WO2013021024A2 - Feuille support pour un élément en silicone et procédé de production d'une feuille support pour un élément en silicone - Google Patents

Feuille support pour un élément en silicone et procédé de production d'une feuille support pour un élément en silicone Download PDF

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Publication number
WO2013021024A2
WO2013021024A2 PCT/EP2012/065565 EP2012065565W WO2013021024A2 WO 2013021024 A2 WO2013021024 A2 WO 2013021024A2 EP 2012065565 W EP2012065565 W EP 2012065565W WO 2013021024 A2 WO2013021024 A2 WO 2013021024A2
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WO
WIPO (PCT)
Prior art keywords
carrier film
silicone
silicone element
coating
treated
Prior art date
Application number
PCT/EP2012/065565
Other languages
German (de)
English (en)
Other versions
WO2013021024A3 (fr
Inventor
Markus Boss
Martin Brandl
Tobias Geltl
Markus Pindl
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of WO2013021024A2 publication Critical patent/WO2013021024A2/fr
Publication of WO2013021024A3 publication Critical patent/WO2013021024A3/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02322—Optical elements or arrangements associated with the device comprising luminescent members, e.g. fluorescent sheets upon the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil

Definitions

  • the present invention relates to a carrier film for
  • a pressing method wherein the silicone member is suitable for use in an optoelectronic semiconductor device.
  • the present invention relates to a
  • Carrier film for receiving a silicone element which, for example in the form of isolated silicone platelets as a radiation conversion element in an optoelectronic
  • An example of an optoelectronic semiconductor component has an electrically contacted semiconductor chip with a radiation conversion element, wherein the semiconductor chip and the radiation conversion element in a potting compound
  • the semiconductor chip emits during operation a primary radiation and in the
  • Radiation conversion element a part of the primary radiation is converted into a secondary radiation of different wavelengths.
  • Semiconductor component results from the superposition of the radiation transmitted by the radiation element primary radiation and the generated secondary radiation. That's the way to go in particular provide light sources that emit a white light.
  • Radiation conversion element is in this case separately from the
  • Semiconductor chip produced and then applied by suitable methods to the semiconductor chip and possibly embedded in a housing.
  • the present invention is therefore based on the object to improve the known prior art.
  • Silicone element and a method for producing a
  • the present invention relates to a carrier film for
  • Silicone element can be achieved on the carrier film.
  • the treated area extends completely along at least one side of the
  • the carrier film can be positioned as desired relative to the silicone element to be applied, since at each point the carrier film has an increased adhesive effect
  • the shape of the partial region imitates the shape of the silicone element to be applied and / or the partial region is in particular circular, square or rectangular. Because only a portion of the carrier film
  • the shape of the partial region forms the shape of the edge of the silicone element to be applied and / or the partial region is in particular annular or frame-shaped.
  • Subregion of the carrier film is surface-treated.
  • Silicone element is achieved.
  • the portion to be treated can be further reduced, and on the other hand, a detachment of the silicone element, if desired in later method steps, is facilitated since the increased adhesive effect occurs only at the edge of the silicone element.
  • an increased adhesion during the pressing process and subsequent steps is thus ensured with the simultaneous possibility of easy detachment at a desired time.
  • the carrier film is a
  • PTFE film Polytetrafluoroethylene film (PTFE film).
  • a PTFE film meets all requirements for use in one
  • the carrier foil is in the
  • Another advantage is the possibility of a simple quality control, for example by roughness measurements or the like. .
  • the roughening depth is 1 ⁇ to 50 ⁇ ,
  • roughening depth must be high enough to ensure the increased adhesion to silicone, but at the same time it must be low enough to allow a later intentional detachment of the silicone element.
  • the roughening depth in the case that the silicone element is used as a converter-filled radiation conversion element a maximum value should not exceed, otherwise due to the thickness differences in the silicone element a
  • the broiling depth according to the invention is thus based on the knowledge of how the adhesion, especially with respect to silicone, is sufficient
  • the carrier foil is in the
  • Coating coated and the coating preferably a primer coating, a plasma coating or a cured silicone coating.
  • the advantage of a coating is for example in a high
  • the uniformity of the coating can be optimally ensured.
  • the possibility of using different coating materials offers a high variability of the coating, so that the coating can be adapted specifically to the respective requirements.
  • a very uniform surface can be achieved so that the coating topology does not subsequently imitate in the silicone element produced.
  • the carrier film is larger than the silicone element to be applied. This makes it possible that the silicone element completely on the carrier film.
  • Carrier film can be changed accordingly and stick to other components and thus a difficult
  • the invention further relates to a system comprising a carrier film according to the invention and a silicone element applied to the carrier film, wherein the silicone element
  • Carrier film and does not adhere to other components.
  • the silicone element lies at least partially on the surface-treated area.
  • the edge region of the silicone element rests on the surface-treated area.
  • the knowledge is used that a sticking of an entire silicone element to the carrier film in particular by an improved adhesion is achieved at the edge region of the silicone element.
  • the portion to be treated can be further reduced, on the other hand, a detachment of the silicone element, if in later
  • Pressing method and subsequent steps ensured at the same time the possibility of easy removal at a desired time.
  • Carrier film allows at a later date.
  • the present invention further relates to a method for producing a carrier film, which is suitable for receiving a silicone element in a pressing process,
  • Partial area such that the adhesion to silicone in the treated area is increased.
  • Silicone element can be achieved on the carrier film.
  • the step of treating the surface is carried out by roughening, preferably by means of etching, by means of a plasma treatment or by means of
  • the step of treating the surface is carried out by coating with an adhesion-promoting coating, preferably the step of
  • Silicone coating The advantage of a coating is for example in a high reproducibility and thus consistent quality. Furthermore, the
  • Coating materials offer a high variability of the coating, so that the coating can be tailored to the particular requirements. Depending on
  • Coating process and / or coating material can be achieved a very uniform surface, so that the coating topology is not hereinafter in the
  • the present invention further relates to a method for producing a silicone element by means of a
  • Carrier film in a pressing process wherein the silicone element is suitable for use in an optoelectronic semiconductor device, comprising the steps of providing a carrier film for receiving a silicone element, wherein the carrier film at least in a partial area such
  • Carrier film for forming a silicone element wherein the
  • Silicone element at least partially on the
  • Clamping forces can be used during the pressing process, because the adhesive effect, even at higher clamping forces, ensures adherence of the silicone element to the carrier foil and not to other components.
  • clamping forces can be better compensated for on the tool side by tolerances, such as, for example, tilting.
  • higher clamping forces lead to a more homogeneous distribution of the silicone mass in the mold cavity, which in turn results in lower thickness variations of the silicone element produced.
  • the thickness is especially in the case of converter-filled Silicon elements, which are used as a radiation conversion element in a semiconductor optoelectronic device, of importance, since with a constant thickness, a lower target Farbortstreuung is achieved.
  • Fig.l is a schematic representation of a cross section
  • FIG. 2 shows a schematic representation of a cross section of the closed first pressing tool with the carrier foil according to the invention
  • Fig. 3 is a schematic representation of the invention
  • Fig. 4 is a schematic representation of a cross section
  • carrier film according to the invention a schematic representation of the carrier film according to the invention with applied silicone element, a plan view of a carrier film according to a first embodiment without silicone element, a plan view of the carrier film of FIG. 6a with applied silicone element, a plan view of a carrier film according to a second embodiment without silicone element, a plan view 7a with applied silicone element, a plan view of a carrier foil according to a second exemplary embodiment without silicone element, a plan view of the carrier foil according to FIG. 7a with applied silicone element, a flow chart with the method steps for producing the carrier foil according to the invention, and a flow chart with FIG the process steps for producing a silicone element by means of the carrier film according to the invention in one
  • the pressing tool 100 is composed of a plurality of pressing tool parts 101, 102, 103, wherein between an upper top mold part 101 and a lower pressing tool part 102, 103 (English bottom mold) in the closed state, a cavity 109 is formed.
  • the cavity 109 is formed by the upper pressing tool part 101 and the lower, inner pressing tool part 103.
  • the cavity 109 is formed by means of a depression, which is bordered by a peripheral nose 104.
  • the cavity 109 is designed in plan view, perpendicular to the plane of the drawing of FIG. 1, for example, circular.
  • Press tool part 102 is mounted springs in the present example by means of a suspension 105.
  • the illustrated pressing tool 100 is here only
  • the present invention may be used in any type of pressing tool 100 with a different number and type of pressing tool parts.
  • the cavity 109 may also be more than two
  • circumferential nose 104 may also be omitted, so that the cavity 109 laterally through the lower, outer
  • Crimping tool 102 is limited. This is preferred
  • Tool foil 110 (English Mold Release Foil) applied, which projects beyond the cavity 109 laterally.
  • the tool foil 110 can mimic a shape of a part of the cavity 109 and / or of a lower pressing tool part 102, 103 defining the cavity 109.
  • the tool foil 110 In particular, a shape of the cavity 109 that changes as a result of the pressing process also reproduce.
  • a carrier foil 200 (English Carrier Foil) is applied on the upper pressing tool part 101. This is a different foil from the tool foil 110, which is preferably not deformed or not significantly deformed during the pressing.
  • the carrier film 200 is particularly adapted to the one produced by the pressing process
  • the carrier film 200 is flat and planar.
  • the carrier film 200 preferably lies at least indirectly on a flat surface of the upper tool part 101.
  • the carrier film 200 in particular does not reform the cavity 109.
  • the carrier film 200 is adapted to be handled in a roll-to-roll process.
  • the carrier foil 200 is replaced by one or more in FIG. 1
  • Carrier sheet 200 are rolled up on one or more second rollers 301 again. It is possible that also the
  • Tool film 110 is handled by a corresponding in Fig. 1 not darg Robinsonen roll process. In this way, one or all of the foils used in the pressing process can be completely or partially replaced between two successive pressing operations in a simple manner.
  • the silicone matrix 400 is applied within the cavity 109.
  • the silicone matrix 400 is, for example, at least one polysilane, siloxane and / or polysiloxane.
  • the silicone base material 400 represents a starting material for the silicone element to be produced.
  • the silicone base material 400 is not fully cured and / or not completely crosslinked during application. Furthermore, the silicone matrix 400 during
  • Incorporating into the pressing tool 100 has a comparatively high viscosity and does not or does not significantly deteriorate. That is, the silicone matrix 400 does not self-delaminate on the tool foil 110 or the carrier foil 200.
  • the viscosity of the silicone base material during application may be at least 10 Pa.s or at least 20 Pa.s.
  • the silicone matrix 400 may, preferably homogeneously distributed, a conversion agent, for example in the form of
  • the conversion agent is suitable for electromagnetic radiation in a first
  • the conversion means may be adapted to radiation in a wavelength range between
  • the conversion agent particles include 420 nm and 490 nm to absorb and convert to a longer wavelength radiation.
  • the conversion agent particles have, for example, a
  • Rare-earth-doped garnets such as YAG: Ce, a rare-earth-doped orthosilicate such as (Ba, Sr ⁇ SiO 2 Si or a
  • Rare earth-doped silicon oxynitride or silicon nitride such as (Ba, Sr) 2 Si 5 Ng: Eu.
  • Silicone matrix 400 molded silicone element lies
  • the silicone base 400 further preferably particulate substances, for example, to increase the thermal conductivity of the silicone element or as
  • Diffuser particles be added, preferably with a
  • Such particles include or
  • the particles consist in particular of oxides or metal fluorides such as alumina, silica or calcium fluoride. Average diameters of the particles are preferably between
  • the pressing tool 100 is then closed by, for example, as shown in Fig. 1 by the arrow B, the lower pressing tool parts 102, 103 on the upper
  • Pressing tool 101 are moved.
  • the movement can also take place in other directions or on both sides.
  • the pressing tool 100 is shown in the closed state.
  • the pressing tool 100 presses the upper pressing tool part 101 on the nose 104 of the lower, inner pressing tool part 103, whereby the cavity 109 is closed.
  • the edge of the cavity 109 is formed by the lower, outer pressing tool part 102.
  • the upper pressing tool part 101 presses on the spring-loaded lower, outer pressing tool part 102, which thereby yields, whereby the cavity 109 closes.
  • the closing of the pressing tool 100 can be done under vacuum. It is also possible that the pressing tool 100 has not shown in the figures air outlets.
  • the silicone matrix 400 is converted into the shape of the cavity 109 and thus in the form of the silicone element 410
  • Silicone base material is located substantially between the carrier foil 200 and the tool foil 110 and stands in
  • the molded silicone element 410 is for example thermally or photochemically precured or fully cured.
  • a photochemical precuring or curing can be any photochemical precuring or curing.
  • Press tool part 101 and through the carrier film 200 through the silicone element 410 are irradiated. It may be the molded silicone element 410 still closed
  • Pre-hardened pressing tool 100 and fully cured after the opening of the pressing tool 100 are specific requirements for in particular the ductility, the tensile strength, the
  • Preferred materials for the tool foil 110 are therefore, for example, ethylene tetrafluoroethylene (ETFE), perfluoroethylene propylene (FEP), polyether imide (PEI) or
  • PTFE Polytetrafluoroethylene
  • Silicon element 410 done.
  • FIG. 3 shows the silicone element 410 removed from the pressing tool 100 and resting on the carrier foil 200.
  • the tool foil 110 is already removed from the silicone element 410. This is made possible in particular by virtue of the fact that the silicone element has a stronger adhesion to the carrier film 200 than to the tool film 1.
  • the silicone element 410 produced can still be used to form individual silicone platelets
  • the carrier film may be affected.
  • the silicone platelets can then, for example, as a converter element in a
  • the Semiconductor component comprises at least one optoelectronic semiconductor chip, preferably a light emitting diode, short LED, which emits a maximum intensity, in particular in the wavelength range between 420 nm and 490 nm inclusive.
  • a mean thickness T of the silicone element 410 is preferably between 10 ⁇ and 1 mm or between
  • a hardness of the fully cured silicone element 410 is in particular
  • the carrier film 200 is provided as a continuous web and handled by means of the described roll processes.
  • Press tool 100 shown in which the carrier film 200 is applied to a clamping ring 310.
  • the clamping ring 310 can be used for the pressing operation in a corresponding groove 111 in the upper pressing tool part 101.
  • the clamping ring 310 with the carrier foil 200 is then inserted manually or automatically into the pressing tool 100, removed after the pressing process and replaced by a new clamping ring 310 with carrier foil 200.
  • the subsequent handling of the silicone element 410 corresponds to the already described handling in the event that the carrier film 200 is provided as a continuous web in a roll process.
  • the carrier film is configured such that after the pressing operation, the silicone element 410 adheres to the carrier film 200 and not to others
  • the carrier film 200 is surface-treated at least in a partial area such that the adhesive effect of the carrier film 200 is increased compared to silicone compared to the untreated surface of the carrier film.
  • Carrier film 200 and the silicone member 410 is increased.
  • the surface treatment of the carrier film 200 can be done either by roughening the carrier film 200 or by
  • Carrier film 200 completely, i. on its entire surface, or only partially pretreated.
  • the roughened or coated region can extend along the entire carrier foil 200 or extend only along partial regions of the carrier foil 200.
  • Carrier sheet 200 in the form of a continuous web for a reel process as well as a clamping ring on one
  • applied carrier film 200 find application.
  • the carrier film 200 is treated only in partial areas, then a partial area or these can be several
  • portions extend along the edge of the silicone member 410 to be applied.
  • the edge region of the silicone element 410 overlaps the treated partial region.
  • Silicone element 410 according to or the shape of the edge of the
  • the partial region is annular and in the case of a square or
  • the partial region preferably projects beyond the edge of the silicone element 410 in the lateral direction, that is, both inwards and outwards. Lateral means in particular along
  • Silicon element 410 seen in plan view, partially or completely surrounded by the sub-area, in particular with a uniform width. Likewise, the overlap area between the portion and the silicone member 410 is
  • Top view i. the area in which the silicone element 410 rests on the surface-treated area of a
  • the silicone element 410 is pressed into the shape of the cavity 109 and thus simulates the shape of the cavity 109, it can also be said that in the plane described embodiment of the treated portion of the shape of the edge of the cavity 109 replicates and overlaps this in both lateral direction.
  • the partial region can also simulate the entire shape of the silicone element 410 to be applied so that the silicone element 410 in applied form rests completely on the treated partial region.
  • the treated part region projects beyond the silicone element 410 in the lateral direction, that is to say the
  • treated part area has a larger area than that
  • Silikonelement 410 is the area in which the portion of the overlying silicone element 410 surmounted by constant width and circumferentially around the entire silicone element 410.
  • the portion may, depending on the shape of the silicone element 410, for example, be circular, rectangular or square.
  • the silicone element 410 replicates the shape of the cavity 109, in other words it can also be said that the partial region corresponds to the shape of the cavity 109 and that it preferably overlaps in the lateral direction, ie. withstand the outside.
  • a lateral extent of the cavity 109 and thus also a lateral extent of the silicone element 410 is
  • Silicone element 410 is thus preferably between 2.5 mm and 75 mm, preferably between 3 mm and 50 mm, in particular preferably between 5 mm and 30 mm, particularly preferably between 6 mm and 20 mm.
  • a circular clamping ring 310 is shown, and a circular silicone element 410, the clamping ring 310 and the silicone element 410 can either individually or together form another shape, for example a square or rectangular shape
  • the support film 210 is shown without silicone element 410 in Fig. 6a and in Fig. 6b with
  • Fig. 6a shows a
  • the carrier film 210 is here pretreated in a partial region 211 which extends along the edge 411 of FIG.
  • the silicone element 410 to be applied extends.
  • the partial region 211 is, in the case of a circular silicone element 410, in particular annular.
  • the partial region 211 preferably extends along the edge 212 of FIG Carrier film 210 and is arranged so that it with the
  • Silicone element 410 laterally overlapped in the applied state. This is illustrated in FIG. 6b, in which the silicone element 410 rests on the treated partial region 211 of the carrier foil 210 in a likewise annular edge region 412.
  • the partial region 211 is arranged such that the annular overlap region 412 has a constant width.
  • Carrier film 210 is thus preferably constant.
  • Interior region 213 of the carrier film within treated portion 211 is not surface-treated and therefore has a lower adhesive effect on silicone than treated portion 211.
  • the silicone element 410 simulates the shape of the cavity 109 of the pressing tool 100
  • the edge 108 of the cavity 109 when inserted into the pressing tool 100 clamping ring, the edge 108 of the cavity 109 at least inwardly towards the outside, preferably laterally outwardly overlapped.
  • the edge 108 of the cavity 109 is formed either by the circumferential nose 104 or the lower, outer pressing tool part 102.
  • the pretreated partial area can simulate not only the shape of the edge of the silicone element 410, but the entire shape of the silicone element 410, so that the silicone element 410 rests completely on the treated area.
  • the interior area 213 would then also be surface-treated.
  • Fig. 7a is a second embodiment of a
  • Carrier film 220 shown in which the entire with the
  • FIG. 7b shows the carrier foil 220 with applied silicone element 410.
  • FIGS. 7a and 7b show an example of a carrier foil 220 applied to a clamping ring 310, but of course it can also be a continuous one and a roll process
  • Carrier sheet 200 completely on the side provided for contact with the silicone element 410 side be treated.
  • the silicone element 410 may be circular, rectangular, square or any desired shape.
  • Fig. 8a is a third embodiment of a
  • Carrier sheet 230 shown in which the carrier film 230 is a continuous web for a reel process and in which the surface is again treated only in partial areas 231.
  • the subregions 231 are arranged so that they respectively along the edge of the applied
  • Silicone element 410 extend, as shown in Fig. 8b, where the carrier film 230 is shown with applied silicone elements 410.
  • the shape of the subregions 231 forms the shape of the edge of the cavity 109 and thus the shape of the edge of the cavity
  • Silicone element 410 after.
  • the subregions 231 are annular, as well as the cavity 109 and thus the silicone element 410 are circular, however, the present invention is not limited to this form.
  • the subregions 231 may have any shape adapted to the cavity 109 or the silicone element 410, so that the treated portion 231 with the edge region of
  • Silicone element 410 overlap.
  • the subregions can also be frame-shaped and in this case a
  • the partial regions 231 must also be arranged in this exemplary embodiment such that at least 5% to 15%, preferably 7% to 13%, in particular preferably 9% to 11%, particularly preferably 10%, of the silicone element 410 rest on the treated partial region 231.
  • Silicone element 410 and carrier foil 230 is also again again
  • Subregions 231 are spaced apart from one another such that they can be positioned over the cavity 109 during unwinding and rolling up of the carrier foil 230, i. that the subregions 231 run along the edge 108 of the cavity 109 and overlap the edge 108 both laterally at least inwardly, and preferably also laterally outwards, i. over the edge of the cavity 109 and thus beyond the edge of the silicone element 410.
  • Cavity 109 can be ensured by appropriate manual or automatic control of the reel process.
  • the partial region may be as described in connection with FIGS. 6a and 6b
  • Carrier film 200, 210, 220, 230 according to the invention with reference to FIG. 9 explained in more detail.
  • step SO The process begins in step SO.
  • step Sl an untreated carrier film is provided,
  • a carrier film made of polytetrafluoroethylene, PTFE for short.
  • the carrier film may in this case already be applied to a clamping ring 310 or be present as a continuous web for a roll process.
  • step S2 the treatment of at least a portion of the carrier film takes place.
  • the areas or subregions in which this surface treatment can take place have already been explained.
  • the surface treatment makes possible an active compound of mechanical and / or chemical nature between the treated surface of the carrier film and silicone, which results in an increased adhesive effect.
  • the treatment can be a roughening.
  • Roughening can be carried out by means of an abrasive paper. Preferably, in this case, another takes place
  • the roughening can be done by means of an etching process, for example using PTFE etchants such as polytetra or tetra-etch.
  • PTFE etchants such as polytetra or tetra-etch.
  • Another possibility for roughening the carrier film consists in a plasma treatment using argon plasma, oxygen plasma, ammonia plasma or
  • Nitrogen plasma whereby the surface partially removed and / or activated.
  • At an average thickness of the silicone element 410 of ?? is a mean roughness of the surface 1 ⁇ to 50 ⁇ , preferably 5 ⁇ to 45 ⁇ , particularly preferably 10 ⁇ to 40 ⁇ , more preferably 20 ⁇ to 30 ⁇ .
  • Roughening can be in the form of groove-shaped, for example
  • Structures exist or in the form of distributed, individual approximately circular depressions.
  • the roughening depth thus reflects the mean depth of the grooves or depressions.
  • the carrier film to increase the adhesion to silicone may also be coated with an adhesion-promoting layer.
  • an adhesion-promoting layer for example, by means of a
  • Plasma treatment a layer deposited on the carrier film.
  • individual molecules can also be incorporated into the surface of the carrier film 200. Possible materials for this are Si0 2 , TiN or any other material for plasma coating.
  • an adhesion promoter layer for example of polysilane or spin on glass, can be applied by means of spin coating (English: spin coating). Also by means of
  • Rotation coating can be applied to a silicone layer, which is fully cured before the pressing process, so that the adhesion of the silicone layer to the carrier film is higher than the silicone element to be applied 410th
  • the treated carrier film can then be provided for the pressing operation and, for example, inserted or introduced into the pressing tool 100.
  • step S5 a surface-treated carrier film 200, 210, 220, 230 is provided which has an increased adhesion to silicone in the treated area than in untreated form, i. which is at least partially roughened or coated with the silicone element 410 in coming page.
  • step S 7 the carrier film is in a
  • Pressing tool 100 introduced.
  • treated portion is positioned so that it rotates at the edge of the cavity 109.
  • step S8 the silicone matrix 400 is introduced into the cavity 109. Subsequently, in step S9, the silicone matrix 400 is introduced into the cavity 109.
  • Press tool 100 is closed and the silicone element 410 produced by pressing, preferably compression molding.
  • the silicone element 410 is at least partially on the
  • the carrier film 200, 210, 220, 230 with the pressed-on silicone element 410 is removed from the pressing tool 100.
  • the inventive carrier film 200, 210, 220, 230 with optimized adhesion properties, the silicone element 410 adheres to the carrier film 200, 210, 220, 230 and not to other components, for example to the tool film 110.
  • Tool film 110 and silicone element 410 can therefore be omitted.
  • silicone platelets may optionally be in the form of silicone platelets in an optoelectronic
  • Semiconductor device can be introduced.
  • the adhesion between the silicone element 410 and the carrier film is increased so much that the pressing tool 100 can be moved to the machine-side maximum possible clamping force. So far, when a clamping force of 20 kN was exceeded, adhesion between the silicone element 410 and the carrier film 200 no longer existed, but the silicone element 410 adhered to the
  • Carrier film according to the invention can now also higher
  • Thickness variations within the silicone element 410 and thus in the case of use as a conversion element has a lower target Farbortstreuung result.
  • using the carrier film according to the invention is
  • Silicon element produced silicone platelets with
  • the optoelectronic semiconductor device and the method for producing an optoelectronic semiconductor device have been described to illustrate the underlying idea based on some embodiments.

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  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Silicon Compounds (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne une feuille support (200, 210, 220, 230) destinée à recevoir un élément en silicone (410) lors d'un procédé de moulage par compression, au moins une partie (211, 231) de la surface de ladite feuille support (200, 210, 220, 230) étant traitée de manière à augmenter l'adhérence à la silicone de la partie traitée. L'invention concerne en outre un système constitué d'une feuille support (200, 210, 220, 230) traitée en surface et d'un élément en silicone (410) appliqué sur la feuille support (200, 210, 220, 230), l'élément en silicone (410) reposant au moins partiellement sur la partie (211, 213) traitée en surface.
PCT/EP2012/065565 2011-08-09 2012-08-09 Feuille support pour un élément en silicone et procédé de production d'une feuille support pour un élément en silicone WO2013021024A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011080653.9 2011-08-09
DE102011080653A DE102011080653A1 (de) 2011-08-09 2011-08-09 Trägerfolie für ein silikonelement und verfahren zum herstellen einer trägerfolie für ein silikonelement

Publications (2)

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WO2013021024A2 true WO2013021024A2 (fr) 2013-02-14
WO2013021024A3 WO2013021024A3 (fr) 2013-04-04

Family

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Application Number Title Priority Date Filing Date
PCT/EP2012/065565 WO2013021024A2 (fr) 2011-08-09 2012-08-09 Feuille support pour un élément en silicone et procédé de production d'une feuille support pour un élément en silicone

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Country Link
DE (1) DE102011080653A1 (fr)
WO (1) WO2013021024A2 (fr)

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DE102012216552A1 (de) * 2012-09-17 2014-03-20 Osram Gmbh Herstellen einer LED-Leuchtvorrichtung mit Konverterschicht

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DE3904819A1 (de) * 1989-02-17 1990-08-23 Hoechst Ag Verfahren und vorrichtung zum einebnen rauher, strukturierter oder heterogener oberflaechen
NL1020594C2 (nl) * 2002-05-14 2003-11-17 Fico Bv Werkwijze voor het met behulp van een folielaag omhullen van een elektronische component.
JP4397653B2 (ja) * 2003-08-26 2010-01-13 日東電工株式会社 半導体装置製造用接着シート
JP4818654B2 (ja) * 2005-07-25 2011-11-16 ソニーケミカル＆インフォメーションデバイス株式会社 発光素子の封止方法
DE102006000687B4 (de) * 2006-01-03 2010-09-09 Thallner, Erich, Dipl.-Ing. Kombination aus einem Träger und einem Wafer, Vorrichtung zum Trennen der Kombination und Verfahren zur Handhabung eines Trägers und eines Wafers
US7851334B2 (en) * 2007-07-20 2010-12-14 Infineon Technologies Ag Apparatus and method for producing semiconductor modules
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DE102010047454A1 (de) * 2010-10-04 2012-04-05 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Silikonfolie, Silikonfolie und optoelektronisches Halbleiterbauteil mit einer Silikonfolie

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015111336A1 (de) * 2015-07-13 2017-01-19 CONTTEK Holding GmbH Beschichtung von Stanzteilen mithilfe von Plasma-Beschichtungsverfahren

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DE102011080653A1 (de) 2013-02-14
WO2013021024A3 (fr) 2013-04-04

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