WO2013047345A1 - Film conducteur transparent et procédé de production de celui-ci - Google Patents

Film conducteur transparent et procédé de production de celui-ci Download PDF

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Publication number
WO2013047345A1
WO2013047345A1 PCT/JP2012/074162 JP2012074162W WO2013047345A1 WO 2013047345 A1 WO2013047345 A1 WO 2013047345A1 JP 2012074162 W JP2012074162 W JP 2012074162W WO 2013047345 A1 WO2013047345 A1 WO 2013047345A1
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Prior art keywords
transparent conductive
conductive film
tin oxide
film
content
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PCT/JP2012/074162
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English (en)
Japanese (ja)
Inventor
央 多々見
村上　英生
大谷　寿幸
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東洋紡株式会社
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Publication of WO2013047345A1 publication Critical patent/WO2013047345A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth

Definitions

  • the present invention relates to a transparent conductive film obtained by laminating a transparent conductive film mainly composed of indium oxide on a transparent plastic film substrate and a method for producing the same, and particularly when used in a touch panel for car navigation, resistance under high temperature and high humidity conditions.
  • the present invention relates to a transparent conductive film excellent in value stability and excellent in pen input durability and an efficient manufacturing method thereof.
  • a transparent conductive film in which a transparent thin film with low resistance is laminated on a transparent plastic substrate is used for applications utilizing the conductivity, for example, a flat panel display such as a liquid crystal display or an electroluminescence (EL) display, As a transparent electrode for touch panels, it is widely used in applications in the electric and electronic fields.
  • a flat panel display such as a liquid crystal display or an electroluminescence (EL) display
  • EL electroluminescence
  • the resistance value fluctuation of the transparent conductive film under the high temperature and high humidity condition of 85 ° C. and 85% RH is the resistance value before the high temperature and high humidity stability test, and the reliability obtained by dividing the resistance value after the high temperature and high humidity stability test. It can be expressed as a coefficient value.
  • the reliability coefficient is preferably in the range of 0.8 to 1.2.
  • the pen input durability test is a test for examining the external appearance and electrical characteristics of the sliding portion after performing a linear sliding of 350,000 times with a load of 5.0 N. If the appearance and electrical characteristics of the sliding part do not change compared to before the pen input durability test, the test result is good.
  • a transparent conductive film that results in a satisfactory pen input durability test a transparent conductive film made crystalline is known.
  • a method for making the transparent conductive film crystalline and making the reliability coefficient close to 1 has been studied (see Patent Documents 1 and 2).
  • Patent Documents 1 and 2 since the transparent conductive film is crystalline, pen input durability is considered to be relatively good.
  • the resistance value stability of the transparent conductive film under high temperature and high humidity conditions is considered. Is considered as follows.
  • Patent Document 1 describes a transparent conductive film in which a heat shrinkage rate is reduced by heating a plastic film substrate before forming a transparent conductive thin film.
  • a heat shrinkage rate is reduced by heating a plastic film substrate before forming a transparent conductive thin film.
  • it is necessary to prepare a heating process which is not preferable because the number of processes increases.
  • 85 degreeC85% R. H. The resistance value after 500 hours was about twice the resistance value in the untreated state (the reliability coefficient was about 2), and the resistance value stability was insufficient even under high temperature and high humidity conditions.
  • Patent Document 2 describes a transparent conductive film containing nitrogen in a transparent conductive film.
  • a transparent conductive thin film is formed by a vacuum film formation method such as a sputtering method, nitrogen is released from the plastic film. Therefore, as described in Patent Document 2, (nitrogen) / (argon + nitrogen) It is very difficult to control the value to be constantly 3000 to 13000 ppm.
  • the object of the present invention is a transparent conductive film excellent in resistance value stability under high-temperature and high-humidity conditions when used in a touch panel, and pen input durability, and its efficient production. It is to provide a method.
  • the transparent conductive film which could solve said subject, and its manufacturing method consist of the following structures.
  • the content of tin oxide is continuously and / or gradually reduced from the surface layer side to the surface layer side, and the content of tin oxide contained in the transparent conductive film on the surface layer side is 0.5 to 8
  • the content of tin oxide contained in the transparent conductive film on the transparent plastic substrate side is 20 to 60% by mass more than the content on the surface layer side, and the total thickness of the transparent conductive film is 16 to 50 nm.
  • a transparent conductive film having a tin oxide content of 0.5 to 8% by mass has a thickness of 15 nm or more.
  • a method for producing a transparent conductive film in which a transparent conductive film of tin oxide-added indium oxide is laminated on at least one surface of a transparent plastic film substrate, wherein a sputtering target as a raw material of the transparent conductive film is made of indium oxide In addition, a film containing 0.5 to 68% by mass of tin oxide, using two or more of the sputtering targets, forming a film on a transparent plastic substrate in order from a sputtering target having a high tin oxide content, and finally forming a film.
  • the content of tin oxide contained in the sputtering target used is 0.5 to 8% by mass, and the content of tin oxide used for film formation first is 20 to 10 from the sputtering target used for film formation last. 60% by mass more, the substrate temperature during film formation of the transparent conductive film is ⁇ 60 to 50 ° C., and a reactive gas for film formation With oxygen, the oxygen partial pressure of 1.0 ⁇ 10 -3 ⁇ 50 ⁇ 10 -3 Pa, the sputtering ratio of the water partial pressure is in the 8.0 ⁇ 10 -4 ⁇ 3 ⁇ 10 -3 for the inert gas And forming a transparent conductive film.
  • a transparent conductive film excellent in resistance value stability and pen input durability and a production method capable of efficiently producing the transparent conductive film are provided.
  • the obtained transparent conductive film is extremely useful for applications such as a car navigation touch panel and other touch panels.
  • the transparent conductive film of the present invention is a transparent conductive film in which a transparent conductive film is laminated on at least one surface of a transparent plastic film substrate, and the transparent plastic film base is in the film thickness direction of the transparent conductive film.
  • the tin oxide content is continuously and / or gradually reduced from the material side to the surface layer side, and the tin oxide content contained in the transparent conductive film on the surface layer side is 0.5.
  • the content of tin oxide contained in the transparent conductive film on the transparent plastic substrate side is 20 to 60% by mass more than the content on the surface layer side, and the total thickness of the transparent conductive film is 16% by mass.
  • the transparent conductive film is preferably a transparent conductive film having a thickness of 15 nm or more and a transparent conductive film having a tin oxide content of 0.5 to 8% by mass of ⁇ 50 nm.
  • the transparent conductive film has the following configuration. That is, a transparent conductive film in which a transparent conductive film of tin oxide-added indium oxide is laminated on at least one surface of a transparent plastic film substrate, and a transparent conductive film having a high tin oxide concentration is provided on the transparent plastic substrate side. Next, a transparent conductive film having a low tin oxide concentration is laminated continuously and / or stepwise toward the surface layer side. The reason for changing the tin oxide concentration in the film thickness direction of the transparent conductive film will be described later.
  • the relationship between the physical properties of the tin oxide-added indium oxide transparent conductive film and the tin oxide concentration when the total thickness of the transparent conductive film is 16 to 50 nm will be described.
  • the tin oxide concentration of the tin oxide-added indium oxide is low, the tin oxide-added indium oxide is likely to be crystalline and excellent in physical durability, and therefore excellent in pen input durability.
  • the definition of the crystalline transparent conductive film is shown.
  • the transparent conductive film layer is observed under a transmission electron microscope, the one having a polygonal region is a crystal, and the others are amorphous.
  • a transparent conductive film having a ratio of the amorphous part to the crystalline part of 0.00 to 0.16 is referred to as crystalline.
  • the method of estimating the ratio of the amorphous part to the crystalline part can be calculated from the area ratio of the crystalline part and the amorphous part when observed under a transmission electron microscope.
  • Increasing the content of tin oxide tends to be amorphous because tin oxide is an impurity with respect to indium oxide.
  • tin oxide is excellent in chemical stability, the chemical stability of tin oxide-added indium oxide improves as the tin oxide content increases.
  • the change in resistance value of tin oxide-added indium oxide was 85 ° C. and 85% R.D. H.
  • Pen durability and 85 ° C 85% R.P. H In order to achieve both resistance value stability under high temperature and high humidity conditions, tin oxide-added indium oxide having a high pen input durability and a low tin oxide content, 85 ° C. and 85% R.D. H. A method of simply combining tin oxide-added indium oxide with a high tin oxide content and excellent resistance value stability under high temperature and high humidity conditions is conceivable. It may occur and is not very preferable.
  • tin oxide-added indium oxide with low tin oxide content and tin oxide-added indium oxide with high tin oxide content tin oxide with high tin oxide content on the transparent plastic substrate side Since the added indium oxide is amorphous, the transparent conductive film may be scraped or peeled off from the transparent plastic substrate.
  • a combination of tin oxide-added indium oxide having a low tin oxide content and tin oxide-added indium oxide having a high tin oxide content is combined with 85 ° C. and 85% H.
  • a tin oxide-added indium oxide portion having a high tin oxide content is excellent, but a tin oxide-added indium oxide portion having a low tin oxide content may be deteriorated.
  • resistance value stability tends to be low, which is not preferable.
  • the ⁇ 60 It is not preferable to form a film with a total thickness of 16 to 50 nm of the transparent conductive film at a substrate temperature of from 50 ° C. to 50 ° C. because there is a problem that crystallization becomes difficult.
  • a transparent conductive film in which a transparent conductive film of tin oxide-added indium oxide is laminated on at least one surface of a transparent plastic film substrate, The tin oxide content is continuously and / or gradually reduced from the transparent plastic film substrate side to the surface layer side in the thickness direction, and is included in the transparent conductive film on the surface layer side.
  • the tin oxide content is 0.5 to 8% by mass, and the tin oxide content contained in the transparent conductive film on the transparent plastic substrate side is 20 to 60% by mass higher than the surface layer side content,
  • the transparent conductive film has a total thickness of 16 to 50 nm and a transparent conductive film having a tin oxide content of 0.5 to 8% by mass and a thickness of 15 nm or more. thing Preferred. With this configuration, with regard to pen input durability, the transparent conductive film on the surface layer side with a small content of tin oxide is crystallized, and further, the content of tin oxide is continuously and / or gradually reduced to be transparent.
  • the configuration in which the tin oxide content is continuously and / or stepwise reduced from the transparent plastic film substrate side to the surface layer side facilitates the carrier compensation.
  • the first point is that the transparent conductive film on the surface layer side that has already been crystallized continuously contains tin oxide from the transparent plastic film substrate side to the surface layer side in the film thickness direction of the transparent conductive film. And / or 85 ° C. 85% R.D. H. It is a seed layer that promotes crystal growth under high temperature and high humidity.
  • the second point is that the content of tin oxide is reduced continuously and / or stepwise from the transparent plastic film substrate side to the surface layer side with respect to the film thickness direction of the transparent conductive film. 85 ° C. and 85% R.D.
  • the content of tin oxide contained in the transparent conductive film on the surface layer side is 0.5 to 8% by mass. If the content of tin oxide contained in the transparent conductive film on the surface layer side is less than 0.5% by mass, the tin oxide concentration contained in the transparent conductive film on the surface layer side is too low. H. It is not desirable because the resistance value stability under high temperature and high humidity conditions is poor. If the content of tin oxide contained in the transparent conductive film on the surface layer side is more than 8% by mass, the concentration of tin oxide contained in the transparent conductive film on the surface layer side is too high, so that crystallization is inhibited and pen input durability is increased. It is not desirable because it is scarce. More preferably, the content of tin oxide contained in the transparent conductive film on the surface layer side is 2 to 7% by mass.
  • the content of tin oxide contained in the transparent conductive film on the transparent plastic substrate side is 20 to 60% by mass more than the content on the surface layer side.
  • the content of tin oxide contained in the transparent conductive film on the transparent plastic substrate side is less than 20% by mass than the content on the surface layer side, the content of tin oxide is continuously increased from the transparent plastic film substrate side to the surface layer side.
  • the content of tin oxide contained in the portion gradually reduced is 85 ° C. and 85% R.C. H. It is not desirable because the resistance value stability under high temperature and high humidity conditions is poor.
  • the content of tin oxide contained in the transparent conductive film on the transparent plastic substrate side is more than 60% by mass than the content on the surface layer side, the content of tin oxide from the transparent plastic film substrate side toward the surface layer side Is continuously and / or stepwise reduced, the content of tin oxide is high, so that crystallization is inhibited and 85 ° C. and 85% R.I. H. This is undesirable because resistance value stability under high temperature and high humidity conditions becomes poor.
  • the internal stress accompanying the lattice strain in the vicinity of the laminated interface of the transparent conductive film becomes very large, when the pen input durability test is performed, the transparent conductive film of the pen sliding part is destroyed, and the pen sliding part is Undesirably whitening.
  • the content of tin oxide contained in the transparent conductive film on the transparent plastic substrate side is 20 to 50% by mass more than the content on the surface layer side.
  • the total thickness of the transparent conductive film is preferably 16 to 50 nm, and the thickness of the transparent conductive film having a tin oxide content of 0.5 to 8% by mass is preferably 15 nm or more. More preferably, it is 15 nm or more.
  • the upper limit of the thickness of the transparent conductive film having a tin oxide content of 0.5 to 8% by mass is preferably 48 nm or less, more preferably 46 nm or less, although it depends on the thickness of the entire transparent conductive film.
  • the entire thickness of the transparent conductive film is less than 16 nm, the entire film thickness of the transparent conductive film is thin. H. When a high temperature and high humidity test is performed, it is not desirable because it is easily affected and resistance value stability is poor. If the thickness of the transparent conductive film is thicker than 50 nm, the total light transmittance becomes lower than a practical level, which is not desirable.
  • the total light transmittance of the transparent conductive film of the present invention is desirably 75 to 95%. More preferably, the total thickness of the transparent conductive film is 18 to 40 nm, and the thickness of the transparent conductive film having a tin oxide content of 0.5 to 8% by mass is 15 nm or more.
  • the heat treatment temperature is desirably 110 to 160 ° C.
  • the heat treatment time is desirably 20 to 120 minutes.
  • the heat treatment temperature is less than 110 ° C., the temperature for crystallizing the transparent conductive film may be insufficient, the pen input durability may be poor, and 85 ° C. 85% R.D. H. This is not desirable because the resistance value stability under high temperature and high humidity conditions may be poor.
  • the heat treatment temperature of the transparent conductive film of the present invention is preferably 120 to 150 ° C. If the heat treatment time is less than 20 minutes, the time required to crystallize the transparent conductive film may be insufficient, and pen input durability may be poor, and 85 ° C. 85% R.D. H. This is not desirable because the resistance value stability under high temperature and high humidity conditions may be poor. Further, if the heat treatment time exceeds 120 minutes, the production efficiency is lowered, which is not practically desirable.
  • the heat treatment time for the transparent conductive film of the present invention is preferably 30 to 90 minutes. Of course, the above description does not exclude an embodiment in which heat treatment is not performed.
  • the tin oxide content contained in the sputtering target used for film formation was 0.5-8.
  • the content of tin oxide used for film formation first from the sputtering target used for film formation at the end of the mass%. 20-60 wt% more and a substrate temperature of -60 ⁇ 50 ° C. at the time of the transparent conductive film deposition, and oxygen was used as the reactive gas for deposition, an oxygen partial pressure of 1.0 ⁇ 10 -
  • a method for producing a transparent conductive film, which is formed by sputtering at 3 to 50 ⁇ 10 ⁇ 3 Pa and a moisture pressure to inert gas ratio of 8.0 ⁇ 10 ⁇ 4 to 3 ⁇ 10 ⁇ 3 is preferable.
  • a film containing 0.5 to 68% by mass of tin oxide using two or more of the sputtering targets, forming a film on a transparent plastic substrate in order from a sputtering target having a high tin oxide content, and finally forming a film.
  • the content of tin oxide contained in the sputtering target used is 0.5 to 8% by mass, and the content of tin oxide used for film formation first is 20 to 10 from the sputtering target used for film formation last.
  • the reason why it is good to produce a transparent conductive film by increasing 60% by mass is as described above, So that the structure of the transparent conductive film of the invention, it is preferable to select such as multiple configurations and deposition sequence of the sputtering target.
  • the number of sputtering targets used as the raw material of the transparent conductive film containing 0.5 to 68% by mass of tin oxide is preferably 2 or more, preferably 3 and 4 More preferably it is. That is, it is preferable that the number is 3 or more, or 4 or more. However, if the number of sputtering targets is too large, the manufacturing becomes complicated, so 10 or less is sufficient.
  • the sputtering target is preferably used in the order of the high mass% of tin oxide.
  • the content of tin oxide in the transparent conductive film gradually decreases from the substrate side to the surface layer side.
  • the DC dual magnetron sputtering method or the DC dual magnetron sputtering method and the DC
  • a transparent conductive film can be formed by magnetron sputtering.
  • indium oxide sintered targets having different tin oxide concentrations are mounted in descending order of tin oxide concentration, and indium oxide firing having different tin oxide concentrations is performed. Since the sintering target discharges alternately next to each other, the tin oxide concentration in the film thickness direction of the transparent conductive film can be continuously changed.
  • the transparent conductive film may be composed of two layers having different tin oxide concentrations, but is preferably composed of three layers. More preferably. That is, the transparent conductive film is preferably composed of three or more layers having different tin oxide concentrations, more preferably four or more layers. However, if there are too many layers having different tin oxide concentrations, the number of targets increases and the manufacturing becomes complicated. Therefore, the number of layers is preferably 10 or less.
  • the substrate temperature when forming the transparent conductive film is preferably set to ⁇ 60 to 50 ° C.
  • the substrate temperature is replaced by the temperature of the chiller heating medium that controls the substrate temperature.
  • the transparent plastic film base material contains a large amount of organic components and water, unlike inorganic base materials such as glass and metal. Therefore, when the substrate temperature is higher than 50 ° C., a large amount of organic gas or water is released from the transparent plastic substrate when forming the transparent conductive film, and these gases react with the transparent conductive film.
  • an unstable and heterogeneous transparent conductive film may be formed, which is not preferable.
  • H. Resistance stability under high-temperature and high-humidity conditions is not necessarily sufficient, and pen input durability tends to be insufficient, which is not preferable.
  • the substrate temperature is 50 ° C. or lower, organic gas and water are hardly released from the transparent plastic substrate, so that a stable and homogeneous transparent conductive film can be formed.
  • H. Resistance value stability and pen input durability under high temperature and high humidity conditions are improved.
  • the substrate temperature is ⁇ 20 to 0 ° C. The reason is as follows. It is desirable that the melting point of water is 0 ° C. or lower because the outgassing is very small. Also, since many general-purpose chillers have a minimum temperature of -20 ° C or higher, -20 ° C or higher is desirable from the economical viewpoint.
  • oxygen is used as a reactive gas for film formation, and the oxygen partial pressure is 1.0 ⁇ 10 ⁇ 3 to 50 ⁇ 10 ⁇ . It is preferable to form a film at 3 Pa. Forming a tin oxide-added indium oxide transparent conductive film with an oxygen partial pressure of less than 1.0 ⁇ 10 ⁇ 3 Pa is not preferable because it tends to be an unstable film with a large number of oxygen vacancies in the transparent conductive film. A transparent conductive film of tin oxide-added indium oxide with many oxygen vacancies was deposited at 85 ° C and 85% H.
  • the oxygen deficient part reacts and the resistance value increases with time, so that the resistance value stability tends to be insufficient, which is not preferable.
  • the transparent conductive film of tin oxide-added indium oxide with many oxygen vacancies is not easily crystalline, when the pen input durability test is performed, the pen sliding portion is easily whitened, which is not preferable.
  • the lower limit of the oxygen partial pressure is 2.0 ⁇ 10 ⁇ 3 . If the oxygen partial pressure is greater than 50 ⁇ 10 ⁇ 3 Pa, the surface resistance value becomes higher than a practical level, which is not desirable.
  • the surface resistance value of the transparent conductive film of the present invention is 100 to 900 ⁇ / ⁇ is desirable. More preferably, the upper limit of the oxygen partial pressure is 40 ⁇ 10 ⁇ 3 Pa.
  • the film should be formed with a ratio of moisture pressure to inert gas of 8.0 ⁇ 10 ⁇ 4 to 3 ⁇ 10 ⁇ 3. Is preferred. About the ratio of the water pressure with respect to the inert gas of the film-forming atmosphere at the time of sputtering, it measured using the gas analyzer (The Inficon company make, Transpector XPR3). In order to form a film with a ratio of the moisture pressure to the inert gas of less than 8.0 ⁇ 10 ⁇ 4, it is necessary to perform evacuation for a long time or a highly efficient vacuum pump, which is economical.
  • a preferable range of the ratio of the moisture pressure to the inert gas is 8.0 ⁇ 10 ⁇ 4 to 2.5 ⁇ 10 ⁇ 3 .
  • the transparent plastic film substrate used in the present invention is a film obtained by subjecting an organic polymer to melt extrusion or solution extrusion into a film, and stretching, cooling, and heat setting in the longitudinal direction and / or the width direction as necessary.
  • organic polymers polyethylene, polypropylene, polyethylene terephthalate, polyethylene-2,6-naphthalate, polytrimethylene terephthalate, nylon 6, nylon 4, nylon 66, nylon 12, polyimide, polyamideimide, polyethersulfane , Polyetheretherketone, Polycarbonate, Polyarylate, Cellulose propionate, Polyvinyl chloride, Polyvinylidene chloride, Polyvinyl alcohol, Polyetherimide, Polyphenylene sulfide, Polyphenylene oxide, Polystyrene , Syndiotactic polystyrene, norbornene-based polymer, and the like.
  • organic polymers polyethylene terephthalate, polytrimethylene terephthalate, polyethylene-2,6-naphthalate, syndiotactic polystyrene, norbornene-based polymer, polycarbonate, polyarylate and the like are preferable. These organic polymers may be copolymerized with a small amount of other organic polymer monomers or blended with other organic polymers.
  • the thickness of the transparent plastic film substrate used in the present invention is preferably in the range of 10 to 300 ⁇ m, particularly preferably in the range of 70 to 260 ⁇ m. If the thickness of the plastic film is less than 10 ⁇ m, the mechanical strength is insufficient, and particularly when used for a touch panel, there is a tendency to increase deformation with respect to pen input, and durability tends to be insufficient. On the other hand, when the thickness exceeds 300 ⁇ m, the pen load for deforming the film tends to be large when used for a touch panel, which is not preferable.
  • the transparent plastic film substrate used in the present invention has a surface activity such as corona discharge treatment, glow discharge treatment, flame treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, ozone treatment, etc., as long as the object of the present invention is not impaired.
  • the treatment may be performed.
  • the first point is that the adhesion between the transparent conductive thin film and the curable resin layer is increased, so that the transparent conductive film can be prevented from being peeled off by the sliding of the pen, and the pen sliding durability is improved.
  • the second point is that the true contact area when the transparent conductive thin film comes into contact with the glass is reduced by sliding the pen, and the sliding property between the glass surface and the transparent conductive film is improved, so that the pen sliding durability is improved. It is. Details of the curable resin layer are described below.
  • the curable resin used in the present invention is not particularly limited as long as it is a resin that is cured by application of energy such as heating, ultraviolet irradiation, electron beam irradiation, and the like. Silicone resin, acrylic resin, methacrylic resin, epoxy resin, melamine resin , Polyester resin, urethane resin and the like. From the viewpoint of productivity, it is preferable to use an ultraviolet curable resin as a main component.
  • Examples of such ultraviolet curable resins are synthesized from polyfunctional acrylate resins such as acrylic acid or methacrylic acid ester of polyhydric alcohol, diisocyanate, polyhydric alcohol and hydroxyalkyl ester of acrylic acid or methacrylic acid.
  • polyfunctional acrylate resins such as acrylic acid or methacrylic acid ester of polyhydric alcohol, diisocyanate, polyhydric alcohol and hydroxyalkyl ester of acrylic acid or methacrylic acid.
  • a polyfunctional urethane acrylate resin can be used.
  • a monofunctional monomer such as vinyl pyrrolidone, methyl methacrylate, styrene or the like can be added to these polyfunctional resins for copolymerization.
  • the transparent conductive thin film and the curable resin layer it is effective to surface-treat the surface of the curable resin layer.
  • Specific methods include a discharge treatment method in which glow or corona discharge is applied to increase carbonyl groups, carboxyl groups, and hydroxyl groups, and acids or alkalis to increase polar groups such as amino groups, hydroxyl groups, and carbonyl groups.
  • the chemical treatment method etc. to process are mentioned.
  • the ultraviolet curable resin is usually used by adding a photopolymerization initiator.
  • a photopolymerization initiator known compounds that absorb ultraviolet rays and generate radicals can be used without particular limitation. Examples of such photopolymerization initiators include various benzoins, phenyl ketones, and benzophenones. And the like.
  • the content of the photopolymerization initiator is usually preferably 1 to 5 parts by mass per 100 parts by mass of the ultraviolet curable resin.
  • a resin that is incompatible with the curable resin in addition to the curable resin, which is the main component, in the curable resin layer.
  • phase separation occurs in the curable resin and the incompatible resin can be dispersed in the form of particles.
  • the dispersed particles of the incompatible resin irregularities can be formed on the surface of the curable resin, and the surface roughness in a wide region can be improved.
  • examples of the incompatible resin include a polyester resin, a polyolefin resin, a polystyrene resin, and a polyamide resin.
  • the blending ratio thereof Is preferably 0.1 to 20 parts by mass, more preferably 0.2 to 10 parts by mass, and particularly preferably 0.5 to 5 parts by mass per 100 parts by mass of the ultraviolet curable resin.
  • the blending amount of the polyester resin is less than 0.1 parts by mass per 100 parts by mass of the ultraviolet curable resin, the convex part formed on the surface of the curable resin layer tends to be small or the convex part tends to decrease. The roughness is not improved, and a further improvement effect of pen sliding durability is not exhibited, which is not preferable.
  • the compounding amount of the polyester resin exceeds 20 parts by mass per 100 parts by mass of the ultraviolet curable resin, the strength of the curable resin layer is lowered and the chemical resistance is easily deteriorated.
  • the polyester resin has a difference in refractive index from the ultraviolet curable resin, it is not preferable because the haze value of the curable resin layer is increased and the transparency is deteriorated. On the contrary, it can be used as an antiglare film having a high haze value and an antiglare function by actively utilizing the deterioration of transparency caused by dispersed particles of high molecular weight polyester resin.
  • the UV curable resin, photopolymerization initiator and high molecular weight polyester resin are dissolved in a common solvent to prepare a coating solution.
  • the solvent to be used is not particularly limited, and examples thereof include alcohol solvents such as ethyl alcohol and isopropyl alcohol, ester solvents such as ethyl acetate and butyl acetate, dibutyl ether, and ethylene glycol monoethyl ether.
  • Ether solvents, ketone solvents such as methyl isobutyl ketone and cyclohexanone
  • aromatic hydrocarbon solvents such as toluene, xylene and solvent naphtha can be used alone or in combination.
  • the concentration of the resin component in the coating solution can be appropriately selected in consideration of the viscosity according to the coating method.
  • the ratio of the total amount of the ultraviolet curable resin, the photopolymerization initiator and the high molecular weight polyester resin in the coating solution is usually 20 to 80% by mass.
  • the prepared coating solution is coated on a transparent plastic film substrate.
  • the coating method is not particularly limited, and conventionally known methods such as a bar coating method, a gravure coating method, and a reverse coating method can be used.
  • the solvent of the coated coating solution is removed by evaporation in the next drying step.
  • the high molecular weight polyester resin that has been uniformly dissolved in the coating solution becomes fine particles and precipitates in the ultraviolet curable resin.
  • the plastic film is irradiated with ultraviolet rays, whereby the ultraviolet curable resin is crosslinked and cured to form a curable resin layer.
  • fine particles of the high molecular weight polyester resin are fixed in the hard coat layer, and protrusions are formed on the surface of the curable resin layer to improve the surface roughness in a wide region.
  • the thickness of the curable resin layer is preferably in the range of 0.1 to 15 ⁇ m. More preferably, it is in the range of 0.5 to 10 ⁇ m, and particularly preferably in the range of 1 to 8 ⁇ m. When the thickness of the curable resin layer is less than 0.1 ⁇ m, the protrusions are not easily formed. On the other hand, when it exceeds 15 ⁇ m, it is not preferable from the viewpoint of productivity.
  • the surface resistance was measured by a four-terminal method in accordance with JIS-K7194. As a measuring machine, LorestaMP MCP-T350 manufactured by Mitsubishi Yuka Co., Ltd. was used.
  • Pen input durability test A transparent conductive film is used as one panel plate, and the other panel plate is an indium-tin composite oxide thin film (thin oxide content) having a thickness of 20 nm by plasma CVD on a glass substrate. : 10% by mass) a transparent conductive thin film (Nippon Soda Co., Ltd., S500) was used. The two panel plates were arranged through epoxy beads having a diameter of 30 ⁇ m so that the transparent conductive thin film faced to prepare a touch panel. Next, a 5.0 N load was applied to a polyacetal pen (tip shape: 0.8 mmR), and a linear sliding test of 350,000 times (reciprocating 175,000 times) was performed on the touch panel.
  • the sliding distance at this time was 30 mm, and the sliding speed was 60 mm / second. After this sliding durability test, first, it was visually observed whether the sliding portion was whitened. Furthermore, the ON resistance (resirably 100 k ⁇ or less. More desirably, it is 10 k ⁇ or less.
  • the content of tin oxide contained in the transparent conductive film on the transparent plastic substrate side is (1) less than the value corresponding to the thickness measured by the total thickness (film thickness) of the transparent conductive film, The measurement data when etching is used. Also, in this measurement, whether the thickness of the transparent conductive film for each tin oxide content or the tin oxide content changes continuously or stepwise from the transparent plastic film substrate side to the surface layer side It was confirmed.
  • Ratio of non-crystalline part to crystalline part of transparent conductive film A film sample piece laminated with a transparent conductive thin film layer is cut into a size of 1 mm ⁇ 10 mm, and an appropriate resin block with the conductive thin film surface facing outward Affixed to the top surface. After trimming this, an ultrathin section approximately parallel to the film surface was prepared by a general ultramicrotome technique. This section was observed with a transmission electron microscope (manufactured by JEOL, JEM-2010), and the surface portion of the conductive thin film without significant damage was selected, and a photograph was taken at an acceleration voltage of 200 kV and a direct magnification of 40000 times. It was calculated from the area ratio of the crystalline part and the amorphous part when observed under a transmission electron microscope.
  • the transparent plastic film substrate used in Examples and Comparative Examples is a biaxially oriented transparent PET film (A4340, thickness 188 ⁇ m) having easy-adhesion layers on both sides.
  • a curable resin layer 100 parts by mass of a photopolymerization initiator-containing acrylic resin (Daiichi Seika Kogyo Co., Ltd., Seika Beam (registered trademark) EXF-01J) and a copolymerized polyester resin (Toyobo Co., Ltd., Byron (registered trademark)) ) 200, weight average molecular weight 18,000) 3 parts by mass, and a solvent mixture of toluene / MEK (8/2: mass ratio) as a solvent is added so that the solid content concentration is 50% by mass and stirred.
  • a photopolymerization initiator-containing acrylic resin (Daiichi Seika Kogyo Co., Ltd., Seika Beam (registered trademark) EXF-01J)
  • the prepared coating solution was applied using a Mayer bar so that the thickness of the coating film was 5 ⁇ m. After drying at 80 ° C. for 1 minute, the coating film was cured by irradiating with ultraviolet rays (light quantity: 300 mJ / cm 2 ) using an ultraviolet ray irradiation device (UB042-5AM-W type, manufactured by Eye Graphics Co., Ltd.). .
  • Example 1 to 12 The conditions for producing the transparent conductive film in the examples are shown in Table 1.
  • the common manufacturing conditions in each example are as follows. A transparent plastic film was put into the vacuum chamber and evacuated to 2.0 ⁇ 10 ⁇ 4 Pa. Next, oxygen was introduced so that the oxygen partial pressure values in Table 1 were obtained, and then argon was introduced as an inert gas to bring the total pressure to 0.5 Pa.
  • power was applied to an indium oxide sintered target containing tin oxide at a power density of 1 W / cm 2 , and the surface on which the curable resin layer of the transparent plastic substrate was applied by the DC magnetron sputtering method. A transparent conductive film was formed.
  • Example 13 to 15 power was applied to an indium oxide sintered target containing tin oxide at a power density of 1 W / cm 2 , and DC dual magnetron sputtering, or DC dual magnetron sputtering and DC magnetron sputtering were used.
  • a transparent conductive film was formed on the surface of the transparent plastic substrate on which the curable resin layer was applied.
  • two identical targets are generally mounted. In this example, indium oxide sintered targets having different tin oxide concentrations were mounted in descending order of tin oxide concentration.
  • indium oxide sintered targets having different tin oxide concentrations are alternately discharged adjacent to each other, so that the tin oxide concentration in the film thickness direction of the transparent conductive film can be continuously changed as shown in FIG. Details of FIG. 1 will be described.
  • a target having a tin oxide concentration of A mass% and a target having a B mass% are arranged adjacent to each other (tin oxide concentration: A> B).
  • the tin oxide concentration is A mass%.
  • the tin oxide concentration at position b most of the particles fly from the target 1 and few particles fly from the target 2. Therefore, the tin oxide concentration at position b is slightly lower than A.
  • the tin oxide concentration at the position c is about halfway between A and B.
  • the tin oxide concentration at position d is slightly higher than B.
  • the tin oxide concentration is B mass%.
  • Table 1 various sputtering targets were selected and films were formed in order so as to obtain a desired transparent conductive film composition. The film thickness was controlled by changing the speed at which the film passed over the target. The film on which the transparent conductive film was formed was heat-treated under the conditions shown in Table 1 (there were some levels that were not), and then measured for each evaluation item. The measurement results are shown in Table 2.
  • the transparent conductive films described in Examples 1 to 15 have a reliability coefficient of 1.0 to 1.2, and 85 ° C. and 85% R.D. H. Excellent resistance stability under high temperature and high humidity conditions.
  • the total light transmittance and the surface resistance value are practical levels and suitable for use, and are excellent in pen input durability.
  • performances such as total light transmittance, surface resistance value, reliability coefficient, pen input durability and the like were unsatisfactory, which was not preferable.
  • a transparent conductive film excellent in resistance stability under high-temperature and high-humidity conditions and pen input durability can be provided, which is extremely effective for touch panels for car navigation and other touch panels.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Position Input By Displaying (AREA)

Abstract

La présente invention vise à fournir : un film conducteur transparent qui a une excellente stabilité de résistance sous des conditions de température élevée et d'humidité élevée et une excellente durabilité à une entrée par un stylo, lorsqu'il est utilisé dans un écran tactile ; et un procédé de production de manière efficace du film conducteur transparent. A cet effet, la présente invention porte sur un film conducteur transparent dans lequel un film conducteur transparent d'oxyde d'indium additionné d'oxyde d'étain est stratifié sur au moins une surface d'une base de film de matière plastique transparente. Ce film conducteur transparent est caractérisé en ce que : la teneur en oxyde d'étain diminue de manière continue et/ou par échelons dans le film conducteur transparent dans la direction d'épaisseur de film depuis le côté base de film de matière plastique transparente vers le côté couche de surface ; la teneur en oxyde d'étain contenu dans le film conducteur transparent côté couche de surface est de 0,5-8 % en masse ; la teneur en oxyde d'étain contenu dans le film conducteur transparent côté base de matière plastique transparente est supérieure à la teneur côté couche de surface de 20-60 % en masse ; l'épaisseur totale du film conducteur transparent est de 16-50 nm ; et l'épaisseur d'une partie du film conducteur transparent ayant une teneur en oxyde d'étain de 0,5-8 % en masse est de 15 nm ou plus.
PCT/JP2012/074162 2011-09-29 2012-09-21 Film conducteur transparent et procédé de production de celui-ci WO2013047345A1 (fr)

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JP2011285257A JP5196001B2 (ja) 2011-09-29 2011-12-27 透明導電性フィルム及びその製造方法
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Cited By (1)

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WO2015146292A1 (fr) * 2014-03-28 2015-10-01 株式会社カネカ Film électro-conducteur transparent et son procédé de production

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4548488B2 (ja) * 2008-01-22 2010-09-22 ダイキン工業株式会社 合流制御システム
JP6239330B2 (ja) * 2013-09-26 2017-11-29 日東電工株式会社 透明導電性フィルムの製造方法
JP2019059170A (ja) * 2017-09-27 2019-04-18 日東電工株式会社 結晶化フィルム

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WO2002090107A1 (fr) * 2001-05-09 2002-11-14 Cpfilms, Inc. Revetement stratiforme conducteur transparent d'oxyde d'indium et d'etain
JP2011103289A (ja) * 2009-10-13 2011-05-26 Toyobo Co Ltd 透明導電性積層フィルム及び透明導電性積層シート並びにタッチパネル
JP2012114070A (ja) * 2010-11-05 2012-06-14 Nitto Denko Corp 透明導電性フィルム、その製造方法及びそれを備えたタッチパネル

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Publication number Priority date Publication date Assignee Title
WO2002090107A1 (fr) * 2001-05-09 2002-11-14 Cpfilms, Inc. Revetement stratiforme conducteur transparent d'oxyde d'indium et d'etain
JP2011103289A (ja) * 2009-10-13 2011-05-26 Toyobo Co Ltd 透明導電性積層フィルム及び透明導電性積層シート並びにタッチパネル
JP2012114070A (ja) * 2010-11-05 2012-06-14 Nitto Denko Corp 透明導電性フィルム、その製造方法及びそれを備えたタッチパネル

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015146292A1 (fr) * 2014-03-28 2015-10-01 株式会社カネカ Film électro-conducteur transparent et son procédé de production
CN105874544A (zh) * 2014-03-28 2016-08-17 株式会社钟化 透明导电膜及其制造方法
JPWO2015146292A1 (ja) * 2014-03-28 2017-04-13 株式会社カネカ 透明導電フィルムおよびその製造方法
US9657386B2 (en) 2014-03-28 2017-05-23 Kaneka Corporation Transparent conductive film and method for producing same

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