WO2013123899A1 - 一种低噪音的电脑散热设备 - Google Patents

一种低噪音的电脑散热设备 Download PDF

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Publication number
WO2013123899A1
WO2013123899A1 PCT/CN2013/071804 CN2013071804W WO2013123899A1 WO 2013123899 A1 WO2013123899 A1 WO 2013123899A1 CN 2013071804 W CN2013071804 W CN 2013071804W WO 2013123899 A1 WO2013123899 A1 WO 2013123899A1
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Prior art keywords
heat
water
plate
computer
pipe
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PCT/CN2013/071804
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English (en)
French (fr)
Inventor
周哲明
周发明
Original Assignee
Zhou Zheming
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Publication date
Application filed by Zhou Zheming filed Critical Zhou Zheming
Priority to EP13751981.5A priority Critical patent/EP2818968A4/en
Publication of WO2013123899A1 publication Critical patent/WO2013123899A1/zh
Priority to US14/467,809 priority patent/US20140362525A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures

Definitions

  • the present invention relates to electronic devices, and more particularly to heat dissipation generated by computer devices such as servers, network devices, PCs, and notebook computers.
  • the utility model provides a low noise computer heat dissipation device, and heats the heat of each main heat generating component in the computer case to the concentrated heat sink.
  • the centralized heat sink uses a heat sink with a large heat dissipation area and a low-speed fan to dissipate heat.
  • a low-speed fan is also installed in the chassis to assist heat dissipation. The advantage of this solution is that it can reduce the noise of the chassis cooling fan and improve the overall heat dissipation efficiency.
  • a low-noise computer cooling device comprising a heat-conducting component, a concentrated heat sink, and an auxiliary cooling fan.
  • One end of the heat transfer member is connected to the main heat generating component in the chassis, and the other end is connected to the concentrated heat sink.
  • the heat conducting component is mainly composed of a heat pipe, and the evaporation end of the heat pipe is connected with the main heat generating component in the chassis, and the main heat generating component is a CPU, a motherboard north and south bridge chip, a graphics card, a memory, a hard disk, a power source and the like, and a condensation end of the heat pipe
  • the concentrated radiators are connected.
  • the heat conducting parts may be connected in series by a plurality of heat pipes, and the two heat pipes are connected in series by the close contact of the metal plates at the connection ends of the heat pipes.
  • insulation materials can be wrapped outside the heat pipes.
  • a concentrated heat sink has a heat sink with a large heat dissipation area and a low speed fan.
  • One type of concentrated radiator is a water-cooled radiator, which includes a water-cooled plate, a water pipe, a water pump, a water storage tank, a heat-dissipating water tank, a low-speed fan, and a water-repellent layer.
  • the water barrier is installed in the chassis to divide the chassis into two inner and outer cavities.
  • the water-cooled heat sink is installed in the outer cavity and is isolated from other devices in the chassis to prevent the cooling water from leaking to the devices in the chassis.
  • the water-cooled plate is connected with the heat pipe of the heat-conducting component.
  • connection method is to weld the heat-dissipating plate at the end of the heat pipe, and the heat-dissipating plate, the water-repellent layer and the water-cooling plate are in contact with each other in a stacked manner, and the other connection method is water-cooling.
  • the heat pipe jack is installed on the side of the board, and the heat pipe is installed with a sealing ring.
  • the heat pipe of the heat conducting part is inserted into the water cooling plate through the water blocking layer to contact the cooling water, and the heat of the heat pipe is Description
  • the water-cooled plate can have multiple pieces, which are respectively connected to the respective heat-conducting parts.
  • a heat pipe heat sink which comprises a heat conducting plate, a heat pipe, a heat dissipating fin and a low speed fan.
  • the heat conducting plate is connected with the heat pipe of the heat conducting component, that is, the heat sink is welded at the end of the heat pipe of the heat conducting component.
  • the heat sink is in contact with the heat conductive plate.
  • a part of the auxiliary cooling fan in the chassis is installed near each main heat-generating component, and the residual heat of each main heat-generating component is exchanged into the air in the chassis, and the other part is installed on the chassis casing, and the hot air in the chassis is discharged to the chassis. Outside the chassis.
  • the utility model has the beneficial effects that the noise of the cooling fan of the chassis can be reduced and the overall heat dissipation efficiency can be improved.
  • FIG. 1 is a schematic structural view of a PC computer case according to the present invention.
  • an embodiment of the present invention is a PC computer case.
  • a PC chassis that contains (19) a chassis enclosure and (1) thermally conductive components inside the enclosure, (2) an auxiliary cooling fan, and (3) a centralized heat sink.
  • the heat-conducting components are mainly composed of (11) heat pipes, (11) the (12) evaporation end of the heat pipe is connected to the main heat-generating components such as (16) CPU, (17) graphics card, (18) power supply in the chassis, (11) The (14) condensation end of the heat pipe is welded with (14) heat sink.
  • Concentrated radiators are water-cooled radiators that contain (4) water-cooled panels, (5) heat-dissipating water tanks, (6) low-speed fans, (7) water storage chambers, (8) water pumps, (9) water pipes, and [10 ) Water barrier. (10) Aquifer installation The chassis is divided into (21) inner chamber and (22) outer chamber in the chassis, and (3) the concentrated heat sink is installed in the (22) outer chamber.
  • the heat sink, (10) the water barrier and (4) the water-cooled panel are placed in a stacked manner.
  • the (2) auxiliary cooling fan in the chassis is partially installed near the main heat-generating component, and the residual heat of each main heat-generating component is exchanged into the air in the chassis, and the other part is installed in the opening of the casing of the casing, and the chassis is The hot air inside is discharged outside the chassis.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明公开了一种低噪音的电脑散热设备，涉及电子设备，特别是涉及服务器、网络设备、PC、笔记本电脑等电脑设备产生的热量的排散。该电脑散热设备包含导热部件、集中散热器和辅助散热风扇，导热部件主要由热管组成，热管的蒸发端与机箱内的主要发热部件相连接，热管的冷凝端与集中散热器相连接，集中散热器具有较大散热面积的散热片和低速风扇。本技术方案的优点是，可以降低机箱散热风扇的噪音和提高整体散热效率。

Description

一种低噪音的电脑散热设备 技术领域
[0001] 本实用新型涉及电子设备， 特别是涉及服务器、 网络设备、 PC、 笔记本电脑等电脑 设备产生的热量的排散。
背景技术
[0002] 目前的电脑机箱最常用的散热方式是， 在机箱内的各个主要发热部件上安装散热片 和风扇散热。 该方式的缺点是各部件上安装的散热片的大小受部件布局的限制， 散热面积一 说
般不大， 因此对散热风扇的风速有较高的要求， 导致风扇转速居高不下， 噪音较大。 另外， 安装在各个发热部件上的风扇吹出来的热风容易被其他风扇吸入， 导致整体散热效率降低。
书
实用新型内容
[0003] 为解决现有技术中的散热风扇噪音较大和整体散热效率降低的问题， 本实用新型提 供一种低噪音的电脑散热设备， 将电脑机箱内各主要发热部件的热量传导到集中散热器上， 集中散热器使用较大散热面积的散热片和低速风扇散热， 机箱内还安装低速风扇辅助散热， 该方案的优点是可以降低机箱散热风扇的噪音和提高整体散热效率。
[0004] 本实用新型解决其技术问题所采用的技术方案是：
[0005] 一种低噪音的电脑散热设备， 包含导热部件、 集中散热器和辅助散热风扇。 导热部 件的一端与机箱内的主要发热部件相连接， 另一端与集中散热器相连接。
[0006] 导热部件主要由热管组成， 热管的蒸发端与机箱内的主要发热部件相连接， 主要发 热部件是 CPU、 主板南北桥芯片、 显卡、 内存、 硬盘、 电源等部件， 热管的冷凝端与集中 散热器相连接。 为解决导热部件可能出现管线繁多， 安装不便的问题， 导热部件可以由多根 热管串联起来， 两根热管通过焊接在热管连接端的金属板紧密接触实现串联。 为了避免导热 部件之间的热干扰和保护热管， 在热管外可以包裹隔热材料。
[0007] 集中散热器具有较大散热面积的散热片和低速风扇。
[0008] 集中散热器的一种是水冷散热器， 包含有水冷板、 水管、 水泵、 储水箱、 散热水 箱、 低速风扇和隔水层。 隔水层安装在机箱内将机箱分隔成内外两个空腔， 水冷散热器安装 在外腔与机箱内其他设备相隔离， 以避免冷却水泄漏时流向机箱内的设备。 水冷板与导热部 件的热管相连接， 一种连接方式是在热管的末端焊接散热板， 散热板、 隔水层和水冷板三者 以叠放的方式相接触， 另一种连接方式是在水冷板的侧面安装热管插孔， 热管插孔内安装有 密封圈， 导热部件的热管穿过隔水层从热管插孔插入到水冷板内与冷却水接触， 热管的热量 说 明 书
可以直接交换到冷却水中； 水冷板可以有多块， 分别就近与各个导热部件相连接。
[0009] 集中散热器的另一种是热管散热器， 包含有导热板、 热管、 散热鳍片和低速风扇， 导热板与导热部件的热管相连接， 即在导热部件的热管的末端焊接散热板， 散热板与导热板 相接触。
[0010] 机箱内的辅助散热风扇一部分安装在各主要发热部件附近， 将各主要发热部件的余 热交换到机箱内的空气中， 另一部分安装在机箱外壳上， 将机箱内的热空气排散到机箱外。
[0011] 本实用新型的有益效果是， 能降低机箱散热风扇的噪音和提高整体散热效率。
附图说明
[0012] 图 1是根据本实用新型的 PC电脑机箱的结构示意图。
[0013] 图中， 1.导热部件， 2.辅助散热风扇， 3.集中散热器， 4.水冷板， 5.散热水箱， 6.低速 风扇， 7.储水室， 8.水泵， 9.水管， 10.隔水层， 11.热管， 12.蒸发端， 13.冷凝端， 14散热 板， 15.主板， 16.CPU, 17.显卡， 18.电源， 19.机箱外壳， 20.机箱外壳开孔处， 21.内腔， 22. 外腔。
具体实施方式
[0014] 下面结合附图和实施例对本实用新型进一步说明。
[0015] 在图 1中， 本实用新型的实施例是一种 PC电脑机箱。
[0016] 如图 1所示：
一种 PC电脑机箱， 包含 （19) 机箱外壳和机箱内的 （1) 导热部件、 （2) 辅助散热风扇和 (3) 集中散热器。 （1) 导热部件主要由 （11) 热管组成， （11) 热管的 （12) 蒸发端与机箱 内的 （16) CPU, (17) 显卡、 （18) 电源等主要发热部件相连接， （11) 热管的 （13) 冷凝 端焊接有 （14) 散热板。 （3) 集中散热器是水冷散热器， 包含有 （4) 水冷板、 （5) 散热水 箱、 （6) 低速风扇、 （7) 储水室、 （8) 水泵、 （9) 水管和 〔10) 隔水层。 （10) 隔水层安装 在机箱内将机箱分隔成 （21) 内腔和 （22) 外腔， （3) 集中散热器安装在 （22) 外腔。
(14) 散热板、 （10) 隔水层和 （4) 水冷板三者以叠放的方式相接触。
[0017] 机箱内的 （2) 辅助散热风扇一部分安装在主要发热部件附近， 将各主要发热部件的 余热交换到机箱内的空气中， 另一部分安装在 （20) 机箱外壳开孔处， 将机箱内的热空气排 散到机箱外。

Claims

权 利 要 求 书
1.一种低噪音的电脑散热设备， 其特征是： 包含导热部件、 集中散热器和辅助散热风扇； 所述导热部件的一端与机箱内的主要发热部件相连接， 另一端与所述集中散热器相连接； 所 述导热部件主要由热管组成。
2. 根据权利要求 1所述的电脑散热设备， 其特征是： 所述导热部件的热管通过焊接在其末 端的金属板紧密接触实现串联； 所述热管外包裹有隔热材料。
3. 根据权利要求 1或 2所述的电脑散热设备， 其特征是： 所述集中散热器的一种是水冷散 热器， 所述集中散热器包含有水冷板、 水管、 水泵、 储水箱、 散热水箱、 低速风扇和隔水 层； 所述隔水层安装在机箱内将机箱分隔成内外两个空腔， 所述水冷散热器安装在外腔与机 箱内其他设备相隔离。
4. 根据权利要求 3所述的电脑散热设备， 其特征是： 所述集中散热器的水冷板与所述导热 部件的热管相连接的一种连接方式是在所述热管上焊接散热板， 所述散热板、 所述隔水层和 所述水冷板三者以叠放的方式相接触。
5. 根据权利要求 3所述的电脑散热设备， 其特征是： 所述集中散热器的水冷板与所述导热 部件的热管相连接的一种连接方式是在所述水冷板的侧面安装带有密封圈的热 管插孔， 所 述导热部件的热管穿过所述隔水层从所述热管插孔插入到所述水冷板内并与冷却水接触； 所 述水冷板有多块， 分别就近与所述各个导热部件相连接。
6. 根据权利要求 1或 2所述的电脑散热设备， 其特征是： 所述集中散热器的一种是热管散 热器， 其特征是： 包含有导热板、 热管、 散热鳍片和低速风扇， 所述导热板与所述导热部件 的热管末端焊接的散热板相接触。
7. 根据权利要求 1或 2所述的电脑散热设备， 其特征是： 所述辅助散热风扇一部分安装在 各主要发热部件附近， 一部分安装在机箱外壳的开孔处。
PCT/CN2013/071804 2012-02-23 2013-02-22 一种低噪音的电脑散热设备 WO2013123899A1 (zh)

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Application Number Priority Date Filing Date Title
EP13751981.5A EP2818968A4 (en) 2012-02-23 2013-02-22 LOW NOISE COMPUTER HEAT DISSIPATION DEVICE
US14/467,809 US20140362525A1 (en) 2012-02-23 2014-08-25 Low-noise computer heat dissipation device

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CN201220060220XU CN202533862U (zh) 2012-02-23 2012-02-23 一种低噪音的电脑散热设备
CN201220060220.X 2012-02-23

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CN116679808A (zh) * 2023-06-20 2023-09-01 苏州市凌臣采集计算机有限公司 一种便于散热的小型工控机

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