WO2013096807A1 - Détecteur d'inclinaison/vibration - Google Patents

Détecteur d'inclinaison/vibration Download PDF

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Publication number
WO2013096807A1
WO2013096807A1 PCT/US2012/071318 US2012071318W WO2013096807A1 WO 2013096807 A1 WO2013096807 A1 WO 2013096807A1 US 2012071318 W US2012071318 W US 2012071318W WO 2013096807 A1 WO2013096807 A1 WO 2013096807A1
Authority
WO
WIPO (PCT)
Prior art keywords
ring
end plate
chamber
ball
shot
Prior art date
Application number
PCT/US2012/071318
Other languages
English (en)
Inventor
Mark DEL GIUDICE
Keith VANDERBOSCH
Original Assignee
American Electronic Components, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Electronic Components, Inc. filed Critical American Electronic Components, Inc.
Publication of WO2013096807A1 publication Critical patent/WO2013096807A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C9/00—Measuring inclination, e.g. by clinometers, by levels
    • G01C9/10—Measuring inclination, e.g. by clinometers, by levels by using rolling bodies, e.g. spheres, cylinders, mercury droplets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P13/00—Indicating or recording presence, absence, or direction, of movement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/135—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by making use of contacts which are actuated by a movable inertial mass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H35/00—Switches operated by change of a physical condition
    • H01H35/02—Switches operated by change of position, inclination or orientation of the switch itself in relation to gravitational field
    • H01H35/025—Switches operated by change of position, inclination or orientation of the switch itself in relation to gravitational field the switch being discriminative in different directions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C9/00—Measuring inclination, e.g. by clinometers, by levels
    • G01C9/10—Measuring inclination, e.g. by clinometers, by levels by using rolling bodies, e.g. spheres, cylinders, mercury droplets
    • G01C2009/107—Measuring inclination, e.g. by clinometers, by levels by using rolling bodies, e.g. spheres, cylinders, mercury droplets spheres
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H1/00—Measuring characteristics of vibrations in solids by using direct conduction to the detector

Definitions

  • a key fob may include a motion sensor.
  • a key fob has no predefined rest position, but could be placed flat on a table, hung from a hook, or stashed in a bag, thereby having no consistent rest position.
  • prior art motion sensors are inadequate as used on objects not having a rest position since such sensors function only when oriented in such rest position.
  • the tilt/vibration sensor of the present disclosure includes an outer wall defining an inner chamber.
  • a first and second end plate are mounted on opposing ends of the inner chamber.
  • a ring circumscribes the chamber and is located between the end plates.
  • a ball is freely moveable and located within the inner chamber.
  • the ball, end plates and ring are formed from, or plated with, a conductive material.
  • the sensor of the present invention is manufactured by a multiple-step molding process which partially embeds the end plates and ring in the outer wall.
  • FIG. 1 is a perspective view of a sensor
  • FIG. 2 is a cross-sectional view of the sensor of FIG. 1 as cut along the line A-A shown in FIG. 3;
  • FIG. 3 is an end view of the sensor of FIG. 1 having two end plates and a single ring and housing a ball;
  • FIG. 4 is a side view of the sensor of FIG. 1;
  • FIG. 5 is another end view of the sensor of FIG. 1;
  • FIG. 6 is a bottom view of the sensor of FIG. 1;
  • FIG. 7 is a perspective view of a first shot formed as a preliminary stage in forming the sensor of FIG. 1;
  • FIG. 8 is a top view the first shot of FIG. 7;
  • FIG. 9 is a side view of the first shot of FIG. 7;
  • FIG. 10 is a cross-sectional view of the first shot of FIG. 9 as cut along line B-B;
  • FIG. 11 is a side view of an end plate
  • FIG. 12 is a side view of a ring with wings removed
  • FIG. 13 is an end view of a sensor having two end plates and two rings and housing a ball
  • FIG. 14 is a side view of the sensor of FIG. 13 ;
  • FIG. 15 is an another end view of the sensor of FIG. 13;
  • FIG. 16 is a bottom view of the sensor of FIG. 13;
  • FIG. 17 is a cross-sectional view of the sensor of FIG. 13 as cut along line C-C;
  • FIG. 18 is an end view the first shot formed as a preliminary stage in forming the sensor of FIG. 14;
  • FIG. 19 is a perspective view of a section of the first shot of FIG. 18;
  • FIG. 20 is a cross-sectional view of a section of the first shot of FIG. 18 as cut along line D-D;
  • FIG. 21 is a bottom view of a section of the first shot of FIG. 18;
  • sensor 10 which monitors the movement of a monitored object (not shown).
  • Sensor 10 is mounted to, carried on, or carried within the monitored object, such that when the monitored object tilts, vibrates, or otherwise moves, sensor 10 moves with the object.
  • sensor 10 includes an outer wall 14 which encloses an inner chamber 16.
  • Chamber 16 includes a first and second end plate 18, 20 spaced at opposing ends of the chamber with a ring 22 spaced between the plates.
  • a moveable object, such as a spherical ball 24, is housed within chamber 16.
  • Sensor 10 is affixed or formed integrally with the monitored object, such that when the monitored object moves or vibrates, sensor 10 also moves or vibrates.
  • Sensor 10 includes an outer wall 14. Together, outer wall 14 and end plates 18, 20 fully enclose chamber 16, as shown in FIG. 2.
  • outer wall 14 is formed in a two-stage process where a premold (shown in FIGS. 7-10), or first shot 64, is formed in a first stage, and an overmold, or second shot 82, is formed around the first shot in a second stage.
  • a premold shown in FIGS. 7-10
  • second shot 82 is formed around the first shot in a second stage.
  • ring 22 and end plates 18, 20 are formed integrally with either the first shot 64 or the second shot 82.
  • first shot 64 and second shot 82 form outer wall 14 which defines chamber 16.
  • Outer wall 14 is preferably formed from a polymer, such as by injection molding.
  • chamber 16 is the hollow interior defined by outer wall 14.
  • Chamber 16 houses ball 24.
  • Ball 24 moves within chamber 16.
  • Chamber 16 extends between a first end 92 and a second end 94.
  • Chamber has a height H as measured along a plane parallel to end plate 18, 20.
  • the inner surface 15 of outer wall 14 is generally cylindrically shaped such that chamber 16 is defined as a cylinder with end plates 18, 20 capping the ends of the cylinder.
  • height H is the inner diameter of the cylinder.
  • the inner diameter H of the chamber 16 is not constant; inner surface 15 includes a slight draft to accommodate the molding process - in such case, the inner diameter H is measured from the point where the diameter is a minimum.
  • End plates 18, 20 abut opposing ends 92, 94 of chamber 16. End plates 18, 20 are configured in a generally parallel relationship with a space formed therebetween defining chamber 16. End plates 18, 20 each include a surface 28, 30 facing the interior of chamber 16. End plates 18, 20 each include a contact 32, 34 extending from plate 18, 20. Contacts 32, 34 serve to connect the end plates 18, 20 to a circuitry system (not shown), as described in greater detail below. As shown in FIG. 1, a portion of end plates 18, 20 may be exposed, in other words the second shot 82 does not completely encase the end plates 18, 20. Opposing ends 92, 94 are formed as part of the second shot 82.
  • end plates 18, 20 are formed as generally flat plates, with surface 28, 30 and contacts 32, 34 formed in a single plane, see FIG. 11.
  • end plates 18, 20 are contoured such that one side of the plate is concave and the opposing side of the plate is convex.
  • end plates 18, 20 include a concave surface (not shown) facing chamber 16.
  • end plates 18, 20 include a convex surface (not shown) facing chamber 16. The shape of end plates 18, 20 effects the interaction between ball 24 and the end plate.
  • a concave surface encourages ball 24 to rest in contact with one of end plates 18, 20 and out of contact with ring 22 - thereby forming an open circuit in such position.
  • a sensor 10 oriented such that plates 18, 20 are oriented perpendicularly to the direction of gravity having convex surfaces urges ball 24 into contact with one of end plates 18, 20 and ring 22 - thereby forming a closed circuit in such position.
  • choice of convex or concave surfaces of end plates 18, 20 dictates whether an open or closed circuit is formed when sensor 10 is oriented with plates 18, 20 oriented perpendicularly to the direction of gravity.
  • contact 32, 34 extends from one edge of end plate 18, 20, see FIG. 11.
  • Contact 32, 34 extends from end plate 18, 20 through outer wall 14 and out of sensor 10 where they are integrated with the circuitry system, as described in further detail below.
  • Ring 22 is spaced between the end plates 18, 20 in chamber 16.
  • Ring 22 is a generally flat plate which includes a generally circular aperture 44 having an inner diameter I formed through the middle of the ring, see FIG. 12.
  • Ring 22 includes a first face 88 and a second face 90 which are generally planar, parallel faces of the ring.
  • Ring 22 has a thickness T defined as the distance between first face 88 and second face 90, as shown in FIG. 2.
  • Ring 22 includes one or more contact 46 extending from the ring through outer wall 14. In the preferred embodiment, contact 46 extends radially outward from ring 22, though the contact may extend in other directions within the spirit of this disclosure.
  • ring 22 extends inwardly from inner surface 15 of outer wall 14, such that ring 22 forms an interruption in the outer wall between end plates 18, 20; inner diameter I of ring is preferably less than height H of chamber 16.
  • Ball 24 is held inward from outer wall 14.
  • Ball 24 is preferably sized to be larger than a gap G formed between end plate 18, 20 and ring 22.
  • Ball 24 preferably has a radius R which is greater than gap G, such that when the ball is in contact with one of end plates 18, 20, the ball does not contact outer wall 14 of chamber 16.
  • the gap G between end plate 18 and ring 22 is substantially the same distance as the gap G between end plate 20 and ring 22, as measured from the end plate surface to the nearest portion of ring 22 to the respective endplate.
  • Ring 22 circumscribes outer wall 14 between end plates 18 and 20.
  • Outer wall 14 is preferably formed from a non-conductive material, such as plastic. As such, by having ring 22 extend inwardly from outer wall 14, ball 24 is held away from the outer wall, and out of contact with the outer wall.
  • two or more rings 22 are spaced between end plates 18, 20. Using multiple rings 22 allows for increased sensitivity of detection of the movement and relative position of ball 24 within chamber 16.
  • a first ring 22 includes one or more contact 46 connecting each ring to the circuitry system.
  • a second ring 23 includes one or more contact 47.
  • the circuitry system is integrated with contacts 46, 47 in such a way that it can distinguish between ball 24 contacting the first ring 22 or the second ring 23, thereby providing improved positional information about ball 24 within chamber 16.
  • first shots 96, 98 are formed, with first ring 22 embedded in first shot 96 and second ring 23 embedded in first shot 98. It is noted that the geometry of first shot 96 is identical to the geometry of second shot 98. End plate 18 is nested against first shot 96, end plate 20 is nested against first shot 98, and first shot 96 and first shot 98 are placed side by side in a mold, which mold is used to form second shot 100 which holds the first shots 96, 98 and the end plates 18, 20 together as sensor 10.
  • Contacts 32, 34, 46 are elements of a circuitry system such that as ball 24 moves within chamber 16, circuits close and open as the ball contacts and moves out of contact with plates 18, 20 and ring 22.
  • the circuitry system monitors the signals received from plates 18, 20 and ring 22 and processes the signals into useable data to identify when the monitored object has tilted, vibrated or otherwise moved.
  • the circuitry system is an element of the electrical system of the monitored object.
  • Ball 24, end plates 18, 20, ring 22 and attached contacts 32, 34, 46 are preferably formed from a conductive material, such as metal.
  • ball 24, end plates 18, 20, ring 22 and attached contacts 32, 34, 46 are plated with a conductive material, such as metal, preferably gold. The materials and construction of ball 24, end plates 18, 20, ring 22 and attached contacts 32, 34, 46 may vary within the scope of this description.
  • Ball 24 is a spherical movable object having a radius R and located within chamber 16. Ball 24 is freely movable within chamber 16, such that as the monitored object moves or vibrates, ball 24 will also move or vibrate in reaction to the movement of the monitored object.
  • a conductive member is defined as one of end plates 18, 20 or ring 22. When ball 24 contacts two conductive members 50, a closed circuit is formed by the ball forming a conductive bridge connecting the two conductive members. A finite number of circuit combinations are possible, with a circuit combination defined as ball 24 contacting two conductive members 50.
  • chamber 16 includes first end plate 18, a single ring 22, and second end plate 20
  • first end plate 18 - ball 24 - ring 22 and (2) ring 22 - ball 24 - second end plate 20.
  • first end plate 18 - ball 24 - ring 22 and (2) ring 22 - ball 24 - second end plate 20.
  • ball 24 may alternatively be in an open circuit position defined by the ball contacting zero or one conductive member at any given time.
  • the circuitry system registers when ball 24 moves between: (1) one circuit combination and another circuit combination; (2) between a circuit combination and an open circuit position; or (3) between an open circuit position and a circuit combination; each of these movements registers as a ball movement by the circuitry system and indicates movement of the monitored object.
  • sensor 10 is oriented relative to the monitored object with ring 22 and end plates 18, 20 in a substantially vertical orientation. With ring 22 and end plates 18, 20 in a vertical orientation, ball 24 will rest on ring 22 and will roll between end plates 18, 20 depending on the movement of the monitored object to which the sensor 10 is attached. The monitored object may be subjected to movement (linear and rotational) in three dimensions, and sensor 10 will provide a signal to the circuitry system to indicate such movement.
  • Ball 24 preferably is sized to be large enough that the ball cannot settle in gap G, such that for any position of ball 24 within chamber 16 a portion of ball 24 is always intersected by a plane passing through one of faces 88, 90 of ring 22.
  • ball 24 is sized to nearly fill chamber 16, such that for any position of ball 24 within chamber 16, a plane which is parallel to face 88, 90 and is intersecting a great circle of ball 24 is positioned between faces 88, 90.
  • Sensor 10 is preferably formed in a two-stage molding process.
  • ring 22 is placed in a first mold (not shown) and a material, such as plastic, is injected around the ring to form a first shot 64 as described in detail below.
  • ring 22 includes a contact 46 extending radially from the ring, and a pair of support members 66 extending radially from opposing edges of the ring and generally perpendicular to contact 46, though the orientation may vary.
  • Support members 66 are for supporting and positioning ring 22 within the first mold and alternatively include wing members (not shown) for additional support and positioning assistance within the first mold.
  • the wing members are extensions of support members 66, and preferably extend perpendicularly from the support members, though the orientation may vary within the scope of this disclosure.
  • First shot 64 is shaped to allow a second shot 82 to be formed around the first shot.
  • First shot 64 is formed having a surrounding wall 80 which is a generally ring-shaped wall extending axially away from ring 22 and terminates in an outer face 76, 77.
  • Outer face 76 is generally planar and parallel with ring 22 and annularly-shaped.
  • first shot 64 includes a guide 72 extending axially away from outer surface 76 of ring 22.
  • First shot 64 preferably includes a plurality of guides 72 extending axially from outer face 76 and spaced radially around a recess 74, 75.
  • First shot 64 includes two outer faces 76, 77 which are parallel to one another and are spaced in opposite directions from ring 22.
  • Each of outer faces 76, 77 includes a recess 74, 75.
  • Recess 74, 75 is an annularly-shaped plane generally parallel with outer face 76, 77 and stepped inwardly therefrom in the direction of ring 22.
  • Recess 74, 75 is shaped to allow one of end plates 18, 20 and the respective contact 32, 34 to be seated inward from outer edge 76 of first shot 64 and to orient the end plate substantially parallel to, and at a spaced distance from, ring 22.
  • Guide 72 is preferably tapered such that it slopes toward recess 74 and is formed to abut the inner diameter of outer face 76 such that as end plate 18, 20 is advanced toward recess 74, guide 72 directs the end plate into the recess.
  • First shot 64 preferably includes one or more flared sections 78 extending outward from the surrounding wall 80.
  • Second shot 82 is formed around first shot 64 and end plates 18, 20. Prior to forming second shot 82 ball 24 is placed in chamber 16, first end plate 18 is nested in first recess 74, and second end plate 20 is nested in second recess 75. First shot 64 with end plates 18, 20 are placed in a second mold (not shown) where second shot 82 is molded around first shot 64 and end plates 18, 20. The outer shape of second shot 64 may vary within the scope of this disclosure. Second shot 82 is overmolded over first shot 64, but may be a partial overmold as portions of first shot or end plates 18, 20 may be visible in the final product. Techniques for injection molding, and overmolding specifically, are well known in the art, and the present disclosure may be adapted within the spirit of this disclosure to conform to varying injection molding techniques.
  • Sensor 10 as formed from first shot 64, second shot 82, ring 22 and end plates 18, 20, may have an outer shape which meets the needs of the end user.
  • sensor 10 is shown as being generally box-shaped with the contacts 46, 32, 34 from ring 22 and end plates 18, 20 extending from one face of the box in a linear pattern - such design may be convenient where the sensor is mounted directly to a circuit board with contacts 46, 32, 34 integrated with the board.
  • the outer form of sensor 10 and the direction of protrusion of contacts 46, 32, 34 may vary according to the geometry dictated by the monitored object in which the sensor is housed.
  • first shot 64 is formed around both ring 22 and end plate 18.
  • first shot 64 includes a single recess 74 in which end plate 20 is seated prior to formation of second shot 82.
  • end plate 18 includes a pair of contacts 32 extending radially from the plate and from opposing edges of the plate - a pair of contacts are included to support end plate 18 during the formation of first shot 64.
  • each of end plates 18, 20 and ring 22 are formed as a chain of plates or rings such that a series of sensors may be formed on the chain and then separated in a post-processing step.
  • second shot 82 is formed by heat staking peripheral portions of first shot 64 such that one or both of end plates 18, 20 is secured to first shot 64 by heating the peripheral portion until it deforms around end plate 18, 20 thereby holding the end plate(s) in place by interference fit.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)

Abstract

L'invention porte sur un détecteur d'inclinaison et de vibration. Selon l'invention, un dispositif de détection de mouvement comprend une paroi extérieure qui définit une chambre, la chambre s'étendant entre une première extrémité et une seconde extrémité, une première plaque d'extrémité qui bute contre la première extrémité de la chambre, un premier contact s'étendant à partir de ladite première plaque d'extrémité, une seconde plaque d'extrémité parallèle à ladite première plaque d'extrémité et qui bute contre ladite seconde extrémité de ladite chambre, un second contact s'étendant à partir de ladite seconde plaque d'extrémité, une bague espacée entre ladite première plaque d'extrémité et ladite seconde plaque d'extrémité et sensiblement parallèle à ces plaques, ladite bague étant partiellement noyée dans ladite paroi extérieure de telle sorte que ladite bague forme une interruption dans ladite paroi extérieure, un contact de bague qui s'étend à partir de ladite bague, une bille mobile à l'intérieur de ladite chambre, ladite bille, la première plaque d'extrémité, la seconde plaque d'extrémité et la bague ayant chacune des surfaces conductrices qui sont connectées à un système de circuit.
PCT/US2012/071318 2011-12-23 2012-12-21 Détecteur d'inclinaison/vibration WO2013096807A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161579861P 2011-12-23 2011-12-23
US61/579,861 2011-12-23

Publications (1)

Publication Number Publication Date
WO2013096807A1 true WO2013096807A1 (fr) 2013-06-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017122198A1 (fr) * 2016-01-11 2017-07-20 Gemsense Ltd. Systèmes et procédés pour connecter des objets physiques à des applications logicielles

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000173420A (ja) * 1998-12-09 2000-06-23 Koshin:Kk 傾斜及び振動センサスイッチ
JP2000331579A (ja) * 1999-05-21 2000-11-30 Koshin:Kk 傾斜及び振動センサとその基板実装
JP2003227747A (ja) * 2002-02-05 2003-08-15 Nittei Musen Kk 常閉式小型振動センサ
EP1939911A1 (fr) * 2005-08-17 2008-07-02 G-Device Corporation Capteur de vibration incliné compact et son procédé de fabrication
US20100000104A1 (en) * 2006-04-07 2010-01-07 Osram Opto Semiconductors Gmbh Tilt sensor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000173420A (ja) * 1998-12-09 2000-06-23 Koshin:Kk 傾斜及び振動センサスイッチ
JP2000331579A (ja) * 1999-05-21 2000-11-30 Koshin:Kk 傾斜及び振動センサとその基板実装
JP2003227747A (ja) * 2002-02-05 2003-08-15 Nittei Musen Kk 常閉式小型振動センサ
EP1939911A1 (fr) * 2005-08-17 2008-07-02 G-Device Corporation Capteur de vibration incliné compact et son procédé de fabrication
US20100000104A1 (en) * 2006-04-07 2010-01-07 Osram Opto Semiconductors Gmbh Tilt sensor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017122198A1 (fr) * 2016-01-11 2017-07-20 Gemsense Ltd. Systèmes et procédés pour connecter des objets physiques à des applications logicielles

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