WO2013094528A1

WO2013094528A1 - Liquid management system and recovery and recycling device for cleaning liquid

Info

Publication number: WO2013094528A1
Application number: PCT/JP2012/082477
Authority: WO
Inventors: 雅美村山; 一重高橋; 菅原　広
Original assignee: オルガノ株式会社
Priority date: 2011-12-20
Filing date: 2012-12-14
Publication date: 2013-06-27
Also published as: JPWO2013094528A1; JP5819987B2; TW201341070A

Abstract

A liquid management system (1E) comprising a cleaning liquid supply device, a refining device (17), and a cleaning liquid recovery means. The cleaning liquid supply device: has a mixing tank (4) wherein alcohol and pure water are mixed and a cleaning liquid is made; adjusts the alcohol concentration in the cleaning liquid to within a prescribed concentration range, inside the mixing tank (4); and supplies the cleaning liquid having the concentration thereof adjusted, to a cleaning device (100). The refining device (17) removes impurities from the cleaning liquid discharged from the cleaning device (100), between the mixing tank (4) and the cleaning device (100). The cleaning liquid recovery means is a means that collects the cleaning liquid discharged from the cleaning device (100), concentrates same using a concentrator (16), and returns same to the mixing tank (4); and includes pipes (14a, 14b, 14c, 14g). By using this system, the alcohol concentration of the cleaning liquid including alcohol and pure water can be maintained within a fixed range, and the amount of alcohol added to adjust concentration can be reduced.

Description

Liquid management system and cleaning liquid recovery / regeneration device

The present invention relates to a system for managing a liquid used for cleaning and drying, such as a semiconductor wafer, an LCD (Liquid Crystal Display) substrate, and a MEMS (Micro Electro Mechanical Systems), and a cleaning liquid recovery and regeneration apparatus.

For cleaning and drying of semiconductor wafers and the like, an alcohol aqueous solution that is a mixture of alcohol and water may be used. Japanese Laid-Open Patent Publication No. 2003-29795 (hereinafter referred to as Patent Document 1) discloses a semiconductor using a liquid obtained by mixing isopropyl alcohol (hereinafter abbreviated as IPA) and ultrapure water as a cleaning liquid. A wafer cleaning and drying apparatus is described. Specifically, an apparatus described in Patent Document 1 includes a processing tank in which wafers are cleaned and dried, a cleaning liquid mixing unit that adjusts a cleaning liquid supplied to the processing tank to a predetermined concentration in advance, and a cleaning liquid mixing And a cleaning liquid supply unit that moves the cleaning liquid from the unit to the cleaning tank.

The cleaning liquid mixing unit has an IPA tank and a mixing tank connected to the IPA tank. The mixing tank is also connected to a source of ultrapure water provided outside the mixing tank. Furthermore, an IPA replenishment pump is provided in the middle of the pipe connecting the IPA tank and the mixing tank. On the other hand, the cleaning liquid supply unit is provided with an IPA concentration meter that measures the IPA concentration in the cleaning liquid supplied to the treatment tank.

In the apparatus described in Patent Document 1 having the above configuration, a predetermined amount of IPA and ultrapure water are independently supplied to the mixing tank, and a cleaning liquid having a predetermined concentration is produced. Then, the cleaning liquid in the mixing tank is supplied to the treatment tank via the cleaning liquid supply unit.

Here, when a decrease in the IPA concentration in the cleaning liquid is detected by the IPA densitometer, the IPA replenishment pump is activated to replenish IPA from the IPA tank to the mixing tank. That is, the IPA concentration is adjusted by replenishing IPA.

Incidentally, in cleaning semiconductor wafers and the like, it is ideal that a cleaning solution having a constant IPA concentration is always circulated in a predetermined amount. In other words, it is ideal that the amount (liquid level) of the cleaning liquid in the mixing tank is maintained within a certain range. However, in practice, the liquid level in the mixing tank changes. For example, not only IPA but also water evaporates from the cleaning liquid circulating in the system. Also, part of the cleaning liquid may adhere to the wafer to be cleaned and be taken out of the system. In such a case, the liquid level of the cleaning liquid in the mixing tank decreases. On the other hand, moisture may adhere to the wafer to be cleaned and be brought into the system. In this case, the liquid level of the cleaning liquid in the mixing tank rises. In this regard, in the semiconductor wafer cleaning / drying apparatus described in Patent Document 1, the liquid level of the cleaning liquid in the mixing tank is not managed. Therefore, in the semiconductor wafer cleaning / drying apparatus described in Patent Document 1, the amount (liquid level) of the cleaning liquid in the mixing tank is not considered when adjusting the concentration of the cleaning liquid. However, if the cleaning liquid concentration is adjusted when the level of the cleaning liquid in the mixing tank is rising, that is, when the amount of the cleaning liquid in the system is increasing, the amount of IPA required for concentration adjustment increases. End up. A plurality of level sensors are provided in a mixing tank in the semiconductor wafer cleaning / drying apparatus described in Patent Document 1. However, the level sensor measures the amount of ultrapure water supplied to the mixing tank, and does not manage the amount (liquid level) of the cleaning liquid in which ultrapure water and IPA are mixed. Absent.

Further, in the semiconductor wafer cleaning / drying apparatus described in Patent Document 1, the concentration of the cleaning liquid is adjusted by replenishment with IPA. However, if the IPA concentration exceeds a predetermined value, it cannot be recovered. Therefore, when adjusting the concentration of the cleaning liquid, it is necessary to gradually approach the predetermined concentration while repeating the replenishment of IPA and the concentration measurement so that the IPA concentration does not exceed the predetermined value. The amount of IPA replenishment must be small. In general, it takes time and labor to adjust the concentration of the cleaning solution. In particular, in the cleaning of semiconductor wafers, it is necessary to manage the concentration of the cleaning liquid with high accuracy. Therefore, it takes a lot of time and labor to adjust the concentration of the cleaning liquid.

Furthermore, Patent Document 1 describes that a plurality of mixing tanks that can be used alternately are provided. However, if the mixing tank is switched without stopping the circulation of the cleaning liquid, a stable supply of the cleaning liquid becomes difficult because the amount of the circulating liquid changes before and after the switching. In addition, since the cleaning liquid is switched before and after the switching of the mixing tank, the state of the cleaning liquid (concentration, temperature, contamination state, etc.) may change, and the process (cleaning, drying) may be affected.

Japanese Patent Laying-Open No. 2003-299795 ([0023] to [0027], [0037] to [0038], FIG. 1)

The present invention has been made in view of the above-described problems. One of the purposes is to maintain the alcohol concentration in the cleaning liquid containing alcohol and pure water within a certain range, and to reduce the amount of alcohol used for concentration adjustment. A further object is to stably supply a high-purity cleaning liquid to the cleaning apparatus.

As one aspect of the present invention, there is provided a liquid management system for managing a cleaning liquid used in a cleaning apparatus for cleaning an object.

This liquid management system includes a cleaning liquid supply device, a purification device, and a cleaning liquid recovery means. The cleaning liquid supply apparatus of this aspect has a mixing unit that mixes alcohol and pure water to produce a cleaning liquid, and adjusts the alcohol concentration in the cleaning liquid within a predetermined concentration range in the mixing unit, and the concentration adjustment The cleaned cleaning liquid is supplied to the cleaning device. The purification device is a device that removes impurities from the cleaning liquid whose concentration has been adjusted by the mixing means or the cleaning liquid discharged from the cleaning apparatus. Further, the cleaning liquid recovery means has a concentrator for concentrating the cleaning liquid whose concentration is adjusted by the mixing means or the cleaning liquid discharged from the cleaning apparatus on the downstream side or the upstream side of the purification apparatus, and the concentrated and purified It is means for returning the cleaning liquid to the mixing means.

As another aspect, the cleaning liquid discharged from the cleaning device for cleaning the object using the aqueous alcohol solution adjusted within the predetermined concentration range as the cleaning liquid is recovered, adjusted again within the predetermined concentration range, and A cleaning / recovery device for cleaning liquid supplied to the cleaning device is provided.

This recovery / regeneration apparatus also includes a cleaning liquid supply apparatus, a purification apparatus, and a cleaning liquid recovery means. The cleaning liquid supply apparatus according to this aspect has a mixing means for producing a cleaning liquid in which alcohol and pure water are supplied to adjust the alcohol concentration within the predetermined concentration range, and supplies the cleaning liquid whose concentration is adjusted to the cleaning apparatus. To do.
The purification device is a device that removes impurities from the cleaning liquid whose concentration has been adjusted by the mixing means or the cleaning liquid discharged from the cleaning apparatus. Further, the cleaning liquid recovery means has a concentrator for concentrating the cleaning liquid whose concentration is adjusted by the mixing means or the cleaning liquid discharged from the cleaning apparatus on the downstream side or the upstream side of the purification apparatus, and the concentrated and purified It is means for returning the cleaning liquid to the mixing means.

According to the present invention, the alcohol concentration in the cleaning liquid containing alcohol and pure water can be maintained within a certain range. In addition, the amount of alcohol used for concentration adjustment can be reduced by purifying and concentrating the cleaning liquid whose concentration has been adjusted by the mixing means or the cleaning liquid discharged from the cleaning apparatus and returning it to the mixing means. . And since the density | concentration of the washing | cleaning liquid which returns to a mixing means can be made into a fixed range, the density | concentration adjustment of a washing | cleaning liquid can be performed with higher precision. Furthermore, a highly pure cleaning liquid can be provided stably.

The block diagram which shows 1st embodiment of this invention. The block diagram which shows 2nd embodiment of this invention. The block diagram which shows 3rd embodiment of this invention. The block diagram which shows 4th embodiment of this invention. The block diagram which shows 5th embodiment of this invention.

(First embodiment)
Hereinafter, the first embodiment of the present invention will be described in detail. FIG. 1 is a block diagram showing a basic configuration of a liquid management system according to the present embodiment.

As shown in FIG. 1, a liquid management system 1A according to this embodiment is connected to a semiconductor wafer cleaning apparatus 100 and supplies a cleaning / drying liquid to the cleaning apparatus 100. Although a detailed description of the cleaning device 100 is omitted here, the cleaning device 100 includes at least a cleaning tank that cleans the semiconductor wafer using the cleaning / drying liquid supplied from the liquid management system 1A.

As shown in FIG. 1, the liquid management system 1A is generically referred to as a cleaning / drying liquid (hereinafter referred to as “cleaning liquid”) in which alcohol (IPA in this embodiment) and pure water (ultra pure water in this embodiment) are mixed. ) Prepared, alcohol supply means for supplying IPA to the mixing tank 4, pure water supply means for supplying ultrapure water to the mixing tank 4, and concentration measuring means connected to the mixing tank 4 ( It has a concentration measuring device 5), a waste liquid tank 6, and a control unit 7 for comprehensively controlling the system 1A.

The above-described alcohol supply means has at least the IPA supply source 2, the pipe 10 and the valve 15a shown in FIG.

The IPA supply source 2 includes, for example, a container in which IPA is stored, and a means for pumping the IPA in the container to the mixing tank 4. Specific examples of means for pumping IPA include gas pressurization and a pump. The pipe 10 connects the IPA supply source 2 and the mixing tank 4, and forms a flow path for introducing IPA from the IPA supply source 2 to the mixing tank 4. The valve 15 a is provided in the pipe 10 and is controlled by the control unit 7 to adjust the start or stop of IPA introduction, the amount of IPA introduction, and the like.

The pure water supply means described above has at least the ultrapure water supply source 3, the pipe 11 and the valve 15b shown in FIG.

The pipe 11 connects the ultrapure water supply source 3 and the mixing tank 4, and forms a flow path for introducing ultrapure water from the ultrapure water supply source 3 to the mixing tank 4. The valve 15 b is provided in the pipe 11 and is controlled by the control unit 7, and adjusts the start or stop of introduction of ultrapure water, the introduction amount of ultrapure water, and the like. The ultrapure water supply source 3 may be an ultrapure water production apparatus that is directly connected to the mixing tank 4 via the pipe 11. The ultrapure water supply source 3 pumps a tank for storing ultrapure water produced by the ultrapure water production apparatus and the ultrapure water stored in the tank to the mixing tank 4 via the pipe 11. You may have a pump etc.

In order to make the concentration of the cleaning liquid in the mixing tank 4 immediately after the supply of IPA and ultrapure water uniform, the mixing tank 4 is preferably provided with a stirring mechanism. For example, circulation of cleaning liquid by a pump or the like, gas ( N ₂ or the like) is preferably blown in and stirred. Moreover, a line mixer may be provided in the front stage of the mixing tank 4, and the cleaning liquid mixed via the line mixer may be stored in the mixing tank 4 by joining the pipe 10 and the pipe 11. Further, a line mixer may be provided instead of the mixing tank 4 and the cleaning liquid mixed by the line mixer may be directly supplied to the cleaning device 100. Therefore, the mixing means referred to in the claims includes not only the mixing tank but also other types.

The mixing tank 4 and the concentration measuring means (concentration measuring device 5) are connected to each other via a pipe 12. The mixing tank 4 and the waste liquid tank 6 are connected to each other via a pipe 13.

Then, the mixing tank 4 and the cleaning apparatus 100 are connected to each other via the pipe 14a, and the cleaning liquid whose concentration is adjusted is sent from the mixing tank 4 to the cleaning apparatus 100 by the first liquid feeding means including the pipe 14a. Here, the component concentration of the cleaning liquid in the mixing tank 4 and the component concentration of the cleaning liquid immediately after flowing out of the mixing tank 4 are substantially the same. Therefore, the component concentration of the cleaning liquid in the mixing tank 4 can be measured both when the concentration measuring device 5 is provided on the pipe 14a and when the concentration measuring device 5 is connected to a pipe (not shown) branched from the pipe 14a. Is possible. That is, the measurement of the cleaning liquid component concentration in the present invention includes both the measurement of the cleaning liquid component concentration in the mixing tank 4 and the measurement of the cleaning liquid component concentration immediately after flowing out of the mixing tank 4.

Furthermore, the liquid management system 1A includes a concentrator 16 that concentrates the cleaning liquid discharged from the cleaning device 100 and returns it to the mixing tank 4. For this reason, the cleaning apparatus 100 and the concentrator 16 are connected to each other via the pipe 14b, and the cleaning liquid discharged from the cleaning apparatus 100 is sent to the concentrator 16 by the second liquid feeding means including the pipe 14b. Furthermore, the mixing tank 4 and the concentrator 16 are connected to each other via the pipe 14c, and the cleaning liquid concentrated in the concentrator 16 is sent to the mixing tank 4 by the third liquid feeding means including the pipe 14c. The waste liquid tank 6 and the concentrator 16 are connected to each other via a pipe 14d, and the waste liquid discharged from the concentrator 16 is sent to the waste liquid tank 6 by the fourth liquid feeding means including the pipe 14d. Each liquid feeding means is provided with a pump or the like that causes a liquid flow in a target direction as required.

For the concentration means of the concentrator 16, it is preferable to apply a membrane separation technique such as an osmotic vaporization method (PV method; Pervaporation) or an evaporation permeation method (VP method; Vapor Permeation). The PV method is preferable in that the heat source can be reduced. On the other hand, the VP method can be concentrated with a small size and high efficiency of the apparatus. Existing films can be used for the PV method and VP method. For example, there are membranes made of inorganic materials such as zeolite, polyimide materials, cellulose materials, and polyvinyl alcohol materials.

Zeolite has excellent mechanical strength, dehydration performance, and heat resistance, and can be concentrated with high efficiency. However, since the water resistance is low, it is suitable for processing a liquid having an IPA concentration of 80% or more. In addition, when the elution from the zeolite is particularly concerned, it is preferable to apply the VP method. A film made of a polymer such as polyimide is more water resistant than zeolite and can be processed even if the IPA concentration is about 60%.

Next, the operation of the liquid management system 1A having the above configuration will be described. First, the control unit 7 opens the

valves

15a and 15b shown in FIG. 1 simultaneously or sequentially and supplies IPA and ultrapure water from the IPA supply source 2 and the ultrapure water supply source 3 to the mixing tank 4. . Here, IPA and ultrapure water are supplied at a predetermined rate. In other words, a predetermined amount of IPA and ultrapure water are respectively supplied so as to obtain a cleaning liquid having an ideal component concentration (hereinafter referred to as “ideal concentration”). Thereby, IPA and ultrapure water are mixed in the mixing tank 4 to produce a cleaning liquid. However, at this time, the component concentration of the cleaning liquid in the mixing tank 4 does not always completely match the ideal concentration. This is because IPA and ultrapure water are supplied to the mixing tank 4 at a constant rate, but this rate is a calculated rate.

When IPA and ultrapure water are supplied to the mixing tank 4 to produce a predetermined amount of cleaning liquid, the

valves

15a and 15b are closed. Next, the density adjustment process is started. Specifically, a part of the cleaning liquid in the mixing tank 4 is extracted via the pipe 12 under the control of the control unit 7, and the concentration of the component is measured by the concentration measuring device 5. Thereafter, both or one of the valve 15a and the valve 15b are opened again according to the measurement result by the concentration measuring device 5, and both the IPA supply source 2 and the ultrapure water supply source 3 are used. Both or one is replenished to the mixing tank 4. More specifically, the concentration measurement by the concentration measuring device 5 and the replenishment of IPA and / or ultrapure water are repeated several times so that the component concentration of the cleaning liquid in the mixing tank 4 matches the ideal concentration. Further, the supply of IPA and ultrapure water for making a predetermined amount of cleaning liquid to the mixing tank 4 and the concentration adjustment process can be executed simultaneously. Specifically, while supplying IPA and ultrapure water to the mixing tank 4, a part of the cleaning liquid in the mixing tank 4 is extracted to measure the component concentration, and both the valve 15a and the valve 15b are measured according to the measurement result. Or one side may be opened and closed, and an opening degree may be adjusted. Anyway, the control part 7 in this embodiment functions as a 1st control means of the invention which concerns on Claim 4 of this application.

The cleaning liquid extracted for concentration measurement is returned to the mixing tank 4 or discarded (may be sent to the waste liquid tank 6 or discharged through another line) depending on the degree of contamination. When the concentration measuring device 5 is branched from the pipe 14 a and connected, it may be returned to the pipe 14 a or sent to the cleaning device 100. However, when a Karl Fischer moisture meter is used as the concentration measuring device 5, it is necessary to use a reagent for the cleaning liquid. Therefore, it is preferable to discard the cleaning liquid after the concentration measurement.

When a cleaning liquid having an ideal concentration or a concentration close thereto is prepared as described above, supply of the cleaning liquid from the mixing tank 4 to the cleaning apparatus 100 and recovery of the cleaning liquid from the cleaning apparatus 100 to the mixing tank 4 are started. . Specifically,

pipes

14a, 14b, and 14c are provided so that the cleaning liquid circulates again from the mixing tank 4 through the cleaning device 100 and the concentrator 16 to the mixing tank 4, and first, the concentration in the mixing tank 4 The adjusted cleaning liquid is supplied to the cleaning tank of the cleaning apparatus 100 through the pipe 14a. Subsequently, the cleaning liquid discharged from the cleaning of the cleaning apparatus 100 is sent to the concentrator 16 through the pipe 14b.

In the cleaning tank, the IPA concentration and the amount of impurities of the cleaning liquid in the cleaning tank differ in the wafer cleaning process due to the influence of the cleaning liquid and moisture taken out or brought in as wafer deposits or evaporation. In general, however, the IPA concentration of the cleaning liquid discharged from the cleaning apparatus 100 is reduced as compared with the IPA concentration of the cleaning liquid supplied from the mixing tank 4 to the cleaning apparatus 100 due to mixing of pure water, IPA evaporation, or the like. Therefore, IPA is concentrated by the concentrator 16.

The concentrated solution that has passed through the concentrator 16 is sent to the mixing tank 4 through the pipe 14 c, and the waste solution that exits the concentrator 16 is sent to the waste solution tank 6. In the mixing tank 4, the IPA concentration of the cleaning liquid is adjusted by the IPA supply means and the ultrapure water supply means, and the cleaning liquid whose concentration has been adjusted is sent to the cleaning device 100 again via the pipe 14a. In this way, the cleaning liquid is circulated from the mixing tank 4 to the mixing tank 4 again through the cleaning device 100 and the concentrator 16. Thereby, it is possible to supply the cleaning liquid of the ideal concentration to the cleaning apparatus 100 without stopping the cleaning process.

As shown in Japanese Patent Application No. 2011-084456 and Japanese Patent Application No. 2011-084457, the applicant of the present invention uses only the supply pipe and the recovery pipe without using the concentrator 16 in the configuration shown in FIG. And a liquid management system that can maintain the concentration of the cleaning liquid within a certain range while circulating the cleaning liquid between the mixing tank 4 and the mixing tank 4.

In these prior inventions, in order to maintain the concentration of the cleaning liquid (a liquid containing IPA and pure water) within a certain range, alcohol or pure water is supplied and controlled from the alcohol supply means and the pure water supply means. Yes. However, depending on the concentration condition of the cleaning liquid, the amount of alcohol or pure water required for concentration adjustment increases, the amount of cleaning liquid increases more than necessary, and the cleaning liquid (that is, alcohol and pure water) is prepared wastefully. The point was concerned.

For example, when managing the IPA concentration of the cleaning liquid to 95%, the supply flow rate (average) to the cleaning apparatus 100 is 1 L / min, the disappearance amount of the cleaning liquid is 0.2 L / min, and the pure water mixing amount in the cleaning apparatus 100 is 0.1 L / min. In that case, the cleaning liquid recovered from the cleaning apparatus 100 to the mixing tank 4 has an IPA concentration of 84.4% at a flow rate (average) of 0.9 (= 1−0.2 + 0.1) L / min. At this time, in order to make the concentration of the cleaning liquid 95%, it is necessary to add 1.9 L / min of 99.9% IPA to the recovered cleaning liquid ((84.4 * 0.9 + 99.9X) / From (0.9 + X) = 95, X = 1.9). As a result, the flow rate after concentration adjustment is 2.8 (= 0.9 + 1.9) L / min, so that the amount of liquid in the system increases (increase rate 1.8 (= 2.8-1) L / Min). Accordingly, it is necessary to take measures such as discharging a part of the cleaning liquid whose concentration has been adjusted to the outside of the system, or discarding a part of the recovered cleaning liquid to reduce the amount of recovered liquid (recovery rate). In other words, both measures waste IPA.

Further, even when the IPA concentration of the cleaning liquid to be managed is low, if the amount of pure water mixed in the cleaning apparatus 100 is large (= the cleaning liquid is greatly diluted by the cleaning apparatus), IPA is wasted. For example, when the IPA concentration of the cleaning liquid is controlled to 20%, the supply flow rate (average) to the cleaning apparatus 100 is 1 L / min, the disappearance amount of the cleaning liquid is 0.1 L / min, and the amount of pure water mixed in the cleaning apparatus 100 is 0.9 L / min. In that case, the cleaning liquid recovered from the cleaning apparatus 100 to the mixing tank 4 has a flow rate (average) of 1.8 L / min and an IPA concentration of 10.0%. At this time, in order to set the concentration of the cleaning solution to 20%, it is necessary to add 0.2 L / min of 99.9% IPA to the recovered cleaning solution ((10 * 1.8 + 99.9X) / (1 .8 + X) = 20, X = 0.2). As a result, the flow rate after concentration adjustment is 2.0 L / min, so the amount of liquid in the system increases (increase rate 1.0 (= 2.0-1) L / min). Accordingly, in this case as well, it is necessary to discharge a part of the cleaning liquid whose concentration has been adjusted to the outside of the system, or to discard a part of the recovered cleaning liquid and reduce the amount of recovered liquid (recovery rate). After all, IPA is consumed wastefully in any correspondence.

In response to such concerns about the prior invention, in this embodiment, the concentration of the cleaning liquid to be recovered is achieved by providing the concentrator 16 in the liquid recovery path for recovering the cleaning liquid from the cleaning device 100 to the mixing tank 4. And cleaning fluid can be circulated. Therefore, the amount of IPA used for concentration adjustment can be reduced.

Furthermore, the concentration control in the mixing tank 4 can be stably performed with high accuracy by adjusting the IPA concentration of the concentrate sent from the concentrator 16 to the mixing tank 4 within a certain range (preferably ideal concentration). Can do. In addition, the amount of waste liquid outside the system of the cleaning liquid is reduced.

`` Liquid volume adjustment process ''
Moreover, in this embodiment, the liquid quantity adjustment process which maintains the quantity of the liquid in the mixing tank 4 within a predetermined liquid quantity range may be performed. In this case, a liquid level measuring means (level sensor) (not shown) is provided in the mixing tank 4 and the liquid level (liquid level) of the cleaning liquid in the mixing tank 4 is continuously or intermittently monitored. The control unit 7 executes a liquid amount adjustment process based on the monitoring result of the level sensor. Specifically, the amount of the cleaning liquid in the mixing tank 4 can be circulated between a predetermined liquid amount range (between the mixing tank 4 and the cleaning device 100 by monitoring with a level sensor, and the semiconductor wafer is cleaned in the cleaning tank. When a decrease in excess of the range sufficient for drying) is detected, the

valves

15a, 15b are opened, and the IPA and ultrapure water source 3 and the ultrapure water source 3 are transferred to the mixing tank 4. Pure water is supplied at a constant rate. On the other hand, when it is detected by monitoring by the level sensor that the amount of the cleaning liquid in the mixing tank 4 has increased beyond a predetermined liquid amount range, the control unit 7 controls the waste liquid means, A part of the cleaning liquid in the mixing tank 4 is discarded. Specifically, a valve (not shown) on the pipe 13 is opened, and a part of the cleaning liquid in the mixing tank 4 is discarded to the waste liquid tank 6. In this way, a predetermined amount of cleaning liquid having an ideal concentration or a concentration close to this is always held in the mixing tank 4. That is, the control unit 7 in this embodiment also functions as the second control means of the invention according to claim 5 of the present application.

However, while the cleaning liquid circulates as described above, the component concentration of the cleaning liquid changes due to various factors. The most common concentration change is a decrease in IPA concentration, but other concentration changes are possible. Therefore, the concentration adjustment process is performed continuously or intermittently even during the circulation of the cleaning liquid. Specifically, under the control of the control unit 7, the component concentration of the cleaning liquid is measured continuously or intermittently by the concentration measuring device 5. As a result, when the component concentration of the cleaning liquid changes beyond a predetermined concentration range, both or one of IPA and ultrapure water is replenished to the mixing tank 4. Specifically, according to the measurement result of the concentration measuring device 5, both or one of the valve 15a and the valve 15b is opened, and both or one of the IPA supply source 2 and the ultrapure water supply source 3 are operated. Both or one of IPA and ultrapure water is replenished to the mixing tank 4.

Here, from the viewpoint of reducing the amount of IPA necessary for the concentration adjustment as much as possible, it is preferable to execute the liquid amount adjustment processing prior to the execution of the concentration adjustment processing. Further, in the liquid amount adjustment process, the amount of the cleaning liquid in the mixing tank 4 is adjusted to an amount that is within a predetermined liquid amount range and does not reach the upper limit of the liquid amount range. IPA and / or pure water are supplied so that the amount of the cleaning liquid in 4 does not exceed the upper limit of the liquid amount range.

As the concentration measuring device 5, an ultrasonic densitometer, a specific resistance meter, an infrared spectrometer, a Brix meter, a specific gravity meter and the like can also be used. Moreover, as a liquid quantity measurement means, the liquid quantity in the mixing tank 4 may be calculated | required from the load of the mixing tank 4 using a load cell.

In addition, a pump and a valve are installed on the above-described piping as necessary. Moreover, a filter can also be installed as needed. Furthermore, the temperature of the cleaning liquid may be controlled by installing a heat exchanger on the pipe.

“Treatment of contaminated cleaning fluid”
Further, when the cleaning liquid is contaminated with impurities due to cleaning and drying of the semiconductor wafer, the cleaning liquid may be replaced. However, according to the present embodiment, a part of the contaminated cleaning liquid is extracted into the waste liquid tank 6 through the pipe 13, and the impurities are diluted to an ideal concentration by supplying IPA and ultrapure water to the mixing tank 4. You can make a cleaning solution. Thereby, the cleaning liquid with the ideal concentration can be supplied to the cleaning apparatus without stopping the cleaning process without replacing all of the contaminated cleaning liquid. The extraction of the cleaning liquid and the dilution of impurities may be performed separately or simultaneously. In order to reduce the amount of IPA and ultrapure water used for diluting the impurities, a part of the cleaning solution is extracted to reduce the volume, and then IPA and ultrapure water are supplied to the mixing tank 4 to dilute the impurities. It is preferable to carry out. When the cleaning liquid is contaminated with impurities and the amount of liquid in the mixing tank 4 is reduced, the IPA and ultrapure water are added to the mixing tank 4 without extracting the contaminated cleaning liquid into the waste liquid tank 6. Supply. As a result, impurities can be diluted to produce an ideal concentration cleaning solution. In order to monitor the impurity concentration of the cleaning liquid, for example, a particle detector (particle meter) is provided on the

pipes

14a, 14b, 14c or 12 or through these branch lines or a sampling line directly connected to the mixing tank 4. The amount of fine particles (impurities) in the cleaning liquid may be monitored. In addition, when the impurity has a property of absorbing light, the amount of the impurity can be monitored by an absorptiometer.

(Second embodiment)
Hereinafter, the second embodiment of the present invention will be described in detail. FIG. 2 is a block diagram showing a basic configuration of the liquid management system according to the present embodiment.

The liquid management system 1B shown in FIG. 2 is the liquid management according to the first embodiment except for the connection configuration of the cleaning liquid supply / recovery pipe among the cleaning device 100, the mixing tank 4, and the concentrator 16. The configuration is essentially the same as that of the system 1A. Therefore, about the structure which is common with 1 A of liquid management systems, the same code | symbol is attached | subjected in FIG. 2, and description is abbreviate | omitted.

In this embodiment, as shown in FIG. 2, the cleaning device 100 and the concentrator 16 are not communicated with each other, and the cleaning device 100 and the mixing tank 4 are connected to each other via

pipes

14a and 14e. The pipe 14a constitutes a first liquid feeding means for sending the cleaning liquid whose concentration is adjusted from the mixing tank 4 to the cleaning apparatus 100 as in the first embodiment. The pipe 14 e constitutes a fifth liquid feeding means for sending the cleaning liquid discharged from the cleaning device 100 to the mixing tank 4.

Furthermore, the mixing tank 4 and the concentrator 16 are connected to each other via

pipes

14c and 14f. The pipe 14 c constitutes a third liquid feeding means for sending the cleaning liquid concentrated by the concentrator 16 to the mixing tank 4 as in the first embodiment. The pipe 14 f forms sixth liquid feeding means for sending the cleaning liquid in the mixing tank 4 containing the cleaning liquid discharged from the cleaning apparatus 100 to the concentrator 16. Each liquid feeding means is provided with a pump or the like that causes a liquid flow in a target direction as required.

In the liquid management system 1B shown in FIG. 2, first, the cleaning liquid whose concentration is controlled in the mixing tank 4 is supplied to the cleaning tank of the cleaning apparatus 100 through the pipe 14a. The cleaning liquid discharged from the cleaning tank of the cleaning apparatus 100 is sent to the mixing tank 4 through the pipe 14e.

In the cleaning tank, the IPA concentration and the amount of impurities of the cleaning liquid in the cleaning tank differ in the wafer cleaning process due to the influence of the cleaning liquid and moisture taken out or brought in as wafer deposits or evaporation. In general, however, the IPA concentration of the cleaning liquid discharged from the cleaning apparatus 100 is reduced as compared with the IPA concentration of the cleaning liquid supplied from the mixing tank 4 to the cleaning apparatus 100 due to mixing of pure water, IPA evaporation, or the like. Therefore, the IPA concentration of the cleaning liquid in the mixing tank 4 tends to decrease. The cleaning liquid in the mixing tank 4 containing the cleaning liquid discharged from the cleaning tank is sent to the concentrator 16 through the pipe 14f to concentrate IPA.

As the concentrating means of the concentrator 16, it is preferable to apply a PV method or a VP method using a membrane made of zeolite, polyimide or the like, as in the first embodiment.

The concentrated solution that has passed through the concentrator 16 is sent to the mixing tank 4 via the pipe 14 c, and the waste solution from the concentrator 16 is sent to the waste solution tank 6. In the mixing tank 4, the IPA concentration of the cleaning liquid is adjusted by the IPA supply means and the ultrapure water supply means, and the cleaning liquid whose concentration has been adjusted is sent to the cleaning device 100 again via the pipe 14a. As described above, the cleaning liquid is circulated between the mixing tank 4 and the cleaning device 100 and between the mixing tank 4 and the concentrator 16. Thereby, it is possible to supply the cleaning liquid of the ideal concentration to the cleaning apparatus 100 without stopping the cleaning process.

In the present embodiment, by providing a concentrator 16 for extracting and concentrating the cleaning liquid collected in the mixing tank 4 and returning it to the mixing tank 4, as in the first embodiment, IPA added for concentration adjustment is provided. The amount of use can be reduced. Furthermore, the concentration control in the mixing tank 4 can be stably performed with high accuracy by adjusting the IPA concentration of the concentrate sent from the concentrator 16 to the mixing tank 4 within a certain range (preferably ideal concentration). Can do. In addition, the amount of waste liquid outside the system of the cleaning liquid is reduced.

In particular, this embodiment has a configuration in which the cleaning liquid in the mixing tank 4 containing the cleaning liquid recovered from the cleaning apparatus 100 is extracted and concentrated by the concentrator 16 and then returned to the mixing tank 4. For this reason, it is applicable when the allowable value of the IPA concentration range in the mixing tank 4 can be increased.

In addition, the concentration process using the

pipes

14c and 14f may be performed regularly or unsteadily. In the case of non-stationary, concentration processing is started when the inside of the mixing tank 4 becomes equal to or lower than the preset IPA concentration, and concentration processing for a certain time is performed, or the IPA concentration of the mixing tank 4 is set separately. Concentration is performed until the above is reached.

Moreover, in the mixing tank 4, it is preferable to perform the same liquid amount adjustment process as that of the first embodiment and the contaminated cleaning liquid.

(Third embodiment)
Hereinafter, a third embodiment of the present invention will be described in detail. FIG. 3 is a block diagram showing a basic configuration of the liquid management system according to the present embodiment.

The liquid management system 1C shown in FIG. 3 includes a purifier that purifies the cleaning liquid discharged from the cleaning device in the liquid management system 1A according to the first embodiment in either one or both of the front and rear stages of the concentrator 16. Except for the points provided, the liquid management system 1A according to the first embodiment has essentially the same configuration. Therefore, about the structure which is common with 1 A of liquid management systems, the same code | symbol is attached | subjected in FIG. 3, and description is abbreviate | omitted.

In the present embodiment, as shown in FIG. 3, the cleaning device 100 and the purification device 17 are connected to each other via a pipe 14b, and the cleaning liquid discharged from the cleaning apparatus 100 by the second liquid feeding means including the pipe 14b. Is sent to the purifier 17. The purifier 17 is disposed on the liquid introduction side of the concentrator 16. The pipe 14 c constitutes a third liquid feeding means for sending the cleaning liquid concentrated by the concentrator 16 to the mixing tank 4 as in the first embodiment. Each liquid feeding means is provided with a pump or the like that causes a liquid flow in a target direction as required.

Although FIG. 3 shows a configuration in which the purification device 17 is installed in the previous stage of the concentrator 16, the purification device 17 may be provided in the subsequent stage or both before and after the concentrator 16, as described above. When the purifier 17 is installed at the subsequent stage of the concentrator 16, that is, on the liquid outlet side of the concentrator, the cleaning device 100 and the concentrator 16 are connected by a pipe 14b, and the purifier 17 and the mixing tank 4 are connected by a pipe 14c. Connect with.

In the liquid management system 1C shown in FIG. 3, first, the concentration-adjusted cleaning liquid in the mixing tank 4 is supplied to the cleaning tank of the cleaning apparatus 100 through the pipe 14a. Subsequently, the cleaning liquid discharged from the cleaning tank of the cleaning device 100 is sent to the purification device 17 through the pipe 14b. The cleaning liquid that has passed through the purifier 17 is processed by the concentrator 16.

In the cleaning tank, the IPA concentration and the amount of impurities of the cleaning liquid in the cleaning tank differ in the wafer cleaning process due to the influence of the cleaning liquid and moisture taken out or brought in as wafer deposits or evaporation. In general, however, the IPA concentration of the cleaning liquid discharged from the cleaning apparatus 100 is reduced as compared with the IPA concentration of the cleaning liquid supplied from the mixing tank 4 to the cleaning apparatus 100 due to mixing of pure water, IPA evaporation, or the like. Therefore, IPA is concentrated by the concentrator 16. Further, since the impurity amount of the cleaning liquid increases due to impurities from the cleaning apparatus 100, wafer deposits, piping, etc., the purification apparatus 17 removes impurities from the cleaning liquid discharged from the cleaning apparatus 100.

The purification device 17 is appropriately selected depending on the object to be removed. For example, an ion exchange resin tower, an ion adsorption membrane, a filter (microfiltration membrane), a distillation can, an evaporator, and the like can be appropriately used as the purification device 17.

The concentrated solution that has passed through the concentrator 16 is sent to the mixing tank 4 via the pipe 14 c, and the waste solution from the concentrator 16 is sent to the waste solution tank 6. In the mixing tank 4, the IPA concentration of the cleaning liquid is adjusted by the IPA supply means and the pure water supply means, and the cleaning liquid whose concentration has been adjusted is sent again to the cleaning device 100 via the pipe 14 a. In this way, the cleaning liquid circulates again from the mixing tank 4 to the mixing tank 4 via the cleaning device 100, the purification device 17 and the concentrator 16. Thereby, it is possible to supply the cleaning liquid of the ideal concentration to the cleaning apparatus 100 without stopping the cleaning process.

In the present embodiment, by using the concentrator 16 in the liquid recovery path for returning the cleaning liquid from the cleaning device 100 to the mixing tank 4, the amount of IPA added for concentration adjustment is the same as in the first embodiment. Can be reduced. Furthermore, the concentration control in the mixing tank 4 can be stably performed with high accuracy by adjusting the IPA concentration of the concentrate sent from the concentrator 16 to the mixing tank 4 within a certain range (preferably ideal concentration). Can do. In addition, the amount of waste liquid outside the system of the cleaning liquid is reduced.

Particularly in the present embodiment, the purifier 17 is provided in either one or both of the front and rear stages of the concentrator 16 as compared to the first embodiment. For this reason, a high-purity cleaning liquid can be stably supplied to the cleaning apparatus 100.

Moreover, in the mixing tank 4, it is preferable to perform the same liquid amount adjustment process as in the first embodiment.

(Fourth embodiment)
Hereinafter, the fourth embodiment of the present invention will be described in detail. FIG. 4 is a block diagram showing a basic configuration of the liquid management system according to the present embodiment.

The liquid management system 1D shown in FIG. 4 is provided with a purifier 17 for purifying a used cleaning liquid in either or both of the front and rear stages of the concentrator 16 in the liquid management system 1B according to the second embodiment. Except for the above, the liquid management system 1B according to the second embodiment has essentially the same configuration. Therefore, about the structure which is common in the liquid management system 1B, the same code | symbol is attached | subjected in FIG. 4, and description is abbreviate | omitted.

In the present embodiment, as shown in FIG. 4, the mixing tank 4 and the purifier 17 are connected to each other via a pipe 14f, and the cleaning liquid discharged from the cleaning apparatus 100 by the sixth liquid feeding means including the pipe 14f. The cleaning liquid in the mixing tank 4 containing is sent to the purification device 17. The purifier 17 is disposed on the liquid introduction side of the concentrator 16. The pipe 14 c constitutes a third liquid feeding means for sending the cleaning liquid concentrated by the concentrator 16 to the mixing tank 4 as in the second embodiment. Each liquid feeding means is provided with a pump or the like that causes a liquid flow in a target direction as required.

In addition, although the structure which installed the refiner | purifier 17 in the front | former stage of the concentrator 16 is shown in FIG. 4, as mentioned above, the refiner | purifier 17 may be provided in the back | latter stage of the concentrator 16, or both front and back. When the purifier 17 is installed at the subsequent stage of the concentrator 16, that is, on the liquid outlet side of the concentrator, the mixing tank 4 and the concentrator 16 are connected by a pipe 14f, and the purifying apparatus 17 and the mixing tank 4 are connected by a pipe 14c. Connect with.

In the liquid management system 1D shown in FIG. 4, first, the cleaning liquid whose concentration is controlled in the mixing tank 4 is supplied to the cleaning tank of the cleaning apparatus 100 through the pipe 14a. The cleaning liquid discharged from the cleaning tank of the cleaning apparatus 100 is sent to the mixing tank 4 through the pipe 14e. Thereby, the cleaning liquid discharged from the cleaning apparatus 100 is partially included in the cleaning liquid in the mixing tank 4.

In the cleaning tank, the IPA concentration and the amount of impurities of the cleaning liquid in the cleaning tank differ in the wafer cleaning process due to the influence of the cleaning liquid and moisture taken out or brought in as wafer deposits or evaporation. In general, however, the IPA concentration of the cleaning liquid discharged from the cleaning apparatus 100 is reduced as compared with the IPA concentration of the cleaning liquid supplied from the mixing tank 4 to the cleaning apparatus 100 due to mixing of pure water, IPA evaporation, or the like. In addition, the amount of impurities in the cleaning liquid increases due to impurities from the cleaning apparatus 100, wafer deposits, piping, and the like. Therefore, the IPA concentration in the mixing tank 4 decreases and the amount of impurities tends to increase.

Therefore, the cleaning liquid in the mixing tank 4 is sent to the purification device 17 through the pipe 14f, and the purification device 17 removes impurities from the cleaning liquid. Further, the cleaning liquid purified by the purifier 17 is sent to the concentrator 16 to concentrate IPA.

The concentrated solution that has passed through the concentrator 16 is sent to the mixing tank 4 via the pipe 14 c, and the waste solution from the concentrator 16 is sent to the waste solution tank 6. In the mixing tank 4, the IPA concentration of the cleaning liquid is adjusted by the IPA supply means and the pure water supply means, and the cleaning liquid whose concentration has been adjusted is sent again to the cleaning device 100 via the pipe 14 a. As described above, the cleaning liquid is circulated between the mixing tank 4 and the cleaning apparatus 100 and between the mixing tank 4, the purification apparatus 17, and the concentrator 16. Thereby, it is possible to supply the cleaning liquid of the ideal concentration to the cleaning apparatus 100 without stopping the cleaning process.

Particularly in the present embodiment, the purifier 17 is provided in either one or both of the front and rear stages of the concentrator 16 as compared to the second embodiment. For this reason, a high-purity cleaning liquid can be stably supplied to the cleaning apparatus 100.

In addition, the concentration process using the

pipes

14c and 14f may be performed regularly or unsteadily. In the case of non-stationary, concentration processing is started when the inside of the mixing tank 4 becomes equal to or lower than the preset IPA concentration, and concentration processing for a certain time is performed, or the IPA concentration of the mixing tank 4 is set separately. Concentration treatment is performed until the above is reached.

Also, as described in the second embodiment, this embodiment is suitable when the allowable value of the IPA concentration range of the mixing tank 4 can be increased.

(Fifth embodiment)
Hereinafter, a fifth embodiment of the present invention will be described in detail. FIG. 5 is a block diagram showing a basic configuration of the liquid management system according to the present embodiment.

The liquid management system 1E shown in FIG. 5 is the same as the liquid management system 1A according to the first embodiment except that a purification device for purifying the cleaning liquid is provided in the liquid supply path between the mixing tank 4 and the cleaning device 100. The liquid management system 1A according to the first embodiment has essentially the same configuration. Therefore, about the structure which is common with 1 A of liquid management systems, the same code | symbol is attached | subjected in FIG. 5, and description is abbreviate | omitted.

In this embodiment, as shown in FIG. 5, the mixing tank 4 and the refiner 17 are connected to each other via a pipe 14a, and the concentration is adjusted from the mixing tank 4 by the first liquid feeding means including the pipe 14a. The cleaning liquid is sent to the purification device 17. Further, the purifying device 17 and the cleaning device 100 are connected to each other via the pipe 14g, and the cleaning liquid purified by the purifying device 17 is sent to the cleaning device 100 by the seventh liquid feeding means including the pipe 14g. Each liquid feeding means is provided with a pump or the like that causes a liquid flow in a target direction as required.

In the liquid management system 1E shown in FIG. 5, first, the concentration-adjusted cleaning liquid in the mixing tank 4 is sent to the purifier 17 via the pipe 14a. Subsequently, the cleaning liquid purified by the purification device 17 is supplied to the cleaning tank of the cleaning device 100 through the pipe 14g.

In the cleaning tank, the IPA concentration and the amount of impurities of the cleaning liquid in the cleaning tank differ in the wafer cleaning process due to the influence of the cleaning liquid and moisture taken out or brought in as wafer deposits or evaporation. In general, however, the IPA concentration of the cleaning liquid discharged from the cleaning apparatus 100 is reduced as compared with the IPA concentration of the cleaning liquid supplied from the mixing tank 4 to the cleaning apparatus 100 due to mixing of pure water, IPA evaporation, or the like. Therefore, the cleaning liquid discharged from the cleaning apparatus 100 is sent to the concentrator 16 to concentrate IPA.

The purification device 17 is appropriately selected depending on the object to be removed. For example, an ion exchange resin tower, an ion adsorption membrane, a filter (microfiltration membrane), a distillation can, an evaporator, and the like can be appropriately used as the purification device 17. In addition, when using a distillation can or an evaporation can, care must be taken because the IPA concentration before and after purification may change depending on the use conditions.

The concentrated solution that has passed through the concentrator 16 is sent to the mixing tank 4 via the pipe 14 c, and the waste solution from the concentrator 16 is sent to the waste solution tank 6. In the mixing tank 4, the IPA concentration of the cleaning liquid is adjusted by the IPA supply means and the pure water supply means, and the cleaning liquid whose concentration is adjusted is sent again to the cleaning apparatus 100 through the pipe 14a, the purification apparatus 17, and the pipe 14g in order. Although the impurity amount of the cleaning liquid returned to the mixing tank 4 increases due to impurities from the cleaning apparatus 100, wafer deposits, piping, etc., the purification apparatus 17 can remove the impurities of the cleaning liquid.

Thus, the cleaning liquid is circulated from the mixing tank 4 to the mixing tank 4 again through the purification device 17, the cleaning device 100, and the concentrator 16 in order. Thereby, it is possible to supply the cleaning liquid of the ideal concentration to the cleaning apparatus 100 without stopping the cleaning process.

Particularly in the present embodiment, the purifying device 17 is provided in the liquid supply path between the mixing tank 4 and the cleaning device 100 in the first embodiment. For this reason, a high-purity cleaning liquid can be stably supplied to the cleaning apparatus 100.

Note that the positions where the concentrator 16 and the purification device 17 are installed are not limited to the locations shown in FIGS. The concentrator 16 should just be provided in the line which collect | recovers the washing | cleaning liquid discharged | emitted from the washing | cleaning apparatus 100, and returns it to the mixing tank 4. FIG. On the other hand, the purification device 17 may be provided in the line or a line for supplying the cleaning liquid whose concentration is adjusted to the cleaning device 100. Further, the order in which the liquid passes through the concentrating device 16 and the purifying device 17 is not particularly limited. Therefore, a processing configuration such as concentration after purification, purification after concentration, concentration after purification, and purification again may be employed.

Example 1
Next, Example 1 of the present invention will be described. This example is a more specific example of the first and second embodiments described above.

A 6-inch silicon wafer was set in a cleaning tank of a single wafer spin cleaning apparatus, and a cleaning solution in which IPA and pure water were mixed to obtain an IPA concentration of 95% and pure water were alternately supplied to the cleaning tank. The silicon wafer to be cleaned is left for 1 week in a clean room.

The flow rate of the pure water to the cleaning tank was 2 L / min, the flow rate of the cleaning liquid having the above IPA concentration to the cleaning tank was 1 L / min, and the supply time was 1 minute.

This drain is equipped with a drain line. During the supply of the cleaning liquid, the cleaning liquid discharged from the drainage line was collected, and the liquid discharged from the drainage line during the pure water supply was discharged out of the system without being recovered.

The alternating supply of cleaning liquid and pure water to such a cleaning tank was repeated 15 times, and 10 L of discharged cleaning liquid was recovered. The IPA concentration of the recovered liquid was 85%. In order to set the recovered liquid to a cleaning liquid management concentration of 95%, it is necessary to add 20 L of a new IPA liquid (99.9%). At this time, the liquid volume is at least 30 L. This liquid amount is larger than the supplied cleaning liquid amount 15 (= 1 × 15) L, and the cleaning liquid (IPA) is wasted because the amount of the cleaning liquid in the system increases.

Therefore, the above-described recovered liquid was subjected to concentration treatment using a VP (Vapor Permeation) apparatus using a zeolite membrane to obtain a treatment liquid having an IPA concentration of 99.9%. Since the moisture is removed from the recovered liquid by the concentration treatment and the entire recovered liquid volume is reduced, the amount of IPA added to the recovered liquid can be reduced. As a result, wasteful use of IPA can be prevented. Even if the IPA concentration of the treatment liquid is less than the IPA concentration of the cleaning liquid, this effect can be exhibited.

Also, if the concentrator is designed and adjusted so that the IPA concentration of the treatment liquid is close to the IPA concentration of the cleaning liquid, the concentration adjustment in the mixing tank can be performed stably and accurately.

(Example 2)
Next, a second embodiment of the present invention will be described. This example is a more specific example of the third and fourth embodiments described above.

The alternating supply of cleaning liquid and pure water to such a cleaning tank was repeated 15 times, and 10 L of discharged cleaning liquid was recovered.

At this time, the metal concentration in the cleaning solution and the recovered solution was measured with an ICP mass spectrometer (ICP-MS). The measurement results are shown in Table 1. Due to impurities from the cleaning apparatus and the wafer, the metal concentration of the recovered liquid was higher than the metal concentration of the supplied cleaning liquid. Therefore, this recovered liquid was purified by an ion exchange resin tower (mixed bed type in which an anion resin and a cation resin were packed in one tower). Table 1 shows the metal concentration of the recovered liquid after purification. From this table, it can be seen that purification can be performed to a metal concentration equivalent to that of the cleaning liquid at the time of supply.

The IPA concentration of the recovered liquid was 85%. However, there was no change in the IPA concentration before and after purification. In order to set the recovered liquid to a cleaning liquid management concentration of 95%, it is necessary to add 20 L of a new IPA liquid (99.9%). At this time, the liquid volume is at least 30 L. This liquid amount is larger than the supplied cleaning liquid amount 15 (= 1 × 15) L, and the cleaning liquid (IPA) is wasted because the amount of the cleaning liquid in the system increases.

Therefore, the purified recovered solution was concentrated using a zeolite membrane VP (Vapor Permeation) device to obtain a processing solution having an IPA concentration of 99.9%. Since the moisture is removed from the recovered liquid by the concentration treatment and the entire recovered liquid volume is reduced, the amount of IPA added to the recovered liquid can be reduced. As a result, wasteful use of IPA can be prevented. This effect can be exhibited even when the IPA concentration of the concentrated treatment liquid is less than the IPA concentration of the cleaning liquid.

(Example 3)
Next, a third embodiment of the present invention will be described. This example is a more specific example of the third and fourth embodiments described above. However, although Example 2 was an example which performs a concentration process after purification, this example is an example in which a purification process is performed after concentration.

The same experiment as in Example 2 was performed, and the IPA concentration of the recovered liquid at this time was measured and found to be 85%. In order to set the recovered liquid to a cleaning liquid management concentration of 95%, it is necessary to add 20 L of a new IPA liquid (99.9%). At this time, the liquid volume is at least 30 L. This liquid amount is larger than the supplied cleaning liquid amount 15 (= 1 × 15) L, and the cleaning liquid (IPA) is wasted because the amount of the cleaning liquid in the system increases.

Therefore, the recovered liquid was concentrated using a zeolite membrane VP (Vapor Permeation) apparatus to obtain a processing liquid having an IPA concentration of 99.9%. Since the moisture is removed from the recovered liquid by the concentration treatment and the entire recovered liquid volume is reduced, the amount of IPA added to the recovered liquid can be reduced. As a result, wasteful use of IPA can be prevented. This effect can be exhibited even when the IPA concentration of the concentrated treatment liquid is less than the IPA concentration of the cleaning liquid. Moreover, if the concentrator is designed and adjusted so that the IPA concentration of the concentrated treatment liquid is close to the IPA concentration of the cleaning liquid, the concentration adjustment in the mixing tank can be performed stably and accurately.

Further, the metal concentration in the cleaning solution and the concentration treatment solution at the time of supply was measured with an ICP mass spectrometer (ICP-MS). The measurement results are shown in Table 2. Due to impurities from the cleaning apparatus, wafer, etc., the metal concentration of the concentrated treatment liquid was higher than the metal concentration of the supplied cleaning liquid. Therefore, the concentrated treatment liquid was purified by an ion exchange resin tower (mixed bed type in which an anion resin and a cation resin were packed in one tower). Table 2 shows the metal concentration of the treated liquid after purification. From this table, it can be seen that purification can be performed to a metal concentration equivalent to that of the cleaning liquid at the time of supply.

As mentioned above, although this invention was demonstrated using embodiment and the Example of this invention, this invention is not limited to these embodiment and Example, The design change of the range which does not deviate from the summary of this invention Is included in the present invention. That is, various changes and modifications that can be naturally made by those skilled in the art are also included in the present invention.

This application claims priority based on Japanese Patent Application No. 2011-278489 filed on December 20, 2011, the entire disclosure of which is incorporated herein.

1A, 1B, 1C, 1D, 1E Liquid management system 2 IPA supply source 3 Ultrapure water supply source 4 Mixing tank 5 Concentration measuring device 6 Waste liquid tank 7

Control unit

10, 11, 12, 13, 14a-

14g Piping

15a, 15b Valve 16 Concentrator 17 Purification device 100 Cleaning device

Claims

A liquid management system for managing a cleaning liquid used in a cleaning apparatus for cleaning an object,
It has a mixing means that mixes alcohol and pure water to make a cleaning liquid, and the mixing means adjusts the alcohol concentration in the cleaning liquid within a predetermined concentration range, and supplies the cleaning liquid whose concentration is adjusted to the cleaning device. A cleaning liquid supply device,
A cleaning device whose concentration is adjusted by the mixing means, or a purification device for purifying the cleaning solution discharged from the cleaning device;
A concentrator for concentrating the cleaning liquid whose concentration has been adjusted by the mixing means or the cleaning liquid discharged from the cleaning apparatus is provided upstream or downstream of the purifying apparatus, and the concentrated and purified cleaning liquid is supplied to the mixing means. Cleaning liquid recovery means to be returned;
Liquid management system with
The cleaning liquid recovery means includes
In the case of the cleaning liquid discharged from the cleaning device, it passes through the purification device and the concentrator to the mixing means, or returns to the mixing means and passes again through the purification device and the concentrator to the mixing means, or 2. The liquid according to claim 1, further comprising a liquid feeding means provided so as to be sent to the mixing means through the purification device, the washing device, and the concentrator in the case of the cleaning liquid whose concentration is adjusted by the mixing means. Management system.
The liquid management system according to claim 2, wherein the concentrator uses membrane concentration by a PV method or a VP method.
The liquid management system according to any one of claims 1 to 3, wherein the purification device includes at least one of an ion exchange resin tower, an ion adsorption membrane, and a microfiltration membrane.
The liquid management system according to claim 4, wherein the ion exchange resin tower is a mixed bed type ion exchange resin tower.
The cleaning liquid supply device includes:
Alcohol supply means for supplying alcohol to the mixing means;
Pure water supply means for supplying pure water to the mixing means;
Concentration measuring means for measuring the alcohol concentration of the cleaning liquid in which alcohol and pure water are mixed by the mixing means;
By controlling both or one of the alcohol supply means and the pure water supply means based on the measurement result of the concentration measurement means, the alcohol concentration of the cleaning liquid obtained by mixing alcohol and pure water by the mixing means is within a predetermined concentration range. A first control means for executing a density adjustment process to be maintained within,
The liquid management system according to claim 1, comprising:
A liquid amount measuring means for measuring the amount of cleaning liquid obtained by mixing alcohol and pure water by the mixing means;
By controlling the alcohol supply unit and the pure water supply unit based on the measurement result of the liquid amount measurement unit, the amount of the cleaning liquid obtained by mixing alcohol and pure water by the mixing unit is maintained within a predetermined liquid amount range. Second control means for performing a liquid amount adjustment process to be performed;
The liquid management system according to claim 6, further comprising:
A cleaning liquid discharged from a cleaning apparatus for cleaning an object using an aqueous alcohol solution adjusted within a predetermined concentration range as a cleaning liquid, and adjusted again within the predetermined concentration range and supplied to the cleaning apparatus A recovery and recycling device
A cleaning liquid supply device for supplying a cleaning liquid whose concentration is adjusted to the cleaning device, the mixing means for preparing a cleaning liquid in which alcohol and pure water are supplied to adjust the alcohol concentration within the predetermined concentration range;
A cleaning device whose concentration is adjusted by the mixing means, or a purification device for purifying the cleaning solution discharged from the cleaning device;
A concentrator for concentrating the cleaning liquid whose concentration has been adjusted by the mixing means or the cleaning liquid discharged from the cleaning apparatus is provided downstream or upstream of the purification apparatus, and the concentrated and purified cleaning liquid is supplied to the mixing means. Cleaning liquid recovery means to be returned;
A recovery and recovery device for cleaning liquid, comprising:
The cleaning liquid recovery means includes
In the case of the cleaning liquid discharged from the cleaning device, it passes through the purification device and the concentrator to the mixing means, or returns to the mixing means and passes again through the purification device and the concentrator to the mixing means, or The cleaning liquid according to claim 8, further comprising a liquid feeding means provided so as to be sent to the mixing means through the purification device, the cleaning device, and the concentrator in the case of the cleaning liquid whose concentration is adjusted by the mixing means. Recovery and recycling equipment.
10. The cleaning liquid recovery / regeneration apparatus according to claim 9, wherein the concentrator utilizes membrane concentration by a PV method or a VP method.
The apparatus for recovering and regenerating a cleaning liquid according to any one of claims 8 to 10, wherein the purification apparatus includes at least one of an ion exchange resin tower, an ion adsorption membrane, and a microfiltration membrane.
The apparatus for recovering and regenerating a cleaning liquid according to claim 11, wherein the ion exchange resin tower is a mixed bed type ion exchange resin tower.