WO2013087632A1 - Appareil de commande à structure sacrificielle - Google Patents

Appareil de commande à structure sacrificielle Download PDF

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Publication number
WO2013087632A1
WO2013087632A1 PCT/EP2012/075095 EP2012075095W WO2013087632A1 WO 2013087632 A1 WO2013087632 A1 WO 2013087632A1 EP 2012075095 W EP2012075095 W EP 2012075095W WO 2013087632 A1 WO2013087632 A1 WO 2013087632A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
integrated circuit
sacrificial structure
circuit device
control device
Prior art date
Application number
PCT/EP2012/075095
Other languages
German (de)
English (en)
Inventor
Jan Keller
Thomas Riepl
Original Assignee
Continental Automotive Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive Gmbh filed Critical Continental Automotive Gmbh
Priority to DE112012005171.8T priority Critical patent/DE112012005171B4/de
Priority to CN201280061493.9A priority patent/CN104145534B/zh
Priority to US14/364,765 priority patent/US10206275B2/en
Publication of WO2013087632A1 publication Critical patent/WO2013087632A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0275—Security details, e.g. tampering prevention or detection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/86—Secure or tamper-resistant housings
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/86—Secure or tamper-resistant housings
    • G06F21/87—Secure or tamper-resistant housings by means of encapsulation, e.g. for integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2221/00—Indexing scheme relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F2221/21—Indexing scheme relating to G06F21/00 and subgroups addressing additional information or applications relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F2221/2101—Auditing as a secondary aspect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Definitions

  • Control unit with sacrificial structure The invention relates to a control unit.
  • the invention further relates to a vehicle with a control unit.
  • the invention also relates to a method for detecting a manipulation of a control device.
  • Patent Application No. 102011088216.2 the disclosure of which is hereby incorporated by reference.
  • tuning usually refers to an individual change in an appearance, a performance or another
  • Circuit devices of the engine control unit changed and / or replaced and / or removed.
  • This type of tuning is also known as chip tuning.
  • tuning, in particular chip tuning is performed by third parties that are not approved and / or licensed by the manufacturer of the device.
  • any change in a component of a device may affect a life expectancy and / or reliability of the altered component of the device and / or the entire device.
  • a change to a controller may affect the life expectancy and / or reliability of a component that is controlled by the controller.
  • the invention has for its object to improve detection of manipulation of a control unit.
  • a control device in particular a motor control device, is specified, wherein the control device has a substrate with an electrically conductive structure, an integrated circuit device and a sacrificial structure on the substrate.
  • the integrated circuit device is electrically conductively mounted on the substrate.
  • the sacrificial structure is arranged to be irreversibly destroyed when the integrated circuit device is disassembled from the substrate.
  • the electrically conductive structure has at least one conductor track applied to and / or in the substrate.
  • the substrate having the electrically conductive structure may be a printed circuit board (PCB).
  • the electrically conductive structure can also have a base which is suitable for being integrated Circuit device and / or a processor and / or a microcontroller exchangeable to mount on the substrate.
  • the integrated circuit device may comprise a microchip and / or a microcontroller and / or a microprocessor, in particular in a housing,
  • the integrated circuit device may comprise a storage medium and / or with a Be connected storage medium, in which the instruction code is stored
  • the storage medium with the microcontroller and / or microprocessor is formed monolithically integrated, i. in particular in and / or on a one-piece
  • an instruction code is implemented in a suitable programming language in the integrated circuit device.
  • the integrated circuit device may be mounted such that the sacrificial structure is located below and / or to the side of the integrated circuit device.
  • Sacrificial structure may be, for example, an assembly of one or more metals.
  • the sacrificial structure may be formed of copper and / or gold and / or silver and / or aluminum.
  • the sacrificial structure may be, for example, a grid and / or a net and / or a foil and / or a scale-like arrangement.
  • the sacrificial structure may also be coated on a surface. For example, the
  • a coating on the surface of the sacrificial structure can be set up as oxidation protection.
  • the coating may have adhesive properties.
  • the sacrificial structure is formed by a portion of the at least one printed conductor applied to the substrate.
  • the section formed as a sacrificial structure having conductor can be used for electrical contacting of the be provided integrated circuit device.
  • the trained as a sacrificial structure portion of the at least one conductor track has, for example, a lattice-shaped, net-like or comb-shaped shape, in particular
  • the sections of the sacrificial structure forming the grid or the mesh or comb have a cross-section which is reduced, for example by at least 50%, preferably by comparison with a cross-section of a further section of the conductor strip adjoining this section by 75% or more.
  • control device has an electrically insulating connection layer - for example a resin layer - which connects the integrated circuit device, the substrate and the sacrificial layer formed portion of the conductor track and by means of which the sacrificial structure during disassembly of the integrated
  • Circuit device is destructible.
  • the connection between the integrated circuit device and the section of the at least one interconnect made as a sacrificial structure by means of the interconnection layer can not be detached non-destructively.
  • the connection of the integrated circuit device to the substrate advantageously reduces the risk of unintentional
  • Damage to the structure of the victim for example due to mechanical stress on the control unit due to vibrations.
  • control units In many modern devices, especially in vehicles, control units have, in addition to control functions, for example, security-related functions. If damage occurs to a component of the device and / or the entire device, under certain circumstances a warranty claim against a manufacturer of the device can be asserted.
  • a manipulation of a control unit can cause damage at a variety of components of the device cause.
  • the safety-related functions of a control device can be lost. It may therefore be an interest of the manufacturer to improperly manipulate and / or
  • Circuit device of the engine control unit remains on a substrate of the engine control unit.
  • the electrically insulating connection layer of the integrated circuit In one embodiment of the control device, the electrically insulating connection layer of the integrated circuit
  • connection layer after installation of the integrated circuit device is particularly easy to apply.
  • the electrically insulating connection layer and the sacrificial structure are in plan view of the substrate - in particular on a main surface of the integrated circuit device carrying the main surface
  • Circuit device particularly difficult dismantled without destroying the sacrificial structure.
  • the at least one conductor track is covered at least in places by a lacquer layer, in particular by a lacquer layer made of a solder resist.
  • the lacquer layer has an opening, by means of which the as
  • the connecting layer fills the opening of the lacquer layer at least partially, so that the Connecting layer in the opening adjacent to the substrate and formed as a sacrificial structure portion of the conductor track.
  • the sacrificial structure is like this
  • a marker in particular an optically and / or electrically and / or haptic perceptible marker left behind.
  • a marker which is visually and / or electrically and / or haptically perceptible is readily perceptible.
  • the marker may already be perceptible to the naked eye.
  • Another possibility may be that the marker is perceptible by means of an electrical measurement.
  • the optically and / or electrically and / or haptically detectable markers make it possible to objectively and simply determine a manipulation of the control unit.
  • the sacrificial structure is designed such that when the sacrificial structure is destroyed, a loss of a function of the control device occurs.
  • a signal line to the integrated circuit device may be interrupted.
  • the loss may relate to a function of the whole controller, so that, for example, the
  • the control unit is, for example, an engine control unit of a vehicle
  • the loss of a function of the control unit can mean that the vehicle can no longer be started.
  • the loss relates to a function of a control section of the controller. This could for example be read out by means of a diagnostic device and / or displayed by means of a warning light.
  • the control unit is, for example, an engine control unit of a vehicle
  • connection layer may be disposed below and / or on at least one side of the integrated circuit device.
  • the connection layer may also be mounted above and / or below the entire integrated circuit device.
  • the bonding layer may, for example, comprise a solid material or consist of a solid material.
  • the solid material may, for example, be brittle or elastic.
  • connection layer may be a liquid material, at least during the production of the connection layer. The liquid material is
  • suitably solidifiable for example, it is a resin such as epoxy resin or silicone resin.
  • the bonding layer has adhesive properties, in particular the bonding layer has an adhesive and / or a resin.
  • an adhesion between the bonding layer and the sacrificial structure is higher than an adhesion between the substrate and the sacrificial structure.
  • the adhesion of the material of the connecting layer is chosen in particular such that when disassembling the integrated
  • Circuit device is destroyed by the substrate at least part of the sacrificial structure.
  • the bonding layer of a material having adhesive properties can also be used for other purposes.
  • another purpose may be to glue two parts together, in particular to glue the integrated circuit device to the substrate.
  • another purpose may be sealing a part.
  • the material of the bonding layer is an organic material.
  • the material for example an organic material, can also be used for other purposes.
  • the material or organic material may be an adhesive.
  • the adhesion of the material of the bonding layer is selected so that in a demounting of the substrate the integrated
  • Circuit device at least part of the sacrificial structure is destroyed.
  • a vehicle is provided with a controller according to one aspect.
  • control unit may be an engine control unit of the vehicle.
  • a method for detecting a manipulation of a control device comprising providing a substrate with an electrically conductive structure, providing an integrated electrically mounted on the substrate
  • a circuit device providing a sacrificial structure on the substrate that is configured to be irreversibly destroyed when the integrated circuit device is disassembled from the substrate, and having a check of the state of the sacrificial structure for detecting the manipulation of the controller. On the basis of the examination of the state of the victim structure, a manipulation of the control device on the basis of the irreversible
  • Destruction of the victim structure can be detected.
  • the examination of the state of the sacrificial structure includes, for example, a measurement of the electrical conductivity of the conductor track, as the Having sacrificial structure formed section. This measurement can be carried out, for example, by the integrated circuit device.
  • the method comprises the formation of an electrically insulating connection layer, which connects the integrated circuit device, the substrate and the section of the conductor track designed as a sacrificial structure, and by means of which the sacrificial structure can be destroyed during disassembly of the integrated circuit device
  • FIG. 1 shows a control device according to a first embodiment
  • Embodiment during a stage of its production in a schematic plan view Embodiment during a stage of its production in a schematic plan view.
  • FIG. 2 shows the finished control device according to the first embodiment in a schematic plan view.
  • FIG. 3 shows a substrate with an electrically conductive structure for a control device according to a further exemplary embodiment in a schematic plan view.
  • FIG. 4 shows a section of the schematic plan view of FIG. 1.
  • FIG. 1 shows a schematic plan view of a control device 100 according to a first exemplary embodiment during a stage of its production.
  • the control device 100 has a substrate 101 with an electrically conductive structure 102.
  • the electrically conductive structure is formed by a plurality of printed conductors 103 applied to the substrate 101.
  • the substrate 101 with the conductor tracks 103 represents, for example, a printed circuit board, for example a printed circuit board.
  • the substrate 101 with the electrically conductive structure 102 also has a sacrificial structure 108.
  • the sacrificial structure 108 is formed by a section of one of the conductor tracks 103.
  • the section formed as sacrificial structure 108 of this trace has a lattice-shaped structure in the present embodiment. In other words, he is out Segments 109 assembled, each having a smaller by at least 50% cross-section than the conductor 103 in a formed on the sacrificial structure 108 section
  • FIG. 4 shows that the conductor tracks in the present exemplary embodiment are provided with a lacquer layer 105 made from a
  • Lötstopplack are covered, wherein at least pads for connecting an integrated circuit device 104 are released.
  • the lacquer layer 105 is omitted in the rest for better representability.
  • the lacquer layer 105 has an opening 1050, so that the printed conductor section 108 formed as a sacrificial structure is largely or completely uncovered by the lacquer layer 105.
  • An integrated circuit device 104 is electrically conductively mounted on the substrate 101 by means of solder connections 106. By means of the solder joints 106 is the integrated
  • Circuit device 104 is also electrically connected to the tracks 1023.
  • the sacrificial structure 108 is arranged in a plan view of a main surface of the substrate 101 laterally next to the integrated circuit device 104.
  • FIG. 2 shows the completed control unit 100 of the first exemplary embodiment.
  • connection layer 110 connects a part of the
  • Circuit device 104 It is covered the
  • Link layer 110 the integrated circuit assembly 104 in plan view of a main surface of the substrate 101 in places and adjacent there to the integrated circuit 104 at. From there, the bonding layer 110 is pulled laterally adjacent to the integrated circuit 104 so as to at least partially fill the opening 1050 and into the opening to the substrate 101 and to the sacrificial structure Section 108 of the conductor 103 adjacent.
  • an adhesion between the material of the connection structure 110 and the sacrificial structure 108 is higher than an adhesion between the substrate 101 and the sacrificial structure 108.
  • FIG. 3 shows a schematic plan view of a substrate 101 with an electrically conductive structure 102 of a control device 100 according to a further exemplary embodiment.
  • Circuit 104 is omitted for simplicity of illustration. Instead, the - in this case, a quadratic - mounting region, which the integrated circuit device 104 covers, is designated by the reference numeral 104 '.
  • some of the conductor tracks 103 run on the surface 101 of the substrate, others run at least in places within the substrate 101.
  • the substrate 101 with an electrically conductive structure 102 is a multilayer one
  • solder joints 106 at least partially laterally adjacent to a body - in particular a housing - the integrated
  • Circuit device 104 are arranged, are the
  • Solder joints 106 in the present case in plan view of a main surface of the substrate 101 of the main body or housing of the integrated circuit device 104 covered.
  • the substrate 101 has a plurality of sacrificial structures 108 that are configured to be irreversibly destroyed when the integrated circuit device 104 is disassembled from the substrate 301.
  • the sacrificial structures 108 are each of sections of conductor tracks 103 the electrically conductive structure 102 is formed.
  • the sections are in the present case of several segments 109 such
  • sacrificial structure sections 108 are arranged laterally next to the mounting surface 104 'and thus laterally adjacent to the integrated circuit device 104.
  • connection layer 110 is pulled from an upper side of the integrated circuit device 104 next to it into the respective opening 1050 of the solder stop resist layer 105 in order to establish a connection there to the respective sacrificial structure 108 and the substrate 101. This is indicated by way of example in the upper left corner of FIG.
  • a material of the interconnect layer 110 connects a portion of the sacrificial structures 108 to a portion of the integrated ones
  • an adhesion of the material of the interconnect layer 110 is selected so that when disassembling the integrated circuit device 104 from the substrate 101 at least a portion of the sacrificial structures 108 is destroyed.
  • a section 108 'of a conductor track 103 formed as a sacrificial structure can be provided, which is arranged within the mounting area 104' so that it is integrated in the plan view of the main area of the substrate 101 having the mounting area 104 '
  • Circuit device 104 is covered. As with the side of the circuit device 104 arranged sacrificial structures 108, the controller 100 expediently a
  • Connection layer 110 which is the integrated circuit
  • Circuit device 104 connects to sacrificial structure 108 'and substrate 101.
  • the connection layer 110 may in this case be completely covered by the integrated circuit device 104.
  • a controller with such arranged Sacrificial structure 108 ' is particularly difficult to manipulate without destroying sacrificial structure 108'.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Software Systems (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Connection Or Junction Boxes (AREA)

Abstract

L'invention concerne un appareil de commande (100). L'appareil de commande (100) présente un substrat (101) comportant une structure électriquement conductrice (102), un dispositif à circuit intégré (104) monté de manière électriquement conductrice sur le substrat (101), et une structure sacrificielle (108, 108') sur le substrat (101). La structure sacrificielle (108, 108') est configurée pour être détruite de manière irréversible lorsque le dispositif à circuit intégré (104) est démonté du substrat (101). La structure électriquement conductrice (102) présente au moins une piste conductrice déposée sur le substrat. La structure sacrificielle (108) est formée par un segment de la piste conductrice. Il est formé une couche de liaison électriquement isolante (110), reliant le dispositif à circuit intégré (104), le substrat (101)et le segment de la piste conductrice, au moyen de laquelle la structure sacrificielle (108, 108') peut être détruite lors du démontage du dispositif à circuit intégré (104). L'invention concerne en outre un véhicule équipé d'un tel appareil de commande, ainsi qu'un procédé de détection d'une manipulation d'un appareil de commande.
PCT/EP2012/075095 2011-12-12 2012-12-11 Appareil de commande à structure sacrificielle WO2013087632A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE112012005171.8T DE112012005171B4 (de) 2011-12-12 2012-12-11 Steuergerät mit Opferstruktur, Fahrzeug und Verfahren
CN201280061493.9A CN104145534B (zh) 2011-12-12 2012-12-11 具有牺牲结构的控制设备
US14/364,765 US10206275B2 (en) 2011-12-12 2012-12-11 Control unit having a sacrificial structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011088216A DE102011088216A1 (de) 2011-12-12 2011-12-12 Motorsteuergerät mit Opferstruktur
DE102011088216.2 2011-12-12

Publications (1)

Publication Number Publication Date
WO2013087632A1 true WO2013087632A1 (fr) 2013-06-20

Family

ID=47501129

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/075095 WO2013087632A1 (fr) 2011-12-12 2012-12-11 Appareil de commande à structure sacrificielle

Country Status (4)

Country Link
US (1) US10206275B2 (fr)
CN (1) CN104145534B (fr)
DE (2) DE102011088216A1 (fr)
WO (1) WO2013087632A1 (fr)

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EP1462907A1 (fr) * 2003-03-25 2004-09-29 Bourns, Inc. Boítier de securité pour un circuit
DE10359088A1 (de) * 2003-12-17 2005-07-21 Conti Temic Microelectronic Gmbh Elektronisches Gerät
US7434736B2 (en) * 2002-12-20 2008-10-14 Nagracard Sa Securing device for a security module connector

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FR2769110B1 (fr) 1997-09-26 1999-12-03 Gemplus Card Int Procede de fabrication d'un module ou etiquette electronique, module ou etiquette obtenue et support comportant un tel module ou etiquette
US6028773A (en) * 1997-11-14 2000-02-22 Stmicroelectronics, Inc. Packaging for silicon sensors
EP1045352A1 (fr) 1999-04-14 2000-10-18 W L Gore & Associares S.r.l. Boítier
JP2001053178A (ja) * 1999-06-02 2001-02-23 Japan Radio Co Ltd 電子回路装置が封止され回路基板に実装される電子部品及びその製造方法
JP4310086B2 (ja) * 2002-08-01 2009-08-05 株式会社日立製作所 エンジン用電子機器
US20040140571A1 (en) * 2003-01-17 2004-07-22 Matsushita Electric Industrial Co., Ltd. Mounting structure of electronic device
DE102004057259A1 (de) 2004-11-26 2006-06-01 Robert Bosch Gmbh Manipulationsgeschütztes Mikrocontrollersystem
JP2006202921A (ja) * 2005-01-19 2006-08-03 Sharp Corp 半導体装置及びそれを用いた表示用モジュール
EP2211289A1 (fr) * 2009-01-22 2010-07-28 Robert Bosch GmbH Procédé et dispositif de contrôle pour protéger un capteur d'une manipulation

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10221086A1 (de) * 2002-05-11 2003-11-20 Bosch Gmbh Robert Steuervorrichtung für ein Kraftfahrzeug
US7434736B2 (en) * 2002-12-20 2008-10-14 Nagracard Sa Securing device for a security module connector
EP1462907A1 (fr) * 2003-03-25 2004-09-29 Bourns, Inc. Boítier de securité pour un circuit
DE10359088A1 (de) * 2003-12-17 2005-07-21 Conti Temic Microelectronic Gmbh Elektronisches Gerät

Also Published As

Publication number Publication date
CN104145534A (zh) 2014-11-12
DE112012005171B4 (de) 2024-06-06
DE112012005171A5 (de) 2014-08-28
CN104145534B (zh) 2018-05-18
DE102011088216A1 (de) 2013-06-13
US20140328029A1 (en) 2014-11-06
US10206275B2 (en) 2019-02-12

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