WO2013081204A1 - Appareil de traitement de motif par laser à l'aide d'un élément optique à diffraction - Google Patents

Appareil de traitement de motif par laser à l'aide d'un élément optique à diffraction Download PDF

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Publication number
WO2013081204A1
WO2013081204A1 PCT/KR2011/009145 KR2011009145W WO2013081204A1 WO 2013081204 A1 WO2013081204 A1 WO 2013081204A1 KR 2011009145 W KR2011009145 W KR 2011009145W WO 2013081204 A1 WO2013081204 A1 WO 2013081204A1
Authority
WO
WIPO (PCT)
Prior art keywords
lens
optical system
laser
diffraction optical
workpiece
Prior art date
Application number
PCT/KR2011/009145
Other languages
English (en)
Korean (ko)
Inventor
장인구
Original Assignee
Jang Ingu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jang Ingu filed Critical Jang Ingu
Priority to PCT/KR2011/009145 priority Critical patent/WO2013081204A1/fr
Publication of WO2013081204A1 publication Critical patent/WO2013081204A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

La présente invention porte sur un appareil de traitement de motif apte à utiliser un laser pendant le traitement d'un dispositif électronique ou analogue de façon à former un motif et, plus particulièrement, sur un appareil de traitement de motif par laser utilisant un DOE (élément optique à diffraction), qui utilise un DOE pour diffuser un faisceau, puis concentrer le faisceau à travers deux lentilles, et régler la focalisation à travers une lentille de traitement afin de traiter un motif de telle sorte que le bord de l'objet traité n'est pas évasé.
PCT/KR2011/009145 2011-11-29 2011-11-29 Appareil de traitement de motif par laser à l'aide d'un élément optique à diffraction WO2013081204A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/KR2011/009145 WO2013081204A1 (fr) 2011-11-29 2011-11-29 Appareil de traitement de motif par laser à l'aide d'un élément optique à diffraction

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2011/009145 WO2013081204A1 (fr) 2011-11-29 2011-11-29 Appareil de traitement de motif par laser à l'aide d'un élément optique à diffraction

Publications (1)

Publication Number Publication Date
WO2013081204A1 true WO2013081204A1 (fr) 2013-06-06

Family

ID=48535639

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/009145 WO2013081204A1 (fr) 2011-11-29 2011-11-29 Appareil de traitement de motif par laser à l'aide d'un élément optique à diffraction

Country Status (1)

Country Link
WO (1) WO2013081204A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08179108A (ja) * 1994-12-26 1996-07-12 Matsushita Electric Ind Co Ltd 回折光学素子の加工方法及び加工装置
JPH09103897A (ja) * 1995-10-11 1997-04-22 Sanyo Electric Co Ltd 光加工法
KR20020032607A (ko) * 1999-09-28 2002-05-03 오자와 미토시 레이저천공 가공방법 및 가공장치
KR20080069915A (ko) * 2007-01-24 2008-07-29 소니 가부시끼 가이샤 레이저 드로잉 방법 및 장치
JP2010158686A (ja) * 2009-01-06 2010-07-22 Disco Abrasive Syst Ltd レーザ加工用光学装置、レーザ加工装置およびレーザ加工方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08179108A (ja) * 1994-12-26 1996-07-12 Matsushita Electric Ind Co Ltd 回折光学素子の加工方法及び加工装置
JPH09103897A (ja) * 1995-10-11 1997-04-22 Sanyo Electric Co Ltd 光加工法
KR20020032607A (ko) * 1999-09-28 2002-05-03 오자와 미토시 레이저천공 가공방법 및 가공장치
KR20080069915A (ko) * 2007-01-24 2008-07-29 소니 가부시끼 가이샤 레이저 드로잉 방법 및 장치
JP2010158686A (ja) * 2009-01-06 2010-07-22 Disco Abrasive Syst Ltd レーザ加工用光学装置、レーザ加工装置およびレーザ加工方法

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