WO2013089492A1 - Module de dissipation de chaleur pour un composant électronique, et liquide de dissipation de chaleur utilisé dans celui-ci - Google Patents

Module de dissipation de chaleur pour un composant électronique, et liquide de dissipation de chaleur utilisé dans celui-ci Download PDF

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Publication number
WO2013089492A1
WO2013089492A1 PCT/KR2012/010924 KR2012010924W WO2013089492A1 WO 2013089492 A1 WO2013089492 A1 WO 2013089492A1 KR 2012010924 W KR2012010924 W KR 2012010924W WO 2013089492 A1 WO2013089492 A1 WO 2013089492A1
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WO
WIPO (PCT)
Prior art keywords
heat
electronic component
heat dissipation
particles
housing
Prior art date
Application number
PCT/KR2012/010924
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English (en)
Korean (ko)
Inventor
임경준
이진숙
Original Assignee
주식회사 지앤씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 지앤씨 filed Critical 주식회사 지앤씨
Publication of WO2013089492A1 publication Critical patent/WO2013089492A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Definitions

  • the present invention relates to an electronic component heat dissipation module for cooling heat of an electronic component that generates heat, and a heat dissipation liquid used therein.
  • the present invention has been made to solve the above-described problem, and is to provide an electronic component heat dissipation module and a heat dissipation liquid that can be used to increase the heat dissipation efficiency by extending the heat dissipation efficiency by employing an efficient liquid cooling method. .
  • An electronic component heat dissipation module for solving the above problems, the housing having a liquid sealing structure; A substrate on which a heating electronic component inserted into the housing is installed, and a heat dissipation dispersion insulating liquid inserted into the housing and cooling the heat generated from the heating electronic component including an insulating liquid and thermally conductive particles.
  • the electronic component heat dissipation module may further include a heat tank unit attached to one surface of the housing for dissipating heat from the heat dissipation dispersion insulating liquid to the outside.
  • the thermally conductive particles may include one of purified carbon nanotube particles, amorphous carbon nanotube particles, graphite particles, ceramic particles, and graphene particles.
  • the insulating liquid may include propylene glycol and ultrapure water.
  • the insulating liquid may include a surfactant for dissolving the thermally conductive particles.
  • the insulating liquid may include one of lubricating oil, silicone oil, minarel oil, olive oil, corn oil, and soybean oil.
  • a guide groove for fixing the substrate may be installed inside the housing.
  • the thermally conductive particles may be magnetic particles.
  • the electronic component heat dissipation module may further include an electromagnetic stirrer provided on the substrate and configured to convex the thermally conductive particles.
  • the electromagnetic stirrer may be an eddy coil or a toroidal magnetic coil.
  • the heat dissipation dispersion insulating liquid which is another embodiment of the present invention, may be used in the above-described electronic component heat dissipation module.
  • the thermally conductive particles of the insulating liquid is included, the heat conduction rate of the heat generated from the heat generating electronic components to increase the cooling efficiency to increase the cooling efficiency, thereby deteriorating the electronic components by heat Or it can be prevented from being damaged.
  • thermally conductive particles are magnetic, and by installing an electromagnetic stirrer inside the housing to allow the insulating liquid to convection, it is possible to maximize the cooling effect on the heat generated from the heat generating electronic component.
  • FIG. 1 is a partially exploded perspective view of an electronic component heat dissipation module according to the present invention.
  • FIG. 2 is a cross-sectional view of an electronic component heat dissipation module according to the present invention.
  • the present invention discloses a configuration for cooling the circuit board when the heating electronic component is mounted on the circuit board, it should be understood that the present invention is not limited thereto and may be applied to various electronic products in which heat generation is problematic. .
  • FIG. 1 is a partially exploded perspective view of an electronic component heat dissipation module according to the present invention
  • FIG. 2 is a cross-sectional view of the electronic component heat dissipation module according to the present invention.
  • an electronic component heat dissipation module 100 may include a circuit board including a housing 10 and an electronic component 21 installed in the housing 10. 20, a heat dissipating insulation 30 filled in the housing 10, an electromagnetic stirrer 40 installed in the housing 10, and a heat tank 50 attached to one surface of the housing 10. can do.
  • the housing 10 may be formed in a liquid sealing structure, and the inside of the housing 10 may be filled so that the heat-dissipating dispersion 30 described later does not leak.
  • at least a part of the housing 10, that is, the portion to which the heat tank part 50 is attached, is made of a material having high thermal conductivity such as metal, thereby improving heat dissipation efficiency.
  • the guide part 11 is installed in the housing 10, and the circuit board 20 described later may be fixed to the guide groove formed by the guide part 11.
  • the circuit board 20 is a component installed in the housing 10, and the electronic component 21 for dissipating heat is installed thereon.
  • this electronic component 21 operates, electrical energy is converted into thermal energy, and heat generation occurs. Heat generated in the electronic component 21 is conducted to the heat radiation insulating dispersion 30 described later.
  • the heat dissipation insulating dispersion 30 is a substance in which thermally conductive particles (or magnetic particles) are added to the insulating liquid, and functions to absorb and release heat generated when the heat generating part is turned on.
  • Insulating liquid is a liquid which is impossible to conduct electricity because its electric conductivity is 0. It contains ultra pure water (DI water), propylene glycol, which contains no ionic components, transformer oil, lubricating oil, silicone oil, minarel Oil, olive oil, corn oil, soybean oil.
  • Ultrapure water is pure water without any impurities except ions formed by removing all ions dissolved in the water and self-ionizing the water. There is no electrical conductivity.
  • Propylene glycol is a material having excellent solubility, and thermally conductive particles described later are dissolved by this propylene glycol, and are environmentally friendly materials in that they are transparent and non-toxic.
  • the surfactant is added to the heat dissipation insulation dispersion 30, it is possible to further increase the solubility of the thermally conductive particles. At this time, it is sufficient that the surfactant is contained in a small amount of less than 1% by weight.
  • the heat dissipation dispersion 30 contains thermally conductive particles, so that the effects of heat absorption and discharge can be increased.
  • the thermally conductive particles may include one of amorphous carbon nanotube particles, purified nanotubes, graphite particles, ceramic particles, and graphene particles.
  • the carbon nanotube particles one of single wall carbon nanotube particles, double wall carbon nanotube particles, and multiwall carbon nanotubes may be used.
  • the carbon nanotubes are carbon nanotubes in the pre-purification step of the manufacturing process, and have magnetic properties because a catalyst for growing the carbon nanotubes remains.
  • the thermally conductive particles are magnetic, they are acted by an electromagnetic stirrer 40 to be described later, and convection occurs in the dispersion 30 to maximize the heat dissipation effect.
  • the electromagnetic stirrer 40 is installed in the housing 10 to form a magnetic field so that the thermally conductive particles, which are the magnetic bodies, can convection.
  • the electromagnetic stirrer 40 may be installed on the substrate 20.
  • a current is supplied to the electromagnetic stirrer 40, a magnetic field is formed according to the ampere law, and the thermally conductive particles, which are magnetic materials of the heat dissipation insulating dispersion 30, are convection according to the magnetic field.
  • the insulating liquid is also convection due to the tension formed between the particles and the insulating liquid. As a result, the heat generated from the heat generating electronic component 21 is more effectively absorbed and conducted into the heat dissipation liquid.
  • an eddy coil or a toroidal magnetic coil may be used as the electromagnetic stirrer 40.
  • the eddy coil is a low speed type and the toroidal magnetic coil is a high speed type, which can be appropriately selected by the manufacturer according to the degree of heat generation.
  • the heat tank unit 50 is attached to one surface of the housing 10 and is a component for dissipating heat from the heat dissipating insulation dispersion 30 to the outside.
  • the heat tank unit 50 may be made of a metal having high thermal conductivity such as copper, and heat generated in the electronic component 21 is finally discharged to the outside by air flowing through the grooves of the heat tank unit 50. (Air cooled).
  • this heat tank part 50 it can prevent rising to the insulating dispersion liquid 30 in the housing 10 more than a predetermined temperature, and it becomes possible to maintain cooling oil steadily.
  • one surface of the housing 10 in contact with the heat tank 50 may be formed of a metal such as copper or aluminum having high thermal conductivity.
  • the heat generated by the operation of the electronic component 21 mounted on the circuit board 20 is transferred to the insulating liquid containing the thermally conductive particles, thereby generating heat
  • the electronic component 21 is cooled.
  • the thermally conductive particles are magnetic materials
  • the electromagnetic stirrer 40 is further installed in the housing 10, and the insulating liquid is convexed by the electromagnetic stirrer 40, so that the efficiency of liquid cooling can be further increased. do.
  • the thermally conductive particles of the insulating liquid is included, the heat conduction rate of heat generated in the heat generating electronic components to increase the cooling efficiency to increase the cooling efficiency, thereby deteriorating the electronic components by heat Or it can be prevented from being damaged.
  • thermally conductive particles are magnetic, and by installing an electromagnetic stirrer inside the housing to allow the insulating liquid to convection, it is possible to maximize the cooling effect on the heat generated from the heat generating electronic component.
  • the electronic component heat dissipation module described above and the heat dissipation insulation dispersion used therein are not limited to the configuration and method of the above-described embodiments, but the embodiments may be modified in various ways so that various modifications may be made. Or some may be selectively combined.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne un module de dissipation de chaleur pour des composants électroniques, et un liquide d'isolation de dispersion de dissipation de chaleur utilisé dans celui-ci, le module comprenant : un boîtier qui a une structure de scellement étanche aux liquides ; un substrat qui est monté avec un composant électronique générant de la chaleur inséré dans le boîtier ; et un liquide d'isolation de dispersion de dissipation de chaleur qui est introduit dans le boîtier et comprend un liquide d'isolation et des particules thermoconductrices pour réduire la chaleur générée à partir du composant électronique générant de la chaleur.
PCT/KR2012/010924 2011-12-14 2012-12-14 Module de dissipation de chaleur pour un composant électronique, et liquide de dissipation de chaleur utilisé dans celui-ci WO2013089492A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110134102A KR101336987B1 (ko) 2011-12-14 2011-12-14 전자 부품 방열 모듈 및 이에 사용되는 방열액
KR10-2011-0134102 2011-12-14

Publications (1)

Publication Number Publication Date
WO2013089492A1 true WO2013089492A1 (fr) 2013-06-20

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PCT/KR2012/010924 WO2013089492A1 (fr) 2011-12-14 2012-12-14 Module de dissipation de chaleur pour un composant électronique, et liquide de dissipation de chaleur utilisé dans celui-ci

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KR (1) KR101336987B1 (fr)
WO (1) WO2013089492A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102199248B1 (ko) 2013-12-02 2021-01-06 엘지이노텍 주식회사 방열 장치 및 차량용 조명장치
EP3685642A4 (fr) * 2017-09-20 2021-07-28 Liquidcool Solutions, Inc. Systèmes et dispositifs électroniques refroidis par immersion dans un liquide

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008098584A (ja) * 2006-10-16 2008-04-24 Fuji Electric Device Technology Co Ltd 半導体装置
KR20090015472A (ko) * 2007-08-08 2009-02-12 임정연 전자제품의 밀폐구조 및 이를 이용한 ｌｅｄ 투광기
JP2009147312A (ja) * 2007-11-20 2009-07-02 Nanoteco Corp 白色ｌｅｄ装置およびその製造方法
KR20110004857A (ko) * 2008-04-21 2011-01-14 하드코어 컴퓨터, 인크. 전자장치 어레이의 액체 잠김 냉각형 케이스 및 랙 시스템

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3506050B2 (ja) 1999-03-26 2004-03-15 トヨタ自動車株式会社 発熱素子の冷却装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008098584A (ja) * 2006-10-16 2008-04-24 Fuji Electric Device Technology Co Ltd 半導体装置
KR20090015472A (ko) * 2007-08-08 2009-02-12 임정연 전자제품의 밀폐구조 및 이를 이용한 ｌｅｄ 투광기
JP2009147312A (ja) * 2007-11-20 2009-07-02 Nanoteco Corp 白色ｌｅｄ装置およびその製造方法
KR20110004857A (ko) * 2008-04-21 2011-01-14 하드코어 컴퓨터, 인크. 전자장치 어레이의 액체 잠김 냉각형 케이스 및 랙 시스템

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Publication number Publication date
KR101336987B1 (ko) 2013-12-16
KR20130067500A (ko) 2013-06-25

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