WO2013085024A1 - Dissipateur de chaleur d'éclairage à diodes électroluminescentes (del) et procédé pour sa fabrication - Google Patents

Dissipateur de chaleur d'éclairage à diodes électroluminescentes (del) et procédé pour sa fabrication Download PDF

Info

Publication number
WO2013085024A1
WO2013085024A1 PCT/JP2012/081769 JP2012081769W WO2013085024A1 WO 2013085024 A1 WO2013085024 A1 WO 2013085024A1 JP 2012081769 W JP2012081769 W JP 2012081769W WO 2013085024 A1 WO2013085024 A1 WO 2013085024A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
heat
led
led element
element mounting
Prior art date
Application number
PCT/JP2012/081769
Other languages
English (en)
Japanese (ja)
Inventor
小西　晴之
Original Assignee
株式会社神戸製鋼所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2011268049A external-priority patent/JP5608152B2/ja
Priority claimed from JP2011285770A external-priority patent/JP5608154B2/ja
Application filed by 株式会社神戸製鋼所 filed Critical 株式会社神戸製鋼所
Priority to CN201280054494.0A priority Critical patent/CN103917824B/zh
Priority to KR1020147015181A priority patent/KR20140096345A/ko
Publication of WO2013085024A1 publication Critical patent/WO2013085024A1/fr

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks

Definitions

  • the present invention relates to a heat sink for LED lighting, in which LED lighting using a light emitting diode (LED) element (including a plurality of elements mounted on a substrate or the like) as a light source radiates heat generated during light emission to the surrounding space. It is about.
  • LED light emitting diode
  • LED lamps include general bulb-type LED bulbs developed to replace existing bulbs such as incandescent bulbs and fluorescent lamps, automotive LED lights such as automobile headlights, and embedded lighting in buildings and other fields. and so on.
  • LED lamps include general bulb-type LED bulbs developed to replace existing bulbs such as incandescent bulbs and fluorescent lamps, automotive LED lights such as automobile headlights, and embedded lighting in buildings and other fields. and so on.
  • in-vehicle LED lighting vehicle lamps, vehicle headlamps
  • replacement with LED elements has begun.
  • replacement with LED lighting has begun in embedded lighting in other fields such as buildings.
  • the LED element that is the light source of this LED illumination is very vulnerable to heat, and there is a problem that when the temperature exceeds the allowable temperature, the light emission efficiency is lowered and the life of the LED element is also affected.
  • the LED lighting is provided with a large heat sink.
  • This LED lighting heat sink is made of aluminum (including an aluminum alloy) and is often formed by die casting or extrusion.
  • Patent Documents 1 to 3 disclose typical heat sink configurations. These heat sinks have a substrate part in which the LED light source is arranged and fixed on the front side, and a plurality of parallelly arranged fin parts protruding at intervals on the back side of the substrate part. In addition, by increasing the surface area of the fin portion, the heat dissipation increases, and a certain heat dissipation property can be obtained.
  • Patent Document 4 proposes a heat sink formed by bending a metal plate having a high thermal conductivity such as aluminum as a heat sink of a vehicle lamp.
  • This heat sink is made by bending a metal flat plate with a thickness of about 1 mm to 3 mm into a ladle-shaped cross section, and forming a heat-dissipating portion of a ladle portion having a U-shaped longitudinal section and an LED element having a lamellar handle portion having a longitudinal section. And a supporting part for supporting.
  • the overall shape of the heat sink is such that a large number of slit-like openings formed by chopping the heat-dissipating part at regular intervals in the longitudinal direction (or width direction) are provided.
  • the heat dissipating part is a comb tooth shape alternately arranged in parallel.
  • Patent Documents 5 to 7 disclose LED bulb heat sinks
  • Patent Documents 8 to 10 include automotive LED lighting heat sinks
  • Patent Documents 11 and 12 disclose heat sinks for embedded illumination.
  • the basic configuration of the conventional heat sink H using the die-cast or extruded shape member is a substrate portion 50 in which an LED element (light source) L is arranged and fixed on the front side, and the substrate portion 50. And a plurality of fin portions 60 arranged in parallel and projecting at an interval.
  • the heat sink H is installed in a limited narrow space.
  • the size of the projected area in the X, Y, and Z axis directions (three-dimensional directions) displayed in the lower right of FIG. 9 affects the efficiency. Radiation efficiency will be improved.
  • the projected area in the Y direction may be the sum of the plane of the substrate unit 50 and the plane of the fin unit 60.
  • the projected area in the Z direction is a comb-like shape with a total of the side surface of the substrate unit 50 and the side surface of the fin unit 60 and has a large space, so the total area obtained by multiplying the length of the substrate unit 50 by the height of the fin unit 60 is The area is less than 50%.
  • the projected area in the X direction is the total of the front surface of the substrate unit 50 and the front surface of the fin unit 60, and even though there are, for example, four fin units 60, these overlap and have the same projected area as one sheet. Yes, radiation efficiency per area on the heat radiation side is low.
  • the heat sink formed by bending the metal flat plate can be lighter than the conventional heat sink H using the die-cast or extruded profile shown in FIG.
  • the slit-shaped opening is provided adjacent to the heat radiating portion, air convection through the lamp chamber flows into the heat radiating portion, and at the same time, air flows through the opening.
  • the heat dissipation efficiency can be improved by the generation of the air flow (convection).
  • the attachment portion 72 for attaching the LED element L is generally formed integrally with the heat sink body 73.
  • the periphery of the LED element L attachment part (pedestal part) 73 is higher than the other part (heat sink body 73). In many cases, the shape was changed.
  • the heat sink of the aluminum die-cast structure since the heat sink of the aluminum die-cast structure has a problem that it is heavy and the manufacturing cost becomes high, it is also considered to manufacture the heat sink with a metal plate material such as aluminum or aluminum alloy. However, it is difficult to form an attachment portion for attaching the LED substrate with only one plate material. As a result, there are problems that a plurality of parts are required and the number of parts is increased, and that it is necessary to assemble a plurality of parts, which also increases the manufacturing cost.
  • JP 2007-193960 A JP 2009-277535 A JP 2010-278350 A JP 2010-146817 A JP 2009-170114 A JP 2009-4130 A JP 2004-296245 A JP 2009-266436 A JP 2010-3621 A JP 2011-28963 A JP 2008-117558 A JP 2009-163955 A
  • the present invention has been made in view of such problems, and the problem is that it can be manufactured from an aluminum plate by a relatively simple processing method, and there is little or no convection due to air (due to air convection).
  • a heat sink for LED lighting that has a radiation-based heat dissipation property that can efficiently radiate heat from an LED light source even when installed in a closed space where heat dissipation cannot be expected. There is.
  • An object of the present invention is to provide a heat sink and a manufacturing method thereof.
  • the gist of the heat sink for LED lighting is that an LED element mounting surface is formed on a single metal thin plate by drawing and a heat dissipation side surface continuous with the LED element mounting surface.
  • a heat sink for LED lighting formed integrally and continuously, wherein the LED element mounting surface is a top portion, the heat radiation side surface is a body portion, and also has an opening of an internal space surrounded by these surfaces It is formed in the body and continuously has a heat radiating surface facing in any three-dimensional direction by the front and back surfaces of the LED element mounting surface and the heat radiating side surface.
  • the heat radiation side surface is preferably formed in a cylindrical shape or a rectangular tube shape.
  • the metal thin plate is preferably an aluminum or aluminum alloy thin plate having a thickness of 0.4 mm to 2 mm.
  • the gist of the LED illumination heat sink according to the second aspect of the present invention is an LED illumination heat sink formed of a metal plate material, and swells to the surface side from the heat sink main body and the heat sink main body. It comprises a pedestal for mounting the LED element, and the pedestal is integrally formed with the heat sink body by coining.
  • the gist of the LED illumination heat sink of the third aspect of the present invention is an LED illumination heat sink formed from a metal plate material, and swells to the surface side from the heat sink body portion and the heat sink body portion. It comprises a pedestal for mounting the LED element, and a backing material is laminated on the back side of the pedestal, and the pedestal is integrally formed with the heat sink body by coining.
  • the metal plate material is preferably made of aluminum or aluminum alloy.
  • the metal plate preferably has a plate thickness in the range of 0.3 mm to 5 mm.
  • the gist of the manufacturing method of the heat sink for LED lighting according to the present invention is that a heat sink main body portion is formed by coining a metal plate material, and a pedestal portion for LED element mounting that bulges to the surface side from the heat sink main body portion. Is integrally formed.
  • the shape of the heat sink formed by drawing is a cylindrical body in which the LED element mounting surface is the top and the heat radiating side is the body, and the front and back surfaces of the LED element mounting surface and the heat radiating side are 3
  • a cylindrical body continuously having a heat radiating surface facing in any direction of the dimension can be obtained.
  • an opening can be provided in the internal space of the cylindrical body.
  • the heat sink can be a radiation-based heat radiation rather than air convection, and the heat radiation can be advantageously improved as a whole.
  • the present invention is a heat sink having a cylindrical body structure integrally formed by drawing from a thin metal plate such as an aluminum thin plate. Therefore, it is only necessary to draw a thin sheet such as a sheet or a coil, or a thin sheet processed by extrusion or the like, which is generally used for forming the thin sheet (including trimming and the like in a series of drawing processes).
  • the shape and structure can be integrally formed and manufactured relatively easily. Further, since the metal thin plate is drawn using a press die, the spring back that occurs in the bending process hardly occurs, and high dimensional accuracy can be obtained.
  • the heat sink has no obstacle such as a slit that divides the heat conduction path as in the prior art.
  • the heat conduction path in the heat sink is not divided, and heat from the LED element is transmitted to each part constituting the heat sink, so that extremely high heat dissipation is ensured.
  • it is an integral structure formed by drawing, high component rigidity and strength are also realized.
  • the heat sink of the cylindrical body structure can be reduced in weight as compared with the die-casting or casting, and can be used for LED lighting such as in-vehicle use. Suitable as a heat sink.
  • the heat sink for LED lighting of the second and third aspects of the present invention since it is formed from a metal plate material, it is possible to reduce the weight, as well as a gold having a complicated shape at the time of manufacturing such as die casting. There is no need to use a mold.
  • the pedestal for attaching the LED board is integrally formed with the heat sink main body by coining, there is no need for a separate part for attaching the LED board, simplifying the component configuration and reducing manufacturing costs. Can be planned.
  • the thickness of the pedestal can be made thicker than the thickness of the heat sink body, and heat generated from the LED board can be efficiently conducted to the surroundings. Can do. Therefore, when a backing material is laminated on the back side of the pedestal, the heat dissipation can be further improved.
  • FIG. 1 shows a first embodiment of a heat sink 1 for LED illumination according to the present invention.
  • a heat sink 1 for LED lighting of the present invention is formed by integrally forming a thin metal plate 1 having a certain plate thickness, such as aluminum, for example, and has a hollow cylindrical shape (cylindrical cup shape) as a whole. It has the three-dimensional shape. That is, the LED illumination heat sink 1 of the present invention shown in FIG. 1 is formed by integrally and continuously forming the LED element mounting surface 2 and the heat radiating side surface 3 from one metal thin plate by drawing.
  • the LED element mounting surface 2 is a disk (disk) -shaped top portion, and the heat radiating side surface 3 is connected to the cylindrical (circular tubular) body portion (side portion). It is formed to be.
  • the side surface of the cylindrical body connected to the LED element mounting surface is referred to as a heat radiating side surface
  • the heat radiating side surface and the surface capable of radiating heat, such as the LED element mounting surface are referred to as a heat radiating surface.
  • the opening 10 on the bottom side of the cylindrical body is a space where no heat dissipation surface exists, and an internal space surrounded by the LED element mounting surface 2 and the heat dissipation side surface 3 of the cylindrical body is opened to the outside. (Space part). Since the heat sink 1 in FIG. 1 is cylindrical, the opening 10 has the same area as the LED element mounting surface 2 when the angle formed by the LED element mounting surface 2 and the heat radiating side surface 3 is 90 degrees, for example. . For this reason, it has a comparatively large area with respect to the heat radiation side area of the heat sink 1, and the air in the internal space and the outside air convect inside and outside the heat sink 1 through the opening 10. The structure is sufficient.
  • Such an opening includes not only the bottom side of the cylindrical body but also the bottom side of the cylindrical body, or instead of the bottom side of the cylindrical body, including other embodiments described later. It may be provided on the side.
  • the provision of the LED element mounting surface 2 is limited when the opening to the LED element mounting surface is provided because if the opening becomes too large, heat conduction from the LED element to the heat radiating side surface will be hindered. It is desirable to apply. Therefore, when an opening is selectively provided on the LED element mounting surface, it is preferable to use a slit-like relatively small opening having a width of about 5 mm at the maximum.
  • the angle formed by the LED element mounting surface 2 and the heat radiating side surface 3, that is, the inclination of the cylindrical body portion (side portion) is determined according to the design conditions of the heat sink 1, and is not necessarily 90 degrees.
  • the longitudinal section of the cylindrical body of the heat sink 1 may be trapezoidal in which either the LED element mounting surface 2 or the opening 10 is large. However, in any case, it is necessary to secure a sufficient area for exciting or inducing convection of air inside and outside the heat sink 1, which is a function of the opening 10.
  • FIG. 1 it has a shape having a flat disk-shaped LED element mounting surface 2 and a heat radiating side surface 3 forming a cylindrical curved surface, and both are formed by drawing from a single aluminum plate. Therefore, the LED element mounting surface 2 and the heat radiating side surface 3 are integrally continuous with the ridgeline of the LED element mounting surface 2 end (corner portion). In other words, the front and back surfaces 2a, 2b, 3a, and 3b of the LED element mounting surface 2 and the heat radiation side surface 3 are continuous by the LED element L installed on the top LED element mounting surface 2 and a single metal thin plate. ing.
  • the LED element mounting surface 2 faces in the Y direction in FIG. 1, the front surface 2a of the LED element mounting surface 2 faces upward in the drawing, and the back surface 2b of the LED element mounting surface 2 faces downward in the drawing. .
  • the heat radiating side surface 3 is cylindrical, both the front surface 3a and the back surface 3b of the heat radiating side surface 3 are oriented in the X direction and the Z direction (lateral direction). For this reason, the LED element mounting surface 2 and the heat radiating side surface 3 together constitute a heat radiating surface facing in any of the three-dimensional X, Y, and Z directions.
  • the heat sink 1 for LED lighting of the present invention directly transmits heat from the LED element L to each of the surfaces 2a, 3a, 2b, and 3b, and three-dimensionally directs the heat to each surface. Heat radiation in any of X, Y, and Z directions is possible.
  • the heat Q transmitted to the LED element mounting surface 2 is radiated from the entire surface 2a and back surface 2b of the flat surface of the mounting surface 2 to the surrounding closed space (heat radiation space).
  • the heat generated by the LED element L is dissipated in any of the three-dimensional X, Y, and Z directions.
  • the heat radiation from the back surface 2b of the LED element mounting surface 2 and the back surface 3b of the heat radiation side surface 3 is heat radiation to the internal space surrounded by the cylindrical (cup) heat radiation side surface 3.
  • heat radiation by convection from these surfaces is of course performed, and by convection inside and outside the heat sink 1 through the opening 10 between the air inside the cylindrical body and the outside air. Heat dissipation to the outside of the heat sink 1 is also guaranteed.
  • the amount of heat radiated is smaller than the heat radiating from the surface 3a on the surface side (outside) of the heat radiating side surface 3. .
  • the heat sink 1 having the cylindrical shape (cup shape) of FIG. 1 and including the LED element mounting surface 2 and the heat radiating side surface 3 constituting the cup shape is air whose heat dissipation efficiency is governed by radiation.
  • the projected area in the X, Y, Z direction that is, the three-dimensional direction, is very large. For this reason, radiation efficiency is high and it has excellent heat dissipation.
  • the projected area of the heat sink 1 does not overlap in the radiation direction to the heat radiation space, the heat radiation efficiency per heat radiation unit area is good while being a simple structure that can be easily drawn (formed).
  • the heat sink of the present invention is optimal in a usage (installation) environment in which the surrounding heat radiation space is closed and the volume is small and there is almost no air convection, and heat radiation due to air convection is hardly expected. is there.
  • a usage environment in which the surrounding heat radiation space is closed and the volume is small and there is almost no air convection, and heat radiation due to air convection is hardly expected. is there.
  • the conventional heat sink structure which is mainly heat dissipation performance of convection of air by increasing the surface area of the heat dissipation surface such as fins, Heat radiation due to this radiation becomes insufficient, and efficient heat radiation cannot be achieved as a whole.
  • the heat sink of the present invention is a heat sink that is optimal for use (installation) environments where heat dissipation by heat radiation from the heat radiating surface such as the heat radiating side is mainly used and heat dissipation by air convection is hardly expected.
  • the structure of the heat sink 1 is configured such that the LED element mounting surface 2 and the heat radiating side surface 3 are configured by a continuous heat radiating surface facing in any of the three-dimensional X, Y, and Z directions. high.
  • FIG. 2 shows a second embodiment of the heat sink for LED lighting according to the present invention.
  • the heat sink 1 for LED illumination shown in FIG. 2 is formed by integrally forming a thin metal plate 1 having a certain plate thickness such as aluminum as in FIG. 1, but the whole as shown in FIG. It has a hollow rectangular tube shape (square tube cup shape).
  • the LED lighting heat sink 1 of the present invention shown in FIG. 2 is formed by integrally forming the LED element mounting surface 2 and the four heat dissipating side surfaces 4, 5, 6, and 7 from a single metal thin plate by drawing. This is the same as in FIG.
  • the heat sink 1 for LED lighting has a shape in which five surfaces of a rectangular parallelepiped are connected, and the LED element mounting surface 2 and four surfaces 4 of the four heat radiation side surfaces forming a plane,
  • the shape has 5, 6, and 7.
  • the LED element mounting surface 2 is a rectangular rectangular plate-shaped top portion, and the four heat radiation side surfaces 4, 5, 6, and 7 are each a square connected to this. It is molded so as to be a square cylindrical body (side). Therefore, the LED element mounting surface 2 and the four heat dissipating side surfaces 4, 5, 6, 7 each have three continuous surface-side surfaces (outside) facing in any of the three-dimensional X, Y, and Z directions.
  • Numeral 10 on the bottom side of the cylindrical body is an opening (space part) in which the internal space of the cylindrical body is open toward the outside, where no heat dissipation surface exists.
  • the heat sink 1 in FIG. 2 has a rectangular tube shape, for example, when the angle formed by the LED element mounting surface 2 and the four surfaces 4, 5, 6, and 7 of the heat radiating side is 90 degrees, It has the same area as the LED element mounting surface 2. For this reason, it has a comparatively large area with respect to the heat radiation side area of the heat sink 1, and the air in the internal space and the outside air convect inside and outside the heat sink 1 through the opening 10.
  • the structure is sufficient.
  • the relationship between the selection of the angle formed by the LED element mounting surface 2 and the heat radiating side surfaces 4, 5, 6, 7 and the size of the opening 10 and the position of the opening 10 are the same as in FIG.
  • FIG. 2 it has a shape having a flat rectangular LED element mounting surface 2 and four surfaces 4, 5, 6, and 7 of heat radiation side surfaces forming a rectangular tube-shaped rectangular surface.
  • the LED element mounting surface 2 and the four heat dissipating side surfaces 4, 5, 6, and 7 are the LED element mounting surfaces. It is continuously continuous with a ridgeline at two ends (corners).
  • the LED element mounting surface 2 and the front and back surfaces 2a, 4a, 5a, 6a, 7a and 2b, 4b, 5b, 6b, 7b of the four surfaces 4, 5, 6, 7 of the heat radiation side are the top LEDs.
  • the LED element L installed on the element mounting surface 2 is continuous with one metal thin plate.
  • the LED element mounting surface 2 is oriented in the Y direction in FIG. 2 as in the case of FIG. 1, and the front surface 2a of the LED element mounting surface 2 is the upward direction in the drawing, and the back surface 2b of the LED element mounting surface 2 is. Is pointing downward in the figure.
  • the four surfaces 4, 5, 6, 7 of the heat radiation side surface are the front and back surfaces 4a, 5a, 6a, 7a and 4b, 5b, 6b, 7b of the four surfaces 4, 5, 6, 7 of the heat radiation side surface.
  • the LED element mounting surface 2 and the four heat dissipating side surfaces 4, 5, 6, and 7 together constitute a heat dissipating surface facing in any of the three-dimensional X, Y, and Z directions.
  • the LED lighting heat sink 1 of FIG. 2 also has the front surface 2a, the back surface 2b of the LED element mounting surface 2, and the front and back surfaces 4a, 5a, 6a, 7a of the four surfaces 4, 5, 6, 7 of the heat radiation side surface.
  • heat is directly conducted from the LED element L to each of the surfaces 2b, 4b, 5b, 6b, and 7b, and in any of the three-dimensional X, Y, and Z directions toward the heat radiation surfaces of the heat. The heat dissipation of each is also possible.
  • FIG. 3 shows a third embodiment of the heat sink for LED lighting according to the present invention.
  • a heat sink 1 for LED illumination shown in FIG. 3 is formed by integrally forming a thin metal plate 1 having a certain thickness such as aluminum, as in FIG. (Cylinder cup shape).
  • the heat sink 1 for LED illumination of the present invention shown in FIG. 2 is that the LED element mounting surface 2 and the heat radiating side surface 3 are integrally formed from a single metal thin plate by drawing. Is the same.
  • the LED lighting heat sink 1 in FIG. 3 has an LED element mounting surface 2 and four flat heat radiation side surfaces 4, 5, 6, and 7, and is one step higher than the LED element mounting surface 2. It has an L-shaped or step-shaped hollow rectangular parallelepiped or cup shape having a step surface 8 in the Y direction (vertical direction) and a flat top surface 9 in the Y direction.
  • the LED element mounting surface 2 which is a flat rectangular top portion whose top portions are continuous with each other on the step surface 8, and further than the LED element mounting surface 2 It has a flat, rectangular top surface 9 that is one step higher.
  • the four surfaces 4, 5, 6, and 7 on the heat radiation side are the same rectangular planar shape as in FIG. 2, and the two surfaces 5 and 7 are L-shaped planar shapes unlike FIG. Thus, it is shaped so as to be a rectangular tube (square tube) body (side).
  • the flat and rectangular top surface 9 can be used as a place to attach a fixture when fixing a heat sink in LED lighting. Or it can utilize as a place at the time of connecting and fixing other components required for LED illumination, for example, a reflecting plate. Therefore, in the case of FIG. 3, the LED element mounting surface 2 which is a cylindrical top has a two-step staircase shape, but if drawing processing is possible, the LED element mounting surface is necessary. Of course, the number of steps of 2 may be a stepped shape of three or more steps with the stepped surface 8 and a continuous flat rectangular top increased.
  • 10 on the bottom side of the cylindrical body is an opening (space part) that is open toward the outside of the internal space of the cylindrical body and does not have a heat radiation side surface.
  • the heat sink 1 in FIG. 3 has a rectangular tube shape, for example, when the angle formed by the LED element mounting surface 2 and the four surfaces 4, 5, 6, and 7 of the heat radiating side is 90 degrees, The total area of the LED element mounting surface 2 and the flat and rectangular top surface 9 is the same. For this reason, it has a comparatively large area with respect to the heat radiation side area of the heat sink 1, and the air in the internal space and the outside air convect inside and outside the heat sink 1 through the opening 10. The structure is sufficient.
  • the relationship between the selection of the angle formed by the LED element mounting surface 2 and the heat radiating side surfaces 4, 5, 6, 7 and the size for exhibiting the function of the opening 10 is the same as in the case of FIG. 2.
  • the LED element mounting surface 2 and the flat and rectangular top surface 9 are connected in the vertical direction.
  • the step surface 8 in the (Y direction) and the four surfaces 4, 5, 6, and 7 that are heat radiation side surfaces are the LED element mounting surface 2 and the top surface 9, or the ridgeline at the end (corner) of the step surface 8. Along with it, it is continuous continuously.
  • 9b, 8b, 4b, 5b, 6b, 7b are connected to the LED element L installed on the LED element mounting surface 2 at the top by a single metal thin plate.
  • the LED element mounting surface 2 and the top surface 9 are oriented in the Y direction of FIG. 3, and the surface 2a of the LED element mounting surface 2 and the surface 9a of the top surface 9 are the upward direction of the figure, the LED element mounting surface The back surface 2b of 2 and the back surface 9b of the top surface 9 face downward in the figure.
  • the four surfaces 4, 5, 6, 7 and the step surface 8 of the heat radiation side surface are the front and back surfaces 4a, 5a, 6a, 7a, 8a and 4b, 5b, 6b, 7b, 8b are respectively X Direction and Z direction (lateral direction). Therefore, the LED element mounting surface 2 and the top surface 9, the heat radiation side surfaces 4, 5, 6, 7 and the step surface 8 are combined to radiate in any of the three-dimensional X, Y, and Z directions. Make up surface.
  • the LED illumination heat sink 1 of FIG. 3 also includes the front surface 2a, the back surface 2b, the top surface 9a, the back surface 9b, and the heat radiation side surfaces 4, 5, 6, 7 of the LED element mounting surface 2. Heat is directly conducted from the LED element L to the front and back surfaces 4a, 5a, 6a, 7a and 4b, 5b, 6b, 7b, and the front and back surfaces 8a, 8b of the stepped surface 8, and these heat Heat radiation in any of the three-dimensional X, Y, and Z directions facing each surface is also possible. And compared with the cylindrical cup-shaped or rectangular parallelepiped heat sinks of FIGS. 1 and 2, the projected area to the heat radiation space is further increased by having more surface area such as the top surface 9 even if the volume is the same. The heat dissipation as a heat sink increases.
  • FIG. 4 shows a fourth embodiment of a heat sink for LED lighting according to the present invention.
  • the heat sink 1 for LED illumination shown in FIG. 4 has the same overall shape as FIG. 2, but does not have the heat radiating side surface 6 in FIG. 2 and has no heat radiating side surface as in the opening 10 on the bottom side.
  • the space has an opening (space portion) 11 that is open to the outside.
  • the opening 11 is provided in a range that does not hinder the rigidity of the heat sink 1, and has a larger area sufficient for the heat radiation side area of the heat sink 1 together with the opening 10 on the bottom side. it can. Therefore, the convection function inside and outside the heat sink 1 through the openings 10 and 11 between the air in the internal space and the external air is improved. As a result, the area on the heat radiation side is reduced by the amount of the heat radiation side surface 6 as compared with the case of FIG. 2, but the heat radiating function is improved and the heat radiation performance is still excellent.
  • the above LED element mounting surface and heat radiation side surface have a part mounting space, a slit, or a partial shape depending on the application of the heat sink 1 and the mounting site, and a process in which these surfaces are cut out to a part of each surface.
  • it may be provided by a molding process that provides unevenness.
  • the heat radiating side surface may have its surface or part of the surface omitted as shown in FIG.
  • the metal thin plate which is a material for drawing (or heat sink)
  • the metal thin plate is preferably made of 1000 series pure aluminum as defined in AA to JIS standards from the viewpoint of the heat conduction characteristics and heat dissipation characteristics required of the heat sink.
  • the same 1000 series or other 3000 series, 5000 series, 6000 series, etc. are suitable aluminum alloys. And tempering conditions are selected. Further, depending on conditions, a steel plate, a magnesium plate, or the like can be applied.
  • the thickness (thickness) of the thin metal plate is selected from the range of 0.4 mm to 2 mm in consideration of the light weight of the heat sink, the required strength and rigidity, and the drawability (formability). If the plate thickness is too thin, the required strength and rigidity of the heat sink or drawing workability (formability) cannot be ensured. On the other hand, if the plate thickness is too thick, the weight reduction of the heat sink is sacrificed, and the drawability (formability) is also lowered.
  • a pure aluminum plate or aluminum alloy plate having a predetermined thickness is manufactured by a normal plate-shaped material manufacturing method such as rolling or extrusion. Next, the manufactured aluminum plate is cut out or punched out into a plate piece having a size capable of forming the outer shape of the heat sink to obtain a flat blank.
  • the blank 20 is subjected to a drawing process using a press molding apparatus including a punch 22, a die (die) 21, and a plate presser 23 each having a shape corresponding to the shape of the heat sink to be molded.
  • the cylindrical body (hollow cup shape) shape in which the inside becomes a space is molded at room temperature (room temperature).
  • Fig.5 (a) shows the state before the drawing process which set the blank 20 to the press molding apparatus.
  • the punch 20, the die (die) 21, and the plate holder 23 are relatively moved up and down as shown by arrows, and the blank 20 is drawn into the shape of the heat sink 1 shown in FIG. The state during processing is shown.
  • the plate pressing portion 24 which is a surplus portion around the periphery of the heat sink 1 (blank 20), is trimmed during this series of steps.
  • Drawing (drawing) by such a press forming apparatus can be applied not only to the heat sink of FIG. 1 but also to the heat sink 1 of FIGS. 2 to 4. It can be easily and inexpensively manufactured by a molding process or a pressing device. This can also be said compared to a heat sink in which a metal flat plate as in Patent Document 4 is manufactured by bending. In addition, since the present invention is a drawing process, there is an advantage that it is easy to ensure dimensional accuracy.
  • the surface emissivity ⁇ of the metal thin plate is preferably 0.6 or more.
  • after-coating treatment (paint film) of a black paint having a high emissivity may be performed.
  • This pre-coating process also serves as a lubricant in the drawing process if it is applied to the metal sheet in advance before the drawing process.
  • This emissivity ⁇ is a ratio with respect to a theoretical value of thermal radiation of an actual object (thermal radiation of a black body which is an ideal thermal radiator), and actual measurement is disclosed in Japanese Patent Application Laid-Open No. 2002-234460.
  • the described method may be used, and measurement may be performed by a portable emissivity measuring apparatus developed by the Japan Aerospace Exploration Agency.
  • an in-vehicle LED lamp (vehicle lamp) includes an LED board on which an LED element as a light source is mounted, a reflector that reflects light from the LED forward in the light irradiation direction, and surrounds the LED board and the reflector. And an outer lens made of a transparent material for closing the open front end of the housing, and a heat sink disposed in thermal contact with the LED substrate.
  • the reflector is formed of a resin material and includes a parabolic reflecting surface having a focal point near the LED on the LED substrate.
  • the heat sink of the present invention is used as the LED substrate or a heat sink disposed in thermal contact with the LED substrate.
  • the LED element is driven to emit light, and the light emitted from the LED element is reflected by the reflector and travels forward in the light irradiation direction through the outer lens. Is irradiated.
  • the heat generated from the LED is transmitted to the heat sink of the present invention and released to the outside of the housing, and the temperature rise of the LED element is suppressed.
  • the heat sink according to the present invention as described above is mainly radiated by radiation of heat from the heat radiating surface such as the heat radiating side surface, and has little air convection (almost no heat radiated by air convection can be expected). It is the best heat sink for installation environment). For this reason, in addition to general heat radiating parts for vehicle lighting lamps, it can be used for heat radiating parts for electronic parts, etc.
  • FIG. 6 shows a heat sink 31 for LED illumination (hereinafter, simply referred to as a heat sink) according to a fifth embodiment of the present invention.
  • the heat sink 31 is formed, for example, by performing coining on a single metal plate made of aluminum or aluminum alloy having a plate thickness of 0.3 to 5 mm.
  • the metal plate material used for manufacturing the heat sink 31 is particularly preferably a metal material having excellent thermal conductivity and formability, such as JIS 1000 series pure aluminum, JIS 3000 series aluminum alloy, and JIS 5000 series aluminum alloy.
  • JIS 1000 series pure aluminum, JIS 3000 series aluminum alloy, and JIS 5000 series aluminum alloy such as JIS 1000 series pure aluminum, JIS 3000 series aluminum alloy, and JIS 5000 series aluminum alloy.
  • other thermal conductivity and formability such as JIS6000 series aluminum alloy material may be used, and high strength aluminum alloy material or other metal plate material such as copper may be used.
  • the plate thickness of the metal plate material is exemplified to be 0.3 to 5 mm. The reason is that the plate thickness of the metal plate material is 5 mm. If the thickness exceeds the thickness, the mass becomes too heavy to be suitable for use as the heat sink 31 of the LED lamp. On the other hand, when the plate thickness is less than 0.3 mm, the strength is sufficient as a component of the LED lamp. This is because it is impossible to secure the above-mentioned value and is not suitable for use as the heat sink 31 of the LED lamp. A more preferable thickness of the metal plate material is 0.35 to 2.5 mm.
  • the heat sink 31 for LED illumination includes a flat heat sink main body 32 and a vertical cross-section trapezoidal pedestal that bulges to the surface side (the upper side in FIG. 6) from the heat sink main body 32.
  • the heat sink 31 is configured by attaching the LED element L to the surface side of the pedestal 33.
  • a recess 34 is formed on the back surface side of the pedestal portion 33.
  • FIG. 7 shows a mold used for manufacturing the heat sink 31 for LED illumination
  • 35 is a metal plate material used for manufacturing the heat sink 31.
  • 36 is a die 36 in which a recess 36 a for forming the surface of the pedestal portion 33 is provided on the lower surface.
  • the die 36 is formed by forming a recess 34 on the back surface of the pedestal portion 33.
  • a punch for forming 33 and 38 is a blank holder.
  • 39 is a bolster
  • 40 is a cushion pin.
  • the die 36 is lowered, and the metal plate material 35 is sandwiched between the lowered die 36 and the pair of blank holders 38, 39.
  • the punch 37 approaches the metal plate material 35 relatively, and a part (intermediate portion) of the metal plate material 35 is pushed up into the recess 36a of the die 36.
  • both side portions of the metal plate member 35 are held between the die 36 and the pair of blank holders 38 and 39.
  • a part of the pushed-up metal plate material 35 is strongly compressed by the concave portion 36 a of the die 36 and the upper surface of the punch 37, and is formed into a trapezoidal shape in the longitudinal section, thereby forming a pedestal portion 33.
  • FIG. 8 shows a heat sink 31 for LED illumination according to a different embodiment of the present invention.
  • the heat sink 31 is also formed by subjecting a metal plate material made of aluminum or aluminum alloy having a plate thickness of 0.3 to 5 mm to coining, and includes a heat sink main body 32 and the heat sink main body 32.
  • the configuration of the pedestal portion 33 having a trapezoidal longitudinal section that bulges to the surface side is the same as that of the embodiment shown in FIG.
  • the part composed of the heat sink body 32 and the pedestal 33 of the LED illumination heat sink 31 will be referred to as a heat sink body 31a for convenience.
  • the embodiment shown in FIG. 8 differs from the embodiment shown in FIG. 6 in that the backing material 41 is laminated along the back side of the heat sink main body 31a including the pedestal portion 33 to constitute the heat sink 31 for LED illumination. It is a point.
  • the backing material 41 is preferably formed using a metal plate material made of aluminum or aluminum alloy having good thermal conductivity and formability, but made of other metal such as copper. It may be formed using a plate material.
  • the LED illumination heat sink 31 according to this embodiment is also manufactured by coining. However, the LED illumination heat sink 31 is manufactured by performing molding once and the LED heat sink 31 is manufactured by performing molding twice. You can adopt any of the methods
  • the heat sink 31 for LED lighting is manufactured by performing molding once, a state in which a metal plate material forming the backing material 41 is laminated on the back surface of the metal plate material forming the heat sink body 31a is shown in FIG.
  • the LED illumination heat sink 31 is manufactured by performing coining using the mold shown.
  • the LED lighting heat sink 31 is manufactured by performing the molding twice, first, after the heat sink body 31a is molded by the method shown in FIG. 7, the recess on the back surface of the pedestal 33 is formed on the back surface of the heat sink body 31a. 34, the metal plate material that forms the backing material 41 is applied and molded again. In the case where the molding is performed twice in this way, it is preferable that the first molding is a preliminary molding and coining is performed in the second molding.
  • the heat sink 31 for LED illumination of the present invention may be a simple plate as shown in FIG. 6 or FIG. 8, or the heat sink body 32 may be processed into various shapes according to the shape of the heat sink. .
  • the LED lighting heat sink 31 can be used as a heat sink for various LED lightings, such as a heat sink for LED bulbs, a heat sink for in-vehicle LED lighting, and a heat sink for embedded lighting in buildings.
  • the term LED element is not limited to a single element, but includes a plurality of elements mounted on the surface of an aluminum alloy plate or the like.

Abstract

La présente invention concerne un dissipateur de chaleur d'éclairage à diodes électroluminescentes (DEL), lequel dissipateur est apte à être fabriqué à partir d'une plaque d'aluminium par un procédé de traitement relativement simple, et produit efficacement un rayonnement de chaleur même quand il est appliqué et installé dans un espace fermé. Le dissipateur de chaleur d'éclairage à DEL selon la présente invention est un dissipateur de chaleur d'éclairage DEL (1) dans lequel une surface de montage d'élément de DEL (2) et une surface latérale de rayonnement (3) sont formées d'un seul tenant ou de façon continue sur un métal feuilleté par emboutissage. Le dissipateur de chaleur selon la présente invention comprend des surfaces de rayonnement d'une manière continue, lesquelles sont formées sur un corps cylindrique de façon à faire face à n'importe quelle direction en trois dimensions.
PCT/JP2012/081769 2011-12-07 2012-12-07 Dissipateur de chaleur d'éclairage à diodes électroluminescentes (del) et procédé pour sa fabrication WO2013085024A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201280054494.0A CN103917824B (zh) 2011-12-07 2012-12-07 Led照明用散热片及其制造方法
KR1020147015181A KR20140096345A (ko) 2011-12-07 2012-12-07 Ｌｅｄ 조명용 히트 싱크 및 그의 제조 방법

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011268049A JP5608152B2 (ja) 2011-12-07 2011-12-07 車載ｌｅｄ照明用ヒートシンク
JP2011-268049 2011-12-07
JP2011285770A JP5608154B2 (ja) 2011-12-27 2011-12-27 Ｌｅｄランプ用ヒートシンク
JP2011-285770 2011-12-27

Publications (1)

Publication Number Publication Date
WO2013085024A1 true WO2013085024A1 (fr) 2013-06-13

Family

ID=48574378

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/081769 WO2013085024A1 (fr) 2011-12-07 2012-12-07 Dissipateur de chaleur d'éclairage à diodes électroluminescentes (del) et procédé pour sa fabrication

Country Status (3)

Country Link
KR (1) KR20140096345A (fr)
CN (2) CN106895378A (fr)
WO (1) WO2013085024A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018137202A (ja) * 2017-02-24 2018-08-30 マツダ株式会社 車両用灯具

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104378954A (zh) * 2014-10-13 2015-02-25 上海仪电数字技术有限公司 电子器件的散热器

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004311444A (ja) * 2003-04-09 2004-11-04 Carl-Zeiss-Stiftung 反射鏡を有する照明器具
JP2006253197A (ja) * 2005-03-08 2006-09-21 Nikon Corp 光照射モジュール
JP2008090163A (ja) * 2006-10-04 2008-04-17 Nikon Corp 電子機器および電子カメラ
JP2008518461A (ja) * 2004-10-25 2008-05-29 クリー インコーポレイテッド 固体金属ブロック半導体発光デバイス実装基板ならびにキャビティおよびヒートシンクを含むパッケージ、ならびにそれらをパッケージングする方法
JP2009205834A (ja) * 2008-02-26 2009-09-10 Ichikoh Ind Ltd 車両用灯具
JP2011134725A (ja) * 2011-03-24 2011-07-07 Sharp Corp 照明装置
WO2011105049A1 (fr) * 2010-02-23 2011-09-01 パナソニック株式会社 Dispositif de source de lumière
JP2011243554A (ja) * 2010-02-10 2011-12-01 Kaneka Corp 電子機器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61145898A (ja) * 1984-12-19 1986-07-03 松下電器産業株式会社 プリント配線基板
DE10062699A1 (de) * 2000-12-15 2002-07-04 Conti Temic Microelectronic Kühlvorrichtung für elektronische Steuergeräte
FR2853200B1 (fr) * 2003-03-27 2005-10-07 Valeo Vision Procede de fixation d'une diode electroluminescente de puissance sur un radiateur, et dispositif de signalisation comportant une telle diode.
JP2005016836A (ja) * 2003-06-26 2005-01-20 Kyocera Corp 冷却装置
US7236366B2 (en) * 2004-07-23 2007-06-26 Excel Cell Electronic Co., Ltd. High brightness LED apparatus with an integrated heat sink
CN201576701U (zh) * 2009-12-25 2010-09-08 上海必威电机电器有限公司 Led灯芯片金属散热装置
CN201639904U (zh) * 2010-01-15 2010-11-17 张逸民 一种发热元件散热结构

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004311444A (ja) * 2003-04-09 2004-11-04 Carl-Zeiss-Stiftung 反射鏡を有する照明器具
JP2008518461A (ja) * 2004-10-25 2008-05-29 クリー インコーポレイテッド 固体金属ブロック半導体発光デバイス実装基板ならびにキャビティおよびヒートシンクを含むパッケージ、ならびにそれらをパッケージングする方法
JP2006253197A (ja) * 2005-03-08 2006-09-21 Nikon Corp 光照射モジュール
JP2008090163A (ja) * 2006-10-04 2008-04-17 Nikon Corp 電子機器および電子カメラ
JP2009205834A (ja) * 2008-02-26 2009-09-10 Ichikoh Ind Ltd 車両用灯具
JP2011243554A (ja) * 2010-02-10 2011-12-01 Kaneka Corp 電子機器
WO2011105049A1 (fr) * 2010-02-23 2011-09-01 パナソニック株式会社 Dispositif de source de lumière
JP2011134725A (ja) * 2011-03-24 2011-07-07 Sharp Corp 照明装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018137202A (ja) * 2017-02-24 2018-08-30 マツダ株式会社 車両用灯具
WO2018155177A1 (fr) * 2017-02-24 2018-08-30 マツダ株式会社 Appareil d'éclairage pour véhicule

Also Published As

Publication number Publication date
CN103917824A (zh) 2014-07-09
CN106895378A (zh) 2017-06-27
KR20140096345A (ko) 2014-08-05
CN103917824B (zh) 2017-11-10

Similar Documents

Publication Publication Date Title
KR101653028B1 (ko) Ｌｅｄ 조명용 히트 싱크
TWI407043B (zh) 發光二極體光源模組及其光學引擎
KR20130124393A (ko) Led 조명용 히트 싱크
WO2011043390A1 (fr) Dispositif d'éclairage
JP5608152B2 (ja) 車載ｌｅｄ照明用ヒートシンク
JP2008059965A (ja) 車両前照灯，照明装置及びその放熱部材
JP6283357B2 (ja) 車両用灯具
JP2008098025A (ja) 車両用灯具
JP2008117558A (ja) 照明用反射体および光源装置
JP6022183B2 (ja) Ｌｅｄ照明用ヒートシンク
JP5902973B2 (ja) 車載ｌｅｄランプ用ヒートシンク
WO2013085024A1 (fr) Dissipateur de chaleur d'éclairage à diodes électroluminescentes (del) et procédé pour sa fabrication
JP5597099B2 (ja) 車載ｌｅｄランプ用ヒートシンク
JP5911184B1 (ja) ダブル型高輝度ｌｅｄ前照灯
JP2012216382A (ja) 車両用灯具
JP3173200U (ja) Ｌｅｄランプ
JP5608154B2 (ja) Ｌｅｄランプ用ヒートシンク
KR20100101489A (ko) 냉각장치
WO2015170552A1 (fr) Feu de véhicule
JP5940863B2 (ja) Ｌｅｄ照明用ヒートシンク
JP6349798B2 (ja) 車両用灯具
JP2013211453A (ja) Ｌｅｄ照明用ヒートシンク
JP2016066694A (ja) ヒートシンク及び照明装置
JP2012234909A (ja) ヒートシンク、ヒートシンクの製造方法及び灯具
CN220038256U (zh) 前照灯和车辆

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12855743

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20147015181

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12855743

Country of ref document: EP

Kind code of ref document: A1