer 27a, it is not limited to this.
- the inclined surface 12 may have an uneven surface so that the space between the first convex portion 2 and the second convex portion 4 is filled.
- Other forms may be used as long as the stress applied to the first convex portion 2 from the recording medium is reduced.
- a thermal head X3 according to the third embodiment will be described with reference to FIGS.
- the shape of the end portion 8 of the first coating layer 27a and the end portion 8 of the second coating layer 27b on the heat storage layer 13 side is a waveform shape in plan view. That is, the end portion 8 of the first covering layer 27a and the end portion 8 of the second covering layer 27b on the heat storage layer 13 side have irregularities in plan view.
- Other configurations are the same as those of the thermal head X1, and the description thereof is omitted.
- the first coating layer 27a and the second coating layer 27b constituting the thermal head X3 have different lengths in the arrangement direction of the substrates 7 at the end portion on the heat storage layer 13 side and the distance from the heat generating unit 9. Specifically, the end portion 8a of the first coating layer 27a is disposed closer to the heat storage layer 13 than the end portion 8b of the first coating layer 27a. And as shown in FIG. 12, the end surface 8a of the 1st coating layer 27a will be arrange
- the end portion 8 of the first coating layer 27a and the end portion 8 of the second coating layer 27b on the heat storage layer 13 side have irregularities in plan view. Therefore, the ink ribbon R can be easily separated from the first coating layer 27a and the second coating layer 27b during printing. Specifically, when the ink ribbon R is transported onto the first coating layer 27a, the ink ribbon R at the end portion 8b of the first coating layer 27a, which is a recess, as shown in FIG. Is partially lifted from the end 8b of the first coating layer 27a, which is a recess. Therefore, for example, even if the ink ribbon R is in close contact with the first coating layer 27a due to static electricity or the like, the ink ribbon R can be easily separated from the first coating layer 27a.
- the first convex portion 2 of the first coating layer 27a contacts the ink ribbon R, and the second convex portion 4 which is the end portion 8b of the first coating layer 27a is the ink. Although it is configured not to contact the ribbon R, as shown in FIG. 12A, the first protrusion 2 of the first covering layer 27a is in contact with the second protrusion, which is the end 8a of the first covering layer 27a. Since the part 4 contacts, possibility that the 1st convex part 2 will be damaged can be reduced.
- the conveyance is performed as described above.
- the ink ribbons R arranged at the same position in the direction S are partially lifted from the first coating layer 27a and the second coating layer 27b. Therefore, the ink ribbon R can be easily separated from the first coating layer 27a and the second coating layer 27b.
- the corrugated shape indicates that the distance between the end portion 8 of the covering layer 27 and the heat generating portion 9 is not a constant value, and the end portion 8 of the covering layer 27 is continuous. A curve is formed.
- the corrugated shape which is the shape of the end portion 8 of the coating layer 27, is defined as follows.
- the average distance W is preferably at a position of ⁇ 0.15 mm. Thereby, the thermal head X3 and the ink ribbon R can be efficiently peeled off.
- the corrugated shape is formed by appropriately adjusting the viscosity of the resin for forming the coating layer 27 or the printing process when forming the coating layer 27.
- the end 8 of the coating layer 27 has irregularities in plan view
- an example in which the end 8 of the coating layer 27 has a corrugated shape is shown, but the present invention is not limited thereto. is not.
- the end portion 8 of the coating layer 27 may be uneven in a stepwise manner.
- the present invention is not limited to this.
- only the end portion of the first coating layer 27a or only the end portion of the second coating layer 27b may have irregularities.
- only the shape of the end portion of the first coating layer 27a or only the shape of the end portion of the second coating layer 27b may be corrugated.
- thermo head X4 according to the fourth embodiment will be described with reference to FIGS.
- the end portion 8 of the first coating layer 27a has irregularities when viewed from the recording medium conveyance direction S.
- the other points are the same as those of the thermal head X1, and the description is omitted.
- thermal head X4 As shown in Drawing 13 (b), as for end part 8 of the 1st covering layer 27a, unevenness is provided in the upper surface. In other words, the thickness of the first coating layer 27a is different in the arrangement direction. Specifically, the thickness of the end portion 8a of the first coating layer 27a is thicker than the thickness of the end portion 8b of the first coating layer 27a. Since the arrangement direction is the main scanning direction, the thermal head X4 has a configuration in which the end 8 of the first coating layer 27a has irregularities in the main scanning direction.
- the first end portion 8a of the thick first coating layer 27a has irregularities in the main scanning direction, as shown in FIG. 14, the first end portion 8a of the thick first coating layer 27a
- the two convex portions 4 are in contact with the ink ribbon R, but the end portion 8b of the first covering layer 27a having a small thickness is not in contact with the ink ribbon and R. For this reason, a portion where the ink ribbon R and the end portion 8 of the first covering layer 27a do not come into contact with each other, and the ink ribbon R and the first covering layer 27a can be easily separated.
- the unevenness provided on the surface of the end portion of the first coating layer 27a can be formed by polishing. Moreover, it can form by previously forming uneven
- the height difference of the unevenness may be 5 to 20 ⁇ m.
- the thermal head X5 will be described with reference to FIG.
- the second coating layer 27b is arranged on the downstream side in the transport direction from the heat generating portion 9.
- the end 18 of the second covering layer 27 b is the third convex portion 14.
- Other configurations are the same as those of the thermal head X1.
- the second coating layer 27b has the third convex portion 14 at the end portion on the heat generating portion 9 side.
- the third convex portion 14 is disposed on the upstream side of the heat generating portion 9. Therefore, the recording medium P comes into contact with the protective layer 25 disposed on the heat generating part 9 after coming into contact with the third convex part 14. Therefore, the recording medium P is guided to the protective layer 25 disposed on the heat generating portion 9 by the third convex portion 14 and can be efficiently conveyed to the protective layer 25 disposed on the heat generating portion 9. .
- a soft recording medium P such as thermal paper
- the possibility of a paper jam or the like occurring in the thermal head X5 can be reduced by being guided by the third convex portion 14.
- the thermal head X5 has a configuration in which the height Hd of the third convex portion 14 from the substrate 7 is lower than the height Hb of the second convex portion 4 from the substrate 7. Therefore, the stress F14 generated by the second convex portion 4 can be made larger than the stress F14 generated by the third convex portion 14.
- the third convex portion 14 efficiently guides the protective layer 25 disposed on the heat generating portion 9, and on the downstream side in the transport direction S, the second convex portion 4.
- the force F4 ′ generated by the reaction of the recording medium P generated by the above can be increased, and the recording medium P can be efficiently peeled from the protective layer 25.
- the height Ha of the first convex portion 2 from the substrate 7, the height Hb of the second convex portion 4 from the substrate 7, the height Hd of the third convex portion 14 from the substrate 7, and the heating portion 9 The relationship of the height Hc of the protective layer 25 positioned from the substrate 7 preferably has a relationship of Ha> Hc> Hb> Hd.
- the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.
- the thermal head X1 is used in the thermal printer Z
- any of the thermal heads X2 to X5 may be used.
- the thermal heads X1 to X5 according to a plurality of embodiments may be used in combination.
- the planar head in which the raised portion 13b of the heat storage layer 13 is provided on the main surface of the substrate 7 and the heat generating portion 9 is formed on the main surface of the substrate 7 has been described as an example, but is not limited thereto.
- the present invention may be applied to an end face head in which the heat storage layer 13 is provided on the end surface of the substrate and the heat generating layer 9 is provided on the heat storage layer 13. Even in that case, an effect equivalent to that of the present invention can be obtained.
- the thermal head provided with the heat generating portion 9 on the end face the meaning in a plan view is that the end face is viewed. That is, in the present specification, the plan view means that the heat generating portion 9 is viewed in plan.
- the heat storage layer 13 is a bulge that partially bulges on the substrate 7 by providing a bulge portion 13b that partially bulges from the ground portion 13a on the ground portion 13a.
- the configuration of the heat storage layer 13 is not limited to this.
- the heat storage layer 13 may be configured by only the raised portion 13b without providing the base portion 13a.
- the invention is not limited to this.
- a glass epoxy board which is a rigid rigid board may be used, and the connector 31 may be directly mounted on the board 7.
- the thin film head in which the heat generating part 9 is formed by a thin film forming technique is illustrated, the present invention is not limited to this.
- a thick film head in which the heat generating portion 9 is formed by a thick film forming technique may be used.
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Electronic Switches (AREA)
Abstract
Description
以下、第1の実施形態に係るサーマルヘッドX1について、図面を参照しつつ説明する。図1~4に示すように、本実施形態のサーマルヘッドX1は、放熱体1と、放熱体1上に配置されたヘッド基体3と、ヘッド基体3に接続されたフレキシブルプリント配線板5(以下、FPC5と称する)とを備えている。
図10を用いてサーマルヘッドX2について説明する。図10では記録媒体Pを点線で示している。サーマルヘッドX2は、第1被覆層27aの端部16が、上面が斜辺である傾斜部12により形成されている。また、第1凸部2を明確にするために、下方に一点鎖線をおろしている。傾斜部12が設けられている点において、サーマルヘッドX1と異なり、その他の点は同様である。また、サーマルヘッドX1と同様の部材については同様の符号を付し、以下同じとする。
図11,12を用いて第3の実施形態に係るサーマルヘッドX3について説明する。サーマルヘッドX3は、蓄熱層13側の第1被覆層27aの端部8および第2被覆層27bの端部8の形状が、平面視して、波形形状である。つまり、蓄熱層13側の第1被覆層27aの端部8および第2被覆層27bの端部8が、平面視して、凹凸を有している。その他の構成はサーマルヘッドX1と同様であり、説明を省略する。
図13,14を用いて第4の実施形態に係るサーマルヘッドX4について説明する。サーマルヘッドX4は、第1被覆層27aの端部8が、記録媒体の搬送方向Sから見たときに凹凸を有している。その他の点はサーマルヘッドX1と同様であり、説明を省略する。
図15を用いてサーマルヘッドX5について説明する。サーマルヘッドX5は、第2被覆層27bが、発熱部9よりも搬送方向の下流側に配置されている。第2被覆層27bの端部18は第3凸部14である。その他の構成はサーマルヘッドX1と同様である。
Z1 サーマルプリンタ
P 記録媒体
1 放熱体
2 第1凸部
3 ヘッド基体
4 第2凸部
7 基板
8,16 第1被覆層の端部
9 発熱部
10 プラテンローラ
12 傾斜部
13 蓄熱層
13b 隆起部
14 第3凸部
15 電気抵抗層
17 共通電極
19 個別電極
25 保護層
27 被覆層
27a 第1被覆層
27b 第2被覆層
Claims (12)
- 基板と、
該基板上に設けられた蓄熱層と、
該蓄熱層上に設けられた発熱部と、
該発熱部に電気的に接続された電極と、
前記発熱部および前記電極の一部を被覆する保護層と、
該保護層の一部を被覆し、前記発熱部よりも記録媒体の搬送方向の下流側に配置された第1被覆層と、を備え、
該第1被覆層は、前記記録媒体側へ向けて突出した第1凸部を有し、
前記第1被覆層の前記発熱部側の端部が、前記第1凸部と前記発熱部との間に位置しており、
前記発熱部と前記第1凸部との間の距離をLとするとき、前記第1被覆層の前記端部は、前記発熱部からL/2の間に位置することを特徴とするサーマルヘッド。 - 前記第1被覆層は、前記端部に、前記記録媒体側へ向けて突出した第2凸部を有し、
前記第2凸部の前記基板からの高さは、前記第1凸部の前記基板からの高さよりも低い、請求項1に記載のサーマルヘッド。 - 前記発熱部上に位置する前記保護層の前記基板からの高さは、
前記第2凸部の前記基板からの高さよりも高く、前記第1凸部の前記基板からの高さよりも低い、請求項2に記載のサーマルヘッド。 - 前記電極は、他の部位よりも厚みの厚い肉厚部を有しており、
該肉厚部上に前記第1凸部が設けられている、請求項1乃至3のいずれか一項に記載のサーマルヘッド。 - 前記第1凸部の表面粗さが、前記端部の表面粗さよりも粗い、請求項1乃至4のいずれか一項に記載のサーマルヘッド。
- 前記電極の一部を被覆し、前記発熱部よりも前記記録媒体の搬送方向の上流側に配置された第2被覆層をさらに備え、
前記第2被覆層は、前記記録媒体側へ向けて突出した第3凸部を有している、請求項1乃至5のいずれか一項に記載のサーマルヘッド。 - 前記第3凸部の前記基板からの高さは、前記端部の前記基板からの高さよりも低い、請求項6に記載のサーマルヘッド。
- 平面視して、前記端部から前記発熱部までの長さが、前記第3凸部から前記発熱部までの長さよりも短い、請求項6または7に記載のサーマルヘッド。
- 前記第1被覆層の前記端部の上面、および、前記第2被覆層の前記発熱部側の前記端部の上面の少なくとも一方は、凹凸を有している、請求項6乃至8のいずれか一項に記載のサーマルヘッド。
- 平面視して、前記第1被覆層の前記端部、および、前記第2被覆層の前記発熱部側の前記端部の少なくとも一方は、凹凸を有している、請求項6乃至9のいずれか一項に記載のサーマルヘッド。
- 平面視して、前記第1被覆層の前記端部の形状、および、前記第2被覆層の前記発熱部側の前記端部の形状の少なくとも一方は、波形形状をなしている、請求項10に記載のサーマルヘッド。
- 請求項1乃至11のいずれか一項に記載のサーマルヘッドと、
前記発熱部上に前記記録媒体を搬送する搬送機構と、
前記発熱部上に前記記録媒体を押圧するプラテンローラと、を備えることを特徴とするサーマルプリンタ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014502082A JP5815836B2 (ja) | 2012-02-28 | 2013-01-31 | サーマルヘッドおよびこれを備えるサーマルプリンタ |
US14/376,485 US9050826B2 (en) | 2012-02-28 | 2013-01-31 | Thermal head and thermal printer equipped with the same |
CN201380004750.XA CN104039557B (zh) | 2012-02-28 | 2013-01-31 | 热敏头以及具备该热敏头的热敏打印机 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012041729 | 2012-02-28 | ||
JP2012-041729 | 2012-02-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013129020A1 true WO2013129020A1 (ja) | 2013-09-06 |
Family
ID=49082224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2013/052155 WO2013129020A1 (ja) | 2012-02-28 | 2013-01-31 | サーマルヘッドおよびこれを備えるサーマルプリンタ |
Country Status (4)
Country | Link |
---|---|
US (1) | US9050826B2 (ja) |
JP (1) | JP5815836B2 (ja) |
CN (1) | CN104039557B (ja) |
WO (1) | WO2013129020A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015099149A1 (ja) * | 2013-12-26 | 2015-07-02 | 京セラ株式会社 | サーマルヘッドおよびサーマルプリンタ |
WO2016104479A1 (ja) * | 2014-12-25 | 2016-06-30 | 京セラ株式会社 | サーマルヘッドおよびサーマルプリンタ |
WO2016178432A1 (ja) * | 2015-05-07 | 2016-11-10 | アオイ電子株式会社 | サーマルヘッド |
JP2017065021A (ja) * | 2015-09-29 | 2017-04-06 | 東芝ホクト電子株式会社 | サーマルプリントヘッド |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10284354B2 (en) * | 2015-01-30 | 2019-05-07 | Nokia Solutions And Networks Oy | Methods, apparatus, computer program, computer program product and mobile communications network for serving cells comprising primary cell and secondary cells |
WO2017057364A1 (ja) * | 2015-09-28 | 2017-04-06 | 京セラ株式会社 | サーマルヘッドおよびサーマルプリンタ |
US10286680B2 (en) * | 2015-10-29 | 2019-05-14 | Kyocera Corporation | Thermal head and thermal printer |
WO2017170800A1 (ja) * | 2016-03-29 | 2017-10-05 | 京セラ株式会社 | サーマルヘッドおよびサーマルプリンタ |
CN110461614B (zh) * | 2017-03-29 | 2021-02-05 | 京瓷株式会社 | 热敏头及热敏打印机 |
CN112297646B (zh) * | 2020-11-17 | 2022-07-05 | 山东华菱电子股份有限公司 | 一种薄膜热敏打印头用发热基板的制造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60150046U (ja) * | 1984-03-19 | 1985-10-05 | 沖電気工業株式会社 | サ−マルヘツド |
JPH05270029A (ja) * | 1992-03-26 | 1993-10-19 | Fuji Xerox Co Ltd | サーマルヘッド |
JPH1134376A (ja) * | 1997-07-23 | 1999-02-09 | Tdk Corp | サーマルヘッドおよびその製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69525868T2 (de) * | 1994-10-03 | 2002-11-21 | Rohm Co., Ltd. | Elektrische Verbindungsstruktur |
JP4137544B2 (ja) | 2002-07-17 | 2008-08-20 | セイコーインスツル株式会社 | サーマルヘッドおよび感熱性粘着ラベルの熱活性化装置並びにプリンタ装置 |
JP2004345237A (ja) * | 2003-05-22 | 2004-12-09 | Fuji Photo Film Co Ltd | サーマルヘッド |
JP2008207439A (ja) * | 2007-02-26 | 2008-09-11 | Rohm Co Ltd | サーマルプリントヘッド |
JP5317723B2 (ja) * | 2009-01-28 | 2013-10-16 | 京セラ株式会社 | 記録ヘッドおよびこれを備える記録装置 |
-
2013
- 2013-01-31 JP JP2014502082A patent/JP5815836B2/ja active Active
- 2013-01-31 CN CN201380004750.XA patent/CN104039557B/zh active Active
- 2013-01-31 US US14/376,485 patent/US9050826B2/en active Active
- 2013-01-31 WO PCT/JP2013/052155 patent/WO2013129020A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60150046U (ja) * | 1984-03-19 | 1985-10-05 | 沖電気工業株式会社 | サ−マルヘツド |
JPH05270029A (ja) * | 1992-03-26 | 1993-10-19 | Fuji Xerox Co Ltd | サーマルヘッド |
JPH1134376A (ja) * | 1997-07-23 | 1999-02-09 | Tdk Corp | サーマルヘッドおよびその製造方法 |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9676205B2 (en) | 2013-12-26 | 2017-06-13 | Kyocera Corporation | Thermal head and thermal printer |
CN105848907A (zh) * | 2013-12-26 | 2016-08-10 | 京瓷株式会社 | 热敏头以及热敏打印机 |
JPWO2015099149A1 (ja) * | 2013-12-26 | 2017-03-23 | 京セラ株式会社 | サーマルヘッドおよびサーマルプリンタ |
WO2015099149A1 (ja) * | 2013-12-26 | 2015-07-02 | 京セラ株式会社 | サーマルヘッドおよびサーマルプリンタ |
WO2016104479A1 (ja) * | 2014-12-25 | 2016-06-30 | 京セラ株式会社 | サーマルヘッドおよびサーマルプリンタ |
JP6096997B2 (ja) * | 2014-12-25 | 2017-03-15 | 京セラ株式会社 | サーマルヘッドおよびサーマルプリンタ |
JPWO2016104479A1 (ja) * | 2014-12-25 | 2017-04-27 | 京セラ株式会社 | サーマルヘッドおよびサーマルプリンタ |
CN107000446A (zh) * | 2014-12-25 | 2017-08-01 | 京瓷株式会社 | 热敏头以及热敏打印机 |
CN107000446B (zh) * | 2014-12-25 | 2018-12-04 | 京瓷株式会社 | 热敏头以及热敏打印机 |
US10160228B2 (en) | 2014-12-25 | 2018-12-25 | Kyocera Corporation | Thermal head and thermal printer with improved sealability |
WO2016178432A1 (ja) * | 2015-05-07 | 2016-11-10 | アオイ電子株式会社 | サーマルヘッド |
JP2016210076A (ja) * | 2015-05-07 | 2016-12-15 | アオイ電子株式会社 | サーマルヘッド |
JP2017065021A (ja) * | 2015-09-29 | 2017-04-06 | 東芝ホクト電子株式会社 | サーマルプリントヘッド |
Also Published As
Publication number | Publication date |
---|---|
CN104039557B (zh) | 2016-12-07 |
CN104039557A (zh) | 2014-09-10 |
US9050826B2 (en) | 2015-06-09 |
US20150009270A1 (en) | 2015-01-08 |
JPWO2013129020A1 (ja) | 2015-07-30 |
JP5815836B2 (ja) | 2015-11-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5815836B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP6181244B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP5918383B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP5836825B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP5128010B1 (ja) | サーマルヘッド、およびこれを備えるサーマルプリンタ | |
WO2017073681A1 (ja) | サーマルヘッドおよびサーマルプリンタ | |
JP2012030439A (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP6130510B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP7309040B2 (ja) | サーマルヘッドおよびサーマルプリンタ | |
WO2012133178A1 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP5744171B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP5780715B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP6290632B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP6189715B2 (ja) | サーマルヘッドおよびサーマルプリンタ | |
JP7444972B2 (ja) | サーマルヘッドおよびサーマルプリンタ | |
JP6154338B2 (ja) | サーマルヘッドおよびサーマルプリンタ | |
JP7122460B2 (ja) | サーマルヘッドおよびサーマルプリンタ | |
JP2017043013A (ja) | サーマルヘッドおよびサーマルプリンタ | |
WO2014171524A1 (ja) | サーマルヘッドおよびサーマルプリンタ | |
JP6189714B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP6426541B2 (ja) | サーマルヘッドおよびサーマルプリンタ | |
JP5665389B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP2016049628A (ja) | サーマルヘッドおよびサーマルプリンタ | |
JP2014144623A (ja) | サーマルヘッドおよびサーマルプリンタ | |
JP2014188983A (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13754898 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2014502082 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14376485 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 13754898 Country of ref document: EP Kind code of ref document: A1 |