WO2013091208A1 - 一种叉式支撑的抛光装置 - Google Patents

一种叉式支撑的抛光装置 Download PDF

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Publication number
WO2013091208A1
WO2013091208A1 PCT/CN2011/084406 CN2011084406W WO2013091208A1 WO 2013091208 A1 WO2013091208 A1 WO 2013091208A1 CN 2011084406 W CN2011084406 W CN 2011084406W WO 2013091208 A1 WO2013091208 A1 WO 2013091208A1
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WO
WIPO (PCT)
Prior art keywords
polishing
polishing wheel
wheel
fork
workpiece
Prior art date
Application number
PCT/CN2011/084406
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English (en)
French (fr)
Inventor
王君林
王绍治
刘健
马占龙
张玲花
Original Assignee
中国科学院长春光学精密机械与物理研究所
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Application filed by 中国科学院长春光学精密机械与物理研究所 filed Critical 中国科学院长春光学精密机械与物理研究所
Priority to PCT/CN2011/084406 priority Critical patent/WO2013091208A1/zh
Publication of WO2013091208A1 publication Critical patent/WO2013091208A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant

Definitions

  • the present invention relates to a fork-supported polishing apparatus for polishing a surface to be polished. Background technique
  • EMM Elastic Emission Machining
  • the existing device adopting the processing method has a large size, which is disadvantageous for processing complex workpieces with the machine tool, and the devices and methods in the prior art both immerse the workpiece to be processed and the polishing wheel in the polishing liquid for processing.
  • the dropped material is mixed with the polishing liquid, which is not conducive to the control of polishing precision and the process is difficult to observe.
  • the present invention provides a fork-supporting polishing apparatus which, on the one hand, has a compact structure and is suitable for cooperation with a machine tool, and on the other hand, it supplies a polishing liquid during processing instead of being processed.
  • the parts and the polishing wheel are immersed in the polishing liquid to improve the processing accuracy and make the entire processing process easy to control.
  • a fork-supporting polishing apparatus includes: a connecting member, a fork-shaped support member, a polishing wheel, a polishing wheel driving portion, a polishing wheel transmission portion, and a polishing liquid supply portion, wherein the connecting member is used for
  • the polishing device is fixed to an actuator of a machine tool, the connecting member is fixedly coupled to the fork support;
  • the fork support has two fork portions extending in a vertical direction, the two fork portions a horizontal extension portion is disposed between the ends of the connecting member;
  • the polishing wheel is disposed between the two fork portions and is located at an end of the two fork portions away from the connecting member,
  • the polishing wheel driving portion is disposed between the two fork portions for providing a driving force for driving the rotation of the polishing wheel;
  • the polishing wheel transmission portion Provided on an outer side of the two fork portions for transmitting a driving force provided by the polishing wheel driving portion to the polish
  • the conductive slip ring is a disc-type conductive slip ring.
  • the base of the polishing wheel is made of a metal material, and an outer surface of the substrate is coated with an elastic polymer material.
  • the present invention also provides a method of polishing a workpiece to be processed using the fork-supported polishing apparatus, comprising the steps of: fixedly connecting the polishing apparatus to an actuator of a machine tool; operating the machine tool a polishing wheel of the polishing device is brought close to the workpiece to be processed; a polishing wheel drive portion is activated to rotate the polishing wheel; a polishing liquid supply portion is activated to supply a polishing liquid to the polishing wheel surface; and the machine tool is driven The polishing apparatus is moved to cause the polishing wheel to polish the workpiece along a predetermined trajectory.
  • the polishing wheel is in contact with or not in contact with the surface of the workpiece to be processed; when the polishing wheel is in contact with the surface of the workpiece to be processed, the polishing removal amount is large; when the polishing wheel is When the surface of the member to be processed is not in contact, the amount of polishing removal is small.
  • the rotational speed of the polishing wheel ranges from 1 to 1000 r/min.
  • the polishing wheel rotates simultaneously with the polishing device, or the polishing wheel rotates while the polishing device does not rotate.
  • the polishing liquid contains particles having a diameter ranging from 0 to 10 ⁇ m.
  • the flow rate of the polishing liquid spray ranges from 10 mL/min to 1 L/min.
  • the polishing apparatus provided in accordance with the present invention has at least one of the following advantageous effects: high support rigidity, compact structure, and cooperation with a numerically controlled machine tool, and additionally, a polishing liquid is supplied during processing instead of a workpiece to be processed and a polishing wheel.
  • the immersion in the polishing liquid is carried out in such a manner as to improve the processing accuracy and make the entire processing process easy to control.
  • Figure 1 is a schematic view of the front side of a polishing apparatus for a fork support according to the present invention
  • Figure 2 is a schematic illustration of the side of a polishing apparatus for a forked support in accordance with the present invention. detailed description
  • Figure 1 is a fork support according to the present invention.
  • Fig. 2 is a schematic view of the side of the polishing apparatus of the fork type support according to the present invention.
  • the fork-supporting polishing apparatus comprises: a connecting member 1, a fork support 2, a polishing wheel 3, a polishing wheel drive portion 4, a polishing wheel drive a portion 5 and a polishing liquid supply portion 6, wherein the connecting member 1 is for fixing the polishing device to an actuator of the machine tool, and the connecting member 1 is fixedly coupled to the fork supporting member 2; the fork supporting member 2 having two fork portions 21 extending in a vertical direction, between the ends of the two fork portions 21 adjacent to the connecting member 1 being provided with a horizontal extending portion 22; the polishing wheel 3 is disposed on the two forks Between the portions 21, and at the end of the two fork portions 21 away from the connecting member 1, for actuating the surface of the workpiece to be processed (not shown), and performing a polishing operation on the surface of the workpiece; The polishing wheel driving portion 4 is disposed between the two fork portions 21 for providing a driving force for driving the rotation of the polishing
  • the end of the pipe is connected to the inner hole of the machine tool spindle to ensure the supply and control of the polishing liquid.
  • a conductive slip ring 7 is also included, and a conductive slip ring 7 is disposed between the connecting member 1 and the fork support 2.
  • the conductive slip ring 7 is a disc-type conductive slip ring.
  • the connector 1 can be fixedly coupled to the fork support 2 by means of a flange.
  • the disc-type conductive slip ring may include an upper disc and a lower disc, and the upper disc and the lower disc have a hole therebetween. The axial length can be reduced by using the conductive slip ring 2, and the conductive slip ring can ensure good contact between the motor and the external controller power line and signal line when the polishing device rotates.
  • the connector 2 can be any type of taper shank that is connected to the machine tool or can be an interface member that is connected to other devices.
  • the machine tool spindle drives the entire polishing device to rotate through the connecting piece.
  • the polishing wheel drive portion 4 may be a motor that is fixedly coupled to the fork support member 2 between the two fork portions 21 via the motor base 41.
  • DC geared motor with encoder and external controller For speed closed-loop control, the external controller can also be connected to the machine's control system so that the two are coordinated.
  • a buffing wheel driving portion 5 is disposed outside the two fork portions 21 for transmitting a driving force supplied from the buffing wheel driving portion 4 to the buffing Round 3.
  • the output shaft of the polishing wheel drive unit 4 is connected to the same wheel 51, and the same wheel 51 drives the same belt 52, thereby driving the same wheel 53 to rotate, and the same wheel 53 rotates the polishing wheel 3 toward the mating shaft 54.
  • the polishing liquid supply portion 6 includes a head 61 which sprays a polishing liquid onto the polishing wheel 3, and which does not affect the supply of the polishing liquid when the polishing device is rotated.
  • the polishing liquid may be ejected in different forms, for example, concentrated, dispersed, misted, etc., and the spray position may be the upper portion, the side portion, or the position near the bottom of the buffing wheel 3.
  • the base of the polishing wheel 3 is made of a metal material, and an outer surface of the substrate is coated with an elastic polymer material.
  • the surface of the elastic polymer material may be a smooth surface or a grain.
  • the polishing wheel 3 is formed by taking the middle portion of the sphere, and those skilled in the art can also set different types of polishing wheels according to actual needs.
  • a method of polishing a workpiece to be processed using the fork-supported polishing apparatus comprising the steps of: fixedly connecting the polishing apparatus to a machine tool actuator; operating the machine tool a polishing wheel of the polishing device is brought close to the workpiece to be processed; a polishing wheel drive portion is activated to rotate the polishing wheel; a polishing liquid supply portion is activated to supply a polishing liquid to the polishing wheel surface; and the machine tool is driven The polishing apparatus is moved to cause the polishing wheel to polish the workpiece along a predetermined trajectory.
  • the polishing wheel is in contact with or not in contact with the surface of the workpiece to be processed; when the polishing wheel is in contact with the surface of the workpiece to be processed, the polishing removal amount is large; when the polishing wheel is When the surface of the member to be processed is not in contact, the amount of polishing removal is small.
  • the gap between the polishing wheel 3 and the surface to be machined can be adjusted. The smaller the gap is, the larger the amount of removal is. In the roughing stage, the two can be brought into contact, so that the polishing removal amount is large. In the finishing stage, You can keep the two out of contact.
  • the rotation speed of the polishing wheel ranges from l-1000r/mm. In the case where the distance between the polishing wheel and the surface of the workpiece to be processed is constant, the higher the rotation speed, the faster the removal.
  • the polishing wheel and the polishing device can rotate simultaneously, or the polishing wheel rotates The polishing device does not rotate.
  • the rotational speed of the polishing apparatus ranges from 1 to 300 r/mm.
  • the polishing liquid may be water-based or oil-based, which is a suspension containing fine particles inside.
  • the flow rate of the polishing liquid spray is in the range of 10 mL/min to 1 L/min.
  • the polishing liquid contains particles having a diameter ranging from 0 to 10 ⁇ ⁇ ⁇ .
  • a polishing liquid having a particle diameter ranging from 0.1 to 10 ⁇ can be selected to obtain a large removal rate, and a polishing liquid having a particle diameter ranging from 0.005 to 0.1 ⁇ can be selected in the finishing stage. To ensure good surface quality.
  • the workpiece when the polishing operation is performed, the workpiece can be roughly processed first, and then the parameters mentioned above are adjusted, the workpiece is finished, the parameters are adjusted again, and the workpiece is superfinished.
  • the amount of surface material removal of the workpiece to be processed is related to the rotational speed of the polishing wheel, the distance between the polishing wheel and the workpiece to be processed, and the size and shape of the particles of the polishing liquid.
  • the following test piece is selected as the workpiece to be machined: a convex mirror with a diameter of 200 mm and a radius of curvature of 300 mm.
  • Roughing according to the above method using a polishing liquid with a particle size of 2 ⁇ m, the rotation speed of the polishing wheel is 400 r/min, the rotation speed of the polishing device is 180 r/min, and the distance between the working surface of the polishing wheel and the surface of the workpiece to be processed is lm.
  • the surface accuracy is 1/10 ⁇ PV and the roughness is 2 nm RMS.
  • polishing wheel rotation speed 800 r/min
  • rotation speed of the device 180 r/min
  • the distance between the polishing wheel working surface and the surface of the workpiece to be machined is 5 ⁇ .
  • the surface accuracy is 1/20 ⁇ PV and the roughness is 0.4 nm RMS.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

一种叉式支撑的抛光装置，包括连接件（1）、叉式支撑件（2）、抛光轮（3）、抛光轮驱动部（4）、抛光轮传动部（5）以及抛光液供给部（6），叉式支撑件具有沿竖直方向延伸的两个叉部（21），两个叉部的邻近所述连接件的端部之间设置有水平延伸部（22）；抛光轮设置于两个叉部之间，并且位于两个叉部的远离所述连接件的端部，其用于作用待加工件表面，对待加工件表面进行抛光操作，该抛光装置的支撑刚度高，结构紧凑。

Description

一种叉式支撑的抛光装置 技术领域
本发明涉及一种叉式支撑的抛光装置，其用于对被抛光表面进行抛光 处理。 背景技术
在光学加工领域，需要对光学元件进行抛光处理，技术人员提出了一 种弹性发射加工 （Elastic Emission Machining, EEM) 的加工方法。
但是采用该加工方法的现有的装置尺寸大，不利于与机床配合加工复 杂工件，以及现有技术中的装置和方法都是将待加工件以及抛光轮浸入在 抛光液中进行加工，加工中落下的材料与抛光液混合，不利于对抛光精度 的控制以及加工过程不易观察。 发明内容
为了解决上述问题的至少一个方面，本发明提出一种叉式支撑的抛光 装置， 一方面， 其结构紧凑， 利于与机床配合， 另一方面， 其采用在加工 过程供给抛光液而不是将待加工件以及抛光轮浸入在抛光液中的方式进 行， 从而提高加工精度， 并且使整个加工过程易于控制。
具体地， 根据本发明的叉式支撑的抛光装置， 其包括： 连接件、 叉 式支撑件、 抛光轮、 抛光轮驱动部、 抛光轮传动部以及抛光液供给部， 其 中，连接件用于将所述抛光装置固定至机床的执行机构，所述连接件与所 述叉式支撑件固定连接； 所述叉式支撑件具有沿竖直方向延伸的两个叉 部，所述两个叉部的邻近所述连接件的端部之间设置有水平延伸部；所述 抛光轮设置于所述两个叉部之间，并且位于所述两个叉部的远离所述连接 件的端部， 其用于作用待加工件表面， 对待加工件表面进行抛光操作； 所 述抛光轮驱动部设置于所述两个叉部之间，用于提供驱动抛光轮旋转的驱 动力；所述抛光轮传动部设置于所述两个叉部的外侧，用于将所述抛光轮 驱动部提供的驱动力传递至所述抛光轮;所述抛光液供给部利用设置于所 述连接件以及叉式支撑件内部的管路将抛光液提供至所述抛光轮。 优选地， 还包括导电滑环， 所述导电滑环设置于所述连接件与所述 叉式支撑件之间。
优选地， 所述导电滑环为盘式导电滑环。
优选地， 所述抛光轮的基底由金属材料制成， 在所述基底外部包覆 有弹性高分子材料。
另外一个方面， 本发明还提供了利用所述的叉式支撑的抛光装置对 待加工件进行抛光的方法，其包括如下歩骤：将所述抛光装置与机床的执 行机构固定连接；操作所述机床， 以使所述抛光装置的抛光轮靠近待加工 件； 启动抛光轮驱动部， 以使所述抛光轮旋转； 启动抛光液供给部， 向所 述抛光轮表面提供抛光液；操作所述机床带动所述抛光装置运动， 以使所 述抛光轮沿预定轨迹对待加工件进行抛光。
优选地， 在加工过程， 所述抛光轮与所述待加工件的表面接触或者 不接触； 当所述抛光轮与所述待加工件的表面接触时， 抛光去除量大； 当 所述抛光轮与所述待加工件的表面不接触时， 抛光去除量小。
优选地， 所述抛光轮的转速的范围为 l-1000r/min。
优选地， 所述抛光轮与所述抛光装置同时旋转， 或者所述抛光轮旋 转而所述抛光装置不旋转。
优选地， 所述抛光液所含的颗粒的直径范围为 0-10 μ m。
优选地， 抛光液喷淋的流量的范围为 10mL/min-lL/min。
根据本发明所提供的抛光装置具有如下有益效果的至少一个方面： 其支撑刚度高， 结构紧凑， 利于与数控机床配合， 另外， 其采用在加工过 程供给抛光液而不是将待加工件以及抛光轮浸入在抛光液中的方式进行， 从而提高加工精度， 并且使整个加工过程易于控制。 附图说明
图 1为根据本发明的叉式支撑的抛光装置正面的示意图；
图 2为根据本发明的叉式支撑的抛光装置侧面的示意图。 具体实施方式
下面结合附图对本发明进行具体说明：图 1为根据本发明的叉式支撑 的抛光装置正面的示意图，图 2为根据本发明的叉式支撑的抛光装置侧面 的示意图。
如图 1 所示， 根据本发明的一个优选的实施方式， 该叉式支撑的抛 光装置， 其包括： 连接件 1、 叉式支撑件 2、 抛光轮 3、 抛光轮驱动部 4、 抛光轮传动部 5以及抛光液供给部 6， 其中， 连接件 1用于将所述抛光装 置固定至机床的执行机构， 所述连接件 1与所述叉式支撑件 2固定连接; 所述叉式支撑件 2具有沿竖直方向延伸的两个叉部 21， 所述两个叉部 21 的邻近所述连接件 1的端部之间设置有水平延伸部 22; 抛光轮 3设置于 所述两个叉部 21之间， 并且位于所述两个叉部 21 的远离所述连接件 1 的端部， 其用于作用待加工件（附图未示出）表面， 对待加工件表面进行 抛光操作； 所述抛光轮驱动部 4设置于所述两个叉部 21之间， 用于提供 驱动抛光轮 3旋转的驱动力； 所述抛光轮传动部 5设置于所述两个叉部 21的外侧，用于将所述抛光轮驱动部 4提供的驱动力传递至所述抛光轮 3 ; 所述抛光液供给部 6 利用设置于所述连接件以及叉式支撑件内部的管路 将抛光液提供至所述抛光轮 3。如图 1和图 2所示，由于管路设置在内部， 从而所述抛光装置整体旋转时不会影响到抛光液的供给。
另外， 所述管路的端部与机床主轴内孔相连， 以保证抛光液的供给 和控制。
如图 1所示， 根据本发明的优选的实施方式， 还包括导电滑环 7， 导 电滑环 7设置于所述连接件 1与所述叉式支撑件 2之间。优选地，导电滑 环 7为盘式导电滑环。连接件 1可以利用法兰与所述叉式支撑件 2固定连 接。 根据本发明的优选的实施方式， 盘式导电滑环可以包括上盘和下盘， 并且所述上盘和下盘中间具有孔。利用导电滑环 2可以减小轴向长度，导 电滑环可以在所述抛光装置旋转时，保证电机与外界控制器动力线和信号 线的良好接触。
所述连接件 2 可以为与机床相连接的各类锥柄或者也可以是与其他 装置相连接的接口件。 机床主轴通过连接件带动整个抛光装置旋转。
根据本发明的优选的实施方式， 如图 1所示， 抛光轮驱动部 4可以 为电机， 其通过电机座 41在两个叉部 21之间固定连接至叉式支撑件 2 上， 电机可以选用直流减速电机并且配有编码器，利用外部控制器对电机 进行速度闭环控制，也可以将外部控制器与机床的控制系统相连接， 以使 两者被协同控制。
如图 1和 2所示， 根据本发明的抛光轮驱动部 5， 其设置于所述两个 叉部 21的外侧， 用于将所述抛光轮驱动部 4提供的驱动力传递至所述抛 光轮 3。 具体的， 如图 1和 2所示， 所述抛光轮驱动部 4的输出轴与同歩 轮 51连接， 同歩轮 51带动同歩带 52， 从而带动同歩轮 53旋转， 与同歩 轮 53向配合的轴 54带动抛光轮 3旋转。
如图 1和 2所示， 所述抛光液供给部 6包括喷头 61， 喷头 61将抛光 液喷到抛光轮 3上，并且，在所述抛光装置旋转时不会影响抛光液的供给。 其中， 抛光液可以以不同的形式喷出， 例如， 集中式、 分散式、 雾状等， 以及喷淋位置可以是抛光轮 3的上部、 侧部或者靠近底部的位置。
根据本发明优选的实施方式， 抛光轮 3 的基底由金属材料制成， 在 所述基底外部包覆有弹性高分子材料。所述弹性高分子材料的表面可以是 光滑的表面， 也可以带有纹路。如图 1所示， 抛光轮 3为球体截取中间部 分而成， 本领域技术人员也可以根据实际需要设置不同形式的抛光轮。
根据本发明的另外一个方面， 提供了利用所述的叉式支撑的抛光装 置对待加工件进行抛光的方法，其包括如下歩骤：将所述抛光装置与机床 执行机构固定连接；操作所述机床， 以使所述抛光装置的抛光轮靠近待加 工件； 启动抛光轮驱动部， 以使所述抛光轮旋转； 启动抛光液供给部， 向 所述抛光轮表面提供抛光液；操作所述机床带动所述抛光装置运动， 以使 所述抛光轮沿预定轨迹对待加工件进行抛光。
其中， 在加工过程中， 所述抛光轮与所述待加工件的表面接触或者 不接触； 当所述抛光轮与所述待加工件的表面接触时， 抛光去除量大； 当 所述抛光轮与所述待加工件的表面不接触时， 抛光去除量小。 换句话说， 抛光轮 3与待加工表面之间的间隙可以调整， 间隙越小去除量越大，在粗 加工阶段， 可以使两者接触， 从而使抛光去除量较大， 在精加工阶段， 可 以使两者不接触。
其中， 所述抛光轮的转速的范围为 l-1000r/mm。 当所述抛光轮与所 述待加工件的表面距离不变的情况下， 转速越高， 去除越快。
所述抛光轮与所述抛光装置可以同时旋转， 或者所述抛光轮旋转而 所述抛光装置不旋转。 所述抛光装置的转速的范围为 l-300r/mm。
根据本发明的优选的实施方式， 抛光液可以是水基的， 也可以是油 基的， 其为内部含有微小颗粒的悬浮液。优选的， 抛光液喷淋的流量的范 围为 10mL/min-lL/min。
根据本发明的优选的实施方式， 以及实际抛光的参数要求， 所述抛 光液所含的颗粒的直径范围为 0-10 μ πΐ。优选地， 在粗加工阶段可以选用 颗粒的直径范围在 0.1-10 μ πΐ的抛光液， 以获得较大的去除率， 在精加工 阶段可以选用颗粒的直径范围在 0.005-0.1 μ πι 的抛光液， 以保证良好的 表面质量。
根据本发明的方法， 进行抛光操作时， 可以先对待加工件进行粗加 工，再调整诸如上述提及的参数，对待加工件进行精加工，再次调整参数， 对待加工件进行超精加工。这里，待加工件的表面材料去除量与抛光轮的 转速、抛光轮与待加工件之间的距离以及抛光液的颗粒的大小、形状都有 关系。
加工示例， 选取如下测试工件作为待加工件： 直径 200mm且曲率半 径为 300mm的凸面镜。 根据上述方法进行粗加工， 使用粒径为 2 μ m的 抛光液， 抛光轮转速 400r/min， 抛光装置旋转速度为 180r/min， 抛光轮工 作面与待加工件表面之间的距离为 l m， 可获得面形精度为 1/10 λ PV, 粗糙度为 2nm RMS。 根据上述方法进行精加工， 使用粒径为 50nm的抛 光液， 抛光轮转速 800r/min， 装置旋转速度为 180r/min， 抛光轮工作面与 待加工件表面之间的距离为 5 μ πι, 可获得面形精度为 1/20 λ PV, 粗糙 度为 0.4nm RMS。
尽管已经示出和描述了本发明的实施例， 对于本领域的普通技术人 员而言，可以理解在不脱离本发明的原理和精神的情况下可以对这些实施 例进行变化， 本发明的范围由所附权利要求及其等同物限定。

Claims

权 利 要 求
1. 一种叉式支撑的抛光装置， 其包括：
连接件、 叉式支撑件、 抛光轮、 抛光轮驱动部、 抛光轮传动部以及 抛光液供给部，
其中， 连接件用于将所述抛光装置固定至机床的执行机构， 所述连 接件与所述叉式支撑件固定连接；
所述叉式支撑件具有沿竖直方向延伸的两个叉部， 所述两个叉部的 邻近所述连接件的端部之间设置有水平延伸部；
所述抛光轮设置于所述两个叉部之间， 并且位于所述两个叉部的远 离所述连接件的端部，其用于作用待加工件表面，对待加工件表面进行抛 光操作；所述抛光轮驱动部设置于所述两个叉部之间，用于提供驱动抛光 轮旋转的驱动力；所述抛光轮传动部设置于所述两个叉部的外侧，用于将 所述抛光轮驱动部提供的驱动力传递至所述抛光轮；
所述抛光液供给部利用设置于所述连接件以及叉式支撑件内部的管 路将抛光液提供至所述抛光轮。
2. 根据权利要求 1所述的抛光装置， 还包括导电滑环， 所述导电滑 环设置于所述连接件与所述叉式支撑件之间。
3. 根据权利要求 2所述的抛光装置， 其中， 所述导电滑环为盘式导 电滑环。
4. 根据权利要求 1所述的抛光装置， 其中， 所述抛光轮的基底由金 属材料制成， 在所述基底外部包覆有弹性高分子材料。
5. 一种利用权利要求 1所述的叉式支撑的抛光装置对待加工件进行 抛光的方法， 其包括如下歩骤：
将所述抛光装置与机床的执行机构固定连接； 操作所述机床， 以使所述抛光装置的抛光轮靠近待加工件； 启动抛光轮驱动部， 以使所述抛光轮旋转；
启动抛光液供给部， 向所述抛光轮表面提供抛光液；
操作所述机床带动所述抛光装置运动， 以使所述抛光轮沿预定轨迹 对待加工件进行抛光。
6. 根据权利要求 5所述的方法， 其中， 在加工过程中， 所述抛光轮 与所述待加工件的表面接触或者不接触；
当所述抛光轮与所述待加工件的表面接触时， 抛光去除量大； 当所述抛光轮与所述待加工件的表面不接触时， 抛光去除量小。
7. 根据权利要求 5所述的方法， 其中， 所述抛光轮的转速的范围为 l-1000r/min。
8. 根据权利要求 5所述的方法， 其中， 所述抛光轮与所述抛光装置 同时旋转， 或者所述抛光轮旋转而所述抛光装置不旋转。
9. 根据权利要求 5所述的方法， 其中， 所述抛光液所含的颗粒的直 径范围为 0-10 μ πΐ。
10. 根据权利要求 5所述的方法， 其中， 抛光液喷淋的流量的范围为 1 OmL/ min- 1 L/ min。
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WO2016042464A1 (en) * 2014-09-16 2016-03-24 Ancora S.P.A. Machinery for the machining of ceramic articles
CN106002521A (zh) * 2016-07-19 2016-10-12 苏州誉衡昌精密机械有限公司 一种自动抛光轮机构
CN110064997A (zh) * 2019-06-05 2019-07-30 中国工程物理研究院机械制造工艺研究所 用于薄壁异形曲面的磁致固态流变效应抛光装置及方法

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CN1899764A (zh) * 2005-07-22 2007-01-24 伊姆比钻石技术有限公司 抛光装置
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CN1486821A (zh) * 2003-08-22 2004-04-07 清华大学 电磁方式磁流变抛光头
CN1899764A (zh) * 2005-07-22 2007-01-24 伊姆比钻石技术有限公司 抛光装置
CN101058163A (zh) * 2007-05-22 2007-10-24 江南大学 曲面砂带磨削柔性磨轮
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016042464A1 (en) * 2014-09-16 2016-03-24 Ancora S.P.A. Machinery for the machining of ceramic articles
CN106002521A (zh) * 2016-07-19 2016-10-12 苏州誉衡昌精密机械有限公司 一种自动抛光轮机构
CN110064997A (zh) * 2019-06-05 2019-07-30 中国工程物理研究院机械制造工艺研究所 用于薄壁异形曲面的磁致固态流变效应抛光装置及方法

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