WO2013046874A1 - Module de source lumineuse linéaire, carte de montage et procédé de fabrication d'un module de source lumineuse linéaire - Google Patents

Module de source lumineuse linéaire, carte de montage et procédé de fabrication d'un module de source lumineuse linéaire Download PDF

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Publication number
WO2013046874A1
WO2013046874A1 PCT/JP2012/068312 JP2012068312W WO2013046874A1 WO 2013046874 A1 WO2013046874 A1 WO 2013046874A1 JP 2012068312 W JP2012068312 W JP 2012068312W WO 2013046874 A1 WO2013046874 A1 WO 2013046874A1
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WIPO (PCT)
Prior art keywords
conductive pattern
light source
source module
linear light
mounting substrate
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PCT/JP2012/068312
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English (en)
Japanese (ja)
Inventor
充朗 佐藤
竜児 酒井
弘睦 小島
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シャープ株式会社
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Publication of WO2013046874A1 publication Critical patent/WO2013046874A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Definitions

  • the present invention relates to a linear light source module in which a plurality of light emitting elements are linearly mounted on a mounting substrate, a mounting substrate, and a method of manufacturing the linear light source module.
  • a linear light source module is known as a light source module used for various display devices, lighting devices, and the like.
  • the linear light source module is a light source module in which light emitting elements such as LEDs (Light Emitting Diodes) are linearly arranged.
  • a frame is formed so as to surround the light emitting elements so that light emitted from the light emitting elements arranged in a line is efficiently incident on a light guide means such as a light guide plate.
  • a body is often provided.
  • Patent Document 1 Japanese Patent Laid-Open No. 2004-265978 (Patent Document 1) shown in FIG. 13 discloses a mounting substrate, a plurality of LEDs arranged in a line on the mounting substrate, and a mounting substrate so as to surround the LEDs.
  • positioned in is disclosed.
  • the phosphor resin is applied linearly and uniformly with high accuracy. It will be necessary. In order to realize this, one solution is that the concentration of the phosphor resin is not biased with the movement of the nozzle that discharges the phosphor resin when the phosphor resin is applied.
  • Patent Document 2 Japanese Patent Application Laid-Open No. 2011-61056 (Patent Document 2) shown in FIG. 14 has a problem that a substrate is warped due to stress generated due to a difference in thermal expansion coefficient between a heat dissipation substrate and a circuit substrate during heat treatment.
  • Patent Document 2 a linear light source module in which a light emitting element chip and a circuit chip are electrically connected in series by bonding wires is disclosed. Since an integrally formed substrate is used in place of different components pasted with a conventional adhesive, stress due to the difference in thermal expansion coefficient does not occur, and warping does not occur. As a result, the linear light source device becomes smaller, and it becomes easier to apply the phosphor resin linearly and uniformly with high accuracy.
  • a reflector that extends along both sides of the light-emitting diode array is formed, and the reflector reflects light from the lateral side surface or the front surface of the light-emitting diode element. Illuminance can be obtained.
  • the linear light source module is increased in size, and the light uniformity of the linear light source is likely to be biased due to the positional accuracy of the reflector, and the cost of the reflector is necessary and expensive.
  • the inside of the frame is filled with a phosphor resin, and the phosphor resin often contains phosphor particles.
  • the light emitted from the light emitting element is emitted more efficiently toward the outside by the phosphor particles.
  • Patent Document 2 when the LED chip and the circuit chip are directly connected by bonding wires, the LED chip and the circuit chip are arranged in the wire forming direction.
  • it is required to further reduce the size of the linear light source.
  • the present invention has been made to solve the above-described problems, and in a linear light source module in which a plurality of light emitting elements are arranged on a mounting substrate, a linear light source module that improves uneven density of phosphors, and An object of the present invention is to provide a mounting substrate used for this and a method for manufacturing a linear light source module.
  • a linear light source module is used for a linear light source module in which a plurality of light emitting elements are linearly mounted, and has a terminal portion for connecting an anode terminal and a cathode terminal of the linear light source. It is characterized by that.
  • a linear light source module is used for a linear light source module in which a plurality of light emitting elements are linearly mounted, and an anode terminal and a cathode terminal of the linear light source are temporarily electrically connected. It is characterized by being connected.
  • the anode terminal and the cathode terminal may be formed on a mounting substrate, or may be formed on a component of the linear light source module other than the mounting substrate.
  • a plurality of linear light sources placed on the mounting board are temporarily connected to the anode terminal and the cathode terminal by wire bonding. It is preferable.
  • a plurality of linear light sources placed on the mounting substrate are temporarily connected to the anode terminal and the cathode terminal electrically with solder. Preferably it is.
  • the interval between the anode terminal and the cathode terminal placed on the mounting substrate is 4 mm or less.
  • the method of manufacturing a linear light source module according to the present invention includes a short-circuit process for short-circuiting the anode terminal and the cathode terminal of the mounting substrate, and removing an electrical connection short-circuited in the short-circuit process.
  • a short-circuit removing step is a short-circuit process for short-circuiting the anode terminal and the cathode terminal of the mounting substrate, and removing an electrical connection short-circuited in the short-circuit process.
  • the linear light source module capable of improving the density unevenness of the phosphor resin, the mounting substrate used therefor, and the manufacturing method thereof I will provide a.
  • linear light source module incorporated in a backlight of a liquid crystal display device, an illuminating device, an alternative illumination to a future fluorescent lamp, or the like.
  • a light guide means such as a light guide is separately provided on the light exit surface side of the backlight of the liquid crystal display device.
  • FIG. 1 is a perspective view partially showing a linear light source module according to Embodiment 1 of the present invention.
  • FIG. 2 is a plan view showing the linear light source module in FIG.
  • FIG. 3 is a cross-sectional view showing the linear light source module in FIG.
  • FIG. 3 shows a cross section of the linear light source module along the line III-III in FIG.
  • the linear light source module 1 ⁇ / b> A mainly includes a mounting substrate 10, a frame body 15, and a plurality of LEDs 20.
  • the mounting substrate 10 is made of a plate-like member having a rectangular shape in plan view, and includes a base material portion 11, a first conductive pattern 12A, and a pair of second conductive patterns 12B and 12C.
  • the main surface of the mounting substrate 10 is roughly divided into a light source area where the frame body 15 and the plurality of LEDs 20 are mounted, and a peripheral area where other circuit components are mounted.
  • the first conductive pattern 12A is provided so as to be disposed at a substantially central portion in the light source area, and at least a part of the pair of second conductive patterns 12B and 12C is disposed at the peripheral portion in the light source area. It is provided so that.
  • the base material portion 11 includes a base 11a and an insulating layer 11b formed on the base 11a.
  • the base 11a has high thermal conductivity such as aluminum from the viewpoint of efficiently dissipating heat generated by driving the LED 20 and heat generated in other circuit components mounted on the mounting substrate 10 to the outside. It is preferable to be comprised with the metal plate.
  • the base 11a is not limited to this, and may be composed of a glass epoxy plate or a ceramic plate.
  • the insulating layer 11b may be made of any material as long as insulation between the base 11a and the first and second conductive patterns 12A to 12C can be ensured.
  • the base 11a is comprised with an insulator like the above-mentioned glass epoxy board or a ceramic board, formation of the insulating layer 11b is unnecessary.
  • the first conductive pattern 12 ⁇ / b> A and the second conductive patterns 12 ⁇ / b> B and 12 ⁇ / b> C described above are formed on the main surface of the base material portion 11 (that is, on the main surface of the insulating layer 11 b). ing.
  • the first conductive pattern 12A is a conductive pattern on which a plurality of LEDs 20 are mounted.
  • the pair of second conductive patterns 12 ⁇ / b> B and 12 ⁇ / b> C is a conductive pattern including an alignment portion serving as an alignment mark for determining the mounting position of each of the plurality of LEDs 20.
  • the reason why the plurality of LEDs 20 are mounted on the conductive pattern is mainly to efficiently dissipate heat generated by driving the LEDs 20 to the base material portion 11.
  • each of the first conductive pattern 12A and the second conductive patterns 12B and 12C is formed so as to cover the wiring layer 13a formed on the main surface of the base member 11 and the wiring layer 13a. And the plated layer 13b.
  • the first conductive pattern 12A and the second conductive pattern 12C do not have a function as wiring for transmitting an electric signal, and transmit the electric signal. This corresponds to a so-called dummy wiring formed simultaneously with other wiring layers.
  • the layer 13a included in the first conductive pattern 12A and the second conductive pattern 12C is also referred to as a wiring layer.
  • the material of the wiring layer 13a and the plating layer 13b is not particularly limited, but the wiring layer 13a is preferably made of a metal material such as copper from the viewpoint of thermal conductivity and conductivity.
  • the layer 13b is preferably made of a metal material such as silver, aluminum, or platinum from the viewpoints of thermal conductivity, conductivity, and reflectance.
  • a metal material such as silver, aluminum, or platinum from the viewpoints of thermal conductivity, conductivity, and reflectance.
  • the thickness of the wiring layer 13a is preferably formed so that the cross-sectional area of the wiring layer 13a is as large as possible from the viewpoint of easy heat release and current flow.
  • the thickness of the wiring layer 13a is preferably set to 0.035 mm or less.
  • the first conductive pattern 12A is viewed from the normal direction of the main surface of the base material portion 11 (hereinafter, also simply referred to as “when viewed in plan”). It has a long, substantially rectangular shape.
  • the LEDs 20 are linearly mounted on the first conductive pattern 12A along the direction in which the first conductive pattern 12A extends.
  • the second conductive pattern 12B which is one of the pair of second conductive patterns 12B and 12C, is on the main surface of the base member 11 on the one side in the direction intersecting the direction in which the first conductive pattern 12A extends. It is provided so as to run in parallel with one conductive pattern 12A.
  • the second conductive pattern 12B includes a base portion 12b extending along the direction in which the first conductive pattern 12A extends, and a plurality of convex portions protruding from the base portion 12b toward the first conductive pattern 12A. And an alignment unit 18B.
  • the plurality of alignment portions 18B are spaced apart from each other with a certain distance along the direction in which the base portion 12b extends.
  • the second conductive pattern 12C which is the other of the pair of second conductive patterns 12B and 12C, is on the other surface in the direction intersecting with the direction in which the first conductive pattern 12A extends on the main surface of the base 11. It is provided so as to run in parallel with one conductive pattern 12A.
  • the second conductive pattern 12C includes a base portion 12c extending along a direction in which the first conductive pattern 12A extends and a plurality of convex portions protruding from the base portion 12c toward the first conductive pattern 12A side. And an alignment portion 18C.
  • the plurality of alignment portions 18C are provided apart from each other at a certain distance along the direction in which the base portion 12c extends.
  • the pair of second conductive patterns 12B and 12C are positioned on the main surface of the base member 11 so as to sandwich the first conductive pattern 12A along the direction intersecting with the direction in which the first conductive pattern 12A extends. become.
  • the alignment portions 18B and 18C are provided so as to be alternately arranged along the direction in which the first conductive pattern 12A extends.
  • each of the alignment portions 18B and 18C composed of a plurality of convex portions has a pair of corner portions when viewed in plan, and each or one of the pair of corner portions is an alignment corner portion for alignment.
  • a plurality of alignment protruding corners formed by the corners of the protrusions intersect the direction in which the first conductive pattern 12 ⁇ / b> A extends on the main surface of the base material part 11.
  • the first conductive pattern 12 ⁇ / b> A is disposed to face the first conductive pattern 12 ⁇ / b> A.
  • the plurality of LEDs 20 correspond to light emitting elements that emit light when driven, and have a predetermined distance from each other in a line along the direction in which the first conductive pattern 12A extends as described above. It is mounted on the pattern 12A. More specifically, each of the plurality of LEDs 20 is bonded to the first conductive pattern 12A by a die bond material (not shown). Adjacent LEDs of the plurality of LEDs 20 are electrically connected by a bonding wire 21 made of a gold wire or the like.
  • the frame body 15 is formed of, for example, a white resin molded body, and is preferably integrated with the mounting substrate 10 by injection molding (outsert molding). Formed.
  • the frame 15 is formed in a shape having a slit-like internal hollow so that its outer shape is annular (frame shape), and is disposed along the periphery of the first conductive pattern 12A described above.
  • the frame body 15 is provided so as to surround the plurality of LEDs 20 arranged in the above-described line shape.
  • the frame 15 has a reflection surface 15 a that reflects a part of the light emitted from the plurality of LEDs 20 on the inner peripheral portion thereof.
  • the reflection surface 15a is preferably provided in an inclined shape as shown in FIG. With this configuration, when the LED 20 is driven, the light reflected by the reflecting surface 15a can be guided in the optical axis direction of the LED 20, and light is efficiently emitted toward the outside. .
  • the hollow inside of the frame 15 is filled with a phosphor resin 16.
  • the phosphor resin 16 is made of, for example, a silicone resin or an epoxy resin, and seals the plurality of LEDs 20 positioned inside the frame-like reflector 15.
  • the phosphor resin 16 has phosphor particles dispersed therein.
  • the insulating layer 11b is formed on the base 11a, and the wiring layer 13a is further formed on the formed insulating layer 11b.
  • the insulating layer 11b is formed on the base 11a by, for example, adhesion or vapor deposition.
  • the wiring layer 13a is insulated by performing an etching process using a photomask on the conductor layer and patterning it into a predetermined shape. It is formed on the layer 11b.
  • a plating layer 13b is formed on the wiring layer 13a. More specifically, a work-in-process product in which a wiring layer 13a patterned in a predetermined shape is formed on the main surface of the base member 11 is immersed in a plating solution, and a voltage is applied to the wiring layer 13a while maintaining the state. By applying, the surface of the exposed wiring layer 13a is plated. Thereby, the plating layer 13b is formed on the wiring layer 13a. In this way, the mounting substrate 10 in which the first conductive pattern 12A and the second conductive patterns 12B and 12C are formed on the main surface of the base member 11 is manufactured.
  • the edge of the formed wiring layer 13a is rounded.
  • the roundness of the edge portion appears rounded at the edge portion of the plating layer 13b during the subsequent plating process, and as a result, the edge portions of the first conductive pattern 12A and the second conductive patterns 12B and 12C. Will be rounded.
  • the wiring layer 13a is formed to be thicker than necessary as described above. It is important not to.
  • the frame body 15 is formed on the main surface side of the mounting substrate 10. More specifically, the frame body 15 is formed on the first conductive pattern 12A by placing the mounting substrate 10 on the molding die of the injection molding apparatus, pouring white resin into the molding die, and curing the white resin. By forming the frame 15 on the mounting substrate 10 by injection molding in this way, the mounting position of the frame 15 on the mounting substrate 10 is positioned with high accuracy.
  • the plurality of LEDs 20 are positioned and mounted on the first conductive pattern 12A. More specifically, the mounting positions of each of the plurality of LEDs 20 are determined based on the alignment portion included in the second conductive patterns 12B and 12C described above, and based on this, the plurality of LEDs 20 are first connected using a chip mounter or the like. It is mounted on one conductive pattern 12A. Thereafter, the plurality of LEDs 20 are wire-bonded using the bonding wires 21 and further sealed with the phosphor resin 16, whereby the linear light source module 1A as shown in FIGS. 1 to 3 is completed.
  • FIG. 4 is a conceptual diagram for explaining a phosphor resin coating process. While discharging a predetermined amount of the phosphor resin from the tip of the dispenser nozzle 23, the tip of the nozzle is moved from the anode terminal side ( ⁇ terminal) to the cathode terminal side (+ terminal) on the first conductive pattern 12A to make it uniform. A phosphor resin is applied to the surface.
  • FIG. 5 is a graph showing the relationship between the application position of the linear light source module 1A and the chromaticity y distribution by conventional phosphor resin application.
  • the chromaticity y distribution from the anode terminal ( ⁇ terminal) to the cathode terminal (+ terminal) is about 0.15 in the vicinity of the anode terminal ( ⁇ terminal). It rises as it approaches (terminal) and reaches about 0.2 near the cathode terminal (+ terminal). For this reason, the chromaticity y is biased in the linear light source module 1A, and the irradiance distribution of the light emitted from the plurality of LEDs 20 is uneven. As described in a verification experiment described later, this is considered to be an influence of charging of the phosphor particles contained in the phosphor resin.
  • FIG. 6 is a plan view showing the entire linear light source module in FIG.
  • the cathode terminal (+ terminal) on the second conductive pattern 12B and the anode terminal ( ⁇ terminal) on the third conductive pattern 12D are wire-bonded using a bonding wire 21.
  • the plurality of LEDs 20 are formed on the first conductive pattern 12A at intervals of a chip pitch of 1.00 to 2.00 mm (preferably around 1.6 mm).
  • a cluster 22 of linear light source modules is formed by connecting about 15 LEDs 20 in series with bonding wires. Further, the interval between the clusters 22 is 3.00 to 4.00 mm (preferably around 3.7 mm), and approximately four clusters are formed in one linear light source module 1A.
  • the phosphor resin shown in FIG. 4 is thermally cured, and the wire is formed at the terminal portion between the anode terminal ( ⁇ terminal) and the cathode terminal (+ terminal) until the predetermined treatment is completed. It is possible to bond.
  • the phosphor particles are charged to the anode ( ⁇ ) when the phosphor resin is applied, and have the property of being easily collected at the cathode terminal (+ terminal). Yes.
  • FIG. 7 is a graph showing the relationship between the application position of the linear light source module 1A and the chromaticity y distribution by applying the phosphor resin in the present embodiment.
  • the chromaticity y is about 0.17 in the vicinity of the anode terminal ( ⁇ terminal), and is also about 0.17 when approaching the cathode terminal (+ terminal), and the linear light source module 1A.
  • the chromaticity bias is not confirmed.
  • the irradiance distribution of the light emitted from the plurality of LEDs 20 is improved to be uniform with high accuracy.
  • FIG. 8 is a plan view showing the entire linear light source module according to Embodiment 2 of the present invention.
  • the linear light source module 1B in the present embodiment will be described with reference to FIG.
  • the terminal positions and connection methods of the anode terminal ( ⁇ terminal) and the cathode terminal (+ terminal) described in Embodiment 1 are different. That is, in the linear light source module 1B of the present embodiment, a + terminal portion is formed by connecting the anode terminals of all clusters, and similarly, a-terminal portion is formed by connecting the cathode terminals of all clusters.
  • the + terminal part and the-terminal part are short-circuited by solder. Thereby, the burden of the manufacturing method called the short circuit and cutting
  • FIG. 9 is a wiring diagram of an actual product substrate of the linear light source module.
  • the mounting board of the linear light source module is composed of a plate-like member having a rectangular shape in plan view and having a width of about 10 mm and a length of about 110 mm.
  • a light source area where the reference hole, the frame body 15 and the plurality of LEDs 20 are mounted, and a peripheral area where other circuit components are mounted are arranged.
  • FIG. 10 is a conceptual diagram of a method for manufacturing a linear light source module, a mounting substrate, and a linear light source module.
  • the configuration of the present invention has been described in the form of an actual product with reference to FIGS. 6, 8, and 9. Subsequently, referring to FIG. 10, the linear light source module to which the present invention is applied, and the mounting The concept of the method for manufacturing the substrate and the linear light source module will be described.
  • a plurality of LEDs 20 are connected by bonding wires, and the linear light source module has an anode terminal ( ⁇ terminal) 24 and a cathode terminal (+ terminal) 25 in a wiring area wired with the LEDs 20.
  • the anode terminal ( ⁇ terminal) 24 and the cathode terminal (+ terminal) 25 are short-circuited before the phosphor resin coating process, and removed by some method after the phosphor resin coating process, for example, disconnection of the bonding wire or etching of the wiring. Disconnect the anode terminal ( ⁇ terminal) and the cathode terminal (+ terminal).
  • FIG. 11 is a flowchart showing the steps of the method for manufacturing the linear light source module.
  • the quality of the parts is checked in the acceptance inspection process, and the plurality of LEDs 20 are die-bonded to the first conductive pattern 12A in the die-bonding process.
  • the bonding wire process the plurality of LEDs 20 are connected by bonding wires, and simultaneously or after that, the anode terminal ( ⁇ terminal) and the cathode terminal (+ terminal) are connected by bonding wires.
  • the same processing is performed for the solder of the second embodiment.
  • quality inspection of the bonding wire is performed in the bonding wire QC process, and the plurality of LEDs 20 in the frame body 15 are sealed with a predetermined phosphor resin in the phosphor resin coating process. After the sealed phosphor resin is cured by heat treatment, the bonding wire is disconnected or the solder is disconnected in a short-circuit bonding wire process.
  • FIG. 12 is a photograph showing the result of the verification experiment.
  • a comb-tooth pattern of copper wiring of a wiring sheet (copper foil thickness 35 ⁇ m, wiring 1.5 mm pitch product) on a glass plate is prepared, and a phosphor resin is applied on the pattern in the same manner. Experiments were performed. As a result, it was confirmed that the phosphor resin gathered on the cathode terminal (+ terminal) side, and the phosphor particles in the phosphor resin were charged on the anode ( ⁇ ).
  • the movement of the phosphor particles from the initial stage of the comb pattern of the copper wiring is shown by a micrograph, and the phosphor particles are charged on the anode ( ⁇ ) even in the moving picture of the entire photograph. I have confirmed that.
  • the frame 15 is integrated with the mounting substrate 10 by outsert molding.
  • the frame 15 is attached to the mounting substrate 10 using other methods. It may be assembled.
  • the linear meaning of the plurality of LEDs 20 refers to a certain direction such as a curved shape, a parallel shape, a zigzag shape, a rectangular shape, or a square shape. It is not limited to what was arranged.
  • the present invention can be used as a linear light source module and a mounting substrate.
  • 1A to 1C linear light source module 10 mounting substrate, 11 base part, 11a base, 11b insulating layer, 12A first conductive pattern, 12B second conductive pattern, 12C second conductive pattern, 12D third conductive pattern, 12b base Part, 12c base part, 13a wiring layer, 13b plating layer, 14 white resist film, 15 frame, 15a reflecting surface, 16 phosphor resin, 18B alignment part, 18C alignment part, 20 LED, 21 bonding wire, 22 cluster, 23 dispenser nozzle, 24 anode terminal (-terminal), 25 cathode terminal (+ terminal), 26 solder, 101 linear light source, 102 reflector, 103 circuit chip.

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  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

Selon l'invention, une borne d'anode (24) et une borne de cathode (25) placées sur une carte de montage (10) sont connectées par une liaison par fil ou de la soudure, ce par quoi le décalage de la chromaticité causé par l'accumulation de particules de luminophore incluses dans la résine phosphorescente peut être empêché et l'irrégularité de la distribution de l'éclairage fourni par la lumière émise par une pluralité de DEL (20) peut être atténuée. La coupure de la liaison par fil dans les sections de connexion des bornes permet de ramener l'état de connexion à un état original de connexion dans lequel les connexions électriques étaient séparées. Grâce à cette configuration, il est fourni un module de source lumineuse linéaire dans lequel une pluralité d'éléments électroluminescents est disposée sur une carte de montage et l'irrégularité de la densité de la résine phosphorescente peut être réduite. L'invention concerne en outre une carte de montage utilisée pour le module de source lumineuse linéaire et un procédé de fabrication du module de source lumineuse linéaire.
PCT/JP2012/068312 2011-09-30 2012-07-19 Module de source lumineuse linéaire, carte de montage et procédé de fabrication d'un module de source lumineuse linéaire WO2013046874A1 (fr)

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JP2011-215782 2011-09-30
JP2011215782A JP2013077660A (ja) 2011-09-30 2011-09-30 線状光源モジュールおよびその製造方法

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JP2017022150A (ja) * 2015-07-07 2017-01-26 日亜化学工業株式会社 線状光源

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JP2001118501A (ja) * 1999-10-15 2001-04-27 Matsushita Electric Ind Co Ltd カラー表示プラズマディスプレイパネルの蛍光体膜形成方法及び装置とそれらにより作製したカラー表示プラズマディスプレイパネル
JP2004323576A (ja) * 2003-04-22 2004-11-18 Matsushita Electric Ind Co Ltd 蛍光体およびプラズマディスプレイ装置
JP2011061056A (ja) * 2009-09-11 2011-03-24 Stanley Electric Co Ltd 線状発光装置、その製造方法並びに面光源装置

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JP2001118501A (ja) * 1999-10-15 2001-04-27 Matsushita Electric Ind Co Ltd カラー表示プラズマディスプレイパネルの蛍光体膜形成方法及び装置とそれらにより作製したカラー表示プラズマディスプレイパネル
JP2004323576A (ja) * 2003-04-22 2004-11-18 Matsushita Electric Ind Co Ltd 蛍光体およびプラズマディスプレイ装置
JP2011061056A (ja) * 2009-09-11 2011-03-24 Stanley Electric Co Ltd 線状発光装置、その製造方法並びに面光源装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017022150A (ja) * 2015-07-07 2017-01-26 日亜化学工業株式会社 線状光源

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