KR102219874B1 - Method for producing phosphor plate - Google Patents

Abstract

Embodiments of the present invention are a method of manufacturing a phosphor plate, comprising: a glass powder manufacturing step of manufacturing glass powder, a phosphor plate forming step of mixing the prepared glass powder and a fluorescent material, heating, and sintering to form a phosphor plate, and the formed phosphor A first polishing step of mechanically polishing one or both sides of the plate using a first pad and a first slurry, and chemically polishing one or both surfaces of the polished phosphor plate using a second pad and a second slurry. It provides a method for manufacturing a phosphor plate comprising two polishing steps.
Accordingly, in the embodiments of the present invention, by manufacturing the phosphor plate through the first polishing step and the second polishing step, the surface of the phosphor plate is polished more evenly, thereby increasing and improving the illuminance and light transmittance.

Description

Phosphor plate manufacturing method {METHOD FOR PRODUCING PHOSPHOR PLATE}

The present invention relates to a method of manufacturing a phosphor plate, wherein by manufacturing a phosphor plate through a first polishing step and a second polishing step, the surface of the phosphor plate is polished more uniformly, thereby increasing the illuminance and light transmittance. It is about.

Existing white LED products are color conversion members, and YAG:Ce ³⁺ yellow phosphor is mixed with an organic binder such as epoxy and mounted on a blue LED chip. Light conversion efficiency decreases due to the phenomenon or discoloration of the organic binder, and color coordinate shifts occur, which leads to shortening of the efficiency and lifespan of LED products.

Silicon is used instead of organic binders to improve the efficiency and life of LED products, but there are problems such as moisture absorption and oxygen permeation, and to improve the phosphor deterioration characteristics, it is intended to replace the existing YAG phosphor with a nitride/oxynitride series with very high thermal stability. Although research and development is in progress, the manufacturing of phosphors is difficult and the unit cost is very high, so there is a limit to practical application.

To solve this problem, a structure that uses an inorganic material-based phosphor supporting material with high thermal durability to block direct contact with a light source at the same time without using an organic material-based solvent such as an organic binder or silicon material is emerging as a solution. , As a new packaging method satisfying this, a phosphor plate (PiG) is being studied.

On the other hand, phosphor plates strictly include phosphor ceramic plate (PCP), phosphor glass plate (PGP), glass phosphor plate (GPP), single-crystal phosphor plate (SCPP), phosphor-in-glass (PiG), etc. It is a concept that can be limited to what only means PiG.

Phosphor plate (phospho-glass plate, Phosphor in Glass, PiG) is a plate type color conversion member manufactured by mixing a low melting point glass frit (glass powder) and a phosphor. Phosphor) is a packaging method.

A conventional technique for a method of manufacturing a phosphor plate (PiG) is as follows.

Korean Patent No. 10-1858662 relates to a method of manufacturing a PiG (phosphor in glass) layer and a PiG layer to which sand blasting is applied. After mixing glass powder and a fluorescent substance in a predetermined ratio, pressure is applied to the PiG layer. A press step of forming a molded body; A heating step of increasing strength by applying heat to the PiG formed body formed through the pressing step; A primary polishing step of increasing light transmittance by polishing one side of the PiG molded body to increase surface roughness and shine; An etching step of forming a pattern on the surface of the PiG formed body by etching; An uneven forming step of forming unevenness on one side of the etched PiG formed body; A secondary polishing step of polishing the other side of the PiG molded body so that the PiG molded body satisfies the design dimensions and has a glossy surface to increase light transmittance; And a cutting step of cutting the PIG molded body into a predetermined size, and increasing the surface area due to the irregularities formed on the surface and improving the transmittance of light emitted from the LED chip to the outside, thereby increasing the light output.

Grana, a phosphor plate (PiG) manufactured by a conventional manufacturing method may have low light transmittance, a large color difference, low heat resistance, and impurities may penetrate during the glass powder manufacturing because glass powder particles are not formed evenly. In addition, since the surface of the phosphor plate PiG is not uniformly polished, the illuminance and light transmittance are low.

In order to solve the above-described problem, embodiments of the present invention include a glass powder manufacturing step of manufacturing a glass powder, a phosphor plate forming step of mixing, heating and sintering the prepared glass powder and a fluorescent material to form a phosphor plate, the A first polishing step of mechanically polishing one or both sides of the formed phosphor plate using a first pad and a first slurry, and chemically polishing one or both sides of the polished phosphor plate using a second pad and a second slurry An object thereof is to provide a method for manufacturing a phosphor plate comprising a second polishing step.

In addition, an object of the present invention is to provide a method for manufacturing a phosphor plate, wherein the second slurry includes alumina or colloidal silica.

In addition, embodiments of the present invention include a lower platen with a second pad on one side, an upper platen with a third pad on one side, and a toothed sun gear rotating at the center of the upper and lower platen in the second polishing step. , A drive unit for rotating the cogwheel-type sun gear, a cogwheel-type carrier disposed between the upper and lower platens and rotating by meshing with the teeth of the cogwheel-type sun gear, and a supply unit for supplying the second slurry, In the first polishing step, when the phosphor plate polished on one side or both sides is fixed to the inside of the cogwheel carrier and rotates with the cogwheel carrier, the phosphor is used by the second pad provided on the lower platen and the second slurry supplied from the supply unit. It is an object of the present invention to provide a method for manufacturing a phosphor plate, characterized in that a polishing apparatus in which one surface of the plate is polished is used.

In addition, an object of the present invention is to provide a method for manufacturing a phosphor plate, characterized in that one cogwheel carrier fixes one phosphor plate.

In addition, embodiments of the present invention provide a method for manufacturing a phosphor plate, characterized in that the phosphor plate is attached to the lower surface of the jig, and the toothed carrier is coupled to the jig from the inside to fix the phosphor plate attached to the jig. There is a purpose.

An embodiment of the present invention to achieve the above object is a glass powder manufacturing step of manufacturing a glass powder, a phosphor plate forming step of forming a phosphor plate by mixing, heating and sintering the prepared glass powder and a fluorescent material, the A first polishing step of mechanically polishing one or both sides of the formed phosphor plate using a first pad and a first slurry, and chemically polishing one or both sides of the polished phosphor plate using a second pad and a second slurry It provides a method of manufacturing a phosphor plate comprising a second polishing step.

In one embodiment, the second slurry may include alumina or colloidal silica.

In one embodiment, in the second polishing step, a lower platen provided with the second pad on one side, an upper platen provided with a third pad on one side, a toothed wheel sun gear rotating at the center of the upper and lower platen, Including a drive unit for rotating the cogwheel type sun gear, a cogwheel type carrier disposed between the upper and lower surface plates and rotating by meshing with the toothed teeth of the cogwheel type sun gear, and a supply unit for supplying the second slurry It is configured, and in the first polishing step, when the phosphor plate polished on one side or both sides is fixed to the inner side of the cogwheel carrier and rotates together with the cogwheel carrier, it is supplied from the second pad provided on the lower platen and the supply unit. A polishing apparatus in which one surface of the phosphor plate is polished by the second slurry may be used.

In one embodiment, one of the cogwheel carriers may fix one of the phosphor plates.

In one embodiment, the phosphor plate may be attached to a lower surface of a jig, and the cogwheel carrier may be coupled to the jig from the inside to fix the phosphor plate attached to the jig.

As described above, embodiments of the present invention include a glass powder manufacturing step of manufacturing a glass powder, a phosphor plate forming step of mixing the prepared glass powder and a fluorescent material, heating, and sintering to form a phosphor plate, and the formed phosphor plate. A first polishing step of mechanically polishing one side or both sides using a first pad and a first slurry, and a second polishing step of chemically polishing one or both sides of the polished phosphor plate using a second pad and a second slurry. By providing a method for manufacturing a phosphor plate comprising the steps, the surface of the phosphor plate is polished more evenly, so that illuminance and light transmittance can be increased.

In addition, according to the embodiments of the present invention, since the second slurry includes alumina or colloidal silica, the surface of the phosphor plate is polished more uniformly, thereby increasing the illuminance and light transmittance.

In addition, embodiments of the present invention include a lower platen with a second pad on one side, an upper platen with a third pad on one side, and a toothed sun gear rotating at the center of the upper and lower platen in the second polishing step. , A drive unit for rotating the cogwheel-type sun gear, a cogwheel-type carrier disposed between the upper and lower platens and rotating by meshing with the teeth of the cogwheel-type sun gear, and a supply unit for supplying the second slurry, In the first polishing step, when the phosphor plate polished on one side or both sides is fixed to the inside of the cogwheel carrier and rotates with the cogwheel carrier, the phosphor is used by the second pad provided on the lower platen and the second slurry supplied from the supply unit. By using a polishing apparatus in which one surface of the plate is polished, the surface of the phosphor plate is polished more evenly, so that the illuminance and light transmittance can be increased.

In addition, according to the embodiments of the present invention, the phosphor plate can be polished to a uniform thickness by fixing one phosphor plate by a single cogwheel carrier.

In addition, in the embodiments of the present invention, the phosphor plate is attached to the lower surface of the jig, and the cogwheel carrier is combined with the jig from the inside to fix the phosphor plate attached to the jig, so that the phosphor plate can be easily fixed and the phosphor plate is It can be prevented from being damaged by fixing.

It is not limited to the above-mentioned effects, and other effects not mentioned may be clearly understood by those of ordinary skill in the art from the following description.

1 is a flow chart showing a method of manufacturing a phosphor plate according to an embodiment of the present invention.
Figure 2 is a flow chart showing a glass powder manufacturing step according to an embodiment of the present invention.
3 is a state diagram showing a first polishing apparatus according to an embodiment of the present invention.
4 and 5 are cross-sectional views showing an embodiment of a second polishing apparatus according to the present invention.
6 is a perspective view showing an embodiment of a cogwheel carrier according to the present invention.
7 is a view showing the surface of the phosphor plate after the first polishing step according to an embodiment of the present invention. FIG. 8 is a view showing the surface of the phosphor plate after the first polishing step and the second polishing step according to an embodiment of the present invention. It is a figure shown.

Since the description of the present invention is only examples for structural or functional description, the scope of the present invention should not be construed as being limited by the embodiments described in the text. That is, since the present embodiments can be variously changed and have various forms, the scope of the present invention should be understood to include equivalents capable of realizing the technical idea.

In addition, since the object or effect presented in the present invention does not mean that a specific embodiment should include all of them or only those effects, the scope of the present invention should not be understood as being limited thereto.

In addition, the accompanying drawings are provided to aid in the understanding of the present invention, and provide embodiments together with a detailed description. However, the technical features of the present invention are not limited to a specific drawing, and features disclosed in each drawing may be combined with each other to constitute a new embodiment.

A method of manufacturing a phosphor plate disclosed in the following embodiments will be described in more detail with reference to each drawing.

1 is a flow chart showing a method of manufacturing a phosphor plate according to an embodiment of the present invention.

Referring to FIG. 1, a method of manufacturing a phosphor plate 100 according to an embodiment includes a glass powder manufacturing step (S110), a phosphor plate forming step (S120), a first polishing step (S130), and a second polishing step (S140). Consists of including.

Glass powder manufacturing step (S110) is a step of manufacturing glass powder. In this regard, it looks at Figure 2.

Figure 2 is a flow chart showing a glass powder manufacturing step according to an embodiment of the present invention.

Referring to Figure 2, the glass powder manufacturing step (S110) according to an embodiment includes a mixing step (S112), a melting step (S114), a quenching step (S116), a crushing step (S118), and a filtering step (S119). It consists of including.

,

,

,

등의 물질은 특정한 몰비로 혼합될 수 있다.The mixing step (S112) is a step of mixing the raw material of the glass powder. For example, in the mixing step (S112),

,

,

,

Materials such as can be mixed in a specific molar ratio.

The melting step (S114) is a step of melting the mixed raw material at, for example, 1200 to 1400°C.

The quenching step (S116) is a step of manufacturing a glass bead by quenching the melt. Here, the term “quenching” may mean quenching the melt, and the glass beads may mean glass grains.

The pulverizing step (S118) is a step of pulverizing a glass bead to generate a glass frit having an average particle diameter of, for example, 1 to 10 μm. Glass particles having a particle diameter of 100 μm or more can reduce the transmittance of the phosphor plate by increasing the proportion or size of the pores in the phosphor plate. Therefore, it is preferable to pulverize the glass frit to 100 μm or less.

Meanwhile, the pulverization method includes dry pulverization and wet pulverization, and the dry pulverization method uses a high-speed jet of compressed air, such as a jet mill, to collide particles with each other to make the particles smaller in a powder state. In addition, the wet pulverization method refers to making the powder particles smaller by impact by the drop of the pulverizing ball in a state in which powder and liquid are mixed, such as in a ball mill.

In the pulverizing step (S118), glass powder may be produced by pulverizing the glass beads by a wet pulverization method. Specifically, water or alcohol may be injected together with glass beads and grinding balls into a ball mill, and the glass beads may be pulverized.

In this way, by pulverizing the glass beads by the wet pulverization method, impurities such as iron (Fe) in the air are prevented from penetrating during pulverization, and the whiteness of the glass powder can be improved compared to the case of using the dry pulverization method. .

The filtering step (S119) is a step of filtering a glass frit having a particle diameter of, for example, 100 μm or more using a mesh.

In this way, by manufacturing the glass powder through the pulverization step (S118) and the filtering step (S119), the glass powder particles are formed evenly, thereby increasing light transmittance, reducing color difference, and improving heat resistance.

After the filtering step (S119), hot air drying and vacuum drying for drying the glass powder may be additionally performed.

Again, it looks with reference to FIG.

The phosphor plate forming step (S120) is a step of forming a phosphor plate by mixing, heating and sintering the prepared glass powder and a fluorescent material.

For example, in the phosphor plate forming step (S120), the glass powder and the phosphor are mixed at a specific weight ratio, put into a mold, pressed and compression molded, then put into a sintering furnace, and heated and sintered to form a phosphor plate.

Here, the weight ratio may correspond to, for example, 70 to 90% by weight of the glass powder and 10 to 30% by weight of the phosphor, and the compression molding may be performed for 1 minute to 20 minutes at, for example, 2 to 20 tons. .

In addition, heating and sintering in the sintering furnace differ depending on the composition of the glass powder or fluorescent material, but may be performed for 20 minutes to 60 minutes in a temperature range of, for example, 580 to 650°C.

The first polishing step (S130) is a step of polishing one or both surfaces of the phosphor plate formed in the phosphor plate forming step (S120) with a first pad and a first slurry. In the first polishing step (S130), one or both surfaces of the phosphor plate may be mechanically polished using a first pad and a first slurry. Referring to FIG. 3 with respect to the first polishing apparatus 200 used in the first polishing step (S130).

3 is a state diagram showing a first polishing apparatus according to an embodiment of the present invention.

3, the first polishing apparatus 200 according to an embodiment includes a first pad 210, a first driving unit 220, a header 230, a first supply unit 240, and a conditioner 250. It consists of including.

The first pad 210 may polish one surface of the phosphor plate A fixed to the header 230 while rotating by the first driving unit 220. In addition, a groove may be formed in the first pad 210.

The first driving unit 220 may be connected to the first pad 210 to rotate the first pad 210.

The header 230 may have a phosphor plate A attached to its lower surface, and may be placed on the first pad 210 so that its lower surface faces the first pad 210. Here, the phosphor plate (A) may be attached to the jig (B), and the jig (B) is directly attached to the header 230, so that the phosphor plate (A) may be indirectly attached to the header 230. Here, the jig B may be made of a ceramic material having high strength.

In this way, by indirectly attaching and detaching the phosphor plate A to the header 230 through the jig B, it is possible to prevent the phosphor plate A from being damaged during detachment. In addition, since the phosphor plate A is attached to and fixed to the header 230 through the jig B, the phosphor plate A can be easily attached and fixed, and damage caused by the fixing can be prevented.

Further, the header 230 can rotate and a force C can be applied from top to bottom. As the header 230 rotates and a force C is applied, one surface of the phosphor plate A attached to the lower surface may be polished.

In this case, it is preferable that the phosphor plate (A) attached to the lower surface of one header 230 is limited to one as shown in FIG. 3. Phosphor plate (A) has low strength and differs in physical properties depending on sintering conditions, so even if it is polished by applying the same pressure to two or more phosphor plates (A) (that is, two or more phosphor plates (A) are attached to one header 230). This is because the phosphor plate (A) can be polished to a different thickness even if it is attached to and polished.

The first supply unit 240 may supply a first slurry (D, slurry) onto the first pad 210. The first slurry D may function as an abrasive and a lubricant for polishing the phosphor plate A.

Here, the first slurry D may correspond to a diamond slurry. The diamond slurry may refer to a suspension in which industrial diamond particles are mixed with a liquid such as water or oil to mechanically polish the surface of a material such as silicon or sapphire or a phosphor plate.

The conditioner 250 may be placed on the first pad 210 and rotated. The conditioner 250 may prevent a groove of the first pad 210 from being blocked by impurities, and may diffuse the first slurry D onto the first pad 210.

However, the polishing apparatus used in the first polishing step S130 is not limited to the first polishing apparatus 200.

The second polishing step (S140) is a step of polishing one or both surfaces of the phosphor plate polished in the first polishing step (S130) again with a second pad and a second slurry. In the second polishing step (S140), one or both surfaces of the phosphor plate may be chemically polished using the second pad and the second slurry. 4 and 5 will be described in relation to the second polishing apparatus 300 used in the second polishing step S140.

4 and 5 are cross-sectional views showing an embodiment of a second polishing apparatus according to the present invention.

4 and 5, the second polishing apparatus 300 according to an embodiment includes an upper surface plate 310, a lower surface plate 320, a toothed wheel type sun gear 330, and a second driving unit ( 340), a toothed carrier 350, an external gear 360, and a second supply unit (not shown).

The upper platen 310 may have a third pad (not shown) on its lower surface, and the lower surface of the upper platen 310 may be placed on the lower platen 320 so as to face the upper surface of the lower platen 320.

The lower platen 320 may have a second pad 322 on the upper surface thereof, and the upper surface of the lower platen 320 may be placed under the upper platen 310 so as to face the lower surface of the upper platen 310. Here, a groove may be formed in the second pad 322.

The second pad 322 provided on the lower platen 320 is fixed to the inner side of the cogwheel type carrier 350 and can polish one side of the rotating phosphor plate A, and the second pad 322 provided on the upper platen 310 The 3-pad (not shown) may be polished by one surface of the jig B coupled to the inner side of the cogwheel-type carrier 350. In this regard, it will be described later in FIG. 6.

The cogwheel-type sun gear 330 may correspond to a cogwheel shape and may be disposed at the center of the upper plate 310 and the lower platen 320. The cogwheel-type sun gear 330 may be connected to the second driving part 340 and the cogwheel teeth of the cogwheel-type sun gear 330 may be engaged with the cogwheel teeth of one or more cogwheel-type carriers 350. .

The cogwheel-type sun gear 330 may rotate one or more cogwheel-type carriers 350.

The second driving unit 340 is connected to the cogwheel-type sun gear 330 to rotate the cogwheel-type sun gear 330. In addition, the second driving unit 340 is connected to the upper plate 310, the lower platen 320, or the external gear 360 to rotate the upper platen 310, the lower platen 320, or the external gear 360. have.

One or more cogwheel-type carriers 350 are disposed between the upper and lower bases 310 and 320, and the teeth of the cogwheel-type carrier 350 are cogwheel-type sun gears 330 or external gears. It can be engaged with the toothed teeth of 360. Referring to FIG. 6 in relation to the cogwheel type carrier 350.

6 is a perspective view showing an embodiment of a cogwheel carrier according to the present invention.

Referring to FIG. 6, the cogwheel-type carrier 350 according to an embodiment may correspond to a cogwheel shape and may be coupled to the jig B through a through hole formed inside. Since the phosphor plate (A) polished on one or both sides in the first polishing step (S130) may be attached to the lower surface of the jig (B), the cogwheel type carrier 350 is combined with the jig (B) from the inside to The phosphor plate attached to (B) can be fixed.

Here, the jig B may be made of a ceramic material having high strength.

In this way, by fixing the phosphor plate (A) to the toothed carrier 350 through the jig (B), the phosphor plate (A) can be easily fixed and the phosphor plate (A) is damaged by the fixing. Can be prevented.

The cogwheel-type carrier 350 rotates together with the phosphor plate A fixed therein to polish one surface of the phosphor plate A in contact with the second pad provided on the lower platen 320.

At this time, it is preferable that the phosphor plate (A) fixed to one cogwheel carrier 350 is limited to one as shown in FIG. 6. Phosphor plate (A) has low strength and differs in physical properties depending on sintering conditions, so even if it is polished by applying the same pressure to two or more phosphor plates (A) (i.e., two or more phosphor plates (A) may This is because even if it is fixed to 350 and polished), it can be polished to a different thickness for each phosphor plate A.

On the other hand, when the jig (B) coupled to the inner side of the cogwheel-type carrier 350 rotates together with the cogwheel-type carrier 350, it is assumed by the upper surface of the jig (B) (the surface opposite to the surface to which the phosphor plate is attached). The third pad provided in the half 310 may be worn.

Specifically, the upper surface of the jig B having strong strength may wear the third pad while rotating in contact with the third pad.

In this way, by causing the third pad provided on the upper table 310 to be worn by the upper surface of the jig (B) coupled to the inner side of the cogwheel type carrier 350, (i) the third pad is a jig (B) (Ii) By matching the shape of the third pad to the shape of the jig (B), the phosphor plate (A) attached to the lower surface of the jig (B) can be polished to a more flat and uniform thickness. .

The second supply unit (not shown) may supply a second slurry (not shown) to the second pad. The second slurry (not shown) may function as an abrasive and a lubricant for polishing the phosphor plate A on the second pad 322.

Here, the second slurry (not shown) may include alumina or colloidal silica to chemically polish the phosphor plate A. Here, alumina may refer to transition alumina such as χ, ρ, η, γ, δ, θ, β, α, or aluminum hydroxide such as Al(OH)3, AlOOH(Boehmite), and colloidal silica may be amorphous, It may mean a suspension containing non-porous silica particles.

The outer gear 360 may be formed in a circular shape surrounding one or more cogwheel-type carriers 350, and may be coupled with the cogwheel teeth of the cogwheel-type carrier 350 by providing cogwheel teeth in the inner circumference.

In addition, the external gear 360 may be connected to the second driving unit 340 and rotated by the second driving unit 340 to rotate the cogwheel-type carrier 350. At this time, it is preferable that the external gear 360 rotates in the opposite direction to the toothed sun gear 330.

However, the polishing apparatus used in the second polishing step S140 is not limited to the second polishing apparatus 300.

7 is a view showing the surface of the phosphor plate after the first polishing step according to an embodiment of the present invention. FIG. 8 is a view showing the surface of the phosphor plate after the first polishing step and the second polishing step according to an embodiment of the present invention. It is a figure shown.

7 and 8, a lot of scratches occurred on the surface of the phosphor plate after the first polishing step, but after the first polishing step and the second polishing step, the scratches on the surface of the phosphor plate were considerably reduced.

In this way, by manufacturing the phosphor plate through the first polishing step (S130) and the second polishing step (S140), the surface of the phosphor plate is polished more evenly, so that the illuminance and light transmittance may be increased.

As described above, although the description has been made with reference to the preferred embodiments of the present application, those skilled in the art will variously modify the present application within the scope not departing from the spirit and scope of the present invention described in the following claims. And it will be appreciated that it can be changed.

100: phosphor plate manufacturing method
S110: Glass powder manufacturing step
S112: mixing step S114: melting step
S116: grinding step S118: grinding step
S119: Filtration step
S120: Phosphor plate formation step
S130: first polishing step S140: second polishing step
200: first polishing device
210: first pad 220: first driving unit
230: header 240: first slurry
250: conditioner
300: second polishing device
310: upper part 320: lower part
322: second pad 330: toothed sun gear
340: second driving unit 350: cogwheel carrier
360: external gear

Claims (5)

Glass powder manufacturing step of manufacturing glass powder;
A phosphor plate forming step of mixing the prepared glass powder and a fluorescent material, heating, and sintering to form a phosphor plate;
A first polishing step of mechanically polishing one or both surfaces of the formed phosphor plate using a first pad and a first slurry;
A second polishing step of chemically polishing one or both surfaces of the polished phosphor plate using a second pad and a second slurry,
In the second polishing step,
A lower platen provided with the second pad on one side, an upper platen provided with a third pad on one side, a toothed sun gear rotating at a central portion of the upper and lower platen, a drive unit for rotating the toothed sun gear, A cogwheel-shaped carrier disposed between the upper and lower surface and rotating by meshing with the teeth of the cogwheel-type sun gear; When a polishing apparatus including a supply unit for supplying the second slurry is used, and the phosphor plate polished on one or both sides in the first polishing step is fixed to the inside of the cogwheel-type carrier and rotates together with the cogwheel-type carrier One surface of the phosphor plate is polished by the second pad provided on the lower platen and the second slurry supplied from the supply unit, and the third pad is worn by the jig coupled to the inner side of the cogwheel-type carrier. Phosphor plate manufacturing method, characterized in that it is adapted to the shape of the jig.
The method of claim 1,
The method for manufacturing a phosphor plate, wherein the second slurry contains alumina or colloidal silica.
delete The method of claim 1,
The method of manufacturing a phosphor plate, characterized in that one of the cogwheel carriers fixes one of the phosphor plates. delete

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