WO2013100749A1 - Apparatus and method for providing improved grinding lines on an aluminium substrate disc - Google Patents
Apparatus and method for providing improved grinding lines on an aluminium substrate disc Download PDFInfo
- Publication number
- WO2013100749A1 WO2013100749A1 PCT/MY2012/000074 MY2012000074W WO2013100749A1 WO 2013100749 A1 WO2013100749 A1 WO 2013100749A1 MY 2012000074 W MY2012000074 W MY 2012000074W WO 2013100749 A1 WO2013100749 A1 WO 2013100749A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- grinding
- plates
- carrier
- central
- rotatable shaft
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
Definitions
- This invention relates to an apparatus or an arrangement which is adapted to establish grinded lines upon an aluminium substrate disc.
- this invention relates to a very unique arrangement wherein the grinding pattern upon the aluminium substrate disc includes an improved surface roughness uniformity compared to conventional parallel grinding lines.
- This invention focuses more on disc grinding processes associated with high production rates wherein the aluminium disc is sandwiched into a machine between two rotatable abrasive plates.
- these conventional types of machinery associated with the grinding process include four types of gears, a sun gear, a ring gear, a lower plate gear and an upper plate gear.
- RPM ratio which is referred to as the rotation ratio of a grinder plate against the sun gear.
- the RPM ratio is associated with the disc revolution. A higher grinder plate rotation will increase disc revolution and wherein a higher sun gear rotation will also increase disc self-rotation.
- a grinding apparatus for establishing grinding lines on an aluminium substrate disc, said apparatus including;
- each plate includes a central bore hole positionable about the central rotatable shaft wherein each of the circular grinding plates are free to rotate independently of the other and/or the central rotatable shaft;
- a plurality of carrier plates adapted to be sandwiched in between the pair of circular grinding plates wherein each carrier plate includes a series of pockets to which aluminium substrate discs are nestable therein such that the upper and lower surfaces of the aluminium discs are in contactable communication with each of the circular grinding plates;
- the central rotatable shaft, peripheral ring and the plurality of carrier plates include a series of teeth and/or gears along their angular edges so as to establish an epicyclic gearing so as to increase and create a degree of rotation upon each of the central rotatable shaft, peripheral ring and each of the carrier plates such that the ability to impart rotation upon the carrier plates to which the aluminium discs rest therein results in an elliptical criss-cross grinding line pattern.
- the applicant for this invention has realised that by establishing a planetary or epicyclic gearing type arrangement between the main central rotatable shaft and the peripheral ring through the geared teeth arrangement of the carrier plates holding the aluminium substrate discs means that as these carrier plates for the aluminium discs are sandwiched there in between the pair of circular grinding plates, not only are they moving in the general direction of the main central rotating shafts and the lower plates to which it rests thereon, it is also undergoing its own internal rotation upon its own axis.
- central rotatable shaft is the central and/or sun gear.
- peripheral ring is an outer ring with inward facing teeth.
- the central and/or sun gear includes outward facing teeth.
- each carrier plate wherein the aluminium substrate discs rest therein have annular pointing outward facing teeth adapted to mesh with the annulus and/or central/sun gear.
- the apparatus is adjustable such that the pair of grinding plates can be separated wherein an upper grinding plate is raisable relative to the lower grinding plate such that carrier plates wherein the aluminium substrate discs nested therein can be placed there upon the lower grinding plate during times of inoperation of the grinding apparatus.
- the plurality of carrier plates are configured about the lower circular plate such that there is a maximising of contact area between the aluminium substrate discs nested in the carrier plate and each of the respective circular grinding plates to which the carrier plates are sandwiched therein between.
- the apparatus further includes sufficient cooling to minimise the heat generated during the disc grinding process.
- the grinding apparatus includes a main external housing body such that the pair of circular grinding plates are enclosed within the apparatus so that the grinding process is not viewable from the outside of the machine thereby minimising any exposure to dust and airborne metal filings created.
- Figure 1 is a schematic view of the main components shown using a conventional grinding process wherein the upper grinding plate to which the carrier plate would be sandwiched therein between during operation is not shown for clarity reasons.
- Figures 2a illustrates the path taken by the carrier plate and its relevant movement to the lower plate when the conventional arrangement of Figure 1 is put into operation wherein the sun gear and the ring impart no rotation into the carrier plate which is not undergoing any self-rotation and figure 2b illustrates the disc grinding lines.
- Figures 3a and 3b provide representations of the path of the carrier plate relative to the lower plate and the grinding line pattern established upon the grinder disc after the grinding process wherein the sun gear and the ring gear rotates the carrier plate has a partial degree of self rotation due to the relative movement of the carrier to the sun gear and the ring gear rotation.
- Figure 4 shows a schematic representation of the main components associated with the apparatus that provides for a cross hatch grinded line pattern during the grinding process in a preferred embodiment of this invention.
- Figures 5a and 5b show respectively the path of carrier movement relative to the lower plate and the cross hatch grinded line pattern upon the aluminium substrate discs after the grinding process.
- the lower plate (14) has an internal bore hole (18) and a peripheral edge (16) which is independent of the main driveable or central shaft (12) and the external rim (20).
- Figure 2a shows the path (26) that the carrier plate moves relative to the lower plate. This is when the main central shaft (12) and the external or annulus ring (20) do not impart any rotation onto the carrier plate (22) and therefore there is no self rotation of the carrier plate (22) as it moves in its defined direction. [041] As the carrier plate (22) does not rotate in its general movement, the Aluminium substrate discs (24) that are located withinside the carrier pockets (25) upon the carrier plate (22) will not rotate as well as one would expect and the resulting grinding line pattern as illustrated in Figure 2b will be parallel (28).
- the Aluminum discs (24) are imparted with a grinding line pattern (31 ) to have a generally or substantial annular or curved parallel configuration.
- Figure 4 illustrates the grinding process of this preferred embodiment of the invention shown generally as (32).
- the main rotatable central shaft of conventional arrangements has become the sun gear (34) with its outwardly pointing teeth or gears (36).
- the carrier plate (46) with its annular teeth (48) is able to establish a meshed gearing relationship between the annulus ring (50) and the sun gear (34) whereby not only will there be general movement of the carrier plate (46) but there will also be internal self rotation to which the degree of that rotation will be dependent upon the gearing relationship between the sun gear, carrier plate and the annulus or outer ring.
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014550231A JP2015503457A (en) | 2011-12-27 | 2012-04-03 | Apparatus and method for providing improved polishing lines on aluminum substrate disks |
AU2012343353A AU2012343353B2 (en) | 2011-12-27 | 2012-04-03 | Apparatus and method for providing improved grinding lines on an aluminium substrate disc |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI2011006290 | 2011-12-27 | ||
MYPI2011006290A MY179417A (en) | 2011-12-27 | 2011-12-27 | Apparatus and method for providing improved grinding lines on an aluminium substrate disc |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013100749A1 true WO2013100749A1 (en) | 2013-07-04 |
Family
ID=48698068
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/MY2012/000074 WO2013100749A1 (en) | 2011-12-27 | 2012-04-03 | Apparatus and method for providing improved grinding lines on an aluminium substrate disc |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2015503457A (en) |
AU (1) | AU2012343353B2 (en) |
MY (1) | MY179417A (en) |
WO (1) | WO2013100749A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112828779A (en) * | 2021-01-21 | 2021-05-25 | 上海橄榄精密工具有限公司 | Preparation method of aluminum-based grinding wheel and grinding wheel |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102219874B1 (en) * | 2019-05-10 | 2021-02-24 | 한국산업기술대학교 산학협력단 | Method for producing phosphor plate |
CN111136573B (en) * | 2019-11-27 | 2021-12-03 | 常州市瑞得通讯科技有限公司 | High-stability and low-loss ceramic filter preparation assembly line |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4133145A (en) * | 1975-12-16 | 1979-01-09 | Ted Bildplatten Aktiengesellschaft Aeg-Telefunken-Teldec | Method for producing a grinding agent carrier |
US5697832A (en) * | 1995-10-18 | 1997-12-16 | Cerion Technologies, Inc. | Variable speed bi-directional planetary grinding or polishing apparatus |
US20090298396A1 (en) * | 2008-05-28 | 2009-12-03 | Sumco Corporation | Method of grinding semiconductor wafers, grinding surface plate, and grinding device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0713964Y2 (en) * | 1987-06-09 | 1995-04-05 | スピ−ドファム株式会社 | Carrier for flat polishing machine |
JPH07156061A (en) * | 1993-11-29 | 1995-06-20 | Nippon Light Metal Co Ltd | Both side polishing attachment of base plate |
US6709981B2 (en) * | 2000-08-16 | 2004-03-23 | Memc Electronic Materials, Inc. | Method and apparatus for processing a semiconductor wafer using novel final polishing method |
-
2011
- 2011-12-27 MY MYPI2011006290A patent/MY179417A/en unknown
-
2012
- 2012-04-03 JP JP2014550231A patent/JP2015503457A/en active Pending
- 2012-04-03 WO PCT/MY2012/000074 patent/WO2013100749A1/en active Application Filing
- 2012-04-03 AU AU2012343353A patent/AU2012343353B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4133145A (en) * | 1975-12-16 | 1979-01-09 | Ted Bildplatten Aktiengesellschaft Aeg-Telefunken-Teldec | Method for producing a grinding agent carrier |
US5697832A (en) * | 1995-10-18 | 1997-12-16 | Cerion Technologies, Inc. | Variable speed bi-directional planetary grinding or polishing apparatus |
US20090298396A1 (en) * | 2008-05-28 | 2009-12-03 | Sumco Corporation | Method of grinding semiconductor wafers, grinding surface plate, and grinding device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112828779A (en) * | 2021-01-21 | 2021-05-25 | 上海橄榄精密工具有限公司 | Preparation method of aluminum-based grinding wheel and grinding wheel |
Also Published As
Publication number | Publication date |
---|---|
AU2012343353A1 (en) | 2013-07-11 |
AU2012343353B2 (en) | 2015-07-09 |
MY179417A (en) | 2020-11-05 |
JP2015503457A (en) | 2015-02-02 |
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