WO2013021024A2

WO2013021024A2 - Carrier film for a silicon element and method for producing a carrier film for a silicon element

Info

Publication number: WO2013021024A2
Application number: PCT/EP2012/065565
Authority: WO
Inventors: Markus Boss; Martin Brandl; Tobias Geltl; Markus Pindl
Original assignee: Osram Opto Semiconductors Gmbh
Priority date: 2011-08-09
Filing date: 2012-08-09
Publication date: 2013-02-14
Also published as: DE102011080653A1; WO2013021024A3

Abstract

The invention relates to a carrier film (200, 210, 220, 230) for accommodating a silicon element (410) in a pressing method, wherein the carrier film (200, 210, 220, 230) is surface-treated at least in a sub-area (211, 231) in such a way that the adhesive effect with respect to silicon is increased in the treated area. The invention further relates to a system comprising a surface-treated carrier film (200, 210, 220, 230) and a silicon element (410) applied to the carrier film (200, 210, 220, 230), wherein the silicon element (410) lies at least partially on the surface-treated area (211, 213).

Description

Carrier film for a silicone element and method for

Producing a carrier film for a silicone element

The present invention relates to a carrier film for

Receiving a silicone element in a press method, a system comprising a carrier film and a silicone element applied to the carrier film, a method for producing a carrier film and a method for producing a silicone element by means of a carrier film in one

A pressing method wherein the silicone member is suitable for use in an optoelectronic semiconductor device.

In particular, the present invention relates to a

Carrier film for receiving a silicone element, which, for example in the form of isolated silicone platelets as a radiation conversion element in an optoelectronic

Semiconductor device is used.

An example of an optoelectronic semiconductor component has an electrically contacted semiconductor chip with a radiation conversion element, wherein the semiconductor chip and the radiation conversion element in a potting compound

can be embedded. The semiconductor chip emits during operation a primary radiation and in the

Radiation conversion element, a part of the primary radiation is converted into a secondary radiation of different wavelengths. The resulting radiation of the optoelectronic

Semiconductor component results from the superposition of the radiation transmitted by the radiation element primary radiation and the generated secondary radiation. That's the way to go in particular provide light sources that emit a white light.

The made of the silicone element

Radiation conversion element is in this case separately from the

Semiconductor chip produced and then applied by suitable methods to the semiconductor chip and possibly embedded in a housing.

As is known, the silicone element from which the

Radiation conversion element by appropriate

Separation processes is obtained, produced by a pressing process. Here, silicone matrix is introduced into the cavity of a pressing tool and brought by pressing in the form of the silicone element. For the subsequent

Further processing, it is necessary that the silicone element adheres to the intended for the pressing process carrier film and not on other components.

The present invention is therefore based on the object to improve the known prior art.

Furthermore, it is an object of the present invention, a carrier film and a system of carrier film and

Silicone element and a method for producing a

Carrier film and a method for producing a

Specify silicone element by means of a carrier film, so that the handling of the silicone element is simplified by means of the carrier film. This object is achieved by a carrier film according to independent claim 1.

Furthermore, this object is achieved by a system comprising a carrier film and a silicone element according to independent claim 9.

Furthermore, this object is achieved by a method for

Producing a carrier film according to the independent

Claim 12 solved.

Furthermore, this object is achieved by a method for

Producing a silicone element according to the independent

Claim 15 solved.

Further developments and advantageous embodiments of the invention are specified in the dependent claims.

EXEMPLARY EMBODIMENTS

The present invention relates to a carrier film for

Receiving a silicone element in a pressing process, wherein the carrier film is surface-treated at least in a partial area such that the adhesion to silicone in the treated area is increased. "

By increasing the adhesive effect of the carrier film against silicone, the processing of silicone in one

Pressing procedure and simplified in subsequent steps, since a more reliable adhesion of the

Silicone element can be achieved on the carrier film.

According to one embodiment, the treated area extends completely along at least one side of the

Carrier film. As a result, the carrier film can be positioned as desired relative to the silicone element to be applied, since at each point the carrier film has an increased adhesive effect

is guaranteed.

According to one embodiment, the shape of the partial region imitates the shape of the silicone element to be applied and / or the partial region is in particular circular, square or rectangular. Because only a portion of the carrier film

is surface-treated, the production of such a carrier film is more material-saving and less expensive than in a treatment of the entire carrier film.

According to one embodiment, the shape of the partial region forms the shape of the edge of the silicone element to be applied and / or the partial region is in particular annular or frame-shaped. Again, the production of such a carrier film is more material-saving and cost-effective than in a treatment of the entire carrier film, as only one

Subregion of the carrier film is surface-treated.

At the same time, the knowledge is used that a sticking of an entire silicone element to the carrier film in particular _n

5 by an improved adhesion to the edge region of the

Silicone element is achieved. In this way, on the one hand, the portion to be treated can be further reduced, and on the other hand, a detachment of the silicone element, if desired in later method steps, is facilitated since the increased adhesive effect occurs only at the edge of the silicone element. As a result, an increased adhesion during the pressing process and subsequent steps is thus ensured with the simultaneous possibility of easy detachment at a desired time.

In one embodiment, the carrier film is a

Polytetrafluoroethylene film (PTFE film). A PTFE film meets all requirements for use in one

Pressing, such as extensibility and

Tear resistance, while allowing a variety of surface treatment options, through which the desired increased adhesion can be achieved.

According to one embodiment, the carrier foil is in the

roughened surface treated area. By roughening a surface enlargement of the carrier film and thus an increased adhesive effect can be achieved in a simple manner. A roughening of the carrier film is simple and quick to carry out and inexpensive. The associated materials and devices are readily available. Furthermore, it is easy to choose different variants, for example

in terms of geometry and design of the roughened surface. Another advantage is the possibility of a simple quality control, for example by roughness measurements or the like. .

b

Preferably, the roughening depth is 1 μιη to 50 μιη,

preferably 5 μιη to 45 μιη, particularly preferably 10 μιη to 40 μιη, more preferably 20 μιη to 30 μιη. The

On the one hand, roughening depth must be high enough to ensure the increased adhesion to silicone, but at the same time it must be low enough to allow a later intentional detachment of the silicone element. In addition, the roughening depth in the case that the silicone element is used as a converter-filled radiation conversion element, a maximum value should not exceed, otherwise due to the thickness differences in the silicone element a

uniform color reproduction would not be guaranteed. The broiling depth according to the invention is thus based on the knowledge of how the adhesion, especially with respect to silicone, is sufficient

can be improved without adversely affecting other parameters in the further processing.

According to one embodiment, the carrier foil is in the

surface treated area with an adhesion-promoting

Coating coated and the coating preferably a primer coating, a plasma coating or a cured silicone coating. The advantage of a coating is for example in a high

Reproducibility and consistent quality. Furthermore, the uniformity of the coating can be optimally ensured. The possibility of using different coating materials offers a high variability of the coating, so that the coating can be adapted specifically to the respective requirements. Depending on the coating method and / or the coating material, a very uniform surface can be achieved so that the coating topology does not subsequently imitate in the silicone element produced. ^

According to various embodiments, the carrier film is larger than the silicone element to be applied. This makes it possible that the silicone element completely on the

Carrier film rests. For later detachment of the silicone element thus only adhesive properties against the

Carrier film can be changed accordingly and stick to other components and thus a difficult

Further processing is eliminated.

The invention further relates to a system comprising a carrier film according to the invention and a silicone element applied to the carrier film, wherein the silicone element

completely rests on the carrier foil, wherein in particular the carrier foil projects beyond the silicone element in the lateral direction. As a result, the handling of the silicone element is facilitated because the silicone element only on the

Carrier film and does not adhere to other components.

In one embodiment, the silicone element lies at least partially on the surface-treated area. By resting the silicone element on the area, the

Especially with respect to silicone has an increased adhesive effect, a reliable adhesion of the silicone element to the

Carrier film in the pressing process and in subsequent

Steps reached.

In one embodiment, at least the edge region of the silicone element rests on the surface-treated area. Here, the knowledge is used that a sticking of an entire silicone element to the carrier film in particular by an improved adhesion is achieved at the edge region of the silicone element. In this way, on the one hand, the portion to be treated can be further reduced, on the other hand, a detachment of the silicone element, if in later

Process steps is desired, easier, since the increased adhesion only occurs at the edge of the silicone element. As a result, an increased adhesion during the

Pressing method and subsequent steps ensured at the same time the possibility of easy removal at a desired time.

Preferably, at least 5% to 15%, preferably 7% to 13%, in particular up to 11%, are particularly preferred

10% of the area of the silicone element on the

surface treated area. This will

on the one hand ensures a good adhesion of the silicone element to the carrier film during the pressing process, on the other hand, a simple detachment of the silicone element of the

Carrier film allows at a later date.

The present invention further relates to a method for producing a carrier film, which is suitable for receiving a silicone element in a pressing process,

comprising the steps of providing a carrier film and treating the surface of the carrier film at least in one

Partial area such that the adhesion to silicone in the treated area is increased.

Pressing process and in subsequent process steps simplified, as a more reliable adhesion of

Silicone element can be achieved on the carrier film.

In one embodiment, the step of treating the surface is carried out by roughening, preferably by means of etching, by means of a plasma treatment or by means of

Abbschleifens. In addition to the already mentioned advantages of a roughened surface, in particular the methods of etching and plasma treatment simultaneously provide the

Possibility to clean the surface of the carrier film and to remove unwanted particles, which also improves the adhesion.

In one embodiment, the step of treating the surface is carried out by coating with an adhesion-promoting coating, preferably the step of

Coating the application of a plasma coating, a primer coating or a cured

Silicone coating. The advantage of a coating is for example in a high reproducibility and thus consistent quality. Furthermore, the

Uniformity of the coating can be optimally ensured. Due to the possibility of using different

Coating materials offer a high variability of the coating, so that the coating can be tailored to the particular requirements. Depending on

Coating process and / or coating material can be achieved a very uniform surface, so that the coating topology is not hereinafter in the

produced silicone element images. The present invention further relates to a method for producing a silicone element by means of a

Carrier film in a pressing process, wherein the silicone element is suitable for use in an optoelectronic semiconductor device, comprising the steps of providing a carrier film for receiving a silicone element, wherein the carrier film at least in a partial area such

is surface-treated, that the adhesion to silicone in the treated area is increased, placing the carrier sheet in a pressing tool, introducing a

Silicone compound in the pressing tool, closing the

Pressing tool and pressing the silicone compound on the

Carrier film for forming a silicone element, wherein the

Silicone element at least partially on the

surface-treated area rests, opening the

Press tool, and removing the carrier film with the

Silicone element from the pressing tool.

By providing a surface treated area for adhesion enhancement and positioning of the silicone element such that it at least partially on the

surface-treated area rests, the adhesion between the silicone element and carrier film is ensured in the pressing process. This can in particular higher

Clamping forces can be used during the pressing process, because the adhesive effect, even at higher clamping forces, ensures adherence of the silicone element to the carrier foil and not to other components. By higher

In turn, clamping forces can be better compensated for on the tool side by tolerances, such as, for example, tilting. Also, higher clamping forces lead to a more homogeneous distribution of the silicone mass in the mold cavity, which in turn results in lower thickness variations of the silicone element produced. The thickness is especially in the case of converter-filled Silicon elements, which are used as a radiation conversion element in a semiconductor optoelectronic device, of importance, since with a constant thickness, a lower target Farbortstreuung is achieved.

BRIEF DESCRIPTION OF THE DRAWINGS

Various embodiments of the solution according to the invention are explained in more detail below with reference to the drawings. In the figures, the first digit (s) of a reference numeral indicate the figure in which the numeral is used first. The same reference numerals are for the same or equivalent elements or properties in all figures

used.

Show it

Fig.l is a schematic representation of a cross section

2 shows a schematic representation of a cross section of the closed first pressing tool with the carrier foil according to the invention, FIG.

Fig. 3 is a schematic representation of the invention

Carrier film with applied silicone element, Fig. 4 is a schematic representation of a cross section

an open second pressing tool with the

carrier film according to the invention, a schematic representation of the carrier film according to the invention with applied silicone element, a plan view of a carrier film according to a first embodiment without silicone element, a plan view of the carrier film of FIG. 6a with applied silicone element, a plan view of a carrier film according to a second embodiment without silicone element, a plan view 7a with applied silicone element, a plan view of a carrier foil according to a second exemplary embodiment without silicone element, a plan view of the carrier foil according to FIG. 7a with applied silicone element, a flow chart with the method steps for producing the carrier foil according to the invention, and a flow chart with FIG the process steps for producing a silicone element by means of the carrier film according to the invention in one

Pressing method.

DETAILED DESCRIPTION OF THE DRAWINGS

1 shows a schematic illustration of a cross section of a first pressing tool 100 in the opened state. The pressing tool 100 is composed of a plurality of pressing tool parts 101, 102, 103, wherein between an upper top mold part 101 and a lower pressing tool part 102, 103 (English bottom mold) in the closed state, a cavity 109 is formed. In the present case, the cavity 109 is formed by the upper pressing tool part 101 and the lower, inner pressing tool part 103. In the lower, inner pressing tool part 103, the cavity 109 is formed by means of a depression, which is bordered by a peripheral nose 104. The cavity 109 is designed in plan view, perpendicular to the plane of the drawing of FIG. 1, for example, circular. The lower, outer

Press tool part 102 is mounted springs in the present example by means of a suspension 105.

The illustrated pressing tool 100 is here only

by way of example and the present invention may be used in any type of pressing tool 100 with a different number and type of pressing tool parts. In particular, the cavity 109 may also be more than two

Pressing tool parts are limited. In particular, the circumferential nose 104 may also be omitted, so that the cavity 109 laterally through the lower, outer

Crimping tool 102 is limited. This is preferred

Pressing a compression molding (English compression molding), but the invention is also in a

Transfer molding process (English Transfer Molding) applicable.

On the lower die parts 102, 103 is a

Tool foil 110 (English Mold Release Foil) applied, which projects beyond the cavity 109 laterally. The tool foil 110 can mimic a shape of a part of the cavity 109 and / or of a lower pressing tool part 102, 103 defining the cavity 109. During the pressing, the tool foil 110 In particular, a shape of the cavity 109 that changes as a result of the pressing process also reproduce.

On the upper pressing tool part 101, a carrier foil 200 (English Carrier Foil) is applied. This is a different foil from the tool foil 110, which is preferably not deformed or not significantly deformed during the pressing. The carrier film 200 is particularly adapted to the one produced by the pressing process

Silicone element after pressing to wear. For example, the carrier film 200 is flat and planar. The carrier film 200 preferably lies at least indirectly on a flat surface of the upper tool part 101. The carrier film 200 in particular does not reform the cavity 109.

In the press tool 100 shown in FIG. 1, the carrier film 200 is adapted to be handled in a roll-to-roll process. The carrier foil 200 is replaced by one or more in FIG. 1

schematically shown first rollers 300 unrolled and introduced into the pressing tool 100. Subsequently, the

Carrier sheet 200 are rolled up on one or more second rollers 301 again. It is possible that also the

Tool film 110 is handled by a corresponding in Fig. 1 not dargstellten roll process. In this way, one or all of the foils used in the pressing process can be completely or partially replaced between two successive pressing operations in a simple manner.

Subsequently, a silicone matrix 400 on the

Tool film 110 and / or the carrier film 200 applied. Preferably, the silicone matrix 400 is applied within the cavity 109. The silicone matrix 400 is, for example, at least one polysilane, siloxane and / or polysiloxane. The silicone base material 400 represents a starting material for the silicone element to be produced. The silicone base material 400 is not fully cured and / or not completely crosslinked during application. Furthermore, the silicone matrix 400 during

Incorporating into the pressing tool 100 has a comparatively high viscosity and does not or does not significantly deteriorate. That is, the silicone matrix 400 does not self-delaminate on the tool foil 110 or the carrier foil 200.

In particular, the viscosity of the silicone base material during application may be at least 10 Pa.s or at least 20 Pa.s.

amount.

The silicone matrix 400 may, preferably homogeneously distributed, a conversion agent, for example in the form of

Be added conversion agent particles, not shown in the figures. The conversion agent is suitable for electromagnetic radiation in a first

At least partially absorbing the wavelength range and converting a radiation in a second wavelength range, which is different from the first wavelength range to convert. For example, the conversion means may be adapted to radiation in a wavelength range between

including 420 nm and 490 nm to absorb and convert to a longer wavelength radiation. The conversion agent particles have, for example, a

Rare-earth-doped garnets such as YAG: Ce, a rare-earth-doped orthosilicate such as (Ba, Sr ^ SiO 2 Si or a

Rare earth-doped silicon oxynitride or silicon nitride such as (Ba, Sr) 2 Si 5 Ng: Eu. A mean diameter of the For example, conversion agent particles are between

including 2 ym and 20 ym, especially between

including 3 ym and 15 ym. A percentage by weight of

Conversion agent particles on the whole of the

Silicone matrix 400 molded silicone element lies

in particular between 5% and 80% by weight, preferably between and including

10 percent by weight and 25 percent by weight or between 60 percent by weight and 80 percent by weight.

Optionally, the silicone base 400 further preferably particulate substances, for example, to increase the thermal conductivity of the silicone element or as

Diffuser particles, be added, preferably with a

Weight fraction between 0 percent by weight and 50 percent by weight inclusive. Such particles include or

consist in particular of oxides or metal fluorides such as alumina, silica or calcium fluoride. Average diameters of the particles are preferably between

including 2 ym and 20 ym.

The pressing tool 100 is then closed by, for example, as shown in Fig. 1 by the arrow B, the lower pressing tool parts 102, 103 on the upper

Pressing tool 101 are moved. Of course, the movement can also take place in other directions or on both sides.

2, the pressing tool 100 is shown in the closed state. When closing the pressing tool 100 presses the upper pressing tool part 101 on the nose 104 of the lower, inner pressing tool part 103, whereby the cavity 109 is closed. In an alternative embodiment of the pressing tool 100, in which the lower, inner Press tool part 103 is formed planar and without nose 104, the edge of the cavity 109 is formed by the lower, outer pressing tool part 102. In this case, when closing, the upper pressing tool part 101 presses on the spring-loaded lower, outer pressing tool part 102, which thereby yields, whereby the cavity 109 closes. The closing of the pressing tool 100 can be done under vacuum. It is also possible that the pressing tool 100 has not shown in the figures air outlets.

When closing the pressing tool 100, the tool foil 110 and the carrier foil 200 become directly adjacent to one another

pressed, whereby the cavity 109 is sealed. As a result of the pressing process, the silicone matrix 400 is converted into the shape of the cavity 109 and thus in the form of the silicone element 410

pressed. The silicone element 410 forming

Silicone base material is located substantially between the carrier foil 200 and the tool foil 110 and stands in

direct contact with them.

In the closed state of the pressing tool 100, the molded silicone element 410 is for example thermally or photochemically precured or fully cured. In a photochemical precuring or curing can

ultraviolet radiation, for example through the top

Press tool part 101 and through the carrier film 200 through the silicone element 410 are irradiated. It may be the molded silicone element 410 still closed

Pre-hardened pressing tool 100 and fully cured after the opening of the pressing tool 100. On the tool film are specific requirements for in particular the ductility, the tensile strength, the

Moldability and the surface texture provided. As a result, a choice of materials for the tool film is severely limited. In particular, it may be the case that the silicone film to be produced on the tool film has a comparatively strong adhesion after pressing, which is undesirable, since the silicone element 410 for the

Further processing should adhere exclusively to the carrier film 200. Preferred materials for the tool foil 110 are therefore, for example, ethylene tetrafluoroethylene (ETFE), perfluoroethylene propylene (FEP), polyether imide (PEI) or

Polytetrafluoroethylene (PTFE). The removal of the tool foil 210 may take place before or after the complete curing of the

Silicon element 410 done.

FIG. 3 shows the silicone element 410 removed from the pressing tool 100 and resting on the carrier foil 200. The tool foil 110 is already removed from the silicone element 410. This is made possible in particular by virtue of the fact that the silicone element has a stronger adhesion to the carrier film 200 than to the tool film 1.

Optionally, in a subsequent step, the silicone element 410 produced can still be used to form individual silicone platelets

be separated, for example by punching, cutting, water jet cutting, lasers. A size of the silicone platelets, seen in plan view, for example between

including 0.25 mm ^ and 4 mm ^, in particular between and including 1 mm ^ and 2 mm ^. From the separation, the carrier film may be affected. The silicone platelets can then, for example, as a converter element in a

optoelectronic semiconductor device find application. The Semiconductor component comprises at least one optoelectronic semiconductor chip, preferably a light emitting diode, short LED, which emits a maximum intensity, in particular in the wavelength range between 420 nm and 490 nm inclusive.

A mean thickness T of the silicone element 410 is preferably between 10 μιη and 1 mm or between

including 50 μιη and 150 μιη. A hardness of the fully cured silicone element 410 is in particular

between Shore A30 and Shore A90.

In the exemplary embodiment illustrated in FIGS. 1 and 2, the carrier film 200 is provided as a continuous web and handled by means of the described roll processes. In contrast, in Fig. 4, a second possible

Press tool 100 shown, in which the carrier film 200 is applied to a clamping ring 310. The clamping ring 310 can be used for the pressing operation in a corresponding groove 111 in the upper pressing tool part 101. For each pressing operation, the clamping ring 310 with the carrier foil 200 is then inserted manually or automatically into the pressing tool 100, removed after the pressing process and replaced by a new clamping ring 310 with carrier foil 200.

In Fig. 5, the clamping ring 310 with carrier film 200 after the

Pressing process with applied silicone element 410 is shown. The subsequent handling of the silicone element 410 corresponds to the already described handling in the event that the carrier film 200 is provided as a continuous web in a roll process. According to the present invention, the carrier film is configured such that after the pressing operation, the silicone element 410 adheres to the carrier film 200 and not to others

Components, for example on the tool foil. This is achieved by a special carrier film 200. In particular, according to the present invention, the carrier film 200 is surface-treated at least in a partial area such that the adhesive effect of the carrier film 200 is increased compared to silicone compared to the untreated surface of the carrier film.

In other words, according to the present invention, the carrier sheet 200 on the side in contact with the silicone member 410, i. on the side facing away from the upper pressing tool part 101, before the pressing process in such a way

Surface treated that the adhesion between the

Carrier film 200 and the silicone member 410 is increased.

The surface treatment of the carrier film 200 can be done either by roughening the carrier film 200 or by

Coating the carrier film 200. Furthermore, the

Carrier film 200 completely, i. on its entire surface, or only partially pretreated. In other words, the roughened or coated region can extend along the entire carrier foil 200 or extend only along partial regions of the carrier foil 200. Under

Surface treatment or pretreatment of the carrier film 200 is to be understood in the following both the roughening and the coating.

The possibilities of treatment of the carrier film 200 on the entire side facing the silicone element 410 or only on Subareas of this site can be found both at a

Carrier sheet 200 in the form of a continuous web for a reel process as well as a clamping ring on one

applied carrier film 200 find application.

If the carrier film 200 is treated only in partial areas, then a partial area or these can be several

In some embodiments, portions extend along the edge of the silicone member 410 to be applied.

In particular, when the silicone element 410 is applied, the edge region of the silicone element 410 overlaps the treated partial region. In other words, the shape of the

Subarea in each case the shape of the applied

Silicone element 410 according to or the shape of the edge of the

After applying silicone element 410 after. For example, in the case of a round silicone element 410, the partial region is annular and in the case of a square or

rectangular silicone element 410 frame-shaped. In this case, the partial region preferably projects beyond the edge of the silicone element 410 in the lateral direction, that is, both inwards and outwards. Lateral means in particular along

Main directions of extension of the produced

Silicone element 410. In other words, that

Silicon element 410, seen in plan view, partially or completely surrounded by the sub-area, in particular with a uniform width. Likewise, the overlap area between the portion and the silicone member 410 is

Top view, i. the area in which the silicone element 410 rests on the surface-treated area of a

uniform width.

In turn, since the silicone element 410 is pressed into the shape of the cavity 109 and thus simulates the shape of the cavity 109, it can also be said that in the plane described embodiment of the treated portion of the shape of the edge of the cavity 109 replicates and overlaps this in both lateral direction.

In a further embodiment, the partial region can also simulate the entire shape of the silicone element 410 to be applied so that the silicone element 410 in applied form rests completely on the treated partial region. Advantageously, the treated part region projects beyond the silicone element 410 in the lateral direction, that is to say the

treated part area has a larger area than that

Silikonelement 410. Vorteilhalfterweise is the area in which the portion of the overlying silicone element 410 surmounted by constant width and circumferentially around the entire silicone element 410. The portion may, depending on the shape of the silicone element 410, for example, be circular, rectangular or square.

As already mentioned above, since the silicone element 410 replicates the shape of the cavity 109, in other words it can also be said that the partial region corresponds to the shape of the cavity 109 and that it preferably overlaps in the lateral direction, ie. withstand the outside.

In order to ensure optimum adhesion of the silicone element 410 to the

To ensure carrier film 200, must be 5 "6 to 15

preferably 7% to 13%, in particular preferably 9-6 to 11, particularly preferably 10% of the surface of the silicone element 410 rest on the treated area. A lateral extent of the cavity 109 and thus also a lateral extent of the silicone element 410 is

for example between 50 mm and 500 mm inclusive, in particular between 60 mm and 200 mm inclusive, for example approximately 100 mm. The minimum constant width of the

Overlap area at the edge of the silicone element 410 between the treated portion of the carrier film 200 and the

Silicone element 410 is thus preferably between 2.5 mm and 75 mm, preferably between 3 mm and 50 mm, in particular preferably between 5 mm and 30 mm, particularly preferably between 6 mm and 20 mm.

With reference to FIGS. 6a and 6b, a first

Embodiment of a clamping ring 310th

applied carrier film 210 described, in which the surface-treated area extends only over a partial region of the carrier film 210. By way of example, in this case, a circular clamping ring 310 is shown, and a circular silicone element 410, the clamping ring 310 and the silicone element 410 can either individually or together form another shape, for example a square or rectangular shape

exhibit. In this case, the support film 210 is shown without silicone element 410 in Fig. 6a and in Fig. 6b with

applied silicone element 410. Fig. 6a shows a

Top view of the coming into contact with the silicone element side of the carrier film 210th

The carrier film 210 is here pretreated in a partial region 211 which extends along the edge 411 of FIG

silicone element 410 to be applied extends. The partial region 211 is, in the case of a circular silicone element 410, in particular annular. The partial region 211 preferably extends along the edge 212 of FIG Carrier film 210 and is arranged so that it with the

Silicone element 410 laterally overlapped in the applied state. This is illustrated in FIG. 6b, in which the silicone element 410 rests on the treated partial region 211 of the carrier foil 210 in a likewise annular edge region 412. Preferably, the partial region 211 is arranged such that the annular overlap region 412 has a constant width. The illustrated in Fig. 6b width D of

Overlap area 412 between silicone element 410 and

Carrier film 210 is thus preferably constant. Of the

Interior region 213 of the carrier film within treated portion 211 is not surface-treated and therefore has a lower adhesive effect on silicone than treated portion 211.

In other words, since the silicone element 410 simulates the shape of the cavity 109 of the pressing tool 100, the

treated portion 211 on the carrier sheet such

arranged that when inserted into the pressing tool 100 clamping ring, the edge 108 of the cavity 109 at least inwardly towards the outside, preferably laterally outwardly overlapped. As already explained, the edge 108 of the cavity 109 is formed either by the circumferential nose 104 or the lower, outer pressing tool part 102.

As an alternative to that shown in FIGS. 6a and 6b

In the exemplary embodiment, the pretreated partial area can simulate not only the shape of the edge of the silicone element 410, but the entire shape of the silicone element 410, so that the silicone element 410 rests completely on the treated area. In this case, the interior area 213 would then also be surface-treated. In Fig. 7a is a second embodiment of a

Carrier film 220 shown in which the entire with the

Silicone element 410 coming into contact side of the carrier film 220 is pretreated. FIG. 7b shows the carrier foil 220 with applied silicone element 410. FIGS. 7a and 7b show an example of a carrier foil 220 applied to a clamping ring 310, but of course it can also be a continuous one and a roll process

Carrier sheet 200 completely on the side provided for contact with the silicone element 410 side be treated. Furthermore, the silicone element 410 may be circular, rectangular, square or any desired shape.

In Fig. 8a is a third embodiment of a

Carrier sheet 230 shown, in which the carrier film 230 is a continuous web for a reel process and in which the surface is again treated only in partial areas 231. Preferably, the subregions 231 are arranged so that they respectively along the edge of the applied

Silicone element 410 extend, as shown in Fig. 8b, where the carrier film 230 is shown with applied silicone elements 410.

The shape of the subregions 231 forms the shape of the edge of the cavity 109 and thus the shape of the edge of the cavity

Silicone element 410 after. In the present example, the subregions 231 are annular, as well as the cavity 109 and thus the silicone element 410 are circular, however, the present invention is not limited to this form.

Rather, the subregions 231 may have any shape adapted to the cavity 109 or the silicone element 410, so that the treated portion 231 with the edge region of

Silicone element 410 overlap. For example, the subregions can also be frame-shaped and in this case a

square or rectangular shape of the silicone element 410 emulate. In this case, the partial regions 231 must also be arranged in this exemplary embodiment such that at least 5% to 15%, preferably 7% to 13%, in particular preferably 9% to 11%, particularly preferably 10%, of the silicone element 410 rest on the treated partial region 231. The width D of the overlapping area 412 shown in FIG. 8b

Silicone element 410 and carrier foil 230 is also again

preferably constant. In a continuous carrier film 230 for a reel process in this case, the individual

Subregions 231 are spaced apart from one another such that they can be positioned over the cavity 109 during unwinding and rolling up of the carrier foil 230, i. that the subregions 231 run along the edge 108 of the cavity 109 and overlap the edge 108 both laterally at least inwardly, and preferably also laterally outwards, i. over the edge of the cavity 109 and thus beyond the edge of the silicone element 410.

The exact positioning of the subregions 231 over the

Cavity 109 can be ensured by appropriate manual or automatic control of the reel process.

As an alternative to the exemplary embodiment in FIGS. 8a and 8b, the partial region may be as described in connection with FIGS. 6a and 6b

already explained, including the entire shape of the silicone element

410 imitate, so that the silicone element 410 rests completely on the treated area. The following is the method of making a

Carrier film 200, 210, 220, 230 according to the invention with reference to FIG. 9 explained in more detail.

The process begins in step SO. In the following step Sl, an untreated carrier film is provided,

preferably a carrier film made of polytetrafluoroethylene, PTFE for short. The carrier film may in this case already be applied to a clamping ring 310 or be present as a continuous web for a roll process.

In the following step S2, the treatment of at least a portion of the carrier film takes place. The areas or subregions in which this surface treatment can take place have already been explained. The surface treatment makes possible an active compound of mechanical and / or chemical nature between the treated surface of the carrier film and silicone, which results in an increased adhesive effect.

The treatment can be a roughening. The

Roughening can be carried out by means of an abrasive paper. Preferably, in this case, another takes place

then clean the roughened backing sheet to

Remove abrasive particles. Alternatively, the roughening can be done by means of an etching process, for example using PTFE etchants such as polytetra or tetra-etch. Another possibility for roughening the carrier film consists in a plasma treatment using argon plasma, oxygen plasma, ammonia plasma or

Nitrogen plasma, whereby the surface partially removed and / or activated. By roughening the

Surface of the carrier film 200 increases and thus achieves an increased adhesive effect.

At an average thickness of the silicone element 410 of ?? is a mean roughness of the surface 1 μιη to 50 μιη, preferably 5 μιη to 45 μιτι, particularly preferably 10 μιη to 40 μιτι, more preferably 20 μιη to 30 μιη. The

Roughening can be in the form of groove-shaped, for example

Structures exist or in the form of distributed, individual approximately circular depressions. The roughening depth thus reflects the mean depth of the grooves or depressions.

Alternatively, the carrier film to increase the adhesion to silicone may also be coated with an adhesion-promoting layer. For example, by means of a

Plasma treatment, a layer deposited on the carrier film. By means of the plasma coating, individual molecules can also be incorporated into the surface of the carrier film 200. Possible materials for this are Si0 ₂ , TiN or any other material for plasma coating. Alternatively, an adhesion promoter layer, for example of polysilane or spin on glass, can be applied by means of spin coating (English: spin coating). Also by means of

Rotation coating can be applied to a silicone layer, which is fully cured before the pressing process, so that the adhesion of the silicone layer to the carrier film is higher than the silicone element to be applied 410th In the following step S3, the treated carrier film can then be provided for the pressing operation and, for example, inserted or introduced into the pressing tool 100.

The process ends in step S4.

With reference to FIG. 10, a method for

Producing a silicone element 410 in a pressing process using a carrier film according to the invention described.

The process starts in step S5. In the first step S6, a surface-treated carrier film 200, 210, 220, 230 is provided which has an increased adhesion to silicone in the treated area than in untreated form, i. which is at least partially roughened or coated with the silicone element 410 in coming page.

In the following step S 7, the carrier film is in a

Pressing tool 100 introduced. In particular, in this case in the case of only partially treated carrier film of the

treated portion is positioned so that it rotates at the edge of the cavity 109.

In the following step S8, the silicone matrix 400 is introduced into the cavity 109. Subsequently, in step S9, the

Press tool 100 is closed and the silicone element 410 produced by pressing, preferably compression molding. Here, the silicone element 410 is at least partially on the

surface treated area. In the following step S10 the carrier film 200, 210, 220, 230 with the pressed-on silicone element 410 is removed from the pressing tool 100. The inventive carrier film 200, 210, 220, 230 with optimized adhesion properties, the silicone element 410 adheres to the carrier film 200, 210, 220, 230 and not to other components, for example to the tool film 110. An additional provision of a release agent between

Tool film 110 and silicone element 410 can therefore be omitted.

In the following step Sil, the silicone element 410

processed and detached from the carrier film. In particular, for example, a separation can be done in silicone platelets. Finally, the silicone element 410 may optionally be in the form of silicone platelets in an optoelectronic

Semiconductor device can be introduced.

As a result of the carrier film according to the invention, the adhesion between the silicone element 410 and the carrier film is increased so much that the pressing tool 100 can be moved to the machine-side maximum possible clamping force. So far, when a clamping force of 20 kN was exceeded, adhesion between the silicone element 410 and the carrier film 200 no longer existed, but the silicone element 410 adhered to the

Tool film 110 or other components. With the

Carrier film according to the invention can now also higher

Clamping forces of, for example 60 kN or even to

maximum clamping force of, for example, 200 kN can be used. This is of particular importance, as can be significantly improved by higher clamping forces of the process result, since tool-side tolerances such as tilting of the

Press tool parts and machine tolerances better

can be compensated. In addition, higher clamping forces lead to a much more homogeneous distribution of the silicone base material 400 in the cavity 109, which in turn is lower

Thickness variations within the silicone element 410 and thus in the case of use as a conversion element has a lower target Farbortstreuung result. For example, using the carrier film according to the invention is

Variation of the thickness over the entire silicone element 410 away less than 10 μιη. This is for example a very uniform conversion of radiation through from the

Silicon element produced silicone platelets with

Conversion agent particles feasible.

FINAL FINDING

The optoelectronic semiconductor device and the method for producing an optoelectronic semiconductor device have been described to illustrate the underlying idea based on some embodiments. The

Embodiments are not specific

Characteristic combinations limited. Although some features and configurations have been described only in connection with a particular embodiment or individual embodiments, they may each be combined with other features from other embodiments. It is also possible to omit or add in individual embodiments illustrated features or particular embodiments, as far as the general technical teaching

realized remains.

Although the steps of the method of fabricating an optoelectronic semiconductor device are described in a particular order, it is to be understood that any of the methods described in this disclosure may be performed in any other meaningful order, including but not limited to method steps can be added, as far as not deviated from the basic idea of the technical teaching described.

LIST OF REFERENCE NUMBERS

100 pressing tool

101 upper pressing tool part

102 lower, outer pressing tool part

103 lower, inner pressing tool part

104 circumferential nose

105 suspension

108 edge of the cavity 109

109 cavity

110 tool foil

111 groove

200 carrier foil

210 carrier film according to a first embodiment

211 subarea

212 edge of the carrier film

213 untreated interior

220 carrier film according to a second embodiment

230 carrier film according to a third embodiment

300 first roll

301 second roll

310 clamping ring

400 silicone base ₄ silicone element

Edge of the silicone element 410

annular edge region of the silicone element 410

Claims

1. carrier film (200, 210, 220, 230) for receiving a

Silicone element (410) in a pressing process, wherein the carrier film (200, 210, 220, 230) at least in a partial area (211, 231) is surface-treated such that the adhesion to silicone in the treated area is increased.

2. Carrier film (200, 210, 220, 230) according to claim 1, wherein the treated area completely along

at least one side of the carrier film (200, 220) extends.

3. carrier film (200, 210, 230) according to claim 1, wherein the shape of the portion (211, 231) simulates the shape of the applied silicone element (410) and / or wherein the portion (211, 231) in particular circular, square or rectangular is.

4. carrier film (200, 210, 230) according to claim 1, wherein the shape of the portion (211, 231) imitates the shape of the edge of the applied silicone element (410) and / or wherein the portion (211, 231) in particular annular or frame-shaped is.

5. carrier film (200, 210, 220, 230) according to any one of the preceding claims, wherein the carrier film (200, 210, 220, 230) in the

surface-treated area (211, 231) is roughened.

6. carrier film (200, 210, 220, 230) according to claim 5, wherein the Aufrautiefe 1 μιη to 50 μιτι, preferably 5 μιη to 45 μιη, especially preferably 10 μιη to 40 μιτι, more preferably 20 μιη to 30 μιη.

7. carrier film (200, 210, 220, 230) according to one of claims 1 to 4, wherein the carrier film (200, 210, 220, 230) in the

surface treated area (211, 231) having a

adhesion-promoting coating is coated and the

Coating preferably a primer coating, a plasma coating or a cured

Silicone coating is.

8. carrier film (200, 210, 220, 230) according to one of

preceding claims, wherein the carrier foil (200, 210, 220, 230) is larger than the silicone element (410) to be applied.

9. System of a carrier film (200, 210, 220, 230) according to one of the preceding claims and one on the

Carrier film (200, 210, 220, 230) applied silicone element (410), wherein the silicone element (410) completely on the Carrier film (200, 210, 220, 230) rests, wherein in particular the carrier film (200, 210, 220, 230) projects beyond the silicone element (410) in the lateral direction.

10. System according to claim 9, wherein at least the edge region (412) of the silicone element (410) rests on the surface-treated area (211, 213).

A system according to claim 9 or 10, wherein at least 5% to 15%, preferably 7% to 13%,

in particular preferably 9% to 11%, particularly preferably 10% of the area of the silicone element (410) on the

surface treated area (211, 213) rests.

12. A method for producing a carrier film (200, 210, 220, 230) which is suitable for receiving a silicone element (410) in a pressing process, comprising the steps of providing (S1) a carrier film (200, 210, 220, 230) and

Treating (S2) the surface of the carrier film (200, 210, 220, 230) at least in a partial region (231, 211) in such a way that the adhesive effect on silicone in the treated region is increased.

13. The method according to claim 12, wherein the step of treating (S2) the surface is by roughening, preferably by means of etching, by plasma treatment or by grinding.

14. The method according to claim 12, wherein the step of treating the surface (S2) is carried out by coating with an adhesion-promoting coating, preferably the step of coating comprises applying a plasma coating, a primer coating or a cured silicone coating.

15. A method for producing a silicone element (410) by means of a carrier film (200, 210, 220, 230) in one

A pressing method, wherein the silicone member (410) is suitable for use in an optoelectronic semiconductor device, comprising the steps

Providing (S6) a carrier film for receiving a

Silicone element (410), wherein the carrier film (200, 210, 220, 230) is surface-treated in at least a partial region (211, 231) in such a way that the adhesive effect on silicone in the treated region is increased,

Introducing (S7) the carrier foil (200, 210, 220, 230)

Pressing tool (100),

Introducing (S8) a silicone compound (400) into the pressing tool (100), Close (S9) the pressing tool and press on the

Silicone compound (400) on the carrier foil (200, 210, 220, 230) to form a silicone element (410), wherein the

Silicone element (410) at least partially on the

surface-treated area rests,

Opening the pressing tool (100), and

Removing (S10) the carrier film (200, 210, 220, 230) with the silicone element from the pressing tool (100).