WO2013078632A1

WO2013078632A1 - Cutting apparatus and cutting method for liquid crystal panel

Info

Publication number: WO2013078632A1
Application number: PCT/CN2011/083201
Authority: WO
Inventors: 李冬; 佘峰; 黄正明
Original assignee: 深圳市华星光电技术有限公司
Priority date: 2011-11-28
Filing date: 2011-11-30
Publication date: 2013-06-06
Also published as: CN102515493A; CN102515493B

Abstract

Apparatus and method for cutting a liquid crystal panel (30). The liquid crystal panel (30) comprises a first substrate (31) and a second substrate (32) affixed to each other. The apparatus for cutting the liquid crystal panel (30) comprises a first cutter part (10) used for cutting the first substrate (31) and a second cutter part (20) used for cutting the second substrate (32). The second cutter part (20) comprises a first support part (26). The first support part (26) is used for supporting the first substrate (31) when the first cutter part (10) is cutting the first substrate (31) while the second cutter part (20) has yet to cut the second substrate (32). This ensures the cutting quality, increases the cutting efficiency, and conserves cutting costs.

Description

Liquid crystal panel cutting device and cutting method

Technical field

The invention belongs to the technical field of production of liquid crystal panels, and particularly relates to a cutting device and a cutting method for a liquid crystal panel.

Background technique

With the increasing popularity of liquid crystal displays, higher requirements have been placed on the production efficiency of liquid crystal panels.

In the process of fabricating a liquid crystal panel, a thin film field effect transistor (Thin Film) Transistor, TFT) substrate and color filter (Color After the combination of the filter and the CF substrate, it is necessary to cleave the both ends of the CF substrate to expose the metal wires at both ends of the TFT substrate, so that the length or width of the TFT substrate and the CF substrate do not coincide with each other, thereby forming the terminal portion.

Referring to FIG. 1A, the liquid crystal panel 10' includes a TFT substrate 11' and a CF substrate 12', wherein the terminal portions 111' at both ends of the TFT substrate 11' include a plurality of metal wires 1111', and the plurality of metal wires 1111' are in the direction B. arrangement.

Referring to FIG. 1B, the cutting apparatus includes an upper cutter head 21' and a lower cutter head 22'. When the liquid crystal panel 10' shown in FIG. 1A is cut by a cutting device, if the cutting direction L of the cutting device (ie, the liquid crystal panel 10) The 'flow direction" is perpendicular to the arrangement direction B of the metal wire 1111'. When the liquid crystal panel 10' is cut, the cutting device needs to pass through the terminal portion 111', and two cases will occur:

First, if the upper cutter head 21' starts cutting the TFT substrate 11', and the lower cutter head 22' simultaneously starts cutting the CF substrate 12', the upper cutter head 21' and the lower cutter head 22' are spaced apart in the cutting direction L. The distance will be too large, causing the LCD panel to break;

Second, if the distance between the upper cutter head 21' and the lower cutter head 22' in the cutting direction L is too small, the upper cutter head 21' will be cut to the TFT substrate 11', and the lower cutter head 22' will also be applied to the TFT substrate 11. 'Cutting, when the lower cutter head 22' is moved to the CF substrate 12', it will touch the side of the CF substrate 12', causing irregular movement of the liquid crystal panel 10' or causing the lower cutter head 22' to be on the CF substrate 12. 'The side of the 'stops the advance, greatly affecting the quality of the cut.

In order to avoid the above-mentioned adverse effects caused by the cutting direction L of the cutting device and the alignment direction B of the metal wire 1111' to the liquid crystal panel 10', the prior art generally cuts the terminal portion 111' in the following two ways:

First, referring to FIG. 1C, the arrangement direction B of the metal wires 1111' of the liquid crystal panel 10' is controlled to be parallel to the cutting direction L of the cutting device, and the terminal portion 111' of the liquid crystal panel 10' is cut by an existing cutting device. However, in this manner, if the alignment direction B of the metal wires 1111' is not parallel to the cutting direction L of the cutting device, the flow direction of the liquid crystal panel 10' needs to be readjusted, resulting in an increase in the production time of the single-piece product and a decrease in the production efficiency.

Secondly, a pre-cutting portion is added to the cutting device, and the terminal portion 111' of the liquid crystal panel 10' is cut off in advance by the pre-cutting portion, so that the length and width of the TFT substrate 11' and the CF substrate 12' are identical, and then passed. The existing cutting device cuts the liquid crystal panel 10'. However, this method requires adding a pre-cutting portion to the existing cutting device, which complicates the process and increases the production cost.

In summary, in the prior art, when the liquid crystal panel is cut, the terminal portion of the TFT substrate is present, and the direction of the flow film is limited when the liquid crystal panel is cut or the cutting process is complicated and the cost is high, which is a technical problem in the production technology of the liquid crystal panel. One of the technical issues.

technical problem

An object of the present invention is to provide a cutting device for a liquid crystal panel, which solves the problem that the flow direction of the liquid crystal panel is limited or cut when the liquid crystal panel is cut when the liquid crystal panel is cut when the liquid crystal panel is cut in the prior art. The process is complicated and the cost is high.

Technical solution

The present invention constructs a cutting device for a liquid crystal panel, the liquid crystal panel including a first substrate and a second substrate that are bonded to each other; the cutting device of the liquid crystal panel includes a first cutting portion and a second cutting portion, the a cutting portion includes a first cutter head for cutting the first substrate, and the second cutting portion includes a second cutter head for cutting the second substrate;

The first cutter head and the second cutter head are disposed offset from each other in a direction perpendicular to the liquid crystal panel, and the first cutter head and the second cutter head are spaced apart from each other in a direction parallel to the liquid crystal panel. distance;

The second cutting portion further includes a support portion, the support portion is a nozzle, the nozzle is configured to cut the first substrate at the first cutting portion, and the second cutting portion is not yet When the second substrate is cut, gas is ejected to support the first substrate.

In the cutting device for a liquid crystal panel of the present invention, the second blade and the second substrate are spaced apart by a knife distance in a direction perpendicular to a plane of the liquid crystal panel.

In the cutting device of the liquid crystal panel of the present invention, the second cutting portion further includes a second base and a second bracket, and the second bracket and the support portion are both disposed on the second base. The distance between the second bracket and the first substrate is smaller than the distance between the support portion and the first substrate.

In the cutting device of the liquid crystal panel of the present invention, the first cutting portion includes the first cutter head, the first bracket, the first base, the first motor, and the first lead screw; the first cutter head setting The first bracket is disposed on the first base, the first motor is coupled to the first base, and the first base is slidably coupled to the first lead screw The first motor is configured to drive the first base to slide along the first lead screw;

The second cutting portion includes the second cutter head, the second bracket, the second base, the second motor, the second lead screw, and the support portion; the second motor is connected to the first portion a second base, the second base is slidably coupled to the second lead screw, and the second motor is configured to drive the second base to slide along the second lead screw.

In the cutting device of the liquid crystal panel of the present invention, the distance between the first cutter head and the second cutter head in a direction parallel to the liquid crystal panel is less than or equal to 3.5 mm.

Another object of the present invention is to provide a cutting device for a liquid crystal panel, which solves the problem that in the prior art, when the liquid crystal panel is cut, since the terminal portion exists at both ends of the TFT substrate, the direction of the flow sheet is limited when the liquid crystal panel is cut or The cutting process is complicated and the cost is high.

In order to solve the above problems, the present invention constructs a cutting device for a liquid crystal panel, the liquid crystal panel including a first substrate and a second substrate that are bonded to each other; the cutting device of the liquid crystal panel includes a cutting substrate for cutting the first substrate a first cutting portion and a second cutting portion for cutting the second substrate;

The second cutting portion includes a supporting portion for cutting the first substrate at the first cutting portion, and the second cutting portion is not cutting the second substrate Supporting the first substrate.

In the cutting device of the liquid crystal panel of the present invention, the first cutting portion includes a first cutter head for cutting the first substrate, and the second cutting portion includes a second cutting portion for cutting the second substrate a cutter head, the first cutter head and the second cutter head are disposed offset from each other in a direction perpendicular to the liquid crystal panel, and the first cutter head and the second cutter head are spaced apart from each other in a direction parallel to the liquid crystal panel a distance.

In the cutting device of the liquid crystal panel of the present invention, the support portion is a nozzle for ejecting gas to support the first substrate.

A further object of the present invention is to provide a method for cutting a liquid crystal panel, which solves the problem that in the prior art, when the liquid crystal panel is cut, since the terminal portion exists at both ends of the TFT substrate, the direction of the flow sheet is limited when the liquid crystal panel is cut or The cutting process is complicated and the cost is high.

In order to solve the above problems, the present invention constructs a cutting method of a liquid crystal panel, the liquid crystal panel includes a first substrate and a second substrate that are bonded to each other; and the cutting method of the liquid crystal panel includes the following steps:

Providing a cutting device for a liquid crystal panel, the cutting device of the liquid crystal panel comprising a first cutting portion and a second cutting portion, the second cutting portion comprising a supporting portion;

Controlling the first cutting portion to contact the first substrate, and starting to cut the first substrate while supporting the first substrate through the supporting portion;

Controlling the second cutting portion to contact the second substrate, and starting to cut the second substrate to stop the support of the support portion to the first substrate.

In the manufacturing method of the liquid crystal panel of the present invention, before controlling the second cutting portion to contact the second substrate, the method further includes the following steps:

The second cutting portion is controlled to move a knife distance in a direction perpendicular to a plane of the liquid crystal panel to contact the second substrate.

In the manufacturing method of the liquid crystal panel of the present invention, the supporting portion is a nozzle, and the step of supporting the first substrate by the supporting portion specifically includes:

Gas is ejected through the nozzle to support the first substrate.

Beneficial effect

Compared with the prior art, the present invention provides a support portion, such as a nozzle, in the second cutting portion, and the first substrate is cut in the first cutting portion, and the second cutting portion is not cut in the second substrate. The support portion supports the first substrate. Obviously, the present invention can effectively cut the liquid crystal panel regardless of the flow direction of the liquid crystal panel of the terminal portion, thereby eliminating the defect caused by the terminal portion on the cutting of the liquid crystal panel. The effect is to ensure the cutting quality, improve the cutting efficiency, and increase the pre-cutting part without reducing the process cost.

DRAWINGS

1A is a schematic structural view of a liquid crystal panel;

1B-1C are schematic diagrams of cutting of a liquid crystal panel in the prior art;

2 is a schematic view showing the positional relationship between a preferred embodiment of the cutting device of the liquid crystal panel of the present invention and the liquid crystal panel;

3 is a schematic structural view of a liquid crystal panel cut by a cutting device of a liquid crystal panel of the present invention;

4 is a schematic structural view of a preferred embodiment of a nozzle of a cutting device for a liquid crystal panel of the present invention;

5 is a schematic view showing a starting position of a cutting device of a liquid crystal panel according to the present invention for cutting a liquid crystal panel;

6 is a schematic view showing a process position of a cutting device of a liquid crystal panel according to the present invention for cutting a liquid crystal panel;

FIG. 7 is a schematic flow chart of a preferred embodiment of a method of cutting a liquid crystal panel according to the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

The following description of the various embodiments is provided to illustrate the specific embodiments of the invention.

2 is a schematic view showing the positional relationship between a preferred embodiment of a cutting device for a liquid crystal panel and a liquid crystal panel according to the present invention. The cutting device of the liquid crystal panel includes a first cutting portion 10 and a second cutting portion 20.

The first cutting portion 10 includes a first cutter head 11 , a first bracket 12 , a first base 13 , a first motor 14 , and a first lead screw 15 . The first cutter head 11 is disposed on the first bracket 12 , the first bracket 12 is disposed on the first base 13 , and the first motor 14 is connected to the first base 13 . The first base 13 is slidably coupled to the first lead screw 15 for driving the first base 13 to slide along the first lead screw 15.

The second cutting portion 20 includes a second cutter head 21, a second bracket 22, a second base 23, a second motor 24, a second lead screw 25, and a nozzle 26. The second cutter head 21 is disposed on the second bracket 22, the second bracket 22 and the nozzle 26 are disposed on the second base 23, and the second motor 24 is connected to the second bracket The base 23 is slidably coupled to the second lead screw 25, and the second motor 24 is configured to drive the second base 23 to slide along the second lead screw 25.

Please refer to FIG. 3 , which is a perspective view of a liquid crystal panel 30 which is cut by a cutting device of a liquid crystal panel according to the present invention. The liquid crystal panel 30 includes the first substrate 31 and the second substrate 32 . The first substrate 31 is bonded to the second substrate 32, and a terminal portion 311 is formed at both ends of the first substrate 31. The terminal portion 311 has a plurality of metal wires 3111, and the plurality of metal wires 3111 are along the direction. B arranged.

Referring to FIG. 2 and FIG. 3 together, B1 is a direction parallel to the liquid crystal panel 30, and B2 is a direction perpendicular to the liquid crystal panel 30. The first cutting portion 10 and the second cutting portion 20 are oppositely disposed, and the first cutter head 11 and the second cutter head 21 are dislocated in the direction B2 so as to be spaced apart by a distance D4 in the direction B1. The liquid crystal panel 30 is disposed between the first cutter head 11 and the second cutter head 21, and the first cutter head 11 is disposed above the first substrate 31, and the second cutter head 21 is disposed at the Below the second substrate 32. The nozzle 26 and the first substrate 31 have a supporting distance D1 in the direction B2, and the second bracket 22 and the first substrate 31 have a spacing D2 in the direction B2, and the second cutting head 21 is The second substrate 32 has a lower knife distance D3 in the direction B2.

Referring to FIG. 2 again, the nozzle 26 can eject a gas flow in a direction B2 for supporting the first substrate 31 when the first cutter head 11 cuts the terminal portion 311 of the first substrate 31. .

Please refer to FIG. 2 and FIG. 4 together. FIG. 4 is a schematic structural view of a preferred embodiment of the nozzle 26 of the present invention. The nozzle 26 is a Laval tube, and the nozzle 26 includes an outlet 261 and a throat 262 that can eject a gas of sufficient pressure to support the first substrate 31, the nozzle 26 further comprising The cavity structure in which the gas is ejected is not described herein in view of the well-known technique. Of course, in the specific implementation process, the nozzle 26 can also be a support portion of another structure, such as a pole that can be automatically telescoped, as long as the terminal portion of the first substrate 31 facing the first substrate 31 can be When the 311 is cut, the first substrate 31 is supported, and is not enumerated here.

The cutting device of the liquid crystal panel cuts the terminal portion 311 of the first substrate 31, and the second cutter head 21 does not cut the second substrate 32. At this time, the nozzle 26 is ejected. The gas supports the first substrate 31, thereby avoiding damage to the liquid crystal panel 30 due to the force imbalance of the terminal portion 311 of the first substrate 31.

Referring to FIG. 2 , in the direction B1 , the distance D2 between the second bracket 22 and the first substrate 31 is smaller than the support distance D1 of the nozzle 26 and the first substrate 31 . Therefore, when the second susceptor 23 is moved in the direction B1, the contact of the nozzle 26 with the second substrate 32 can be avoided, further ensuring the cutting quality.

In this embodiment, in order to avoid an excessively large cutting section of the liquid crystal panel 30 due to the excessive spacing D4 of the first cutter head 11 and the second cutter head 21 in the direction B1, the first The distance D4 at which the cutter head 11 and the second cutter head 21 are spaced apart in the direction B1 should not be too large. Preferably, the distance D4 of the interval is less than or equal to 3.5 mm.

The lower cutting distance D3>0 between the second cutter head 21 and the second substrate 32 in the direction B2. When the second motor 24 drives the second base 23 to move in the direction B1, the second cutter head 21 is simultaneously controlled to move the lower cutter distance D3 in the direction B2, so that the second cutter head 21 Contacting the second substrate 32. In this embodiment, by spacing the knife distance D3 between the second cutter head 21 and the second substrate 32, it is ensured that the second cutter head 21 does not intersect with the second substrate 32 before cutting. The edge of the second substrate 32 collides. In a specific implementation process, the moving speed of the second cutter head 21 in the direction B2 (ie, the lower knife speed) is adjusted according to the moving speed of the second cutter head 21 in the direction B1 and the lower cutter distance D3. I won't go into details here.

The process of cutting the liquid crystal panel of the preferred embodiment of the cutting device for a liquid crystal panel of the present invention will be described in detail below with reference to FIGS. 2, 5 and 6.

Referring to FIG. 2 and FIG. 5, the cutting device of the liquid crystal panel cuts the liquid crystal panel 30 in the direction B1, and the first motor 14 drives the first base 13 to slide along the first lead screw 15. The first cutter head 11 contacts the first substrate 31 and begins to cut the terminal portion 311 of the first substrate 31. At this time, the nozzle 26 ejects gas to support the first substrate 31. The second motor 24 drives the second base 23 to slide along the second lead screw 25, and simultaneously controls the second cutter head 21 to move toward the second substrate 32 in the direction B2, at the control station. After the second cutter head 21 moves the lower cutter distance D3 in the direction B2, the second cutter head 21 contacts the second substrate 32.

Referring to FIGS. 2 and 6, the second cutter head 21 contacts the second substrate 32 and begins to cut the second substrate 32. At this time, the nozzle 26 stops the ejection of the gas, and the second cutter 32 cuts the second substrate 32 to generate a supporting force to the liquid crystal panel 30, thereby canceling the first cutter head. When the first substrate 31 is cut, the pressure on the liquid crystal panel 30 is cut, so that the liquid crystal panel 30 does not warp, and the quality of the cutting is ensured.

According to the present invention, when the nozzle portion 26 is provided in the second cutting portion 20, when the first cutting portion 10 cuts the terminal portion 311 of the first substrate 31, the nozzle 26 ejects gas to support the nozzle. The first substrate 31 is described. Obviously, the present invention can effectively cut the liquid crystal panel 30 regardless of the flow direction of the liquid crystal panel 30 of the terminal portion 311, thereby eliminating the adverse effect of the terminal portion 311 on cutting. The cutting quality improves the cutting efficiency, and the pre-cutting portion is not required to be added, thereby reducing the process cost.

Please refer to FIG. 7. FIG. 7 is a schematic flow chart of a method for cutting a liquid crystal panel according to a preferred embodiment of the present invention. The method for cutting a liquid crystal panel includes the following steps:

Step S701: A cutting device for a liquid crystal panel is provided. For detailed structure of the cutting device of the liquid crystal panel, please refer to the description of FIG. 2 to FIG. 6 , and details are not described herein again.

Step S702: The first cutting portion 21 cuts the first substrate 31, and the nozzle 26 ejects gas.

In this step, the first motor 14 drives the first susceptor 13 to slide along the first lead screw 15, the first cutter head 11 contacts the first substrate 31, and begins to cut the first substrate 31. The starting position of the liquid crystal panel 30 is the one end of the liquid crystal panel 30 where the terminal portion 311 is located, and the cutting direction of the first cutting head 11 is perpendicular to the arrangement direction B of the metal wire 3111.

The nozzle 26 ejects gas to support the first substrate 31. At this time, since the gas ejected from the nozzle 26 generates a supporting force, the supporting force supports the first substrate 31, and the pressure of the first cutting head 11 against the first substrate 31 is cancelled. In a specific implementation, the nozzle 26 can also be a support portion of another structure, such as a pole that can be automatically telescoped, as long as the terminal portion 311 of the first substrate 31 can be performed on the first cutter head 11 When cutting, the first substrate 31 may be supported, and will not be enumerated here.

Step S703: the second motor 24 drives the second base 23 to slide along the second lead screw 25 while controlling the second cutter head 22 to move toward the second substrate 32 in the direction B2. The second cutter head 22 contacts the second substrate 32 after moving the lower cutter distance D3 in the direction B2.

Step S704: The second cutter head 21 cuts the second substrate 32, and the nozzle 26 stops the discharge of gas.

According to the present invention, when the nozzle portion 26 is provided in the second cutting portion 20, when the first cutting portion 10 cuts the terminal portion 311 of the first substrate 31, the nozzle 26 ejects gas to support the nozzle. The first substrate 31 is apparently capable of effectively cutting the liquid crystal panel 30 regardless of the flow direction of the liquid crystal panel 30 of the terminal portion 311, eliminating the pair of terminal portions 311. The adverse effects of cutting ensure the cutting quality and improve the cutting efficiency, and the pre-cutting part is not required to be added, which reduces the process cost.

In the above, the present invention has been disclosed in the above preferred embodiments, but the preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various modifications without departing from the spirit and scope of the invention. The invention is modified and retouched, and the scope of the invention is defined by the scope defined by the claims.

Embodiments of the invention

Industrial applicability

Sequence table free content

Claims

A cutting device for a liquid crystal panel, the liquid crystal panel including a first substrate and a second substrate that are bonded to each other; the cutting device of the liquid crystal panel includes a first cutting portion and a second cutting portion, the first cutting portion including a first cutter head for cutting the first substrate, the second cutting portion including a second cutter head for cutting the second substrate, wherein:

The first cutter head and the second cutter head are disposed offset from each other in a direction perpendicular to the liquid crystal panel, and the first cutter head and the second cutter head are spaced apart from each other in a direction parallel to the liquid crystal panel. distance;

The second cutting portion further includes a support portion, the support portion is a nozzle, the nozzle is configured to cut the first substrate at the first cutting portion, and the second cutting portion is not yet When the second substrate is cut, gas is ejected to support the first substrate.
The cutting device for a liquid crystal panel according to claim 1, wherein the second tip and the second substrate are spaced apart by a knife distance in a direction perpendicular to a plane of the liquid crystal panel.
The cutting device of the liquid crystal panel according to claim 1, wherein the second cutting portion further comprises a second base and a second bracket, wherein the second bracket and the support portion are both disposed on the first The distance between the second bracket and the first substrate is smaller than the distance between the support portion and the first substrate.
A cutting device for a liquid crystal panel according to claim 3, wherein

The first cutting portion includes the first cutter head, the first bracket, the first base, the first motor and the first lead screw; the first cutter head is disposed on the first bracket, the first a bracket is disposed on the first base, the first motor is coupled to the first base, the first base is slidably coupled to the first lead screw, and the first motor is configured to drive the The first base slides along the first lead screw;

The second cutting portion includes the second cutter head, the second bracket, the second base, the second motor, the second lead screw, and the support portion; the second motor is connected to the first portion a second base, the second base is slidably coupled to the second lead screw, and the second motor is configured to drive the second base to slide along the second lead screw.
A cutting device for a liquid crystal panel according to claim 1, wherein a distance between said first cutter head and said second cutter head in a direction parallel to said liquid crystal panel is less than or equal to 3.5 mm.
A cutting device for a liquid crystal panel, the liquid crystal panel including a first substrate and a second substrate that are bonded to each other; the cutting device of the liquid crystal panel includes a first cutting portion for cutting the first substrate and for cutting a second cutting portion of the second substrate, characterized by:

The second cutting portion includes a supporting portion for cutting the first substrate at the first cutting portion, and the second cutting portion is not cutting the second substrate Supporting the first substrate.
The cutting device of a liquid crystal panel according to claim 6, wherein the first cutting portion includes a first cutter head for cutting the first substrate, and the second cutting portion includes a cutting portion for cutting a second cutter head of the second substrate, the first cutter head and the second cutter head are offset from each other in a direction perpendicular to the liquid crystal panel, and the first cutter head and the second cutter head are in a The liquid crystal panels are spaced apart by a distance in a parallel direction.
The cutting device of a liquid crystal panel according to claim 7, wherein the second blade and the second substrate are spaced apart by a knife distance in a direction perpendicular to a plane of the liquid crystal panel.
The cutting device of the liquid crystal panel according to claim 7, wherein the second cutting portion further comprises a second base and a second bracket, wherein the second bracket and the support portion are both disposed on the first The distance between the second bracket and the first substrate is smaller than the distance between the support portion and the first substrate.
A cutting device for a liquid crystal panel according to claim 9, wherein

The first cutting portion includes the first cutter head, the first bracket, the first base, the first motor and the first lead screw; the first cutter head is disposed on the first bracket, the first a bracket is disposed on the first base, the first motor is coupled to the first base, the first base is slidably coupled to the first lead screw, and the first motor is configured to drive the The first base slides along the first lead screw;

The second cutting portion includes the second cutter head, the second bracket, the second base, the second motor, the second lead screw, and the support portion; the second motor is connected to the first portion a second base, the second base is slidably coupled to the second lead screw, and the second motor is configured to drive the second base to slide along the second lead screw.
A cutting device for a liquid crystal panel according to claim 7, wherein a distance between said first cutter head and said second cutter head in a direction parallel to said liquid crystal panel is less than or equal to 3.5 mm.
The cutting device of a liquid crystal panel according to claim 6, wherein the support portion is a nozzle for ejecting gas to support the first substrate.
A cutting method of a liquid crystal panel, the liquid crystal panel comprising a first substrate and a second substrate which are bonded to each other; wherein the cutting method of the liquid crystal panel comprises the following steps:

Providing a cutting device for a liquid crystal panel, the cutting device of the liquid crystal panel comprising a first cutting portion and a second cutting portion, the second cutting portion comprising a supporting portion;

Controlling the first cutting portion to contact the first substrate, and starting to cut the first substrate while supporting the first substrate through the supporting portion;

Controlling the second cutting portion to contact the second substrate, and starting to cut the second substrate to stop the support of the support portion to the first substrate.
The method of fabricating a liquid crystal panel according to claim 13, wherein before the controlling the second cutting portion contacts the second substrate, the method further comprises the steps of:

The second cutting portion is controlled to move a knife distance in a direction perpendicular to a plane of the liquid crystal panel to contact the second substrate.
The method of fabricating a liquid crystal panel according to claim 13, wherein the supporting portion is a nozzle, and the step of supporting the first substrate by the supporting portion comprises:

Gas is ejected through the nozzle to support the first substrate.