WO2013075620A1 - Dispositif électronique refroidi par immersion - Google Patents

Dispositif électronique refroidi par immersion Download PDF

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Publication number
WO2013075620A1
WO2013075620A1 PCT/CN2012/084933 CN2012084933W WO2013075620A1 WO 2013075620 A1 WO2013075620 A1 WO 2013075620A1 CN 2012084933 W CN2012084933 W CN 2012084933W WO 2013075620 A1 WO2013075620 A1 WO 2013075620A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
isolation
electronic device
housing
layer
Prior art date
Application number
PCT/CN2012/084933
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English (en)
Chinese (zh)
Inventor
黄茂胜
黄书亮
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2013075620A1 publication Critical patent/WO2013075620A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion

Definitions

  • the present application claims priority to Chinese Patent Application No. 201110373997, filed on November 21, 2011, the entire disclosure of which is hereby incorporated by reference. This is incorporated herein by reference.
  • BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling technology for an electronic device, and more particularly to an electronic device using an immersion cooling method.
  • BACKGROUND OF THE INVENTION Electronic devices of the prior art such as the heat generated during operation of various communication devices, fail to perform good heat dissipation treatment, which will accelerate the degradation of device performance, resulting in poor reliability of the communication device and increasing maintenance costs.
  • the existing communication equipment mainly uses air-cooling technology for heat dissipation, such as using a fan for ventilation.
  • air-cooling technology for heat dissipation, such as using a fan for ventilation.
  • heat density increases, hot spots and noise become more prominent.
  • a conventional sealing structure is a sealing space in which a sealing strip is used to form a closed cooling medium.
  • a sealing strip is used to form a closed cooling medium.
  • the embodiment of the invention provides an electronic device using immersion cooling for solving the problems of poor sealing reliability and high complexity of the cooling system in the prior art.
  • the sealing structure of the embodiment of the invention is simple, and the reliability of the sealing is high.
  • the embodiment of the invention provides an immersed cooling electronic device, including:
  • the circuit board includes a circuit board layer, a circuit board lower layer, and a trace layer between the circuit board layer and the circuit board lower layer, and the circuit board layer and the circuit board lower layer are respectively provided with isolation trenches;
  • the housing includes a partition wall extending in the housing toward the circuit board and interposed into the isolation slot, thereby passing through the partition wall, the circuit board, and the The housing forms a sealed space, and the sealed space has a cooling medium for cooling the components on the circuit board sealed in the sealed space;
  • the circuit board is provided on another portion outside the sealed space with a connector for connecting the signal of the wiring layer to other electronic devices.
  • An embodiment of the present invention further provides an electronic device, including:
  • the circuit board includes a first working area and a second working area, an isolation slot is disposed between the first working area and the second working area, and the first electronic component on the circuit board that needs to be cooled is disposed on
  • the connector on the circuit board is disposed in the second working area, and the connector is configured to connect a signal of a routing layer in the circuit board with other electronic devices;
  • the housing includes a plurality of partition walls that engage the isolation grooves to form a closed interior space in the housing, the first working area being sealed in the interior space,
  • the interior space has a cooling medium, and the first electronic component is immersed in the cooling medium.
  • the circuit board has an isolation groove, and the partition wall of the casing is closely coupled with the isolation groove on the circuit board to form a sealed internal space in the casing.
  • the embodiment of the invention separates the connector from the outside of the sealed internal space, so that the connector can be Conveniently connected to other equipment, compared to the way the connector is submerged, there is no need to introduce additional sealing devices and set sealing methods, reducing design costs and manufacturing costs. Since the sealing structure of the embodiment is simple, and the sealant or the sealing strip which is prone to aging is not used, the reliability of the sealing is improved.
  • FIG. 1 is a schematic exploded view of a first embodiment of an electronic device for immersion cooling according to the present invention
  • FIG. 2 is a schematic structural view of the electronic device shown in FIG. Figure 3 is an enlarged schematic view of a broken line portion of Figure 2;
  • FIG. 4 is a schematic structural view of a second embodiment of an immersed cooling electronic device according to the present invention
  • FIG. 5 is an enlarged schematic view of a broken line portion of FIG.
  • FIG. 6 is a schematic structural view of a third embodiment of an immersed cooling electronic device according to the present invention
  • FIG. 7 is a schematic structural view of a fourth embodiment of an immersed cooling electronic device according to the present invention
  • FIG. 9 is a schematic structural view of a sixth embodiment of an immersed-cooled electronic device of the present invention.
  • FIG. 1 is a schematic exploded view of a first embodiment 100 of an immersed cooling electronic device according to the present invention
  • FIG. 2 is a combined structure of the electronic device 100 shown in FIG. schematic diagram.
  • An immersed cooled electronic device embodiment 100 of the present invention includes a housing 10 and a circuit board 20 disposed in the housing.
  • the housing 10 includes an upper housing 12 and a lower housing 14 which are disposed opposite each other.
  • the upper casing 12 has a first flat plate 121, a first side wall 123, and a first partition wall 125.
  • the first side wall 123 is located at both ends of the first flat plate 121 and extends from both ends of the first flat plate 121 toward the circuit board 20.
  • the first partition wall 125 is located between the two first side walls 123 and extends from the inner surface of the first flat plate 121 toward the circuit board 20.
  • the lower casing 14 has a second flat plate 141, a second side wall 143, and a second partition wall 145.
  • the second side wall 143 is located at both ends of the second flat plate 141 and extends from both ends of the second flat plate 141 toward the circuit board 20.
  • the second partition wall 145 is located between the two second side walls 143 and extends from the inner surface of the second flat plate 141 toward the circuit board 20.
  • the material of the casing 10 may be selected from a metal material such as an aluminum profile or a sheet metal material, or an acrylic material having a high thickness and strength may be selected.
  • the circuit board 20 includes a circuit board layer 21, a circuit board lower layer 23, and a trace layer 25 between the circuit board layer 21 and the circuit board lower layer 23.
  • the circuit board layer 21 has a first isolation trench 22, and the circuit board lower layer 23 has a second isolation trench 24.
  • the depth of the first isolation trench 22 and the second isolation trench 24 does not affect the trace layer 25, BP: the first isolation trench 22
  • the bottom of the second isolation trench 24 does not reach the surface of the trace layer 25, and does not affect the trace layer 25.
  • the specific shape and width of the first isolation groove 22 and the second isolation groove 24 are adapted to be in close contact with the first partition wall 125 and the second partition wall 145, respectively. It should be understood that the widths of the first isolation trench 22 and the second isolation trench 24 are enlarged in FIG. 1 based on the need to more clearly illustrate the structure of the embodiment of the present invention, notably the width shown in FIG.
  • the circuit board 20 is divided into two working areas by the first isolation trench 22 and the second isolation trench 24: a first working area 20a and a second working area 20b on both sides of the first working area 20a.
  • the first working area 20a of the circuit board 20 is provided with a first component 211, and the second working area 20b is provided with a second component 213.
  • the first element 211 is an electronic thermal active element, and the first element 211 generates heat during operation, and needs to be cooled to maintain a stable operating state.
  • the first component 211 is, for example, an electronic component such as a processor, a memory, or a power source.
  • the second element 213 refers to an electronic component that does not require a special cooling process during operation, such as a connector. In the present embodiment, only the second component 213 is used as an example for the connector. It should be particularly noted that the second component 213 may be other specific electronic components in addition to the connector. It is to be noted that the number of the first electronic component 211 and the second electronic component 213 shown in the drawings of the present invention is merely an example, and is not specifically limited as the embodiment of the present invention.
  • FIG. 3 is an enlarged schematic view of a broken line portion of FIG. 2 to more clearly show the manner in which the housing 10 and the circuit board 20 are joined.
  • the first isolation wall 125 of the upper housing 12 is tightly engaged with the first isolation trench 22 of the circuit board 20, the second isolation wall 145 of the lower housing 14 and the second of the circuit board 20
  • the isolation grooves 24 are tightly joined.
  • the first partition wall 125 and the second partition wall 145 are tightly joined to the first partitioning groove 22 and the second isolating groove 24, and can be further tightened by gluing, crimping or welding to further strengthen the overall sealing effect.
  • the first partition wall 125 and the second partition wall 145 are not limited to be close to the first isolation trench 22 and the second isolation trench 24 in a manner perpendicular to the surface of the circuit board 20 as shown in FIG.
  • the first partitioning wall 125 and the second partitioning wall 145 are respectively tightly engaged with the first isolating groove 22 and the second isolating groove 24 to form a sealed internal space 30 between the upper casing 12 and the lower casing 14 .
  • 30 is a closed cavity, and the first working area 20a of the circuit board 20 is sealed in the internal space 30.
  • the internal space 30 includes a first area 30A and a second area 30B, and the first area 30A and the second area 30B are separated by the first working area 20a of the circuit board 20, and are formed on the upper and lower sides of the first working area 20a, respectively.
  • the enclosed interior space 30 can be implemented in a variety of ways, including but not limited to the three ways exemplified below:
  • the first isolation trench 22 of the circuit board 20 is two strip slots, the first flat panel 121 of the upper housing 12, the circuit board layer 21, and two opposite sidewalls of the upper housing 12 (not shown) and The first partition wall 125 as a top surface, a bottom surface, and four side walls of the closed cavity together form a first region 30A of the inner space 30;
  • the second isolation trenches 22 of the circuit board 20 are two strip-shaped slots, the second flat panel 141 of the lower housing 14, the lower layer 23 of the circuit board, and the opposite sidewalls of the lower housing 14 (not shown).
  • the two second partition walls 145 together form a second region 30B of the interior space 30.
  • the first isolation trench 22 of the circuit board 20 is a triangular closed channel surrounded by three slots, and the first flat plate 121 of the upper casing 12, the circuit board layer 21 and the three first partition walls 125 respectively serve as The top surface, the bottom surface, and the side walls of the closed cavity together form a first region 30A of the internal space 30;
  • the second isolation trench 22 of the circuit board 20 is a triangular closed channel surrounded by three slots, and the second flat plate 141 of the lower casing 14 and the lower circuit board 23 and the three second partition walls 145 are common.
  • a second region 30B of the internal space 30 is formed.
  • the first isolation trench 22 of the circuit board 20 is a circular closed channel, and the first flat plate 121 of the upper casing 12, the circuit board layer 21 and the annular first partition wall 125 respectively serve as a closed cavity.
  • the top surface, the bottom surface, and the side walls together form a first region 30A of the inner space 30;
  • the second isolation trench 22 of the circuit board 20 is a circular closed channel, and the second flat plate 141 of the lower casing 14, the lower circuit board 23, and the annular second partition wall 145 together form an internal space 30.
  • the number and shape of the first isolation trench 22 and the second isolation trench 24 can be set according to actual needs, and the first isolation trench 22 can be a strip slot and a closed annular slot. Or a polygonal closed channel surrounded by a plurality of channels; and the shapes of the first isolation groove 22 and the second isolation groove 24 are not required to be the same, as long as they can be separated from the first isolation wall 125 and the second The walls 145 are correspondingly tightly joined.
  • the first working area 20a of the circuit board 20 is sealed in the internal space 30, and the first working area 30A and the second area 30B of the internal space 30 have the cooling medium 40 therein, and The first electronic component 211 on the circuit board 20 is immersed in the cooling medium 40.
  • the cooling medium 40 is in direct contact with the first member 211, so the cooling medium 40 should be electrically insulating, thermally stable, and non-corrosive to the circuit board 20 and the electronic components thereon.
  • the cold working fluid 40 has electrical insulation and does not cause short circuit of the circuit; the cooling medium 40 has thermal stability, and does not decompose and deteriorate without being worked at a high temperature for a long time.
  • the cooling medium 40 that meets the foregoing requirements is, for example:
  • the internal space 30 should be filled with a sufficient cooling medium 40 to immerse the first electronic component 211 that needs to be cooled.
  • the cooling medium 40 fills the internal space 30, and the first electronic component 211 on the first working area 20a of the circuit board 20 is immersed in the cooling medium 40.
  • the housing 10 is formed with two outer spaces 50 located outside the sealed internal space 30.
  • Each of the outer spaces 50 is formed by a first surface 121, a first side wall 123, a first partition wall 125 and a second surface 141, a second side wall 143 and a second partition wall 145, and the second working area 20b of the circuit board 20 Located in the outer space 50. Since the second component 213 disposed on the second working area 20b of the circuit board 20 does not require special cooling treatment during operation, the stability of the second component 213 can be maintained for a long period of time. Therefore, the outer space 50 does not need to be provided with a corresponding cooling device. quality.
  • the heat generated by the first component 211 on the first working area 20a of the circuit board 20 is immersed in the cooling medium 40, and the cooling medium 40 is cooled. Direct contact with the first element 211 is sufficient, so that the heat generated by the first element 211 is absorbed by the cooling medium 40, and a cooling process for the heating element is achieved to maintain the operating temperature of the electronic device 100 within a normal threshold range.
  • the cold working fluid 40 sealed in the first region 30A is taken as an example.
  • the cooling medium 40 located around the first component 211 is in direct contact with the first component 211, and absorbs heat quickly.
  • the working fluid 40 flows from a position close to the first flat plate 121 or the first partition wall 125 toward a position close to the first member 211, whereby the cooling medium 40 is shaped in the first region 30A.
  • a natural convection to achieve the cooling of the first processing element 211.
  • the cooling medium 40 having a higher temperature flows to a position close to the first flat plate 121 or the first partition wall 125, the heat absorbed by the first element 211 is reduced, and the first plate can be passed.
  • the first partition wall 125 further dissipates heat to the outside, so the temperature of the cooling medium 40 decreases; on the other hand, when the lower temperature cooling medium 40 circulates near the first element 211, The element 211 is in direct contact, and the heat dissipated by the first element 211 can be absorbed in the first time, and the temperature rises accordingly. Therefore, a new convection cycle will start between the cooling mediums 40 having the temperature difference in the first region 30A.
  • a first element that generates heat may be disposed in the second region 30B of the internal space 30, and the working mode of the cooling medium 40 in the second region 30B is the same as that described above in the first region 30A.
  • the cooling medium 40 in the cooling mode is the same, and will not be described here.
  • FIG. 5 is a schematic structural view of an electronic device 200 according to a second embodiment of the present invention, wherein FIG. 5 is a partial enlarged view of a broken line portion shown in FIG.
  • the electronic device 200 of the present embodiment is different from the electronic device 100 of the first embodiment in that a reinforcing boss is further provided.
  • the circuit board layer 21 and the circuit board lower layer 23 have a first reinforcing boss 212 and a second reinforcing boss 232, respectively.
  • the first reinforcing protrusion 212 is located above the first isolation trench 22 and has a first opening (not labeled) communicating with the first isolation trench 22 .
  • the first isolation wall 125 passes through the first opening and the first isolation trench 22 . Tightly joined.
  • the second reinforcing boss 232 is located above the second isolation groove 24 and has a second opening (not labeled) communicating with the second isolation groove 24, and the second partition wall 145 is closely connected to the second isolation groove 24 through the second opening. Engage.
  • the first partitioning wall 125 and the first reinforcing boss 212, the second partitioning wall 145 and the second reinforcing boss 232 can be further tightened by gluing, crimping or welding, and further strengthened. The overall sealing effect.
  • the arrangement of the reinforcing bosses 212, 213 can reduce the depth of the isolation trenches formed on the surface of the circuit board layer 21 and the lower layer 23 of the circuit board, thereby reducing damage to the surface of the circuit board. Further, it is preferable that the isolation groove is not provided on the surface of the circuit board, and only the isolation grooves 22, 24 are opened in the reinforcement bosses 212, 213, thereby completely avoiding the damage caused to the surface of the circuit board by the isolation groove.
  • FIG. 6 is a schematic structural diagram of an electronic device 300 according to a third embodiment of the present invention.
  • the electronic device 300 of the present embodiment is different from the electronic device 100 of the first embodiment in that a heat dissipation structure is further provided to further enhance the heat dissipation effect.
  • the first flat plate 121 of the upper casing 12 is provided with a heat dissipation fin 127 corresponding to the outer surface of the inner space 30;
  • the second flat plate 141 of the lower casing 14 is provided with a heat dissipation fin 147 corresponding to the outer surface of the inner space 30.
  • the heat dissipation fins 127 and the heat dissipation fins 147 may be machined, ground, cast or otherwise formed.
  • the heat dissipation fins 127 and the heat dissipation fins 147 can enlarge the heat dissipation area of the first flat plate 121 and the second flat plate 141, and further enhance the electrons by the passive air cooling method in which the heat exchange surface is exposed to a lower external environment temperature as much as possible.
  • the heat dissipation effect of the device 200 is not limited to.
  • heat dissipation fins may be provided only on the upper casing 12 or only on the lower casing 14 to expand the heat dissipation area; and a heat pipe type radiator may be used instead of the heat dissipation fins to further enhance the whole. Cooling effect.
  • FIG. 7 is a schematic structural diagram of an electronic device 400 according to a fourth embodiment of the present invention.
  • the electronic device 400 of the present embodiment is different from the electronic device 100 of the first embodiment in that the structure of the outer space 50 is different.
  • the outer space 50 is an open receiving space having an opening, and the circuit
  • the second working area 20b of the board 20 and its second component 213, the first partitioning wall 125, and the second partitioning wall 145 are exposed to the air, and the air is circulated, and the passive air cooling method through a lower external ambient temperature can be used.
  • the overall heat dissipation effect on the electronic device 400 is further enhanced.
  • FIG. 8 is a schematic structural diagram of an electronic device 500 according to a fifth embodiment of the present invention.
  • the electronic device 500 of the present embodiment is different from the electronic device 100 of the first embodiment in that only one outer space 50 is included.
  • the first flat plate 121, the first side wall 123, the first partition wall 125 and the second flat plate 141, the second side wall 143 and the second partition wall 145 form a sealed internal space 30.
  • the first side wall 123 and the second side wall 143 of the housing are used as one side wall of the internal space 30, so that the number of isolation slots formed on the circuit board can be reduced.
  • the sealing structure is further simplified and the cost is reduced.
  • FIG. 9 is a schematic structural diagram of an electronic device 600 according to a sixth embodiment of the present invention.
  • the electronic device 600 of the present embodiment is different from the electronic device 100 of the first embodiment in that a through hole 26 is provided in the circuit board 20 so that the cooling medium 40 can be in the first region 30A and the first portion of the internal space 30. Circulation between the two regions 30B.
  • the through holes 26 are provided in the first working area 20a of the circuit board 20 and penetrate the upper and lower surfaces of the first working area 20a.
  • the through hole 26 allows the cooling medium 40 to freely circulate between the first region 30A and the second region 30B of the internal space 30, thereby accelerating convection between the hotter temperature and the lower temperature cooling medium 40, further improving heat dissipation. effectiveness.
  • the flow of the cooling medium 40 in the internal space 30 may be a forced convection generated by an excitation component such as a pump for heat exchange;
  • a heat dissipation structure as shown in FIG. 6 is simultaneously disposed in the electronic device 100, and the side space 40 is set as shown in FIG. An open space with a side opening; or, a through hole 26 as shown in FIG. 9 is provided in the electronic device 200 and a heat dissipation structure as shown in FIG. 6 is provided; the combination between the embodiments can be designed according to actual needs, This is no longer enumerated one by one;
  • the second component 213 may be disposed in the first working area 20a of the circuit board.
  • BP Under the premise that the first component 211 that needs to be cooled is disposed in the first working area 20a, a part of the second element 213 is disposed in the first working area 20a, and another part of the second element 213 is disposed in the second working In area 20b.
  • the second component 213 is a common external component such as a connector, a cable, a network cable connector, a signal connector, etc.
  • the external component is disposed in the second working area 20b, and the other types of the second component 213 can be selected.
  • the first work area 20a or the second work area 20b In the first work area 20a or the second work area 20b.
  • the electronic devices described in the embodiments of the present invention include, but are not limited to, high performance computers, minicomputers, general purpose servers, routers, optical transmission devices, and the like.
  • the immersion type cooling scheme of the present invention is illustrated by taking a blade/single board as an example, and it should be understood that the present invention is also applicable to other electronic devices using the immersion cooling method.
  • the upper and lower layers of the circuit board have isolation trenches, and the partition walls of the housing are closely coupled with the isolation trenches on the circuit board to form in the housing. Closed interior space.
  • the heating electronic components such as the power supply, the processor, and the memory are immersed in the cooling medium for cooling; on the other hand, the electronic components that do not need to be cooled, especially the connector, are isolated. Set outside the closed internal space.
  • the sealing structure is simple, and the sealant or the sealing strip which is prone to aging is not used, the reliability of the sealing is improved.
  • the connector since the connector is disposed outside the immersion area, the connector does not need to be sealed, so that the sealing scheme is realized more simply, and also because no sealing treatment is required and no additional device for sealing treatment is required, thereby Reduced costs.
  • the opening of the isolation trench does not damage the trace layer of the circuit board, the entire circuit board is not connected to each other, so that the signal trace design can be completed on one circuit board without designing multiple circuit boards.
  • it avoids designing the connection between multiple boards and designing the seal of the connector, which not only reduces the design cost, but also saves the hardware cost caused by the introduction of the connector and the connection of the cable.
  • the sealing structure of the embodiment of the invention is simple and feasible, does not affect the wiring layer of the circuit board, and can effectively prevent the cooling working medium from leaking out through the cavity of the device, has the advantages of simple sealing structure, high reliability, low cost and easy processing and production.
  • the fastening is further tightened by welding, gluing, crimping, etc.; the reinforcing boss having the opening is provided by the corresponding isolation groove on both sides of the circuit, and the partition wall of the casing is worn. The opening in the reinforcing boss is engaged with the isolation groove to further enhance the overall sealing effect.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention se rapporte à un dispositif électronique qui comprend un boîtier et une carte de circuit imprimé agencée à l'intérieur du boîtier. La carte de circuit imprimé comprend une première région de travail et une seconde région de travail. Il existe une fente d'isolation entre la première région de travail et la seconde région de travail. Un premier élément électronique qui doit être refroidi sur la carte de circuit imprimé est agencé sur la première région de travail. Le boîtier comprend une pluralité de parois d'isolation. Les parois d'isolation et les fentes d'isolation viennent étroitement en prise afin de former un espace interne fermé hermétiquement à l'intérieur du boîtier. La première région de travail est scellée à l'intérieur de l'espace interne. Un fluide de travail de refroidissement est disposé à l'intérieur de l'espace interne, et le premier élément électronique est immergé dans le fluide de travail de refroidissement. Les parois d'isolation et les fentes d'isolation viennent étroitement en prise afin de former un espace interne fermé hermétiquement à l'intérieur du boîtier, un fluide de travail de refroidissement est disposé à l'intérieur de l'espace interne, un élément électronique chauffant est immergé dans le fluide de travail de refroidissement pour être refroidi, un élément électronique qui doit être refroidi n'est pas nécessaire, et un connecteur est agencé à l'extérieur de l'espace interne de manière isolée, ce qui a l'avantage de donner une structure d'étanchéité simple et une fiabilité élevée.
PCT/CN2012/084933 2011-11-21 2012-11-21 Dispositif électronique refroidi par immersion WO2013075620A1 (fr)

Applications Claiming Priority (2)

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CN201110373997.1A CN102510709B (zh) 2011-11-21 2011-11-21 浸没式冷却的电子设备
CN201110373997.1 2011-11-21

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10206307B2 (en) 2016-05-03 2019-02-12 Bitfury Group Limited Immersion cooling
WO2021130504A1 (fr) * 2019-12-24 2021-07-01 Iceotope Group Limited Module de refroidissement
CN113299482A (zh) * 2020-10-19 2021-08-24 阿里巴巴集团控股有限公司 电子元器件封装结构、电子设备、服务器及数据中心系统

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102510709B (zh) * 2011-11-21 2015-03-11 华为机器有限公司 浸没式冷却的电子设备
CN102821586B (zh) * 2012-09-01 2015-12-09 温州市三立电子科技有限公司 液冷式电机控制器
TWI654920B (zh) 2017-11-23 2019-03-21 英業達股份有限公司 浸入式冷卻系統
GB201804875D0 (en) * 2018-03-27 2018-05-09 Sec Dep For Foreign And Commonwealth Affairs A power distribution assembly
US10542640B1 (en) * 2018-09-27 2020-01-21 Hewlett Packard Enterprise Development Lp Liquid chamber housings
US10761577B1 (en) * 2019-08-29 2020-09-01 Google Llc Liquid soluble gas sealed cooling system
CN111491489B (zh) * 2020-04-10 2022-11-15 深圳国人无线通信有限公司 一种印制板组件
CN113966069B (zh) * 2021-09-30 2024-07-05 华为数字能源技术有限公司 基板结构和终端设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1177903A (zh) * 1996-08-06 1998-04-01 株式会社爱德万测试 安装有电子器件的印刷电路板
JP2000101271A (ja) * 1998-09-18 2000-04-07 Mitsubishi Electric Corp 屋外用電子機器筐体
CN101443724A (zh) * 2006-05-16 2009-05-27 固核电脑公司 液体浸没式冷却系统
CN201585166U (zh) * 2010-02-09 2010-09-15 东莞勤上光电股份有限公司 用于led灯具的油冷却电源
CN102510709A (zh) * 2011-11-21 2012-06-20 聚信科技有限公司 浸没式冷却的电子设备

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101415316B (zh) * 2008-08-21 2011-04-20 华为终端有限公司 一种电子设备及其制造方法
CN201504386U (zh) * 2009-10-14 2010-06-09 纬创资通股份有限公司 电子组件屏蔽装置与电路板模块

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1177903A (zh) * 1996-08-06 1998-04-01 株式会社爱德万测试 安装有电子器件的印刷电路板
JP2000101271A (ja) * 1998-09-18 2000-04-07 Mitsubishi Electric Corp 屋外用電子機器筐体
CN101443724A (zh) * 2006-05-16 2009-05-27 固核电脑公司 液体浸没式冷却系统
CN201585166U (zh) * 2010-02-09 2010-09-15 东莞勤上光电股份有限公司 用于led灯具的油冷却电源
CN102510709A (zh) * 2011-11-21 2012-06-20 聚信科技有限公司 浸没式冷却的电子设备

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10206307B2 (en) 2016-05-03 2019-02-12 Bitfury Group Limited Immersion cooling
WO2021130504A1 (fr) * 2019-12-24 2021-07-01 Iceotope Group Limited Module de refroidissement
CN113299482A (zh) * 2020-10-19 2021-08-24 阿里巴巴集团控股有限公司 电子元器件封装结构、电子设备、服务器及数据中心系统
CN113299482B (zh) * 2020-10-19 2023-07-28 阿里巴巴集团控股有限公司 电子元器件封装结构、电子设备、服务器及数据中心系统

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