WO2013013514A1 - 照明led灯 - Google Patents

照明led灯 Download PDF

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Publication number
WO2013013514A1
WO2013013514A1 PCT/CN2012/072538 CN2012072538W WO2013013514A1 WO 2013013514 A1 WO2013013514 A1 WO 2013013514A1 CN 2012072538 W CN2012072538 W CN 2012072538W WO 2013013514 A1 WO2013013514 A1 WO 2013013514A1
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WO
WIPO (PCT)
Prior art keywords
heat transfer
led lamp
heat
cover
bulb
Prior art date
Application number
PCT/CN2012/072538
Other languages
English (en)
French (fr)
Inventor
李甫文
Original Assignee
厦门立明光电有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 厦门立明光电有限公司 filed Critical 厦门立明光电有限公司
Priority to EP12818320.9A priority Critical patent/EP2738457A4/en
Priority to US14/234,150 priority patent/US9080761B2/en
Publication of WO2013013514A1 publication Critical patent/WO2013013514A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/68—Details of reflectors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Definitions

  • the invention relates to an LED lamp, in particular to an illumination LED lamp.
  • the light source has the advantages of high luminous efficiency, low heat generation, power saving and long life, so its application is more and more extensive.
  • a single LED source has a limited amount of illumination.
  • To be used for everyday illumination multiple LED sources are arranged together to increase luminous flux. These arranged LED light sources generate a large amount of heat, which is not easily dissipated quickly in a small space. If the temperature of the LED lamp is too high, the LED illumination will be attenuated and rapidly deteriorated, and the lamp life will be greatly shortened. .
  • the industry has proposed a COB (Chip On Board type LED lamp, the LED light source is directly fixed on the end surface of the heat transfer substrate of the LED lamp, and the heat transfer substrate is thermally connected to the heat sink of the LED lamp; however, the COB type LED lamp only reduces the lamp by improving the heat transfer efficiency.
  • the heat is generated only by a heat sink disposed under the heat transfer substrate, the heat dissipation channel is single, the heat dissipation area is insufficient, and the heat dissipation efficiency is limited, so that the temperature of the LED lamp during operation may not be effectively reduced.
  • An illumination LED lamp comprising a bulb shell, a light emitting unit and a heat transfer substrate, wherein the light emitting unit is disposed on the heat transfer substrate, the light bulb housing is provided with the light emitting unit, and further comprises a heat dissipating unit, wherein the heat dissipating unit comprises a heat transfer rod One end of the heat transfer rod is thermally connected to the heat transfer substrate, and the other end of the heat transfer rod is thermally connected to the bulb shell to transfer heat on the heat transfer substrate to the bulb shell.
  • the illumination LED lamp of the invention passes The heat transfer rod is disposed, and the heat transfer substrate is thermally connected to the bulb shell to transfer heat on the heat transfer substrate to the bulb shell, thereby effectively increasing heat dissipation of the illumination LED lamp Channel and heat sink area, making this Illuminated LED lights have the advantage of high heat dissipation efficiency.
  • Figure 1 is a perspective view of a first embodiment of an illuminated LED lamp of the present invention.
  • Figure 2 is an exploded perspective view of the illuminated LED lamp of Figure 1.
  • Figure 3 is a cross-sectional view taken along line A-A of Figure 1.
  • FIG. 4 is a light distribution graph of the illuminated LED lamp shown in FIG. 1.
  • Figure 5 is a schematic illustration of a second embodiment of an illuminated LED lamp of the present invention.
  • Figure 6 is a schematic illustration of a third embodiment of an illuminated LED lamp of the present invention.
  • illumination LED lamp 100 of the first embodiment of the present invention please refer to FIG. 1 to FIG.
  • the illuminating LED lamp 100 includes a base 10, a heat dissipating unit 20, a heat transfer substrate 30, a light emitting unit 40, a bulb shell 50, and a reflecting unit 60.
  • the light emitting unit 40 is disposed on the heat transfer substrate 30.
  • the light bulb housing 50 covers the light emitting unit 40 and the heat transfer substrate 30, and the light emitting unit 40 and the heat transfer substrate 30 and the illumination LED lamp 100 The outside is isolated to ensure safe and stable operation of the illuminated LED lamp 100.
  • the heat dissipation unit 20 includes a heat sink 22 and a heat transfer rod 24 .
  • the heat sink 22 is a conventional fin type heat sink having a bottom end fixed to the base 10.
  • the top end of the heat sink 22 is provided with an annular groove 222.
  • the heat transfer rod 24 is made of a metal material such as aluminum metal that can conduct heat.
  • the heat transfer substrate 30 has a disk-like structure.
  • the middle portion of the heat transfer substrate 30 is provided with a mounting hole 32.
  • the mounting hole 32 is provided with a thread.
  • the light emitting unit 40 includes a plurality of LED light sources 42 that surround the mounting holes 32 of the heat transfer substrate 30 and are evenly disposed on the top end surface of the heat transfer substrate 30.
  • the heat transfer substrate 30 is fixed in the annular groove 222 and is thermally connected to the heat sink 22.
  • the bulb shell 50 is a bottom end open spherical shell structure including a lamp cover 52 and a heat dissipation cover 54 .
  • the top end of the lamp cover 52 is provided with an opening 522, and the heat dissipation cover 54 has a substantially round shell structure.
  • the heat sink cover 54 is received in the opening 522 to engage with the lamp cover 52 to form a spherical shell structure.
  • the bottom end of the lamp cover 52 that is, the bottom end of the bulb case 50, is embedded in the annular groove 222 of the heat sink 22, and the heat transfer substrate 30 is received therein.
  • the heat sink cover 54 is made of a material having good thermal conductivity such as aluminum alloy.
  • the outer diameter of the heat dissipation cover 54 is smaller than the maximum outer diameter of the light cover 52 so as not to completely block the light emitted by the light emitting unit 40 in the upward direction (as shown in FIG. 3). Uniform on the lamp cover 54 A transmissive scattering material is provided for scattering light emitted by the light emitting unit 40.
  • the heat sink 54 is integrally formed with the heat transfer rod 24, and the connected shape is similar to an open umbrella. The other end of the heat transfer rod 24 is fixed in the mounting hole 32 of the heat transfer substrate 30, and is thermally connected to the heat transfer substrate 30.
  • the reflecting unit 60 includes a reflector 62 attached to the bottom surface of the heat dissipation cover 54.
  • the reflector 62 is disposed corresponding to the light emitting unit 40 for reflecting the light emitting unit 40 downward.
  • the emitted light is disposed.
  • the reflecting unit 60 further includes a reflective sleeve 64 disposed on the heat transfer rod 24 to overcome the defect that the metal heat transfer rod 24 is opaque.
  • the heat dissipation principle of the LED lamp 100 in the first embodiment of the present invention is: when working, the heat generated by the light-emitting unit 40 is transmitted to the heat sink 22 through the heat transfer substrate 30, and then radiated outward by the heat sink 22; On the other hand, the heat transfer rod 24 transfers heat on the heat transfer substrate 30 to the heat sink cover 54, which then diverge heat to the outside by convection and heat radiation.
  • the LED lamp 100 of the present invention can skillfully increase the heat dissipation area without increasing the overall structure of the lamp, and also increases the heat dissipation channel, and the heat dissipation efficiency is higher, which is advantageous for extending. The service life of the luminaire.
  • the upwardly emitted light of the illumination unit 40 is emitted to the reflector 62, and the reflector 62 reflects the light in the direction below the heat transfer substrate 30;
  • the sleeve 64 also reflects the light irradiated on the surface thereof to the periphery, and then sufficiently illuminates the periphery of the LED lamp 100 by the scattering effect of the bulb shell.
  • the lamp cover 52 is provided with a scattering material and the outer diameter of the heat dissipation cover 54 is smaller than the maximum outer diameter of the lamp cover 52, the partial lamp cover 52 around the heat dissipation cover 54 will forwardly scatter the light emitting unit 40.
  • the position originally blocked by the heat dissipation cover 54 still has a relatively high light intensity, so that the illumination LED lamp 100 The overall brightness is uniform.
  • the light reflecting plate 62 reflects the light emitted by the light emitting unit 40 downward, the light emitting angle of the lighting LED lamp 100 is increased, so that the light emitting angle thereof reaches 320°, and the omnidirectional illumination of the lighting LED lamp 100 is realized.
  • the improvement may be further made by omitting the reflection unit 60, directly providing a reflective coating on the surface of the heat transfer rod 24 instead of the reflective sleeve 64, and providing a reflective coating on the bottom surface of the heat dissipation cover 54.
  • a layer can also achieve a reflective effect, thereby enabling the luminaire to be omnidirectional.
  • the illumination LED lamp 100 of the present invention passes The heat transfer rod 24 is disposed, and the heat transfer substrate 30 is thermally connected to the bulb shell 50 by the heat transfer rod 24 to transfer heat on the heat transfer substrate 30 to the bulb shell 50.
  • Technology effectively increases this Illuminating the heat dissipation area of the LED lamp 100 makes the illumination LED lamp 100 have the advantage of high heat dissipation efficiency.
  • the illumination LED lamp 100 has an illumination angle of 320°, which realizes omnidirectional illumination of the illumination LED lamp 100.
  • FIG. 5 illustrates a lighting LED lamp 100a according to a second embodiment of the present invention.
  • the illumination LED lamp 100a is different from the first embodiment in that the bulb shell 50a is integrally formed of a transparent ceramic material, one end of the heat transfer rod 24 is connected to the heat transfer substrate 30, and the other end is connected to the bulb shell 50a. . Because the thermal conductivity of ceramic materials can reach 180 ⁇ 220W / M ⁇ K, the bulb case 50a can effectively dissipate heat from the heat transfer rod 24. In this case, the bulb case 50a does not have to be separately formed like the bulb case 50 in the first embodiment, thereby simplifying the overall structure of the product. Of course, in addition to the transparent ceramic, the bulb shell 50a can also adopt other transparent materials with higher heat conduction efficiency.
  • FIG. 6 illustrates a lighting LED lamp 100b according to a third embodiment of the present invention, which is different from the first embodiment in that the bulb shell 50b is entirely a bottom end open spherical shell structure including A lamp cover 52b disposed at the top end and a heat dissipation cover 54b disposed at the bottom end.
  • the lamp cover 52b has a hemispherical shell structure, and the heat dissipation cover 54b is an annular shell structure corresponding to the lamp cover 52b.
  • the heat dissipation cover 54b is made of transparent ceramic.
  • the heat transfer rod 24b has an 'L'-shaped structure, one end of which is connected to the heat transfer substrate 30, and the other end of which is connected to the heat dissipation cover 54b.
  • the heat transfer rod 24b transfers the heat on the heat transfer substrate 30 to the heat dissipation cover 54b, and the heat dissipation efficiency of the illumination LED lamp 100b as a whole is improved by the high thermal conductivity heat dissipation cover 54b.
  • the heat dissipation cover 54b may be an opaque metal material. .
  • the portion of the lamp cover 52b that is not blocked by the heat radiation cover 54b scatters light, so that the light emission angle can be reduced without being blocked by the opaque heat radiation cover 54b.
  • it can be understood that at this time, it is necessary to distribute more light to the lamp cover 52b connected to the heat dissipation cover 54b, so that the light distribution curve of the whole lamp is more uniform.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

一种照明LED灯（100），包括灯泡壳（50）、发光单元（40）、传热基板（30）和散热单元（20）。发光单元（40）设置在传热基板（30）上。灯泡壳（50）罩设发光单元（40）。散热单元（20）包括传热杆（24）。传热杆（24）的一端与传热基板（30）热连接，另一端与灯泡壳（50）热连接，以将传热基板（30）上的热量传递到灯泡壳（50）上。照明LED灯（100）具有散热效率高的优点。

Description

照明LED灯 技术领域
本发明涉及一种LED灯，特别是一种照明LED灯。
背景技术
LED 光源具有发光效率高、低发热、省电和寿命长的优点，因此其应用越来越广泛。单个LED光源的发光量有限，若要用于日常照明，则要将多个LED光源排布在一起以提高光通量。这些排布在一起的LED光源会产生大量的热量，该热量聚集在较小的空间内不容易迅速散发，如果LED灯的温度过高，将造成LED照度衰减而迅速老化，灯具使用寿命大大缩短。
为了降低LED灯工作时的温度，业界提出了一种COB(Chip On Board)型的LED灯，其LED光源直接固定在LED灯的传热基板端面，而该传热基板热连接LED灯的散热器；然而所述COB型LED灯只是通过提高传热效率来减少灯具发热，其散热仅仅通过一设于传热基板之下的散热器，散热渠道单一，散热面积不足，散热效率受限，因此仍有可能无法有效降低LED灯工作时的温度。
发明内容
有鉴于此，有必要提供一种散热效率高的照明LED灯。
一种照明LED灯，包括灯泡壳、发光单元和传热基板，该发光单元设置在该传热基板上，该灯泡壳罩设该发光单元，还包括散热单元，该散热单元包括传热杆,该传热杆的一端与该传热基板热连接，该传热杆的另一端与该灯泡壳热连接，以将该传热基板上的热量传递到该灯泡壳上。
与现有技术相比，本发明照明LED灯通过 设置该传热杆,利用该传热杆将该该传热基板与该灯泡壳热连接，以将该传热基板上的热量传递到该灯泡壳上，有效地增加了该 照明LED灯的散热渠道和 散热面积，使得该 照明LED灯具有散热效率较高的优点 。
附图说明
图1是本发明的照明LED灯第一实施例的立体示意图。
图2是图1所示照明LED灯的立体分解图。
图3是沿图1中A-A线的剖视图。
图4是图1所示照明LED灯的配光曲线图。
图5是本发明照明LED灯第二实施例的示意图。
图6是本发明照明LED灯第三实施例的示意图。
具体实施方式
下面结合附图与具体实施方式对本发明作进一步详细描述。
本发明第一实施例的照明LED灯100，请参考图1至图3。
结合图1和图2所示，该照明LED灯100包括一灯头10、一散热单元20、一传热基板30、一发光单元40、一灯泡壳50和一反射单元60。 该发光单元40设置在该传热基板30上。该灯泡壳50罩设该发光单元40及该传热基板30，将该发光单元40与该传热基板30与该 照明LED灯100的 外界隔绝开来，以确保该 照明LED灯100安全、稳定的运行。
请参考图2及图3，该散热单元20包括一散热器22及一传热杆24。该散热器22为传统鳍片式散热器，其底端固定在该灯头10上。该散热器22的顶端设有一环形凹槽222。该传热杆24的材质为铝金属等能够导热的金属材质。该传热基板30为一圆片状结构，该传热基板30的中部设有一安装孔32，该安装孔32内设有螺纹。该发光单元40包括多个LED光源42，这些LED光源42环绕该传热基板30的安装孔32，并均匀布设于传热基板30的顶部端面。传热基板30固定在该环形凹槽222内且与该散热器22热连接。
请参考图1至图3，该灯泡壳50为一底端开口的球壳结构，其包括一灯罩52及一散热罩54。该灯罩52的顶端设有一开口522， 该散热罩54大致为圆壳结构。 组装时，该散热罩54收容在该开口522内以与该灯罩52接合形成一球壳结构。该灯罩52的底端，即该灯泡壳50的底端，嵌设于该散热器22的环形凹槽222之内，并将该传热基板30收容于内。该散热罩54由铝合金等导热性好的材料制成。 该散热罩54的外径小于该灯罩52最大的外径,以免在向上的方向上完全阻挡该发光单元40发出的光（如图3所示）。 该灯罩54上均匀 设有透过散射材料，用于对该发光单元40发出的光进行散射。 该散热罩54与该传热杆24为一体成型，二者连接后的形状类似一把张开的伞。该传热杆24的另一端固定在该传热基板30的安装孔32内，已与该传热基板30热连接。
请参考图2及图3，该反射单元60包括一贴设于该散热罩54的底面的反光板62，该反光板62对应该发光单元40设置，用于在向下反射该发光单元40向上发射出的光。该反射单元60还包括一反光套64，该反光套套设在该传热杆24上，以克服该金属传热杆24不透光的缺陷。
本发明第一实施例中的LED灯100的散热原理为：工作时，该发光单元40发出的热量一方面通过该传热基板30传递至该散热器22，再由散热器22向外散热；另一方面，该传热杆24将该传热基板30上的热量传递至该散热罩54，然后该散热罩54通过对流与热辐射的形式将热量向外界发散。与一般LED灯的散热方式相比，本发明中的LED灯100无需大幅度地改变灯具的整体结构，就能够巧妙地增大散热面积，也增加了散热渠道，散热效率更高，有利于延长灯具的使用寿命。
请参考图3，该照明LED灯100在工作时，该发光单元40向上发出的光发射到该反光板62后，该反光板62将此方向的光在向传热基板30下方反射；同时反光套64也将照射在其表面上的光向四周反射，再经过灯泡壳的散射作用，充分地照射于LED灯100的四周。另外，由于该灯罩52上设有散射材料且该散热罩54的外径小于该灯罩52最大的外径，这就使得该散热罩54周围的部分灯罩52将向前散射该发光单元40发出的光，以弥补被该散热罩54所遮挡住的光。这样，请参照图4所示的该照明LED灯100的配光曲线图，在0°方向上，原本被该散热罩54遮挡住的位置仍有相当的光强，使得该照明LED灯100的整体亮度均匀一致。另外，由于该反光板62向下反射该发光单元40发出的光，增大了该照明LED灯100的发光角度，使得其发光角度达到320°，实现了该照明LED灯100的全向照明。
本发明的第一实施例中，还可以作如下改进：省略反射单元60，直接在传热杆24表面设有反射涂层以替代所述反光套64，以及在散热罩54底面设有反射涂层以替代所述反光板62，亦可实现反光效果，从而使得灯具能够全向照明。
综上所述，本发明照明LED灯100通过 设置该传热杆24,利用该传热杆24将该该传热基板30与该灯泡壳50热连接，以将该传热基板30上的热量传递到该灯泡壳50上，相比现有技术有效地增加了该 照明LED灯100的 散热面积，使得该 照明LED灯100具有散热效率较高的优点 。通过设置该反射单元60及在该灯罩52上设置散射材料，使得 该照明LED灯100的发光角度达到320°，实现了该照明LED灯100的全向照明 。
请参考图5，其绘示了本发明第二实施例的照明LED灯100a。该照明LED灯100a与第一实施例的不同之处在于：该灯泡壳50a由透明陶瓷材料一体成型，该传热杆24的一端与该传热基板30连接，另一端与该灯泡壳50a连接。由于陶瓷材料的热导率可以达到180～220W/M· K，故该灯泡壳50a可以有效地散发该传热杆24传来的热量。在此情况下，该灯泡壳50a不必像第一实施例中的灯泡壳50那样分体成型，从而简化了产品的整体结构。当然该灯泡壳50a除采用透明陶瓷外，还可以采用其他导热效率较高的透明材料。
请参考图6，其绘示了本发明的第三实施例的照明LED灯100b，其与第一实施例的不同之处在于：该灯泡壳50b整体为底端开口的球壳结构，其包括一设于顶端的灯罩52b及一设于底端的散热罩54b。该灯罩52b为半球壳结构，该散热罩54b为对应该灯罩52b的圆环状壳结构。该散热罩54b由透明陶瓷制成，该传热杆24b为'L'形结构，其一端与该传热基板30连接，另一端与该散热罩54b连接。工作时，该传热杆24b将该传热基板30上的热量传递至该散热罩54b，借助该高导热性的散热罩54b提高该照明LED灯100b整体的散热效率。另外，在该照明LED灯100b中，当该散热罩54b最大的外径小于该灯罩52b最大的外径且该灯罩52b上设有散射材料时，该散热罩54b可以为不透光的金属材料。这样，利用该灯罩52b上未被该散热罩54b遮挡住的部分对光进行散射，可以使发光角度不因该不透光的散热罩54b的遮挡而减小。当然，可以理解的，此时需要向与该散热罩54b相连接的灯罩52b多配光，以使得整灯的配光曲线更加均匀。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本发明保护的范围之内。

Claims (10)

  1. 一种照明LED灯，包括灯泡壳、发光单元和传热基板，该发光单元设置在该传热基板上，该灯泡壳罩设该发光单元，其特征在于：还包括散热单元，该散热单元包括传热杆,该传热杆的一端与该传热基板热连接，该传热杆的另一端与该灯泡壳热连接，以将该传热基板上的热量传递到该灯泡壳上。
  2. 根据权利要求1所述的照明LED灯，其特征在于：该灯泡壳由高导热性透明陶瓷材料制成。
  3. 根据权利要求1所述的照明LED灯，其特征在于：该灯泡壳包括灯罩及与该灯罩接合的散热罩，该散热罩由高导热性材料制成，该传热杆的另一端与该散热罩热连接。
  4. 根据权利要求3所述的照明LED灯，其特征在于：所述灯泡壳的底端收容该传热基板，该散热罩位于该灯泡壳的顶端，该散热罩大致为圆壳结构，该散热罩的外径小于该灯罩最大的外径。
  5. 根据权利要求3或4所述的照明LED灯，其特征在于：该传热杆的一端与该传热基板的中部连接，该发光单元包括多颗LED光源，所述LED光源围绕该传热杆的一端设置。
  6. 根据权利要求3所述的照明LED灯，其特征在于：该散热罩的底面对应该发光单元设有反光板。
  7. 根据权利要求6所述的照明LED灯，其特征在于：该传热杆上套设有反光套。
  8. 根据权利要求4所述的照明LED灯，其特征在于：该灯罩上设有散射材料，用于对该发光单元发出的光进行散射。
  9. 根据权利要求3所述的照明LED灯，其特征在于：该灯罩为半球壳结构，该散热罩为对应该灯罩的圆环状壳结构，该灯罩与该散热罩组合形成该下端开口的灯泡壳。
  10. 根据权利要求9所述的照明LED灯，其特征在于：该灯泡壳上设有散射材料，该散热罩靠近该灯泡壳的底端设置且该散热罩的外径小于该灯罩最大的外径。
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