WO2013071794A1 - 具有绞合芯线的金刚石线锯及其制造方法 - Google Patents

具有绞合芯线的金刚石线锯及其制造方法 Download PDF

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Publication number
WO2013071794A1
WO2013071794A1 PCT/CN2012/081932 CN2012081932W WO2013071794A1 WO 2013071794 A1 WO2013071794 A1 WO 2013071794A1 CN 2012081932 W CN2012081932 W CN 2012081932W WO 2013071794 A1 WO2013071794 A1 WO 2013071794A1
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WIPO (PCT)
Prior art keywords
diamond
layer
stranded core
wire
core wire
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PCT/CN2012/081932
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English (en)
French (fr)
Inventor
李园
Original Assignee
Li Yuan
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Publication of WO2013071794A1 publication Critical patent/WO2013071794A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips

Definitions

  • the present invention contemplates a metal or non-metal cutting apparatus, and more particularly to a diamond wire saw having a stranded core for cutting a hard material. Background technique
  • the semiconductor device substrate is usually formed by an effective cutting process for a brittle and hard material such as silicon wafer, sapphire, gallium arsenide or silicon carbide.
  • a diamond wire saw with a diamond abrasive grain fixed on its surface can be used.
  • this diamond wire saw has less loss of the material to be cut, and the cutting efficiency is remarkably improved.
  • the cutting coolant can be composed of an aqueous solution, which is more green and environmentally friendly.
  • diamond wire saws have received much attention as a new generation of cutting tools.
  • the diamond wire saw In the cutting process, in order to make full use of the diamond abrasive layer, the diamond wire saw is generally required to be traced back and forth, that is, the abrasive layer of the diamond wire saw is actually used multiple times, and the number of uses is several hundred times or more.
  • the disadvantage of its existence is that the diamond wire saw is subjected to a certain tension during use. The greater the tension, the faster the cutting speed, and the wire saw will bend when used. As the number of processing increases, the diamond wire saw is extremely easy to be used. The bending fatigue or the stress impact at the time of cutting breaks, so the existing diamond wire saw often breaks when the surface abrasive layer is still usable, and the reliability is poor.
  • the present invention aims to solve at least one of the technical problems existing in the prior art.
  • a diamond wire saw having a stranded core wire comprising: a stranded core wire comprising at least two wires, the at least two wires being mutually Stranding a buffer layer, the buffer layer tightly coating the stranded core wire; an abrasive layer, the abrasive layer coating the buffer layer, and the abrasive layer is dispersedly embedded with diamond abrasive grains.
  • the buffer layer is a soft copper layer.
  • Copper is a common non-ferrous metal that has good ductility, is easy to process and coat on steel wires, and is inexpensive and readily available.
  • the buffer layer has a thickness of about 1 to 50 ⁇ m, that is, the thickness of the soft copper layer is about 1 to 50 ⁇ m.
  • the abrasive layer comprises a layer of nickel or nickel alloy.
  • the nickel or nickel alloy layer is formed on the buffer layer by electroplating, and the diamond abrasive grains are dispersedly embedded in the nickel or nickel alloy layer.
  • Nickel or a nickel alloy is used as a plating material in the present invention, and the diamond abrasive grains are fixedly attached to the surface of the wire saw.
  • the nickel or nickel alloy layer has a thickness of about 5-20 ⁇ m.
  • the buffer layer is Sn, Al, an aluminum alloy or a resin.
  • Al, aluminum alloy or resin has the advantages of relatively cheap price and low hardness, and is suitable as a cushioning material.
  • the buffer layer has a thickness of about 1 to 50 ⁇ m, i.e., Sn, Al, an aluminum alloy or a resin has a thickness of about 1 to 50 ⁇ m.
  • the abrasive layer comprises a thermosetting resin layer or a photo-solid resin layer.
  • the thermosetting resin layer or the photo-curable resin layer is formed on the buffer layer by thermosetting or photo-setting, and the diamond abrasive grains are dispersedly embedded in the thermosetting resin.
  • a layer or a photo-solid resin layer In a layer or a photo-solid resin layer.
  • thermosetting resin layer or the photo-curable resin layer has a thickness of about 5-20 ⁇ m.
  • the stranded core wire has an outer diameter of about 50-500 ⁇ m.
  • the outer diameter of the stranded core wire shall not be less than 50 microns or greater than 500 microns. Too fine is not easy to break, and too thick to increase the loss of cutting material.
  • the wire has a diameter of about 5-250 ⁇ m.
  • the two or more strands of wire are in a regular twisted manner Stranded together.
  • the regular twisting method can ensure that the diamond wire saw with the stranded core wire is relatively hooked at different positions, so that the hook can work stably when cutting.
  • the stranded core wire is twisted from three or seven strands of wire to form a stranded core.
  • the wire is a steel wire.
  • Another aspect of the invention provides a method of preparing a diamond wire saw having a stranded core wire, comprising: twisting two or more wires into a stranded core wire by a stranding machine; subsequently twisting the wire by a plating method The surface of the core wire forms a buffer layer; finally, an abrasive layer is plated on the outside of the buffer layer by an electroplating method.
  • a further aspect of the present invention provides a method of preparing a diamond wire saw having a stranded core wire, comprising: twisting two or more wires into a stranded core wire by a stranding machine; The surface of the cored wire forms a buffer layer; finally, an abrasive layer is formed outside the buffer layer by a thermosetting or photocuring method.
  • the core wire is made of two or more strands of wire, which has better reliability and is not easy to be broken during the cutting process, even if some of the strands of the wire constituting the core wire are partially broken, the remaining metal The wire still maintains the entire diamond wire saw for continued use.
  • the sawdust can be easily taken out of the cutting interface during the sawing process, and it is not easy to form sawdust blockage.
  • the diamond abrasive layer can be sharpened for a long time, and the diamond is increased.
  • the life and repetitive use of the wire saw due to the sawdust being brought out of the cutting interface, the probability of direct contact between the diamond particles and the material being cut at the cutting interface is greatly increased, and the cutting rate can be significantly increased.
  • the presence of a buffer layer can improve the toughness of the diamond wire saw and slow down the large impact stress caused by the high-speed impact between the diamond particles and the material being cut in the abrasive layer.
  • the core wire breakage is largely avoided, and the reliability of the diamond wire saw is greatly improved.
  • the buffer layer covers the stranded core wire, the plurality of single wires constituting the stranded core wire can be tightly bundled together, and even if some of the single wires are loosely translated or broken, the buffer layer is still Wrapped, it will not be scattered or burr, especially after the diamond wire saw is repeatedly used, the surface abrasive layer is seriously worn. At this time, if the surface of the stranded core has only the abrasive layer, the core is prone to breakage. And The broken single wire is easily scattered and forms burrs.
  • the surface quality of the cut will be seriously deteriorated, such as the formation of deeper marks, cracks, and even fragments, which will form a large number of non-thin wafers, such as ultra-thin wafers. Good product.
  • a buffer layer By coating the stranded core wire with a buffer layer, this problem can be effectively improved.
  • the presence of the buffer layer facilitates the recycling and reuse of the diamond wire saw.
  • the core of the diamond wire saw is generally steel wire, and the abrasive layer is generally nickel metal or nickel alloy and diamond co-plated.
  • the abrasive layer on the surface of the diamond wire saw wears, if there is an acid-resistant buffer layer, such as a metal copper buffer layer, the residual abrasive layer can be removed by pickling, such as hydrochloric acid cleaning to remove the nickel-based abrasive layer without corroding the metal.
  • pickling such as hydrochloric acid cleaning to remove the nickel-based abrasive layer without corroding the metal.
  • the copper buffer layer after pickling and then re-plating the abrasive layer, can obtain a new diamond wire saw.
  • the buffer layer can improve the bonding strength between the surface abrasive layer and the metal core.
  • the core wire is a steel wire and the abrasive layer is a nickel-based material
  • the bonding strength between the electroplated nickel and the steel wire tends to be poor, and the high bonding strength between the electroplated copper and the steel wire, the electroplated copper and the nickel can be used.
  • Copper as a buffer layer can effectively improve the bonding strength between the nickel-based abrasive layer and the steel wire core, thereby improving the service life of the diamond wire saw.
  • Figure la and Figure 1b are respectively a cross-sectional schematic view and a side view of a diamond wire saw having stranded core wires formed by twisting two wires;
  • the core wire of the diamond wire saw 1 having the stranded core wire is formed by twisting two wires, each of which has a diameter of about 150 ⁇ m, and a twist pitch of about 1.5 mm when twisted.
  • the buffer layer is coated, and the buffer layer is preferably a soft copper layer, that is, a metal Cu having a higher purity and a lower impurity content, and the soft copper layer material has an average thickness of about 25 ⁇ m, and the outermost layer is plated with an abrasive layer and an abrasive layer.
  • the Ni-based material is preferably embedded with diamond particles, wherein the Ni material has an average thickness of about 8 ⁇ m, the diamond abrasive grains have an average particle size of ⁇ , and the diamond abrasive grains account for 10% by mass of the abrasive layer.
  • Figure la is gold with stranded core
  • a schematic cross-sectional view of a diamond saw 1 is a schematic side view of a diamond wire saw 1 having a stranded core.
  • the diamond wire saw is composed of a stranded core wire 100, a buffer layer 110, a Ni base layer 120, and abrasive grains 130.
  • the stranded core 100 includes two wires, and the abrasive particles 130 are diamond.
  • the core wire of the diamond wire saw 2 having the stranded core wire is formed by twisting three steel wires, each of which has a diameter of about 120 ⁇ m, and a twist pitch of about 1.5 mm when twisted. .
  • the buffer layer is coated, and the buffer layer is preferably a soft copper layer, that is, a metal Cu having a higher purity and a lower impurity content, and the soft copper layer material has an average thickness of about 25 ⁇ m, and the outermost layer is plated with an abrasive layer and an abrasive layer.
  • the Ni-based material is inlaid with diamond particles, wherein the Ni-based material has an average thickness of about 8 ⁇ m, the diamond abrasive grains have an average particle size of ⁇ , and the diamond abrasive grains account for 10% by mass of the abrasive layer.
  • Fig. 2a is a schematic cross-sectional view of a diamond wire saw 2 having a stranded core wire
  • Fig. 2b is a side schematic view of a diamond wire saw 2 having a stranded core wire.
  • the diamond wire saw is composed of a stranded core wire 200, a buffer layer 210, a Ni base layer 220, and abrasive grains 230.
  • the stranded core wire 200 includes three wires, and the abrasive grains 230 are diamond.
  • the core wire of the diamond wire saw 3 having the stranded core wire is twisted from seven strands of steel wire, one of which is the center wire, and the remaining six steel wires surround the center wire. Twist.
  • Each single wire has a diameter of about 80 ⁇ m, and the outer circumference of the six steel wires has a pitch of about 1.5 mm.
  • the sun monkey is covered with a buffer layer, and the buffer layer is preferably a soft copper layer, that is, the purity is high and the impurity content is low.
  • Fig. 3a is a schematic cross-sectional view of a diamond wire saw 3 having a stranded core
  • Fig. 3b is a side view of a diamond wire saw 3 having a stranded core.
  • the diamond wire saw is composed of a core wire 300, a buffer layer 310, a Ni base layer 320, and abrasive grains 330.
  • the stranded core 300 includes seven wires, and the abrasive particles 330 are diamond.
  • the diamond wire saw 1 having the stranded core wire, the diamond wire saw 2 having the stranded core wire 2, the diamond wire saw 3 having the stranded core wire, and the ordinary diamond wire saw 0 are cut and tested.
  • the diamond wire saw is a single steel wire as a core wire, the core wire diameter is about 335 ⁇ m, no buffer layer, the surface abrasive layer is Ni-based inlaid diamond particles, the average thickness of the Ni material is about 8 ⁇ m, and the average grain size of the diamond abrasive grains is ⁇ .
  • the diamond abrasive grains accounted for 10% by mass of the abrasive layer.
  • the outer diameter of the wire saw 1, the diamond wire saw 2, the diamond wire saw 3, and the ordinary diamond wire saw 0 is about 300-350 ⁇ m, which is not much different, and the outer diameter of the ordinary diamond wire saw 0 is the thickest, about 350 ⁇ m.
  • the test conditions are as follows: The material to be cut is a polycrystalline silicon ingot, reciprocating cutting, wire tension 100N, and each wire saw counts 100 cutting data. Under the same cutting conditions, the wire saw 1 with a stranded core has a wire breakage rate of 5%, the diamond wire saw 2 has a wire breakage rate of 2%, and the diamond wire saw 3 has a wire breakage rate of 1%. Ordinary diamond wire saw 0 has a wire break rate of 17%. It can be seen that the diamond wire saw with the stranded core wire has a significantly lower wire breakage rate than the conventional single wire core wire diamond wire saw, indicating that the present invention can greatly improve the reliability of the diamond wire saw.
  • the present invention also provides a method for preparing a diamond wire saw having a stranded core wire by using an electroplating process, comprising the steps of: twisting two or more wires into a stranded core wire by a stranding machine; Subsequently, the surface of the stranded core wire is plated with a buffer layer by electroplating; finally, an abrasive layer is plated on the outside of the buffer layer by an electroplating method.
  • the twisting machine can be used to rotate two or more strands of steel wire in a certain direction, and the twisted core wire can be twisted together, and the steel wire is obviously prevented during the twisting process. Distorted stress.
  • an environmentally-friendly ammonia-free copper plating method may be used.
  • the specific method may be a one-step copper plating at a normal temperature without cyanide, or a copper plating method after two-step method.
  • the pyrophosphate salt and the citrate are pre-plated, and then copper is plated with sulfate.
  • the nickel sulfamate plating solution when the abrasive grain layer is electroplated, the nickel sulfamate plating solution is used, the current density is 2-2.5 A/dm 3 , the temperature is 55-60 ° C, and the pH is 3.5-4. A high quality composite coating with a diamond particle content of 8-12% can be obtained.
  • a Watt type plating solution that is, a plating solution containing nickel sulfate, nickel chloride or boric acid, having a pH of 4.3, and a high-quality composite plating layer having a diamond particle content of 10%.
  • the stranded core wire may be pickled prior to plating the buffer layer to remove the oxide layer on the surface of the stranded core wire.
  • the stranded core wire may be pickled prior to plating the buffer layer to remove the oxide layer on the surface of the stranded core wire.
  • the diamond wire saw can be cleaned after plating the abrasive layer, and the plating solution remaining on the surface of the abrasive layer is removed by the aqueous solution.
  • the transportation, use, and the like of the diamond wire saw are facilitated by timely removing the plating solution on the surface of the prepared diamond wire saw.
  • the diamond wire saw manufactured by the resin binder method and the diamond wire saw manufactured by the electroplating method are not different in construction form, and the difference is mainly reflected in the types of materials of the respective layers. And, precisely because of the nature of the materials in each layer, there are corresponding differences in the manufacturing methods.
  • the core of the diamond wire saw 4 having the stranded core wire is formed by twisting two wires, each of which has a diameter of about 150 ⁇ m and a twist of about 1.5 when twisted. Mm.
  • the buffer layer is coated.
  • the buffer layer is preferably metal Sn, Al, aluminum alloy or resin.
  • the buffer layer has an average thickness of about 25 ⁇ m, and the outermost layer is an abrasive layer.
  • the abrasive layer is preferably a thermosetting resin or a photo-solid resin and is embedded.
  • the diamond particles wherein the thermosetting resin or the photocurable resin has an average thickness of about 8 ⁇ m, the average particle size of the diamond abrasive grains is ⁇ , and the diamond abrasive grains account for 50% by mass of the abrasive layer.
  • Figure la is also a schematic cross-sectional view of a diamond wire saw 1 having a stranded core
  • Figure lb is also a side view of a diamond wire saw 4 having a stranded core.
  • the diamond wire saw is composed of a stranded core wire 100, a buffer layer 110, a thermosetting resin or a photo-resin layer 120, and abrasive grains 130.
  • the stranded core 100 includes two wires, and the abrasive particles 130 are diamond.
  • the core wire of the diamond wire saw 5 having the stranded core wire is formed by twisting three steel wires, each of which has a diameter of about 120 ⁇ m, and a twist pitch of about 1.5 mm when twisted. .
  • the buffer layer is coated.
  • the buffer layer is preferably metal Cu, Sn, A1 or resin.
  • the buffer layer material has an average thickness of about 25 ⁇ m, and the outermost layer is an abrasive layer.
  • the abrasive layer is preferably a thermosetting resin or a photo-curable resin and is embedded with diamond.
  • FIG. 2a also has a stranded core
  • Fig. 2b is also a schematic side view of a diamond wire saw 5 having a stranded core wire.
  • the diamond wire saw is composed of a stranded core wire 200, a buffer layer 210, a thermosetting resin or a photo-solid resin layer 220, and abrasive grains 230.
  • the stranded core wire 200 includes three wires, and the abrasive grains 230 are diamond.
  • the core wire of the diamond wire saw 6 having the stranded core wire is twisted from seven strands of steel wire, one of which is the center wire, and the remaining six steel wires surround the center wire. Twist. Each single wire has a diameter of about 80 ⁇ m. When twisted, the outer six wires have a pitch of about 1.5 mm.
  • the buffer layer is preferably metal Cu, Sn, A1 or resin. The buffer layer has an average thickness of about 25 ⁇ m.
  • the outermost layer of abrasive The layer is preferably a thermosetting resin or a photo-curable resin and is embedded with diamond particles, wherein the thermosetting resin or the photo-curable resin has an average thickness of about 8 ⁇ m, the diamond abrasive grains have an average particle size of ⁇ , and the diamond abrasive grains account for 50% by mass of the abrasive layer.
  • Fig. 3a is also a schematic cross-sectional view of a diamond wire saw 6 having a stranded core
  • Fig. 3b is also a side view of a diamond wire saw 6 having a stranded core.
  • the diamond wire saw is composed of a core wire 300, a buffer layer 310, a thermosetting resin or a photo-solid resin layer 320, and abrasive grains 330.
  • the stranded core 300 includes seven wires, and the abrasive particles 330 are diamond.
  • the diamond wire saw is a single steel wire as the core wire, the core wire diameter is 335 ⁇ , no buffer layer, the surface abrasive layer is Ni-based inlaid diamond particles, the average thickness of the Ni material is about 8 ⁇ , the average grain size of the diamond abrasive grains is ⁇ , diamond grinding The particle% of the abrasive layer is 10% by mass.
  • the diamond wire saw 4 with a twisted core wire, the diamond wire saw 5, the diamond wire saw 6, and the ordinary diamond wire saw 0 have an outer diameter of about 300-350 ⁇ m, which is not much different, and the outer diameter of the ordinary diamond wire saw 0 is the most Thick, about 350 ⁇ .
  • the test conditions are as follows: The material to be cut is a polycrystalline silicon ingot, reciprocating cutting, wire tension 100N, and each wire saw counts 100 cutting data. Under the same cutting conditions, the wire saw 4 having the stranded core wire has a wire breakage rate of 5%, the diamond wire saw 5 has a wire breakage rate of 2%, and the diamond wire saw 6 has a wire breakage rate of 1%. Ordinary diamond wire saw 0 has a wire breakage rate of 17%. It can be seen that the diamond wire saw with the twisted core wire has a significantly lower wire breakage rate than the ordinary single wire core wire diamond wire saw, indicating that the present invention can greatly improve the diamond wire saw. Reliability.
  • the present invention also provides a method for preparing a diamond wire saw having a stranded core wire by a resin binder process, comprising the steps of: twisting two or more wires by a stranding machine The cored wire; subsequently forming a buffer layer on the surface of the stranded core; finally forming an abrasive layer outside the buffer layer by a thermosetting or photocuring method.
  • the twisting machine can be used to rotate two or more strands of steel wire in a certain direction, and the twisted core wire can be twisted together, and the steel wire is obviously prevented during the twisting process. Distorted stress.
  • the forming method is selected in accordance with the specific material of the buffer layer.
  • the specific method may be rapid one-step copper plating at a normal temperature without cyanide, or copper plating after two-step method, that is, first using pyrophosphorus salt.
  • the citrate is pre-plated and then copper plated with sulfate.
  • the buffer layer is a resin
  • the thermosetting or photo-curing method is used depending on the kind of the resin, and preferably, the stranded core wire can be polished before the formation of the buffer layer of the resin material on the surface of the stranded core wire, which is advantageous for improving the buffer layer.
  • the strength of bonding with the stranded core is advantageous for improving the buffer layer.
  • metal powder may also be added to the resin to improve the abrasion resistance of the wire saw and the retention of the abrasive grains.
  • the experimental results show that the most effective additive is copper powder.
  • copper powder By adding copper powder, the thermal conductivity of the resin bond and the diamond wire saw is greatly improved, which is beneficial to improve the heat resistance, wear resistance and breaking strength of the wire saw.
  • a diamond wire saw having a stranded core wire according to an embodiment of the present invention has the following advantages:
  • the core wire is made of two or more strands of wire, which has better reliability and is not easy to be broken during the cutting process, even if some of the strands of the wire constituting the core wire are partially broken, the remaining metal The wire still maintains the entire diamond wire saw for continued use.
  • the sawdust can be easily taken out of the cutting interface during the sawing process, and it is not easy to form sawdust blockage.
  • the diamond abrasive layer can be sharpened for a long time, and the diamond is increased.
  • the life and repetitive use of the wire saw due to the sawdust being brought out of the cutting interface, the probability of direct contact between the diamond particles and the material being cut at the cutting interface is greatly increased, and the cutting rate can be significantly increased. 3.
  • the presence of a buffer layer can improve the toughness of the diamond wire saw and slow down the large impact stress caused by the high-speed impact between the diamond particles and the material being cut in the abrasive layer.
  • the core wire breakage is largely avoided, and the reliability of the diamond wire saw is greatly improved.
  • the buffer layer covers the stranded core wire, the plurality of single wires constituting the stranded core wire can be tightly bundled together, and even if some of the single wires are loosely translated or broken, the buffer layer is still Wrapped, it will not be scattered or burr, especially after the diamond wire saw is repeatedly used, the surface abrasive layer is seriously worn. At this time, if the surface of the stranded core has only the abrasive layer, the core is prone to breakage. And the broken single wire is easily scattered and forms burrs.
  • the surface quality of the cut will be seriously deteriorated, such as the formation of deeper marks, cracks, and even fragments, which will form a large number of non-thin wafers, such as ultra-thin wafers. Good product.
  • a buffer layer By coating the stranded core wire with a buffer layer, this problem can be effectively improved.
  • the presence of the buffer layer facilitates the recycling and reuse of the diamond wire saw.
  • the core of the diamond wire saw is generally steel wire, and the abrasive layer is generally nickel metal or nickel alloy and diamond co-plated.
  • the abrasive layer on the surface of the diamond wire saw wears, if there is an acid-resistant buffer layer, such as a metal copper buffer layer, the residual abrasive layer can be removed by pickling, such as hydrochloric acid cleaning to remove the nickel-based abrasive layer without corroding the metal.
  • pickling such as hydrochloric acid cleaning to remove the nickel-based abrasive layer without corroding the metal.
  • the copper buffer layer after pickling and then re-plating the abrasive layer, can obtain a new diamond wire saw.
  • the buffer layer can improve the bonding strength between the surface abrasive layer and the metal core.
  • the core wire is a steel wire and the abrasive layer is a nickel-based material
  • the bonding strength between the electroplated nickel and the steel wire tends to be poor, and the high bonding strength between the electroplated copper and the steel wire, the electroplated copper and the nickel can be used.
  • Copper as a buffer layer can effectively improve the bonding strength between the nickel-based abrasive layer and the steel wire core, thereby improving the service life of the diamond wire saw.
  • the description of the terms “one embodiment”, “some embodiments”, “example”, “specific example”, or “some examples” and the like means a specific feature described in connection with the embodiment or example.
  • a structure, material or feature is included in at least one embodiment or example of the invention.
  • the schematic representation of the above terms does not necessarily mean the same embodiment or example.
  • the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

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Abstract

一种具有绞合芯线的金刚石线锯，包括绞合芯线，绞合芯线包括至少两股金属丝，该至少两股金属丝相互绞合；紧密包覆绞合芯线的缓冲层；包覆缓冲层的磨料层，磨料层中分散镶嵌有金刚石颗粒。该具有绞合芯线的金刚石线锯具有可靠性好，切割速度快，不易断裂，使用寿命长，易于回收利用等优点。

Description

具有绞合芯线的金刚石线锯及其制造方法 技术领域
本发明设计一种金属或非金属切割装置， 尤其是涉及一种切割硬质材料用 的具有绞合芯线的金刚石线锯。 背景技术
半导体元件基底通常是对硅片、 蓝宝石、 砷化镓、 碳化硅等脆而硬的材料 通过有效切割加工形成。 一般可釆用表面固定着金刚石磨粒的金刚石线锯。 这 种金刚石线锯与传统的使用悬浊液的游离磨粒方式相比， 被切割材料的损耗较 少， 切割效率有了明显的提高。 并且切割冷却液可以由水性溶液组成， 更加绿 色环保。
因此金刚石线锯作为新一代切割工具受到人们的重视。 在切割过程中， 为 了使金刚石磨料层充分利用， 一般需要金刚石线锯来回走线， 即金刚石线锯的 磨料层实际上是多次使用的， 使用次数在数百次以上。 其存在的缺点是:金刚石 线锯在使用过程中受到一定的张力作用， 张力越大， 切割速度越快， 且使用时 线锯会发生弯曲， 随着加工次数的增加，金刚石线锯极易因弯曲疲劳或切割时 的应力冲击而断裂， 所以现有金刚石线锯经常在表面磨料层尚可使用时断线， 可靠性差。切割时断线不但影响生产效率，还会严重影响切割产品的表面质量， 比如切割硅片时常因线锯断线而整批报废。 此外， 在金刚石磨料层被磨损、 脱 落之后， 磨损后的金刚石线锯就成为了废品， 无法再利用。 发明内容
本发明旨在至少解决现有技术中存在的技术问题之一。
为此，本发明的一个目的在于提出一种具有绞合芯线的金刚石线锯， 包括： 绞合芯线，所述绞合芯线包括至少两股金属丝，所述至少两股金属丝相互绞合； 緩冲层， 所述緩冲层紧密包覆所述绞合芯线； 磨料层， 所述磨料层包覆所述緩 冲层， 且所述磨料层中分散镶嵌有金刚石磨粒。
在本发明的一个实施例中， 所述緩冲层为软质铜层。 铜是一种常见有色金 属， 其延展性良好， 容易加工包覆在钢线上， 且廉价易得。
在本发明的一个实施例中， 所述緩冲层的厚度约为 1-50μηι, 即软质铜层的 厚度约为 1-50μιη。
在本发明的一个实施例中， 所述磨料层包括镍或镍合金层。
在本发明的一个实施例中， 所述镍或镍合金层通过电镀的方式形成在所述 緩冲层上， 所述金刚石磨粒分散镶嵌在所述镍或镍合金层中。 镍或镍合金在本 发明中作为电镀材料， 将金刚石磨粒固定地附着在线锯表面。
在本发明的一个实施例中， 所述镍或镍合金层的厚度约为 5-20μηι。
在本发明的一个实施例中， 所述緩冲层为 Sn、 Al、 铝合金或树脂。 Sn、
Al、 铝合金或树脂具有价格相对便宜、 硬度小的优点， 适合做緩冲材料。
在本发明的一个实施例中， 所述緩冲层的厚度约为 1-50μιη, 即 Sn、 Al、 铝合金或树脂的厚度约为 1-50μηι。
在本发明的一个实施例中， 所述磨料层包括热固树脂层或光固树脂层。 在本发明的一个实施例中， 所述热固树脂层或光固树脂层通过热固或光固 的方式形成在所述緩冲层上， 所述金刚石磨粒分散镶嵌在所述热固树脂层或光 固树脂层中。
在本发明的一个实施例中， 所述热固树脂层或光固树脂层的厚度约为 5-20μηι。
在本发明的一个实施例中， 所述绞合芯线的外径约为 50-500μηι。 绞合芯线 的外径不得小于 50微米或大于 500微米，太细则强度不够易断裂，太粗则增大 切割材料损失量。
在本发明的一个实施例中， 所述金属丝直径约为 5-250μιη。
在本发明的一个实施例中， 所述两股或两股以上的金属丝以规则绞合方式 相互绞合。 规则绞合的方式可以保证具有绞合芯线的金刚石线锯在不同位置相 对均勾， 从而在切割时能均勾稳定地工作。 优选地， 绞合芯线由三股或七股金 属丝绞合组成绞合芯线。
在本发明的一个实施例中， 其特征在于：所述金属丝为钢丝。
本发明另一方面提出一种制备具有绞合芯线的金刚石线锯的方法， 包括： 通过绞线机将两股以上的金属丝绞合成绞合芯线； 随后通过电镀方法在所述绞 合芯线表面形成緩冲层； 最后通过电镀方法在所述緩冲层外镀上磨料层。
本发明再一方面提出一种制备具有绞合芯线的金刚石线锯的方法， 其特征 在于， 包括： 通过绞线机将两股以上的金属丝绞合成绞合芯线； 随后在所述绞 合芯线表面形成緩冲层；最后通过热固或光固方法在所述緩冲层外形成磨料层。
根据本发明实施例的具有绞合芯线的金刚石线锯， 具有下列优点：
1、 芯线由两股或两股以上的金属丝绞合而成， 具有更好的可靠性， 切割过 程中不易断裂， 即使组成芯线的多股金属丝中有部分断裂， 剩下的金属丝仍可 维持整个金刚石线锯继续使用。
2、 由于多股金属丝绞合结构可以形成容屑空间，在锯切过程中锯屑很容易 被带出切割界面，不易形成锯屑堵塞，一方面能使金刚石磨料层长期保持锋利， 增加金刚石线锯的寿命和重复使用次数， 另一方面由于锯屑被带出切割界面， 切割界面处金刚石颗粒与被切材料间直接接触的几率大大增加， 可以明显增加 切割的速率。
3、緩冲层的存在，尤其是软质緩冲层的存在，可以改善金刚石线锯的韧性， 减緩因磨料层中金刚石颗粒与被切材料间的高速冲击产生的巨大冲击应力， 在 很大程度上避免了芯线断裂， 大大改善了金刚石线锯的可靠性。
4、 由于緩冲层包覆绞合芯线，使得组成绞合芯线的多根单金属丝能够紧密 地束在一起， 即使中有部分单金属丝松译或者断裂， 也仍被緩冲层包覆在内， 不会散乱或者形成毛刺， 尤其是在金刚石线锯多次重复使用之后， 表层磨料层 磨损严重， 此时如果绞合芯线表面仅有磨料层， 芯线就很容易发生断裂， 而且 断裂的单金属丝易散乱并形成毛刺。 如果绞合芯线散乱或形成毛刺， 则会严重 恶化被切割的表面质量， 比如形成较深的刀痕、 裂纹、 甚至碎片， 这在切割超 薄片比如超薄硅片时会形成大量的不良品。 通过緩冲层包覆绞合芯线， 能够有 效地改善这一问题。
5、緩冲层的存在有利于金刚石线锯的回收再利用。金刚石线锯的芯线一般 为钢丝， 磨料层一般为镍金属或镍合金与金刚石共镀。 当金刚石线锯表面磨料 层磨损之后， 如果有耐酸的緩冲层存在， 比如金属铜緩冲层， 则可以通过酸洗 去除残余磨料层， 比如盐酸清洗去除镍基磨料层， 却不会腐蚀金属铜緩冲层， 酸洗后再重新电镀磨料层， 就可以获得全新的金刚石线锯。 如果没有緩冲层， 酸洗去除表面镍基磨料层时则会同时腐蚀里面的钢丝， 如果不酸洗直接重新电 镀磨料层， 由于残余磨料层厚度是不均匀的， 重新电镀后得到的金刚石线锯直 径也是不均匀的。
6、緩冲层可以改善表面磨料层与金属芯线的结合强度。 当芯线为钢丝、磨 料层为镍基材料时， 电镀镍与钢丝之间的结合强度往往较差， 而电镀铜与钢丝、 电镀铜与镍之间可以获得很高的结合强度， 因此釆用铜作为緩冲层， 可以有效 改善镍基磨料层与钢丝芯线之间的结合强度,从而改善金刚石线锯的使用寿命。
本发明的附加方面和优点将在下面的描述中部分给出， 部分将从下面的描 述中变得明显， 或通过本发明的实践了解到。 附围说明
本发明的上述和 /或附加的方面和优点从结合下面附图对实施例的描述中 将变得明显和容易理解， 其中：
图 la与图 lb分别是两股金属丝绞合形成的具有绞合芯线的金刚石线锯的 横截面示意图与侧面示意图；
图 2a与图 2b分别是三股金属丝绞合形成的具有绞合芯线的金刚石线锯的 横截面示意图与侧面示意图； 图 3a与图 3b分别是七股金属丝绞合形成的具有绞合芯线的金刚石线锯的 横截面示意图与侧面示意图。 具体实 14方式
下面详细描述本发明的实施例， 所述实施例的示例在附图中示出， 其中自 始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元 件。 下面通过参考附图描述的实施例是示例性的， 仅用于解释本发明， 而不能 理解为对本发明的限制。
在本发明的描述中， 术语"纵向"、 "横向"、 "上"、 "下"、 "前"、 "后"、 "左"、 "右"、 "竖直"、 "水平"、 "顶"、 "底"等指示的方位或位置关系为基于附图所示的 方位或位置关系， 仅是为了便于描述本发明而不是要求本发明必须以特定的方 位构造和操作， 因此不能理解为对本发明的限制。
参照下面的描述和附图， 将清楚本发明的实施例的这些和其他方面。 在这 些描述和附图中， 具体公开了本发明的实施例中的一些特定实施方式， 来表示 实施本发明的实施例的原理的一些方式， 但是应当理解， 本发明的实施例的范 围不受此限制。 相反， 本发明的实施例包括落入所附加权利要求书的精神和内 涵范围内的所有变化、 修改和等同物。 树脂粘合剂法制造的金刚石线锯两类， 下面作分别介绍。
( 1 ) 电镀法制造的金刚石线锯
在本发明的一个实施例中， 具有绞合芯线的金刚石线锯 1的芯线由两股金 属丝互相绞合而成， 每根单线直径约为 150μιη, 绞合时捻距约为 1.5mm。 随后 包覆緩冲层， 緩冲层优选软质铜层， 即纯度较高、 杂质含量较低的金属 Cu, 软 质铜层材料平均厚度约为 25μιη, 最外层电镀上磨料层， 磨料层优选 Ni基材料 并镶嵌金刚石颗粒， 其中 Ni材料平均厚度约为 8μιη, 金刚石磨粒的平均粒度 为 ΙΟμιη, 金刚石磨粒占磨料层质量百分比为 10%。 图 la是具有绞合芯线的金 刚石线锯 1的横截面示意图，图 lb是具有绞合芯线的金刚石线锯 1的侧面示意 图。 金刚石线锯由绞合芯线 100、 緩冲层 110、 Ni基层 120和磨粒 130组成。 其中绞合芯线 100包括两根金属丝， 磨粒 130为金刚石。
在本发明的另一个实施例中， 具有绞合芯线的金刚石线锯 2的芯线由三股 钢线互相绞合而成， 每根单线直径约为 120μιη, 绞合时捻距约为 1.5mm。 随后 包覆緩冲层， 緩冲层优选软质铜层， 即纯度较高、 杂质含量较低的金属 Cu, 软 质铜层材料平均厚度约为 25μιη, 最外层电镀上磨料层， 磨料层优选 Ni基材料 并镶嵌金刚石颗粒， 其中 Ni基材料平均厚度约为 8μιη, 金刚石磨粒平均粒度 为 ΙΟμιη, 金刚石磨粒占磨料层质量百分比为 10%。 图 2a是具有绞合芯线的金 刚石线锯 2的横截面示意图，图 2b是具有绞合芯线的金刚石线锯 2的侧面示意 图。 金刚石线锯由绞合芯线 200、 緩冲层 210、 Ni基层 220和磨粒 230组成。 其中绞合芯线 200包括三根金属丝， 磨粒 230为金刚石。
在本发明的另一个实施例中， 具有绞合芯线的金刚石线锯 3的芯线由七股 钢线绞合而成， 其中一根钢线作为中心线， 其余六根钢线围绕该中心线拧转。 每根单线直径约为 80μιη, 绞合时外围六根钢线的捻距约为 1.5mm, 孙猴包覆 緩冲层， 緩冲层优选软质铜层， 即纯度较高、 杂质含量较低的金属 Cu, 软质铜 层材料平均厚度约为 25μιη, 最外层磨料层的 Ni材料平均厚度约为 8μιη, 金刚 石磨粒平均粒度为 ΙΟμιη, 金刚石磨粒占磨料层质量百分比为 10% 。 图 3a是 具有绞合芯线的金刚石线锯 3的横截面示意图，图 3b是具有绞合芯线的金刚石 线锯 3的侧面示意图。 金刚石线锯由芯线 300、 緩冲层 310、 Ni基层 320和磨 粒 330组成。 其中绞合芯线 300包括七根金属丝， 磨粒 330为金刚石。
对上述实施例提到的具有绞合芯线的金刚石线锯 1、 具有绞合芯线的金刚 石线锯 2、 具有绞合芯线的金刚石线锯 3和普通金刚石线锯 0进行切割测试， 普通金刚石线锯为单根钢线为芯线， 芯线直径约为 335μιη, 无緩冲层， 表面磨 料层为 Ni基镶嵌金刚石颗粒， Ni材料平均厚度约为 8μιη, 金刚石磨粒平均粒 度为 ΙΟμιη, 金刚石磨粒占磨料层质量百分比为 10% 。 具有绞合芯线的金刚石 线锯 1、 金刚石线锯 2、 金刚石线锯 3、 和普通金刚石线锯 0 的外径约为 300-350μιη, 相差不大， 其中普通金刚石线锯 0的外径最粗， 约为 350μιη。 测 试条件为： 被切割材料为多晶硅方锭， 往复式切割， 线张力 100N, 每种线锯均 统计 100次切割的数据。 在相同的切割条件下， 具有绞合芯线的金刚石线锯 1 的断线率为 5% ，金刚石线锯 2的断线率为 2%,金刚石线锯 3的断线率为 1% , 而普通金刚石线锯 0的断线率为 17% 。 可以看出， 具有绞合芯线的金刚石线 锯与普通单线芯线金刚石线锯相比， 断线率有明显降低， 表明本发明可以大幅 度改善金刚石线锯的可靠性。
相对应地， 本发明还提出了一种利用电镀工艺的制备具有绞合芯线的金刚 石线锯的方法， 包括以下步骤： 通过绞线机将两股以上的金属丝绞合成绞合芯 线； 随后通过电镀方法在绞合芯线表面镀上緩冲层； 最后通过电镀方法在緩冲 层外镀上磨料层。
在本发明的上述实施例中， 可使用捻丝机， 让两股或两股以上钢丝按一定 方向旋转卷绕， 便可捻合出绞合芯线， 捻绞过程中注意谨防钢丝产生明显的扭 曲应力。
在本发明的上述实施例中， 电镀緩冲层时， 可釆用环保的无氨镀铜方法， 具体方法可是无氰常温快速一步镀铜， 也可以是经过两步法镀铜， 即先用焦磷 盐、 柠檬酸盐进行预镀， 然后用硫酸盐进行镀铜。
在本发明的上述实施例中， 电镀磨粒层时， 釆用氨基磺酸镍镀液， 电流密 度为 2-2.5A/dm3,温度为 55-60°C , pH值为 3.5-4, 可以获得金刚石微粒含量为 8-12%的优质复合镀层。 此外， 还可以釆用瓦特型电镀液， 即釆用含硫酸镍、 氯化镍、 硼酸的电镀液， pH值为 4.3 , 同样可获得金刚石微粒含量为 10%的优 质复合镀层。
另外，根据本发明的上述实施例，在电镀緩冲层之前可以对绞合芯线酸洗， 以便清除绞合芯线表面的氧化层。 由此， 有利于提高緩冲层与绞合芯线之间的 结合强度。 酸洗之前还可以对绞合芯线表面去脂， 通过含有碱性水溶液或有机溶剂去 脂， 以便清除绞合芯线表面的油脂。 由此， 可以进一步提高緩冲层与绞合芯线 之间的结合强度。
此外， 在电镀磨料层之后还可以对金刚石线锯进行清洗， 通过水溶液清除 磨料层表面所残余的电镀液。 由此， 通过及时除去所制备的金刚石线锯表面的 电镀液， 有利于金刚石线锯的运输、 使用等。
( 2 )树脂粘合剂法制造的金刚石线锯
树脂粘合剂法制造的金刚石线锯与电镀法制造的金刚石线锯在构造形式上 并无不同， 差别主要体现在各层材料的种类上。 以及， 正是由于各层材料本身 性质的差别， 在制造方法上也有对应的差别。
在本发明的另一个实施例中， 具有绞合芯线的金刚石线锯 4的芯线由两股 金属丝互相绞合而成， 每根单线直径约为 150μιη, 绞合时捻距约为 1.5mm。 随 后包覆緩冲层， 緩冲层优选金属 Sn、 Al、 铝合金或者树脂， 緩冲层的平均厚度 约为 25μιη, 最外层为磨料层， 磨料层优选热固树脂或者光固树脂并镶嵌金刚 石颗粒， 其中热固树脂或者光固树脂平均厚度约为 8μιη, 金刚石磨粒的平均粒 度为 ΙΟμιη, 金刚石磨粒占磨料层质量百分比为 50% 。 图 la同样是具有绞合 芯线的金刚石线锯 1的横截面示意图，图 lb同样是具有绞合芯线的金刚石线锯 4的侧面示意图。 金刚石线锯由绞合芯线 100、 緩冲层 110、 热固树脂或者光固 树脂层 120和磨粒 130组成。 其中绞合芯线 100包括两根金属丝， 磨粒 130为 金刚石。
在本发明的另一个实施例中， 具有绞合芯线的金刚石线锯 5的芯线由三股 钢线互相绞合而成， 每根单线直径约为 120μιη, 绞合时捻距约为 1.5mm。 随后 包覆緩冲层， 緩冲层优选金属 Cu、 Sn、 A1或者树脂， 緩冲层材料平均厚度约 为 25μιη, 最外层为磨料层， 磨料层优选热固树脂或者光固树脂并镶嵌金刚石 颗粒， 其中热固树脂或者光固树脂平均厚度约为 8μιη, 金刚石磨粒的平均粒度 为 ΙΟμιη, 金刚石磨粒占磨料层质量百分比为 50% 。 图 2a同样是具有绞合芯 线的金刚石线锯 5的横截面示意图， 图 2b同样是具有绞合芯线的金刚石线锯 5 的侧面示意图。金刚石线锯由绞合芯线 200、緩冲层 210、 热固树脂或者光固树 脂层 220和磨粒 230组成。 其中绞合芯线 200包括三根金属丝， 磨粒 230为金 刚石。
在本发明的另一个实施例中， 具有绞合芯线的金刚石线锯 6的芯线由七股 钢线绞合而成， 其中一根钢线作为中心线， 其余六根钢线围绕该中心线拧转。 每根单线直径约为 80μιη, 绞合时外围六根钢线的捻距约为 1.5mm, 緩冲层优 选金属 Cu、 Sn、 A1或者树脂， 緩冲层的平均厚度约为 25μιη, 最外层磨料层优 选热固树脂或者光固树脂并镶嵌金刚石颗粒， 其中热固树脂或者光固树脂平均 厚度约为 8μιη, 金刚石磨粒平均粒度为 ΙΟμιη, 金刚石磨粒占磨料层质量百分 比为 50% 。 图 3a同样是具有绞合芯线的金刚石线锯 6的横截面示意图， 图 3b 同样是具有绞合芯线的金刚石线锯 6的侧面示意图。 金刚石线锯由芯线 300、 緩冲层 310、热固树脂或者光固树脂层 320和磨粒 330组成。其中绞合芯线 300 包括七根金属丝， 磨粒 330为金刚石。
对上述实施例提到的具有绞合芯线的金刚石线锯 4、 具有绞合芯线的金刚 石线锯 5、 具有绞合芯线的金刚石线锯 6和普通金刚石线锯 0进行切割测试， 普通金刚石线锯为单根钢线为芯线， 芯线直径 335μιη, 无緩冲层， 表面磨料层 为 Ni基镶嵌金刚石颗粒， Ni材料平均厚度约为 8μιη, 金刚石磨粒平均粒度为 ΙΟμιη,金刚石磨粒占磨料层质量百分比为 10%。具有绞合芯线的金刚石线锯 4、 金刚石线锯 5、金刚石线锯 6、 和普通金刚石线锯 0的外径约为 300-350μηι, 相 差不大， 其中普通金刚石线锯 0的外径最粗， 约为 350μιη。 测试条件为： 被切 割材料为多晶硅方锭， 往复式切割， 线张力 100N, 每种线锯均统计 100次切割 的数据。 在相同的切割条件下， 具有绞合芯线的金刚石线锯 4的断线率为 5%, 金刚石线锯 5的断线率为 2%, 金刚石线锯 6的断线率为 1%, 而普通金刚石线 锯 0的断线率为 17%。 可以看出， 具有绞合芯线的金刚石线锯与普通单线芯线 金刚石线锯相比， 断线率有明显降低， 表明本发明可以大幅度改善金刚石线锯 的可靠性。
相对应地， 本发明的还提出了一种利用树脂粘合剂工艺的制备具有绞合芯 线的金刚石线锯的方法， 包括以下步骤： 通过绞线机将两股以上的金属丝绞合 成绞合芯线； 随后在绞合芯线表面形成緩冲层； 最后通过热固或光固方法在緩 冲层外形成磨料层。
在本发明的上述实施例中， 可使用捻丝机， 让两股或两股以上钢丝按一定 方向旋转卷绕， 便可捻合出绞合芯线， 捻绞过程中注意谨防钢丝产生明显的扭 曲应力。
在本发明的上述实施例中， 形成緩冲层时， 根据緩冲层的具体材料选择形 成方法。 例如， 当緩冲层为软铜时， 可釆用环保的无氨镀铜方法， 具体方法可 是无氰常温快速一步镀铜， 也可以是经过两步法镀铜， 即先用焦磷盐、 柠檬酸 盐进行预镀， 然后用硫酸盐进行镀铜。 当緩冲层是树脂时， 根据树脂种类釆用 热固或光固方法， 优选地， 在绞合芯线表面形成树脂材料緩冲层之前可以对绞 合芯线打磨， 有利于提高緩冲层与绞合芯线之间的结合强度。
优选地， 还可以在树脂中添加金属粉末以提高线锯的耐磨性和磨粒保持强 度。 实验结果表明最有效的添加剂是铜粉。 通过添加铜粉， 树脂结合剂和金刚 石线锯的导热性能有很大改善，有利于提高线锯的耐热性、耐磨性和断裂强度。 综上所述， 根据本发明实施例的具有绞合芯线的金刚石线锯具有下列优点：
1、 芯线由两股或两股以上的金属丝绞合而成， 具有更好的可靠性， 切割过 程中不易断裂， 即使组成芯线的多股金属丝中有部分断裂， 剩下的金属丝仍可 维持整个金刚石线锯继续使用。
2、 由于多股金属丝绞合结构可以形成容屑空间，在锯切过程中锯屑很容易 被带出切割界面，不易形成锯屑堵塞，一方面能使金刚石磨料层长期保持锋利， 增加金刚石线锯的寿命和重复使用次数， 另一方面由于锯屑被带出切割界面， 切割界面处金刚石颗粒与被切材料间直接接触的几率大大增加， 可以明显增加 切割的速率。 3、緩冲层的存在，尤其是软质緩冲层的存在，可以改善金刚石线锯的韧性， 减緩因磨料层中金刚石颗粒与被切材料间的高速冲击产生的巨大冲击应力， 在 很大程度上避免了芯线断裂， 大大改善了金刚石线锯的可靠性。
4、 由于緩冲层包覆绞合芯线，使得组成绞合芯线的多根单金属丝能够紧密 地束在一起， 即使中有部分单金属丝松译或者断裂， 也仍被緩冲层包覆在内， 不会散乱或者形成毛刺， 尤其是在金刚石线锯多次重复使用之后， 表层磨料层 磨损严重， 此时如果绞合芯线表面仅有磨料层， 芯线就很容易发生断裂， 而且 断裂的单金属丝易散乱并形成毛刺。 如果绞合芯线散乱或形成毛刺， 则会严重 恶化被切割的表面质量， 比如形成较深的刀痕、 裂纹、 甚至碎片， 这在切割超 薄片比如超薄硅片时会形成大量的不良品。 通过緩冲层包覆绞合芯线， 能够有 效地改善这一问题。
5、緩冲层的存在有利于金刚石线锯的回收再利用。金刚石线锯的芯线一般 为钢丝， 磨料层一般为镍金属或镍合金与金刚石共镀。 当金刚石线锯表面磨料 层磨损之后， 如果有耐酸的緩冲层存在， 比如金属铜緩冲层， 则可以通过酸洗 去除残余磨料层， 比如盐酸清洗去除镍基磨料层， 却不会腐蚀金属铜緩冲层， 酸洗后再重新电镀磨料层， 就可以获得全新的金刚石线锯。 如果没有緩冲层， 酸洗去除表面镍基磨料层时则会同时腐蚀里面的钢丝， 如果不酸洗直接重新电 镀磨料层， 由于残余磨料层厚度是不均匀的， 重新电镀后得到的金刚石线锯直 径也是不均匀的。
6、 緩冲层可以改善表面磨料层与金属芯线的结合强度。 当芯线为钢丝、 磨 料层为镍基材料时， 电镀镍与钢丝之间的结合强度往往较差， 而电镀铜与钢丝、 电镀铜与镍之间可以获得很高的结合强度， 因此釆用铜作为緩冲层， 可以有效 改善镍基磨料层与钢丝芯线之间的结合强度,从而改善金刚石线锯的使用寿命。
需要说明的是， 制备具有绞合芯线的金刚石线锯的方法之中， 并不对具体 绞合工艺、 电镀工艺做出限定。 因此本领域技术人员可基于此思想对上述制备 方法进行等同的修改或变化以达到制备具有绞合芯线的金刚石线锯的目的， 这 些均应包含在本发明的保护之内。
在本说明书的描述中， 参考术语"一个实施例"、 "一些实施例"、 "示例"、 "具体示例"、或"一些示例"等的描述意指结合该实施例或示例描述的具体特征、 结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中， 对上述术语的示意性表述不一定指的是相同的实施例或示例。 而且， 描述的具 体特征、 结构、 材料或者特点可以在任何的一个或多个实施例或示例中以合适 的方式结合。
尽管已经示出和描述了本发明的实施例，本领域的普通技术人员可以理解： 在不脱离本发明的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、 替换和变型， 本发明的范围由权利要求及其等同物限定。

Claims

权利要求书
1、 一种具有绞合芯线的金刚石线锯， 其特征在于， 包括：
绞合芯线， 所述绞合芯线包括至少两股金属丝， 所述至少两股金属丝相互 绞合；
緩冲层， 所述緩冲层紧密包覆所述绞合芯线；
磨料层， 所述磨料层包覆所述緩冲层， 且所述磨料层中分散镶嵌有金刚石 磨粒。
2、如权利要求 1所述的具有绞合芯线的金刚石线锯， 其特征在于， 所述緩 冲层为软质铜层。
3、如权利要求 2所述的具有绞合芯线的金刚石线锯， 其特征在于， 所述緩 冲层的厚度约为 1-50μηι。
4、如权利要求 1所述的具有绞合芯线的金刚石线锯， 其特征在于， 所述磨 料层包括镍或镍合金层。
5、如权利要求 4所述的具有绞合芯线的金刚石线锯， 其特征在于， 所述镍 或镍合金层通过电镀的方式形成在所述緩冲层上， 所述金刚石磨粒分散镶嵌在 所述镍或镍合金层中。
6、如权利要求 4所述的具有绞合芯线的金刚石线锯， 其特征在于， 所述镍 或镍合金层的厚度约为 5-20μηι。
7、如权利要求 1所述的具有绞合芯线的金刚石线锯， 其特征在于， 所述緩 冲层为 Sn、 Al、 铝合金或树脂。
8、如权利要求 7所述的具有绞合芯线的金刚石线锯， 其特征在于， 所述緩 冲层的厚度约为 1-50μηι。
9、如权利要求 1所述的具有绞合芯线的金刚石线锯， 其特征在于， 所述磨 料层包括热固树脂层或光固树脂层。
10、 如权利要求 9所述的具有绞合芯线的金刚石线锯， 其特征在于， 所述 热固树脂层或光固树脂层通过热固或光固的方式形成在所述緩冲层上， 所述金 刚石磨粒分散镶嵌在所述热固树脂层或光固树脂层中。
11、 如权利要求 9所述的具有绞合芯线的金刚石线锯， 其特征在于， 所述 热固树脂层或光固树脂层的厚度约为 5-20μηι。
12、 如权利要求 1所述的具有绞合芯线的金刚石线锯， 其特征在于， 所述 绞合芯线的外径约为 50-500μηι。
13、 如权利要求 1-12中任意一项所述的具有绞合芯线的金刚石线锯， 其特 征在于： 所述金属丝直径约为 5-250μηι。
14、 如权利要求 1-13中任意一项所述的具有绞合芯线的金刚石线锯， 其特 征在于：所述至少两股金属丝以规则绞合方式相互绞合。
15、 如权利要求 1-14中任意一项所述的具有绞合芯线的金刚石线锯， 其特 征在于：所述金属丝为钢丝。
16、 一种制备具有绞合芯线的金刚石线锯的方法， 其特征在于， 包括： 通 过绞线机将两股以上的金属丝绞合成绞合芯线； 随后通过电镀方法在所述绞合 芯线表面形成緩冲层； 最后通过电镀方法在所述緩冲层外镀上磨料层。
17、 一种制备具有绞合芯线的金刚石线锯的方法， 其特征在于， 包括： 通 过绞线机将两股以上的金属丝绞合成绞合芯线； 随后在所述绞合芯线表面形成 緩冲层； 最后通过热固或光固方法在所述緩冲层外形成磨料层。
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