CN108073045A - A kind of double story board write-through exposure machine systems - Google Patents
A kind of double story board write-through exposure machine systems Download PDFInfo
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- CN108073045A CN108073045A CN201610973547.9A CN201610973547A CN108073045A CN 108073045 A CN108073045 A CN 108073045A CN 201610973547 A CN201610973547 A CN 201610973547A CN 108073045 A CN108073045 A CN 108073045A
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- dmd
- light
- mirror device
- exposure
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
- G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The present invention relates to laser explosure technologies, and in particular to a kind of double story board laser direct-writing formula exposure machine systems.One DMD of scanning type laser write-through exposure device currently on the market can only export a band, the intensity of exposure energy can be sacrificed to expand exposure covering surface using the mode for the multiplying power for changing camera lens, can cause that complexity and system cost of system etc. significantly improve, system stability can decline using the mode that multiple DMD are combined.The present invention is mounted with a beam splitting system under DMD, by the reflected light on digital micro-mirror device point to both sides, exponentially improves individual digit micro-mirror device（DMD）The area covered.Under equal conditions, the required digital micro-mirror device of the present invention（DMD）Quantity there was only the half of the prior art.Due to significantly reducing digital micro-mirror device（DMD）Usage amount, the complexity of system is reduced, also improves the stability of system operation；DMD input amounts halve simultaneously, also significantly reduce equipment cost.
Description
Technical field
The present invention relates to laser explosure technologies, and in particular to a kind of double story board write-through exposure machine systems.
Background technology
In the laser direct-write photoetching field that semiconductor and PCB are manufactured, using the scan exposure of the direct image technology of laser
Principle is as follows：Using digital micro-mirror device, (Digital Micromirror Device, the referred to as micromirror of (DMD) are turned at a high speed
Turn ability, with reference to appropriate light source and projection optical system, when micromirror is ON, emergent light can project substrate, work as micro mirror
When piece is OFF, emergent light will project light path, not have emergent light in substrate.By continuously to DMD project uniform light, while in real time,
Collective changes the on off state of micromirror array, achievees the purpose that expose different pattern on substrate.
At present, the scan exposure process of single DMD is：The scan axis of control platform at the uniform velocity moves, while platform moves
The position signal fed back to data processing module feedback position signal, data processing module according to platform generates the figure of the position
As being incident upon on DMD, DMD images the reflected beams to substrate complete the exposure work of the position；This mode, single pass can be with
Form a strip scanning strip；The actual domain for needing scan exposure is all much larger than the width of strip scanning strip, so needing
Multiple-Scan.
Scanning type laser write-through exposure device in the market, optical texture is as shown in figure 3, wherein, light source 310 is in light
The light needed for exposure is sent under the control of source control module 320, light is posted to digital micro-mirror device（DMD）At 110, number
The direction that word micro-mirror device 110 adjusts emergent light forms exposure image, and by exposure image directive level-one imaging system 120, one
Secondary imaging system 120 completes focal imaging and exports an exposure bands, and in the prior art, a DMD can only export a band.
In order to improve the width of single sweep operation, the technical solution mainly taken at present has：
1）Change the multiplying power of camera lens, make DMD hot spot biggers, although this mode can improve the width of strip scanning strip, sacrifice
The energy intensity of exposure light source and the minimum process precision of machine；
2）Use multiple DMD lens groups：Multiple-Scan is needed using single DMD exposures, thus can be caused when large area is processed
Production capacity is low；Multiple DMD combinations can significantly promote production capacity, if accomplishing the ability of a full page covering, it is necessary to the DMD used
Quantity will be more.If accomplishing 50um line widths, the ability of the wide full page covering of the plate of 600mm, it is necessary to DMD quantity mesh
Preceding at 12 or more, if data processing method is not proper, data processing amount is very big, the office that will cause system schema that can not implement
Face；In addition equipment uses multiple DMD, and equipment investment is of high cost.Therefore in order to reduce equipment investment, reduce system enforcement difficulty,
The usage amount that DMD is reduced in the case where keeping exposing work efficiency, which is one, needs the technological difficulties broken through.
The content of the invention
It is an object of the invention to provide a kind of double story board write-through exposure machine systems, expose skill compared with traditional direct write
The DMD usage amounts in exposure machine are greatly reduced while system exposure efficiency is ensured, reduces cost input, reduces for art
The complexity of system.
In order to reach above-mentioned technical purpose, the technical scheme is that：A kind of double story board write-through exposure machine systems
System, including optical system, plateform system, light-source system, communication module, computer, data processing module and pedestal；Platform system
System is mounted on pedestal, and plateform system is divided into stepping platform and scanning platform, and the position of scanning platform is on stepping platform；
Computer is respectively connected with plateform system, communication module, data processing module；Light-source system is by light source control module and light source
Composition, light source control module are connected with communication module；Optical system is connected with communication module；Optical system and light source system
System is installed on scanning platform；Optical system is by digital micro-mirror device, level-one imaging system, beam splitting system and secondary imaging
System forms；Level-one imaging system is mounted below digital micro-mirror device, and beam splitting system is mounted on the lower section of level-one imaging system,
Secondary imaging system is mounted below beam splitting system.
Preferably, above-mentioned beam splitting system is divided into left and right two, and every is led by a Y-axis light guiding prism and X axis
Light prism connection composition；The lower section of left and right two of beam splitting system is also sequentially installed by have dislocation fine tuning prism and optical path difference compensation rib
Mirror.
Preferably, present invention additionally comprises an error correction module, the error correction module is mounted on scanning platform
Above and with data processing module it is connected.
Preferably, data processing module is made of fpga chip and ram memory cell and DLP processing units.
The technical effects of the invention are that：Compared with the prior art, the present invention is mounted with one under digital micro-mirror device
Beam splitting system by the reflected light on digital micro-mirror device point to both sides, exponentially improves individual digit micro-mirror device（DMD）Institute
The area of covering.Under equal conditions, double required digital micro-mirror dresses of story board write-through exposure machine system provided by the invention
It puts（DMD）Quantity there was only the half of the prior art.Due to significantly reducing digital micro-mirror device（DMD）Usage amount, system
Complexity be reduced, also improve the stability of system operation；Simultaneously DMD input amounts halve, significantly reduce equipment into
This.
Description of the drawings：
Fig. 1 is the dimensional structure diagram of the present invention；
Fig. 2 is the schematic block diagram of each component connection relation in the present invention；
Fig. 3 is the structure diagram of optical system in the prior art；
Fig. 4 is the structure diagram of optical system in the present invention；
Fig. 5 is the dimensional structure diagram of beam splitting system in the present invention.
Specific embodiment：
The specific embodiment of the present invention is described in detail below in conjunction with attached drawing.1 and attached drawing 2 referring to the drawings, a kind of double points
Camera lens write-through exposure machine system, including optical system 100, plateform system 200, light-source system 300, communication module 400, calculating
Machine 500, data processing module 600 and pedestal 800；Plateform system 200 is mounted on pedestal 800, and plateform system 200 divides for step
Into platform 210 and scanning platform 220, the position of scanning platform 220 is on stepping platform 210；The computer 500 with
Plateform system 200, communication module 400, data processing module 600 are respectively connected with；The light-source system 300 is by light source control
Module 320 and light source 310 form, and the light source control module 320 is connected with communication module 400；The optical system
100 are connected with communication module 400；The optical system 100 and light-source system 300 is installed on scanning platform 220；
Referring to the drawings 4, the optical system 100 by digital micro-mirror device 110, level-one imaging system 120, beam splitting system 130 and
Secondary imaging system 140 forms；Level-one imaging system 120 is mounted on 110 lower section of digital micro-mirror device, and beam splitting system 130 is installed
In the lower section of level-one imaging system 120, secondary imaging system 140 is mounted on 130 lower section of beam splitting system.
In actual use, light source 310 exists a kind of double story board write-through exposure machine systems provided by the present invention first
The light needed for exposure is sent under the control of light source control module 320, light is posted at digital micro-mirror device 110, data
Processing module 600 sends image data, digital micro-mirror by computer 500 and communication module 400 to digital micro-mirror device 110
The direction that device 110 adjusts emergent light under the control of data processing module 600 forms exposure image, and by exposure image directive
Level-one imaging system 120；Exposure image is invested beam splitting system 130 by level-one imaging system 120, and beam splitting system 130 is by exposure diagram
As point to both sides, subsequently into secondary imaging system 140, secondary imaging system 140 is by exposure image directive stepping platform 210.
Since beam splitting system 130 divides image two, 2 exposure regions can be projected out on stepping platform 210, it is compared with prior art, more
One exposure region, the photosensitive-member being carried on stepping platform 210 can be exposed by the two exposure regions.Stepping platform 210 along
Axially into places multistep into action, per stepping once, scanning platform 220 does a scanning motion singly plowed to stepping platform 210, such as
This lasting progress can then cover the whole of photosensitive-member.In exposure process, the control of control computer 500 light-source system 300,
Plateform system 200, optical system 100 and data processing module 600, are allowed to cooperate.
Preferably, beam splitting system 130 can realize that light two divides by prism arrangement, referring to the drawings 5, beam splitting system
130 points are left and right two, and every is made of a Y-axis light guiding prism 131 and the connection of X axis light guiding prism 132；Light splitting system
The lower section of left and right two of system 130 is also sequentially installed by have dislocation fine tuning prism 133 and optical path difference compensating prism 134.Beam splitting system 130
Light is carried out Y-axis deviation by Y-axis light guiding prism 131 on each, and the X axis in beam splitting system 130 each is guide-lighting
Light is carried out X axis deviation by prism 132, to achieve the purpose that divide light two.Dislocation fine tuning prism 133 finely tunes light in x
With the distance to misplace on y directions, optical path difference compensating prism 134 compensates the optical path difference of two parts light.
Since the movement of plateform system 200 is there are error, actual exposure position and desired exposure position may result in not
It is unified, it is preferred that referring to the drawings 2, present invention additionally comprises an error correction module 700, error correction module 700 is mounted on and sweeps
It retouches on platform 220 and is connected with data processing module 600.Error correction module 700 scans for receiving on scanning platform 220
Accurate location information after site error is corrected, is then sent to data processing module 600 by the position signal of axis.
Preferably, data processing module 600 is by fpga chip 601 and ram memory cell 602 and DLP processing units 603
Composition；Fpga chip 601 is mainly used for data processing, and ram memory cell 602 is stored for data, and DLP processing units 603 drive
Dynamic digital micro-mirror device 110 performs image display.
It should be appreciated that the specific embodiments described herein are merely to illustrate and explain the present invention, it is not used to
The limitation present invention.All embodiments drawn based on the principle of the invention are within protection scope of the present invention.
Claims (4)
1. a kind of double story board write-through exposure machine systems, including optical system（100）, plateform system（200）, light-source system
（300）, communication module（400）, computer（500）, data processing module（600）And pedestal（800）；Plateform system（200）
Mounted on pedestal（800）On, plateform system（200）It is divided into stepping platform（210）And scanning platform（220）, scanning platform（220）
Position be in stepping platform（210）On；The computer（500）With plateform system（200）, communication module（400）, number
According to processing module（600）It is respectively connected with；The light-source system（300）By light source control module（320）And light source（310）Group
Into the light source control module（320）With communication module（400）It is connected；The optical system（100）With communication module
（400）It is connected；The optical system（100）And light-source system（300）It is installed in scanning platform（220）On；It is special
Sign is：The optical system（100）By digital micro-mirror device（110）, level-one imaging system（120）, beam splitting system（130）
And secondary imaging system（140）Composition；Level-one imaging system（120）Mounted on digital micro-mirror device（110）Lower section, light splitting system
System（130）Mounted on level-one imaging system（120）Lower section, secondary imaging system（140）Mounted on beam splitting system（130）Under
Side.
2. a kind of double story board write-through exposure machine systems according to claim 1, it is characterised in that：The light splitting system
System（130）It is divided into left and right two, every by a Y-axis light guiding prism（131）With X axis light guiding prism（132）Connection group
Into；The beam splitting system（130）Also sequentially installation has dislocation fine tuning prism the lower section of left and right two（133）It is compensated with optical path difference
Prism（134）.
3. a kind of double story board laser direct-writing formula exposure machine systems according to claim 1 or claim 2, feature exist
In：Further include an error correction module（700）, the error correction module（700）Mounted on scanning platform（220）On simultaneously
With data processing module（600）It is connected.
4. a kind of double story board laser direct-writing formula exposure machine systems according to claim 1 or claim 2, feature exist
In：The data processing module（600）By fpga chip（603）And ram memory cell（602）And DLP processing units
（601）Composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610973547.9A CN108073045A (en) | 2016-11-07 | 2016-11-07 | A kind of double story board write-through exposure machine systems |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610973547.9A CN108073045A (en) | 2016-11-07 | 2016-11-07 | A kind of double story board write-through exposure machine systems |
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| Publication Number | Publication Date |
|---|---|
| CN108073045A true CN108073045A (en) | 2018-05-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610973547.9A Pending CN108073045A (en) | 2016-11-07 | 2016-11-07 | A kind of double story board write-through exposure machine systems |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110456612A (en) * | 2019-07-02 | 2019-11-15 | 苏州源卓光电科技有限公司 | A kind of high efficiency projecting etching imaging system and exposure method |
| CN111025858A (en) * | 2019-12-27 | 2020-04-17 | 合肥众群光电科技有限公司 | Equipment for realizing ultra-high-speed exposure |
| CN114076750A (en) * | 2020-08-20 | 2022-02-22 | 深圳华大智造科技股份有限公司 | Super-resolution imaging device and method, biological sample identification system and identification method |
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| JP2012247711A (en) * | 2011-05-30 | 2012-12-13 | Orc Manufacturing Co Ltd | Exposure device |
| CN104950587A (en) * | 2014-03-25 | 2015-09-30 | 上海微电子装备有限公司 | Exposure device and exposure method |
| CN205539932U (en) * | 2016-03-18 | 2016-08-31 | 江苏影速光电技术有限公司 | A duplex platform vertical light exposure device |
| CN105954980A (en) * | 2016-07-20 | 2016-09-21 | 马颖鏖 | Ultraviolet exposure machine based on digital micromirror array and control method thereof |
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2016
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101320222A (en) * | 2008-07-02 | 2008-12-10 | 中国科学院光电技术研究所 | Stepping maskless digital exposure device based on digital micromirror array |
| JP2012247711A (en) * | 2011-05-30 | 2012-12-13 | Orc Manufacturing Co Ltd | Exposure device |
| CN104950587A (en) * | 2014-03-25 | 2015-09-30 | 上海微电子装备有限公司 | Exposure device and exposure method |
| CN205539932U (en) * | 2016-03-18 | 2016-08-31 | 江苏影速光电技术有限公司 | A duplex platform vertical light exposure device |
| CN105954980A (en) * | 2016-07-20 | 2016-09-21 | 马颖鏖 | Ultraviolet exposure machine based on digital micromirror array and control method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110456612A (en) * | 2019-07-02 | 2019-11-15 | 苏州源卓光电科技有限公司 | A kind of high efficiency projecting etching imaging system and exposure method |
| CN111025858A (en) * | 2019-12-27 | 2020-04-17 | 合肥众群光电科技有限公司 | Equipment for realizing ultra-high-speed exposure |
| CN114076750A (en) * | 2020-08-20 | 2022-02-22 | 深圳华大智造科技股份有限公司 | Super-resolution imaging device and method, biological sample identification system and identification method |
| CN114076750B (en) * | 2020-08-20 | 2024-05-10 | 深圳华大智造科技股份有限公司 | Super-resolution imaging device and method, biological sample identification system and identification method |
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