WO2013078699A1 - 修复线系统及其修复方法 - Google Patents
修复线系统及其修复方法 Download PDFInfo
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- WO2013078699A1 WO2013078699A1 PCT/CN2011/083438 CN2011083438W WO2013078699A1 WO 2013078699 A1 WO2013078699 A1 WO 2013078699A1 CN 2011083438 W CN2011083438 W CN 2011083438W WO 2013078699 A1 WO2013078699 A1 WO 2013078699A1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
Definitions
- the invention relates to the field of liquid crystal panel manufacturing, in particular to a repair line system for a liquid crystal panel and a repairing method thereof.
- FIG. 1 is a schematic structural view of a prior art liquid crystal display panel having a repair line system, including a substrate 110, a driver 120, four packages 131, 132, 133, 134, and four repair lines 141, 142, 143, 144,
- the driver 120 inputs a signal to the data line 111 to cause the liquid crystal display panel to display a corresponding picture.
- the packages 131, 132, 133, and 134 are respectively connected to the driver 120 and the substrate 110, and the repair line 141 and the repair line 142 are sequentially disposed at both ends of the substrate 110 through the packages 131, 132 and the driver 120 through one side of the substrate 110 ( That is, both ends of the data line 111), the repair line 143 and the repair line 144 are sequentially disposed at both ends of the substrate 110 through the package 133, 134 and the driver 120 via the other side of the substrate 110, and the repair line 141 and the repair line 142 are used as the substrate.
- the output signal of the driver 120 can be output to the data line 111 through the repair line 141 and the repair line 142.
- the repair line 141 and the repair line 142 in FIG. 1 are respectively taken out from the packages 131 and 132 to facilitate repair of the data lines 111 drawn from the packages 131 and 132.
- the repair line 141 can be used instead of the break.
- Line data line 111 is
- repair line 141 and the repair line 142 can only repair the data lines of the two broken lines in the package body 131 and the package body 132 at the same time, that is, three broken data lines appear in the package body 131 and the package body 132 at the same time. Repair line 141 and repair line 142 will not be able to repair the data lines of the three broken lines.
- the package body 133 and the package body 134 may be repaired by the repair line 143 and the repair line 144, but the repair line 143 and the repair line 144 may also repair only the data lines of the two broken lines in the package body 133 and the package body 134 at the most.
- the liquid crystal display panel of the existing repair line system can repair only two broken data lines through the repair line at most, and each half of the liquid crystal display panel can only repair two broken lines through the repair line at most.
- the data line of the line once more than two data lines are broken in a package, it will not be able to repair all the broken data lines of the package.
- a repair line system and a corresponding repair method for increasing the flexibility of repairing a data line by repairing the same repair line drawn from different seals to form a line-connected form.
- the invention relates to a repairing line system, comprising a plurality of packages and a substrate, the substrate having a plurality of data lines to be repaired, the repairing line system further comprising: two repairing lines, the repairing lines comprising the package body And a lead wire disposed on the substrate and disposed on three sides of the package and connected to the lead wire, the trace intersecting with the second end of the data line to be repaired; and two a connecting line, the connecting line insulation intersecting the first end of the lead line and the data line.
- each of the repair lines includes four of the lead wires, and the lead wires are respectively led out from four packages, and each end of the wires connects two of the lead wires. line.
- the repair line system further includes a signal amplifier connected to the repair line for amplifying a data signal, the lead line passing through the signal amplifier and the walking Wire connection.
- the invention also relates to a repairing method for a repairing line system, the repairing line system comprising a plurality of packages, a substrate having a plurality of data lines to be repaired, two repair lines and two connecting lines, the repair lines including a lead wire drawn by the package body and a trace disposed on the substrate on which three sides of the package body are not disposed and connected to the lead wire; and the repairing method of the repair line system includes the steps of: Connecting the connection line to the first end of the lead-out line and the data line to be repaired, respectively connecting the corresponding trace of the lead-out line and the second end of the data line to be repaired; B. Connecting a line and the trace to separate an alternate line using the same connection line and the same trace; C, amplifying the data signal on the repair line.
- the invention also relates to a repairing method for a repairing line system, the repairing line system comprising a plurality of packages, a substrate having a plurality of data lines to be repaired, two repair lines and two connecting lines, the repair lines including a lead wire drawn by the package body and a trace disposed on the substrate on which three sides of the package body are not disposed and connected to the lead wire; and the repairing method of the repair line system includes the steps of: Connecting the connection line to the first end of the lead-out line and the data line to be repaired, respectively connecting the corresponding trace of the lead-out line and the second end of the data line to be repaired; B. Connecting lines and the traces to separate alternate lines using the same connection line and the same trace.
- the repairing line includes a first repairing line and a second repairing line, and the first repairing line and the second repairing line each include four of the leading lines.
- the lead wires are respectively led out from the first, second, third, and fourth package bodies, and each end of the trace is connected to the two lead wires; the connection wire includes a first connection line and a second connection line.
- the data line to be repaired includes a first data line to be repaired, a second data line to be repaired, and a third data line to be repaired;
- the step A is specifically:
- the first connection line is connected to the lead line drawn from the first package body by the second repair line, and then the first connection line is connected to the first end of the first to-be-patched data line.
- the trace of the second repair line is connected to the second end of the first data line to be repaired; and the second connection line is connected to the lead line drawn from the first package by the first repair line.
- the first connecting line is connected to the lead line drawn from the third package by the first repair line, and then the first connecting line is connected to the first end of the third data line to be repaired, the first A trace of a repair line is connected to a second end of the third data line to be repaired.
- the step B is specifically: connecting a connection point between the first connecting line and the first data line to be repaired, and the first connecting line Disconnecting the first connection line between connection points of the third data line to be repaired; connecting a connection point between the first repair line and the second data line to be repaired with the first repair line The first repair line between the connection points of the third to-be-patched data line is disconnected.
- the data line to be repaired includes a first data line to be repaired, a second data line to be repaired, a third data line to be repaired, and a fourth data line to be repaired;
- the step A is specifically: connecting the first connecting line and the lead line drawn from the first package by the second repairing line, and then connecting the first connecting line and the first data line to be repaired a first end connection, a trace of the second repair line is connected to a second end of the first to-be-patched data line; and the second connection line and the first repair line are from the first package Connecting the lead wires of the body, and then connecting the second connecting wire to the first end of the second data line to be repaired, the routing of the first repairing line and the second data line to be repaired a two-terminal connection; connecting the first connection line to a lead line drawn from the third package body by the first repair line, and then the first connection line and the third line to be repaired Connected at one end, the trace of the first repair line and the
- the step B is specifically: connecting a connection point between the first connection line and the third to-be-patched data line and the first connection line Disconnecting the first connection line between the connection points of the first data line to be repaired; connecting the connection point of the first repair line and the second data line to be repaired with the first repair line
- the first repair line between the connection points of the third to-be-patched data line is disconnected; the connection point between the second connection line and the second to-be-patched data line and the second connection line
- the second repair line between the line and the connection point of the fourth to-be-patched data line is disconnected.
- the repairing method of the repairing line system further comprises the step of: C. amplifying the data signal on the repairing line.
- connection line which is insulated from the data line and the repair line
- the lead wire of the corresponding package of the repair line and the first end of the data line to be repaired are respectively connected with the connection line.
- the corresponding repair line is connected to the second end of the data line to be repaired and the replacement line is formed by disconnecting the connection line between the connection points to replace the data line to be repaired, so that the single package can be repaired. Multiple data lines are broken.
- FIG. 1 is a schematic structural view of a prior art repair line system repairing a broken line
- FIG. 2 is a schematic structural view of a preferred embodiment of a repair line system of the present invention.
- FIG. 3 is a flow chart of a preferred embodiment of a repairing method of the repair line system of the present invention.
- FIG. 4 is a schematic structural view of repairing three data lines to be repaired by the repair line system and the repair method of the present invention
- FIG. 5 is a schematic structural diagram of repairing four data lines to be repaired by the repairing line system and the repairing method of the present invention.
- the repairing wire system 200 includes a substrate 210 and a driver 220.
- the substrate 210 is formed with a plurality of parallelly disposed data lines (not shown). One end of the data line is concentrated in the first package 231, the second package 232, the third package 233, and the fourth package 234 according to the distribution position on the substrate 210.
- the repair line system 200 further includes a first repair line 241 and a second repair line 242.
- the first repair line 241 and the second repair line 242 are respectively separated from the first package 231, the second package 232, and the third package 233. And the fourth package 234 is taken out.
- the repair line system further includes a first connection line 251 and a second connection line 252.
- the first repairing line 241 includes a lead line 2411, a lead line 2413, a lead line 2414, a lead line 2415, and a trace 2412.
- the lead lines 2411, 2413, 2414, and 2415 are respectively from the package 231, 233, 232, and 234.
- the traces 2412 are disposed on three sides of the substrate 210 where the packages 231, 232, 233, and 234 are not disposed.
- One ends of the lead wires 2411, 2414 are insulated from the first connection line 251 and the second connection line 252, and the other end thereof is connected to one end of the trace 2412 through a signal amplifier 262; one end of the lead wires 2413, 2415 is The first connection line 251 and the second connection line 252 are insulated from each other, and the other end thereof is connected to the other end of the trace 2412 via a signal amplifier 263.
- the second repair line 242 includes a lead line 2421, a lead line 2423, a lead line 2424, a lead line 2425, and a trace 2422.
- the lead lines 2421, 2423, 2424, and 2425 are respectively led out from the package bodies 231, 233, 232, and 234.
- the traces 2422 are disposed on three sides of the substrate 210 where the packages 231, 232, 233, and 234 are not disposed.
- One ends of the lead wires 2421 and 2424 are insulated from the first connection line 251 and the second connection line 252, and the other end thereof is connected to one end of the trace 2422 through a signal amplifier 261; one end of the lead wires 2423, 2425 is The first connection line 251 and the second connection line 252 are insulated from each other, and the other end thereof is connected to the other end of the trace 2422 via a signal amplifier 263.
- the first connection line 251 and the second connection line 252 are insulated from the first end of the data line (not shown), and the trace 2412 and the trace 2422 are insulated from the second end of the data line, respectively.
- the signal amplifiers 261, 262, 263, 264 are used to amplify the data signals. Since the transmission path of the repair line is generally longer than the data line to be repaired, it is easy to cause signal distortion, and the signal amplifier pre-amplifies the transmission signal and then transmits through the repair line to avoid the signal caused by the signal loss on the transmission path. distortion.
- FIG. 3 is a flowchart of a preferred embodiment of a repairing method for a repair line system according to the present invention.
- the repair method includes the following steps:
- Step 401 Soldering the connection line connected to the lead line and the second end of the data line to be repaired by soldering the connection line to the lead line and the first end of the data line to be repaired;
- Step 402 Form an alternative line by cutting the connecting line and the routing.
- the repairing method of the repair line system further comprises the step of: amplifying the data signal on the repair line. Since the transmission path of the repair line is generally longer than the data line to be repaired, it is easy to cause distortion of the signal, and the transmission signal is preamplified and then transmitted through the repair line to avoid signal distortion caused by signal loss on the transmission path.
- FIG. 4 is a structural diagram of a repair line system and a repair method for repairing three data lines to be repaired.
- the data lines on the substrate 210 have three data lines to be repaired on the same package, for example, the first package 231 has a data line 211 to be repaired, a data line to be repaired 212, and a data line 213 to be repaired.
- the step 401 is specifically:
- the first connection line 251 is connected to the lead line 2421, and then the first connection line 251 is connected to the first end of the data line 211 to be repaired, the trace 2422 of the second repair line 242 and the second end of the data line 211 to be repaired. connection;
- the first connection line 251 is connected to the lead line 2413, and then the first connection line 251 is connected to the first end of the data line 213 to be repaired.
- the trace 2412 of the first repair line 241 and the second end of the data line 213 to be repaired are connected. connection.
- the above connection may be such that the first connection line, the second connection line, the lead line, and the insulating layer between the data lines to be repaired are separated by a laser to make the two conductive.
- the step 402 is specifically:
- the first repair line 241 located between the connection point of the first repair line 241 and the data line 212 to be repaired and the connection point of the first repair line 241 and the data line 213 to be repaired is cut at point E.
- the data signal When the data signal is input from the driver 220 to the end of the data line 211 to be repaired, the data signal is transmitted to the connection point of the first connection line 251 and the lead line 2421 through the connection point of the data line 211 to be repaired and the first connection line 251. Then, it is sent to the signal amplifier 261 along the lead line 2421. The data signal is amplified by the signal amplifier 261 and sent to the trace 2422, and then input to the connection point of the data line 211 to be repaired and the trace 2422 through the trace 2422, thereby realizing repair. Data signal transmission of data line 211. Similarly, the data signal transmission of the data lines 212 and 213 to be repaired can be realized.
- two alternative lines are formed on the first repair line 241, and an alternative line is formed on the second repair line 242, thereby realizing the data line 211 to be repaired and the data line 212 to be repaired on the first package 231. And the repair of the data line 213 to be repaired.
- the repair of the three data lines to be repaired in a single package can be achieved by using the repair line system and the repair method described above, and the single package can be in the first package, the second package, the third package, and the fourth package. Either as long as the first repair line 241 and the second repair line 242 are changed at the connection point between the lead lines of the respective packages and the first connection line 251 and the second connection line 252, respectively.
- FIG. 5 is a schematic structural diagram of a repair line system and a repairing method for repairing four lines to be repaired.
- the data line on the substrate 210 has both the data line to be repaired 211, the data line to be repaired 212, and the data to be repaired. Line 213 and data line 214 to be repaired.
- the step 401 is specifically:
- the first connection line 251 is connected to the lead line 2421, and then the first connection line 251 is connected to the first end of the data line 211 to be repaired, the trace 2422 of the second repair line 242 and the second end of the data line 211 to be repaired. connection;
- the first connection line 251 is connected to the lead line 2413, and then the first connection line 251 is connected to the first end of the data line 213 to be repaired.
- the trace 2412 of the first repair line 241 and the second end of the data line 213 to be repaired are connected. connection;
- the above connection may be such that the first connection line, the second connection line, the lead line, and the insulating layer between the data lines to be repaired are separated by a laser to make the two conductive.
- the step 402 is specifically:
- the second repair line 242 located between the connection point of the second repair line 242 and the data line 211 to be repaired and the connection point of the second repair line 242 and the data line 214 to be repaired is disconnected at point G.
- the data signal When the data signal is input from the driver 220 to the end of the data line 211 to be repaired, the data signal is transmitted to the connection point of the first connection line 251 and the lead line 2421 through the connection point of the data line 211 to be repaired and the first connection line 251. Then, it is sent to the signal amplifier 261 along the lead line 2421. The data signal is amplified by the signal amplifier 261 and sent to the trace 2422, and then input to the connection point of the data line 211 to be repaired and the trace 2422 through the trace 2422, thereby realizing repair. Data signal transmission of data line 211. Similarly, the data signal transmission of the data lines 212, 213, and 214 to be repaired can be realized.
- two alternative lines are formed on the first repair line 241, and two alternative lines are formed on the second repair line 242, thereby realizing the data line to be repaired 211, the data line to be repaired 212, the data line to be repaired 213, and to be repaired. Repair of data line 214.
- connection line which is insulated from the data line and the repair line
- the lead wire of the corresponding package of the repair line and the first end of the data line to be repaired are respectively connected with the connection line.
- the corresponding repair line trace is connected with the second end of the data line to be repaired to form an alternative circuit to replace the data line to be repaired for data communication, thereby repairing multiple data line breaks in a single package.
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Abstract
一种修复线系统（200），包括多个封装体（231，232，233，234）、具有多条待修补数据线的基板（210）、两条修复线（241，242）以及两条连接线（251，252）。所述修复线（241，242）包括从所述封装体（231，232，233，234）引出的引出线（2411，2413，2414，2415，2421，2423，2424，2415）以及设置在所述基板（210）为设置封装体（231，232，233，234）的三侧且与引出线（2411，2413，2414，2415，2421，2423，2424，2415）连接的走线（2412，2422）。所述走线（2412，2422）用于与所述待修补数据线的第二端绝缘连接。所述连接线（251，252）绝缘相交于引出线（2411，2413，2414，2415，2421，2423，2424，2415）及数据线的第一端。本申请还公开了一种修复线系统的修复方法。本申请的修复线系统以及修复方法通过将由不同封装体引出的同一修复线相互连接形成整线相连的形式以增加修复线系统修补数据线的灵活性。
Description
本发明涉及液晶面板制作领域，特别是涉及液晶面板的修复线系统及其修复方法。
图1为现有技术的具有修复线系统的液晶显示面板的结构示意图，其中包括基板110、驱动器120、四个封装体131、132、133、134以及四条修复线141、142、143、144，驱动器120向数据线111输入信号，以使液晶显示面板显示相应的画面。
封装体131、132、133、134分别与驱动器120和基板110连接，同时修复线141和修复线142依次通过封装体131、132以及驱动器120经基板110的一侧设置在基板110的两端（即数据线111的两端），修复线143和修复线144依次通过封装体133、134以及驱动器120经基板110的另一侧设置在基板110的两端，修复线141和修复线142作为基板110上数据线111的替代线路，以便数据线111发生断线时，驱动器120的输出信号可以通过修复线141和修复线142输出到数据线111。
图1中修复线141和修复线142分别从封装体131、132引出，以便于对封装体131、132引出的数据线111进行修补。当数据线111在图中A处的发生断线时，将断线的数据线111的两端分别与修复线141的B端和C端连接，连接后即可使用修复线141替代该发生断线的数据线111。
但是修复线141和修复线142最多只能修复封装体131和封装体132中的两条断线的数据线，即如在封装体131和封装体132中同时出现了三条断线的数据线，修复线141和修复线142将无法修复该三条断线的数据线。封装体133和封装体134可以通过修复线143和修复线144进行修补，但是修复线143和修复线144同样最多也只能修复封装体133和封装体134中的两条断线的数据线。
综上所述，现有修复线系统的液晶显示面板每个封装体最多只能通过修复线修复两条断线的数据线，且每半边液晶显示面板最多也只能通过修复线修复两条断线的数据线，一旦某个封装体出现了两条以上的数据线断线，将无法对该封装体的所有断线的数据线进行修补。
故，有必要提供一种修复线系统及相应的修复方法，以解决现有技术所存在的问题。
本发明的目的在于提供一种通过将由不同密封件引出的同一修复线相互连接形成整线相连的形式以增加修复线系统修补数据线的灵活性的修复线系统及相应的修复方法，以解决现有的液晶显示面板的修复线系统的单一封装体出现多条数据线断线时无法进行修补的技术问题。
本发明涉及修复线系统，包括多个封装体及基板，所述基板上具有多条待修补数据线，所述修复线系统还包括：两条修复线，所述修复线包括从所述封装体引出的引出线以及设置在所述基板未设置所述封装体的三侧且与所述引出线连接的走线，所述走线与所述待修补数据线的第二端绝缘相交；以及两条连接线，所述连接线绝缘相交于引出线及数据线的第一端。
在本发明所述的修复线系统中，每一所述修复线包括四条所述引出线，所述引出线分别对应从四个封装体引出，所述走线的每一端连接两条所述引出线。
在本发明所述的修复线系统中，所述修复线系统还包括与所述修复线连接的、用于对数据信号进行放大的信号放大器，所述引出线经所述信号放大器与所述走线连接。
本发明还涉及一种修复线系统的修复方法，所述修复线系统包括多个封装体、具有多条待修补数据线的基板、两条修复线及两条连接线，所述修复线包括从所述封装体引出的引出线以及设置在所述基板未设置所述封装体的三侧且与所述引出线连接的走线；所述修复线系统的修复方法包括步骤：A、通过将所述连接线分别与所述引出线和所述待修补数据线的第一端连接，将所述引出线相应的走线和所述待修补数据线的第二端连接；B、通过切割所述连接线和所述走线，以分离使用同一所述连接线和同一所述走线的替代线路；C、对所述修复线上的数据信号进行放大。
本发明还涉及一种修复线系统的修复方法，所述修复线系统包括多个封装体、具有多条待修补数据线的基板、两条修复线及两条连接线，所述修复线包括从所述封装体引出的引出线以及设置在所述基板未设置所述封装体的三侧且与所述引出线连接的走线；所述修复线系统的修复方法包括步骤：A、通过将所述连接线分别与所述引出线和所述待修补数据线的第一端连接，将所述引出线相应的走线和所述待修补数据线的第二端连接；B、通过切割所述连接线和所述走线，以分离使用同一所述连接线和同一所述走线的替代线路。
在本发明所述的修复线系统的修复方法中，所述修复线包括第一修复线及第二修复线，所述第一修复线及所述第二修复线均包括四条所述引出线，所述引出线分别对应从第一、第二、第三、第四封装体引出，所述走线的每一端连接两条所述引出线；所述连接线包括第一连接线及第二连接线。
在本发明所述的修复线系统的修复方法中，所述待修补数据线包括第一待修补数据线、第二待修补数据线及第三待修补数据线；所述步骤A具体为：将所述第一连接线与所述第二修复线从所述第一封装体引出的引出线连接，然后将所述第一连接线与所述第一待修补数据线的第一端连接，所述第二修复线的走线与所述第一待修补数据线的第二端连接；将所述第二连接线与所述第一修复线从所述第一封装体引出的引出线连接，然后将所述第二连接线与所述第二待修补数据线的第一端连接，所述第一修复线的走线与所述第二待修补数据线的第二端连接；将所述第一连接线与所述第一修复线从所述第三封装体引出的引出线连接，然后将所述第一连接线与所述第三待修补数据线的第一端连接，所述第一修复线的走线与所述第三待修补数据线的第二端连接。
在本发明所述的修复线系统的修复方法中，所述步骤B具体为：将位于所述第一连接线与所述第一待修补数据线的连接点和所述第一连接线与所述第三待修补数据线的连接点之间的所述第一连接线断开；将位于所述第一修复线与所述第二待修补数据线的连接点与所述第一修复线与所述第三待修补数据线的连接点之间的所述第一修复线断开。
在本发明所述的修复线系统的修复方法中，所述待修补数据线包括第一待修补数据线、第二待修补数据线、第三待修补数据线及第四待修补数据线；所述步骤A具体为：将所述第一连接线与所述第二修复线从所述第一封装体引出的引出线连接，然后将所述第一连接线与所述第一待修补数据线的第一端连接，所述第二修复线的走线与所述第一待修补数据线的第二端连接；将所述第二连接线与所述第一修复线从所述第一封装体引出的引出线连接，然后将所述第二连接线与所述第二待修补数据线的第一端连接，所述第一修复线的走线与所述第二待修补数据线的第二端连接；将所述第一连接线与所述第一修复线从所述第三封装体引出的引出线连接，然后将所述第一连接线与所述第三待修补数据线的第一端连接，所述第一修复线的走线与所述第三待修补数据线的第二端连接；将所述第二连接线与所述第二修复线从所述第三封装体引出的引出线连接，然后将所述第二连接线与所述第四待修补数据线的第一端连接，所述第二修复线的走线与所述第四待修补数据线的第二端连接。
在本发明所述的修复线系统的修复方法中，所述步骤B具体为：将位于所述第一连接线与所述第三待修补数据线的连接点和所述第一连接线与所述第一待修补数据线的连接点之间的所述第一连接线断开；将位于所述第一修复线与所述第二待修补数据线的连接点和所述第一修复线与所述第三待修补数据线的连接点之间的所述第一修复线断开；将位于所述第二连接线与所述第二待修补数据线的连接点和所述第二连接线与所述第四待修补数据线的连接点之间的所述第二连接线断开；将位于所述第二修复线与所述第一待修补数据线的连接点和所述第二修复线与所述第四待修补数据线的连接点之间的所述第二修复线断开。
在本发明所述的修复线系统的修复方法中，所述修复线系统的修复方法还包括步骤：C、对所述修复线上的数据信号进行放大。
由于本发明设有与数据线及修复线均绝缘交叉设置连接线，在数据线出现断路时，分别将修复线相应的封装体的引出线和待修补数据线的第一端与连接线连接，同时将相应的修复线的走线与待修补数据线的第二端连接并通过断开部分连接点之间的连接线形成替代线路来代替待修补数据线进行数据通信，从而可以修复单一封装体出现多条数据线断线。
图1为现有技术的修复线系统修复断线的结构示意图；
图2为本发明的修复线系统的优选实施例的结构示意图；
图3为本发明的修复线系统的修复方法的优选实施例的流程图；
图4为本发明的修复线系统及修复方法修复三条待修补数据线的结构示意图；
图5为本发明的修复线系统及修复方法修复四条待修补数据线的结构示意图。
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。
图2所示的为本发明的修复线系统的优选实施例的结构示意图，修复线系统200包括基板210及驱动器220，所述基板210上形成有多条平行设置的数据线（图未示），所述数据线的一端根据其在基板210上的分布位置对应汇聚在第一封装体231、第二封装体232、第三封装体233、第四封装体234内。
所述修复线系统200还包括第一修复线241以及第二修复线242，第一修复线241和第二修复线242分别从第一封装体231、第二封装体232、第三封装体233以及第四封装体234引出。该修复线系统还包括第一连接线251以及第二连接线252。
所述第一修复线241包括引出线2411、引出线2413、引出线2414、引出线2415以及走线2412，所述引出线2411、2413、2414、2415分别从封装体231、233、232、234引出，所述走线2412设置在所述基板210未设置封装体231、232、233、234的三侧。所述引出线2411、2414的一端与第一连接线251和第二连接线252绝缘相交，其另一端通过一信号放大器262与走线2412的一端连接；所述引出线2413、2415的一端与第一连接线251和第二连接线252绝缘相交，其另一端通过一信号放大器263与走线2412的另一端连接。
第二修复线242包括引出线2421、引出线2423、引出线2424、引出线2425以及走线2422；所述引出线2421、2423、2424、2425分别从封装体231、233、232、234引出，所述走线2422设置在所述基板210未设置封装体231、232、233、234的三侧。所述引出线2421、2424的一端与第一连接线251和第二连接线252绝缘相交，其另一端通过一信号放大器261与走线2422的一端连接；所述引出线2423、2425的一端与第一连接线251和第二连接线252绝缘相交，其另一端通过一信号放大器263与走线2422的另一端连接。
第一连接线251和第二连接线252与数据线（图未示）的第一端均绝缘相交，走线2412和走线2422分别与数据线的第二端绝缘相交。
作为本发明的优选实施例，所述信号放大器261、262、263、264，用于对数据信号进行放大。由于修复线的传输路径一般都比待修补数据线长，因此容易造成信号的失真，信号放大器对传输信号预先进行放大处理后再通过修复线传输避免了由于传输路径上的信号损失而造成的信号失真。
请参阅图3，其为本发明修复线系统的修复方法的优选实施例的流程图，该修复方法包括如下步骤：
步骤401:
通过将连接线分别与引出线和待修补数据线的第一端焊接，将与引出线连接的走线和待修补数据线的第二端焊接；
步骤402：通过切割连接线和走线，形成替代线路。
作为本发明的优选实施例，所述修复线系统的修复方法还包括步骤：对修复线上的数据信号进行放大。由于修复线的传输路径一般都比待修补数据线长，因此容易造成信号的失真，对传输信号预先进行放大处理后再通过修复线传输避免了由于传输路径上的信号损失而造成的信号失真。
下面结合液晶面板存在三条待修补线和四条待修补线详细说明本发明修复线系统及其修复方法。
请参阅图4，其为本发明修复线系统及修复方法用于修复三条待修补数据线的结构示意图。当基板210上的数据线在同一封装体上存在三条待修补数据线时，如第一封装体231出现待修补数据线211、待修补数据线212以及待修补数据线213。
所述步骤401具体为：
将第一连接线251与引出线2421连接，然后将第一连接线251与待修补数据线211的第一端连接，第二修复线242的走线2422与待修补数据线211的第二端连接；
将第二连接线252与引出线2411连接，然后将第二连接线252与待修补数据线212的第一端连接，第一修复线241的走线2412与待修补数据线212的第二端连接；
将第一连接线251与引出线2413连接，然后将第一连接线251与待修补数据线213的第一端连接，第一修复线241的走线2412与待修补数据线213的第二端连接。
上述的连接可为通过激光熔断第一连接线、第二连接线、引出线、待修补数据线之间的绝缘层等间隔物，使二者导通。
所述步骤402具体为：
将位于第一连接线251与待修补数据线213的连接点和第一连接线251与待修补数据线211的连接点之间的第一连接线251在D点切割开；
将位于第一修复线241与待修补数据线212的连接点和第一修复线241与待修补数据线213的连接点之间的第一修复线241在E点切割开。
当数据信号自驱动器220输入待修补数据线211的一端时，该数据信号经过该待修补数据线211与第一连接线251的连接点后传送至第一连接线251与引出线2421的连接点，然后沿引出线2421传送至信号放大器261，该数据信号进信号放大器261放大后输送至走线2422，然后经过走线2422输入待修补数据线211与走线2422的连接点，从而实现待修补数据线211的数据信号传输。同理，即可实现待修补数据线212、213的数据信号传输。
通过以上方法，在第一修复线241上形成两条替代线路，在第二修复线242上形成一条替代线路，从而实现了对第一封装体231的待修补数据线211、待修补数据线212以及待修补数据线213的修复。
使用上述的修复线系统及修复方法可以实现对单一封装体的三条待修补数据线的修复，单一封装体可以是第一封装体、第二封装体、第三封装体以及第四封装体中的任一，只要改变第一修复线241和第二修复线242在各个封装体的引出线分别与第一连接线251和第二连接线252之间的连接点即可实现。
图5所示为本发明的修复线系统及修复方法用于修复四条待修补线的结构示意图，当基板210上的数据线中同时存在待修补数据线211、待修补数据线212、待修补数据线213以及待修补数据线214。
所述步骤401具体为：
将第一连接线251与引出线2421连接，然后将第一连接线251与待修补数据线211的第一端连接，第二修复线242的走线2422与待修补数据线211的第二端连接；
将第二连接线252与引出线2411连接，然后将第二连接线252与待修补数据线212的第一端连接，第一修复线241的走线2412与待修补数据线212的第二端连接；
将第一连接线251与引出线2413连接，然后将第一连接线251与待修补数据线213的第一端连接，第一修复线241的走线2412与待修补数据线213的第二端连接；
将第二连接线252与引出线2423连接，然后将第二连接线252与待修补数据线214的第一端连接，第二修复线242的走线2422与待修补数据线214的第二端连接。
上述的连接可为通过激光熔断第一连接线、第二连接线、引出线、待修补数据线之间的绝缘层等间隔物，使二者导通。
所述步骤402具体为：
将位于第一连接线251与待修补数据线213的连接点和第一连接线251与待修补数据线211的连接点之间的第一连接线251在D点断开；
将位于第一修复线241与待修补数据线212的连接点和第一修复线241与待修补数据线213的连接点之间的第一修复线241在E点断开；
将位于第二连接线252与待修补数据线212的连接点和第二连接线252与待修补数据线214的连接点之间的第二连接线252在F点断开；
将位于第二修复线242与待修补数据线211的连接点和第二修复线242与待修补数据线214的连接点之间的第二修复线242在G点断开。
当数据信号自驱动器220输入待修补数据线211的一端时，该数据信号经过该待修补数据线211与第一连接线251的连接点后传送至第一连接线251与引出线2421的连接点，然后沿引出线2421传送至信号放大器261，该数据信号进信号放大器261放大后输送至走线2422，然后经过走线2422输入待修补数据线211与走线2422的连接点，从而实现待修补数据线211的数据信号传输。同理，即可实现待修补数据线212、213、214的数据信号传输。
这样在第一修复线241上形成两条替代线路，在第二修复线242上形成两条替代线路，从而实现了对待修补数据线211、待修补数据线212、待修补数据线213以及待修补数据线214的修复。
由于本发明设有与数据线及修复线均绝缘交叉设置连接线，在数据线出现断路时，分别将修复线相应的封装体的引出线和待修补数据线的第一端与连接线连接，同时将相应的修复线的走线与待修补数据线的第二端连接形成替代线路来代替待修补数据线进行数据通信，从而可以修复单一封装体出现多条数据线断线。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。
Claims (15)
- 一种修复线系统，包括多个封装体及基板，所述基板上具有多条待修补数据线，其特征在于，所述修复线系统还包括：两条修复线，所述修复线包括从所述封装体引出的引出线以及设置在所述基板未设置所述封装体的三侧且与所述引出线连接的走线，所述走线与所述待修补数据线的第二端绝缘相交；以及两条连接线，所述连接线绝缘相交于引出线及数据线的第一端。
- 根据权利要求1所述的修复线系统，其特征在于，每一所述修复线包括四条所述引出线，所述引出线分别对应从四个封装体引出，所述走线的每一端连接两条所述引出线。
- 根据权利要求1所述的修复线系统，其特征在于，所述修复线系统还包括与所述修复线连接的、用于对数据信号进行放大的信号放大器，所述引出线经所述信号放大器与所述走线连接。
- 一种修复线系统的修复方法，所述修复线系统包括多个封装体、具有多条待修补数据线的基板、两条修复线及两条连接线，所述修复线包括从所述封装体引出的引出线以及设置在所述基板未设置所述封装体的三侧且与所述引出线连接的走线；其特征在于，所述修复线系统的修复方法包括步骤：A、通过将所述连接线分别与所述引出线和所述待修补数据线的第一端连接，将所述引出线相应的走线和所述待修补数据线的第二端连接；B、通过切割所述连接线和所述走线，以分离使用同一所述连接线和同一所述走线的替代线路；C、对所述修复线上的数据信号进行放大。
- 根据权利要求4所述的修复线系统的修复方法，其特征在于，所述修复线包括第一修复线及第二修复线，所述第一修复线及所述第二修复线均包括四条所述引出线，所述引出线分别对应从第一、第二、第三、第四封装体引出，所述走线的每一端连接两条所述引出线；所述连接线包括第一连接线及第二连接线。
- 根据权利要求5所述的修复线系统的修复方法，所述待修补数据线包括第一待修补数据线、第二待修补数据线及第三待修补数据线；其特征在于，所述步骤A具体为：将所述第一连接线与所述第二修复线从所述第一封装体引出的引出线连接，然后将所述第一连接线与所述第一待修补数据线的第一端连接，所述第二修复线的走线与所述第一待修补数据线的第二端连接；将所述第二连接线与所述第一修复线从所述第一封装体引出的引出线连接，然后将所述第二连接线与所述第二待修补数据线的第一端连接，所述第一修复线的走线与所述第二待修补数据线的第二端连接；将所述第一连接线与所述第一修复线从所述第三封装体引出的引出线连接，然后将所述第一连接线与所述第三待修补数据线的第一端连接，所述第一修复线的走线与所述第三待修补数据线的第二端连接。
- 根据权利要求6所述的修复线系统的修复方法，其特征在于，所述步骤B具体为：将位于所述第一连接线与所述第一待修补数据线的连接点和所述第一连接线与所述第三待修补数据线的连接点之间的所述第一连接线断开；将位于所述第一修复线与所述第二待修补数据线的连接点与所述第一修复线与所述第三待修补数据线的连接点之间的所述第一修复线断开。
- 根据权利要求5所述的修复线系统的修复方法，所述待修补数据线包括第一待修补数据线、第二待修补数据线、第三待修补数据线及第四待修补数据线；其特征在于，所述步骤A具体为：将所述第一连接线与所述第二修复线从所述第一封装体引出的引出线连接，然后将所述第一连接线与所述第一待修补数据线的第一端连接，所述第二修复线的走线与所述第一待修补数据线的第二端连接；将所述第二连接线与所述第一修复线从所述第一封装体引出的引出线连接，然后将所述第二连接线与所述第二待修补数据线的第一端连接，所述第一修复线的走线与所述第二待修补数据线的第二端连接；将所述第一连接线与所述第一修复线从所述第三封装体引出的引出线连接，然后将所述第一连接线与所述第三待修补数据线的第一端连接，所述第一修复线的走线与所述第三待修补数据线的第二端连接；将所述第二连接线与所述第二修复线从所述第三封装体引出的引出线连接，然后将所述第二连接线与所述第四待修补数据线的第一端连接，所述第二修复线的走线与所述第四待修补数据线的第二端连接。
- 根据权利要求8所述的修复线系统的修复方法，其特征在于，所述步骤B具体为：将位于所述第一连接线与所述第三待修补数据线的连接点和所述第一连接线与所述第一待修补数据线的连接点之间的所述第一连接线断开；将位于所述第一修复线与所述第二待修补数据线的连接点和所述第一修复线与所述第三待修补数据线的连接点之间的所述第一修复线断开；将位于所述第二连接线与所述第二待修补数据线的连接点和所述第二连接线与所述第四待修补数据线的连接点之间的所述第二连接线断开；将位于所述第二修复线与所述第一待修补数据线的连接点和所述第二修复线与所述第四待修补数据线的连接点之间的所述第二修复线断开。
- 一种修复线系统的修复方法，所述修复线系统包括多个封装体、具有多条待修补数据线的基板、两条修复线及两条连接线，所述修复线包括从所述封装体引出的引出线以及设置在所述基板未设置所述封装体的三侧且与所述引出线连接的走线；其特征在于，所述修复线系统的修复方法包括步骤：A、通过将所述连接线分别与所述引出线和所述待修补数据线的第一端连接，将所述引出线相应的走线和所述待修补数据线的第二端连接；B、通过切割所述连接线和所述走线，以分离使用同一所述连接线和同一所述走线的替代线路。
- 根据权利要求10所述的修复线系统的修复方法，其特征在于，所述修复线包括第一修复线及第二修复线，所述第一修复线及所述第二修复线均包括四条所述引出线，所述引出线分别对应从第一、第二、第三、第四封装体引出，所述走线的每一端连接两条所述引出线；所述连接线包括第一连接线及第二连接线。
- 根据权利要求11所述的修复线系统的修复方法，所述待修补数据线包括第一待修补数据线、第二待修补数据线及第三待修补数据线；其特征在于，所述步骤A具体为：将所述第一连接线与所述第二修复线从所述第一封装体引出的引出线连接，然后将所述第一连接线与所述第一待修补数据线的第一端连接，所述第二修复线的走线与所述第一待修补数据线的第二端连接；将所述第二连接线与所述第一修复线从所述第一封装体引出的引出线连接，然后将所述第二连接线与所述第二待修补数据线的第一端连接，所述第一修复线的走线与所述第二待修补数据线的第二端连接；将所述第一连接线与所述第一修复线从所述第三封装体引出的引出线连接，然后将所述第一连接线与所述第三待修补数据线的第一端连接，所述第一修复线的走线与所述第三待修补数据线的第二端连接。
- 根据权利要求12所述的修复线系统的修复方法，其特征在于，所述步骤B具体为：将位于所述第一连接线与所述第一待修补数据线的连接点和所述第一连接线与所述第三待修补数据线的连接点之间的所述第一连接线断开；将位于所述第一修复线与所述第二待修补数据线的连接点与所述第一修复线与所述第三待修补数据线的连接点之间的所述第一修复线断开。
- 根据权利要求11所述的修复线系统的修复方法，所述待修补数据线包括第一待修补数据线、第二待修补数据线、第三待修补数据线及第四待修补数据线；其特征在于，所述步骤A具体为：将所述第一连接线与所述第二修复线从所述第一封装体引出的引出线连接，然后将所述第一连接线与所述第一待修补数据线的第一端连接，所述第二修复线的走线与所述第一待修补数据线的第二端连接；将所述第二连接线与所述第一修复线从所述第一封装体引出的引出线连接，然后将所述第二连接线与所述第二待修补数据线的第一端连接，所述第一修复线的走线与所述第二待修补数据线的第二端连接；将所述第一连接线与所述第一修复线从所述第三封装体引出的引出线连接，然后将所述第一连接线与所述第三待修补数据线的第一端连接，所述第一修复线的走线与所述第三待修补数据线的第二端连接；将所述第二连接线与所述第二修复线从所述第三封装体引出的引出线连接，然后将所述第二连接线与所述第四待修补数据线的第一端连接，所述第二修复线的走线与所述第四待修补数据线的第二端连接。
- 根据权利要求14所述的修复线系统的修复方法，其特征在于，所述步骤B具体为：将位于所述第一连接线与所述第三待修补数据线的连接点和所述第一连接线与所述第一待修补数据线的连接点之间的所述第一连接线断开；将位于所述第一修复线与所述第二待修补数据线的连接点和所述第一修复线与所述第三待修补数据线的连接点之间的所述第一修复线断开；将位于所述第二连接线与所述第二待修补数据线的连接点和所述第二连接线与所述第四待修补数据线的连接点之间的所述第二连接线断开；将位于所述第二修复线与所述第一待修补数据线的连接点和所述第二修复线与所述第四待修补数据线的连接点之间的所述第二修复线断开。
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