WO2013122109A1 - インプリント装置およびインプリント方法 - Google Patents
インプリント装置およびインプリント方法 Download PDFInfo
- Publication number
- WO2013122109A1 WO2013122109A1 PCT/JP2013/053425 JP2013053425W WO2013122109A1 WO 2013122109 A1 WO2013122109 A1 WO 2013122109A1 JP 2013053425 W JP2013053425 W JP 2013053425W WO 2013122109 A1 WO2013122109 A1 WO 2013122109A1
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- WIPO (PCT)
- Prior art keywords
- molding
- mold
- cover
- stage
- fluid
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/002—Component parts, details or accessories; Auxiliary operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
- B29C71/04—After-treatment of articles without altering their shape; Apparatus therefor by wave energy or particle radiation, e.g. for curing or vulcanising preformed articles
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2791/00—Shaping characteristics in general
- B29C2791/004—Shaping under special conditions
- B29C2791/006—Using vacuum
Definitions
- the present invention relates to an imprint apparatus and imprint method for transferring a fine pattern of a mold to a molding.
- a nanoimprint technique as a method for forming a micro-order or nano-order fine pattern.
- a mold having a fine pattern is pressed on a molded object such as resin, and the pattern is transferred to the molded object using heat or light (for example, see Patent Document 1).
- an imprint apparatus that pressurizes a flexible mold or a molded object with fluid pressure is also considered (for example, see Patent Document 2).
- the conventional imprint apparatus uses a cylindrical bellows to form the decompression chamber, when a square stage is used, there is a problem that a large bellows is required and the apparatus becomes large.
- an object of the present invention is to provide an imprint apparatus and an imprint method that can reduce the size of the apparatus and reduce the cost.
- an imprint apparatus of the present invention is for transferring a molding pattern of a mold to a molding object, and includes a stage and a cover for pressurizing the mold and the molding object.
- a frame that has a hole into which the stage can be inserted and surrounds the outer periphery of the stage, first moving means that can move the stage and the cover relatively in the contact and separation directions, and the cover and the frame Pressure reducing a decompression chamber composed of a second moving means capable of relatively moving in the contact / separation direction, the cover, the mold or the molding object, the stage, and the frame body, A first pressure reducing means for removing fluid between the mold and the molding; and a second pressure reducing means for removing fluid in a space formed between the cover and the mold or the molding. It is characterized by comprising.
- the frame body includes a fluid ejecting unit that ejects a fluid between the mold and the molding target.
- the first decompression unit and the second decompression unit may have a communication channel that communicates the space and the decompression chamber.
- the frame body has the fluid ejecting means at a position facing the molding object.
- the imprint method of the present invention is for pressurizing the mold and the molding object between a stage and a cover, and transferring the molding pattern of the mold to the molding object.
- An arrangement step of arranging the mold and the molding on the cover, a frame having a hole into which the stage can be inserted and surrounding an outer periphery of the stage, and the cover, the mold or the molding A gripping step of gripping the one on the cover side, a spacing step of relatively separating the stage and the cover, and a fluid in a space formed between the cover and the mold or the molding object
- the stage and the frame are relatively moved to form a gap between the mold and the workpiece, and fluid is ejected from the fluid ejecting means provided in the frame to the gap. It is preferable to have a mold release step.
- the transfer step may be performed by heating the molding to a glass transition temperature or higher, and then applying a thermal imprint that pressurizes the molding, or pressurizing the mold and the molding, and then molding the molding.
- An optical imprint that irradiates light can be used.
- the imprint apparatus and the imprint method of the present invention use a frame body that has a hole into which a stage can be inserted and surrounds the outer periphery of the stage instead of the conventionally used bellows, and the frame body is attached to the stage and the cover. Therefore, the apparatus can be downsized. Also, by holding either the mold or the object to be molded by the cover and the frame, and moving the stage and the cover relatively, the stage, the frame and the cover also serve as a separation means, so the apparatus can be further downsized. Can lower the cost.
- the imprint apparatus of the present invention is for transferring a molding pattern of a mold 1 to a molding object 2, and is a stage for pressurizing the mold 1 and the molding object 2 32 and the cover 33, a frame 43 having a hole into which the stage 32 can be inserted, and surrounding the stage 32, and a first moving means capable of relatively moving the stage 32 and the cover 33 in the contact / separation direction (see FIG.
- second moving means 46 capable of relatively moving the cover 33 and the frame 43 in the contact / separation direction, either the cover 33, the mold 1 or the workpiece 2, the stage 32, and the frame 43 is formed between the cover 33 and the mold 1 or the molding object 2, and the first decompression means 45 for removing the fluid between the mold 1 and the molding object 2.
- Second decompression means 35 for removing fluid in the space to be formed.
- the mold 1 is made of, for example, “metal such as nickel”, “ceramics”, “carbon material such as glassy carbon”, “silicon”, etc., and one end surface thereof (molding)
- the surface) has a predetermined molding pattern.
- This molding pattern can be formed by subjecting the molding surface to precision machining.
- it is formed on a silicon substrate or the like by a semiconductor micromachining technique such as etching, or the surface of the silicon substrate or the like is subjected to metal plating by an electroforming method, for example, nickel plating, and the metal plating layer is peeled off. It can also be formed.
- a resin mold produced using an imprint technique In this case, the mold may be formed in a film shape that is flexible with respect to the molding surface of the molding object.
- the material and the manufacturing method thereof are not particularly limited.
- the molding pattern formed on the mold 1 is not only a geometrical shape composed of irregularities, but also for transferring a predetermined surface state, such as a mirror surface transfer having a predetermined surface roughness. Including.
- the molding pattern is formed in various sizes such as the minimum width of the convex portion and the concave portion in the plane direction is 100 ⁇ m or less, 10 ⁇ m or less, 2 ⁇ m or less, 1 ⁇ m or less, 100 nm or less, 10 nm or less.
- dimensions in the depth direction are formed in various sizes such as 10 nm or more, 100 nm or more, 200 nm or more, 500 nm or more, 1 ⁇ m or more, 10 ⁇ m or more, 100 ⁇ m or more.
- the shape of the surface (molded surface) on which the mold pattern is formed is not limited to a flat surface.
- the molding surface may be formed into a three-dimensional shape such as a curved surface, such as a mold for transferring the moth-eye structure to the curved surface of the lens.
- the molded object 2 means a substrate or film made of a resin, an inorganic compound or a metal, or a molded layer 21 made of a resin, an inorganic compound or a metal on the substrate or film.
- resin used for the to-be-molded product 2 there exist photocurable resin, thermosetting resin, or thermoplastic resin, for example.
- unsaturated hydrocarbons such as vinyl and allyl groups such as epoxide-containing compounds, (meth) acrylic acid ester compounds, vinyl ether compounds, and bisallyl nadiimide compounds Group-containing compounds
- molding pattern may be used.
- Organic peroxides and azo compounds can be preferably used as the heat-reactive radical initiator, and acetophenone derivatives, benzophenone derivatives, benzoin ether derivatives, xanthone derivatives and the like can be preferably used as the photoreactive radical initiator.
- the reactive monomer may be used without a solvent, or may be used after being dissolved in a solvent and desolvated after coating.
- thermoplastic resin examples include cyclic olefin ring-opening polymerization / hydrogenated product (COP) and cyclic olefin-based resin such as cyclic olefin copolymer (COC), acrylic resin, polycarbonate, vinyl ether resin, perfluoroalkoxyalkane (PFA), and the like.
- Fluorine resin such as polytetrafluoroethylene (PTFE), polystyrene, polyimide resin, polyester resin, or the like can be used.
- the molded object 2 may be a flexible film or a layer formed on a substrate made of an inorganic compound such as silicon or a metal.
- the mold 1 is arranged on the stage 32 side and the molding 2 is arranged on the cover 33 side.
- the molding 2 may be arranged on the stage 32 side and the mold 1 is arranged on the cover 33 side. Absent.
- the cover 33 is for pressing the mold 1 and the molding 2 together with the stage 32.
- the cover 33 is formed larger than the stage 32 so that the mold 1 or the molding object 2 can be held together with the frame body 43.
- the material of the cover 33 may be any material as long as it has pressure resistance and heat resistance with respect to molding conditions during the imprint process. For example, a metal such as stainless steel can be used.
- a metal such as stainless steel can be used.
- the stage 32 is for pressurizing the mold 1 and the workpiece 2 together with the cover 32.
- the pressure receiving surface 321 on the side in contact with the mold 1 or the workpiece 2 of the stage 32 is sufficiently wide and smoothly formed.
- the pressure receiving surface 321 may be formed in a planar shape or a curved surface shape in accordance with the shape of the mold 1 or the workpiece 2 to be supported.
- the material may be anything as long as it has pressure resistance and heat resistance with respect to the molding conditions during the imprint process. For example, a metal such as stainless steel can be used.
- a metal or the like having high thermal conductivity.
- the pressure receiving surface 321 is made of a material having high thermal conductivity.
- a transparent material such as glass may be used.
- the mold 1 and the stage 32 may be integrally formed in order to prevent unnecessary transfer marks from being generated on the workpiece 2. For example, conventionally, after a pattern is formed by electroforming, only the portion of the pattern is cut out and used, but this can be used as it is without being cut out.
- the frame body 43 is disposed so as to surround the outer periphery of the stage 32 and may be formed in a cylindrical shape having a hole into which the stage 32 can be inserted.
- the decompression chamber 40 can be configured by moving the frame 43 relative to the stage 32.
- the decompression chamber 40 is for decompressing the atmosphere around the mold 1 and the molding 2, particularly the atmosphere between the mold 1 and the molding 2.
- the material of the frame body 43 may be any material as long as it has pressure resistance and heat resistance with respect to the molding conditions during the imprint process.
- a metal such as stainless steel can be used.
- a decompression chamber sealing means 44 for bringing the frame body 43 and the stage 32 into close contact with each other and between the frame body 43 and the mold 1 or the molding object 2 is further provided. It may be provided.
- an O-ring is prepared as the decompression chamber sealing means 44, and a concave groove shallower than the diameter of the cross section of the O-ring is formed at the end of the frame 43 on the cover 33 side.
- An O-ring may be disposed on the side.
- a concave groove shallower than the diameter of the cross section of the O-ring may be formed on the outer periphery side (frame body 43 side) of the stage 32, and the O-ring may be disposed in this groove.
- a concave groove shallower than the diameter of the cross section of the O-ring may be formed on the inner peripheral side (stage 32 side) of the frame body 43, and the O-ring may be disposed in this groove.
- the first moving means may be anything as long as the cover 33 and the stage 32 are close to or away from each other.
- the stage 32 is fixed, and the cover 33 is a hydraulic or pneumatic cylinder. It is possible to apply one that moves by means of, or one that moves by an electric motor and a ball screw.
- the cover 33 may be fixed and the stage 32 may be moved by a similar mechanism.
- the pressure for transferring the pattern of the mold 1 to the molding 2 may be applied to the cover 33 and the stage 32 by the first moving means, but a pressure means for pressing the cover 33 and the stage 32 is separately provided. It is also possible to provide it. In this case, what is pressurized by a hydraulic or pneumatic cylinder, what is pressurized by an electric motor and a ball screw, or the like may be used.
- the second moving means 46 may be any means as long as the cover 33 and the frame body 43 are brought close to or away from each other.
- the frame 43 can be moved by a hydraulic or pneumatic cylinder, The thing which moves with a motor and a ball screw, etc. are applicable.
- the cover 33 may be moved by a similar mechanism.
- the first depressurizing means 45 depressurizes the depressurization chamber 40 composed of any one of the cover 33, the mold 1 or the molding object 2, the stage 32, and the frame 43, and at least the mold 1 and the molding object 2.
- the gas in the decompression chamber 40 is exhausted via the gas supply / discharge passage 451 for the decompression chamber connected to the decompression chamber 40 and the gas supply / exhaust passage 451 for the decompression chamber. What is necessary is just to comprise with the pump 452 for 1st pressure reduction.
- the decompression chamber gas supply / exhaust flow path 451 may be appropriately provided with an on-off valve.
- the second decompression means 35 uses the pressure difference between the decompression chamber 40 and the space slightly formed between the cover 33 and the mold 1 or the molding object 2 to form the mold 1 or the molding object. This is to prevent the object 2 from being bent toward the decompression chamber 40 side.
- the second decompression means 35 includes, for example, a space gas supply / discharge channel 351 connected to the space, and a second pressure reduction pump 352 that exhausts gas in the space via the space gas supply / discharge channel 351. What is necessary is just to comprise.
- the space gas supply / discharge flow path 351 may be appropriately provided with an on-off valve. By doing so, the fluid in the space can be removed before the decompression chamber 40 is decompressed.
- the first pressure reducing pump 452 the space gas supply / exhaust flow path 351, and the pressure reducing chamber gas supply / exhaust flow path 451 are connected by a three-way valve, and the first pressure reducing pump is commonly used. By using this, the second pressure reducing pump 352 can be omitted.
- a communication flow path is provided to connect the space and the decompression chamber so that the fluid in the space and the decompression chamber can be removed at the same time. May be.
- a space sealing means for bringing the cover 33 and the mold 1 or the molding object 2 into close contact with each other. 34 may be arranged.
- an O-ring is prepared as a space sealing means 34, and a concave groove shallower than the diameter of the cross-section of the O-ring is formed in a portion of the cover 33 facing the frame 43.
- An O-ring may be disposed on the side.
- the imprint apparatus of the present invention may be provided with a fluid ejecting means 6 for ejecting a fluid such as a gas between the mold 1 and the workpiece 2 on the frame.
- a fluid ejecting means 6 for ejecting a fluid such as a gas between the mold 1 and the workpiece 2 on the frame.
- the fluid ejecting means 6 is provided, for example, on the inner peripheral side wall of the frame 43, and an ejection port 61 that ejects fluid between the mold 1 and the molding object 2, and a flow velocity of the fluid ejected from the ejection port 61.
- a flow rate adjusting means (not shown) for adjusting, a release fluid supply source 62 for supplying fluid to the ejection port 61, and a release fluid for flowing the fluid of the release fluid supply source 62 to the ejection port 61 And a supply channel 63.
- the injection port 61 can be formed in a slit shape formed along the inner peripheral side wall of the frame body 43.
- the width of the slit may be adjusted according to the adhesion between the mold 1 and the molding object 2 and the like. For example, a slit having a width of 0.2 to 0.5 mm may be used. It is also possible to use a multi-nozzle in which a plurality of holes are provided at appropriate intervals along the end of the molding 2.
- the angle of the injection port 61 may be formed in the direction of the contact surface between the mold 1 and the workpiece 2 or parallel to the contact surface.
- the injection ports 61 in at least two directions facing each other with the molding 2 interposed therebetween, preferably in four directions.
- the fluid ejected from the facing position collides at the central portion between the mold 1 and the workpiece 2.
- the fluid loses velocity and changes from dynamic pressure to static pressure, and the static pressure at the collision portion becomes higher than the pressure on the upper surface of the molding object 2, so that the molding object 2 is lifted.
- the energy of the ejected high-speed fluid is converted into static pressure, so that the pattern transferred to the molding 2 can be damaged by instantaneously extinguishing the peeling, vortex, and shearing force generated on the wall surface. It can be prevented from receiving.
- the flow rate adjusting means may be anything as long as it can adjust the flow rate of the fluid ejected from the ejection port 61.
- a device that adjusts the flow rate with pressure and ejection time can be used.
- the fluid pressurized to 0.2 to 0.5 MPa with an accumulator may be ejected with a pulse of 50 to 300 ms.
- the release fluid supply source 63 may be an air compressor that sends gas to the injection port 61, a cylinder that stores compressed gas, or the like.
- the temperature control means which adjusts the temperature of the to-be-molded object 2 by heating or cooling the to-be-molded object 2 is further provided.
- the temperature adjusting means a heating means for directly or indirectly heating the molding 2 or a cooling means for cooling can be used.
- any heating means can be used as long as it can heat either one or both of the mold 1 and the molding 2 to a predetermined temperature, for example, the glass transition temperature or the melting temperature or higher of the molding 2. But it ’s okay.
- the object to be molded 2 may be heated from the stage 32 side or heated from the cover 33 side.
- a heater provided in the stage 32 or the cover 33 to heat the mold 1 or the workpiece 2 can be used. It is also possible to heat using a heated liquid or gas.
- any cooling means may be used as long as it can cool either one or both of the mold 1 and the molding 2 to a predetermined temperature, for example, below the glass transition temperature or below the melting temperature of the molding 2. But it ’s okay.
- the product 2 may be cooled from the stage 32 side or may be cooled from the cover 33 side.
- a cooling water channel provided in the stage 32 or the cover 33 to cool the mold 1 or the workpiece 2 can be used.
- the light irradiation unit 7 including the light source 71 capable of emitting an electromagnetic wave having a predetermined wavelength may be disposed on the molding object 2.
- the light irradiation unit 7 may be provided inside the cover 33 or may be provided on the stage 32 side. In this case, in order to adjust the temperature of the molding 2 to an appropriate temperature, the above-described temperature adjusting means may be further provided.
- a conveying means for conveying the molding 2 to the imprint apparatus of the present invention may be further provided.
- a feed roll for supplying a resin film (molded object) and a recovery roll for recovering the resin film to which the molding pattern is transferred are arranged with the stage 32 interposed therebetween. Thereby, a pattern can be transferred continuously.
- the imprinting method of the present invention is to pressurize the mold 1 and the molding object 2 between the stage 32 and the cover 33 and transfer the molding pattern of the mold 1 to the molding object 2.
- the separation process of relatively separating the stage 32 and the cover 33 A first removal step for removing fluid, a second removal step for removing fluid between the mold 1 and the molding object 2, an adhesion process for bringing the mold 1 and the molding object 2 into close contact, and a molding pattern of the mold 1 And a transfer step for transferring the material to the molding 2.
- the mold 1 and the molding object 2 are arranged on the stage 32.
- the stage 32 side is arranged so as not to overlap the frame body 43 on the stage 32, and what is arranged on the cover 33 side is held by the frame body 43 and the cover 33 and held on the stage It is arranged so that at least a part thereof overlaps with the frame body 43 so that it can be separated from 32.
- the cover 33 and the frame body 43 are moved toward each other, and the cover 33 and the frame body 43 are located on the cover 33 side of the mold 1 and the molding 2 ( In FIG. 2, the object 2) is held.
- the cover 33 and the stage 32 are relatively moved in the separation direction while holding the mold 1 or the workpiece 2 by the cover 33 and the frame body 43.
- the decompression chamber 40 can be formed with a gap between the mold 1 and the molding 2.
- the fluid in the space formed between the cover 33 and the mold 1 or the molded object 2 on the cover 33 side (molded object 2 in FIG. 3) is removed, and the mold 1 or The molding object 2 is adsorbed to the cover 33.
- the decompression chamber 40 is depressurized, and the fluid existing between the mold 1 and the molding object 2 vacated in the separation step is removed.
- the cover 33 and the stage 32 are moved relatively close to each other so that the mold 1 and the workpiece 2 are in close contact with each other.
- the molding pattern of the mold 1 is transferred to the molding object 2 using thermal imprinting or optical imprinting.
- thermal imprinting first, the molding 2 is heated to a glass transition temperature or higher by heating means, and then a force is applied to the cover 33 and the stage 32 by first moving means or pressurizing means. Then, the mold 1 and the molding object 2 are pressurized, and the molding pattern is transferred to the molding object 2. Next, the molding pattern is fixed to the molding 2 by lowering the temperature of the molding 2 below the glass transition temperature by the cooling means.
- the object 2 is heated to a glass transition temperature or higher by a heating unit, and then a force is applied to the cover 33 and the stage 32 by a first moving unit or a pressing unit. Then, the mold 1 and the molding object 2 are pressurized, and the molding pattern is transferred to the molding object 2. Next, when the object 2 is irradiated with light having a predetermined wavelength by the light irradiation means, the molding pattern is fixed to the object 2.
- the mold release process may be any process as long as the mold 1 can be separated from the molding 2, but, for example, as shown in FIG. 5, the stage 32 and the frame body 43 are relatively moved to be in close contact with each other. A gap is formed between the mold 1 and the molding 2. Next, fluid is ejected from the fluid ejecting means provided in the frame 43 into the gap. Thereby, the type
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Abstract
Description
2 被成形物
6 流体噴射手段
7 光照射手段
32 ステージ
33 カバー
34 空間用密閉手段
35 第2減圧手段
40 減圧室
43 枠体
44 減圧室用密閉手段
45 第1減圧手段
46 第2移動手段
Claims (13)
- 型の成型パターンを被成形物に転写するためのインプリント装置であって、
前記型と前記被成形物を加圧するためのステージ及びカバーと、
前記ステージを挿入可能な穴を有し、前記ステージの外周を囲む枠体と、
前記ステージと前記カバーを接離方向に相対的に移動可能な第1移動手段と、
前記カバーと前記枠体を接離方向に相対的に移動可能な第2移動手段と、
前記カバー、前記型又は前記被成形物のいずれかと、前記ステージと、前記枠体と、で構成される減圧室を減圧し、前記型と前記被成形物の間の流体を除去する第1減圧手段と、
前記カバーと前記型又は前記被成形物との間に形成される空間の流体を除去する第2減圧手段と、
を具備することを特徴とするインプリント装置。 - 前記枠体は、前記型と前記被成形物の間に流体を噴射する流体噴射手段を具備することを特徴とする請求項1記載のインプリント装置。
- 前記第1減圧手段と前記第2減圧手段は、前記空間と前記減圧室とを連通する連通流路を有することを特徴とする請求項1又は2記載のインプリント装置。
- 前記空間を密閉するための空間用密閉手段を具備することを特徴とする請求項1ないし3のいずれかに記載のインプリント装置。
- 前記減圧室を密閉するための減圧室用密閉手段を具備することを特徴とする請求項1ないし4のいずれかに記載のインプリント装置。
- 前記枠体は、前記被成形物を挟んで対向する位置に前記流体噴射手段を有することを特徴とする請求項3記載のインプリント装置。
- 前記被成形物の温度を調節する温調手段を具備することを特徴とする請求項1ないし6のいずれかに記載のインプリント装置。
- 前記被成形物に光を照射する光照射手段を具備することを特徴とする請求項1ないし7のいずれかに記載のインプリント装置。
- 前記被成形物を供給するための送りロールと、前記成型パターンの転写された被成形物を回収するための回収ロールと、を有する搬送手段を具備することを特徴とする請求項1ないし8のいずれかに記載のインプリント装置。
- ステージとカバーの間で前記型と前記被成形物を加圧し、前記型の成型パターンを前記被成形物に転写するためのインプリント方法であって、
前記ステージ又は前記カバー上に前記型及び前記被成形物を配置する配置工程と、
前記ステージを挿入可能な穴を有し前記ステージの外周を囲む枠体と、前記カバーとで、前記型又は前記被成形物のうちカバー側にあるものを挾持する挾持工程と、
前記ステージと前記カバーを相対的に離間する離間工程と、
前記カバーと前記型又は前記被成形物との間に形成される空間の流体を除去する第1除去工程と、
前記型と前記被成形物との間の流体を除去する第2除去工程と、
前記型と前記被成形物を密着させる密着工程と、
前記型の成型パターンを前記被成形物に転写する転写工程と、
を有することを特徴とするインプリント方法。 - 前記ステージと前記枠体を相対的に移動して前記型と前記被成形物との間に隙間を形成し、前記枠体に設けられた流体噴射手段から前記隙間に流体を噴射する離型工程を有することを特徴とする請求項10記載のインプリント方法。
- 前記転写工程は、前記被成形物をガラス転移温度以上に加熱した後、前記被成形物を加圧することを特徴とする請求項11又は12記載のインプリント方法。
- 前記転写工程は、前記型と前記被成形物を加圧した後、前記被成形物に光を照射することを特徴とする請求項11又は12記載のインプリント方法。
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US14/377,934 US20150042013A1 (en) | 2012-02-14 | 2013-02-13 | Imprint device and imprint method |
JP2013558710A JP6028266B2 (ja) | 2012-02-14 | 2013-02-13 | インプリント装置およびインプリント方法 |
EP13748541.3A EP2815868B1 (en) | 2012-02-14 | 2013-02-13 | Imprint device and imprint method |
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JP2016162870A (ja) * | 2015-03-02 | 2016-09-05 | パナソニックIpマネジメント株式会社 | インプリント装置 |
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US10343312B2 (en) * | 2012-08-27 | 2019-07-09 | Scivax Corporation | Imprint device and imprint method |
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KR20180066880A (ko) * | 2016-12-09 | 2018-06-19 | 주식회사 엘지화학 | 밀봉재 조성물 |
CN108481727B (zh) * | 2018-03-30 | 2020-02-18 | 重庆熊氏运升汽车零部件有限公司 | 一种装饰面板压花装置 |
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US20150042013A1 (en) | 2015-02-12 |
EP2815868A1 (en) | 2014-12-24 |
EP2815868A4 (en) | 2016-05-04 |
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