CN203076787U - Processing device by using laser direct imaging technology - Google Patents
Processing device by using laser direct imaging technology Download PDFInfo
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- CN203076787U CN203076787U CN 201220737165 CN201220737165U CN203076787U CN 203076787 U CN203076787 U CN 203076787U CN 201220737165 CN201220737165 CN 201220737165 CN 201220737165 U CN201220737165 U CN 201220737165U CN 203076787 U CN203076787 U CN 203076787U
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Abstract
The utility model relates to a processing device by using laser direct imaging technology. A beam of laser transmitted by an ultrashort pulse laser device enters a first beam expander, the laser beam is expanded by the first beam expander, wherein the expanding times of the first beam expander is adjustable, and then the laser beam enters into a digital light processing (DLP) chip through a first 45-degree half reflecting mirror. The DLP chip is controlled by a computer aided manufacturing (CAM) work station, the CAM work station outputs images directly, the images enter the DLP chip, and the laser beam is modulated by a digital micro mirror device (DMD) system. The modulated laser beam is reflected by a second 45-degree half reflecting mirror, then the laser beam is expanded or focused through a second beam expander, wherein the expanding times of the second beam expander is adjustable, and the laser beam is focused on a printed circuit board under the action of the second beam expander. Before processing, a charge coupled device (CCD) sensor senses the position of a sample and calibrates the position of the sample with an automatic focusing (AF) unit, and thus a laser path is calibrated. The processing device by using the laser direct imaging technology has the advantages of being simple to operate, good in quality and high in processing efficiency. Further, samples processed through the processing device is high in fineness.
Description
Technical field
The utility model relates to a kind of laser direct imaging processing unit (plant), belongs to the laser process equipment technical field.
Background technology
Without the micro-shadow technology of light shield, be called again direct imaging, there is splendid advantage in the products such as semiconductor and personal computer motherboard, compared to the micro-shadow technology of tradition, need use light shield by image imaging on photoresistance, not only save cost without the micro-shadow technology of light shield, also have more elasticity in use
.the groundwork mode is directly to utilize the data of CAM work station output, and the driving laser imaging device carries out pattern imaging being coated with on the printed circuit board of photoresist.
Traditional printed circuit exposure method is the method for using the UV-irradiation light shield, needs adding of light shield egative film in process, and in this method, because the ultraviolet light uniformity is different, near the re-covering property of live width edge is bad; In addition, there is the problem of breathing in egative film, to precision, can impact, and has tens errors to the hundreds of micron on the circuit board of 500mm; Along with the development of circuit board technology, the size that circuit board line requires becomes more and more thinner, has caused the reduction of productivity ratio and product quality simultaneously.
The utility model content
The purpose of this utility model is to overcome the deficiency that prior art exists, and a kind of laser direct imaging processing unit (plant) is provided.
The purpose of this utility model is achieved through the following technical solutions:
The laser direct imaging processing unit (plant), characteristics are: the output at ultrashort pulse laser is furnished with the first beam expanding lens, the output of the first beam expanding lens is provided with the one 45 degree half anti-mirror, the reflection output of the one 45 degree half anti-mirror is furnished with the DLP chip, the output of DLP chip is arranged by the 2 45 degree half anti-mirror, the transmission output of the 2 45 degree half anti-mirror is furnished with the second beam expanding lens, described the second beam expanding lens is right against workbench, described workbench comprises the X-axis delivery unit, Y-axis delivery unit and refractory ceramics substrate, the X-axis delivery unit comprises the X-axis slide rail and controls the motor of X-axis slide rail motion, the Y-axis delivery unit comprises the Y-axis slide rail and controls the motor of Y-axis slide rail motion, the Y-axis delivery unit is installed on the X-axis slide rail of X-axis delivery unit, the refractory ceramics substrate is placed on the Y-axis slide rail of Y-axis delivery unit, fixing printed circuit board sample on the refractory ceramics substrate, ccd sensor and AF unit are installed on the refractory ceramics substrate, ccd sensor is connected mnemon with the AF unit.
Further, above-mentioned laser direct imaging processing unit (plant), wherein, described ultrashort pulse laser is the laser instrument that wavelength is the 405nm blue wave band.
Further, above-mentioned laser direct imaging processing unit (plant), wherein, described DLP chip adopts the chip that model is DLP9500, DLP7000 or DLP3000.
Further, above-mentioned laser direct imaging processing unit (plant), wherein, described ccd sensor is CCD real-time photography monitoring sensor.
Again further, above-mentioned laser direct imaging processing unit (plant), wherein, described AF(focuses automatically) unit makes the laser beam focusing on base material, and base material is carried out to exposure-processed.
The substantive distinguishing features that technical solutions of the utility model are outstanding and significant progressive being mainly reflected in:
The utility model is by being incident upon ultra-short pulse laser on the DLP chip, and by the image of CAM work station output, laser beam is modulated, by optics, light beam is incident upon on processed sample and makes its exposure again, have simple to operate, the processed sample fineness is high, quality better and working (machining) efficiency high.Utilize the digital micro-mirror system, angle by each micro mirror is controlled the parameters such as the shape, size, gray scale of hot spot, in conjunction with mobile example platform, circuit board is carried out to exposure-processed fast, the not accurate enough problem of processing that does not have egative film breathing to cause to obtain plane of exposure, the laser beam after simultaneously focusing on can be processed very meticulous circuit.
The accompanying drawing explanation
Below in conjunction with accompanying drawing, technical solutions of the utility model are described further:
Fig. 1: structural representation of the present utility model.
The specific embodiment
As shown in Figure 1, the laser direct imaging processing unit (plant), output at ultrashort pulse laser 1 is furnished with the first beam expanding lens 2, the output of the first beam expanding lens 2 is provided with the one 45 degree half anti-mirror 3, the reflection output of the one 45 degree half anti-mirror 3 is furnished with DLP chip 4, the output of DLP chip 4 is arranged by the 2 45 degree half anti-mirror 5, the transmission output of the 2 45 degree half anti-mirror 5 is furnished with the second beam expanding lens 6, described the second beam expanding lens 6 is right against workbench, workbench comprises the X-axis delivery unit, Y-axis delivery unit and refractory ceramics substrate, the X-axis delivery unit comprises the X-axis slide rail and controls the motor of X-axis slide rail motion, the Y-axis delivery unit comprises the Y-axis slide rail and controls the motor of Y-axis slide rail motion, the Y-axis delivery unit is installed on the X-axis slide rail of X-axis delivery unit, the refractory ceramics substrate is placed on the Y-axis slide rail of Y-axis delivery unit, fixing printed circuit board sample on the refractory ceramics substrate, ccd sensor 8 and AF unit 7 are installed on the refractory ceramics substrate, ccd sensor 8 is connected mnemon 9 with AF unit 7.The base material treatment position is determined in ccd sensor 8 monitorings.AF unit 7 is focused on this position laser automatically.Mnemon 9 can be proofreaied and correct Working position under ccd sensor 8 and AF unit 7 auxiliary.
Wherein, ultrashort pulse laser 1 is the laser instrument that wavelength is the 405nm blue wave band; DLP chip 4 is chips that model is DLP9500, DLP7000 and DLP3000; Support respectively three kinds of different resolution ratio: 1920 * 1080ppi(pixel), 1024 * 768ppi and 800 * 480ppi.The equipment of three kinds of respectively corresponding high, normal, basic three kinds of different models of resolution ratio.Ccd sensor 8 is CCD real-time photography monitoring sensors; AF unit 7 is the unit of automatically focusing.
Said apparatus adds man-hour for laser direct imaging, ultrashort pulse laser 1 sends laser and enters the first beam expanding lens 2, realize the amplification of light beam through the first beam expanding lens 2 of adjustable multiple, enter DLP chip 4 after the one 45 degree half anti-mirror 3, DLP chip 4 is controlled by the CAM work station, the direct output image of CAM work station enters DLP chip 4, DMD system in DLP chip 4 is modulated light beam, each micro mirror in the DMD system is subject to instruction to control swaying direction, the shape of beam and focus, the parameters such as gray scale are modulated, thereby reach the hot spot requirement needed, finally printed circuit board is carried out to exposure-processed, light beam after modulation is after the 2 45 degree half anti-mirror 5 transmissions, the second beam expanding lens 6 through adjustable multiple amplifies or focuses on again, and light beam is acted on printed circuit board by the second beam expanding lens 6 to focus on, first being processed, ccd sensor 8 perception sample positions, and with 7 common calibration sample positions, AF unit, by X-axis delivery unit, Y-axis delivery unit mobile platform, realize that the XY direction moves, the position of the ccd sensor 8 be connected with mnemon 9 and AF unit 7 perception samples, and carry out the light path calibration.Can arrange a plurality of light path systems in same imaging device, a plurality of light beams of formation carry out operation simultaneously, and production efficiency improves greatly.
Due to the use of having abandoned the light shield egative film, therefore, operation greatly reduces, and the working time is reduction greatly also, and production efficiency significantly improves.
The utility model is by being incident upon ultra-short pulse laser on the DLP chip, and by the image of CAM work station output, laser beam is modulated, by optics, light beam is incident upon on processed sample and makes its exposure again, have simple to operate, the processed sample fineness is high, quality better and working (machining) efficiency high.Utilize the digital micro-mirror system, angle by each micro mirror is controlled the parameters such as the shape, size, gray scale of hot spot, in conjunction with mobile example platform, circuit board is carried out to exposure-processed fast, the not accurate enough problem of processing that does not have egative film breathing to cause to obtain plane of exposure, the laser beam after simultaneously focusing on can be processed very meticulous circuit.
Need to understand: the above is only preferred embodiment of the present utility model; for those skilled in the art; under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.
Claims (4)
1. laser direct imaging processing unit (plant), it is characterized in that: the output at ultrashort pulse laser (1) is furnished with the first beam expanding lens (2), the output of the first beam expanding lens (2) is provided with the one 45 degree half anti-mirror (3), the reflection output of the one 45 degree half anti-mirror (3) is furnished with DLP chip (4), the output of DLP chip (4) is arranged by the 2 45 degree half anti-mirror (5), the transmission output of the 2 45 degree half anti-mirror (5) is furnished with the second beam expanding lens (6), described the second beam expanding lens (6) is right against workbench, described workbench comprises the X-axis delivery unit, Y-axis delivery unit and refractory ceramics substrate, the X-axis delivery unit comprises the X-axis slide rail and controls the motor of X-axis slide rail motion, the Y-axis delivery unit comprises the Y-axis slide rail and controls the motor of Y-axis slide rail motion, the Y-axis delivery unit is installed on the X-axis slide rail of X-axis delivery unit, the refractory ceramics substrate is placed on the Y-axis slide rail of Y-axis delivery unit, fixing printed circuit board sample on the refractory ceramics substrate, ccd sensor (8) and AF unit (7) are installed on the refractory ceramics substrate, ccd sensor (8) is connected mnemon (9) with AF unit (7).
2. laser direct imaging processing unit (plant) according to claim 1, it is characterized in that: described ultrashort pulse laser (1) is the laser instrument that wavelength is the 405nm blue wave band.
3. laser direct imaging processing unit (plant) according to claim 1, it is characterized in that: described DLP chip (4) is the chip that model is DLP9500, DLP7000 or DLP3000.
4. laser direct imaging processing unit (plant) according to claim 1, it is characterized in that: described ccd sensor (8) is CCD real-time photography monitoring sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220737165 CN203076787U (en) | 2012-12-28 | 2012-12-28 | Processing device by using laser direct imaging technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220737165 CN203076787U (en) | 2012-12-28 | 2012-12-28 | Processing device by using laser direct imaging technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203076787U true CN203076787U (en) | 2013-07-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220737165 Withdrawn - After Issue CN203076787U (en) | 2012-12-28 | 2012-12-28 | Processing device by using laser direct imaging technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203076787U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103028842A (en) * | 2012-12-28 | 2013-04-10 | 苏州德龙激光股份有限公司 | Device and method for processing laser direct imaging |
| CN105549550A (en) * | 2015-11-30 | 2016-05-04 | 北大方正集团有限公司 | Laser direct imaging data transferring method and device |
-
2012
- 2012-12-28 CN CN 201220737165 patent/CN203076787U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103028842A (en) * | 2012-12-28 | 2013-04-10 | 苏州德龙激光股份有限公司 | Device and method for processing laser direct imaging |
| CN103028842B (en) * | 2012-12-28 | 2014-12-31 | 苏州德龙激光股份有限公司 | Device and method for processing laser direct imaging |
| CN105549550A (en) * | 2015-11-30 | 2016-05-04 | 北大方正集团有限公司 | Laser direct imaging data transferring method and device |
| CN105549550B (en) * | 2015-11-30 | 2018-02-02 | 北大方正集团有限公司 | Laser direct imaging data transfering method and device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20130724 Effective date of abandoning: 20141231 |
|
| RGAV | Abandon patent right to avoid regrant |