WO2013111214A1 - Ampoule - Google Patents

Ampoule Download PDF

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Publication number
WO2013111214A1
WO2013111214A1 PCT/JP2012/006687 JP2012006687W WO2013111214A1 WO 2013111214 A1 WO2013111214 A1 WO 2013111214A1 JP 2012006687 W JP2012006687 W JP 2012006687W WO 2013111214 A1 WO2013111214 A1 WO 2013111214A1
Authority
WO
WIPO (PCT)
Prior art keywords
base
housing
lamp
light emitting
resin
Prior art date
Application number
PCT/JP2012/006687
Other languages
English (en)
Japanese (ja)
Inventor
吉典 覚野
仕田　智
松井　伸幸
田村　哲志
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Priority to JP2013501052A priority Critical patent/JP5255735B1/ja
Publication of WO2013111214A1 publication Critical patent/WO2013111214A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a lamp using a semiconductor light emitting device.
  • a general light bulb shaped lamp is housed in a semiconductor light emitting element as a light source, a base on which the semiconductor light emitting element is mounted on the upper surface, a housing in which the base is attached to the upper end, and a housing
  • the base unit and the casing are made of metal (Patent Document 1).
  • the circuit unit and the base attached to the lower end of the casing are provided.
  • the reason why the base and the housing are made of metal in this way is to ensure the heat dissipation necessary for the lamp, that is, to efficiently dissipate the heat generated by the semiconductor light emitting element to the outside of the lamp at the time of lighting. .
  • the base when the base is made of metal, heat generated in the semiconductor light emitting element can be efficiently conducted to the housing. Furthermore, if the housing is also made of metal, the heat of the housing can be efficiently conducted to the base, which allows the heat to be efficiently released from the base to the lighting apparatus side. In addition, if the case is made of metal, heat can easily spread throughout the entire case, so heat can be efficiently released from the entire outer surface of the case into the atmosphere.
  • the heat load on the semiconductor light emitting element and the circuit unit is reduced, and the lifetime of the lamp is increased.
  • the semiconductor light emitting element which is a heat source is a portion which becomes the highest temperature and is subjected to a large heat load, it is necessary for the lamp to constitute the base with metal so as to be able to take heat quickly from the semiconductor light emitting element. It is important to ensure good heat dissipation.
  • the base and the housing are made of metal, the lamp becomes heavier than the incandescent bulb. A heavy lamp is inconvenient because it is difficult to handle when transporting or removing the lamp.
  • the base and the housing are made of metal, it is difficult to ensure the insulation between the semiconductor light emitting element and the housing. Therefore, in order to reduce the weight of the lamp and to ensure the insulation property, it is conceivable to constitute the base with resin.
  • the base when the base is made of resin, the base may be warped due to a molding error at the time of molding the base or heat generated by the semiconductor light emitting device when the lamp is used.
  • a warp When such a warp is generated, the heat dissipation is lowered and the attitude of the semiconductor light emitting element mounted on the base is distorted, and the light distribution characteristic of the lamp is deteriorated.
  • the present invention has been made in view of the problems as described above, and it is an object of the present invention to provide a lamp which is light in weight and has good light distribution characteristics while securing the heat dissipation necessary for the lamp.
  • a lamp according to the present invention includes a semiconductor light emitting device as a light source, a base on which the semiconductor light emitting device is mounted on the upper surface, a housing in which the base is mounted on the upper end, and the housing And a base attached to the lower end portion of the housing, wherein the base is made of resin, and the base is formed with irregularities for preventing warpage. It features.
  • the lamp according to the present invention is lighter in weight than the lamp in which the base is made of metal because the base is made of resin. Furthermore, since the base is provided with irregularities for preventing warpage, warpage is unlikely to occur in the base, and the semiconductor light emitting element can be attached to the base without warpage in a suitable posture. Good characteristics.
  • Sectional view showing a lamp according to the first embodiment An exploded perspective view showing a lamp according to the first embodiment An enlarged sectional view showing a portion surrounded by a two-dot chain line in FIG.
  • the perspective view for demonstrating the mounting form of a semiconductor light-emitting device to a modification A perspective view showing a base concerning a 1st embodiment
  • the perspective view which shows the base concerning a modification The perspective view which shows the base of the lamp
  • FIG. 1 is a cross-sectional view showing a lamp according to a first embodiment.
  • FIG. 2 is an exploded perspective view showing the lamp according to the first embodiment.
  • FIG. 3 is an enlarged sectional view showing a portion surrounded by a two-dot chain line in FIG.
  • the lamp 1 is an LED lamp as a substitute for an incandescent lamp, and a semiconductor light emitting module 10 as a light source and the semiconductor light emitting module 10 are mounted on the upper surface 21
  • the dashed-dotted line drawn along the vertical direction of the drawing in FIG. 1 indicates the lamp axis J of the lamp 1.
  • the lamp axis J is an axis serving as a rotation center when attaching the lamp 1 to a socket of a lighting fixture (not shown), and coincides with the rotation axis of the base 60. Further, in FIG. 1, the upper side of the drawing is above the lamp 1 and the lower side of the drawing is below the lamp.
  • the semiconductor light emitting module 10 is provided on the mounting substrate 11 so as to cover the mounting substrate 11, the plurality of semiconductor light emitting devices 12 mounted on the mounting substrate 11, and the semiconductor light emitting devices 12.
  • One sealing member 13 is provided.
  • the mounting substrate 11 is, for example, a metal base substrate including an insulating layer, a wiring pattern, and a metal plate, and a power receiving terminal 14 for receiving power for driving the semiconductor light emitting element 12 is provided on the top surface.
  • Each semiconductor light emitting element 12 is, for example, a GaN-based LED that emits blue light, and, as shown in FIG. 2, for example, 25 semiconductor light emitting elements 12 are arranged in a matrix on the mounting substrate 11 in 5 rows and 5 rows. It is arranged.
  • the sealing member 13 is formed of, for example, a transparent silicone resin mixed with phosphor particles for converting blue light into yellow light, and seals all 25 semiconductor light emitting elements 12.
  • the mounting substrate 11 is not limited to a metal base substrate, and may be an existing mounting substrate other than a metal base substrate, such as a resin substrate or a ceramic substrate. Also, the mounting substrate 11 is not necessarily required, and as shown in FIG. 4, a wiring pattern (not shown) is formed on the upper surface 21A of the base 20A having electrical insulation, and the mounting substrate is on the wiring pattern The semiconductor light emitting device 12A having no light emitting diode may be mounted.
  • the semiconductor light emitting element 12 is not limited to the LED, and may be an LD (laser diode) or an EL element (electric luminescence element). Also, even if the semiconductor light emitting element 12 is mounted on the upper surface of the mounting substrate 11 using COB (Chip on Board) technology, it is mounted using an SMD (Surface Mount Device) type. It may be.
  • LD laser diode
  • EL element electric luminescence element
  • the semiconductor light emitting element 12 and the sealing member 13 are not limited to the GaN-based LED emitting blue light and the sealing member converting blue light into yellow light, and perform LED conversion of other luminescent color and other wavelength conversion It may be a sealing member.
  • the wavelength conversion material does not necessarily have to be mixed in the sealing member, and white light is mixed by using three types of LEDs, that is, blue light emission, red light emission, and green light emission. If so, mixing of the wavelength conversion material is not necessary.
  • a wavelength conversion layer may be formed on the surface of the sealing member, or a wavelength conversion layer may be formed on the inner surface 71 of the globe 70.
  • FIG. 5 is a perspective view showing a base according to the first embodiment
  • FIG. 5 (a) is a perspective view of the base viewed from the top side
  • FIG. 5 (b) is a perspective view. It is the perspective view which looked at the base from the lower surface side.
  • the base 20 has, for example, a substantially disk shape, and the semiconductor light emitting module 10 is mounted substantially at the center of the substantially circular upper surface 21.
  • attachment, an engagement structure etc. can be considered.
  • the base 20 is made of a high thermal conductivity resin, and is manufactured by, for example, injection molding the high thermal conductivity resin.
  • the high thermal conductivity resin is a resin composition in which a filler having thermal conductivity is mixed in a resin material, and has high thermal conductivity compared to a resin in which the filler is not mixed. Since the base 20 made of high thermal conductivity resin has high thermal conductivity, it can be used for a lamp instead of a metal base.
  • the thermal conductivity of the high thermal conductivity resin can be adjusted by the material, shape, mixing amount, and the like of the filler.
  • filler of high thermal conductivity resin glass, silicon oxide, beryllium oxide, aluminum oxide, magnesium oxide, zinc oxide, silicon oxide, silicon nitride, boron nitride, titanium nitride, aluminum nitride, diamond, graphite, silicon carbide, titanium carbide, boride Materials such as inorganic materials and metals such as zirconium, phosphorus boride, molybdenum silicide, beryllium sulfide, aluminum, tin, indium, iron, copper, silver, or two or more of them It is also possible to use a conductive filler composed of an alloy or the like. Furthermore, it is also conceivable to use a plurality of types of the filler described above in combination.
  • the high thermal conductivity resin can be provided with electrical insulation, and a base having electrical insulation can be produced.
  • the insulating member for electrically insulating the semiconductor light emitting module and the base is unnecessary, and the structure of the lamp can be simplified, so that the cost of the lamp can be reduced and the productivity can be improved.
  • the base 20 according to the present embodiment is made of a high thermal conductivity resin using a nonconductive filler and thus has electrical insulation. Therefore, the insulating member for electrically insulating the semiconductor light emitting module 10 and the base 20 is not used.
  • the base 20 is made of a high thermal conductivity resin using a conductive filler, the semiconductor light emitting module 10 and the base 20 can be electrically insulated from the semiconductor light emitting module 10 and the base 20. It is conceivable to interpose an insulating member such as an insulating sheet (not shown) between them.
  • the shape of the filler is preferably fibrous or particulate.
  • a ceramic fiber such as glass fiber as a filler, a high thermal conductivity resin having a small specific gravity can be obtained, and the weight of the base 20 can be further reduced.
  • desired directionality such as the plane direction of the child material 20, for example, a path serving as a heat passage can be easily formed in the resin material, and the high thermal conductivity resin The thermal conductivity in the desired direction can be enhanced.
  • Resins of high thermal conductivity resins include synthetic resins such as polypropylene, polypropylene sulfide, polycarbonate, polyetherimide, polyphenylene sulfide, polyphenylene oxide, polysulfone, polybutylene terephthalate, polyamide, polyethylene terephthalate, polyether sulfone, polyphthalamide, etc. It is preferred to use.
  • the mixing amount of the filler to the resin is, for example, preferably in the range of 5 to 95% by mass, more preferably in the range of 10 to 70% by mass, and in the range of 30 to 50% by mass. It is further preferred that When the amount of the filler is too small, the effect of improving the thermal conductivity is reduced, and when the amount of the filler is too large, the formability of the high thermal conductivity resin is reduced.
  • the thermal conductivity of the high thermal conductivity resin is preferably 1 W / mk or more, more preferably 5 W / mk or more, and still more preferably 10 W / mk or more.
  • the lower surface 22 of the base 20 is formed with an unevenness for preventing warpage. Specifically, an uneven portion is formed on the lower surface 22 of the base 20 by a rectangular frame-shaped rib 23 provided on the lower surface 22 of the base 20.
  • a general resin can be realized without using a high thermal conductivity resin.
  • the semiconductor light emitting element 12 can be attached to the base 20 without warping in a suitable posture, and the lamp 1 has good light distribution characteristics. Furthermore, since the base 20 is unlikely to be warped, the dimensions of the base 20 are unlikely to be distorted, and the dimensional error does not make it difficult for the lamp 1 to be assembled.
  • the amount of resin used can be reduced while maintaining the rigidity of the base 20, so that the cost and weight of the base 20 can be reduced.
  • corrugation of the base 20 is not limited by what is formed of the frame-shaped rib 23 provided in the lower surface 22 of the base 20,
  • corrugation may be formed as follows.
  • FIG. 6 is a perspective view showing a base according to a modification.
  • the asperity is formed by the annular rib 23B provided on the lower surface 22 of the base 20B. Then, only one annular rib 23B is provided along the outer peripheral edge on the outer peripheral edge of the lower surface 22B of the base 20B.
  • annular rib is not limited to one, Two or more may be provided.
  • the lower surface 22C of the base 20C has an annular rib 23C provided on the outer peripheral edge along the outer peripheral edge and a smaller diameter than the rib 23C and along the outer peripheral edge
  • the annular rib 24C provided inside the outer peripheral edge and the annular rib 25C provided smaller in diameter than the rib 24C and inside the rib 24C along the outer peripheral edge are concentric circles.
  • the plurality of annular ribs are not limited to the case where they are provided so as to be concentric circles, and the center position may be shifted.
  • the rib may have an elliptical ring shape.
  • corrugation is formed of rib 23D radially provided in lower surface 22D of base 20D. Then, the ribs 23D are provided radially in eight directions at equal angles from the center of the lower surface 22D of the base 20D.
  • the radial ribs are not limited to those directed to eight directions, and may be provided in a plurality of directions other than eight.
  • the base 20E may be provided from the center of the lower surface 22E in four directions at equal angles, that is, in a cross shape.
  • the radial ribs are not limited to the case where they are radially provided at equal angles, and the angle is arbitrary.
  • the annular rib or radial rib described above may be provided on the upper surface 21 of the base 20, or may be provided on both the lower surface 22 and the upper surface 21. Even in such a case, it is possible to relieve the stress causing the warpage and prevent the warpage of the base 20, and reduce the amount of resin used to achieve cost reduction and weight reduction of the base 20. it can.
  • an annular rib is provided on the outer peripheral edge of the upper surface 21, it is possible to temporarily fix the glove 70 by using the rib. Further, when a rib is provided on a portion of the upper surface 21 on which the semiconductor light emitting module 10 is mounted, heat generated in the semiconductor light emitting element 12 can be efficiently transmitted to the housing 30 by using the rib.
  • corrugation for curvature prevention of the base 20 may be formed by the groove
  • FIG. The shape, position and number of grooves, holes and through holes are arbitrary.
  • corrugation for curvature prevention of the base 20 may be formed by making thickness of the center side of the base 20, and outer peripheral side different. Even in these cases, it is possible to relieve the stress that causes the warpage and prevent the warpage of the base 20, and reduce the amount of resin used to achieve cost reduction and weight reduction of the base 20. Can.
  • the groove 70 can be used to fix the glove 70 to the base 20 by engagement with the claws. Further, when a groove is provided in the portion of the upper surface 21 where the semiconductor light emitting module 10 is mounted, the groove can be used to position the semiconductor light emitting module 10.
  • Case The case 30 is constituted of, for example, a circuit case 31 in which the circuit unit 40 is accommodated and a cover 32 externally fitted on the upper end side of the circuit case 31.
  • the housing 30, that is, each of the circuit case 31 and the cover 32 is made of, for example, a heat conductive resin.
  • the housing 30 is made of resin
  • the lamp 1 is lighter than when the housing 30 is made of metal.
  • the resin has high thermal conductivity, the heat of the housing 30 can be efficiently conducted to the base 60, and heat can be efficiently released from the entire outer surface of the housing 30 to the atmosphere. it can.
  • ramp which concerns on this invention does not necessarily need to be comprised with high heat conductive resin
  • casing may be comprised with metal.
  • the heat dissipation of the lamp is higher than when the case is made of high thermal conductivity resin.
  • the case is not made of a high thermal conductivity resin but made of a low thermal conductivity resin, the heat of the base 20 will not be easily conducted to the circuit unit 40, so the circuit unit 40 should be protected from heat. Can.
  • the definition of the high thermal conductivity resin constituting the housing 30 is the same as the definition of the high thermal conductivity resin constituting the base 20.
  • the circuit case 31 and the cover 32 may be made of the same resin composition as the high thermal conductivity resin constituting the base 20, and either one of the filler or the resin or both of the filler and the resin are different. And may be made of another type of high thermal conductivity resin.
  • the circuit case 31 and the cover 32 may be made of the same resin composition, or may be made of different types of resin compositions.
  • the circuit case 31 has a substantially cylindrical shape with an upper end and a lower end opened, and includes a substantially cylindrical large diameter portion 33 and a substantially cylindrical small diameter portion 34 having a smaller diameter than the large diameter portion 33. Most of the circuit unit 40 is accommodated in the large diameter portion 33 located on the upper side. On the other hand, a base 60 is externally fitted to the small diameter portion 34 located on the lower side, whereby the lower side opening 35 of the circuit case 31 is closed.
  • the cover 32 has a bottomed cylindrical inner cylindrical portion 36 having a cylindrical side wall portion 36a and a lid wall portion 36b for closing the upper end side of the side wall portion 36a, and a cylindrical shape whose diameter gradually decreases from the upper end to the lower end
  • the inner cylindrical portion 36 and the outer cylindrical portion 37 are integrally formed so as to be continuous at their respective lower ends. A gap is generated between the inner cylindrical portion 36 and the outer cylindrical portion 37 over the entire circumferential direction. Therefore, even if the inner cylindrical portion 36 melts or burns due to abnormal heat generation or the like of the electronic components 42, 43, the outer cylindrical portion 37 constituting the outer shell of the lamp 1 hardly affects.
  • One claw 34a is provided at the upper end of the large diameter portion 33 of the circuit case 31, and the upper end portion of the side wall portion 36a of the inner cylindrical portion 36 of the cover 32 is used to receive the claw 34a.
  • One through hole 36c is provided.
  • the circuit case 31 and the cover 32 are assembled by inserting the circuit case 31 into the inner cylindrical portion 36 of the cover 32 and engaging the claws 34 a of the circuit case 31 with the through holes 36 c of the cover 32.
  • the circuit case 31 does not rotate about the lamp axis J with respect to the cover 32 due to the engagement between the claws 34a and the through holes 36c.
  • the circuit case 31 and the cover 32 are assembled by the engagement structure with the claws, but there may be a plurality of the claws 34a and the through holes 36c for receiving the claws, and their assembly
  • the method may be a claw-free engagement structure, screwing, bonding, press fitting, or the like, or a plurality of methods may be combined.
  • the base 20 and the globe 70 are attached to the upper end 30 a of the housing 30, that is, the upper end 37 a of the outer cylindrical portion 37 of the cover 32.
  • the inner peripheral surface of the upper end portion 37a of the outer cylindrical portion 37 is formed with a claw locking portion 37b for locking the claw 25 provided on the outer peripheral portion 24 of the base 20, and the claw locking portion
  • the base 20 is attached to the cover 32 by locking the claws 25 of the base 20 to 37 b.
  • a groove 26 is formed between the base 20 and the upper end 37 a of the cover 32, and the upper end 37 a of the cover 32 and the outer periphery 24 of the base 20 are engaged with each other in the groove 26.
  • the circuit case 31 and the cover 32 of the housing 30 are each formed of an insulating material. Therefore, the base 20 located above the lid wall portion 36b of the inner cylindrical portion 36 of the cover 32 and the circuit unit 40 located below are insulated by the lid wall portion 36b interposed therebetween.
  • the base 20 is provided with a pair of through holes 27 for inserting the electric wires 44 and 45, and the cover wall portion 36b is made to correspond to the positions of the through holes 27 of the base 20.
  • a pair of through holes 36 d for inserting the electric wires 44 and 45 is provided.
  • the circuit unit 40 includes various electronic components 42 and 43 mounted on the circuit board 41, and is housed inside the housing 30.
  • the housing 30 is made of a highly thermally conductive resin having electrical insulation. Therefore, the circuit unit 40 is directly accommodated inside the housing 30, and the circuit case for insulating the housing 30 and the circuit unit 40 is not used.
  • the pair of electric wires 44 and 45 on the output side of the circuit unit 40 is electrically connected to the power receiving terminal of the semiconductor light emitting module 10. Specifically, the electric wires 44 and 45 are led out above the base 20 through the through holes 36 d of the cover 32 and the through holes 27 of the base 20 and connected to the power receiving terminal of the semiconductor light emitting module 10. ing.
  • Each of the electric wires 44 and 45 is, for example, a lead wire covered with an insulating covering layer such as a resin.
  • the electric wires 46 and 47 on the input side of the circuit unit 40 are electrically connected to the base 60.
  • the electrical wiring 46 is led out of the through hole 38 provided in the small diameter portion 34 of the housing 30 to the outside of the housing 30 and connected to the shell portion 61 of the mouthpiece 60.
  • the electrical wiring 47 is drawn out of the lower side opening 35 of the small diameter portion 34 of the housing 30 to the outside of the housing 30, and is connected to the eyelet portion 62 of the base 60.
  • Each of the electric wires 46 and 47 is, for example, a lead wire covered with an insulating covering layer such as a resin.
  • Base A base 60 is a so-called Edison type base and is for receiving power from the socket of the lighting apparatus when the lamp 1 is attached to the lighting apparatus and turned on.
  • the base 60 has a cylindrical shell portion 61 whose outer peripheral surface is an external thread, and an eyelet portion 62 mounted on the shell portion 61 via the insulating material 63.
  • the small diameter portion of the housing 30 It is attached to the lower end of the housing 34, ie, the small part 34 of the housing 30.
  • the base 60 is not limited to the Edison type, and may be, for example, a pin type (specifically, a G type such as GY or GX).
  • the globe 70 has, for example, a dome shape, and is attached to the upper end 30 a of the housing 30 so as to cover the upper side of the semiconductor light emitting module 10. Specifically, the base 20 and the housing are bonded with the adhesive 80 for bonding the base 20 and the housing 30 with the opening side end 72 of the glove 70 fitted in the groove 26 of the base 20. Bonded to 30.
  • the shape of the globe 70 is not particularly limited, and may be a shape resembling a bulb of an A-shaped or G-shaped incandescent bulb. Further, the glove 70 is not essential to the lamp according to the present invention, and a configuration without the glove is also conceivable.
  • the light emitted from the semiconductor light emitting module 10 is incident on the inner surface 71 of the globe 70, passes through the globe 70, and is extracted to the outside of the globe 70.
  • the inner surface 71 of the globe 70 may be subjected to a diffusion process for diffusing light emitted from the semiconductor light emitting module 10, for example, a diffusion process using silica, a white pigment, or the like.
  • the heat generated by the semiconductor light emitting element 12 is mainly conducted to the base 60 through the base 20 and the housing 30, and the lighting apparatus 60 It is discharged to the wall and the ceiling via (not shown). Since the base 20 and the housing 30 are made of a high thermal conductivity resin and their thermal conductivity is high, the heat generated by the semiconductor light emitting module 10 can be efficiently released to the outside of the lamp 1. Further, since the housing 30 is made of a high thermal conductivity resin, heat can easily spread over the entire housing 30, and heat can be efficiently released to the atmosphere from the entire outer surface of the housing 30. .
  • the base 20 and the case 30 are made of high thermal conductivity resin, the base and the case are lighter than the lamp formed of metal, and the handling is easy. It is easy.
  • FIG. 7 is a perspective view showing a lamp base, a housing and a glove according to a second embodiment.
  • FIG. 8 is an enlarged sectional view of an essential part of a lamp according to a second embodiment.
  • the lamp 100 according to the second embodiment is adhesively bonded in that the base 120 and the glove 170 are attached to the upper end 131 of the housing 130 by a claw engagement structure. And the lamp 1 according to the first embodiment attached.
  • the lamp 100 according to the second embodiment basically has substantially the same configuration as the lamp 1 according to the first embodiment except for the configuration relating to the engagement structure. Therefore, only the configuration related to the engagement structure will be described in detail, and the description of the other configurations will be omitted or simplified.
  • the same members as in the first embodiment are denoted by the same reference numerals as in the first embodiment.
  • the outer peripheral portion 122 of the base 120 is provided with a plurality of claws 126.
  • the claws 126 respectively project from the circumferential surface of the outer circumferential portion 122 in the direction orthogonal to the lamp axis J (see FIG. 1), and are equally spaced along the circumferential direction of the outer circumferential portion 122 It is provided in four places.
  • a plurality of claws 173 are provided at the opening side end portion 172 of the glove 170.
  • the claws 173 respectively project from the outer peripheral surface of the opening side end portion 172 in the direction orthogonal to the lamp axis J, and are equally spaced along the circumferential direction of the outer peripheral surface of the opening side end portion 172 It is open and provided in four places.
  • the upper end portion 131 of the housing 130 is provided with a plurality of claw receiving portions 136 at positions corresponding to the claws 126 of the base 120, and the plurality of claws are also received at positions corresponding to the claws 173 of the glove 170.
  • the part 139 is provided, and the nail receiving part 139 is located above the nail receiving part 136.
  • the nail receiving portion 136 and the nail receiving portion 139 are, for example, through holes penetrating in the thickness direction of the housing 130.
  • the base 120 When the base 120 is attached to the housing 130, the base 120 is fitted into the upper end 131 from the top of the housing 130, and the claws 126 of the base 120 are engaged with the claw receiving portion 136 of the housing 130. . Since the base 120 can be attached to the housing 130 by such an engagement structure, assembling of the lamp is simplified as compared with the case where the base 120 is attached to the housing 130 by screwing, bonding, caulking or the like. It is.
  • the base 120 and the housing 130 are each made of a high thermal conductivity resin. If the base material 120 is a resin, even if the housing 130 is made of metal or ceramic, it is feasible to attach the base 120 to the housing 130 with the above-described claw-based engagement structure.
  • the opening side end 172 of the glove 170 is fitted into the inside of the upper end 131 from the top of the housing 130. This is performed by locking the claw 173 on the claw receiving portion 139 of the housing 130. Since the glove 170 can be attached to the housing 130 by such an engagement structure, the assembly of the lamp is easier as compared to the case where the glove 170 is attached to the housing 130 by adhesion or the like. In addition, since the housing
  • casing are not limited to said structure.
  • the claw receiving portion 136 and the claw receiving portion 139 of the housing 130 may not be through holes, but may be recesses which do not penetrate.
  • the engagement structure of the base and the housing by the claws may be a structure in which the claw provided on the housing is engaged with the claw receiving portion provided on the base.
  • the engaging structure by the claws of the glove and the housing may be a structure in which the claw provided on the housing is locked to the claw receiving portion provided on the glove.
  • FIG. 9 is a perspective view showing a lamp base, a housing and a glove according to a third embodiment.
  • FIG. 10 is an enlarged sectional view of an essential part of a lamp according to a third embodiment.
  • the lamp 200 according to the third embodiment is adhesively bonded in that the base 220 and the glove 270 are attached to the upper end portion 231 of the housing 230 by a claw engagement structure. And the lamp 1 according to the first embodiment attached.
  • the lamp 200 according to the third embodiment has basically the same configuration as the lamp 1 according to the first embodiment except for the configuration relating to the engagement structure.
  • the lamp 200 according to the third embodiment and the lamp 100 according to the second embodiment are different in the aspect of the engagement structure by the claws.
  • the same members as in the first embodiment are denoted by the same reference numerals as in the first embodiment.
  • the outer peripheral portion 222 of the base 220 is provided with a plurality of claws 226.
  • the claws 226 respectively project from the circumferential surface of the outer circumferential portion 222 in the direction orthogonal to the lamp axis J (see FIG. 1), and are equally spaced along the circumferential direction of the outer circumferential portion 222 It is provided in four places.
  • a plurality of claws 239 are also provided at the upper end portion 231 of the housing 230.
  • the claws 239 respectively project from the inner peripheral surface of the upper end portion 231 in the direction orthogonal to the lamp axis J, and are equally spaced along the circumferential direction of the inner peripheral surface of the upper end portion 231 It is provided in four places.
  • a plurality of claw receiving portions 274 are provided at positions corresponding to the claws 226 of the base 220 at the opening side end 272 of the glove 270, and a plurality of positions are also provided at positions corresponding to the claws 239 of the housing 230.
  • a nail receiving portion 273 is provided, and the nail receiving portion 273 is located above the nail receiving portion 274.
  • the nail receiving portion 273 and the nail receiving portion 274 are, for example, through holes penetrating in the thickness direction of the glove 270, respectively.
  • the base 220 When attaching the base 220 to the glove 270, the base 220 is fitted into the opening side end 272 from the lower side of the glove 270, and the claws 226 of the base 220 are locked to the claw receiving portion 274 of the glove 270. Since the base 220 can be attached to the glove 270 by such an engagement structure, the assembly of the lamp is easier as compared to the case where the base 220 is attached to the glove 270 by adhesion or the like.
  • the base 220 is made of a high thermal conductivity resin.
  • the glove 270 is attached to the housing 230.
  • the opening side end 272 of the glove 270 is fitted into the upper end 231 from the top of the housing 230, and the claw 239 of the housing 230 is engaged with the claw receiving part 273 of the glove 270. Stop it. Since the glove 270 can be attached to the housing 230 by such an engagement structure, assembly of the lamp is easier than when the glove 270 is attached to the housing 230 by adhesion or the like.
  • the housing 230 is made of high thermal conductivity resin.
  • casing 230 set it as high thermal conductivity resin here, a metal and a ceramic may be sufficient.
  • the base 220 is attached to the upper end portion 231 of the housing 230 via the globe 270.
  • the heat of the base 220 can be efficiently conducted to the globe 270, and the heat from the globe 270 can also be efficiently introduced into the air. It can be released.
  • casing and a glove are not limited to a structure above.
  • the claw receiving portion 273 and the claw receiving portion 274 of the glove 270 may not be through holes, but may be concave portions which do not penetrate.
  • the engagement structure by the claws of the base and the glove may be a structure in which the claw provided on the glove is locked to the claw receiving portion provided on the base.
  • the engagement structure of the housing and the glove by the claw may be a structure in which the claw provided on the glove is locked to the claw receiving portion provided on the housing.
  • the lamp may be a combination of the partial configurations of the lamps according to the first to third embodiments and their modifications.
  • the materials, numerical values, and the like described in the above-described embodiment only exemplify preferable ones, and the present invention is not limited thereto.
  • the present invention can be widely used in lighting in general.
  • Reference Signs List 1 100, 200 lamps 12 semiconductor light emitting devices 20, 120, 220 base 21 upper surface 22 lower surface 23, 23B, 23C, 23D, 24C, 25C, 23E rib 30, 130, 230 housing 30a, 131, 231 upper end 30b Lower end 40 Circuit unit 60 base 70, 170, 270 Globe

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

Cette invention concerne une ampoule présentant les caractéristiques de dissipation thermiques nécessaires à une ampoule, un poids réduit et d'excellentes caractéristiques de distribution de la lumière. Ladite ampoule comprend : un élément électroluminescent à semi-conducteur (12) formant source lumineuse; une base (20) présentant une surface supérieure (21) sur laquelle est monté l'élément électroluminescent à semi-conducteur (12); un boîtier (30) présentant une partie d'extrémité supérieure (30a) sur laquelle est fixée la base (20); une unité de circuit (40) logée dans le boîtier (30); et un culot (60) fixé à une partie d'extrémité inférieure (30b) du boîtier (30). La base (20) est constituée d'une résine, et des creux et des saillies destinés à empêcher le gauchissement sont formés sur la base (20).
PCT/JP2012/006687 2012-01-25 2012-10-18 Ampoule WO2013111214A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013501052A JP5255735B1 (ja) 2012-01-25 2012-10-18 ランプ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012013104 2012-01-25
JP2012-013104 2012-01-25

Publications (1)

Publication Number Publication Date
WO2013111214A1 true WO2013111214A1 (fr) 2013-08-01

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PCT/JP2012/006687 WO2013111214A1 (fr) 2012-01-25 2012-10-18 Ampoule

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JP (1) JP5255735B1 (fr)
TW (1) TW201339477A (fr)
WO (1) WO2013111214A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015041461A (ja) * 2013-08-21 2015-03-02 三菱電機株式会社 照明ランプ及び照明装置
JP2015076280A (ja) * 2013-10-09 2015-04-20 パナソニックＩｐマネジメント株式会社 照明装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104864315A (zh) * 2015-06-08 2015-08-26 河南巴拉斯光电科技有限公司 Led球泡灯

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010021089A1 (fr) * 2008-08-21 2010-02-25 パナソニック株式会社 Source de lumière pour éclairage
WO2010084546A1 (fr) * 2009-01-20 2010-07-29 パナソニック株式会社 Appareil d'éclairage
WO2011021457A1 (fr) * 2009-08-20 2011-02-24 株式会社光波 Dispositif d'éclairage du type à lampe fluorescente
JP2011165434A (ja) * 2010-02-08 2011-08-25 Panasonic Corp 光源、バックライトユニット及び液晶表示装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010021089A1 (fr) * 2008-08-21 2010-02-25 パナソニック株式会社 Source de lumière pour éclairage
WO2010084546A1 (fr) * 2009-01-20 2010-07-29 パナソニック株式会社 Appareil d'éclairage
WO2011021457A1 (fr) * 2009-08-20 2011-02-24 株式会社光波 Dispositif d'éclairage du type à lampe fluorescente
JP2011165434A (ja) * 2010-02-08 2011-08-25 Panasonic Corp 光源、バックライトユニット及び液晶表示装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015041461A (ja) * 2013-08-21 2015-03-02 三菱電機株式会社 照明ランプ及び照明装置
JP2015076280A (ja) * 2013-10-09 2015-04-20 パナソニックＩｐマネジメント株式会社 照明装置

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JP5255735B1 (ja) 2013-08-07
TW201339477A (zh) 2013-10-01
JPWO2013111214A1 (ja) 2015-05-11

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