WO2013081204A1 - Laser pattern processing apparatus using a diffractive optic element - Google Patents

Laser pattern processing apparatus using a diffractive optic element Download PDF

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Publication number
WO2013081204A1
WO2013081204A1 PCT/KR2011/009145 KR2011009145W WO2013081204A1 WO 2013081204 A1 WO2013081204 A1 WO 2013081204A1 KR 2011009145 W KR2011009145 W KR 2011009145W WO 2013081204 A1 WO2013081204 A1 WO 2013081204A1
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Prior art keywords
lens
optical system
laser
diffraction optical
workpiece
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PCT/KR2011/009145
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French (fr)
Korean (ko)
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장인구
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Jang Ingu
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Priority to PCT/KR2011/009145 priority Critical patent/WO2013081204A1/en
Publication of WO2013081204A1 publication Critical patent/WO2013081204A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting

Definitions

  • the present invention relates to a pattern processing apparatus for forming a pattern using a laser when processing an electronic device, and more particularly, after dispersing a beam using a diffrative optic element (DOE)
  • DOE diffrative optic element
  • the present invention relates to a laser pattern processing apparatus using a diffraction optical system that collects a beam through two lenses and adjusts a focus to a processed lens while processing the pattern to prevent the edge of the workpiece from being tapered.
  • Modern electronic devices commonly require metal thin film patterns for electrodes or wiring. These metal thin film patterns are typically formed through a photolithography process combined with vacuum deposition of a thin film.
  • Photolithography has the advantage of enabling high resolution patterning, but requires expensive equipment, multi-step processes, high energy consumption, and also involves the release of significant amounts of chemical waste by repeated deposition and etching.
  • the conventional patterning processing apparatus 50 transmits the multiple laser beams 51 through the lens 52 and heat energy of the laser in the multiple focusing portion 53 formed thereby.
  • the workpiece 54 is machined to form a pattern.
  • the conventional patterning processing apparatus 50 as described above transmits the multiple laser beams 51 through the lens 52 and the thermal energy of the laser reaches its peak in the multifocal portion 53 formed thereby.
  • the laser beam is obliquely irradiated when the pattern is processed to form a tapered shape (t) at the edge thereof, thereby making it impossible to clean the processed surface.
  • a light source unit for generating a laser, a reflection mirror reflecting the light source, a beam diffraction optical system (DOE), the rear of the beam diffraction optical system (DOE) It consists of a first lens and a second lens for refracting a plurality of beams, and a processed lens for processing the patterned workpiece by adjusting the multiple focal length of the laser beam refracted through the first lens and the second lens
  • DOE beam diffraction optical system
  • the present invention for solving the above object is a processing apparatus for forming a pattern on a workpiece with a multiple laser beam using a diffraction optical system
  • the processing lens is installed at the point where the first lens and the second lens for collecting the beam and the front multiple laser beam of the second lens are intersected so that the workpiece can be processed and patterned while allowing multiple focal projections to the workpiece. Characterized in that consists of.
  • the laser pattern processing apparatus using the diffraction optical system of the present invention enables to process the edge of the workpiece while controlling the focal length of the multiple laser beams refracted through the first lens and the second lens through the processing lens, There is an advantage that the edge shape of the can be processed cleanly.
  • the processing efficiency and quality can be significantly improved by patterning the edge of the workpiece so as not to taper.
  • FIG. 1 is a schematic configuration diagram of a laser pattern processing apparatus using a diffraction optical system according to the present invention
  • FIG. 2 is a schematic state diagram in which an edge of a workpiece is patterned by a processing lens provided in a laser pattern processing apparatus using a diffraction optical system according to the present invention.
  • FIG. 3 is a schematic state diagram in which the edge of the workpiece is variously processed to adjust the patterning width while adjusting the processing lens provided in the laser pattern processing apparatus using the diffraction optical system according to the present invention.
  • FIG. 4 is a schematic state diagram in which the edge of the workpiece is processed while the conventional laser processing apparatus is tapered.
  • diffractive optical system 150 first lens 160: second lens 170: the workpiece
  • processing lens 181 controller
  • stage 191 stage adjuster
  • Laser pattern processing apparatus 100 using a diffraction optical system according to the present invention as shown in Figures 1 to 2,
  • a beam diffusion controller (130) installed in front of the reflection mirror (120) and configured of a concave lens and a convex lens to control diffusion of a laser beam;
  • a diffractive optic element (DOE, diffractive optic element 140) provided in front of the beam diffusion controller 130 to generate a multiple laser beam
  • a first lens 150 and a second lens 160 provided at a predetermined distance in front of the diffraction optical system 140 to collect the laser beams that are diffused and projected by the diffraction optical system 140,
  • a processing lens 180 is installed at a point where the front multi-laser beam of the second lens 160 intersects, so that the processing pattern can be processed while multiple focus is projected on the workpiece 170.
  • the distance L between the diffraction optical system 140 and the first lens 150 is longer than the focal length f1 of the first lens 150.
  • the distance between the first lens 150 and the second lens 160 is configured by adding the focal length f2 of the second lens 160 to the focal length f1 of the first lens 150. do.
  • processing lens 180 is installed at a front side of the second lens 160 at a distance equal to the focal length f2 of the second lens 160.
  • the diffraction optical system 140 and the processing lens 180 are commercially available products and are standard parts that can be purchased and used by anyone.
  • the workpiece 170 is to be mounted to the workpiece stage 190 to install and move it.
  • the workpiece stage 190 is provided with a stage adjuster 191 for controlling it.
  • a controller 181 is connected to the processed lens 180 to easily adjust the patterning width of the workpiece 170 while controlling the distance between the workpiece lens 180 and the workpiece 170.
  • Laser pattern processing apparatus 100 using the diffraction optical system of the present invention configured as described above is to perform the patterning by projecting a laser beam to the workpiece 170 as follows.
  • the diffraction optical system 140 generates a multiple laser beam to project the first lens 150, in which case the multi-laser beam generated by the diffraction optical system 140 reaches the first lens 150. Each is projected in parallel.
  • the respective laser beams are collected up to the focal length f1, and after the focal length f1, the laser beam is diffused and the second lens 160 positioned at the focal length f2. It is projected while expanding to).
  • the multi-laser beam reaching the second lens 160 is refracted by the second lens 160 and is focused on the workpiece 170 spaced apart by a predetermined distance after being crossed from the processed lens 180. Will be formed.
  • the multiple laser beams from the second lens 160 are respectively projected in parallel to the processing lens 180, and the multiple laser beams are focused on the workpiece 170 while passing through the processing lens 180.
  • the workpiece 170 is processed patterned.
  • the workpiece 170 controls the controller 181 connected to the workpiece lens 180 according to its thickness or width by a controller (not shown), thereby providing a distance between the workpiece lens 180 and the workpiece 170.
  • a controller not shown
  • the laser pattern processing apparatus using the diffraction optical system includes a light source unit for generating a laser, a reflection mirror reflecting the light source, a beam diffraction optical system (DOE), and a plurality of beams behind the beam diffraction optical system. It consists of a first lens and a second lens for refraction, and a processed lens for processing the patterned workpiece by adjusting the multi-focal length of the laser beam refracted through the first lens and the second lens, the laser to the workpiece By irradiating multiple focal points of the beam, the edge shape of the pattern is not tapered, thereby greatly improving the processing efficiency and quality.
  • DOE beam diffraction optical system

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention relates to a pattern processing apparatus capable of using a laser during the processing of an electronic device or the like to form a pattern and, more particularly, to a laser pattern processing apparatus using a DOE (diffractive optic element), which uses a DOE to diffuse a beam, then concentrates the beam through two lenses, and adjusts the focus through a processing lens in order to process a pattern so that the edge of the processed object is not tapered.

Description

회절광학계를 이용한 레이저 패턴 가공장치Laser Pattern Processing Equipment Using Diffraction Optical System
본 발명은 전자 소자 등의 가공시에 레이저를 이용하여 패턴을 형성할 수 있도록 하는 패턴 가공장치에 관한 것으로, 더욱 상세하게는 회절광학계(DOE, diffrative optic element)를 이용하여 빔을 분산한 후 2개의 렌즈를 통해 빔을 모아 가공렌즈로 초점을 조절하면서 가공물의 가장자리가 테이퍼(taper)지지 않도록 가공 패터닝 하는 회절광학계를 이용한 레이저 패턴 가공장치에 관한 것이다.The present invention relates to a pattern processing apparatus for forming a pattern using a laser when processing an electronic device, and more particularly, after dispersing a beam using a diffrative optic element (DOE) The present invention relates to a laser pattern processing apparatus using a diffraction optical system that collects a beam through two lenses and adjusts a focus to a processed lens while processing the pattern to prevent the edge of the workpiece from being tapered.
현대의 전자 소자들은 공통적으로, 전극 또는 배선용 금속 박막 패턴을 필요로 한다. 이들 금속 박막 패턴은 통상적으로, 박막의 진공 증착과 결합한 포토리소그래피 공정을 거쳐 형성된다. Modern electronic devices commonly require metal thin film patterns for electrodes or wiring. These metal thin film patterns are typically formed through a photolithography process combined with vacuum deposition of a thin film.
포토리소그래피는 높은 해상도를 갖는 패터닝을 가능케 하는 장점이 있지만, 고가의 장비, 다단계 공정, 많은 에너지 소모를 필요로 하며, 증착과 에칭의 반복으로 상당량의 화학 폐기물의 배출 또한 수반된다. Photolithography has the advantage of enabling high resolution patterning, but requires expensive equipment, multi-step processes, high energy consumption, and also involves the release of significant amounts of chemical waste by repeated deposition and etching.
플렉시블 전자소자의 도래와 더불어 저온에서 대면적화가 가능한 패터닝 공정의 중요성이 제기되고 있으며, 따라서 고비용, 고온공정으로 대표되는 기존의 포토리소그래피 공정을 대체하는 대안을 찾고자 하는 많은 연구개발이 진행되고 있다. With the advent of flexible electronic devices, the importance of patterning processes that can be large-scaled at low temperatures has been raised. Therefore, many researches and developments have been conducted to find alternatives to conventional photolithography processes represented by high cost and high temperature processes.
예컨대, 잉크젯 프린팅, 소프트 리소그래피, 레이저-유도식 포워드 트랜스퍼(laser-indcued forward transfer)등이 있으나, 이와 같은 방식들은 모두 additive patterning방식이라는 장점이 있고 일부는 상당한 기술적 진보를 보이기도 하였으나, 해상도, 신뢰성, 공정속도에 있어서의 각각의 한계로 인해 여전히 포토리소그래피 공정을 대체하지 못하고 있는 실정이다. For example, there are inkjet printing, soft lithography, laser-indcued forward transfer, but all of these methods have the advantage of additive patterning and some have made significant technological advances. Due to their respective limitations in process speed, they still do not replace photolithography processes.
상기와 같은 종래의 패터닝 가공장치(50)는 도 4에 도시되어 있는 바와 같이, 다중 레이저빔(51)을 렌즈(52)를 통해 투과시키고 이로 인해 형성되는 다중 초점부(53)에서 레이저의 열에너지가 절정에 이르러 가공물(54)을 가공하여 패턴을 형성할 수 있도록 하는 구조로 되어 있다.As shown in FIG. 4, the conventional patterning processing apparatus 50 as described above transmits the multiple laser beams 51 through the lens 52 and heat energy of the laser in the multiple focusing portion 53 formed thereby. At a climax, the workpiece 54 is machined to form a pattern.
상기와 같은 종래의 패터닝 가공장치(50)는 다중 레이저빔(51)을 렌즈(52)를 통해 투과시키고 이로 인해 형성되는 다중 초점부(53)에서 레이저의 열에너지가 절정에 이르러 가공물(54)이 가공되어 패턴을 형성될 때 레이저빔이 경사지게 조사되어 그 가장자리부에 테이퍼형상(t)이 형성됨으로써 가공면이 깨끗하게 되지 못하는 단점이 있다.The conventional patterning processing apparatus 50 as described above transmits the multiple laser beams 51 through the lens 52 and the thermal energy of the laser reaches its peak in the multifocal portion 53 formed thereby. The laser beam is obliquely irradiated when the pattern is processed to form a tapered shape (t) at the edge thereof, thereby making it impossible to clean the processed surface.
또한, 가장자리부에 테이퍼형상(t)으로 인해 가공 효율과 품질이 떨어지는 문제가 있다.In addition, due to the tapered shape (t) at the edge portion there is a problem in that the processing efficiency and quality is poor.
이에 본 발명은 상기와 같은 문제를 해결하기 위해 안출된 것으로, 레이저를 발생기키는 광원부와, 상기 광원을 반사시켜주는 반사미러, 빔 회절광학계(DOE), 상기 빔 회절광학계(DOE)의 후방에서 다수개의 빔을 굴절시킬 수 있도록 하는 제1렌즈와 제2렌즈, 및 상기 제1렌즈와 제2렌즈를 통해 굴절되는 레이저 빔의 다중 초점거리를 조절하여 가공물을 가공 패턴닝 하는 가공렌즈로 구성되어, 가공물에 레이저 빔의 다중 초점을 조사시켜 패턴의 가장자리 형상이 테이퍼지지 않도록 하여 가공효율과 품질을 획기적으로 향상시킬 수 있도록 하는 회절광학계를 이용한 레이저 패턴 가공장치를 제공하는데 그 목적이 있다.Accordingly, the present invention has been made to solve the above problems, a light source unit for generating a laser, a reflection mirror reflecting the light source, a beam diffraction optical system (DOE), the rear of the beam diffraction optical system (DOE) It consists of a first lens and a second lens for refracting a plurality of beams, and a processed lens for processing the patterned workpiece by adjusting the multiple focal length of the laser beam refracted through the first lens and the second lens It is an object of the present invention to provide a laser pattern processing apparatus using a diffraction optical system that can dramatically improve the processing efficiency and quality by irradiating a multi-focus of the laser beam to the workpiece so that the edge shape of the pattern is not tapered.
상기 목적을 해결하기 위한 본 발명은 회절광학계를 이용하여 다중레이저빔으로 가공물에 패턴을 형성하는 가공 장치에 있어서,The present invention for solving the above object is a processing apparatus for forming a pattern on a workpiece with a multiple laser beam using a diffraction optical system,
레이저빔을 생성하는 레이저 광원과, 상기 레이저 광원으로부터 발생되는 레이저빔을 반사킬 수 있도록 하는 반사미러와, 상기 반사미러의 전방에 설치되고 오목렌즈와 볼록렌즈로 구성되어 레이저빔의 확산을 조절할 수 있도록 하는 빔확산조절기, 상기 빔확산조절기의 전방에 구비되어 다중레이저빔이 생성될 수 있도록 하는 회절광학계, 상기 회절광학계의 전방에 순차로 일정한 거리를 두면서 구비되고 상기 회절광학계에서 확산되어 투사되는 레이저빔을 모아줄 수 있도록 하는 제1렌즈와 제2렌즈, 및 상기 제2렌즈의 전방 다중레이저빔이 교차되는 지점에 설치되어 가공물에 다중초점이 투사되도록 하면서 가공물이 가공 패터닝될 수 있도록 하는 가공렌즈로 구성되어 이루어진 것을 특징으로 한다.A laser light source for generating a laser beam, a reflection mirror for reflecting the laser beam generated from the laser light source, and a concave lens and a convex lens installed in front of the reflection mirror to control the diffusion of the laser beam. A diffraction optical system provided in front of the beam diffusion controller, a diffraction optical system for generating a multi-laser beam, and a laser provided at a predetermined distance in front of the diffraction optical system and spread and projected from the diffraction optical system The processing lens is installed at the point where the first lens and the second lens for collecting the beam and the front multiple laser beam of the second lens are intersected so that the workpiece can be processed and patterned while allowing multiple focal projections to the workpiece. Characterized in that consists of.
따라서 본 발명의 회절광학계를 이용한 레이저 패턴 가공장치는 제1렌즈와 제2렌즈를 통해 굴절되는 다중의 레이저 빔을 가공렌즈를 통해 그 초점거리를 조절하면서 가공물의 가장자리를 가공할 수 있도록 함으로써, 가공물의 가장자리 형상이 깨끗하게 가공될 수 있는 장점이 있다.Therefore, the laser pattern processing apparatus using the diffraction optical system of the present invention enables to process the edge of the workpiece while controlling the focal length of the multiple laser beams refracted through the first lens and the second lens through the processing lens, There is an advantage that the edge shape of the can be processed cleanly.
또한, 가공물의 가장자리가 테이퍼지지 않도록 패터닝함으로써 가공효율과 품질을 획기적으로 향상시킬 수 있다.In addition, the processing efficiency and quality can be significantly improved by patterning the edge of the workpiece so as not to taper.
도 1은 본 발명에 따른 회절광학계를 이용한 레이저 패턴 가공장치의 개략적인 구성도이고,1 is a schematic configuration diagram of a laser pattern processing apparatus using a diffraction optical system according to the present invention,
도 2는 본 발명에 따른 회절광학계를 이용한 레이저 패턴 가공장치에 구비된 가공렌즈에 의해 가공물의 가장자리가 테이퍼지지 않도록 패터닝되는 개략적인 상태도이고,2 is a schematic state diagram in which an edge of a workpiece is patterned by a processing lens provided in a laser pattern processing apparatus using a diffraction optical system according to the present invention.
도 3은 본 발명에 따른 회절광학계를 이용한 레이저 패턴 가공장치에 구비된 가공렌즈를 조절하면서 가공물의 가장자리가 다양하게 가공되어 패터닝 폭이 조절되는 개략적인 상태도이고,3 is a schematic state diagram in which the edge of the workpiece is variously processed to adjust the patterning width while adjusting the processing lens provided in the laser pattern processing apparatus using the diffraction optical system according to the present invention.
도 4는 종래의 레이저가공장치에 의해 가공물의 가장자리가 테이퍼되면서 가공되는 개략적인 상태도이다.4 is a schematic state diagram in which the edge of the workpiece is processed while the conventional laser processing apparatus is tapered.
<도면 부호의 설명><Description of Drawing>
100:회절광학계를 이용한 레이저 패턴 가공장치100: laser pattern processing apparatus using diffractive optical system
110:레이저광원 120:반사미러 130:빔확산조절기110: laser light source 120: reflection mirror 130: beam diffusion controller
140:회절광학계 150:제1렌즈 160:제2렌즈 170:가공물140: diffractive optical system 150: first lens 160: second lens 170: the workpiece
180:가공렌즈 181:컨트롤러 180: processing lens 181: controller
190:가공물스테이지 191:스테이지조절기190: stage 191: stage adjuster
이하, 본 발명의 바람직한 실시 예를 첨부한 도면을 참조하여 당해 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 설명한다.Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described to be easily carried out by those of ordinary skill in the art.
본 발명에 따른 회절광학계를 이용한 레이저 패턴 가공장치(100)는 도 1 내지 도 2에 도시되어 있는 바와 같이,Laser pattern processing apparatus 100 using a diffraction optical system according to the present invention, as shown in Figures 1 to 2,
레이저빔을 생성하는 레이저 광원(110)과,A laser light source 110 for generating a laser beam,
상기 레이저 광원(110)으로부터 발생되는 레이저빔을 반사킬 수 있도록 하는 반사미러(120)와,A reflection mirror 120 for reflecting the laser beam generated from the laser light source 110;
상기 반사미러(120)의 전방에 설치되고 오목렌즈와 볼록렌즈로 구성되어 레이저빔의 확산을 조절할 수 있도록 하는 빔확산조절기(130),A beam diffusion controller (130) installed in front of the reflection mirror (120) and configured of a concave lens and a convex lens to control diffusion of a laser beam;
상기 빔확산조절기(130)의 전방에 구비되어 다중레이저빔이 생성될 수 있도록 하는 회절광학계(140,DOE, diffractive optic element),A diffractive optic element (DOE, diffractive optic element 140) provided in front of the beam diffusion controller 130 to generate a multiple laser beam,
상기 회절광학계(140)의 전방에 순차로 일정한 거리를 두면서 구비되고 상기 회절광학계(140)에서 확산되어 투사되는 레이저빔을 모아줄 수 있도록 하는 제1렌즈(150)와 제2렌즈(160),A first lens 150 and a second lens 160 provided at a predetermined distance in front of the diffraction optical system 140 to collect the laser beams that are diffused and projected by the diffraction optical system 140,
상기 제2렌즈(160)의 전방 다중레이저빔이 교차되는 지점에 설치되어 가공물(170)에 다중초점이 투사되도록 하면서 가공 패터닝될 수 있도록 하는 가공렌즈(180)로 구성되어 이루어진다.It is composed of a processing lens 180 is installed at a point where the front multi-laser beam of the second lens 160 intersects, so that the processing pattern can be processed while multiple focus is projected on the workpiece 170.
그리고 상기 회절광학계(140)와 상기 제1렌즈(150)와의 거리(L)는 상기 제1렌즈(150)의 초점거리(f1)보다 길게 구성되어 있다.The distance L between the diffraction optical system 140 and the first lens 150 is longer than the focal length f1 of the first lens 150.
또한 상기 제1렌즈(150)와 상기 제2렌즈(160)와의 거리는 상기 제1렌즈(150)의 초점거리(f1)에 상기 제2렌즈(160)의 초점거리(f2)를 더한 길이로 구성된다.In addition, the distance between the first lens 150 and the second lens 160 is configured by adding the focal length f2 of the second lens 160 to the focal length f1 of the first lens 150. do.
그리고 상기 가공렌즈(180)는 상기 제2렌즈(160)의 전방측에 상기 제2렌즈(160)의 초점거리(f2) 만큼의 거리를 두고 설치 구성된다.In addition, the processing lens 180 is installed at a front side of the second lens 160 at a distance equal to the focal length f2 of the second lens 160.
여기서 상기 회절광학계(140)와 상기 가공렌즈(180)는 상용화된 제품으로 누구나 구입 활용되는 표준부품이다.Here, the diffraction optical system 140 and the processing lens 180 are commercially available products and are standard parts that can be purchased and used by anyone.
그리고 상기 가공물(170)은 이를 설치하고 이동할 수 있도록 하는 가공물스테이지(190)에 장착 구비되게 된다.And the workpiece 170 is to be mounted to the workpiece stage 190 to install and move it.
상기 가공물스테이지(190)에는 이를 컨트롤할 수 있도록 하는 스테이지조절기(191)가 연결 구비되어 있다.The workpiece stage 190 is provided with a stage adjuster 191 for controlling it.
또한 상기 가공렌즈(180)에는 컨트롤러(181)가 연결 설치되어 상기 가공렌즈(180)와 상기 가공물(170) 사이의 거리를 조절하면서 상기 가공물(170)의 패터닝 폭을 용이하게 조절할 수 있도록 되어 있다.In addition, a controller 181 is connected to the processed lens 180 to easily adjust the patterning width of the workpiece 170 while controlling the distance between the workpiece lens 180 and the workpiece 170. .
상기와 같이 구성된 본 발명의 회절광학계를 이용한 레이저 패턴 가공장치(100)는 다음과 같이 레이저빔을 상기 가공물(170)에 투사하여 패터닝을 실시하게 된다.Laser pattern processing apparatus 100 using the diffraction optical system of the present invention configured as described above is to perform the patterning by projecting a laser beam to the workpiece 170 as follows.
우선, 상기 레이저광원(110)에서 레이저빔이 발생되면 이를 상기 반사미러(120)에서 반사시켜 상기 빔확산조절기(130)를 통해 상기 회절광학계(140)로 투사된다.First, when a laser beam is generated in the laser light source 110, it is reflected by the reflection mirror 120 and projected to the diffraction optical system 140 through the beam diffusion controller 130.
그러면, 상기 회절광학계(140)에서는 다중레이저빔을 발생시켜 상기 제1렌즈(150)로 투사하게 되는데, 이 경우 상기 회절광학계(140)에서 발생되는 다중레이저빔은 상기 제1렌즈(150)까지 각각 평행하게 투사된다.Then, the diffraction optical system 140 generates a multiple laser beam to project the first lens 150, in which case the multi-laser beam generated by the diffraction optical system 140 reaches the first lens 150. Each is projected in parallel.
이어, 상기 제1렌즈(150)에서는 그 초점거리(f1)까지 각각의 레이저빔이 모아진 후 다시 초점거리(f1) 이후에는 레이져빔이 확산되면서 초점거리(f2)에 위치한 상기 제2렌즈(160)까지 확상되면서 투사된다.Subsequently, in the first lens 150, the respective laser beams are collected up to the focal length f1, and after the focal length f1, the laser beam is diffused and the second lens 160 positioned at the focal length f2. It is projected while expanding to).
그리고, 상기 제2렌즈(160)까지 도달한 다중레이저빔은 상기 제2렌즈(160)에서 굴절되면서 상기 가공렌즈(180)에서 교차된 후 일정거리 만큼 떨어져 있는 상기 가공물(170)에 각각 초점이 형성되게 된다.In addition, the multi-laser beam reaching the second lens 160 is refracted by the second lens 160 and is focused on the workpiece 170 spaced apart by a predetermined distance after being crossed from the processed lens 180. Will be formed.
여기서 상기 제2렌즈(160)에서의 다중레이저빔은 각각 상기 가공렌즈(180)까지 평행하게 투사되고 상기 가공렌즈(180)를 통과하면서 다중레이저빔이 상기 가공물(170)에 초점이 각각 형성됨으로써 상기 가공물(170)이 가공 패터닝된다.Here, the multiple laser beams from the second lens 160 are respectively projected in parallel to the processing lens 180, and the multiple laser beams are focused on the workpiece 170 while passing through the processing lens 180. The workpiece 170 is processed patterned.
이때 상기 가공물(170)은 그 두께나 폭에 따라 상기 가공렌즈(180)에 연결 설치된 상기 컨트롤러(181)를 제어부(미도시)에서 제어하여 상기 가공렌즈(180)와 상기 가공물(170)의 거리를 적절히 조절하여 패터닝 작업을 실시함으로써, 가공물의 가장자리에 형성될 수 있는 테이퍼부가 형성되지 않고 깨끗하게 패터닝될 수 있게 된다.In this case, the workpiece 170 controls the controller 181 connected to the workpiece lens 180 according to its thickness or width by a controller (not shown), thereby providing a distance between the workpiece lens 180 and the workpiece 170. By appropriately adjusting the patterning operation, a tapered portion that can be formed on the edge of the workpiece can be cleanly patterned.
이상과 같이 본 발명의 회절광학계를 이용한 레이저 패턴 가공장치는 레이저를 발생기키는 광원부와, 상기 광원을 반사시켜주는 반사미러, 빔 회절광학계(DOE), 상기 빔 회절광학계의 후방에서 다수개의 빔을 굴절시킬 수 있도록 하는 제1렌즈와 제2렌즈, 및 상기 제1렌즈와 제2렌즈를 통해 굴절되는 레이저 빔의 다중 초점거리를 조절하여 가공물을 가공 패턴닝 하는 가공렌즈로 구성되어, 가공물에 레이저 빔의 다중 초점을 조사시켜 패턴의 가장자리 형상이 테이퍼지지 않도록 하여 가공효율과 품질을 획기적으로 향상시킬 수 있게 된다.As described above, the laser pattern processing apparatus using the diffraction optical system includes a light source unit for generating a laser, a reflection mirror reflecting the light source, a beam diffraction optical system (DOE), and a plurality of beams behind the beam diffraction optical system. It consists of a first lens and a second lens for refraction, and a processed lens for processing the patterned workpiece by adjusting the multi-focal length of the laser beam refracted through the first lens and the second lens, the laser to the workpiece By irradiating multiple focal points of the beam, the edge shape of the pattern is not tapered, thereby greatly improving the processing efficiency and quality.

Claims (4)

  1. 회절광학계를 이용하여 다중레이저빔으로 가공물에 패턴을 형성하는 가공 장치에 있어서,A processing apparatus for forming a pattern on a workpiece with a multiple laser beam using a diffraction optical system,
    레이저빔을 생성하는 레이저 광원과,A laser light source for generating a laser beam,
    상기 레이저 광원으로부터 발생되는 레이저빔을 반사킬 수 있도록 하는 반사미러와,A reflection mirror to reflect the laser beam generated from the laser light source,
    상기 반사미러의 전방에 설치되고 오목렌즈와 볼록렌즈로 구성되어 레이저빔의 확산을 조절할 수 있도록 하는 빔확산조절기,A beam diffusion controller which is installed in front of the reflection mirror and composed of a concave lens and a convex lens to control the diffusion of the laser beam;
    상기 빔확산조절기의 전방에 구비되어 다중레이저빔이 생성될 수 있도록 하는 회절광학계,A diffraction optical system provided in front of the beam diffusion controller to generate a multiple laser beam,
    상기 회절광학계의 전방에 순차로 일정한 거리를 두면서 구비되고 상기 회절광학계에서 확산되어 투사되는 레이저빔을 모아줄 수 있도록 하는 제1렌즈와 제2렌즈, 및A first lens and a second lens which are provided with a predetermined distance in front of the diffraction optical system in order to collect laser beams that are diffused and projected by the diffraction optical system, and
    상기 제2렌즈의 전방 다중레이저빔이 교차되는 지점에 설치되어 가공물에 다중초점이 투사되도록 하면서 가공물이 가공 패터닝될 수 있도록 하는 가공렌즈로 구성되어 이루어진 것을 특징으로 하는 회절광학계를 이용한 레이저 패턴 가공장치.Laser pattern processing apparatus using a diffraction optical system, characterized in that the lens is installed at the point where the front multi-laser beam of the second lens intersects, the processing lens to be processed patterned while allowing the multi-focus projection on the workpiece .
  2. 제1항에 있어서,The method of claim 1,
    상기 회절광학계와 상기 제1렌즈와의 거리는 상기 제1렌즈의 초점거리보다 길게 구성되고, 상기 제1렌즈와 상기 제2렌즈와의 거리는 상기 제1렌즈의 초점거리에 상기 제2렌즈의 초점거리를 더한 길이로 구성되며, 상기 가공렌즈는 상기 제2렌즈의 전방측에 상기 제2렌즈의 초점거리 만큼의 거리를 두고 설치 구성되어 이루어진 것을 특징으로 하는 회절광학계를 이용한 레이저 패턴 가공장치.The distance between the diffraction optical system and the first lens is longer than the focal length of the first lens, and the distance between the first lens and the second lens is a focal length of the second lens at a focal length of the first lens. And the processed lens is provided at the front side of the second lens at a distance equal to the focal length of the second lens.
  3. 제2항에 있어서,The method of claim 2,
    상기 가공렌즈에는 상기 가공렌즈와 상기 가공물 사이의 거리를 조절하면서 상기 가공물의 가공 패터닝 폭을 조절할 수 있도록 하는 컨트롤러가 연결 설치되어 이루어진 것을 특징으로 하는 회절광학계를 이용한 레이저 패턴 가공장치.And a controller for controlling the processing patterning width of the workpiece while adjusting the distance between the workpiece lens and the workpiece, the processing lens being connected to the processed lens.
  4. 제3항에 있어서,The method of claim 3,
    상기 회절광학계에서 발생되는 다중레이저빔은 상기 제1렌즈까지 각각 평행하게 투사될 수 있도록 구성되고, 상기 제2렌즈에서 굴절되는 다중레이저빔은 각각 상기 가공렌즈까지 평행하게 투사될 수 있도록 구성된 것을 특징으로 하는 회절광학계를 이용한 레이저 패턴 가공장치.The multi-laser beam generated in the diffraction optical system is configured to be projected in parallel to each of the first lens, and the multi-laser beam refracted in the second lens is configured to be projected in parallel to the processed lens, respectively. Laser pattern processing apparatus using a diffraction optical system.
PCT/KR2011/009145 2011-11-29 2011-11-29 Laser pattern processing apparatus using a diffractive optic element WO2013081204A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08179108A (en) * 1994-12-26 1996-07-12 Matsushita Electric Ind Co Ltd Method and device for machining diffraction optical element
JPH09103897A (en) * 1995-10-11 1997-04-22 Sanyo Electric Co Ltd Laser beam machining method
KR20020032607A (en) * 1999-09-28 2002-05-03 오자와 미토시 Laser drilling method and laser drilling device
KR20080069915A (en) * 2007-01-24 2008-07-29 소니 가부시끼 가이샤 Laser drawing method and apparatus
JP2010158686A (en) * 2009-01-06 2010-07-22 Disco Abrasive Syst Ltd Optical device for laser processing, laser processing device and laser processing method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08179108A (en) * 1994-12-26 1996-07-12 Matsushita Electric Ind Co Ltd Method and device for machining diffraction optical element
JPH09103897A (en) * 1995-10-11 1997-04-22 Sanyo Electric Co Ltd Laser beam machining method
KR20020032607A (en) * 1999-09-28 2002-05-03 오자와 미토시 Laser drilling method and laser drilling device
KR20080069915A (en) * 2007-01-24 2008-07-29 소니 가부시끼 가이샤 Laser drawing method and apparatus
JP2010158686A (en) * 2009-01-06 2010-07-22 Disco Abrasive Syst Ltd Optical device for laser processing, laser processing device and laser processing method

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