WO2013021024A3 - Carrier film for a silicon element and method for producing a carrier film for a silicon element - Google Patents

Carrier film for a silicon element and method for producing a carrier film for a silicon element Download PDF

Info

Publication number
WO2013021024A3
WO2013021024A3 PCT/EP2012/065565 EP2012065565W WO2013021024A3 WO 2013021024 A3 WO2013021024 A3 WO 2013021024A3 EP 2012065565 W EP2012065565 W EP 2012065565W WO 2013021024 A3 WO2013021024 A3 WO 2013021024A3
Authority
WO
WIPO (PCT)
Prior art keywords
carrier film
silicon element
producing
treated
silicon
Prior art date
Application number
PCT/EP2012/065565
Other languages
German (de)
French (fr)
Other versions
WO2013021024A2 (en
Inventor
Markus Boss
Martin Brandl
Tobias Geltl
Markus Pindl
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of WO2013021024A2 publication Critical patent/WO2013021024A2/en
Publication of WO2013021024A3 publication Critical patent/WO2013021024A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02322—Optical elements or arrangements associated with the device comprising luminescent members, e.g. fluorescent sheets upon the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Silicon Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention relates to a carrier film (200, 210, 220, 230) for accommodating a silicon element (410) in a pressing method, wherein the carrier film (200, 210, 220, 230) is surface-treated at least in a sub-area (211, 231) in such a way that the adhesive effect with respect to silicon is increased in the treated area. The invention further relates to a system comprising a surface-treated carrier film (200, 210, 220, 230) and a silicon element (410) applied to the carrier film (200, 210, 220, 230), wherein the silicon element (410) lies at least partially on the surface-treated area (211, 213).
PCT/EP2012/065565 2011-08-09 2012-08-09 Carrier film for a silicon element and method for producing a carrier film for a silicon element WO2013021024A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011080653A DE102011080653A1 (en) 2011-08-09 2011-08-09 CARRIER FOIL FOR A SILICONE ELEMENT AND METHOD FOR PRODUCING A CARRIER FOIL FOR A SILICONE ELEMENT
DE102011080653.9 2011-08-09

Publications (2)

Publication Number Publication Date
WO2013021024A2 WO2013021024A2 (en) 2013-02-14
WO2013021024A3 true WO2013021024A3 (en) 2013-04-04

Family

ID=46763039

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/065565 WO2013021024A2 (en) 2011-08-09 2012-08-09 Carrier film for a silicon element and method for producing a carrier film for a silicon element

Country Status (2)

Country Link
DE (1) DE102011080653A1 (en)
WO (1) WO2013021024A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012216552A1 (en) * 2012-09-17 2014-03-20 Osram Gmbh LED lighting device manufacturing method, involves covering LED chip with converter layer, filling matrix material in converter layer, roughening surface of LED chip, and applying adhesion promoter on surface of LED chip
DE102015111336A1 (en) * 2015-07-13 2017-01-19 CONTTEK Holding GmbH Coating of stampings using plasma coating techniques

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0383251A2 (en) * 1989-02-17 1990-08-22 Hoechst Aktiengesellschaft Method and device for evening rough, structured or heterogeneous surfaces
WO2003096408A1 (en) * 2002-05-14 2003-11-20 Fico B.V. Method for encapsulating an electronic component using a foil layer
US20050046021A1 (en) * 2003-08-26 2005-03-03 Kazuhito Hosokawa Adhesive sheet for producing a semiconductor device
DE102006000687A1 (en) * 2006-01-03 2007-07-12 Thallner, Erich, Dipl.-Ing. Combination of a carrier and a wafer
DE102008033651A1 (en) * 2007-07-20 2009-01-22 Infineon Technologies Ag Apparatus and method for manufacturing semiconductor devices
US20100140654A1 (en) * 2005-07-25 2010-06-10 Sony Chemical & Information Device Corporation Light emitting element module and method for sealing light emitting element
EP2200105A2 (en) * 2008-12-16 2010-06-23 tesa SE Method for encapsulation of an electronic assembly

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010047454A1 (en) * 2010-10-04 2012-04-05 Osram Opto Semiconductors Gmbh Process for producing a silicone film, silicone film and optoelectronic semiconductor component with a silicone film

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0383251A2 (en) * 1989-02-17 1990-08-22 Hoechst Aktiengesellschaft Method and device for evening rough, structured or heterogeneous surfaces
WO2003096408A1 (en) * 2002-05-14 2003-11-20 Fico B.V. Method for encapsulating an electronic component using a foil layer
US20050046021A1 (en) * 2003-08-26 2005-03-03 Kazuhito Hosokawa Adhesive sheet for producing a semiconductor device
US20100140654A1 (en) * 2005-07-25 2010-06-10 Sony Chemical & Information Device Corporation Light emitting element module and method for sealing light emitting element
DE102006000687A1 (en) * 2006-01-03 2007-07-12 Thallner, Erich, Dipl.-Ing. Combination of a carrier and a wafer
DE102008033651A1 (en) * 2007-07-20 2009-01-22 Infineon Technologies Ag Apparatus and method for manufacturing semiconductor devices
EP2200105A2 (en) * 2008-12-16 2010-06-23 tesa SE Method for encapsulation of an electronic assembly

Also Published As

Publication number Publication date
DE102011080653A1 (en) 2013-02-14
WO2013021024A2 (en) 2013-02-14

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